Laser module detection system

Abstract

The present invention provides a laser module detection system, which relates to the technical field of semiconductor lasers. The laser module detection system provided by the present invention has at least two chip groups arranged along a second direction on the laser module, and each chip group includes a first chip and a second chip arranged along a first direction. The system includes: a first power supply mechanism, a second power supply mechanism, an optical path changing structure, and a detection sensor; the first power supply mechanism and the second power supply mechanism are arranged along the first direction, and the first power supply mechanism and the second power supply mechanism respectively supply power to the first chip and the second chip; the optical path changing structure is located between the first chip and the second chip of the chip group, and the optical path changing structure is used to respectively receive the light generated by the first chip and the second chip and inject the light into the detection sensor.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lasers, and more particularly to a laser module detection system. Background Art

[0002] A laser module is formed by converging multiple chips into a main optical path and then transmitting the light through a multimode optical fiber. Therefore, only when the device has low power or fails can a single-chip abnormality be detected through the abnormality of the final result, and then the abnormal chip is disassembled and analyzed.

[0003] When detecting a single chip in a laser module, it is necessary to power on the chip, then collect the light emitted by the chip and analyze it. In the existing laser modules, there are two rows of chips on the left and right. After detecting one row of chips, it is necessary to rotate the detection device by 180°, and then detect the other row of chips. During the flipping process, problems such as misalignment of the optical path or the power supply mechanism are likely to occur, resulting in inaccurate detection results and increased detection time. Summary of the Invention

[0004] The purpose of the present invention is to provide a laser module detection system to alleviate the technical problem of misalignment of the optical path or the power supply mechanism caused by the overall rotation of the detection device during the single-chip detection process of the existing laser module.

[0005] A laser module detection system provided by the present invention, wherein at least two chip groups arranged along a second direction are provided on the laser module, and each chip group includes a first chip and a second chip arranged along a first direction. The system includes: a first power supply mechanism, a second power supply mechanism, an optical path changing structure, and a detection sensor;

[0006] The first power supply mechanism and the second power supply mechanism are arranged along the first direction, and the first power supply mechanism and the second power supply mechanism respectively power on the first chip and the second chip;

[0007] The optical path changing structure is located between the first chip and the second chip of the chip group, and the optical path changing structure is used to receive the light generated by the first chip and the second chip respectively and inject the light into the detection sensor.

[0008] Furthermore, the system further includes a first moving mechanism and a second moving mechanism respectively located on both sides of the first direction of the laser module,

[0009] The first moving mechanism drives the first power supply mechanism to move along a third direction and a second direction to electrically connect the first chip in the chip group;

[0010] The second moving mechanism drives the second power supply mechanism to move along a third direction and a second direction to electrically connect the second chip in the chip group;

[0011] The optical path changing structure is arranged on the first moving mechanism, and the detection sensor is arranged on the second moving mechanism;

[0012] Both the first direction and the second direction are located on a reference plane, and the third direction is perpendicular to the reference plane.

[0013] Further, the first moving mechanism can move in the third direction to a first position and a second position, and the first position is farther from the laser module than the second position;

[0014] The second moving mechanism can move in the third direction to a third position and a fourth position, and the third position is farther from the laser module than the fourth position;

[0015] The first power supply mechanism is used to electrically connect with the first chip when the first moving mechanism is at the second position; the second power supply mechanism is used to electrically connect with the second chip when the second moving mechanism is at the fourth position.

[0016] Further, the optical path changing structure includes a first light incident area, a second light incident area, a first light emitting area and a second light emitting area;

[0017] The first light incident area is used to receive the light emitted by the first chip, and the light incident from the first light incident area is emitted from the first light emitting area; the second light incident area is used to receive the light emitted by the second chip, and the light incident from the second light incident area is emitted from the second light emitting area;

[0018] In the third direction, the first light emitting area is farther from the laser module than the second light emitting area, so that the light emitted from the first light emitting area can be incident into the detection sensor at the third position along the first direction, and the light emitted from the second light emitting area can be incident into the detection sensor at the fourth position along the first direction.

[0019] Further, the optical path changing structure includes independent first and second optical path components. The first optical path component forms the first light incident area and the first light emitting area; the second optical path component forms the second light incident area and the second light emitting area.

[0020] Further, the first optical path component includes a first light incident surface, a first reflecting surface, a second reflecting surface, and a first light exiting surface arranged in sequence; the first light incident area is located on the first light incident surface; the first light exiting area is located on the first light exiting surface; the first reflecting surface faces the light emitting surface of the first chip, and the second reflecting surface faces the detection surface of the detection sensor; the light emitted by the first chip passes through the first light incident surface, the first reflecting surface, the second reflecting surface, and the first light exiting surface in sequence and then enters the detection sensor.

[0021] Further, the first light incident surface is parallel to the light emitting surface of the first chip; the first reflecting surface forms a 45° angle with the reference plane, the first reflecting surface and the second reflecting surface are parallel; the first light exiting surface is parallel to the detection surface of the detection sensor.

[0022] Further, the second optical path component includes a first light incident and exiting surface, a third reflecting surface, and a fourth reflecting surface; the second light incident area and the second light exiting area are both located on the first light incident and exiting surface; the third reflecting surface faces the light emitting surface of the second chip, and the fourth reflecting surface faces the detection surface of the detection sensor. The light emitted by the second chip passes through the first light incident and exiting surface, the third reflecting surface, the fourth reflecting surface, and the first light incident and exiting surface in sequence and then enters the detection sensor.

[0023] Further, the first light incident and exiting surface is parallel to the light emitting surface of the second chip and the detection surface of the detection sensor respectively; the third reflecting surface forms a 45° angle with the reference plane, the fourth reflecting surface forms a 45° angle with the reference plane, and the third reflecting surface and the fourth reflecting surface form a 90° angle.

[0024] Further, the optical path changing structure includes a first prism and a second prism, and the second prism is fixed relative to the first moving mechanism; the first prism is rotatably connected to the first moving mechanism and can be switched between a first angle and a second angle;

[0025] At the first angle, the light emitted by the first chip passes through the first prism and then enters the detection sensor;

[0026] At the second angle, in the second direction, the light emitted by the second chip passes through the first prism and the second prism in sequence and then enters the detection sensor.

[0027] Further, the optical path changing structure includes a rotating frame and a fixed frame, and the fixed frame is fixedly connected to the first moving mechanism; the rotating frame is rotatably connected to the first moving mechanism, the rotating shaft of the rotating frame extends along the third direction and is located between the first chip and the second chip of the chip group;

[0028] The second prism is provided on the fixing frame; in the second direction, the second prism is located on one side of the rotating shaft;

[0029] The first prism is provided on the rotating frame. When the rotating frame drives the first prism to rotate to a first angle, in the second direction, the first prism is located on the other side of the rotating shaft;

[0030] When the rotating frame drives the first prism to rotate to a second angle, the first angle and the second angle differ by 180°. In the second direction, both the first prism and the second prism are located on one side of the rotating shaft.

[0031] The present invention has at least the following advantages or beneficial effects:

[0032] In the laser module detection system provided by the present invention, at least two chip groups arranged along the second direction are provided on the laser module, and each chip group includes a first chip and a second chip arranged along the first direction. The system includes: a first power supply mechanism, a second power supply mechanism, an optical path changing structure, and a detection sensor; the first power supply mechanism and the second power supply mechanism are arranged along the first direction, and the first power supply mechanism and the second power supply mechanism respectively supply power to the first chip and the second chip; the optical path changing structure is located between the first chip and the second chip of the chip group, and the optical path changing structure is used to respectively receive the light generated by the first chip and the second chip and inject the light into the detection sensor.

[0033] The first power supply mechanism and the second power supply mechanism arranged on the opposite sides can respectively supply power to the first chip and the second chip in the chip group to be detected in the laser module. The laser generated after the first chip and the second chip in the chip group to be detected are powered on can both be incident on the optical path changing structure in the middle position. The light emitted by the first chip and the second chip towards each other's directions can both pass through the optical path changing structure and then be incident into the detection sensor, thereby completing the detection of the first chip and the second chip in one chip group. When detecting, there is no need to rotate the system as a whole, and the relative displacement between components is small, improving the detection stability of the device. Description of the Drawings

[0034] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0035] Figure 1 It is a top view of the laser module detection system provided in Embodiment 1 of the present invention;

[0036] Figure 2 The front view of the laser module detection system provided in Embodiment 1 of the present invention;

[0037] Figure 3 The optical path diagram of the first chip detection of the laser module detection system provided in Embodiment 1 of the present invention;

[0038] Figure 4 The optical path diagram of the right-side chip detection of the laser module detection system provided in Embodiment 1 of the present invention;

[0039] Figure 5 The schematic diagram of the rear view direction of the laser module detection system provided in Embodiment 2 of the present invention;

[0040] Figure 6 The schematic diagram of the rear view direction of the first chip detection of the laser module detection system provided in Embodiment 2 of the present invention;

[0041] Figure 7 For Figure 6 The schematic diagram of the rear view direction of the optical path changing structure in

[0042] Figure 8 For Figure 6 The schematic diagram of the right view direction of the optical path changing structure in

[0043] Figure 9 For Figure 6 The optical path diagram of the first chip in

[0044] Figure 10 The schematic diagram of the rear view direction of the second chip detection of the laser module detection system provided in Embodiment 2 of the present invention;

[0045] Figure 11 For Figure 10 The schematic diagram of the rear view direction of the optical path changing structure in

[0046] Figure 12 For Figure 10 The schematic diagram of the right view direction of the optical path changing structure in

[0047] Figure 13 For Figure 10 The optical path diagram of the second chip in

[0048] Icons: 1 - Laser module; 21 - First power-on mechanism; 22 - Second power-on mechanism; 3 - Detection sensor; 41 - First moving mechanism; 42 - Second moving mechanism; 51 - First optical path component; 511 - First light incident surface; 512 - First reflecting surface; 513 - Second reflecting surface; 514 - First light output surface; 52 - Second optical path component; 521 - First light input / output surface; 522 - Third reflecting surface; 523 - Fourth reflecting surface; 61 - Rotating frame; 62 - Fixed frame; 63 - Rotating shaft; 64 - First prism; 65 - Second prism; 7 - Optical path changing structure; 81 - First chip; 82 - Second chip; 611 - Second light incident surface; 612 - Fifth reflecting surface; 613 - Sixth reflecting surface; 614 - Second light output surface; 621 - Second light input / output surface; 622 - Seventh reflecting surface; 623 - Eighth reflecting surface. Detailed implementation manners

[0049] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. The components of the embodiments of the present invention described and illustrated herein usually can be arranged and designed in various different configurations.

[0050] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0051] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0052] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship in which the inventive product is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0053] In addition, terms such as "horizontal" and "vertical" do not require the components to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0054] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0055] Embodiment 1

[0056] As Figures 1-4 shown, the laser module detection system provided by the present invention can, but is not limited to, detecting the optical field morphology of the chips in the laser module 1.

[0057] The laser module 1 can be horizontally fixed on the fixture. At least two chip groups arranged along the second direction are provided on the laser module 1, and each chip group includes a first chip 81 and a second chip 82 arranged along the first direction. Specifically, for the convenience of description, in this embodiment, the first direction is set as the left-right direction, the direction where the first chip 81 is located is the left side direction, and the direction where the second chip 82 is located is the right side direction. The second direction is the front-back direction, that is, the chip groups are arranged along the front-back direction. During detection, the chip groups can be detected one by one from front to back, as Figure 1 shown.

[0058] As Figure 2 shown, the system includes: a first power supply mechanism 21, a second power supply mechanism 22, an optical path changing structure 7, and a detection sensor 3.

[0059] The first power supply mechanism 21 and the second power supply mechanism 22 are arranged along the first direction. After the first power supply mechanism 21 moves downward in place, it contacts the contact of the first chip 81 to power it, as Figure 3 shown. Similarly, after the second power supply mechanism 22 moves downward in place, it contacts the contact of the second chip 82 to power it, as Figure 4 shown.

[0060] The optical path changing structure 7 is located between the first chip 81 and the second chip 82. The optical path changing structure 7 can also move in the third direction, so as to facilitate the replacement of the laser module 1. In this embodiment, the third direction is the up and down direction. After the optical path changing structure 7 moves downward between the first chip 81 and the second chip 82, it is used to receive the light emitted horizontally to the right by the first chip 81 on the left side and the light emitted to the left by the second chip 82 on the right side, and reflect the light to the detection sensor 3. The detection sensor 3 analyzes and processes the light emitted by the chips.

[0061] The first power supply mechanism 21 and the second power supply mechanism 22 on the left and right sides can be used to supply power to the first chip 81 and the second chip 82 in the laser module 1 respectively (for some laser modules 1, the first chip 81 and the second chip 82 are staggered in the left and right positions. For example, the first chip 81 is more forward, and the second chip 82 is more backward. In this way, after detecting the first chip 81 on the left side, when detecting the second chip 82 in the right position, only the laser module 1 needs to be moved back and forth, that is Figure 3 and Figure 4 are two separate steps; of course, in some other laser modules 1, the first chip 81 and the second chip 82 can also be in the same row in the front and back direction). The laser generated after the first chip 81 and the second chip 82 on the left and right sides are powered on can be incident into the optical path changing structure 7 in the middle position. The light propagating to the left and right emitted by the first chip 81 and the second chip 82 on the left and right sides can pass through the optical path changing structure 7 and then be incident into the detection sensor 3, so as to complete the detection of the first chip 81 and the second chip 82 in a chip group. When detecting, there is no need to rotate the system as a whole, and the relative displacement between components is less, improving the detection stability of the equipment.

[0062] The system further includes a first moving mechanism 41 and a second moving mechanism 42. The first moving mechanism 41 can move in the up and down and front and back directions; the second moving mechanism 42 can move in the up and down and front and back directions. The first moving mechanism 41 and the second moving mechanism 42 can be conventional two-dimensional linear drive modules in the prior art. The detection sensor 3 is arranged on the second moving mechanism 42; the optical path changing structure 7 is arranged on the first moving mechanism 41.

[0063] The first moving mechanism 41 can move in the third direction to a first position and a second position, and the first position is higher than the second position; the second moving mechanism 42 can move in the third direction to a third position and a fourth position, and the third position is higher than the fourth position. Moreover, the first power supply mechanism 21 can be lifted and lowered independently relative to the first moving mechanism 41, and the first power supply mechanism 21 is used to be electrically connected to the first chip 81 when the first moving mechanism 41 is at the second position. The second power supply mechanism 22 is connected to the second moving mechanism 42, and the second power supply mechanism 22 can be lifted and lowered independently relative to the second moving mechanism 42, and the second power supply mechanism 22 is used to be electrically connected to the second chip 82 when the second moving mechanism 42 is at the fourth position.

[0064] In the initial state, as Figure 2 shown, the first moving mechanism 41 is at the first position, and the second moving mechanism 42 is at the third position. When it is necessary to detect the first chip 81, the first moving mechanism 41 moves downward to the second position to power on the first chip 81, as Figure 3 shown. Similarly, when the second chip 82 needs to be powered on, the second moving mechanism 42 at the third position is moved to the fourth position, as Figure 4 shown. The first moving mechanism 41 and the second moving mechanism 42 are respectively located on the left and right sides of the laser module 1, and there is no interference between them.

[0065] The first moving mechanism 41 and the second moving mechanism 42 have the same motion state in the front-rear direction, that is, they move synchronously in the front-rear direction, so that the detection sensor 3 is always aligned with the optical path changing structure 7, and their relative positions in the front-rear direction remain unchanged. After the detection of the previous chip group is completed, they move backward synchronously, and then detect the first chip 81 and the second chip 82 in the next chip group.

[0066] In this embodiment, the optical path changing structure 7 includes an independent first optical path component 51 and a second optical path component 52. The first optical path component 51 is used to change the optical path of the light emitted by the first chip 81; the second optical path component 52 is used to change the optical path of the light emitted by the second chip 82.

[0067] Among them, the first optical path component 51 has a first light incident area, a first light exit area, and a first optical path from the first light incident area to the first light exit area. And the second optical path component 52 has a second light incident area, a second light exit area, and a second optical path from the second light incident area to the second light exit area.

[0068] The first light incident area is used to receive the light emitted by the first chip 81 and propagating to the right; the second light incident area is used to receive the light emitted by the second chip 82 and propagating to the left. In the third direction, the first light exit area and the second light exit area are vertically offset, and the first light exit area is higher than the second light exit area to avoid mutual occlusion. When the first chip 81 is powered on, the first chip 81 can emit light horizontally to the right, and the light enters the first optical path component 51 from the first light incident area, and is horizontally emitted from the first light exit area after reflection and / or refraction. The emitted light can be incident on the detection sensor 3 on the second moving mechanism 42 at the third position to the right, as Figure 3 shown.

[0069] After the detection of the first chip 81 is completed, if the second chip 82 is offset from the first chip 81 in the front-back direction, for example, the first chip 81 is more forward and the second chip 82 is more backward, then the first power supply mechanism 21 needs to be retracted (the height of the optical path changing structure 7 can remain unchanged, that is, the height of the first moving mechanism 41 remains unchanged) and the laser module 1 is moved back and forth so that the second chip 82 is located below the second power supply mechanism 22. If the first chip 81 and the second chip 82 are aligned left and right, that is, in the front-back direction, the two are in the same row, then the laser module 1 does not need to be moved, and the second moving mechanism 42 is directly moved downward to the fourth height. At this time, the second power supply mechanism 22 is in electrical contact with the second chip 82, and at the same time the detection sensor 3 also drops a certain height. The fourth height is related to the height of the second light exit area of the second optical path component 52. The light emitted from the second light exit area of the second optical path component 52 can be received by the detection sensor 3, as Figure 4 shown. The light emitted by the second chip 82 horizontally to the left enters the second optical path component 52 from the second light incident area, and is horizontally emitted from the second light exit area after reflection and / or refraction. The emitted light can be incident on the detection sensor 3 on the second moving mechanism 42 at the fourth position to the right. The second light exit area is lower than the first light exit area, and the detection sensor 3 is lowered in cooperation with the second power supply mechanism 22, so that the light emitted by the first chip 81 and the light emitted by the second chip 82 can both be incident on the detection area of the detection sensor 3. Therefore, the detection sensor 3 with a smaller receiving surface can be used to detect the first chip 81 and the second chip 82. After the detection of the second chip 82 is completed, the second power supply mechanism 22 can be retracted as needed, or the second moving mechanism 42 can be raised.

[0070] The first optical path component 51 may include a first light incident surface 511, a first reflection surface 512, a second reflection surface 513, and a first light exit surface 514 arranged in sequence; the first light incident surface 511 is parallel to the light emitting surface of the first chip 81, the first reflection surface 512 faces the first chip 81, the second reflection surface 513 faces the detection sensor 3, the first light exit surface 514 is parallel to the detection surface of the detection sensor 3, and the light emitted by the first chip 81 is incident on the detection sensor 3 after passing through the first light incident surface 511, the first reflection surface 512, the second reflection surface 513, and the first light exit surface 514 in sequence. Specifically, the first light incident surface 511 is located between the first chip 81 and the first reflection surface 512 and is perpendicular to the reference plane; the first reflection surface 512 forms a 45° angle with the reference plane, the second reflection surface 513 is located above the first reflection surface 512, the second reflection surface 513 forms a 45° angle with the reference plane, and the first reflection surface 512 and the second reflection surface 513 are parallel; the first light exit surface 514 is located between the second reflection surface 513 and the detection sensor 3 and is perpendicular to the reference plane. The light horizontally emitted to the right by the first chip 81 is vertically incident on the first light incident surface 511 and then enters the first reflection surface 512. The first reflection surface 512 reflects the light, and the reflected light propagates upward and is incident on the second reflection surface 513. The second reflection surface 513 reflects the light and emits it from the first light exit surface 514 along the first direction and then is incident on the detection sensor 3. The first optical path component 51 may be a beam translation prism, the first reflection surface 512 and the second reflection surface 513 are two opposite inner side surfaces of the beam translation prism, and the first light incident surface 511 and the first light exit surface 514 are the other two opposite outer side walls of the beam translation prism. In other implementable solutions, the first optical path component 51 may also include two parallel reflecting plane mirrors, and the two reflecting plane mirrors respectively form a first light incident area and a first light exit area.

[0071] The second optical path component 52 includes a first light incident and exiting surface 521, a third reflecting surface 522, and a fourth reflecting surface 523. Both the second light incident area and the second light exiting area are located on the first light incident and exiting surface 521. The third reflecting surface 522 faces the second chip 82, and the fourth reflecting surface 523 faces the detection sensor 3. The light emitted by the second chip 82 enters the detection sensor 3 after passing through the first light incident and exiting surface 521, the third reflecting surface 522, the fourth reflecting surface 523, and the first light incident and exiting surface 521 in sequence. Specifically, the first light incident and exiting surface 521 is parallel to the light emitting surface of the second chip 82 and the detection surface of the detection sensor 3 respectively, and perpendicular to the reference plane. The third reflecting surface 522 forms a 45° angle with the reference plane. The fourth reflecting surface 523 is located above the third reflecting surface 522 and forms a 45° angle with the reference plane. The third reflecting surface 522 faces the second chip 82, and the fourth reflecting surface 523 faces the detection sensor 3. The light emitted horizontally to the left by the second chip 82 enters vertically from below the first light incident and exiting surface 521, then propagates upward after passing through the third reflecting surface 522 and is incident on the fourth reflecting surface 523. The fourth reflecting surface 523 flips the light beam and propagates it to the right, and then exits vertically from above the first light incident and exiting surface 521 and is incident on the detection sensor 3. The second optical path component 52 is a 180° beam deflection prism, which changes the propagation direction of the light by 180°. In other feasible solutions, the second optical path component 52 may also include two parallel reflecting plane mirrors, and the two reflecting plane mirrors respectively form the second light incident area and the second light exiting area.

[0072] After the detection of the first chip 81 and the second chip 82 in a chip group is completed, the first moving mechanism 41 and the second moving mechanism 42 can be synchronously moved forward, so as to detect the next chip group. In the front-back direction, the relative positions of the first moving mechanism 41 and the second moving mechanism 42 remain unchanged, avoiding the misalignment of the optical path changing structure 7 and the detection sensor 3 in the front-back direction, thereby making the detection more accurate.

[0073] Embodiment 2

[0074] This embodiment is designed by making full use of the positional relationship that the first chip 81 and the second chip 82 are staggered in the front-back direction, that is, the left-right corresponding first chip 81 is closer to the front side, while the second chip 82 is closer to the rear side. The difference from Embodiment 1 is that in Embodiment 1, the components responsible for changing the optical path of the first chip 81 and the second chip 82 are independent of each other, while in this embodiment, as Figures 5-13As shown, the optical path changing structure 7 includes a first prism 64 and a second prism 65. The second prism 65 is fixed relative to the first moving mechanism 41. The first prism 64 is rotatably connected to the first moving mechanism 41 and can be switched between a first angle and a second angle. When detecting the first chip, the first prism 64 is at the first angle, and the light emitted by the first chip 81 enters the detection sensor 3 after passing through the first prism 64. When detecting the second chip 82, the first prism 64 rotates to the second angle. In the second direction, the light emitted by the second chip 82 enters the detection sensor 3 after passing through the first prism 64 and the second prism 65 successively.

[0075] Specifically, the optical path changing structure 7 includes a rotating frame 61 and a fixed frame 62. The fixed frame 62 is fixedly connected to the first moving mechanism 41. The rotating frame 61 is rotatably connected to the first moving mechanism 41. The rotating frame 61 can be driven to rotate. The rotating shaft 63 of the rotating frame 61 extends in the third direction and is located between the first chip 81 and the second chip 82.

[0076] The second prism 65 is provided on the fixed frame 62, and the second prism 65 is located behind the rotating shaft 63.

[0077] The first prism 64 is provided on the rotating frame 61 and is not provided at the position of the rotating shaft 63. Therefore, when the rotating frame 61 rotates to the first angle, as Figures 6-9 shown, the first prism 64 is located in front of the rotating shaft 63 and is aligned with the first chip 81. At this time, the first prism 64 independently completes the change of the optical path. The light emitted by the first chip 81 propagates to the right and enters the first prism 64. Under the action of the first prism 64, the light emitted by the first chip 81 is translated upward and then incident on the detection sensor 3, as Figure 9 shown. At this time, the second prism 65 does not interfere with the first prism 64.

[0078] As Figures 10-13 shown, when the rotating frame 61 rotates 180° to the second angle, the first prism 64 and the second prism 65 are located behind the rotating shaft 63. As Figure 11 shown, the first prism 64 and the second prism 65 form a shaping group for changing the light emitted by the second chip 82. The light emitted by the second chip 82 first passes through the first prism 64, and then the light is translated in the third direction and rises. Then, the light enters the second prism 65 in the same propagation direction. The second prism 65 flips the light by 180° and then horizontally shoots it to the detection sensor 3 on the right, as Figure 13 shown.

[0079] Since the first prism 64 and the second prism 65 form an optical path together when they are on the same side, the second prism 65 is close to the first prism 64. The rotating frame 61 has a notch for avoiding the fixed frame 62 to prevent the fixed frame 62 from interfering with the rotation of the rotating frame 61.

[0080] In this embodiment, the first prism 64 is a beam translation prism. The first prism 64 may include a second incident light surface 611, a fifth reflection surface 612, a sixth reflection surface 613, and a second exit light surface 614 arranged in sequence. At the first angle, the second incident light surface 611 is parallel to the light emitting surface of the first chip 81, the fifth reflection surface 612 faces the first chip 81, the sixth reflection surface 613 faces the detection sensor 3, the second exit light surface 614 is parallel to the detection surface of the detection sensor 3, and the light emitted by the first chip 81 passes through the second incident light surface 611, the fifth reflection surface 612, the sixth reflection surface 613, and the second exit light surface 614 in sequence and then enters the detection sensor 3.

[0081] Specifically, the second incident light surface 611 is located between the first chip 81 and the fifth reflection surface 612 and is perpendicular to the reference plane; the fifth reflection surface 612 forms a 45° angle with the reference plane, the sixth reflection surface 613 is located above the fifth reflection surface 612, the sixth reflection surface 613 forms a 45° angle with the reference plane, and the fifth reflection surface 612 and the sixth reflection surface 613 are parallel; the second exit light surface 614 is located between the sixth reflection surface 613 and the detection sensor 3 and is perpendicular to the reference plane. The light emitted horizontally to the right by the first chip 81 is vertically incident on the second incident light surface 611 and then enters the fifth reflection surface 612. The fifth reflection surface 612 reflects the light, and the reflected light propagates upward and is incident on the sixth reflection surface 613. The sixth reflection surface 613 reflects the light and emits it from the second exit light surface 614 along the first direction and then enters the detection sensor 3. The fifth reflection surface 612 and the sixth reflection surface 613 are two opposite inner side surfaces of the beam translation prism, and the second incident light surface 611 and the second exit light surface 614 are the other two opposite outer side walls of the beam translation prism. Of course, in other implementable solutions, two plane mirrors may be used to form the first prism 64.

[0082] In this embodiment, the second prism 65 is a 180° beam deflection prism. The second prism 65 includes a second incident / exit light surface 621, a seventh reflection surface 622, and an eighth reflection surface 623. At the second angle, the second incident light surface 611 is parallel to the light emitting surface of the second chip 82, the fifth reflection surface 612 faces the second chip 82, and the sixth reflection surface 613 faces the second incident / exit light surface 621. The light emitted by the second chip 82 passes through the second incident light surface 611, the fifth reflection surface 612, the sixth reflection surface 613, and the second exit light surface 614 in sequence and then enters the second prism 65 from the second incident / exit light surface 621.

[0083] The seventh reflecting surface 622 faces the second light-emitting surface 614, and the eighth reflecting surface 623 faces the detection sensor 3. The light emitted horizontally from the first prism 64 enters the detection sensor 3 after passing through the second light incident and exit surface 621, the seventh reflecting surface 622, the eighth reflecting surface 623, and the second light incident and exit surface 621. Specifically, the second light incident and exit surface 621 is parallel to the detection surface of the detection sensor 3 and perpendicular to the reference plane. The seventh reflecting surface 622 forms a 45° angle with the reference plane. The eighth reflecting surface 623 is located above the seventh reflecting surface 622 and forms a 45° angle with the reference plane, and the seventh reflecting surface 622 and the eighth reflecting surface 623 are not parallel. Of course, in other implementable solutions, two plane mirrors can be used to form the second prism 65.

[0084] Since the distance by which the first chip 81 and the second chip 82 are offset in the front-back direction is constant throughout the laser module 1, the first prism 64 is located at a distance of half of the offset distance from the rotation axis 63, so that after the first chip 81 is detected, rotating the first prism 64 can exactly face the second chip 82. It is designed by making full use of the positional relationship in which the first chip 81 and the second chip 82 are offset from each other in the front-back direction, that is, the first chip 81 corresponding to the left and right is closer to the front side, while the second chip 82 is closer to the rear side, avoiding repeatedly adjusting the front-back positions of the detection sensor 3 and the optical path changing structure 7 during detection and reducing the generation of errors.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser module detection system, wherein: The laser module (1) is provided with at least two chip groups arranged along a second direction, each of the chip groups comprises a first chip (81) and a second chip (82) arranged along the first direction, the first chip (81) and the second chip (82) are staggered in the second direction, the second direction is a front-to-back direction, the first chips (81) corresponding to the left and right are close to the front side, and the second chips (82) are close to the back side, and the system comprises: a first power-on mechanism (21), a second power-on mechanism (22), an optical path changing structure (7) and a detection sensor (3); The first power-on mechanism (21) and the second power-on mechanism (22) are arranged along a first direction, and the first power-on mechanism (21) and the second power-on mechanism (22) respectively power the first chip (81) and the second chip (82); The optical path changing structure (7) is located between the first chip (81) and the second chip (82) of the chipset, and the optical path changing structure (7) is used to receive light generated by the first chip (81) and the second chip (82), respectively, and emit the light into the detection sensor (3); The system further comprises a first moving mechanism (41) and a second moving mechanism (42) respectively located on both sides of the laser module (1) in the first direction. The first moving mechanism (41) drives the first power-on mechanism (21) to move along the third direction and the second direction, so that the first chip (81) in the chipset is electrically connected; The second moving mechanism (42) drives the second power-on mechanism (22) to move along the third direction and the second direction, so that the second chip (82) in the chipset is electrically connected; The optical path changing structure (7) is arranged on the first moving mechanism (41), and the detection sensor (3) is arranged on the second moving mechanism (42); The first direction and the second direction are both located on a reference plane, and the third direction is perpendicular to the reference plane; The optical path changing structure (7) comprises a first prism (64) and a second prism (65), wherein the second prism (65) is fixed relative to the first moving mechanism (41); the first prism (64) is rotatably connected to the first moving mechanism (41) and is capable of switching between a first angle and a second angle; At the first angle, light emitted by the first chip (81) passes through the first prism (64) and then enters the detection sensor (3); At the second angle, in the second direction, the light emitted by the second chip (82) passes through the first prism (64) and the second prism (65) successively before being incident on the detection sensor (3).

2. The laser module detection system according to claim 1, characterized in that: The first moving mechanism (41) is capable of moving in a third direction to a first position and a second position, the first position being further away from the laser module (1) than the second position; The second moving mechanism (42) is capable of moving in a third direction to a third position and a fourth position, the third position being further away from the laser module (1) than the fourth position; The first power supply mechanism (21) is used to be electrically connected to the first chip (81) when the first moving mechanism (41) is located at the second position; and the second power supply mechanism (22) is used to be electrically connected to the second chip (82) when the second moving mechanism (42) is located at the fourth position.

3. The laser module detection system according to claim 1, characterized in that: The optical path changing structure (7) comprises a rotating frame (61) and a fixed frame (62), wherein the fixed frame (62) is fixedly connected to the first moving mechanism (41); the rotating frame (61) is rotatably connected to the first moving mechanism (41), and a rotating shaft (63) of the rotating frame (61) extends along a third direction and is located between the first chip (81) and the second chip (82) of the chipset; The fixing frame (62) is provided with the second prism (65); in the second direction, the second prism (65) is located on one side of the rotating shaft (63); The first prism (64) is arranged on the rotating frame (61); when the rotating frame (61) drives the first prism (64) to rotate to a first angle, the first prism (64) is located on the other side of the rotating shaft (63) in the second direction; When the rotating frame (61) drives the first prism (64) to rotate to a second angle, the first angle and the second angle differ by 180°, and in the second direction, the first prism (64) and the second prism (65) are both located on one side of the rotating shaft (63).

4. A laser module detection system, wherein: The laser module (1) is provided with at least two chip groups arranged along the second direction, each of the chip groups comprising a first chip (81) and a second chip (82) arranged along the first direction, characterized in that the system comprises: a first power-on mechanism (21), a second power-on mechanism (22), an optical path changing structure (7) and a detection sensor (3); The first power-on mechanism (21) and the second power-on mechanism (22) are arranged along a first direction, and the first power-on mechanism (21) and the second power-on mechanism (22) respectively power the first chip (81) and the second chip (82); The optical path changing structure (7) is located between the first chip (81) and the second chip (82) of the chipset, and the optical path changing structure (7) is used to receive light generated by the first chip (81) and the second chip (82), respectively, and emit the light into the detection sensor (3); The system further comprises a first moving mechanism (41) and a second moving mechanism (42) respectively located on both sides of the laser module (1) in the first direction. The first moving mechanism (41) drives the first power-on mechanism (21) to move along the third direction and the second direction, so that the first chip (81) in the chipset is electrically connected; The second moving mechanism (42) drives the second power-on mechanism (22) to move along the third direction and the second direction, so that the second chip (82) in the chipset is electrically connected; The optical path changing structure (7) is arranged on the first moving mechanism (41), and the detection sensor (3) is arranged on the second moving mechanism (42); The first direction and the second direction are both located on a reference plane, and the third direction is perpendicular to the reference plane; The first moving mechanism (41) is capable of moving in a third direction to a first position and a second position, the first position being further away from the laser module (1) than the second position; The second moving mechanism (42) is capable of moving in a third direction to a third position and a fourth position, the third position being further away from the laser module (1) than the fourth position; The first power supply mechanism (21) is used to be electrically connected to the first chip (81) when the first moving mechanism (41) is located at the second position; the second power supply mechanism (22) is used to be electrically connected to the second chip (82) when the second moving mechanism (42) is located at the fourth position; The light path changing structure (7) comprises a first light entrance area, a second light entrance area, a first light exit area and a second light exit area; The first light entrance area is used to receive light to be emitted by the first chip (81), and the light incident from the first light entrance area is emitted from the first light exit area; the second light entrance area is used to receive light to be emitted by the second chip (82), and the light incident from the second light entrance area is emitted from the second light exit area; In the third direction, the first light exiting area is farther away from the laser module (1) than the second light exiting area, so that light emitted from the first light exiting area can be incident along the first direction into the detection sensor (3) at the third position, and light emitted from the second light exiting area can be incident along the first direction into the detection sensor (3) at the fourth position.

5. The laser module detection system according to claim 4, characterized in that: The optical path changing structure (7) comprises a first optical path component (51) and a second optical path component (52) which are independent of each other; the first optical path component (51) forms the first light entrance area and the first light exit area; and the second optical path component (52) forms the second light entrance area and the second light exit area.

6. The laser module detection system according to claim 5, characterized in that: The first optical path component (51) comprises a first light incident surface (511), a first reflection surface (512), a second reflection surface (513) and a first light emitting surface (514) which are arranged in sequence; the first light incident area is located on the first light incident surface (511); the first light emitting area is located on the first light emitting surface (514); the first reflection surface (512) faces the light emitting surface of the first chip (81), and the second reflection surface (513) faces the detection surface of the detection sensor (3); and light emitted by the first chip (81) passes through the first light incident surface (511), the first reflection surface (512), the second reflection surface (513) and the first light emitting surface (514) in sequence before being incident on the detection sensor (3).

7. The laser module detection system according to claim 6, characterized in that: The first light incident surface (511) is parallel to the light emitting surface of the first chip (81); the first reflection surface (512) forms an angle of 45° with the reference plane, the first reflection surface (512) and the second reflection surface (513) are parallel; and the first light emitting surface (514) is parallel to the detection surface of the detection sensor (3).

8. The laser module detection system according to claim 5, characterized in that: The second optical path component (52) comprises a first light inlet and outlet surface (521), a third reflection surface (522) and a fourth reflection surface (523); the second light inlet area and the second light outlet area are both located on the first light inlet and outlet surface (521); the third reflection surface (522) faces the light emitting surface of the second chip (82), and the fourth reflection surface (523) faces the detection surface of the detection sensor (3); light emitted by the second chip (82) passes through the first light inlet and outlet surface (521), the third reflection surface (522), the fourth reflection surface (523) and the first light inlet and outlet surface (521) in sequence before being incident on the detection sensor (3).

9. The laser module detection system according to claim 8, characterized in that: The first light inlet and outlet surfaces (521) are respectively parallel to the light emitting surface of the second chip (82) and the detection surface of the detection sensor (3); the third reflection surface (522) forms an angle of 45° with the reference plane, the fourth reflection surface (523) forms an angle of 45° with the reference plane, and the third reflection surface (522) and the fourth reflection surface (523) form an angle of 90°.

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