Laser module detection system

By designing the opposite power-up mechanism and optical path change structure in the laser module detection system, the problem of optical path misalignment after rotation of the detection device is solved, and stable detection of the laser module chip is realized, and the stability and efficiency of detection are improved.

CN119689224AActive Publication Date: 2025-03-25DOGAIN LASER TECH (SUZHOU) CO LTD
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Patent Information

Application Number
CN202510200667.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-24
Publication Date
2025-03-25
Estimated Expiration
2045-02-24

AI Technical Summary

Technical Problem

The existing laser module detection system is prone to misalignment of the optical path or power-up mechanism after the overall rotation of the detection device, resulting in inaccurate detection results and increased detection time.

Method used

A laser module detection system is designed, including at least two chip sets arranged in the second direction, each chip set consisting of a first chip and a second chip arranged in the first direction. The system uses a first power-up mechanism and a second power-up mechanism to power the first chip and the second chip respectively, and uses the optical path change structure to inject the light generated by the chip into the detection sensor to avoid overall rotation.

Benefits of technology

Through the power-up mechanism and optical path change structure provided on the opposite side, stable detection of the chip in the laser module is achieved, dislocation problems caused by overall rotation are avoided, and detection stability and efficiency are improved.

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Abstract

The invention provides a laser module detection system, and relates to the technical field of semiconductor lasers, the laser module detection system provided by the invention is characterized in that a laser module is provided with at least two chipsets arranged along a second direction, each chipset comprises a first chip and a second chip arranged along a first direction, the system comprises a first power-up mechanism, a second power-up mechanism, a light path changing structure and a detection sensor, the first power-up mechanism and the second power-up mechanism are arranged along a first direction, and the first power-up mechanism and the second power-up mechanism respectively power up the first chip and the second chip; the light path changing structure is located between the first chip and the second chip of the chip set, and the light path changing structure is used for receiving light generated by the first chip and the second chip and emitting the light into the detection sensor.
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Description

Technical Field

[0001] The invention relates to the technical field of semiconductor lasers, and in particular to a laser module detection system. Background Art

[0002] The laser module is composed of multiple chips converged into a main optical path, which is then transmitted through a multi-mode optical fiber. Therefore, a single chip abnormality can only be discovered through the abnormal final result when the device is low power or fails, and the abnormal chip can then be disassembled and analyzed.

[0003] When testing a single chip in a laser module, the chip needs to be powered on, and then the light emitted by the chip needs to be collected and analyzed. In existing laser modules, there are two rows of chips on the left and right. After testing one row of chips, the testing device needs to be rotated 180° to test the other row of chips. During the flipping process, the optical path or the power supply mechanism is easily misaligned, resulting in inaccurate test results and increased test time. Summary of the invention

[0004] The object of the present invention is to provide a laser module detection system to alleviate the technical problem of optical path or power supply mechanism misalignment caused by overall rotation of the detection device during single-chip detection in the existing laser module.

[0005] The present invention provides a laser module detection system, wherein the laser module is provided with at least two chip groups arranged along a second direction, each of the chip groups includes a first chip and a second chip arranged along a first direction, and the system includes: a first power-on mechanism, a second power-on mechanism, an optical path changing structure and a detection sensor; The first power-on mechanism and the second power-on mechanism are arranged along a first direction, and the first power-on mechanism and the second power-on mechanism respectively power the first chip and the second chip; The optical path changing structure is located between the first chip and the second chip of the chipset, and is used to receive light generated by the first chip and the second chip respectively, and emit the light into the detection sensor.

[0006] Furthermore, the system further comprises a first moving mechanism and a second moving mechanism respectively located on both sides of the laser module in the first direction. The first moving mechanism drives the first power-on mechanism to move along the third direction and the second direction, so that the first chip in the chipset is electrically connected; The second moving mechanism drives the second power-on mechanism to move along the third direction and the second direction, so that the second chip in the chipset is electrically connected; The optical path changing structure is arranged on the first moving mechanism, and the detection sensor is arranged on the second moving mechanism; The first direction and the second direction are both located on a reference plane, and the third direction is perpendicular to the reference plane.

[0007] Furthermore, the first moving mechanism can move in the third direction to a first position and a second position, and the first position is farther away from the laser module than the second position; The second moving mechanism can move in the third direction to a third position and a fourth position, wherein the third position is farther away from the laser module than the fourth position; The first power-on mechanism is used to be electrically connected to the first chip when the first moving mechanism is located at the second position; the second power-on mechanism is used to be electrically connected to the second chip when the second moving mechanism is located at the fourth position.

[0008] Further, the optical path changing structure includes a first light incident area, a second light incident area, a first light exit area, and a second light exit area; The first light incident area is used to receive light to be emitted by the first chip, and the light incident from the first light incident area is emitted from the first light exit area; the second light incident area is used to receive light to be emitted by the second chip, and the light incident from the second light incident area is emitted from the second light exit area; In the third direction, the first light exit area is farther away from the laser module than the second light exit area, so that light emitted from the first light exit area can be incident on the detection sensor at the third position along the first direction, and light emitted from the second light exit area can be incident on the detection sensor at the fourth position along the first direction.

[0009] Furthermore, the optical path changing structure includes a first optical path component and a second optical path component that are independent of each other, the first optical path component forms the first light entrance area and the first light exit area; the second optical path component forms the second light entrance area and the second light exit area.

[0010] Furthermore, the first optical path component includes a first light incident surface, a first reflection surface, a second reflection surface and a first light emitting surface which are arranged in sequence; the first light incident area is located on the first light incident surface; the first light emitting area is located on the first light emitting surface; the first reflection surface faces the light emitting surface of the first chip, and the second reflection surface faces the detection surface of the detection sensor; the light emitted by the first chip passes through the first light incident surface, the first reflection surface, the second reflection surface and the first light emitting surface in sequence and then enters the detection sensor.

[0011] Furthermore, the first light incident surface is parallel to the light emitting surface of the first chip; the first reflection surface is at an angle of 45° with the reference plane, and the first reflection surface is parallel to the second reflection surface; and the first light emitting surface is parallel to the detection surface of the detection sensor.

[0012] Furthermore, the second optical path component includes a first light input and output surface, a third reflection surface and a fourth reflection surface; the second light input area and the second light output area are both located on the first light input and output surface; the third reflection surface faces the light emitting surface of the second chip, and the fourth reflection surface faces the detection surface of the detection sensor, and the light emitted by the second chip passes through the first light input and output surface, the third reflection surface, the fourth reflection surface and the first light input and output surface in sequence before entering the detection sensor.

[0013] Furthermore, the first light input and output surfaces are respectively parallel to the light emitting surface of the second chip and the detection surface of the detection sensor; the third reflection surface forms an angle of 45° with the reference plane, the fourth reflection surface forms an angle of 45° with the reference plane, and the third reflection surface and the fourth reflection surface form an angle of 90°.

[0014] Further, the optical path changing structure includes a first prism and a second prism, the second prism is fixed relative to the first moving mechanism; the first prism is rotatably connected to the first moving mechanism, and can be switched between a first angle and a second angle; At the first angle, the light emitted by the first chip passes through the first prism and then enters the detection sensor; At the second angle, in the second direction, the light emitted by the second chip passes through the first prism and the second prism successively before entering the detection sensor.

[0015] Further, the optical path changing structure includes a rotating frame and a fixed frame, the fixed frame is fixedly connected to the first moving mechanism; the rotating frame is rotatably connected to the first moving mechanism, the rotating axis of the rotating frame extends along the third direction and is located between the first chip and the second chip of the chipset; The fixing frame is provided with the second prism; in the second direction, the second prism is located on one side of the rotating shaft; The first prism is arranged on the rotating frame, and when the rotating frame drives the first prism to rotate to a first angle, in a second direction, the first prism is located on the other side of the rotating shaft; When the rotating frame drives the first prism to rotate to a second angle, the first angle and the second angle differ by 180°, and in the second direction, the first prism and the second prism are both located on one side of the rotating shaft.

[0016] The present invention has at least the following advantages or beneficial effects: The laser module detection system provided by the present invention comprises at least two chipsets arranged along a second direction, each of the chipsets comprises a first chip and a second chip arranged along a first direction, and the system comprises: a first power-on mechanism, a second power-on mechanism, an optical path changing structure and a detection sensor; the first power-on mechanism and the second power-on mechanism are arranged along the first direction, and the first power-on mechanism and the second power-on mechanism respectively power on the first chip and the second chip; the optical path changing structure is located between the first chip and the second chip of the chipset, and the optical path changing structure is used to respectively receive light generated by the first chip and the second chip, and emit the light into the detection sensor.

[0017] The first power-on mechanism and the second power-on mechanism provided on the opposite side can be used to power on the first chip and the second chip in the chip group to be detected in the laser module respectively. The laser light generated by the first chip and the second chip in the chip group to be detected after powering on can be incident on the optical path changing structure in the middle position, and the light emitted by the first chip and the second chip in the direction of each other can be incident on the detection sensor after passing through the optical path changing structure, thereby completing the detection of the first chip and the second chip in a chip group. During the detection, there is no need to rotate the system as a whole, and the relative displacement between the components is small, thereby improving the detection stability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A top view of the laser module detection system provided in Example 1 of the present invention; Figure 2 A front view of the laser module detection system provided in Example 1 of the present invention; Figure 3 An optical path diagram for the first chip detection of the laser module detection system provided in Example 1 of the present invention; Figure 4 This is a light path diagram for detecting the right side chip of the laser module detection system provided in Example 1 of the present invention; Figure 5 A schematic diagram of the rearward-looking direction of the laser module detection system provided in Embodiment 2 of the present invention; Figure 6 A schematic diagram of a rearward-looking direction detected by a first chip of a laser module detection system provided in Embodiment 2 of the present invention; Figure 7 for Figure 6 Schematic diagram of the rearward viewing direction of the structure with the optical path changed; Figure 8 for Figure 6 Schematic diagram of the right-viewing direction of the structure with the optical path changed; Fig. 9 for Figure 6 The optical path diagram of the first chip in the figure; Fig.10 A schematic diagram of a rearward-looking direction detected by a second chip of a laser module detection system provided in Embodiment 2 of the present invention; Fig.11 for Fig.10 Schematic diagram of the rearward viewing direction of the structure with the optical path changed; Fig.12 for Fig.10 Schematic diagram of the right-viewing direction of the structure with the optical path changed; Fig.13 for Fig.10 Light path diagram of the second chip.

[0020] Icons: 1-laser module; 21-first power-on mechanism; 22-second power-on mechanism; 3-detection sensor; 41-first moving mechanism; 42-second moving mechanism; 51-first optical path component; 511-first light incident surface; 512-first reflection surface; 513-second reflection surface; 514-first light output surface; 52-second optical path component; 521-first light input and output surface; 522-third reflection surface; 523-fourth reflection surface; 61-rotating frame; 62-fixed frame; 63-rotating shaft; 64-first prism; 65-second prism; 7-optical path changing structure; 81-first chip; 82-second chip; 611-second light incident surface; 612-fifth reflection surface; 613-sixth reflection surface; 614-second light output surface; 621-second light input and output surface; 622-seventh reflection surface; 623-eighth reflection surface. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0024] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0026] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Example 1 like Figure 1-Figure 4 As shown, the laser module detection system provided by the present invention can be used for, but is not limited to, detecting the light field morphology of the chip in the laser module 1 .

[0028] The laser module 1 can be fixed horizontally on the fixture. The laser module 1 is provided with at least two chipsets arranged along the second direction, each of which includes a first chip 81 and a second chip 82 arranged along the first direction. Specifically, for the convenience of description, in this embodiment, the first direction is the left-right direction, and the direction where the first chip 81 is located is the left direction, and the direction where the second chip 82 is located is the right direction. The second direction is the front-to-back direction, that is, the chipsets are arranged along the front-to-back direction. During detection, the chipsets can be detected one by one from front to back, such as Figure 1 shown.

[0029] like Figure 2 As shown, the system includes: a first power-on mechanism 21 , a second power-on mechanism 22 , an optical path changing structure 7 and a detection sensor 3 .

[0030] The first power-on mechanism 21 and the second power-on mechanism 22 are arranged along the first direction. After the first power-on mechanism 21 moves downward to a position, it contacts the contact point of the first chip 81 to power it. Figure 3 Similarly, after the second power-on mechanism 22 moves downward to its position, it contacts the contacts of the second chip 82 to power it, as shown in FIG. Figure 4 shown.

[0031] The optical path changing structure 7 is located between the first chip 81 and the second chip 82. The optical path changing structure 7 can also move in a third direction, so as to facilitate the replacement of the laser module 1. In this embodiment, the third direction is the up and down direction. After the optical path changing structure 7 moves downward to between the first chip 81 and the second chip 82, it is used to receive the light horizontally emitted to the right by the first chip 81 on the left side and the light emitted to the left by the second chip 82 on the right side, and reflect the light to the detection sensor 3, which analyzes and processes the light emitted by the chip.

[0032] The first power-on mechanism 21 and the second power-on mechanism 22 on the left and right sides can be used to power the first chip 81 and the second chip 82 in the laser module 1 respectively (for some laser modules 1, the first chip 81 and the second chip 82 are staggered in the left and right positions, for example, the first chip 81 is closer to the front side, and the second chip 82 is closer to the back side. In this way, after detecting the first chip 81 on the left side, when detecting the second chip 82 on the right side, it is only necessary to move the laser module 1 forward and backward, that is, Figure 3 and Figure 4 are two separate steps; of course, in some other laser modules 1, the first chip 81 and the second chip 82 may also be located in the same row in the front-to-back direction). The lasers generated by the first chip 81 and the second chip 82 on the left and right sides after being powered on can both be incident on the optical path changing structure 7 in the middle position, and the light propagating to the left and right from the first chip 81 and the second chip 82 on the left and right sides can both pass through the optical path changing structure 7 and be incident on the detection sensor 3, thereby completing the detection of the first chip 81 and the second chip 82 in one chipset. During the detection, there is no need to rotate the system as a whole, and the relative displacement between the components is small, thereby improving the detection stability of the device.

[0033] The system further includes a first moving mechanism 41 and a second moving mechanism 42. The first moving mechanism 41 can move in the up-down and front-back directions; the second moving mechanism 42 can move in the up-down and front-back directions. The first moving mechanism 41 and the second moving mechanism 42 can be conventional two-dimensional linear drive modules in the prior art. The detection sensor 3 is arranged on the second moving mechanism 42; and the optical path changing structure 7 is arranged on the first moving mechanism 41.

[0034] The first moving mechanism 41 can move in the third direction to the first position and the second position, and the first position is higher than the second position; the second moving mechanism 42 can move in the third direction to the third position and the fourth position, and the third position is higher than the fourth position. In addition, the first power-on mechanism 21 can be independently raised and lowered relative to the first moving mechanism 41, and the first power-on mechanism 21 is used to electrically connect to the first chip 81 when the first moving mechanism 41 is in the second position. The second power-on mechanism 22 is connected to the second moving mechanism 42, and the second power-on mechanism 22 can be independently raised and lowered relative to the second moving mechanism 42, and the second power-on mechanism 22 is used to electrically connect to the second chip 82 when the second moving mechanism 42 is in the fourth position.

[0035] In the initial state, if Figure 2 As shown, the first moving mechanism 41 is in the first position, and the second moving mechanism 42 is in the third position. When the first chip 81 needs to be tested, the first moving mechanism 41 moves downward to the second position, and the first chip 81 is powered on. Figure 3 Similarly, when the second chip 82 needs to be powered on, the second moving mechanism 42 in the third position is moved to the fourth position, as shown in FIG. Figure 4 The first moving mechanism 41 and the second moving mechanism 42 are respectively located on the left and right sides of the laser module 1 without interfering with each other.

[0036] The first moving mechanism 41 and the second moving mechanism 42 have the same movement state in the front-to-back direction, that is, they move synchronously forward and backward, so that the detection sensor 3 is always aligned with the optical path changing structure 7, and the relative positions of the two in the front-to-back direction remain unchanged. After completing the detection of the previous chipset, they move backward synchronously to detect the first chip 81 and the second chip 82 in the next chipset.

[0037] In this embodiment, the optical path changing structure 7 includes a first optical path component 51 and a second optical path component 52 which are independent of each other. The first optical path component 51 is used to change the optical path of light emitted by the first chip 81 ; the second optical path component 52 is used to change the optical path of light emitted by the second chip 82 .

[0038] The first optical path component 51 has a first light incident area, a first light exit area, and a first optical path from the first light incident area to the first light exit area, while the second optical path component 52 has a second light incident area, a second light exit area, and a second optical path from the second light incident area to the second light exit area.

[0039] The first light incident area is used to receive light emitted by the first chip 81 and propagating to the right; the second light incident area is used to receive light emitted by the second chip 82 and propagating to the left. In the third direction, the first light exit area and the second light exit area are staggered up and down, and the first light exit area is higher than the second light exit area to avoid mutual obstruction. When the first chip 81 is powered on, the first chip 81 can emit light horizontally to the right, and the light is incident from the first light incident area to the first optical path component 51, and is horizontally emitted from the first light exit area after reflection and / or refraction. The emitted light can be incident to the right into the detection sensor 3 on the second moving mechanism 42 in the third position, as shown in FIG. Figure 3 shown.

[0040] After completing the detection of the first chip 81, if the second chip 82 is staggered with the first chip 81 in the front-to-back direction, for example, the first chip 81 is closer to the front side and the second chip 82 is closer to the back side, it is necessary to retract the first power-on mechanism 21 (the height of the optical path changing structure 7 can remain unchanged, that is, the height of the first moving mechanism 41 remains unchanged) and move the laser module 1 forward and backward so that the second chip 82 is located below the second power-on mechanism 22. If the first chip 81 and the second chip 82 are aligned left and right, that is, they are in the same row in the front-to-back direction, there is no need to move the laser module 1, and the second moving mechanism 42 is directly moved downward to the fourth height. At this time, the second power-on mechanism 22 is in electrical contact with the second chip 82, and the detection sensor 3 is also lowered to a certain height. The fourth height is related to the height of the second light emitting area of ​​the second optical path component 52. The light emitted from the second light emitting area of ​​the second optical path component 52 can be received by the detection sensor 3. Figure 4 As shown. The light emitted by the second chip 82 to the left in the horizontal direction enters the second optical path component 52 from the second light entrance area, and is horizontally emitted from the second light exit area after reflection and / or refraction. The emitted light can be incident to the right on the detection sensor 3 on the second moving mechanism 42 in the fourth position. The second light exit area is lower than the first light exit area, and the detection sensor 3 is lowered at the same time as the second power-on mechanism 22 is lowered, so that the light emitted by the first chip 81 and the light emitted by the second chip 82 can both be incident on the detection area of ​​the detection sensor 3. Therefore, the detection sensor 3 with a smaller receiving surface can be used to detect the first chip 81 and the second chip 82. After completing the detection of the second chip 82, the second power-on mechanism 22 can be retracted or the second moving mechanism 42 can be raised as needed.

[0041] The first optical path component 51 may include a first light incident surface 511, a first reflection surface 512, a second reflection surface 513 and a first light emitting surface 514 which are arranged in sequence; the first light incident surface 511 is parallel to the light emitting surface of the first chip 81, the first reflection surface 512 faces the first chip 81, the second reflection surface 513 faces the detection sensor 3, and the first light emitting surface 514 is parallel to the detection surface of the detection sensor 3. The light emitted by the first chip 81 passes through the first light incident surface 511, the first reflection surface 512, the second reflection surface 513 and the first light emitting surface 514 in sequence and then enters the detection sensor 3. Specifically, the first light incident surface 511 is located between the first chip 81 and the first reflection surface 512, and is perpendicular to the reference plane; the first reflection surface 512 forms an angle of 45° with the reference plane, the second reflection surface 513 is located above the first reflection surface 512, the second reflection surface 513 forms an angle of 45° with the reference plane, and the first reflection surface 512 and the second reflection surface 513 are parallel; the first light emitting surface 514 is located between the second reflection surface 513 and the detection sensor 3, and is perpendicular to the reference plane. After the light horizontally emitted from the first chip 81 to the right side is vertically incident on the first light incident surface 511, it is incident on the first reflection surface 512, the first reflection surface 512 reflects the light, and the reflected light propagates upward and is incident on the second reflection surface 513, the second reflection surface 513 reflects the light and is emitted from the first light emitting surface 514 along the first direction and then incident on the detection sensor 3. The first optical path component 51 may be a beam translation prism, the first reflection surface 512 and the second reflection surface 513 are two opposite inner side surfaces of the beam translation prism, and the first light incident surface 511 and the first light emitting surface 514 are the other two opposite outer side walls of the beam translation prism. In other practicable solutions, the first optical path component 51 may also include two parallel reflecting plane mirrors, and the two reflecting plane mirrors respectively form a first light incident area and a first light emitting area.

[0042] The second optical path component 52 includes a first light-inlet and light-outlet surface 521, a third reflective surface 522, and a fourth reflective surface 523. The second light-inlet region and the second light-outlet region are both located on the first light-inlet and light-outlet surface 521. The third reflective surface 522 faces the second chip 82, and the fourth reflective surface 523 faces the detection sensor 3. The light emitted by the second chip 82 passes through the first light-inlet and light-outlet surface 521, the third reflective surface 522, the fourth reflective surface 523, and the first light-inlet and light-outlet surface 521 in sequence before entering the detection sensor 3. Specifically, the first light-inlet and light-outlet surface 521 is parallel to the light-emitting surface of the second chip 82 and the detection surface of the detection sensor 3, respectively, and is perpendicular to the reference plane. The third reflection surface 522 forms an angle of 45° with the reference plane. The fourth reflection surface 523 is located above the third reflection surface 522. The fourth reflection surface 523 forms an angle of 45° with the reference plane. The third reflection surface 522 faces the second chip 82, and the fourth reflection surface 523 faces the detection sensor 3. The light emitted horizontally to the left by the second chip 82 enters vertically from below the first light-inlet and light-outlet surface 521, passes through the third reflection surface 522, propagates upward and enters the fourth reflection surface 523. The fourth reflection surface 523 flips the light and propagates to the right, then vertically exits from above the first light-inlet and light-outlet surface 521 and enters the detection sensor 3. The second optical path component 52 is a 180° beam deflection prism, which changes the propagation direction of the light by 180°. In other feasible solutions, the second optical path component 52 may also include two reflecting plane mirrors arranged in parallel, and the two reflecting plane mirrors respectively form a second light incident area and a second light exit area.

[0043] After the detection of the first chip 81 and the second chip 82 in a chipset is completed, the first moving mechanism 41 and the second moving mechanism 42 can be synchronously moved forward to detect the next chipset. In the front-to-back direction, the relative position of the first moving mechanism 41 and the second moving mechanism 42 remains unchanged, avoiding the optical path changing structure 7 and the detection sensor 3 from being misaligned in the front-to-back direction, thereby making the detection more accurate.

[0044] Example 2 This embodiment is designed by making full use of the positional relationship between the first chip 81 and the second chip 82 which are staggered in the front-to-back direction, that is, the first chip 81 corresponding to the left and right is closer to the front side, while the second chip 82 is closer to the back side. The difference from the embodiment 1 is that in the embodiment 1, the element responsible for changing the optical path of the first chip 81 and the element responsible for changing the optical path of the second chip 82 are independent of each other, while in the embodiment, Figure 5-Figure 13As shown, the optical path changing structure 7 includes a first prism 64 and a second prism 65, wherein the second prism 65 is fixed relative to the first moving mechanism 41; the first prism 64 is rotatably connected to the first moving mechanism 41, and can be switched between a first angle and a second angle; when detecting the first chip, the first prism 64 is at the first angle, and the light emitted by the first chip 81 passes through the first prism 64 and then enters the detection sensor 3. When detecting the second chip 82, the first prism 64 rotates to the second angle, and in the second direction, the light emitted by the second chip 82 passes through the first prism 64 and the second prism 65 successively and then enters the detection sensor 3.

[0045] Specifically, the optical path changing structure 7 includes a rotating frame 61 and a fixed frame 62, and the fixed frame 62 is fixedly connected to the first moving mechanism 41. The rotating frame 61 is rotatably connected to the first moving mechanism 41, and the rotating frame 61 can be driven to rotate. The rotating shaft 63 of the rotating frame 61 extends along the third direction and is located between the first chip 81 and the second chip 82.

[0046] A second prism 65 is disposed on the fixing frame 62 , and the second prism 65 is located at the rear side of the rotating shaft 63 .

[0047] The rotating frame 61 is provided with a first prism 64, and the first prism 64 is not provided at the position of the rotating shaft 63. Therefore, when the rotating frame 61 rotates to the first angle, Figure 6-Figure 9 As shown, the first prism 64 is located at the front side of the rotating shaft 63 and is aligned with the first chip 81. At this time, the first prism 64 independently completes the change of the optical path, and the light emitted by the first chip 81 propagates to the right and enters the first prism 64. Under the action of the first prism 64, the light emitted by the first chip 81 is translated upward and then enters the detection sensor 3, as shown in FIG. Fig. 9 At this time, the second prism 65 does not interfere with the first prism 64 .

[0048] like Figure 10-13 As shown in FIG. 1 , when the rotating frame 61 rotates 180° to a second angle, the first prism 64 and the second prism 65 are located at the rear side of the rotating shaft 63, as shown in FIG. Fig.11 As shown, the first prism 64 and the second prism 65 are combined to form a shaping group for changing the light emitted by the second chip 82. The light emitted by the second chip 82 first passes through the first prism 64, and then the light is translated in the third direction and rises, and then enters the second prism 65 in the same propagation direction. The second prism 65 flips the light 180° and then emits it horizontally to the detection sensor 3 on the right side, as shown in FIG. Fig.13 shown.

[0049] Since the first prism 64 and the second prism 65 form an optical path together when they are on the same side, the second prism 65 is close to the first prism 64 , and the rotating frame 61 has a notch to avoid the fixed frame 62 to prevent the fixed frame 62 from interfering with the rotation of the rotating frame 61 .

[0050] In this embodiment, the first prism 64 is a beam translation prism, and the first prism 64 may include a second light incident surface 611, a fifth reflection surface 612, a sixth reflection surface 613, and a second light emitting surface 614, which are arranged in sequence. At a first angle, the second light incident surface 611 is parallel to the light emitting surface of the first chip 81, the fifth reflection surface 612 faces the first chip 81, the sixth reflection surface 613 faces the detection sensor 3, and the second light emitting surface 614 is parallel to the detection surface of the detection sensor 3. The light emitted by the first chip 81 passes through the second light incident surface 611, the fifth reflection surface 612, the sixth reflection surface 613, and the second light emitting surface 614 in sequence and then enters the detection sensor 3.

[0051] Specifically, the second light incident surface 611 is located between the first chip 81 and the fifth reflection surface 612, and is perpendicular to the reference plane; the fifth reflection surface 612 forms an angle of 45° with the reference plane, the sixth reflection surface 613 is located above the fifth reflection surface 612, the sixth reflection surface 613 forms an angle of 45° with the reference plane, and the fifth reflection surface 612 and the sixth reflection surface 613 are parallel; the second light emitting surface 614 is located between the sixth reflection surface 613 and the detection sensor 3, and is perpendicular to the reference plane. After the light horizontally emitted from the first chip 81 to the right side is vertically incident on the second light incident surface 611, it is incident on the fifth reflection surface 612, the fifth reflection surface 612 reflects the light, and the reflected light propagates upward and is incident on the sixth reflection surface 613, the sixth reflection surface 613 reflects the light and is emitted from the second light emitting surface 614 along the first direction and then incident on the detection sensor 3. The fifth reflecting surface 612 and the sixth reflecting surface 613 are two opposite inner side surfaces of the beam shifting prism, and the second light incident surface 611 and the second light exit surface 614 are the other two opposite outer side walls of the beam shifting prism. Of course, in other feasible solutions, two plane reflectors can be used to form the first prism 64.

[0052] In this embodiment, the second prism 65 is a 180° beam deflection prism, and the second prism 65 includes a second light-input and light-output surface 621, a seventh reflection surface 622, and an eighth reflection surface 623. At the second angle, the second light-input surface 611 is parallel to the light-emitting surface of the second chip 82, the fifth reflection surface 612 faces the second chip 82, and the sixth reflection surface 613 faces the second light-input and light-output surface 621. The light emitted by the second chip 82 passes through the second light-input surface 611, the fifth reflection surface 612, the sixth reflection surface 613, and the second light-output surface 614 in sequence, and then enters the second prism 65 from the second light-input and light-output surface 621.

[0053] The seventh reflection surface 622 faces the second light-emitting surface 614, and the eighth reflection surface 623 faces the detection sensor 3. The light emitted horizontally from the first prism 64 passes through the second light-in and light-out surface 621, the seventh reflection surface 622, the eighth reflection surface 623, and the second light-in and light-out surface 621, and then enters the detection sensor 3. Specifically, the second light-in and light-out surface 621 is parallel to the detection surface of the detection sensor 3 and perpendicular to the reference plane. The seventh reflection surface 622 forms an angle of 45° with the reference plane. The eighth reflection surface 623 is located above the seventh reflection surface 622. The eighth reflection surface 623 forms an angle of 45° with the reference plane, and the seventh reflection surface 622 is not parallel to the eighth reflection surface 623. Of course, in other feasible solutions, two plane reflectors can be used to form the second prism 65.

[0054] Since the offset distance between the first chip 81 and the second chip 82 in the front-to-back direction is constant in the entire laser module 1, the first prism 64 is located at half the offset distance from the rotating shaft 63, so that after the first chip 81 is detected, the first prism 64 can be rotated to face the second chip 82. The design makes full use of the offset position relationship between the first chip 81 and the second chip 82 in the front-to-back direction, that is, the first chip 81 corresponding to the left and right is closer to the front side, and the second chip 82 is closer to the back side, so as to avoid repeated adjustment of the front-to-back position of the detection sensor 3 and the optical path changing structure 7 during detection, thereby reducing the generation of errors.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser module detection system, wherein: The laser module (1) is provided with at least two chip groups arranged along the second direction, each of the chip groups comprising a first chip (81) and a second chip (82) arranged along the first direction, characterized in that the system comprises: a first power-on mechanism (21), a second power-on mechanism (22), an optical path changing structure (7) and a detection sensor (3); The first power-on mechanism (21) and the second power-on mechanism (22) are arranged along a first direction, and the first power-on mechanism (21) and the second power-on mechanism (22) respectively power the first chip (81) and the second chip (82); The optical path changing structure (7) is located between the first chip (81) and the second chip (82) of the chipset, and the optical path changing structure (7) is used to respectively receive light generated by the first chip (81) and the second chip (82), and emit the light into the detection sensor (3).

2. The laser module detection system according to claim 1, characterized in that: The system further comprises a first moving mechanism (41) and a second moving mechanism (42) respectively located on both sides of the laser module (1) in the first direction. The first moving mechanism (41) drives the first power-on mechanism (21) to move along the third direction and the second direction, so that the first chip (81) in the chipset is electrically connected; The second moving mechanism (42) drives the second power-on mechanism (22) to move along the third direction and the second direction, so that the second chip (82) in the chipset is electrically connected; The optical path changing structure (7) is arranged on the first moving mechanism (41), and the detection sensor (3) is arranged on the second moving mechanism (42); The first direction and the second direction are both located on a reference plane, and the third direction is perpendicular to the reference plane.

3. The laser module detection system according to claim 2, characterized in that: The first moving mechanism (41) is capable of moving in a third direction to a first position and a second position, the first position being further away from the laser module (1) than the second position; The second moving mechanism (42) is capable of moving in a third direction to a third position and a fourth position, the third position being further away from the laser module (1) than the fourth position; The first power supply mechanism (21) is used to be electrically connected to the first chip (81) when the first moving mechanism (41) is located at the second position; and the second power supply mechanism (22) is used to be electrically connected to the second chip (82) when the second moving mechanism (42) is located at the fourth position.

4. The laser module detection system according to claim 3, characterized in that: The light path changing structure (7) comprises a first light entrance area, a second light entrance area, a first light exit area and a second light exit area; The first light entrance area is used to receive light to be emitted by the first chip (81), and the light incident from the first light entrance area is emitted from the first light exit area; the second light entrance area is used to receive light to be emitted by the second chip (82), and the light incident from the second light entrance area is emitted from the second light exit area; In the third direction, the first light exiting area is farther away from the laser module (1) than the second light exiting area, so that light emitted from the first light exiting area can be incident along the first direction into the detection sensor (3) at the third position, and light emitted from the second light exiting area can be incident along the first direction into the detection sensor (3) at the fourth position.

5. The laser module detection system according to claim 4, characterized in that: The optical path changing structure (7) comprises a first optical path component (51) and a second optical path component (52) which are independent of each other; the first optical path component (51) forms the first light entrance area and the first light exit area; and the second optical path component (52) forms the second light entrance area and the second light exit area.

6. The laser module detection system according to claim 5, characterized in that: The first optical path component (51) comprises a first light incident surface (511), a first reflection surface (512), a second reflection surface (513) and a first light emitting surface (514) which are arranged in sequence; the first light incident area is located on the first light incident surface (511); the first light emitting area is located on the first light emitting surface (514); the first reflection surface (512) faces the light emitting surface of the first chip (81), and the second reflection surface (513) faces the detection surface of the detection sensor (3); and light emitted by the first chip (81) passes through the first light incident surface (511), the first reflection surface (512), the second reflection surface (513) and the first light emitting surface (514) in sequence before being incident on the detection sensor (3).

7. The laser module detection system according to claim 6, characterized in that: The first light incident surface (511) is parallel to the light emitting surface of the first chip (81); the first reflection surface (512) forms an angle of 45° with the reference plane, the first reflection surface (512) and the second reflection surface (513) are parallel; and the first light emitting surface (514) is parallel to the detection surface of the detection sensor (3).

8. The laser module detection system according to claim 5, characterized in that: The second optical path component (52) comprises a first light inlet and outlet surface (521), a third reflection surface (522) and a fourth reflection surface (523); the second light inlet area and the second light outlet area are both located on the first light inlet and outlet surface (521); the third reflection surface (522) faces the light emitting surface of the second chip (82), and the fourth reflection surface (523) faces the detection surface of the detection sensor (3); light emitted by the second chip (82) passes through the first light inlet and outlet surface (521), the third reflection surface (522), the fourth reflection surface (523) and the first light inlet and outlet surface (521) in sequence before being incident on the detection sensor (3).

9. The laser module detection system according to claim 8, characterized in that: The first light inlet and outlet surfaces (521) are respectively parallel to the light emitting surface of the second chip (82) and the detection surface of the detection sensor (3); the third reflection surface (522) forms an angle of 45° with the reference plane, the fourth reflection surface (523) forms an angle of 45° with the reference plane, and the third reflection surface (522) and the fourth reflection surface (523) form an angle of 90°.

10. The laser module detection system according to claim 3, characterized in that: The optical path changing structure (7) comprises a first prism (64) and a second prism (65), wherein the second prism (65) is fixed relative to the first moving mechanism (41); the first prism (64) is rotatably connected to the first moving mechanism (41) and is capable of switching between a first angle and a second angle; At the first angle, light emitted by the first chip (81) passes through the first prism (64) and then enters the detection sensor (3); At the second angle, in the second direction, the light emitted by the second chip (82) passes through the first prism (64) and the second prism (65) successively before being incident on the detection sensor (3).

11. The laser module detection system according to claim 10, characterized in that: The optical path changing structure (7) comprises a rotating frame (61) and a fixed frame (62), wherein the fixed frame (62) is fixedly connected to the first moving mechanism (41); the rotating frame (61) is rotatably connected to the first moving mechanism (41), and a rotating shaft (63) of the rotating frame (61) extends along a third direction and is located between the first chip (81) and the second chip (82) of the chipset; The fixing frame (62) is provided with the second prism (65); in the second direction, the second prism (65) is located on one side of the rotating shaft (63); The first prism (64) is arranged on the rotating frame (61); when the rotating frame (61) drives the first prism (64) to rotate to a first angle, the first prism (64) is located on the other side of the rotating shaft (63) in the second direction; When the rotating frame (61) drives the first prism (64) to rotate to a second angle, the first angle and the second angle differ by 180°, and in the second direction, the first prism (64) and the second prism (65) are both located on one side of the rotating shaft (63).

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