Heat dissipation mechanism and server with same

Abstract

The invention provides a heat dissipation mechanism and a server with the heat dissipation mechanism, and the heat dissipation mechanism comprises an installation housing which is used for installing a target workpiece, and at least one wall surface of the installation housing is provided with a plurality of installation channels; the heat dissipation part is arranged on the mounting shell, and airflow in the mounting shell flows out through the heat dissipation part; wherein the heat dissipation part comprises a fan blade assembly, the fan blade assembly comprises a rotating shaft and a plurality of flow guide fan blades, each flow guide fan blade is rotatably arranged around the axis of the flow guide fan blade, the rotating shaft is rotatably arranged around the axis of the rotating shaft, and the plurality of flow guide fan blades are all mounted on the rotating shaft so as to synchronously rotate around the axis of the rotating shaft under the driving of the rotating shaft; the multiple installation channels and the multiple flow guide fan blades are arranged in a one-to-one correspondence mode, and all the flow guide fan blades are rotationally installed in the corresponding installation channels. The problem that adjustment cannot be carried out according to heat distribution changes of different areas in the server in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of server heat dissipation, and in particular to a heat dissipation mechanism and a server having the same. Background Art

[0002] A server is a high-performance computer designed specifically to process and respond to requests from other computers (commonly called clients). The server plays a core role in a network environment and is responsible for storing, processing, and distributing data, applications, and services. The server generates a lot of heat during use and requires a cooling device.

[0003] However, existing server cooling devices usually use a fixed cooling fan layout, and the position and direction of these fans will not change once installed. This means that the wind direction and air volume of the cooling fans are fixed and cannot be adjusted according to the changes in heat distribution in different areas inside the server. Summary of the invention

[0004] The main purpose of the present invention is to provide a heat dissipation mechanism and a server having the same, so as to solve the problem that the heat dissipation device in the prior art cannot be adjusted according to the change of heat distribution in different areas inside the server.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the present invention, a heat dissipation mechanism is provided, including: a mounting shell for mounting a target workpiece; a heat dissipation portion, which is arranged on the mounting shell, and the airflow in the mounting shell flows out through the heat dissipation portion; a cover plate, which is movably arranged on the mounting shell to shield or avoid the heat dissipation portion; the heat dissipation portion includes a fan blade assembly, the fan blade assembly includes a rotating shaft and a plurality of guide fan blades, each guide fan blade is rotatably arranged around its axis, the rotating shaft is rotatably arranged around its axis, and the plurality of guide fan blades are all installed on the rotating shaft to rotate synchronously around the axis of the rotating shaft under the drive of the rotating shaft; a plurality of mounting channels are arranged one-to-one with the plurality of guide fan blades, and each guide fan blade is rotatably installed in the corresponding mounting channel.

[0006] Furthermore, the heat dissipation part includes a plurality of heat dissipation holes, and the plurality of heat dissipation holes are arranged on the top plate of the mounting shell; the heat dissipation mechanism also includes: a cover plate, which is movably arranged on the mounting shell, and on a projection plane parallel to the top plate, the cover plate has an overlapping position covering the plurality of heat dissipation holes and a spaced position spaced apart from the plurality of heat dissipation holes.

[0007] Furthermore, the heat dissipation part also includes: a mounting component, which is arranged on the top plate, the mounting component is located on the side of the plurality of heat dissipation holes, and the mounting component protrudes relative to the top plate; and the cover plate is movably arranged on the mounting component.

[0008] Furthermore, there are two mounting components, which are spaced apart along the length direction or width direction of the mounting shell, and the heat dissipation portion is located between the two mounting components; each mounting component is provided with a first slide groove, at least part of the cover plate is inserted into the first slide groove, and slides along the extension direction of the first slide groove.

[0009] Furthermore, the mounting shell also includes a plurality of side panels, and a plurality of mounting channels are arranged on at least one side panel; wherein the rotating shaft is inserted into the side panel from the side of the corresponding side panel, and passes through the plurality of mounting channels in sequence, so that each guide blade is respectively mounted on the rotating shaft.

[0010] Furthermore, the heat dissipation mechanism also includes: a driving component, which is arranged on the mounting shell, and the driving component is drivingly connected to the rotating shaft to drive the rotating shaft to rotate around its axis.

[0011] Furthermore, a plurality of installation channels are provided on the side panel, and a plurality of guide blades are arranged in each installation channel one by one; a rotating shaft is inserted into the side panel from the side surface of the side panel, and passes through each installation channel in turn, so that each guide blade is respectively installed on the rotating shaft, and each guide blade is driven to rotate by the rotating shaft.

[0012] Furthermore, the driving assembly also includes: a driving component, which is arranged on the mounting shell, the driving component includes a driving shaft, and the driving shaft is rotatably arranged around its own axis; a transmission component, the two ends of the transmission component are respectively connected to the driving shaft and the rotating shaft, and the driving shaft drives the rotating shaft to rotate through the transmission component; a dustproof box body, which is arranged on the mounting shell, and at least a part of the driving component is arranged in the dustproof box body.

[0013] Furthermore, the heat dissipation mechanism also includes: a supporting component, which is arranged in the installation shell, the supporting component is provided with a second slide groove, a connecting component is provided in the second slide groove, the connecting component is movably arranged along the extension direction of the second slide groove, and the target workpiece is clamped on the connecting component.

[0014] Further, the supporting component includes: a first supporting body, a second supporting body and a third supporting body, the second supporting body and the third supporting body are arranged at intervals along the length direction of the first supporting body, and the second supporting body and the third supporting body are respectively provided with second slide grooves; wherein, buffer components are respectively provided on the top surfaces of the second supporting body and the top surfaces of the third supporting body, and at least part of the target workpiece is in contact with the buffer component.

[0015] According to another aspect of the present invention, a server is provided, comprising a heat dissipation mechanism and a server body, wherein at least a portion of the server body is disposed in the heat dissipation mechanism, and the heat dissipation mechanism is the above-mentioned heat dissipation mechanism.

[0016] According to the technical solution of the present invention, the heat dissipation mechanism includes a mounting shell and a heat dissipation part, the mounting shell is used to mount the target workpiece, and a plurality of mounting channels are arranged on at least one wall surface of the mounting shell; the heat dissipation part is arranged on the mounting shell, and the airflow in the mounting shell flows out through the heat dissipation part, and the heat dissipation part includes a fan blade assembly, and the fan blade assembly includes a rotating shaft and a plurality of guide fan blades, each of which is rotatably arranged around its axis, and the rotating shaft is rotatably arranged around its axis, and the plurality of guide fan blades are all installed on the rotating shaft so as to rotate synchronously around the axis of the rotating shaft under the drive of the rotating shaft; wherein, the plurality of mounting channels are arranged one-to-one with the plurality of guide fan blades, and each guide fan blade is rotatably installed in the corresponding mounting channel.

[0017] It can be seen that the guide blade is not only rotatable around the first axis (the axis of the guide blade) to adapt to the natural flow of airflow inside the installation shell, but also rotatable around the second axis (the axis of the rotating shaft), allowing the user or control system to adjust the guide angle according to the real-time heat distribution. This flexibility ensures that the airflow is directly and effectively aimed at the heat generation area, significantly improving the heat dissipation efficiency while reducing energy consumption. By adjusting the guide angle of the guide blade, the heat dissipation device can adapt to the heat dissipation requirements of the server under different working conditions. Under high load, the inclination angle of the guide blade can be increased to enhance the cooling of the hot spot area; while under low load, the inclination angle is appropriately reduced to reduce unnecessary airflow and achieve energy-saving operation. The adjustability of the guide blade also means that during maintenance and cleaning, the blade angle can be easily adjusted to facilitate cleaning of internal dust accumulation, reduce maintenance costs and time, while maintaining the heat dissipation performance of the equipment. Optimized airflow guidance reduces the turbulence and vortex of the airflow in the channel, which helps to reduce the noise generated by the cooling fan during operation and create a quieter working environment. The installation channel design allows the second heat dissipation unit to be compactly installed on the side of the server, saving internal space while ensuring that the heat dissipation efficiency is not affected, making it suitable for high-density server environments. The dynamic adjustment capability of the guide vanes can help evenly distribute the airflow inside the server, avoiding local overheating, thereby improving the stability and service life of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0019] Figure 1 A schematic structural diagram of an embodiment of a heat dissipation mechanism according to the present invention is shown;

[0020] Figure 2 A schematic structural diagram of a heat dissipation mechanism according to the present invention from a first viewing angle is shown;

[0021] Figure 3A schematic structural diagram of a heat dissipation mechanism according to the present invention from a second viewing angle is shown;

[0022] Figure 4 A schematic diagram showing the structure of a driving component in a heat dissipation mechanism according to the present invention is shown;

[0023] Figure 5 A schematic structural diagram of the heat dissipation mechanism according to the present invention from a third viewing angle is shown;

[0024] Figure 6 A schematic structural diagram of a heat dissipation mechanism according to a fourth viewing angle of the present invention is shown;

[0025] Figure 7 A schematic diagram showing the installation of a target workpiece in a heat dissipation mechanism according to the present invention is shown;

[0026] Figure 8 A schematic structural diagram of a supporting component in a heat dissipation mechanism according to the present invention is shown.

[0027] The above drawings include the following reference numerals:

[0028] 100, mounting housing; 110, top plate; 120, dustproof groove; 130, side plate; 131, mounting channel; 132, side; 133, protection frame;

[0029] 200, heat dissipation part; 201, first heat dissipation part; 2010, heat dissipation hole; 202, second heat dissipation part; 210, guide fan blade; 220, power component;

[0030] 300, cover plate; 310, handle; 400, mounting component; 410, first slide groove;

[0031] 500, driving assembly; 510, rotating shaft; 520, driving component; 530, transmission component; 540, dustproof box body; 551, first transmission roller; 552, second transmission roller; 600, supporting component; 610, second slide groove; 620, connecting component; 601, first supporting body; 602, second supporting body; 603, third supporting body; 630, buffer component; 640, slider; 140, protective door panel; 150, protective back panel; 160, fixing part; 161, fixing screw; 700, server body; 710, connector. DETAILED DESCRIPTION

[0032] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0033] As mentioned in the background technology, most of the existing server heat dissipation mechanisms install a cooling fan on the server frame to guide the hot air flow generated by the server, or set cooling holes on the server frame to dissipate heat from the server. However, both the cooling holes and the cooling fans expose the server to the air. When there is no need to cool the server, dust in the air will adhere to the server through the cooling holes or the gaps of the cooling fan, affecting the heat dissipation effect of the server. Therefore, in response to the above-mentioned problems, the heat dissipation mechanism provided in the present application is provided with a cover 300, and the cover 300 is movably provided on the installation shell 100 to cover or avoid the heat dissipation part 200. When there is no need to dissipate heat for the server, the cover 300 is moved to a position to cover the heat dissipation part 200 to prevent dust in the air from entering the interior of the installation shell 100 through the heat dissipation part 200, thereby achieving a dust-proof effect. When it is necessary to dissipate heat for the server, the cover 300 is moved to an avoiding position. At this time, the airflow in the installation shell 100 flows out through the heat dissipation part 200. In this way, while not affecting the normal heat dissipation of the server by the heat dissipation mechanism, it also prevents impurities such as dust in the air from entering the interior of the installation shell 100 through the heat dissipation part 200 and attaching to the server to affect the heat dissipation effect and the normal operation of the server.

[0034] Please refer to Figures 1 to 8 The present application provides a heat dissipation mechanism, including: an installation shell 100, used to install a target workpiece, and a plurality of installation channels 131 are arranged on at least one wall surface of the installation shell 100; a heat dissipation portion 200, which is arranged on the installation shell 100, and the airflow in the installation shell 100 flows out through the heat dissipation portion 200; wherein the heat dissipation portion 200 includes a fan blade assembly, and the fan blade assembly includes a rotating shaft 510 and a plurality of guide fan blades 210, each of which is rotatably arranged around its axis, and the rotating shaft 510 is rotatably arranged around its axis, and the plurality of guide fan blades 210 are all installed on the rotating shaft 510 to synchronously rotate around the axis of the rotating shaft 510 under the drive of the rotating shaft 510; the plurality of installation channels 131 are arranged one-to-one correspondingly to the plurality of guide fan blades 210, and each guide fan blade 210 is rotatably installed in the corresponding installation channel 131.

[0035] By applying the technical solution of the present invention, the heat dissipation mechanism includes a mounting shell and a heat dissipation part, the mounting shell is used to mount the target workpiece, and a plurality of mounting channels 131 are arranged on at least one wall surface of the mounting shell 100; the heat dissipation part is arranged on the mounting shell, and the airflow in the mounting shell flows out through the heat dissipation part, and the heat dissipation part 200 includes a fan blade assembly, and the fan blade assembly includes a rotating shaft 510 and a plurality of guide fan blades 210, each of which is rotatably arranged around its axis, and the rotating shaft 510 is rotatably arranged around its axis, and the plurality of guide fan blades 210 are all installed on the rotating shaft 510, so as to rotate synchronously around the axis of the rotating shaft 510 under the drive of the rotating shaft 510; wherein, the plurality of mounting channels 131 are arranged one-to-one with the plurality of guide fan blades 210, and each guide fan blade 210 is rotatably installed in the corresponding mounting channel 131.

[0036] It can be seen that the guide vane 210 is not only rotatable around the first axis (the axis of the guide vane 210) to adapt to the natural flow of the airflow inside the mounting housing 100, but also rotatable around the second axis (the axis of the rotating shaft 510), allowing the user or the control system to adjust the guide angle according to the real-time heat distribution. This flexibility ensures that the airflow is directly and effectively aimed at the heat generation area, significantly improving the heat dissipation efficiency while reducing energy consumption. By adjusting the guide angle of the guide vane 210, the heat dissipation device can adapt to the heat dissipation requirements of the server under different working conditions. Under high load, the inclination angle of the guide vane 210 can be increased to enhance the cooling of the hot spot area; while under low load, the inclination angle is appropriately reduced to reduce unnecessary airflow and achieve energy-saving operation. The adjustability of the guide vane 210 also means that during maintenance and cleaning, the vane angle can be easily adjusted to facilitate cleaning of internal dust accumulation, reduce maintenance costs and time, and maintain the heat dissipation performance of the equipment. The optimized airflow guidance reduces the turbulence and vortex of the airflow in the channel, which helps to reduce the noise generated by the cooling fan during operation and create a quieter working environment. The design of the installation channel 131 enables the second heat dissipation unit 202 to be compactly installed on the side of the server, saving internal space while ensuring that the heat dissipation efficiency is not affected, which is suitable for high-density server environments. The dynamic adjustment capability of the guide vane 210 can help the airflow to be evenly distributed inside the server, avoiding local overheating, thereby improving the stability and service life of the server.

[0037] Specifically, Figure 2 As shown, the heat dissipation part 200 includes a first heat dissipation part 201 composed of a plurality of heat dissipation holes 2010, and the first heat dissipation part 201 is arranged on the top plate 110 of the mounting shell 100; the heat dissipation mechanism also includes: a cover plate 300, which is movably arranged on the mounting shell 100, and on the projection plane parallel to the top plate 110, the cover plate 300 has an overlapping position covering the plurality of heat dissipation holes 2010 and a spaced position spaced apart from the plurality of heat dissipation holes 2010.

[0038] According to the heat dissipation mechanism provided in the present application, it includes a mounting shell 100, a heat dissipation part 200 and a cover plate 300, wherein the mounting shell 100 is used to mount the target workpiece; the heat dissipation part 200 is arranged on the mounting shell 100, and the airflow in the mounting shell 100 flows out through the heat dissipation part 200, and the cover plate 300 is movably arranged on the mounting shell 100 to shield or avoid the heat dissipation part 200. Through the design of the movable cover plate 300, the heat dissipation mechanism can dynamically shield or avoid the heat dissipation part 200 according to the heat distribution and working state of the target workpiece (such as the server body), thereby achieving more precise heat dissipation control. When a higher heat dissipation is required in a high load or hot spot area, the cover plate 300 can be avoided to ensure that the airflow of the heat dissipation part 200 is unobstructed and improve the heat dissipation efficiency; and when the load is low or there is no need for excessive heat dissipation, the cover plate 300 can shield the heat dissipation part 200, reduce unnecessary energy consumption, and achieve energy saving. The cover plate 300 can also play a dust-proof role when shielding the heat dissipation part 200, reduce the dust from entering the interior of the mounting housing 100, protect the target workpiece and its internal components from dust, extend the service life of the equipment, and reduce the maintenance frequency.

[0039] The movement of the cover plate 300 can not only block or avoid the heat dissipation unit 200, but also help guide the airflow to make the heat dissipation more uniform. When some areas are overheated, the position of the cover plate 300 can be adjusted to guide more airflow to these hot spots, thereby improving the heat dissipation uniformity of the entire target workpiece and improving stability.

[0040] In this embodiment, the heat dissipation mechanism further includes a mounting component 400, which is arranged on the top plate 110. The mounting component 400 is located on the side of the first heat dissipation part 201, and the mounting component 400 protrudes relative to the top plate 110; the cover plate 300 is movably arranged on the mounting component 400. The first heat dissipation part 201 is directly arranged on the top plate 110 of the mounting shell 100, and can quickly transfer the heat generated by the server body to the heat dissipation part. Since its position is close to the heat source, the heat loss during the transfer process is reduced, and the heat dissipation efficiency is improved; through the protruding design of the mounting component 400 and the movable setting of the cover plate 300, the direction and flow of the airflow can be flexibly adjusted. Under different operating conditions of the server body, according to the change of heat distribution, the position of the cover plate 300 is adjusted, so that the airflow is more accurately aimed at the hot spot area, thereby achieving efficient heat dissipation, and reducing unnecessary energy consumption under low load conditions. The cover plate 300 can not only adjust the airflow, but also serve as a dust barrier. When the server operating environment is poor, the cover plate 300 can be moved to an appropriate position to block the first heat dissipation part 201 of the heat dissipation part 200, reduce dust ingress, and protect the internal components from dust, thereby extending the service life of the server. The separation design of the first heat dissipation part 201 and the cover plate 300 is convenient for daily maintenance and cleaning. The movable characteristic of the cover plate allows cleaning and inspection without disassembling the entire device, which improves the convenience and efficiency of maintenance. The protruding design of the mounting component 400 and the fixed connection with the top plate 110 increase the structural stability of the entire heat dissipation device, avoid the displacement of the heat dissipation part due to long-term operation or changes in the external environment, and ensure the long-term reliable operation of the heat dissipation system. Through the movement and adjustment of the cover plate 300, the heat dissipation part 200 can adapt to different server bodies and operating conditions. Even if the layout of the server body or the location of the heat source changes, the heat dissipation effect can be optimized by adjusting the position of the cover plate, which improves the versatility and adaptability of the device.

[0041] The cover plate 300 is also provided with a handle 310 , which facilitates pushing and pulling of the cover plate 300 .

[0042] Specifically, a dustproof groove 120 is provided on the top plate 110, and the first heat dissipation part 201 includes a heat dissipation hole 2010, and the heat dissipation hole 2010 is provided on the groove bottom surface of the dustproof groove 120. There are multiple dustproof grooves 120, and the multiple dustproof grooves 120 are arranged at intervals along the length direction or width direction of the top plate 110. The groove bottom surface of each dustproof groove 120 is respectively provided with multiple heat dissipation holes 2010. The design of the dustproof groove 120 forms a groove relative to the top plate 110, which can effectively prevent external dust and impurities from falling directly into the heat dissipation hole 2010. This design reduces the risk of clogging of the heat dissipation hole, keeps the heat dissipation channel unobstructed, and ensures that the heat dissipation efficiency of the server body is not affected. Since the heat dissipation hole 2010 is arranged on the groove bottom surface of the dustproof groove 120, this layout helps to optimize the path of the airflow. After entering the dustproof groove 120, the airflow is guided to the heat dissipation hole 2010, forming a more concentrated and directional airflow, improving the efficiency of heat exchange, and helping to quickly dissipate heat. The dustproof groove 120 can, to a certain extent, guide the airflow to be more evenly distributed on the surface of the server body, promote uniform heat dissipation, reduce local overheating, and improve the stability and reliability of server operation.

[0043] In a specific implementation, there are two mounting components 400, and the two mounting components 400 are arranged at intervals along the length direction or width direction of the mounting shell 100, and the heat dissipation part 200 is located between the two mounting components 400; each mounting component 400 is provided with a first slide groove 410, and at least part of the cover plate 300 is inserted into the first slide groove 410 and slides along the extension direction of the first slide groove 410. By arranging two mounting components 400 on opposite sides of the mounting shell 100, the stability and rigidity of the overall structure can be improved, and the heat dissipation part 200 can be prevented from being displaced or damaged due to vibration or external force during operation, ensuring that the heat dissipation part 200 can operate stably for a long time. The position between the two mounting components 400 can accurately control the installation position of the heat dissipation part 200, so that the heat dissipation part 200 can be closer to the heat source or flexibly adjusted according to the internal heat distribution of the server, so as to more effectively dissipate heat and improve heat dissipation efficiency. The spacing arrangement of the mounting components 400 and the design of the first slide groove 410 make it easier to disassemble and install the cover plate 300, and facilitate the cleaning, maintenance or replacement of the heat dissipation unit 200, and also facilitate the maintenance of the cover plate 300 itself, such as replacing dustproof materials. The arrangement of the first slide groove 410 allows the cover plate 300 to slide along the extension direction of the first slide groove 410, which can not only adjust the position of the cover plate 300, but also can be quickly opened or closed when necessary to adapt to different working environments and changes in heat dissipation requirements, such as reducing dustproof measures in a low-dust environment to allow smoother airflow. The relative position between the heat dissipation unit 200 and the cover plate 300 can be adjusted by sliding the cover plate 300, which helps to improve the airflow path and ensure that the airflow can flow through the heat dissipation unit 200 more directly and effectively, thereby improving the efficiency of the entire heat dissipation system.

[0044] Among them, an elastic sealing strip is arranged in the first slide groove 410 to ensure that no matter which position the cover plate 300 slides to, the sealing between the cover plate 300 and the mounting housing 100 is not affected, so as to prevent dust and impurities from entering the server. In addition to dust prevention, the elastic sealing strip also has a certain heat insulation effect. When the server is running, the heat generated inside is discharged through the heat dissipation system, and the sealing strip can reduce the leakage of airflow, ensure the heat dissipation effect, and prevent the external heat source or cold source from affecting the internal temperature of the server, so as to maintain the thermal stability of the server operation. When the cover plate 300 slides, the elastic sealing strip can reduce the collision and friction between the cover plate and the slide groove, and reduce the noise during operation. The sealing strip made of elastic material, such as rubber or silicone, can not only provide a good sealing effect, but also reduce the resistance during the sliding process of the cover plate, and ensure the smoothness of the sliding operation. At the same time, the elastic sealing strip has good wear resistance, can maintain its sealing performance after long-term use, and reduces the frequency of maintenance and replacement. The design of the elastic sealing strip has high adaptability, which can adapt to the slight position change of the cover plate during the sliding process, and ensure that the sealing effect is still reliable even when the cover plate is frequently opened and closed or slid. This flexibility enables the cover design to better adapt to changes in the server's operating state, such as quickly opening the heat dissipation channel when the load is high, and reducing airflow leakage when the load is low or the server is not in operation. The design of setting an elastic sealing strip in the first slide groove 410 not only significantly enhances the dustproof and heat-insulating performance of the server, but also brings multiple advantages such as noise control, sliding smoothness, adaptability, energy saving and environmental protection.

[0045] In another embodiment provided in the present application, the cover plate 300 is hinged to the mounting component 400 so that the cover plate 300 is rotatably arranged relative to the mounting component 400, so that the user can adjust the tilt angle of the cover plate as needed. This design allows the user to adjust the angle of the cover plate to optimize the heat dissipation effect or enhance the dustproof ability when the operating environment of the server changes, such as in a high dust environment or when a more direct airflow guide is required. Specifically, the cover plate 300 is connected to the mounting component 400 by a hinge, and the hinge is driven by a motor or a hydraulic pump to achieve automatic angle adjustment of the cover plate. A dustproof sealing strip is designed on the contact surface between the cover plate and the mounting frame. When the cover plate is closed, the sealing strip can ensure close contact between the cover plate and the mounting frame to prevent dust and impurities from entering.

[0046] Furthermore, a temperature sensor is installed near the key heat source inside the server to monitor the temperature change in real time. When the temperature is detected to exceed a preset threshold, the control system automatically adjusts the position of the cover plate, so that the cover plate 300 slides open or rotates open, and the heat dissipation through hole is opened to enhance heat dissipation. On the contrary, when the temperature inside the server is lower than a certain level, the cover plate is automatically closed to reduce dust entry and maintain the temperature stability inside the server. This design improves the intelligence level of the heat dissipation device and can automatically adjust the state of the cover plate according to the real-time temperature demand of the server. By dynamically adjusting the state of the cover plate, it is possible to ensure rapid heat dissipation at high temperatures and reduce energy loss at low temperatures or in non-operating states. A high-precision, fast-response temperature sensor, such as a thermocouple, a thermistor or an infrared temperature sensor, is used to ensure the accuracy of real-time monitoring of the internal temperature of the server. Preferably, the temperature sensor is connected to the drive assembly 500 signal. When the temperature sensor detects that the temperature exceeds the preset threshold, the control system adjusts the position of the cover plate, and the guide fan blade 210 starts to operate.

[0047] Furthermore, if Figures 2 to 4 As shown, the mounting shell 100 also includes a plurality of side panels 130, and a plurality of mounting channels 131 are provided on at least one side panel 130; wherein the rotating shaft 510 is inserted into the side panel 130 from the side surface 132 of the corresponding side panel 130, and passes through the plurality of mounting channels 131 in sequence, so that each guide blade 210 is respectively mounted on the rotating shaft 510.

[0048] The heat dissipation part 200 also includes a second heat dissipation part 202, which is arranged in the installation channel 131. The second heat dissipation part 202 includes: the above-mentioned guide vane 210, which is arranged in the corresponding installation channel 131. The guide vane 210 is rotatably arranged around the first axis (the axis of the guide vane 210) to guide the airflow in the installation shell 100. At the same time, the guide vane 210 is rotatably arranged around the second axis (the axis of the rotating shaft 510) to adjust the guide angle of the guide vane 210. The guide vane 210 is not only rotatable around the first axis to adapt to the natural flow of the airflow inside the installation shell 100, but also rotatable around the second axis, allowing the user or the control system to adjust the guide angle according to the real-time heat distribution. This flexibility ensures that the airflow is directly and effectively aimed at the heat generation area, significantly improves the heat dissipation efficiency, and reduces energy consumption. By adjusting the guide angle of the guide vane 210, the heat dissipation device can adapt to the heat dissipation requirements of the server under different working conditions. When the load is high, the inclination angle of the guide blade can be increased to enhance the cooling of the hot spot area; when the load is low, the inclination angle can be appropriately reduced to reduce unnecessary airflow and achieve energy-saving operation. The adjustability of the guide blade 210 also means that during maintenance and cleaning, the blade angle can be easily adjusted to facilitate the cleaning of internal dust accumulation, reduce maintenance costs and time, and maintain the heat dissipation performance of the equipment. The optimized airflow guidance reduces the turbulence and vortex of the airflow in the channel, helps to reduce the noise generated by the cooling fan during operation, and creates a quieter working environment. The design of the mounting channel 131 on the side panel 130 enables the second heat dissipation part 202 to be compactly installed on the side of the server, saving internal space while ensuring that the heat dissipation efficiency is not affected, which is suitable for high-density server environments. The dynamic adjustment capability of the guide blade 210 can help the airflow to be evenly distributed inside the server, avoiding local overheating, thereby improving the stability and service life of the server.

[0049] In the present application, the heat dissipation mechanism also includes: a drive assembly 500, which is arranged on the mounting housing 100, and the drive assembly 500 is connected to the rotating shaft 510 to drive the rotating shaft 510 to be rotatably arranged around the second axis. The rotating shaft 510 is rotatably arranged on the mounting housing 100 around the second axis, so that the heat dissipation fan can not only realize a small lateral angle rotation through the drive mechanism and the transmission mechanism, but also realize a more flexible angle adjustment through the drive assembly 500, and even includes a longitudinal rotation, so as to better adapt to the changes in the internal heat distribution of the server. The design of the guide vane 210 can enhance the guiding property of the airflow, ensure that the heat can be quickly and evenly dissipated, improve the heat dissipation efficiency, and reduce the operating temperature of the server. During the operation of the server, the workload of different time periods will be different, resulting in changes in the heat distribution. Through the arrangement of the drive assembly 500 and the guide vane 210, it is possible to better adapt to such changes, so that the heat dissipation strength of the hot spot area can be increased during the high load period, and the heat dissipation intensity can be appropriately reduced during the low load period, saving power resources.

[0050] Specifically, the second heat dissipation unit 202 also includes a power component 220, which is arranged on the rotating shaft 510 and connected to the guide vane 210. The guide vane 210 is driven to rotate by the power component 220, thereby realizing the heat dissipation of the server. This arrangement does not affect the normal heat dissipation function of the guide vane 210, and also makes the rotation of the guide vane 210 and the rotation of the rotating shaft 510 not interfere with each other, and the guide vane 210 can rotate with the rotating shaft 510 at the same time.

[0051] The rotating shaft 510 is provided with a guide vane 210, which is a specially designed vane that can not only enhance the guiding property of the airflow, but also realize more efficient energy conversion and air volume adjustment under the drive of the rotating shaft 510. The setting of the guide vane 210 can dynamically adjust the wind direction and air volume according to the heat distribution in different areas inside the server, ensuring that the heat can be dissipated quickly and evenly, thereby improving the heat dissipation efficiency, reducing the temperature of the server during operation, and extending the service life of the server.

[0052] like Figure 4As shown, the side panel 130 is provided with a plurality of installation channels 131, and the guide vanes 210 are multiple, and the guide vanes 210 are arranged in each installation channel 131 one by one; the rotating shaft 510 is inserted into the side panel 130 from the side 132 of the side panel 130, and passes through each installation channel 131 in sequence, so that each guide vane 210 is respectively installed on the rotating shaft 510, and each guide vane 210 is driven to rotate by the rotating shaft 510. Driven by the rotating shaft 510, the guide vanes 210 can be dynamically adjusted according to a preset angle, so that the heat dissipation device can dynamically adjust the angle of the vanes according to the real-time position and heat change of the internal heat source of the server, so as to more effectively guide the airflow to the heat-intensive area and improve the heat dissipation efficiency. The guide vanes 210 are arranged in the side panel 130 through the installation channel 131, which reduces the occupied space of the entire device, so that the high-strength heat dissipation device for the server has a more compact structure while maintaining efficient heat dissipation, which is convenient for installation and maintenance in a limited space. The combined installation method of the guide blades 210 and the rotating shaft 510 not only simplifies the installation process of the blades, but also facilitates subsequent maintenance and replacement. Once a blade fails or needs to be cleaned, it can be operated directly through the side 132 without disassembling the entire heat dissipation device, saving time and manpower. The through-installation of the rotating shaft 510 ensures the stability and consistency of all the guide blades 210, and maintains a good balance even at high-speed rotation, reducing noise and device wear caused by blade vibration. Since the angle of the guide blades 210 can be adjusted, this heat dissipation device can adapt to changes in the internal structure of servers of different models and configurations, improves the versatility and adaptability of the device, and reduces inventory pressure.

[0053] In a specific implementation, the drive assembly 500 further includes: a drive component 520, which is arranged on the mounting housing 100, and the drive component 520 includes a drive shaft, which is rotatably arranged around its own axis; a transmission component 530, and the two ends of the transmission component 530 are respectively connected to the drive shaft and the rotating shaft 510, and the drive shaft drives the rotating shaft 510 to rotate through the transmission component 530; a dustproof box body 540, which is arranged on the mounting housing 100, and at least part of the drive component 520 is arranged in the dustproof box body 540. The drive shaft is rotatably arranged around its own axis, and the rotation of the rotating shaft 510 can be accurately controlled, thereby controlling the direction and angle of the cooling fan. This design allows the cooling fan to be aimed at the hot spot area of ​​the target workpiece, improving the pertinence and efficiency of heat dissipation. The transmission component 530 connects the drive shaft with the rotating shaft 510, ensuring the efficient transmission of power, while reducing the energy loss during the transmission process. The design of the transmission component 530 also improves the stability of the entire drive system and reduces the vibration and noise during the transmission process. The provision of the dustproof box body 540 encloses part of the structure of the driving component 520, effectively preventing dust and external impurities from entering key parts such as the driving shaft and the transmission component 530, protecting these components from damage, and extending the service life of the driving component. The use of the dustproof box body 540 not only provides dust protection, but also makes the maintenance and cleaning of the driving component 500 more convenient. Maintenance personnel can easily open the dustproof box body 540 to inspect, clean or replace the internal driving component 520 and the transmission component 530 without completely disassembling the entire heat dissipation mechanism. Disposing at least part of the driving component 520 in the dustproof box body 540 optimizes space utilization, makes the design of the driving component 500 more compact, reduces the occupation of the internal space of the mounting shell 100, and improves the flexibility of the internal component layout of the target workpiece.

[0054] Specifically, the driving component 520 is a driving motor, a first transmission roller 551 is arranged on the driving shaft of the driving motor, a second transmission roller 552 is arranged at the end of the rotating shaft 510, the first transmission roller 551 and the second transmission roller 552 are connected by a transmission component 530, and the transmission component 530 is preferably a transmission belt.

[0055] To facilitate the installation of the target artifact, such as Figure 7 and Figure 8As shown, the heat dissipation mechanism also includes: a support component 600, which is arranged in the installation housing 100, and a second slide groove 610 is arranged on the support component 600. A connecting component 620 is arranged in the second slide groove 610, and the connecting component 620 is movably arranged along the extension direction of the second slide groove 610, and the target workpiece is clamped on the connecting component 620. The second slide groove 610 arranged on the support component 600 allows the connecting component 620 to move along its extension direction, which means that the target workpiece (such as a server or an electronic component) can be easily installed and removed. This design not only improves the convenience of the installation process, but also ensures the stability of the target workpiece during operation, especially under high load conditions, the thermal expansion or mechanical vibration of the server can be buffered and supported by the support component 600. By moving the connecting component 620 along the second slide groove 610, the position of the target workpiece relative to the heat dissipation portion 200 can be accurately adjusted to ensure the optimal alignment of the heat source and the heat dissipation device. This adjustment capability allows the airflow to flow directly and efficiently through the heat source, improve the heat dissipation efficiency, and reduce energy waste. The slide groove design of the support component 600 makes the installation and removal of the target workpiece no longer complicated. Maintenance personnel can easily access and clean the heat dissipation part 200 and the heat dissipation surface of the target workpiece, reducing maintenance costs and time, and ensuring long-term heat dissipation performance and system stability. The second slide groove 610 and the movable connecting component 620 are designed to adapt to target workpieces of different sizes and shapes, so that the heat dissipation mechanism can be widely used in a variety of servers or electronic devices, improving the versatility and adaptability of the device. The precise matching of the connecting component 620 and the second slide groove 610 reduces the displacement and tilt of the target workpiece during the installation process, avoids the reduction of heat dissipation effect or airflow blockage due to inaccurate installation, and ensures the long-term reliable operation of the heat dissipation system.

[0056] The support component 600 includes: a first support body 601, a second support body 602 and a third support body 603, wherein the second support body 602 and the third support body 603 are arranged at intervals along the length direction of the first support body 601, and second slide grooves 610 are respectively arranged on the second support body 602 and the third support body 603; wherein, a buffer component 630 is respectively arranged on the top surface of the second support body 602 and the top surface of the third support body 603, and at least part of the target workpiece is in contact with the buffer component 630. Through the combination of the first support body 601 and the second support body 602 and the third support body 603 arranged at intervals, a stable support frame is formed, which can effectively bear the weight of the server body, ensure the structural stability of the server during operation, and avoid hardware damage caused by equipment vibration or external force impact. The second slide groove 610 design on the second support body 602 and the third support body 603 allows the position of the server body to be adjusted as needed. This adjustability can optimize the airflow path inside the server, ensure that the airflow of the cooling fan can more effectively cover the heat source, and improve the overall heat dissipation efficiency. The setting of the buffer component 630 can effectively disperse the weight of the server body, reduce the local pressure on the support component 600, and absorb and disperse the vibration when the server body is running, reduce noise, protect the internal components of the server from vibration, and extend the service life of the equipment. Since part of the target workpiece fits with the buffer component 630, this design helps to evenly distribute the heat generated by the server body, reduce local overheating, improve the uniformity and efficiency of thermal management, and ensure the stability and performance of the server when running under high load.

[0057] Specifically, a slider 640 is also provided in the second slide groove 610, and the connecting component 620 is connected to the slider 640. Through the design of the second slide groove 610 and the slider 640, the server body can slide horizontally on the supporting component 600, which is convenient for adjusting the position of the server body to adapt to different installation requirements. Since there is a certain gap between the server body and the supporting component 600, air circulation is convenient, the heat dissipation efficiency is improved, and the stability of the server body when running under high load is ensured.

[0058] During use, turn on the power supply and start the drive motor. The drive motor drives the drive shaft to rotate. The rotation of the drive shaft is transmitted to the rotating shaft 510 through the transmission component 530, thereby driving the guide fan blade 210 to adjust the angle. Observe whether the guide fan blade 210 is working normally, ensure that the airflow can be discharged smoothly through the heat dissipation hole 2010, confirm that the airflow direction is correct and there is no blockage or obstruction. If the heat dissipation hole 2010 needs to be closed to prevent dust from entering, the handle 310 can be used to slide the dust cover 300 to close it. When dust protection is not needed, the dust cover 300 can be opened to ensure that the heat dissipation hole 2010 is unobstructed. Check the working status of the guide fan blade 210 regularly to ensure its normal operation, clean the heat dissipation hole 2010 regularly to prevent dust accumulation, and open or close the dust cover 300 regularly as needed to adapt to different usage environments.

[0059] Specifically, installation channels 131 are opened on both sides of the installation housing 100 , and a protection frame 133 is fixedly installed on the outer side of the installation channel 131 , and the cross section of the protection frame 133 is circular.

[0060] Furthermore, by reserving the protective frame 133 , it is convenient for the user to set a dustproof mesh cover inside the protective frame 133 in the future, and further improve the dustproof effect of the device during the heat dissipation process.

[0061] Specifically, four groups of guide blades 210 are provided, and two groups of transmission components 530 are provided and both are located on the back side of the mounting housing 100 .

[0062] Specifically, buffer components 630 are provided on both sides of the top of the supporting component 600 and located on the inner side of the mounting shell 100 , and the surface of the buffer component 630 is movably connected to the bottom surface of the server body 700 .

[0063] Furthermore, the buffer component 630 can effectively absorb the vibration generated during the operation of the server body, reduce the impact of the vibration on the server body and the mounting shell 100, and improve the stability and reliability of the server body. The movable connection design enables the buffer component 630 to absorb and disperse the vibration during the operation of the server body, providing a better shock absorption effect.

[0064] Specifically, protective door panels 140 are provided on both sides of the front of the installation shell 100 , and connectors 710 are provided on both sides of the server body 700 .

[0065] Specifically, a protective back plate 150 is disposed on the back of the mounting shell 100 , a fixing member 160 is disposed on the outer side of the protective back plate 150 , and fixing screws 161 are threadedly installed on both sides of the surface of the fixing member 160 .

[0066] Furthermore, the provision of the protective door panel 140 and the protective back panel 150 provides comprehensive physical protection, protecting the server body 700 and its connector 710 from external physical damage and dust intrusion, ensuring the safe operation of the server body 700. The provision of the connector 710 ensures that the connection between the server body 700 and the external device or network is convenient and stable, thereby improving the reliability and stability of data transmission. The provision of the fixing member 160 and the fixing screw 161 ensures that the protective back panel 150 is firmly fixed, thereby improving the overall structural stability of the mounting shell 100 and reducing displacement or loosening caused by vibration or external force.

[0067] When in use, the support component 600 is fixedly installed on the bottom of the inner cavity of the installation shell 100 to ensure that the support component 600 is tightly fitted with the bottom of the installation shell 100, and is fixed with appropriate fixing parts 160 (such as screws) to ensure its stability. A second slide groove 610 is opened on the surface of the support component 600. The design of the second slide groove 610 should ensure that it matches the size of the slider 640 so that the slider 640 can slide smoothly. The slider 640 is slidably installed in the inner cavity of the second slide groove 610. The slider 640 should be able to slide freely in the second slide groove 610 while maintaining stability. The connecting component 620 is fixedly connected to the inner side of the slider 640, and the server body 700 is clamped and installed on the top of the connecting component 620. The installation position of the buffer component 630 should ensure that it can effectively cover the bottom surface of the server body 700.

[0068] In summary, by driving the transmission component 530 to rotate at a small angle through the driving component 520, the position of the guide fan blade 210 can be dynamically adjusted to make it always in the best heat dissipation position. The dynamic adjustment method can dissipate heat more effectively, improve the heat dissipation efficiency, and ensure that the server body 700 can maintain a good operating state even under high load conditions. At the same time, the workload of the server body 700 in different time periods will be different, resulting in changes in heat distribution. By adjusting the angle of the guide fan blade 210, it is possible to better adapt to such changes, so that the heat dissipation intensity of the hot spot area can be increased during high load periods, and the heat dissipation intensity can be appropriately reduced during low load periods, thereby achieving the purpose of energy saving. The design of the support component 600 makes the server body The server body 700 can be easily installed and disassembled. Through the design of the slider 640 and the second slide groove 610, the user can easily push or pull the server body 700 into or out of the installation shell 100, which is convenient for daily maintenance and replacement. At the same time, the design of the buffer component 630 can reduce the vibration of the server body 700 during operation and reduce noise. A dustproof groove 120 is set on the top of the installation shell 100, and a cover 300 is set on the dustproof groove 120. Through the design of the dustproof cover 300 and the handle 310, the user can easily open and close the dustproof cover 300, which not only ensures the ventilation effect of the heat dissipation hole 2010, but also effectively prevents dust from entering the inside of the server body 700, reducing the impact of dust on the operation of the server body 700.

[0069] The present application forms an efficient heat dissipation system by setting a drive component, a transmission component and a heat dissipation part. The drive component drives the transmission component to rotate at a small angle, and the position of the heat dissipation fan (guide blade) can be dynamically adjusted to keep it in the best heat dissipation position at all times. The dynamic adjustment method can dissipate heat more effectively, improve heat dissipation efficiency, and ensure that the server body 700 can maintain a good operating state even under high load conditions. At the same time, the workload of the server body 700 in different time periods will be different, resulting in changes in heat distribution. By adjusting the angle of the heat dissipation fan, it is possible to better adapt to such changes, so that the heat dissipation intensity of the hot spot area can be increased during high load periods, and the heat dissipation intensity can be appropriately reduced during low load periods, thereby achieving the purpose of energy saving and cost reduction; the support component design of the present application allows the server body 700 to be easily installed and disassembled. Through the design of the slider and the slide groove, the user can easily push the server body 700 into or pull it out of the installation frame, which is convenient for daily maintenance and replacement. At the same time, the design of the shock-absorbing pad (buffer component) can reduce the vibration of the server body 700 during operation and reduce noise.

[0070] The high-strength heat dissipation device for servers of the present application comprises a mounting shell 100, both sides of the mounting shell 100 are provided with a driving assembly, a transmission component is provided on the outside of the driving assembly, and a heat dissipation mechanism is provided at the end of the transmission component. The high-strength heat dissipation device for servers forms an efficient heat dissipation system by providing a driving assembly, a transmission component and a heat dissipation mechanism. The position of the heat dissipation fan can be dynamically adjusted by driving the transmission component to rotate at a small angle through the driving assembly, so that it is always in the best heat dissipation position. The dynamic adjustment method can dissipate heat more effectively, improve the heat dissipation efficiency, and ensure that the server body 700 can maintain a good operating state even under high load conditions. At the same time, the workload of the server body 700 in different time periods will be different, resulting in changes in heat distribution. By adjusting the angle of the heat dissipation fan, such changes can be better adapted.

[0071] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0072] The heat dissipation mechanism in the present application includes a mounting shell and a heat dissipation part. The mounting shell is used to mount the target workpiece. A plurality of mounting channels 131 are arranged on at least one wall surface of the mounting shell 100. The heat dissipation part is arranged on the mounting shell. The airflow in the mounting shell flows out through the heat dissipation part. The heat dissipation part 200 includes a fan blade assembly. The fan blade assembly includes a rotating shaft 510 and a plurality of guide fan blades 210. Each guide fan blade 210 is rotatably arranged around its axis. The rotating shaft 510 is rotatably arranged around its axis. The plurality of guide fan blades 210 are all mounted on the rotating shaft 510 so as to rotate synchronously around the axis of the rotating shaft 510 under the drive of the rotating shaft 510. Among them, the plurality of mounting channels 131 are arranged one-to-one correspondingly to the plurality of guide fan blades 210, and each guide fan blade 210 is rotatably mounted in the corresponding mounting channel 131.

[0073] It can be seen that the guide vane 210 is not only rotatable around the first axis (the axis of the guide vane 210) to adapt to the natural flow of the airflow inside the mounting housing 100, but also rotatable around the second axis (the axis of the rotating shaft 510), allowing the user or the control system to adjust the guide angle according to the real-time heat distribution. This flexibility ensures that the airflow is directly and effectively aimed at the heat generation area, significantly improving the heat dissipation efficiency while reducing energy consumption. By adjusting the guide angle of the guide vane 210, the heat dissipation device can adapt to the heat dissipation requirements of the server under different working conditions. Under high load, the inclination angle of the guide vane 210 can be increased to enhance the cooling of the hot spot area; while under low load, the inclination angle is appropriately reduced to reduce unnecessary airflow and achieve energy-saving operation. The adjustability of the guide vane 210 also means that during maintenance and cleaning, the vane angle can be easily adjusted to facilitate cleaning of internal dust accumulation, reduce maintenance costs and time, and maintain the heat dissipation performance of the equipment. The optimized airflow guidance reduces the turbulence and vortex of the airflow in the channel, which helps to reduce the noise generated by the cooling fan during operation and create a quieter working environment. The design of the installation channel 131 enables the second heat dissipation unit 202 to be compactly installed on the side of the server, saving internal space while ensuring that the heat dissipation efficiency is not affected, which is suitable for high-density server environments. The dynamic adjustment capability of the guide vane 210 can help the airflow to be evenly distributed inside the server, avoiding local overheating, thereby improving the stability and service life of the server.

[0074] According to the heat dissipation mechanism provided in the present application, it includes a mounting shell 100, a heat dissipation part 200 and a cover plate 300, wherein the mounting shell 100 is used to mount the target workpiece; the heat dissipation part 200 is arranged on the mounting shell 100, and the airflow in the mounting shell 100 flows out through the heat dissipation part 200, and the cover plate 300 is movably arranged on the mounting shell 100 to shield or avoid the heat dissipation part 200. Through the design of the movable cover plate 300, the heat dissipation mechanism can dynamically shield or avoid the heat dissipation part 200 according to the heat distribution and working state of the target workpiece (such as the server body), thereby achieving more precise heat dissipation control. When a higher heat dissipation is required in a high load or hot spot area, the cover plate 300 can be avoided to ensure that the airflow of the heat dissipation part 200 is unobstructed and improve the heat dissipation efficiency; and when the load is low or there is no need for excessive heat dissipation, the cover plate 300 can shield the heat dissipation part 200, reduce unnecessary energy consumption, and achieve energy saving. The cover plate 300 can also play a dust-proof role when shielding the heat dissipation part 200, reduce the dust from entering the interior of the mounting housing 100, protect the target workpiece and its internal components from dust, extend the service life of the equipment, and reduce the maintenance frequency.

[0075] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0076] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0077] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0078] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0079] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0080] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipation mechanism, characterized in that: include: An installation housing (100) for installing a target workpiece, wherein at least one wall surface of the installation housing (100) is provided with a plurality of installation channels (131); A heat dissipation portion (200) is arranged on the installation shell (100), and the airflow in the installation shell (100) flows out through the heat dissipation portion (200); The heat dissipation part (200) includes a fan blade assembly, the fan blade assembly includes a rotating shaft (510) and a plurality of guide fan blades (210), each of the guide fan blades (210) is rotatably arranged around its axis, the rotating shaft (510) is rotatably arranged around its axis, and the plurality of guide fan blades (210) are all mounted on the rotating shaft (510) so as to rotate synchronously around the axis of the rotating shaft (510) under the drive of the rotating shaft (510); The plurality of installation channels (131) are arranged in one-to-one correspondence with the plurality of guide blades (210), and each guide blade (210) is rotatably installed in the corresponding installation channel (131).

2. The heat dissipation mechanism according to claim 1, characterized in that: The heat dissipation portion (200) comprises a plurality of heat dissipation holes (2010), and the plurality of heat dissipation holes (2010) are arranged on the top plate (110) of the mounting shell (100); the heat dissipation mechanism further comprises: The cover plate (300) is movably arranged on the installation shell (100); on a projection plane parallel to the top plate (110), the cover plate (300) has an overlapping position covering the plurality of heat dissipation holes (2010) and a spaced position spaced apart from the plurality of heat dissipation holes (2010).

3. The heat dissipation mechanism according to claim 2, characterized in that: The heat dissipation mechanism also includes: A mounting component (400) is arranged on the top plate (110), the mounting component (400) is located on the side of the plurality of heat dissipation holes (2010), and the mounting component (400) protrudes relative to the top plate (110); The cover plate (300) is movably arranged on the mounting component (400).

4. The heat dissipation mechanism according to claim 3, characterized in that: There are two mounting components (400), the two mounting components (400) are arranged at intervals along the length direction or the width direction of the mounting housing (100), and the heat dissipation portion (200) is located between the two mounting components (400); Each of the mounting components (400) is provided with a first sliding groove (410), and at least a portion of the cover plate (300) is inserted into the first sliding groove (410) and slides along an extension direction of the first sliding groove (410).

5. The heat dissipation mechanism according to claim 1, characterized in that: The mounting shell (100) further comprises a plurality of side panels (130), and at least one of the side panels (130) is provided with the plurality of mounting channels (131); wherein the rotating shaft (510) is inserted into the side panel (130) from the side surface (132) of the corresponding side panel (130), and sequentially passes through the plurality of mounting channels (131), so that each of the guide blades (210) is respectively mounted on the rotating shaft (510).

6. The heat dissipation mechanism according to claim 1, characterized in that: The heat dissipation mechanism also includes: A driving assembly (500) is arranged on the mounting housing (100); the driving assembly (500) is drivingly connected to the rotating shaft (510) to drive the rotating shaft (510) to rotate around its axis.

7. The heat dissipation mechanism according to claim 6, characterized in that: The drive assembly (500) further comprises: A driving component (520) is arranged on the mounting housing (100), wherein the driving component (520) comprises a driving shaft, and the driving shaft is rotatably arranged around its own axis; a transmission component (530), wherein two ends of the transmission component (530) are respectively connected to the driving shaft and the rotating shaft (510), and the driving shaft drives the rotating shaft (510) to rotate through the transmission component (530); A dustproof box body (540) is arranged on the mounting shell (100), and at least a portion of the driving component (520) is arranged in the dustproof box body (540).

8. The heat dissipation mechanism according to claim 1, characterized in that: The heat dissipation mechanism also includes: A support component (600) is arranged in the mounting shell (100), and a second slide groove (610) is arranged on the support component (600). A connecting component (620) is arranged in the second slide groove (610). The connecting component (620) is movably arranged along the extension direction of the second slide groove (610), and the target workpiece is clamped on the connecting component (620).

9. The heat dissipation mechanism according to claim 8, characterized in that: The supporting component (600) comprises: A first supporting body (601), a second supporting body (602) and a third supporting body (603), wherein the second supporting body (602) and the third supporting body (603) are arranged at intervals along the length direction of the first supporting body (601), and the second supporting body (602) and the third supporting body (603) are respectively provided with a second slide groove (610); Wherein, a buffer component (630) is respectively provided on the top surface of the second supporting body (602) and the top surface of the third supporting body (603), and at least a part of the target workpiece is in contact with the buffer component (630).

10. A server, comprising a heat dissipation mechanism and a server body, wherein at least a portion of the server body is disposed in the heat dissipation mechanism, wherein: The heat dissipation mechanism is the heat dissipation mechanism according to any one of claims 1 to 9.

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