Process for improving meltallizing deformation of stainless steel part of semiconductor equipment and meltallizing jig

Abstract

The invention belongs to the technical field of meltallizing processes, and discloses a process and a meltallizing jig for improving meltallizing deformation of a stainless steel component of semiconductor equipment, and the process method comprises the following steps: meltallizing pretreatment including sand blasting and protection; the stainless steel part is subjected to twice meltallizing treatment with low current within 150 A, and cooling water is used for cooling; carrying out deprotection and data measurement; and drying after high-pressure water washing and ultrasonic cleaning. Traditional high-current one-time meltallizing is changed into low-current two-time meltallizing, the roughness is guaranteed, meanwhile, the current is reduced, meanwhile, a meltallizing jig is optimized, the temperature of the surface of a component is reduced through water circulation, component deformation is avoided, a client side can be repeatedly used, and the cost is greatly reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of melt spraying technology, in particular to a technology and a melt spraying jig for improving the melt spraying deformation of stainless steel parts of semiconductor equipment. Background Art

[0002] Semiconductor equipment manufacturing is a highly sophisticated field, in which stainless steel parts are widely used due to their good corrosion resistance, mechanical strength and thermal stability. However, during the spraying process, stainless steel parts are easily deformed due to high temperature and the impact of the sprayed material, which affects the overall performance and precision of the equipment. Therefore, it is particularly important to develop a process and fixture that can effectively control the spraying deformation.

[0003] Melt spraying is a thermal spraying technology that forms a coating with specific properties by spraying molten material onto the surface of the substrate at high speed. This technology is often used in semiconductor equipment manufacturing to strengthen and modify the surface of stainless steel parts to improve their wear resistance, corrosion resistance and high temperature resistance. However, the high temperature and impact force generated during the melt spraying process often cause deformation of the parts.

[0004] This semiconductor equipment component is used in mainstream semiconductor factories and is an indispensable part of chip manufacturing. It is mainly used after the PVD chamber PM. The stainless steel component will act as a wafer to verify whether the various parameters of the equipment are stable. After the existing spraying process, the component will be deformed. Once there is a problem with the flatness of the component, it will detach due to the poor combination with the suction cup during operation, and then it cannot be used normally.

[0005] However, the existing spraying process cannot meet the requirements of low spraying temperature and high roughness at the same time. At the same time, the spraying equipment is not perfect in function. In addition, the stainless steel parts are indispensable parts in semiconductor physical vapor deposition equipment, which are expensive and have high replacement costs. Summary of the invention

[0006] In order to solve the defects existing in the prior art, the present invention provides a process for improving the deformation of stainless steel parts of semiconductor equipment during spraying. The improvement is divided into two types: one is to reduce the current during spraying. Low current means low temperature during spraying; the other is to add water cooling tooling, and the circulating water continuously takes away the heat on the surface of the parts, so that the parts are always at a lower temperature. The above two methods can ensure that the temperature on the surface of the parts is low, and the low temperature will not change the morphology of the parts, that is, the flatness of the parts will not be changed after spraying, so that the parts can be reused. Before the current is reduced, the cleaning times reach about 20 times, and the parts have been severely deformed and cannot be used normally. After the current is reduced, the cleaning times can reach about 60 times, and it is still in normal use. The final cleaning times should be greater than 60 times.

[0007] To achieve the above purpose, the technical solution of the invention is:

[0008] A process for improving the spraying deformation of stainless steel parts of semiconductor equipment comprises the following steps:

[0009] (1) Pre-spraying treatment, including sandblasting and protection;

[0010] (2) Spraying: The stainless steel parts are sprayed twice with a low current of less than 150A, and cooled with cooling water;

[0011] (3) deprotection and data measurement;

[0012] (4) High-pressure water washing, ultrasonic cleaning and then drying.

[0013] Furthermore, the temperature of the spraying in step (2) is below 60°C.

[0014] Furthermore, the roughness of the spraying in step (2) is Ra: 20-60 μm.

[0015] Furthermore, in step (2), the number of times of spraying is 2 to 4, the air pressure is 60 to 80 psi, and the gun speed of the spraying gun is 350 to 700.

[0016] Furthermore, in step (2), the first pass of the spraying is firstly performed as a primer, and then the component is sprayed once with a low current of less than 130A, so that a spraying layer is formed on the component, and the roughness is 10 to 15μm. When the spraying is repeated for the second time, the current is controlled within 150A.

[0017] Furthermore, the sandblasting in step (1) uses aluminum oxide sand.

[0018] Furthermore, the water used in the high-pressure water washing in step (4) is ultrapure water with a resistivity greater than or equal to 15 MΩ.CM.

[0019] Furthermore, the drying equipment in step (4) is a dust-free oven, and the drying time is greater than 4 hours.

[0020] A spraying jig for improving the deformation of stainless steel parts of semiconductor equipment during spraying. The spraying jig is mainly composed of a cooling tray and a cooling tube. The cooling tray is designed with slots for placing cooling tubes. The cooling tubes are evenly coiled in the cooling tray, and the parts are placed on them. The cooling tubes are provided with a water inlet and a water outlet. While the parts are being sprayed, cooling water is passed into the cooling tubes to reduce the surface temperature of the parts in real time, thereby preventing the parts from deforming. There is no limit on the number of grooves in the above tooling, mainly for the convenience of taking. The number of slots can be changed according to the usage habits. In addition, for the shape of the cooling tray, a tray of corresponding shape can be designed according to the shape of the product, without any restrictions on any shape.

[0021] The beneficial effects of the present invention compared with the prior art are:

[0022] The present invention provides a process for improving the deformation of stainless steel parts of semiconductor equipment by spraying. The traditional high-current one-time spraying is changed to low-current two-time spraying. The current is reduced while ensuring the roughness. At the same time, the spraying jig is optimized and water circulation is used to reduce the surface temperature of the parts to avoid deformation of the parts. The parts can be reused by the client, and the cost is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0024] Figure 1 It is a one-time spraying effect and local effect diagram;

[0025] Figure 2 It is the secondary spraying effect and local effect diagram;

[0026] Figure 3 It is a schematic diagram of the structure of the spraying fixture;

[0027] Figure 4 It is a schematic diagram of the combined structure of the spraying fixture.

[0028] In the figure: 1. Cooling tray; 2. Cooling pipe; 3. Water inlet; 4. Water outlet; 5. Groove. DETAILED DESCRIPTION

[0029] The present invention is described in detail below by specific examples, but the protection scope of the present invention is not limited. Unless otherwise specified, the experimental methods used in the present invention are all conventional methods, and the experimental equipment, materials, reagents, etc. used can be obtained from commercial channels.

[0030] Example 1

[0031] The present invention mainly provides a process for improving the deformation of stainless steel parts of semiconductor equipment by spraying, which comprises the following steps:

[0032] (1) Incoming inspection: Print the engineering table and compare it with the information in the table, mainly counting the number of parts, checking the material of the parts, and checking whether there are any abnormalities such as cracks or missing corners on the appearance.

[0033] (2) De-filming: The parts are de-filmed, washed and dried.

[0034] (3) Sandblasting: The stainless steel parts after film removal are sandblasted. The surface of the parts is pre-treated to make a certain degree of roughness to improve the bonding strength of the spraying.

[0035] (4) Protection: Shield the areas of the stainless steel parts that are not allowed to be sprayed to avoid splashing on the sprayed layer.

[0036] (5) Spraying: The stainless steel parts are sprayed, and the traditional high-current one-time spraying is changed to low-current two-time spraying, which ensures the roughness while reducing the current. At the same time, the improved spraying fixture is used to reduce the spraying temperature and avoid deformation of the parts;

[0037] If the roughness requirement is Ra30-60μm, the traditional method requires a current of at least 200A to meet the roughness requirement; while the low current mentioned in the present invention can meet the roughness requirement of Ra30-60μm within 150A, and it has been verified that multiple batches of parts will not cause deformation of the parts at 150A;) while ensuring the roughness, reduce the current to avoid deformation of the parts, and at the same time use the improved spraying fixture to reduce the spraying temperature (the temperature can reach 150°C before the current is reduced, and the temperature can reach 60°C after the current is reduced);

[0038] Technical difficulties: High roughness generally requires high current to meet the roughness requirements. High current will cause the parts to deform, so low current is needed. Low current needs to be matched with the number of spraying times and air pressure, and the gun speed of the spraying gun needs to be adjusted accordingly.

[0039] The roughness is Ra: 20-60μm, the number of spraying times is 2 to 4 times, the air pressure is controlled at 60 to 80psi, and the gun speed of the spraying gun is 350 to 700. It can be adjusted accordingly according to the specific roughness requirements.

[0040] The traditional spraying method is to increase the current to achieve high roughness requirements, but high current will bring high temperature, which will cause the stainless steel parts to deform and make the parts non-reusable; the present invention breaks the traditional practice and uses the "1+1" method, that is, the spraying superposition method, such as Figure 1 As shown: The first pass is to prime, that is, to spray the component once with a low current, so that there is a spray layer on the component, with a roughness of about 10 to 15 μm, and the current is controlled within 130A. Figure 2 When performing the second spraying, fine-tuning can be performed according to the roughness of the first spraying, but the current needs to be controlled within 150A. If the roughness is low, it can be adjusted by air pressure or spraying speed. This superposition method can meet the high roughness requirements while reducing the current and spraying temperature to prevent the parts from deformation. At the same time, cooling water circulation is increased on the spraying fixture, such as Figure 3 As shown in Figure 4, the heat of the components is taken away by cold water circulation. During the component spraying process, the water circulation continuously takes away the heat on the surface of the components, so that the components are always in a state of low temperature, effectively avoiding the occurrence of component deformation;

[0041] (6) Deprotection: After the spraying is completed, the protection is removed;

[0042] (7) Data measurement: After the spraying is completed, the flatness is measured and compared with the standard value. Qualified products are circulated normally, and unqualified products must be fed back and specially processed;

[0043] (8) High-pressure water washing: The stainless steel parts are washed with high-pressure water to remove the sprayed ash and other dirt on the surface of the parts to ensure the cleanliness of the surface of the parts;

[0044] (9) Ultrasonic cleaning: completely immerse the stainless steel parts in the ultrasonic tank for ultrasonic cleaning to remove smaller dust particles;

[0045] (10) Final drying: The parts are finally dried for more than 4 hours;

[0046] (11) Final inspection: Check and confirm whether the parts have any abnormalities such as residual film or marks. If there are residual film or marks, they need to be processed again. If there are no abnormalities, they are confirmed as qualified products and shipped normally.

[0047] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A process for improving the spraying deformation of stainless steel parts of semiconductor equipment, characterized in that: The steps include: (1) Pre-spraying treatment, including sandblasting and protection; (2) Spraying: The stainless steel parts are sprayed twice with a low current of less than 150A, and cooled with cooling water; (3) deprotection and data measurement; (4) High-pressure water washing, ultrasonic cleaning and then drying.

2. The process for improving the spraying deformation of stainless steel parts of semiconductor equipment according to claim 1, characterized in that: The temperature of the spraying in step (2) is below 60°C.

3. The process for improving the spraying deformation of stainless steel parts of semiconductor equipment according to claim 1, characterized in that: The roughness of step (2) spraying is Ra: 20-60 μm.

4. The process for improving the spraying deformation of stainless steel parts of semiconductor equipment according to claim 3, characterized in that: The number of times of the spraying in step (2) is 2 to 4, the air pressure is 60 to 80 psi, and the gun speed of the spraying gun is 350 to 700.

5. The process for improving the spraying deformation of stainless steel parts of semiconductor equipment according to claim 1, characterized in that: Step (2) The first pass of spraying is to prime the part, and then spray the part once with a low current of less than 130A, so that a spray layer is formed on the part, and the roughness is 10 to 15 μm. When spraying the part again for the second time, the current is controlled within 150A.

6. The process for improving the spraying deformation of stainless steel parts of semiconductor equipment according to claim 1, characterized in that: The sandblasting step (1) uses aluminum oxide sand.

7. The process for improving the spraying deformation of stainless steel parts of semiconductor equipment according to claim 1, characterized in that: The water used in the high-pressure water washing in step (4) is ultrapure water with a resistivity greater than or equal to 15 MΩ.CM.

8. The process for improving the spraying deformation of stainless steel parts of semiconductor equipment according to claim 1, characterized in that: The drying equipment in step (4) is a dust-free oven, and the drying time is greater than 4 hours.

9. A spraying jig for improving the spraying deformation of stainless steel parts of semiconductor equipment, characterized in that: The spraying fixture comprises a cooling tray (1) and a cooling tube (2). The cooling tray (1) is designed with a slot for placing the cooling tube (2). The cooling tube (2) is evenly coiled in the cooling tray (1). The cooling tube (2) is provided with a water inlet end (3) and a water outlet end (4).

10. The spraying jig for improving the spraying deformation of stainless steel parts of semiconductor equipment according to claim 9, characterized in that: The cooling tray (1) is provided with a card slot (5).

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