3D coupling surface enhanced Raman scattering array chip and preparation method and application thereof

By forming a 3D coupled nanowire mesh structure on the SERS substrate, the problem of high requirements and difficulty in wide application of existing SERS substrate technology is solved, and SERS performance with high sensitivity and high uniformity can be achieved, and low concentrations of bioamines can be detected.

CN119688665AInactive Publication Date: 2025-03-25JIANGNAN UNIV
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Patent Information

Application Number
CN202411618370.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-13
Publication Date
2025-03-25
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing 2D and 3D SERS reinforced substrates mostly use nanoparticle aggregation slits and metal columns (particles) micro-nano arrangement etching, which has high technical requirements and is difficult to widely use.

Method used

Interface bonded alloy nanoparticles are used as the growth site of gold nanowires, and the nanowire mesh dot matrix structure interacts with light through the 3D growing nanowire resonance (LSPR), which stimulates local surface plasmon resonance (LSPR), and realizes 3D coupling of nanowire LSPR and enhances SERS signal.

Benefits of technology

The SERS performance with high sensitivity, high reproducibility, high stability and high uniformity is achieved, allowing the substrate to detect bioamines at concentrations as low as 3.95×10-12M, providing a sensitive and feasible detection method.

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Abstract

The invention discloses a preparation method of a 3D coupled surface enhanced Raman scattering array chip, which comprises the following steps: (1) dispersing a SiO2 microsphere solution on a substrate, and self-assembling to form a single-layer distributed dot matrix substrate; (2) plating a layer of metal film on the dot matrix substrate, and performing ultrasonic cleaning to obtain a chip substrate with micro holes in the surface; (3) processing the chip substrate by using a silanization reagent to prepare a chip substrate of which the micro-pore surface is charged; (4) dripping gold nanoparticles on the surface of the chip substrate treated in the step (3), bonding, and removing the metal film by using alkali liquor to obtain a gold nanoparticle aggregation dot-matrix array chip substrate; and (5) immersing the chip substrate treated in the step (4) into a solution containing HAuCl4, an inducer and a reducing agent, and carrying out an in-situ growth reaction of the gold nanowire-shaped structure to obtain the array chip. The chip disclosed by the invention can realize application value in the fields of biomedicine, environment detection, food safety and the like.
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Citation Information

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