Liquid cooling heat dissipation device and electronic device

Abstract

The invention discloses a liquid cooling heat dissipation device and an electronic device. The liquid cooling heat dissipation device comprises a containing shell and a liquid cooling heat dissipation assembly. The accommodating shell is provided with an accommodating structure. The liquid cooling heat dissipation assembly comprises at least one liquid cooling head, a liquid cooling plate and a connecting pipe assembly. The liquid cooling head is located in the accommodating structure. The liquid cooling plate covers the accommodating shell and covers the accommodating structure. The connecting pipe assembly is connected with at least one liquid cooling head and penetrates through the liquid cooling plate.

Description

Technical Field

[0001] The invention relates to a liquid cooling and heat dissipation device and an electronic device, and in particular to a liquid cooling and heat dissipation device and an electronic device capable of preventing liquid leakage. Background Art

[0002] Currently, servers are widely used by various enterprises. The scope of their development combines the application of the Internet and telecommunications industry, and also penetrates into the lives of ordinary people, such as finance, economics, online banking, the use of online credit cards, artificial intelligence, etc. These can only be achieved by relying on the powerful computing power of servers. Taking artificial intelligence as an example, because artificial intelligence technology requires a larger amount of computing processing, it needs to be equipped with a large number of high-performance processors. However, high-performance processors will also bring a large amount of waste heat. If this waste heat cannot be discharged from the server immediately, the accumulated waste heat may cause the server's computing performance to decrease, or even cause thermal failure.

[0003] The existing practice is to add an open liquid cooling system inside the server to transfer the heat energy generated by the high-performance processor to the outside of the server through liquid cooling. However, the current open liquid cooling system or closed liquid cooling system may have leakage problems in the pipes inside the server, and the leaked liquid may affect the operation of the electronic components inside the server, or even cause the risk of short circuit in the server. Summary of the invention

[0004] The invention provides a liquid cooling device and an electronic device, which are used to prevent leakage of liquid cooling liquid inside a server.

[0005] A liquid cooling device disclosed in an embodiment of the present invention comprises a housing and a liquid cooling assembly. The housing has a housing structure. The liquid cooling assembly comprises at least one liquid cooling head, a liquid cooling plate and a connecting pipe assembly. The liquid cooling head is located in the housing structure. The liquid cooling plate is covered on the housing and covers the housing structure. The connecting pipe assembly is connected to at least one liquid cooling head and penetrates the liquid cooling plate.

[0006] Another embodiment of the present invention discloses an electronic device comprising a housing, an electronic component and a liquid cooling heat dissipation component. The housing has a housing structure. The electronic component is located in the housing structure. The liquid cooling heat dissipation component comprises at least one liquid cooling head, a liquid cooling plate and a connecting pipe assembly. The liquid cooling head is located in the housing structure and is thermally coupled to the electronic component. The liquid cooling plate is covered on the housing and covers the housing structure. The connecting pipe assembly is connected to at least one liquid cooling head and penetrates the liquid cooling plate.

[0007] According to the liquid-cooled heat sink and the electronic device of the above-mentioned embodiment, since the flow tube joints of the liquid-cooled heat sink in the accommodation structure are integrally formed by welding or the like, and the connecting pipe assembly passes through the liquid cooling plate, if the connecting pipe assembly leaks under the action of high hydraulic pressure, the leaked liquid will not directly flow into the accommodation structure.

[0008] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a three-dimensional schematic diagram of an electronic device according to a first embodiment of the present invention;

[0010] Figure 2 for Figure 1 Schematic diagram of the decomposition of

[0011] Figure 3 for Figure 1 Schematic cross-sectional view of ;

[0012] Figure 4 is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention;

[0013] Figure 5 for Figure 1 A three-dimensional schematic diagram of an electronic device installed on an outdoor pole.

[0014] Explanation of symbols

[0015] 10: Electronic devices

[0016] 100: Container

[0017] 110: Bottom plate

[0018] 120: Ring side panel

[0019] 121: External interface

[0020] 130: Ring top plate

[0021] 200: Electronic components

[0022] 210: Motherboard

[0023] 220: Heat source

[0024] 300: Liquid cooling components

[0025] 310, 310A: Liquid cooling head

[0026] 320: Liquid cooling plate

[0027] 321: First side

[0028] 322: Side 2

[0029] 323:Piercing

[0030] 324: First connector

[0031] 325: Internal flow channel

[0032] 330: first connecting pipe

[0033] 331: Second connector

[0034] 340: Second connecting pipe

[0035] 350: Pump

[0036] 410: first seal

[0037] 420: Second sealing member

[0038] 430: Third seal

[0039] 440: Fourth seal

[0040] 500: Air cooling components

[0041] 510: Heat sink fins

[0042] 520: Fan

[0043] 600:Fixed mechanism

[0044] 610:Fixed fixture

[0045] 620: Connecting rod

[0046] 640:Assembly rack

[0047] A, F: Direction

[0048] S: Accommodation structure DETAILED DESCRIPTION

[0049] See also Figures 1 to 3 . Figure 1 FIG. 1 is a schematic three-dimensional diagram of an electronic device 10 according to a first embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the decomposition. Figure 3 for Figure 1 Schematic cross-section diagram of .

[0050] The electronic device 10 of the present embodiment includes a housing 100, an electronic component 200 and a liquid-cooling heat dissipation component 300. The housing 100 and the liquid-cooling heat dissipation component 300, for example, together constitute a liquid-cooling heat dissipation device. The housing 100 includes a bottom plate 110, an annular side plate 120 and an annular top plate 130. The annular side plate 120 is connected to the bottom plate 110 and together surrounds a housing structure S. The annular top plate 130 is connected to a side of the annular side plate 120 away from the bottom plate 110 and, for example, covers a portion of the housing structure S. In addition, the annular side plate 120 of the housing 100 also has an external interface 121, which is connected to the housing structure S and is used to expose an external connector (not shown) of the electronic component 200.

[0051] The electronic component 200 is located in the accommodating structure S. The electronic component 200 includes, for example, a mainboard 210 and a plurality of heat sources 220. The heat source 220 is, for example, a central processing unit or an image processor, and is disposed on the mainboard 210. The number of the mainboard 210 in this embodiment is taken as a single one, but is not limited thereto. In other embodiments, the number of the mainboards may also be multiple.

[0052] The liquid cooling heat dissipation component 300 includes a plurality of liquid cooling heads 310, a liquid cooling plate 320 and a connecting pipe assembly. In addition, the liquid cooling heat dissipation component 300 may further include a pump 350. The liquid cooling heads 310 are located in the accommodating structure S and are thermally coupled to the heat source 220 of the electronic component 200. The number of the liquid cooling heads 310 is adjusted, for example, by the number of the heat sources 220. For example, if the number of the heat sources 220 is changed to three, the number of the liquid cooling heads 310 is also changed to three accordingly.

[0053] The liquid cooling plate 320 is combined with the housing shell 100 by screwing, for example, and covers the housing shell 100 so that the liquid cooling plate 320 covers the housing structure S. The liquid cooling plate 320 has a first surface 321, a second surface 322, and two through holes 323. The second surface 322 faces away from the first surface 321, and the two through holes 323 penetrate from the first surface 321 to the second surface 322. In addition, the liquid cooling plate 320 has two first connectors 324 and an internal flow channel 325, and the two first connectors 324 are connected through the internal flow channel 325 of the liquid cooling plate 320. The form of the internal flow channel 325 of the liquid cooling plate 320 is, for example, a thermosiphon type or a pulse type.

[0054] The connecting pipe assembly includes, for example, two first connecting pipes 330 and a plurality of second connecting pipes 340. The two first connecting pipes 330 are, for example, metal pipes, and are integrally connected to the liquid cooling head 310 by, for example, welding or other combining methods, so that the connection between the first connecting pipe 330 and the liquid cooling head 310 is more pressure-resistant. The two first connecting pipes 330 are respectively provided with two through holes 323. The two first connecting pipes 330 each have a second connecting head 331, and the two second connecting heads 331 are located outside the accommodating structure S. Some of the second connecting pipes 340 are, for example, hoses, and connect the two first connecting heads 324 and the two second connecting heads 331. The pump 350 is connected to one of the second connecting pipes 340, for example, to drive the conductive coolant to form a cooling cycle between the liquid cooling head 310 and the liquid cooling plate 320. For example, the conductive coolant flows along the direction F, for example.

[0055] In this embodiment, the connecting pipe assembly is exemplified by two first connecting pipes 330 and three second connecting pipes 340, but the present invention is not limited thereto. In other embodiments, the number of first connecting pipes in the connecting pipe assembly may be changed to one or more than three, and the number of second connecting pipes may be changed to two or more than four.

[0056] In this embodiment, the liquid cooling device may further include two first sealing members 410. The two first sealing members 410 are respectively sleeved on the two first connecting pipes 330 and respectively plugged into the two through holes 323. In this way, liquid outside the accommodating structure S can be prevented from flowing into the accommodating structure S from the through holes 323.

[0057] In this embodiment, the liquid cooling device may further include a second sealing member 420, which presses against the I / O panel and covers the external interface 121. In this way, liquid outside the accommodating structure S can be prevented from flowing into the accommodating structure S from the external interface 121 while allowing electronic signals and power supply components to pass through.

[0058] In this embodiment, the liquid cooling device may further include a third seal 430, which is sandwiched between the annular top plate 130 and the liquid cooling plate 320. In this way, liquid outside the accommodating structure S can be prevented from flowing into the accommodating structure S from the gap between the annular top plate 130 and the liquid cooling plate 320.

[0059] In this embodiment, the liquid cooling device may further include an air cooling component 500 . The air cooling component 500 is in thermal contact with the second surface 322 of the liquid cooling plate 320 .

[0060] In this embodiment, the air-cooled heat dissipation assembly 500 includes a heat dissipation fin 510 and a plurality of fans 520. The heat dissipation fin 510 is thermally coupled to the second surface 322 of the liquid cooling plate 320. The heat dissipation fin 510 is, for example, a knife-cut heat dissipation fin, and is integrally formed on the second surface 322 of the liquid cooling plate 320. The fan 520 is disposed on one side of the heat dissipation fin 510 to blow air toward the heat dissipation fin 510 along direction A, or to draw air in the reverse direction of direction A.

[0061] In this embodiment, the heat dissipation fins 510 are, for example, knife-cut heat dissipation fins, but the present invention is not limited thereto. In other embodiments, the heat dissipation fins may also be aluminum extruded fins or buckled fins.

[0062] In this embodiment, the heat dissipation fins 510 do not cover the entire liquid cooling plate 320 , but the present invention is not limited thereto. In other embodiments, the heat dissipation fins may also cover the entire liquid cooling plate 320 .

[0063] In this embodiment, the liquid cooling device actively drives the conductive coolant through the pump 350, but the invention is not limited thereto. In other embodiments, if the internal flow channel of the liquid cooling plate has the ability to drive the conductive coolant to form a two-phase heat transfer exchange form, the pump can be omitted from the liquid cooling device.

[0064] Since all the connection points of the liquid-cooled heat sink in the accommodation structure S are integrally formed, for example, by welding or other bonding methods, and the first connector 324 and the second connector 331 in the liquid-cooled heat sink used for connecting with the hose are both located outside the accommodation structure S, if the first connector 324 and the second connector 331 of the liquid-cooled heat sink leak under the action of high hydraulic pressure, the leaked liquid will not directly flow into the accommodation structure S.

[0065] In addition, since the through holes 323 in the housing shell 100 and the liquid cooling plate 320 that are connected to the housing structure S, the external interface 121, and the gap between the liquid cooling plate 320 and the housing shell 100 are all sealed by sealing members, the housing structure S can be regarded as a liquid-tight space. Therefore, even if there is a liquid leakage problem at the first connector 324 and the second connector 331, it will not cause harm to the electronic components 200 in the housing structure S.

[0066] In addition, in the electronic device 10 of the present embodiment, the liquid cooling plate 320, the air cooling heat dissipation assembly 500 and the second connecting tube 340 can be regarded as a whole after being assembled, and can be easily assembled and disassembled with the housing 100 and the first connecting tube 330. In this way, the liquid cooling plate 320, the air cooling heat dissipation assembly 500 and the second connecting tube 340 can be flexibly adjusted according to actual needs.

[0067] See also Figure 4 . Figure 4 for Figure 4: is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention. In this embodiment, the use of non-conductive coolant in a liquid-cooled heat dissipation device is taken as an example. The liquid-cooled head 310A is stacked on the mainboard 210, and the heat source 220 is surrounded by a hollow space. The liquid-cooled heat dissipation device may also include a fourth seal 440, and the fourth seal 440 is sandwiched between the liquid-cooled head 310A and the mainboard 210, so that the liquid-cooled head 310 and the mainboard 210 jointly surround the non-conductive coolant and the heat source 220, and the fourth seal 440 is provided to prevent the internal fluid of the liquid-cooled head 310 from leaking to the accommodating structure S. Since the liquid-cooled head 310 and the mainboard 210 jointly surround the non-conductive working fluid and the heat source 220, the heat source 220 is immersed in the non-conductive coolant to improve the cooling efficiency of the liquid-cooled heat dissipation device on the heat source 220.

[0068] See also Figure 5 . Figure 5 for Figure 1 A three-dimensional schematic diagram of an electronic device 10 installed on an outdoor pole.

[0069] The electronic device 10 is fixed to the outdoor pole 20, for example, by two fixing mechanisms 600. In detail, each fixing mechanism 600 includes two fixing fixtures 610, two connecting rods 620, and two assembly racks 640. The two fixing fixtures 610 are movably disposed on the two connecting rods 620, and are relatively close to or away from each other under the guidance of the two connecting rods 620. The two assembly racks 640 are disposed between one of the fixing fixtures 610 and the housing 100, so as to fix the housing 100 to the pole 20 or to the bottom or side of the antenna (not shown).

[0070] According to the liquid-cooled heat sink and the electronic device of the above-mentioned embodiment, since the various connection points of the liquid-cooled heat sink in the accommodation structure are integrally formed by a combination method such as welding, and the first connector and the second connector used for connecting with the hose in the liquid-cooled heat sink are both located outside the accommodation structure, if the first connector and the second connector of the liquid-cooled heat sink leak under the action of high hydraulic pressure, the leaked liquid will not directly flow into the accommodation structure.

[0071] In addition, since the through holes in the housing shell and the liquid cooling plate that are connected to the housing structure, the external interfaces, and the gap between the liquid cooling plate and the housing shell are all sealed by the sealing member, the housing structure can be regarded as a liquid-tight space. Therefore, even if there is a liquid leakage problem at the first connector and the second connector, it will not cause harm to the electronic components in the housing structure.

[0072] In addition, in the electronic device of this embodiment, the liquid cooling plate, the air cooling heat dissipation component and the second connecting pipe can be regarded as a whole after being assembled, and can be easily assembled and disassembled with the housing and the first connecting pipe. In this way, the liquid cooling plate, the air cooling heat dissipation component and the second connecting pipe can be flexibly adjusted according to actual needs.

[0073] Although the present invention is disclosed in conjunction with the above embodiments, they are not intended to limit the present invention. Anyone familiar with similar techniques may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be based on the definition of the claims attached to this specification.

Claims

1. A liquid cooling device, comprising: A housing shell having a housing structure; and Liquid cooling components, including: At least one liquid cooling head is located in the accommodating structure; a liquid cooling plate, covering the accommodating shell and the accommodating structure; and The connecting pipe assembly is connected to the at least one liquid cooling head and passes through the liquid cooling plate.

2. The liquid cooling heat dissipation device as described in claim 1, wherein the liquid cooling plate has at least two through holes and two first connecting heads, the connecting pipe assembly includes at least two first connecting pipes and a plurality of second connecting pipes, the at least two first connecting pipes are connected to the liquid cooling head and are respectively penetrated by the at least two through holes, the at least two first connecting pipes each have a second connecting head, the two second connecting heads are located outside the accommodating structure, and the second connecting pipes connect the two first connecting heads and the two second connecting heads.

3. The liquid cooling device as claimed in claim 2, wherein the at least two first connecting pipes are integrally formed on the liquid cooling head. 4 . The liquid cooling device as claimed in claim 3 , wherein the at least two first connecting pipes are welded to the liquid cooling head.

5. The liquid cooling device as claimed in claim 2, further comprising at least two first sealing members, wherein the at least two first sealing members are respectively sleeved on the at least two first connecting tubes and respectively plugged into the at least two through holes.

6. The liquid cooling device as claimed in claim 5 further comprises a second sealing member, the accommodating shell has an external interface, and the second sealing member covers the external interface.

7. The liquid cooling device as claimed in claim 2, wherein the liquid cooling component further comprises a pump, and the pump is connected to one of the second connecting pipes.

8. The liquid cooling heat dissipation device as described in claim 2 further comprises an air cooling heat dissipation component, the liquid cooling plate having a first surface and a second surface opposite to each other, the second surface facing away from the accommodating shell, the at least two through holes extending from the first surface to the second surface, and the air cooling heat dissipation component being in thermal contact with the second surface of the liquid cooling plate. 9 . The liquid-cooling heat dissipation device as claimed in claim 8 , wherein the air-cooling heat dissipation component comprises a heat dissipation fin, and the heat dissipation fin is thermally coupled to the second surface of the liquid cooling plate. 10 . The liquid cooling device as claimed in claim 9 , wherein the heat dissipation fins are integrally formed on the second surface of the liquid cooling plate.

11. The liquid cooling device as claimed in claim 9, wherein the air cooling component further comprises at least one fan, and the at least one fan is disposed on one side of the heat dissipation fin.

12. The liquid cooling heat dissipation device as described in claim 6 further includes a third sealing member, the housing shell includes a bottom plate, an annular side plate and an annular top plate, the annular side plate is connected to the bottom plate and together surrounds the housing structure, the annular top plate is connected to a side of the annular side plate away from the bottom plate, and the third sealing member is clamped between the annular top plate and the liquid cooling plate.

13. An electronic device comprising: A containing shell having a containing structure; An electronic component is located in the housing structure; and Liquid cooling components, including: At least one liquid cooling head is located in the housing structure and is thermally coupled to the electronic component; a liquid cooling plate, covering the accommodating shell and the accommodating structure; and The connecting pipe assembly is connected to the at least one liquid cooling head and passes through the liquid cooling plate.

14. The electronic device as described in claim 13, wherein the liquid cooling plate has at least two through holes and two first connecting heads, the connecting tube assembly includes at least two first connecting tubes and a plurality of second connecting tubes, the at least two first connecting tubes are connected to the liquid cooling head and are respectively penetrated by the at least two through holes, the at least two first connecting tubes each have a second connecting head, the two second connecting heads are located outside the accommodating structure, and the second connecting tubes connect the two first connecting heads and the two second connecting heads. 15 . The electronic device as claimed in claim 14 , wherein the at least two first connecting tubes are integrally formed on the liquid cooling head. The electronic device as claimed in claim 15 , wherein the at least two first connecting tubes are welded to the liquid cooling head. 17 . The electronic device as claimed in claim 14 , wherein the liquid cooling device further comprises at least two first sealing members, the at least two first sealing members are respectively sleeved on the at least two first connecting tubes and respectively plugged into the at least two through holes. 18 . The electronic device as claimed in claim 17 , wherein the liquid cooling device further comprises a second sealing member, the accommodating shell has an external interface, and the second sealing member covers the external interface.

19. The electronic device as claimed in claim 14, wherein the liquid cooling heat dissipation assembly further comprises a pump, and the pump is connected to one of the second connecting pipes.

20. The electronic device as claimed in claim 14, wherein the liquid-cooling heat dissipation device further comprises an air-cooling heat dissipation component, the liquid cooling plate has a first surface and a second surface opposite to each other, the second surface faces away from the accommodating shell, the at least two through holes penetrate from the first surface to the second surface, and the air-cooling heat dissipation component is in thermal contact with the second surface of the liquid cooling plate. 21 . The electronic device as claimed in claim 20 , wherein the air-cooled heat dissipation component comprises a heat dissipation fin, and the heat dissipation fin is thermally coupled to the second surface of the liquid cooling plate. 22 . The electronic device as claimed in claim 21 , wherein the heat dissipation fin is integrally formed on the second surface of the liquid cooling plate.

23. The electronic device as described in claim 18 further includes a third sealing member, the housing shell includes a bottom plate, an annular side plate and an annular top plate, the annular side plate is connected to the bottom plate and together surrounds the housing structure, the annular top plate is connected to a side of the annular side plate away from the bottom plate, and the third sealing member is clamped between the annular top plate and the liquid cooling plate.

24. The electronic device as claimed in claim 23, further comprising a fourth sealing member, the electronic component comprising a mainboard and at least one heat source, the at least one heat source being disposed on the mainboard, the fourth sealing member being sandwiched between the liquid cooling head and the mainboard, and allowing the liquid cooling head and the mainboard to jointly surround the heat source.

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