Method for improving overlay mark detection precision
By using the reference chip in the incision measurement system to acquire the template image and match the chip to be tested, the incision mark is located at the center of the field of view, which solves the problem of low accuracy in the existing technology in the detection of the incision mark, and achieves high-precision, simple operation and strong robustness detection effects.
CN119689791APending Publication Date: 2025-03-25SHANGHAI ERUI MICRO SEMICONDUCTOR EQUIPMENT CO LTD +1
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Patent Information
- Application Number
- CN202411797132.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-03-25
AI Technical Summary
Technical Problem
The accuracy of the interlock mark detection method in the prior art needs to be improved, especially when looking for mark patterns, there are problems such as false detection and low robustness.
Method used
By using a reference chip in the incision measurement system to obtain a template image with a complete and centered pattern of the incision mark, and matching the chip to be measured based on the template image, the incision mark is positioned at the center of the field of view.
Benefits of technology
It effectively improves the accuracy of the inscribed mark detection, simplifies operation, improves robustness, and is suitable for lithography error detection of different types of inscribed mark patterns.
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Figure CN119689791A_ABST
Abstract
The invention provides a method for improving overlay mark detection precision, and the method comprises the following steps: placing a to-be-detected wafer in an overlay measurement system, the to-be-detected wafer comprises a plurality of chips, each chip is provided with an overlay mark, a chip is used as a reference chip, and a preset number of chips are used as to-be-detected chips; a template image is obtained based on the reference chip, the template image comprises a pattern of the overlay mark, and the pattern of the overlay mark is located in the center of the template image. And acquiring a center coordinate of an overlay mark in the to-be-detected chip based on the template image. And the wafer to be measured is moved to a detection position based on the center coordinate, and at the detection position, the overlay mark of the chip to be measured is located at the center position of the view field of the overlay measurement system. According to the method, the detection accuracy can be effectively improved, the requirement for the experience degree of detection personnel is low, operation is easy, robustness is high, and applicability is high.
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