Method and device for detecting abnormal heating of working device in laser

Abstract

The present invention provides a method and device for detecting abnormal heating of working devices in a laser, which relates to the technical field of semiconductor lasers. The method for detecting abnormal heating of working devices in the laser provided by the present invention includes: Step S10. Collect the temperatures of each working device on the laser and determine whether the temperature is an abnormal temperature, and lock the position of the working device with the abnormal temperature; Step S20. According to the position of the working device with the locked abnormal temperature, collect the serial number of the working device with the abnormal temperature on the laser.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lasers, and in particular, to a method and device for detecting abnormal heating of working devices in a laser. Background Art

[0002] A high-power laser is composed of multiple high-power semiconductor chips and their optical passive devices. Since the module uses high-power output, the internal chips and optical passive devices need to withstand the heat brought by the high-power output. Working devices such as chips are prone to damage and are likely to have performance anomalies and reliability problems, such as insufficient power and abnormal heating. Therefore, it is particularly important to check the performance of the module in the early stage. Thus, it is necessary to study a method and device for detecting abnormal heating of working devices in a laser to detect abnormal chips in the early stage of the laser manufacturing process for timely processing and avoid performance anomalies and reliability problems. Summary of the Invention

[0003] The purpose of the present invention is to provide a method and device for detecting abnormal heating of working devices in a laser to alleviate the technical problem of high production failure rate of existing lasers.

[0004] In a first aspect, a method for detecting abnormal heating of working devices in a laser provided by the present invention includes:

[0005] Step S10. Collect the temperatures of each working device on the laser and determine whether the temperature is an abnormal temperature, and lock the position of the working device with the abnormal temperature;

[0006] Step S20. According to the position of the working device with the locked abnormal temperature, collect the serial number of the working device with the abnormal temperature on the laser.

[0007] Further, the method for detecting abnormal heating of working devices in the laser further includes a step performed before step S10:

[0008] Step S1. Collect an image of the laser;

[0009] Place the working devices on the laser within the temperature collection area and the serial number collection area.

[0010] Further, in step S10, the temperatures of each working device on the laser are collected by a thermal imaging detection mechanism and it is determined whether the temperature is an abnormal temperature, and the position of the working device with the abnormal temperature is locked;

[0011] In step S20, the serial number of the working device with the abnormal temperature on the laser is collected by a serial number image detection mechanism;

[0012] In step S1, an image of the laser is collected by the positioning image detection mechanism; the working devices on the laser are located within the temperature acquisition area of the thermal imaging detection mechanism and the serial number acquisition area of the serial number image detection mechanism.

[0013] Further, step S1 includes the steps of: the positioning image detection mechanism identifies and locates the positioning marks on the laser, and numbers each of the working devices on the laser separately;

[0014] Step S10 includes the steps of: the thermal imaging detection mechanism identifies and locates the positioning marks on the laser, so that the image of the laser collected by the positioning image detection mechanism in step S1 coincides with the image of the laser collected by the thermal imaging detection mechanism in step S10; collect the numbers of the working devices with abnormal temperatures;

[0015] Step S20 specifically includes: according to the numbers of the abnormal working devices, adjust the focal length of the serial number image detection mechanism to magnify the image of the area where the numbers of the abnormal working devices are located to obtain the serial numbers of the working devices with abnormal temperatures.

[0016] Further, step S1 includes the steps of: the positioning image detection mechanism identifies and locates the positioning marks on the laser, numbers each of the working devices on the laser separately, and sets the number of one of the working devices as a preset number;

[0017] Adjust the focal length of the serial number image detection mechanism so that its serial number acquisition area is focused on the area where the preset number is located;

[0018] Step S10 includes the steps of: the thermal imaging detection mechanism identifies and locates the positioning marks on the laser, so that the image of the laser collected by the positioning image detection mechanism in step S1 coincides with the image of the laser collected by the thermal imaging detection mechanism in step S10;

[0019] Step S20 specifically includes the steps of: move the laser to move the working device with the locked abnormal temperature to the position of the area where the preset number is located; collect the serial number of the working device with abnormal temperature on the laser through the serial number image detection mechanism.

[0020] Further, step S1 includes the steps of: through the image of the laser collected by the positioning image detection mechanism, so that all the working devices on the laser are located within the temperature acquisition area of the thermal imaging detection mechanism;

[0021] Adjust the focal length of the serial number image detection mechanism so that the serial number acquisition area of the serial number image detection mechanism is focused within the temperature acquisition area and fix the serial number acquisition area; wherein, the serial number acquisition area is sufficient to completely collect the image of the serial number of one working device;

[0022] The specific steps of step S10 include: moving the laser, passing the working devices on the laser one by one through the serial number acquisition area, and collecting the temperatures of the working devices on the laser through the thermal imaging detection mechanism;

[0023] The specific steps of step S20 include: when the temperature of the working device in the serial number acquisition area is abnormal, collecting the serial number of the working device with abnormal temperature in the serial number acquisition area through the serial number image detection mechanism.

[0024] In a second aspect, a device for detecting abnormal heating of working devices in a laser provided by the present invention includes: a thermal imaging detection mechanism and a serial number image detection mechanism,

[0025] The thermal imaging detection mechanism collects the temperatures of each working device on the laser and determines whether the temperature is an abnormal temperature, and locks the position of the working device with the abnormal temperature;

[0026] The serial number image detection mechanism collects the serial numbers of the working devices with abnormal temperature on the laser.

[0027] Furthermore, the device for detecting abnormal heating of working devices in the laser further includes a positioning image detection mechanism and a moving bracket. The positioning image detection mechanism, the thermal imaging detection mechanism, and the serial number image detection mechanism are all installed on the same moving bracket so that the three have the same motion state;

[0028] The positioning image detection mechanism is used to collect an image of the laser, and the moving bracket is used to move the laser to be detected into the temperature acquisition area of the thermal imaging detection mechanism and the serial number acquisition area of the serial number image detection mechanism.

[0029] Furthermore, the moving bracket includes a first driving mechanism and a second driving mechanism. The driving end of the first driving mechanism is connected with a connecting frame, and the first driving mechanism is used to drive the connecting frame to move vertically; the driving end of the second driving mechanism is connected to the first driving mechanism so that the second driving mechanism drives the first driving mechanism and the connecting frame to move horizontally together;

[0030] The positioning image detection mechanism, the thermal imaging detection mechanism, and the serial number image detection mechanism are all installed on the connecting frame.

[0031] Furthermore, the device for detecting abnormal heating of working devices in the laser further includes a moving base, and the moving base is used to install the laser to drive the laser to move in the horizontal direction.

[0032] The present invention has at least the following advantages or beneficial effects:

[0033] The method for detecting abnormal heating of working devices in the laser provided by the present invention includes: Step S10. Collect the temperatures of various working devices on the laser and determine whether the temperatures are abnormal temperatures, and lock the positions of the working devices with abnormal temperatures; Step S20. According to the positions of the working devices with abnormal temperatures locked, collect the serial numbers of the working devices with abnormal temperatures on the laser.

[0034] The detection method provided by the present invention identifies the working devices with abnormal temperatures by collecting the temperatures of the working devices inside the laser and determining whether the temperatures are abnormal temperatures; then obtains the serial numbers of the working devices with abnormal temperatures, conducts key analysis on the working devices with abnormal temperatures, checks and processes the abnormal working devices in the initial stage of preparation in a timely manner, avoids performance and reliability problems, so as to avoid the overall failure of the laser due to its failure when used by the client, ensure that the overall state of the laser works in the best state, and improve the yield rate. Description of the Drawings

[0035] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0036] Figure 1 Schematic diagram of the device for detecting abnormal heating of working devices in the laser provided in Embodiment 4 of the present invention (the detailed structure on the laser is not drawn);

[0037] Figure 2 Image of the laser collected in Step S1 in the method for detecting abnormal heating of working devices in the laser provided in Embodiment 1 of the present invention;

[0038] Figure 3 Thermal imaging diagram of the laser collected in Step S10 in the method for detecting abnormal heating of working devices in the laser provided in Embodiment 1 of the present invention;

[0039] Figure 4 Schematic diagram of the abnormal working device collected in Step S20 in the method for detecting abnormal heating of working devices in the laser provided in Embodiment 1 of the present invention;

[0040] Figure 5 Image collected by the positioning image detection mechanism in Step S1 in the method for detecting abnormal heating of working devices in the laser provided in Embodiment 2 of the present invention;

[0041] Figure 6 Image collected by the thermal imaging detection mechanism in Step S10 in the method for detecting abnormal heating of working devices in the laser provided in Embodiment 2 of the present invention;

[0042] Figure 7 This is the image captured by the thermal imaging detection mechanism in step S20 of the method for detecting abnormal heating of the working device in the laser provided in Embodiment 2 of the present invention;

[0043] Figure 8 This is a schematic diagram of step S1 in the method for detecting abnormal heating of the working device in the laser provided in Embodiment 3 of the present invention;

[0044] Figure 9 This is a schematic diagram of step S10 in the method for detecting abnormal heating of the working device in the laser provided in Embodiment 3 of the present invention.

[0045] Icon: 1 - positioning image detection mechanism; 2 - thermal imaging detection mechanism; 3 - serial number image detection mechanism; 4 - moving bracket; 5 - laser; 6 - working device; 7 - positioning mark; 8 - area where the preset number is located; 9 - temperature acquisition area; 10 - serial number acquisition area. Detailed implementation manners

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents the selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0048] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0049] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0050] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0051] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0052] Embodiment 1

[0053] As Figure 1 shown, in view of the problem that the abnormal working device 6 (the working device 6 is a chip in this embodiment) in the laser 5 generates higher heat, this method is designed. The temperature of the working device 6 inside the laser 5 is collected through a heat image, and the abnormal temperature working device 6 is identified; the abnormal temperature working device 6 is analyzed emphatically, and the abnormal part of the system is checked and processed in time at the initial stage of the process.

[0054] The method for detecting abnormal heating of the working device in the laser provided by the present invention is executed by a detection device. Among them, the detection device includes: a thermal imaging detection mechanism 2 and a serial number image detection mechanism 3. The thermal imaging detection mechanism 2 collects the temperatures of the respective working devices 6 on the laser 5. Preferably, the temperature can be displayed. When the user can preset that when the temperature is higher than the first preset value, it is determined as an abnormal temperature, and the first preset value is different according to different products. After the thermal imaging detection mechanism 2 discovers the working device 6 with an abnormal temperature, it quickly locks the position of the working device 6 with the abnormal temperature and displays the abnormal temperature.

[0055] The serial number image detection mechanism 3 collects the serial numbers of the working devices 6 with abnormal temperatures on the laser 5, identifies the serial numbers and retrieves the COS-phase test results of the working devices 6 with abnormal temperatures to compare whether there are abnormalities, and accelerates the analysis of the abnormalities. Specifically, according to the serial numbers of the working devices 6, the data recorded during the test and aging stage of this working device 6 is retrieved, and through relevant reliability data (such as optical power, working current, working voltage, polarization, etc.), it is determined whether the working device 6 has any abnormalities.

[0056] The detection method provided by the present invention collects the temperatures of the working devices 6 inside the laser 5 through the thermal imaging detection mechanism 2 and identifies the working devices 6 with abnormal temperatures; then obtains the serial numbers of the working devices 6 with abnormal temperatures, conducts key analysis on the working devices 6 with abnormal temperatures, checks for abnormal devices in the system during the initial preparation stage and processes them in a timely manner to improve the yield rate.

[0057] As Figure 1 shown, the detection device further includes: a positioning image detection mechanism 1, and the positioning image detection mechanism 1, the thermal imaging detection mechanism 2, and the serial number image detection mechanism 3 can all be installed on the same moving bracket 4. The three detection mechanisms are fixed to the moving bracket 4 and can move simultaneously, but can each fine-tune the focal length. First, the positioning image detection mechanism 1 locates the image acquisition center to ensure that all the working devices 6 on the laser 5 can be completely collected, and determines the shooting focal length. After the focus is determined, the height of the moving bracket 4 is kept basically unchanged (in the z-axis direction), that is, the focus remains unchanged. Then, the thermal imaging detection mechanism 2 is activated to collect heat, and the working devices 6 with abnormal temperatures can be observed. Next, the serial number image detection mechanism 3 is used to determine the serial numbers of the abnormal temperature points. The moving bracket 4 can move in two-dimensional or three-dimensional directions. In this embodiment, the moving bracket 4 can move along the horizontal (x-axis direction) and vertical (z-axis direction).

[0058] The method for detecting abnormal heating of the working devices in the laser further includes a step performed before step S10: Step S1. The positioning image detection mechanism 1 collects an image of the laser 5, and adjusts the position of the moving bracket 4 so that the laser 5 to be detected is located within the temperature acquisition area of the thermal imaging detection mechanism 2 and the serial number acquisition area 10 of the serial number image detection mechanism 3.

[0059] Specifically, a complete image of the laser 5 can be obtained through the positioning image detection mechanism 1, and the laser 5 is located at the center of the image acquisition area of the positioning image detection mechanism 1, that is, the positioning image detection mechanism 1, the thermal imaging detection mechanism 2, and the serial number image detection mechanism 3 can all collect a complete top view of the laser 5, which is convenient for the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 to perform positioning and reduce the focal length adjustment range of the corresponding detection mechanism, facilitating rapid acquisition and identification work.

[0060] In this embodiment, step S1 includes the steps of: identifying the positioning mark 7 on the laser 5 through the positioning image detection mechanism 1, positioning the laser 5 according to the positioning mark 7, and then numbering the working devices 6 thereon. Among them, the positioning mark 7 can be a specific structure on the laser 5. For example, structures such as screw holes and positioning posts. In this embodiment, 4 screw holes are used as the positioning mark 7. According to the positions of the working devices 6 (chips) on the laser 5, all the working devices 6 are numbered. For example, there are 26 working devices 6 that generate heat on the laser 5. Starting from the first working device 6 in the upper left corner of the image in sequence, these 26 working devices 6 are given morphological registration in turn (to prepare for the serial number image detection mechanism 3 to focus on the image later, to avoid the serial number not being within the image after focusing) and numbered, such as number 1, number 2... number 26, as Figure 2 shown. In step S10, the laser 5 is positioned using the same positioning mark 7, so that the image collected in step S1 is corresponding to the thermal imaging image collected in step S10. Since the number and the working device 6 are in one-to-one correspondence, when an abnormal temperature working device 6 appears, the number of the abnormal working device 6 can be directly obtained without obtaining the coordinates of each working device 6 by establishing coordinates. Then, according to the number of the abnormal working device 6, the focal length of the serial number image detection mechanism 3 is adjusted to magnify the image of the area where the number of the abnormal working device 6 is located to obtain the complete serial number of the abnormal temperature working device 6, as Figure 3 and Figure 4 shown. In this embodiment, by uniformly processing the images collected by the positioning image detection mechanism 1, the thermal imaging detection mechanism 2, and the serial number image detection mechanism 3, the serial number of the abnormal working device 6 can be found quickly and accurately.

[0061] Embodiment 2

[0062] In this embodiment, step S1 includes the steps of: identifying the positioning mark 7 on the laser 5 through the positioning image detection mechanism 1, positioning the laser 5 according to the positioning mark 7, and then numbering the working devices 6 thereon. This step is the same as that in Embodiment 1 and will not be elaborated here.

[0063] After numbering each working device 6, the focal length of the serial number image detection mechanism 3 is adjusted to make it focus on the preset numbered area 8 and fix the serial number acquisition area 10 of the serial number image detection mechanism 3 as the preset numbered area 8. For example, the serial number acquisition area 10 of the serial number image detection mechanism 3 is locked at the position of the working device 6 numbered 1 in the upper left corner through focusing, and then the serial number acquisition area 10 of the serial number image detection mechanism 3 no longer changes, as Figure 5 shown.

[0064] Similar to Embodiment 1, in step S10, the laser 5 is positioned in the same positioning manner so that the image of the laser collected by the positioning image detection mechanism 1 in step S1 coincides with the image of the laser 5 collected by the thermal imaging detection mechanism 2 in step S10, thereby corresponding the image collected in step S1 with the thermal imaging image collected in step S10.

[0065] As Figure 6 shown, after the working device 6 with abnormal temperature is locked, the laser 5 is moved to move the working device 6 with the locked abnormal temperature to the position in the area 8 where the preset number is located, as Figure 7 shown; the serial number of the working device 6 with abnormal temperature on the laser 5 is collected by the serial number image detection mechanism 3. During the detection process of the serial number, the shooting position of the serial number image detection mechanism 3 remains unchanged all the time, but the entire laser 5 is translated to move the abnormal working device 6 into the collection area of the serial number image detection mechanism 3.

[0066] When the number of working devices 6 with abnormal temperature is greater than or equal to two, the working devices 6 with abnormal temperature are sequentially moved to the area 8 where the preset number is located in the order from near to far from the area 8 where the preset number is located, thereby reducing the total movement distance of the laser 5 and reducing the detection time.

[0067] Embodiment 3

[0068] As Figure 8 and Figure 9 shown, in this embodiment, different from Embodiments 1 and 2, it is simpler and faster. There is no need to register the morphology of the working device 6, nor to obtain the coordinate information of the working device 6; only by moving the position of the laser 5 in the temperature collection area of the thermal imaging detection mechanism 2, the serial number of the abnormal working device 6 can be obtained quickly and accurately.

[0069] Specifically: as Figure 8 shown, first, before collecting the thermal imaging image, the size of the thermal imaging images of all the working devices 6 to be detected is adapted to the temperature collection area 9 of the thermal imaging detection mechanism 2, for example, the height is adapted ( Figure 8 left figure): the uppermost working device 6 is located at the upper left corner of the temperature collection area 9, and at the same time, the serial number collection area 10 of the serial number image detection mechanism 3 is focused and locked at the position of the upper left corner. (Of course, this focused and locked position can also be other positions, such as other corners, or a certain edge position of the temperature collection area 9, as long as the thermal imaging image of a certain working device 6 can be moved out or into this edge position by moving the position of the laser 5); when an abnormal working device 6 appears, the thermal imaging images of other working devices 6 can be moved to this locked position one by one by moving the position of the laser 5. As Figure 9As shown, by moving the position of the laser 5, the thermal imaging images of each working device 6 can pass through the serial number acquisition area 10 one by one and be moved out of the temperature acquisition area 9. Preferably, it is only necessary to detect the temperature of the working device 6 at the serial number acquisition area 10 at a fixed point; when the thermal imaging image of the working device 6 is normal, it is directly moved out of the temperature acquisition area 9, and then the position of the laser 5 is moved so that the thermal imaging image of the next working device 6 is moved into the serial number acquisition area 10. Therefore, during the detection process, there is no need to perform morphological registration on the working device 6, nor to obtain the coordinate information of the working device 6. Only by moving the position of the laser 5 in the temperature acquisition area of the thermal imaging detection mechanism 2 can the serial number of the abnormal working device 6 be obtained quickly and accurately, and the detection speed is faster and more convenient.

[0070] Embodiment 4

[0071] The device for detecting abnormal heating of working devices in the laser provided by the present invention includes: a thermal imaging detection mechanism 2 and a serial number image detection mechanism 3. The thermal imaging detection mechanism 2 collects the temperatures of various working devices 6 on the laser 5 and determines whether the temperatures are abnormal temperatures, and locks the positions of the working devices 6 with abnormal temperatures; the serial number image detection mechanism 3 collects the serial numbers of the working devices 6 with abnormal temperatures on the laser 5. The detection method provided by the present invention collects the temperatures of the working devices 6 inside the laser 5 through the thermal imaging detection mechanism 2 to identify the working devices 6 with abnormal heat; then obtains the serial numbers of the working devices 6 with abnormal temperatures, conducts key analysis on the working devices 6 with abnormal temperatures, and checks and processes system abnormal devices in the initial preparation stage to improve the yield rate.

[0072] The device for detecting abnormal heating of working devices in the laser further includes the positioning image detection mechanism 1 and the moving bracket 4. The positioning image detection mechanism 1, the thermal imaging detection mechanism 2, and the serial number image detection mechanism 3 are all installed on the same moving bracket 4 so that the three have the same motion state.

[0073] The detection device further includes: a positioning image detection mechanism 1. Moreover, the positioning image detection mechanism 1, the thermal imaging detection mechanism 2, and the serial number image detection mechanism 3 can all be installed on the same moving bracket 4. The three detection mechanisms are fixed to the moving bracket 4 and can move simultaneously, but can each fine-tune the focal length. First, the positioning image detection mechanism 1 locates the image acquisition center to ensure that the laser 5 is completely acquired and determines the shooting focal length. After the focus is determined, the height of the moving bracket 4 is kept basically unchanged, that is, the focus remains unchanged. Thereafter, the thermal imaging detection mechanism 2 is turned on to collect heat, and abnormal temperature points can be observed. Next, the serial number of the abnormal temperature point is determined through the serial number image detection mechanism 3. The moving bracket 4 can move in two-dimensional or three-dimensional directions. In this embodiment, the moving bracket 4 can move along the horizontal direction (x-axis direction) and the vertical direction (z-axis direction).

[0074] The abnormal heating detection device for the working device in the laser further includes a moving base (not shown), which is used to mount the laser 5 to drive the laser 5 to move in the horizontal direction so that the working device 6 thereon is moved into the serial number acquisition area 10 of the serial number image detection mechanism 3. In this embodiment, the moving base can move in the x-axis direction and the y-axis direction, so that the working device 6 with abnormal temperature locked can be moved to the position of the area 8 where the preset number is located. During the detection of the serial number, the shooting position of the serial number image detection mechanism 3 remains unchanged, but the entire laser 5 is translated to move the abnormal working device 6 into the serial number acquisition area 10 of the serial number image detection mechanism 3.

[0075] Further, the moving bracket 4 includes a first driving mechanism and a second driving mechanism. The driving end of the first driving mechanism is connected with a connecting frame, and the first driving mechanism is used to drive the connecting frame to move in the vertical direction (z-axis direction); the driving end of the second driving mechanism is connected to the first driving mechanism, so that the second driving mechanism drives the first driving mechanism and the connecting frame to move together in the horizontal direction (x-axis direction). The positioning image detection mechanism 1, the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 are all installed on the connecting frame. Among them, the first driving mechanism and the second driving mechanism can both be conventional linear driving modules, such as lead screw motor modules, etc.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for detecting abnormal heating of a working device in a laser, characterized in that: include: Step S10. collecting the temperature of each working device (6) on the laser (5) and determining whether the temperature is abnormal, and locking the position of the working device (6) with abnormal temperature; Step S20. According to the position of the abnormally-temperature working device (6) that is locked, the serial number of the abnormally-temperature working device (6) on the laser (5) is collected; The method for detecting abnormal heating of a working device in a laser further includes the following steps performed before step S10: Step S1. collecting an image of the laser (5); The working device (6) on the laser (5) is located in the temperature collection area (9) and the serial number collection area (10); In the step S10, the temperature of each working device (6) on the laser (5) is collected by the thermal imaging detection mechanism (2) to determine whether the temperature is abnormal, and the position of the working device (6) with abnormal temperature is locked; In the step S20, the serial number of the working device (6) with abnormal temperature on the laser (5) is collected by the serial number image detection mechanism (3); In the step S1, an image of the laser (5) is collected by positioning the image detection mechanism (1); and the working device (6) on the laser (5) is located in the temperature collection area (9) of the thermal imaging detection mechanism (2) and the serial number collection area (10) of the serial number image detection mechanism (3).

2. The method for detecting abnormal heating of a working device in a laser according to claim 1, characterized in that: The step S1 comprises the steps of: the positioning image detection mechanism (1) identifies and locates the positioning mark (7) on the laser (5), and numbers each working device (6) on the laser (5); The step S10 comprises the steps of: the thermal imaging detection mechanism (2) identifying the positioning mark (7) on the laser (5) and positioning it so that the image of the laser collected by the positioning image detection mechanism (1) in step S1 coincides with the image of the laser (5) collected by the thermal imaging detection mechanism (2) in step S10; The number of the working device (6) that collects the abnormal temperature; The step S20 specifically comprises: according to the serial number of the abnormal working device (6), adjusting the focal length of the serial number image detection mechanism (3) to magnify the image of the area where the serial number of the abnormal working device (6) is located to obtain the serial number of the working device (6) with abnormal temperature.

3. The method for detecting abnormal heating of a working device in a laser according to claim 1, characterized in that: The step S1 comprises the steps of: the positioning image detection mechanism (1) identifies the positioning mark (7) on the laser (5) and positions it, numbers each working device (6) on the laser (5), and sets the number of one of the working devices (6) to a preset number; Adjusting the focal length of the serial number image detection mechanism (3) so that the serial number acquisition area (10) is focused on the area (8) where the preset number is located; The step S10 comprises the steps of: the thermal imaging detection mechanism (2) identifying the positioning mark (7) on the laser (5) and positioning it so that the image of the laser collected by the positioning image detection mechanism (1) in step S1 coincides with the image of the laser (5) collected by the thermal imaging detection mechanism (2) in step S10; The step S20 specifically comprises the steps of: moving the laser (5) to move the working device (6) with abnormal temperature to be locked to the position of the area (8) where the preset number is located; and collecting the serial number of the working device (6) with abnormal temperature on the laser (5) by means of the serial number image detection mechanism (3).

4. The method for detecting abnormal heating of a working device in a laser according to claim 1, characterized in that: The step S1 comprises the steps of: capturing an image of the laser (5) by positioning the image detection mechanism (1) so that all working components (6) on the laser (5) are located within a temperature collection area (9) of the thermal imaging detection mechanism (2); Adjusting the focal length of the serial number image detection mechanism (3) so that the serial number acquisition area (10) of the serial number image detection mechanism (3) is focused within the temperature acquisition area (9), and fixing the serial number acquisition area (10); wherein the serial number acquisition area (10) is sufficient to completely acquire an image of the serial number of a working device (6); The step S10 specifically comprises the steps of: moving the laser (5), passing the working components (6) on the laser (5) through the serial number collection area (10) one by one, and collecting the temperature of the working components (6) on the laser (5) by means of the thermal imaging detection mechanism (2); The step S20 specifically comprises the steps of: when the temperature of the working device (6) in the serial number collection area (10) is abnormal, collecting the serial number of the working device (6) with abnormal temperature in the serial number collection area (10) by means of the serial number image detection mechanism (3).

5. A device for detecting abnormal heating of a working device in a laser, characterized in that: The detection device comprises: a thermal imaging detection mechanism (2) and a serial number image detection mechanism (3), The thermal imaging detection mechanism (2) collects the temperature of each working device (6) on the laser (5) and determines whether the temperature is abnormal, and locks the position of the working device (6) with abnormal temperature; The serial number image detection mechanism (3) collects the serial number of the working device (6) with abnormal temperature on the laser (5); The device for detecting abnormal heating of a working device in a laser further comprises a positioning image detection mechanism (1) and a movable bracket (4); the positioning image detection mechanism (1), the thermal imaging detection mechanism (2) and the serial number image detection mechanism (3) are all mounted on the same movable bracket (4) so ​​that the three have the same motion state; The positioning image detection mechanism (1) is used to collect an image of a laser (5), and the movable bracket (4) is used to move the laser (5) to be detected to a temperature collection area of ​​the thermal imaging detection mechanism (2) and a serial number collection area (10) of the serial number image detection mechanism (3).

6. The device for detecting abnormal heating of a working device in a laser according to claim 5, characterized in that: The mobile bracket (4) comprises a first driving mechanism and a second driving mechanism, wherein the driving end of the first driving mechanism is connected to a connecting frame, and the first driving mechanism is used to drive the connecting frame to move vertically; the driving end of the second driving mechanism is connected to the first driving mechanism, so that the second driving mechanism drives the first driving mechanism and the connecting frame to move horizontally together; The positioning image detection mechanism (1), the thermal imaging detection mechanism (2) and the serial number image detection mechanism (3) are all mounted on the connecting frame.

7. The device for detecting abnormal heating of a working device in a laser according to claim 6, characterized in that: The device for detecting abnormal heating of a working device in a laser further comprises a movable base, wherein the movable base is used to mount the laser (5) so as to drive the laser (5) to move in a horizontal direction.

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