Heating body temperature acquisition method of water heater and related device

Abstract

The embodiment of the invention provides a heating body temperature acquisition method of a water heater and a related device, and relates to the technical field of heaters. The method comprises the following steps: acquiring a first voltage and a first current on a heating body arranged in a high-voltage loop; calculating a first resistance value of the heating body according to the first voltage and the first current; and calculating the core temperature of the heating body according to the stored relation between the resistance value and the temperature and the first resistance value. Therefore, the temperature of the heating body in the water heater can be accurately obtained.

Description

Technical Field

[0001] The present application relates to the technical field of heaters, and in particular to a method for collecting the temperature of a heating element of a water heater and a related device. Background Art

[0002] Currently, water heaters are installed in various devices, such as high-pressure water heaters in cars. The water heater includes a heat exchange cavity, in which there are heating elements (such as PTC (Positive Temperature Coefficient, positive temperature coefficient thermistor), resistance wire, etc.) and heat exchange medium (such as water). The heating element generates heat by utilizing its physical characteristics, and the heating element exchanges heat with the heat exchange medium. Due to some requirements, it may be necessary to collect the temperature of the heating element, so how to accurately obtain the temperature of the heating element has become a technical problem that technicians in this field need to solve urgently. Summary of the invention

[0003] The embodiment of the present application provides a method and a related device for collecting the temperature of a heating element of a water heater, which can accurately obtain the temperature of the heating element in the water heater.

[0004] The embodiments of the present application can be implemented as follows:

[0005] In a first aspect, an embodiment of the present application provides a method for collecting the temperature of a heating element of a water heater, wherein the heating element is arranged in a high-voltage circuit, and the method comprises:

[0006] Collecting and obtaining a first voltage and a first current on the heating element;

[0007] Calculating a first resistance value of the heating element according to the first voltage and the first current;

[0008] The core temperature of the heating element is calculated based on the stored relationship between the resistance value and the temperature and the first resistance value.

[0009] In a second aspect, an embodiment of the present application provides a temperature collection device for a heating element of a water heater, wherein the heating element is arranged in a high-pressure circuit, and the device comprises:

[0010] A collection module, used for collecting and obtaining a first voltage and a first current on the heating element;

[0011] a calculation module, configured to calculate a first resistance value of the heating element according to the first voltage and the first current;

[0012] The calculation module is further used to calculate the core temperature of the heating element according to the stored relationship between the resistance value and the temperature and the first resistance value.

[0013] In an optional embodiment, the device further comprises:

[0014] A control module is used to control the working state of the heating element according to the core temperature.

[0015] In a third aspect, an embodiment of the present application provides an electronic device, including a processor and a memory, wherein the memory stores machine executable instructions that can be executed by the processor, and the processor can execute the machine executable instructions to implement the method for collecting the temperature of the heating element of the water heater described in the aforementioned embodiment.

[0016] In a fourth aspect, an embodiment of the present application provides a readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the method for collecting the temperature of the heating element of the water heater as described in the aforementioned embodiment is implemented.

[0017] In the method and related device for collecting the temperature of the heating element of the water heater provided in the embodiment of the present application, the heating element is arranged in the high-voltage circuit, and the first voltage and the first current on the heating element are first collected, and then the first resistance value of the heating element is calculated according to the first voltage and the first current, and finally the core temperature of the heating element is calculated according to the relationship between the resistance value and the temperature and the first resistance value. In this way, the temperature of the heating element in the water heater can be accurately obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A block diagram of an electronic device provided in an embodiment of the present application;

[0020] Figure 2 One of the flow charts of the method for collecting the temperature of the heating element of the water heater provided in the embodiment of the present application;

[0021] Figure 3 A second flow chart of a method for collecting the temperature of a heating element of a water heater provided in an embodiment of the present application;

[0022] Figure 4 A schematic diagram of the temperature collection architecture of the MCH high-voltage heater heating element provided in an embodiment of the present application;

[0023] Figure 5One of the block diagrams of the heating element temperature collection device of the water heater provided in the embodiment of the present application;

[0024] Figure 6 The second block diagram of the heating element temperature collection device of the water heater provided in the embodiment of the present application.

[0025] Icons: 100 - electronic device; 110 - memory; 120 - processor; 130 - communication unit; 200 - heating element temperature acquisition device of water heater; 210 - acquisition module; 220 - calculation module; 230 - control module. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0028] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0029] In order to obtain the temperature of the heating element of the water heater, it may be thought that a temperature sensor is arranged on the surface of the heating element to obtain the temperature of the heating element by using the temperature sensor. However, the temperature obtained in this way is different from the core temperature of the heating element, and cannot accurately represent the core temperature of the heating element, that is, it cannot truly and effectively represent the temperature of the heating element.

[0030] In view of the above situation, the embodiment of the present application provides a method and related device for collecting the temperature of the heating element of a water heater, which accurately obtains the temperature of the heating element in the water heater based on the physical properties of the heating element.

[0031] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0032] Please refer to Figure 1 , Figure 1 A block diagram of an electronic device 100 provided in an embodiment of the present application. The electronic device 100 may be, but is not limited to, a computer, a server, etc. The electronic device 100 may include a memory 110, a processor 120, and a communication unit 130. The memory 110, the processor 120, and the communication unit 130 are electrically connected to each other directly or indirectly to achieve data transmission or interaction. For example, these components may be electrically connected to each other via one or more communication buses or signal lines.

[0033] The memory 110 is used to store programs or data. The memory 110 may be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc.

[0034] The processor 120 is used to read / write data or programs stored in the memory 110 and execute corresponding functions. For example, the memory 110 stores a water heater temperature acquisition device 200, and the water heater temperature acquisition device 200 includes at least one software function module that can be stored in the memory 110 in the form of software or firmware. The processor 120 executes various functional applications and data processing by running software programs and modules stored in the memory 110, such as the water heater temperature acquisition device 200 in the embodiment of the present application, that is, realizing the water heater temperature acquisition method in the embodiment of the present application.

[0035] The communication unit 130 is used to establish a communication connection between the electronic device 100 and other communication terminals through a network, and to send and receive data through the network.

[0036] It should be understood that Figure 1 The structure shown is only a schematic diagram of the structure of the electronic device 100. The electronic device 100 may also include Figure 1 More or fewer components as shown, or with Figure 1 Different configurations are shown. Figure 1 Each component shown in the figure can be implemented by hardware, software or a combination thereof.

[0037] Please refer to Figure 2 , Figure 2 One of the flow diagrams of the method for collecting the temperature of the heating element of the water heater provided in the embodiment of the present application. The method can be applied to the above-mentioned electronic device. The specific process of the method for collecting the temperature of the heating element of the water heater is described in detail below. In this embodiment, the method may include steps S110 to S130.

[0038] Step S110, collecting and obtaining a first voltage and a first current on the heating element.

[0039] Step S120: calculating a first resistance value of the heating element according to the first voltage and the first current.

[0040] Step S130, calculating the core temperature of the heating element according to the stored relationship between the resistance value and the temperature and the first resistance value.

[0041] In this embodiment, the heating element of the water heater is arranged in the high-voltage circuit to obtain electrical energy to generate heat. The resistance value of the heating element changes with the change of the core temperature. The heating element can be MCH (MetalCeramics Heater), such as an alumina ceramic heating element, a silicon nitride ceramic heating element, etc., or other types of heating elements other than MCH, which can be determined in combination with actual conditions.

[0042] The first voltage and the first current of the heating element arranged in the high-voltage circuit can be obtained in any manner. That is, the first voltage represents the voltage difference between the two ends of the heating element, and the first current is the current flowing through the heating element. The order of collecting the first voltage and the first current is not specifically limited. The first voltage can be collected first and then the first current can be collected, the first current can be collected first and then the first voltage can be collected, or the first current and the first voltage can be collected at the same time.

[0043] Afterwards, the first resistance value of the heating element can be calculated based on Ohm's law according to the first voltage and the first current. Then, the temperature corresponding to the first resistance value can be obtained as the core temperature of the heating element according to the pre-saved relationship between the resistance value and the temperature. In this way, the core temperature of the heating element of the current water heater can be calculated in real time based on the physical properties of the heating coating applied inside the heating element.

[0044] As a possible implementation method, the first voltage and the first current on the heating element can be obtained in the following manner. The high-voltage circuit also includes a sampling resistor connected in series with the heating element. The current in the high-voltage circuit can be first collected as the second current, and the second current can be used as the first current. The second voltage on the high-voltage circuit can also be collected. Then, the product of the first current and the second resistance value of the sampling resistor is calculated, and the first voltage is calculated based on the product and the second voltage. For example, the difference between the second voltage and the product is used as the first voltage.

[0045] When the first voltage and the first current are obtained, the first resistance value of the heating element can be calculated based on Ohm's law. Then, the core temperature of the heating element can be calculated based on the stored relationship between the resistance value and the temperature and the first resistance value.

[0046] Optionally, the relationship between the resistance value and the temperature may include different resistance values ​​and the temperatures corresponding to the different resistance values. From the different resistance values ​​and the temperatures corresponding to the different resistance values, the temperature corresponding to the first resistance value may be obtained by difference as the core temperature of the heating element. Alternatively, the relationship between the resistance value and the temperature may be expressed by a preset formula.

[0047] As a possible implementation, a preset formula is used to represent the relationship between the resistance value and the temperature. After obtaining the first resistance of the heating element, the core temperature of the heating element can be calculated according to the preset formula corresponding to the heating element and the first resistance value.

[0048] Optionally, preset formulas corresponding to different types of heating elements may be pre-stored, that is, the relationship between the resistance value and temperature of each different type of heating element may be stored. When the core temperature needs to be calculated, the preset formula corresponding to the current heating element may be determined according to the type of the current heating element and the preset formulas corresponding to different types of heating elements, and then the core temperature may be calculated based on the preset formula and the first resistance value of the current heating element.

[0049] Please refer to Figure 3 , Figure 3 The second flow chart of the method for collecting the temperature of the heating element of the water heater provided in the embodiment of the present application. In this embodiment, the method may further include step S140.

[0050] Step S140: controlling the working state of the heating element according to the core temperature.

[0051] In this embodiment, when the core temperature of the heating element is obtained, the working state of the heating element can be controlled based on the core temperature to protect the function of the heating element. The specific control method can be determined in combination with actual needs.

[0052] Optionally, it can be determined whether the core temperature is greater than a preset temperature, and the preset temperature can be set specifically in combination with actual needs. If the core temperature is greater than the preset temperature, it means that the current core temperature of the heating element is high, and the heating element can be controlled to stop heating to prevent the heating element from overheating. For example, the high-voltage circuit can be disconnected so that no current flows through the heating element, so that the heating element stops heating. If the core temperature is not greater than the preset temperature, it means that the current heating element is in a normal temperature range, and the heating element can be controlled to continue heating. In this way, the heating element can be temperature protected based on the obtained core temperature of the heating element to prevent the heating element from overheating.

[0053] Among them, optionally, after controlling the heating element to stop heating for a preset period of time, the heating element can be controlled to resume heating, and the core temperature of the heating element can be collected again. If the core temperature at this time is not greater than the preset temperature, the heating element is controlled to continue heating; if the core temperature at this time is greater than the preset temperature, the heating element is controlled to stop heating again.

[0054] Combine the following Figure 4 The method for collecting the temperature of the heating element of the water heater is described by way of example. In the following example, the water heater is a high-pressure water heater for an automobile, and the heating element is a ceramic heating element. A voltage collection unit and a current collection unit may be provided. A current sampling resistor and a ceramic heating element are provided in series on the high-voltage circuit.

[0055] The voltage acquisition unit is used to acquire the first voltage on the current ceramic heating element and send the first voltage to the MCU (Micro Control Unit). The current acquisition unit is used to acquire the first current on the current ceramic heating element and send the first current to the MCU. The MCU calculates the resistance value of the current ceramic heating element based on the first current and the first voltage, and then obtains the core temperature of the current ceramic heating element based on the RT relationship of the physical characteristics of the ceramic heating element. Based on the core temperature, the real-time and accurate temperature protection function of the load (i.e., the ceramic heating element) of the MCH high-pressure water heater can be realized, thereby preventing the heating element from overheating.

[0056] By utilizing the physical properties of the ceramic heating element, the core temperature is accurately calculated by collecting the voltage and current of the heating element, thereby realizing real-time and accurate load temperature protection of the MCH heater. However, the method of mounting a temperature sensor on the outside of the heating element to obtain the core temperature of the heating element, due to the presence of a heat-conducting medium link between the heating element and the temperature sensor, heat loss occurs, resulting in the temperature obtained in this way not being able to truly and accurately reflect the current temperature of the heating element.

[0057] The method for collecting the temperature of the heating element of the water heater provided in the embodiment of the present application calculates the resistance value of the heating element by collecting the voltage and current of the heating element, and then accurately calculates the core temperature of the heating element based on the resistance value and the relationship between the stored resistance value and the temperature. Afterwards, the temperature protection of the heating element can be realized according to the obtained core temperature of the heating element.

[0058] In order to perform the corresponding steps in the above embodiments and various possible methods, the following is a method for implementing a heating element temperature collection device 200 of a water heater. Optionally, the heating element temperature collection device 200 of the water heater can adopt the above Figure 1 The device structure of the electronic device 100 is shown. Figure 5 , Figure 5 This is one of the block diagrams of the heating element temperature acquisition device 200 of the water heater provided in the embodiment of the present application. It should be noted that the basic principle and technical effect of the heating element temperature acquisition device 200 of the water heater provided in this embodiment are the same as those of the above embodiments. For the sake of brief description, for the parts not mentioned in this embodiment, please refer to the corresponding contents in the above embodiments. The heating element is arranged in a high-pressure circuit, and the heating element temperature acquisition device 200 of the water heater may include: an acquisition module 210 and a calculation module 220.

[0059] The acquisition module 210 is used to acquire the first voltage and the first current on the heating element.

[0060] The calculation module 220 is used to calculate the first resistance value of the heating element according to the first voltage and the first current.

[0061] The calculation module 220 is further used to calculate the core temperature of the heating element according to the stored relationship between the resistance value and the temperature and the first resistance value.

[0062] Please refer to Figure 6 , Figure 6 The second block diagram of the heating element temperature acquisition device 200 of the water heater provided in the embodiment of the present application. In this embodiment, the heating element temperature acquisition device 200 of the water heater may further include a control module 230.

[0063] The control module 230 is used to control the working state of the heating element according to the core temperature.

[0064] Optionally, the above modules can be stored in the form of software or firmware. Figure 1 The memory 110 shown in the figure may be fixed in the operating system (OS) of the electronic device 100 and may be Figure 1 Meanwhile, the data and program codes required for executing the above modules may be stored in the memory 110.

[0065] The embodiment of the present application also provides a readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the method for collecting the temperature of the heating element of the water heater is implemented.

[0066] In summary, the embodiment of the present application provides a method and a related device for collecting the temperature of a heating element of a water heater. The heating element is set in a high-voltage circuit. First, a first voltage and a first current on the heating element are collected, and then a first resistance value of the heating element is calculated based on the first voltage and the first current. Finally, the core temperature of the heating element is calculated based on the relationship between the stored resistance value and the temperature and the first resistance value. In this way, the temperature of the heating element in the water heater can be accurately obtained.

[0067] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0068] In addition, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0069] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium, including several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0070] The above description is only an optional embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for collecting the temperature of a heating element of a water heater, characterized in that: The heating element is arranged in a high-voltage circuit, and the method comprises: Collecting and obtaining a first voltage and a first current on the heating element; Calculating a first resistance value of the heating element according to the first voltage and the first current; The core temperature of the heating element is calculated based on the stored relationship between the resistance value and the temperature and the first resistance value.

2. The method according to claim 1, characterized in that The high-voltage circuit also includes a sampling resistor connected in series with the heating element, and the first voltage and the first current on the heating element are obtained by sampling, including: collecting a second current on the high-voltage loop as the first current; Collecting and obtaining a second voltage on the high-voltage circuit; The first voltage is calculated according to the second voltage, the first current and a second resistance value of the sampling resistor.

3. The method according to claim 1, characterized in that: The step of calculating the core temperature of the heating element according to the stored relationship between the resistance value and the temperature and the first resistance value comprises: The core temperature is calculated according to a preset formula corresponding to the heating element and the first resistance value, wherein the preset formula is used to indicate the relationship between the resistance value and the temperature.

4. The method according to any one of claims 1 to 3, characterized in that: The method further comprises: The working state of the heating element is controlled according to the core temperature.

5. The method according to claim 4, characterized in that The controlling the working state of the heating element according to the core temperature includes: Determining whether the core temperature is greater than a preset temperature; If the core temperature is greater than the preset temperature, the heating element is controlled to stop heating.

6. The method according to claim 5, characterized in that The controlling the working state of the heating element according to the core temperature further includes: If the core temperature is not greater than the preset temperature, the heating element is controlled to continue heating.

7. A temperature collection device for a heating element of a water heater, characterized in that: The heating element is arranged in a high-voltage circuit, and the device comprises: A collection module, used for collecting and obtaining a first voltage and a first current on the heating element; a calculation module, configured to calculate a first resistance value of the heating element according to the first voltage and the first current; The calculation module is further used to calculate the core temperature of the heating element according to the stored relationship between the resistance value and the temperature and the first resistance value.

8. The device according to claim 7, characterized in that The device also includes: A control module is used to control the working state of the heating element according to the core temperature.

9. An electronic device, characterized in that: It comprises a processor and a memory, wherein the memory stores machine executable instructions that can be executed by the processor, and the processor can execute the machine executable instructions to implement the method for collecting the temperature of the heating element of the water heater as described in any one of claims 1-6.

10. A readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for collecting the temperature of the heating element of the water heater as described in any one of claims 1 to 6 is implemented.

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