Industrial personal computer heat dissipation structure based on AI assistance and application process thereof

Abstract

The invention relates to the technical field of industrial personal computer heat dissipation, and discloses an industrial personal computer heat dissipation structure based on AI assistance and an application process thereof.The industrial personal computer heat dissipation structure comprises a machine shell and a heat dissipation module located in the machine shell, the heat dissipation module comprises a heat conduction mechanism and a heat dissipation mechanism, and the heat conduction mechanism comprises a heat conduction plate attached to the upper surface of a CPU and a plurality of heat pipes; the heat pipes are arranged in a U shape and evenly distributed in the length direction of the heat conduction plate, the horizontal sections of the heat pipes are sleeved with the heat conduction plate, the heat dissipation mechanism comprises water cooling plates jointly arranged on the vertical sections of the same sides of the heat pipes in a sleeving mode, a cooling fin set and a fan assembly, the cooling fin set and the fan assembly are arranged between the two water cooling plates, and the ends of the cooling fin set make close contact with the water cooling plates on the two sides. The fan assembly comprises an air inlet fan and an air outlet fan, the air inlet fan is arranged on the side wall, located on one side of the air inlet direction of the cooling fin set, in the machine shell, and the air outlet fan is arranged on the side wall, located on one side of the air outlet direction of the cooling fin set, in the machine shell. The heat dissipation efficiency of the industrial personal computer is improved, and meanwhile the maintenance difficulty is reduced.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology for industrial computers, and in particular to an AI-assisted heat dissipation structure for industrial computers and its application process. Background Art

[0002] Industrial computers play an important role in modern industrial automation and data processing systems and are widely used in manufacturing, medical equipment, traffic monitoring and other fields. With the development of technology, the functions of industrial computers are becoming increasingly powerful and the integration is constantly improving, but this also brings about higher heat generation problems. Especially in high-performance computing scenarios, such as high-load operation of the CPU as a core component, heat dissipation becomes a key factor in ensuring equipment stability and extending service life. Efficient heat dissipation can not only prevent performance degradation caused by overheating of the equipment, but also avoid safety hazards caused by high temperature, thereby improving the reliability and stability of the overall system.

[0003] In the existing industrial computer cooling technology, commonly used methods include air cooling, water cooling and mixed cooling. Air cooling usually achieves air circulation by installing multiple fans to take away the heat of the CPU inside the device. Water cooling uses a water cooling plate and coolant to absorb and dissipate heat through a pump-driven circulation. In addition, there is a mixed cooling method that combines air cooling and water cooling, which improves the cooling efficiency through the joint action of multiple means. These methods have solved the heat dissipation problem of industrial computers to a certain extent, but there are still some shortcomings in complex working environments.

[0004] Although the above methods have improved the heat dissipation efficiency of industrial computers to a certain extent, there are still some problems in practical applications. For example, air cooling is difficult to effectively reduce the CPU temperature when running under high load, which can easily lead to overheating of the equipment; although water cooling has a better effect, it has a complex structure, high cost, and difficult maintenance. Therefore, how to simplify the structure, reduce costs, and improve maintenance convenience while ensuring the heat dissipation effect has become an urgent problem to be solved. Summary of the invention

[0005] In order to improve the heat dissipation efficiency of industrial computers while reducing the difficulty of maintenance, this application provides an AI-assisted industrial computer heat dissipation structure and its application process.

[0006] The AI-assisted industrial computer heat dissipation structure and its application process provided in this application adopt the following technical solutions: The heat dissipation structure of an industrial computer based on AI assistance includes a casing and a heat dissipation module located in the casing, the heat dissipation module includes a heat conducting mechanism fitted with the CPU and a heat dissipation mechanism connected to the heat conducting mechanism, the heat conducting mechanism includes a heat conducting plate fitted with the upper surface of the CPU and a plurality of heat pipes penetrated on the heat conducting plate, the heat pipes are arranged in a U-shape and are evenly distributed along the length direction of the heat conducting plate, the heat conducting plate is sleeved on the horizontal sections of the plurality of heat pipes, the heat dissipation mechanism includes a water-cooling plate jointly sleeved on the vertical sections on the same side of the plurality of heat pipes, a heat sink group arranged between the two water-cooling plates, and a fan assembly for cooling the heat sink group, the ends of the heat sink group are in close contact with the water-cooling plates on both sides, the fan assembly includes an intake fan and an exhaust fan, the intake fan is arranged on a side wall in the casing on the side of the air intake direction of the heat sink group, and the exhaust fan is arranged on the side wall in the casing on the side of the air outlet direction of the heat sink group.

[0007] By adopting the above technical solution, when the industrial computer is running, the heat generated by the CPU is quickly transferred to the heat pipe through the heat conduction plate. The coolant in the heat pipe evaporates due to the heat, rises along the vertical section of the heat pipe to the water cooling plate, and transfers the heat to the heat sink group through the water cooling plate. The heat sink group uses the synergistic effect of the intake fan and the exhaust fan to bring the heat out of the casing through air convection, thereby achieving efficient heat dissipation. Through the combined design of the heat conduction plate, heat pipe, water cooling plate and heat sink group, the heat generated by the CPU can be quickly transferred out, effectively reducing the CPU temperature and preventing the equipment from overheating.

[0008] Optionally, a plurality of baffles are arranged in the water cooling plate along the distribution direction of the heat pipe, some of the baffles are connected to the top wall of the inner cavity of the water cooling plate, and the remaining baffles are connected to the bottom wall of the inner cavity of the water cooling plate, and the baffles divide the inner cavity of the water cooling plate into guide channels arranged in a serpentine shape, and one baffle is provided for each of two adjacent baffles of the heat pipe.

[0009] By adopting the above technical solution, a number of staggered baffles separate the inner cavity of the water-cooled plate into a serpentine-shaped flow guide channel, which improves the sufficient heat exchange between the coolant and each heat pipe during the flow of the coolant in the water-cooled plate, thereby improving the heat dissipation effect of the industrial computer.

[0010] Optionally, the upper surface of the CPU facing the heat conducting plate is evenly coated with thermal grease.

[0011] By adopting the above technical solution, thermal grease as a thermal interface material can fill the tiny gap between the CPU and the heat conducting plate, thereby forming a thin, continuous thermal conductive layer, significantly reducing the interface thermal resistance and improving the heat transfer efficiency between the CPU and the heat conducting plate.

[0012] Optionally, a temperature sensor for detecting the temperature of the CPU in real time is arranged on one side of the CPU in the housing, and the temperature sensor is electrically connected to the fan assembly.

[0013] By adopting the above technical solution, the temperature sensor is electrically connected to the fan assembly, so that the ventilation volume of the fan assembly is adjusted according to the temperature of the CPU. It not only intelligently controls the power cost of the fan assembly, but also timely controls the temperature of the CPU, thereby improving the reliability and stability of the heat dissipation structure of the industrial computer.

[0014] Optionally, the relative side walls of the two water-cooled plates are vertically distributed with a plurality of parallel plug-in slots, the plug-in slots are T-shaped, and the ends of the plurality of plug-in slots on the same side in the length direction extend to the side walls of the water-cooled plate, the heat sink group includes a plurality of parallel cooling fins, the cooling fins correspond to the plug-in slots one by one, and the end of each of the cooling fins is provided with a plug-in strip that is plugged into the plug-in slot, the top wall of the water-cooled plate near the open end of the plug-in slot is vertically penetrated by a plurality of plug-in slots, and a pull ring is provided on the top wall of the water-cooled plate extending out of the water-cooled plate, and each of the plug-in strips is limited in the plug-in slot by the sealing plate.

[0015] By adopting the above technical solution, the one-to-one correspondence and plug-in cooperation between the plug-in slots and the plug-in strips make it easy to replace a single heat sink fin independently when it is damaged, avoiding overall replacement, thereby saving equipment maintenance costs and improving maintenance convenience.

[0016] Optionally, each of the heat dissipating fins is provided with a concave strip on the top wall of the end close to the water cooling plate, and a convex strip that plugs into and fits with the concave strip is provided on the bottom wall of the end, and two adjacent heat dissipating fins are vertically limited by the plug-in fit between the relative concave strips and the convex strips.

[0017] By adopting the above technical solution, the positioning of a plurality of heat sink fins in the vertical direction is achieved by plugging and fitting between the relative concave strips and the convex strips, so that the heat sink group is formed into a whole in advance before being assembled on the two water-cooling plates, thereby improving the assembly efficiency of the heat sink structure.

[0018] Optionally, a plurality of positioning posts are arranged around the CPU in the casing, a positioning sleeve is slidably sleeved on each of the positioning posts, a compression spring is connected between the positioning sleeve and the inner bottom wall of the casing, the compression spring is sleeved on the corresponding positioning post, a spherical connecting end is arranged on the top of each of the positioning sleeves, connecting plates are arranged on both sides of the heat conducting plate parallel to the arrangement direction of the heat pipes, a rubber sleeve is arranged on the connecting plate corresponding to each connecting end, and the rubber sleeve is sleeved at the connection between the connecting end and the positioning sleeve.

[0019] By adopting the above technical solution, a rubber ferrule is arranged at the connection between the connecting end and the positioning sleeve to realize the quick connection between the heat conducting plate and the CPU. Compared with connecting the housing and the connecting plate with screws along the diagonal line, the installation method is simpler, and under the elastic action of the compression spring, the excessive pressure of the heat conducting plate on the CPU during connection is reduced, thereby reducing the possibility of damage to the CPU and improving the adaptability to the installation of CPUs of different thicknesses.

[0020] Optionally, the bottom end of the positioning column is threadedly rotated to rotate the adjustment sleeve, and the compression spring is abutted between the adjustment sleeve and the positioning sleeve.

[0021] By adopting the above technical solution, the height of the adjusting sleeve on the positioning column can be adjusted by rotating the adjusting sleeve through the thread on the positioning column, thereby adjusting the tensioning force of the compression spring on the positioning sleeve, avoiding excessive pressure on the CPU by the heat conducting plate, and improving the safety of the heat dissipation device.

[0022] The application process of the AI-assisted industrial computer heat dissipation structure includes the following steps: S1. Apply thermal grease on the surface of CPU; S2. Align the rubber ferrules on the connection plate with the connection ends one by one and press them down until the connection ends pass through the rubber ferrules, so that the heat conducting plate and the CPU surface coated with thermal grease remain in contact; S3, starting the air intake fan and the exhaust fan to form an air circulation path in the casing; S4. Run the industrial computer to transfer the heat generated by the CPU to the heat conducting plate through the thermal grease. The heat conducting plate conducts the heat to the running water cooling plate through the heat pipe. The coolant circulating in the guide channel of the water cooling plate exchanges heat with the heat pipe, thereby dispersing the heat on the heat pipe to the whole body of the water cooling plate, achieving initial cooling, and transferring the excess heat to the heat sink group. The intake fan draws cold air from outside the case, and the cold air passes through the heat sink group to take away the heat, and then the exhaust fan discharges the hot air in the case out of the case. S5. According to the detection result of the temperature sensor, the speed of the intake fan and the exhaust fan is adjusted by the control unit in the industrial computer.

[0023] By adopting the above technical solution, the heat generated by the CPU can be quickly transferred out through the combined design of the heat conduction plate, heat pipe, water cooling plate and heat sink group, effectively reducing the CPU temperature and preventing the equipment from overheating. At the same time, the assembly process of the heat dissipation structure is optimized, and the maintenance convenience of the heat dissipation structure of the industrial computer is improved. In summary, the present application includes at least one of the following beneficial technical effects: 1. When the industrial computer is running, the heat generated by the CPU is quickly transferred to the heat pipe through the heat conduction plate. The coolant in the heat pipe evaporates due to the heat, rises along the vertical section of the heat pipe to the water cooling plate, and transfers the heat to the heat sink group through the water cooling plate. The heat sink group uses the synergistic effect of the intake fan and the exhaust fan to bring the heat out of the case through air convection, thereby achieving efficient heat dissipation. The combined design of the heat conduction plate, heat pipe, water cooling plate and heat sink group can quickly transfer the heat generated by the CPU, effectively reduce the CPU temperature and prevent the equipment from overheating; 2. Several staggered baffles separate the inner cavity of the water-cooling plate into serpentine-shaped flow channels, which improves the sufficient heat exchange between the coolant and each heat pipe during the flow of the water-cooling plate, thereby improving the heat dissipation effect of the industrial computer; 3. As a thermal interface material, thermal grease can fill the tiny gap between the CPU and the heat conducting plate, thus forming a thin, continuous thermal conductive layer, which significantly reduces the interface thermal resistance and improves the heat transfer efficiency between the CPU and the heat conducting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0025] Figure 2 It is a schematic diagram of the internal structure of the shell in the embodiment of the present application.

[0026] Figure 3 It is a schematic diagram of the connection relationship between the heat conduction mechanism and the CPU in the embodiment of the present application.

[0027] Figure 4 It is a cross-sectional view showing the internal structure of the water cooling plate in the embodiment of the present application.

[0028] Description of reference numerals: 01. CPU; 1. Casing; 11. Central control screen; 12. Air inlet; 121. Filter plate; 13. Limiting card slot; 2. Heat dissipation module; 3. Heat conduction mechanism; 31. Heat conduction plate; 32. Heat pipe; 4. Heat dissipation mechanism; 41. Water cooling plate; 411. Baffle plate; 412. Plug slot; 42. Heat sink assembly; 421. Heat dissipation fin; 4211. Plug strip; 422. Concave strip; 423. Convex strip; 43. Fan assembly; 431. Intake fan; 4311. Block; 432. Exhaust fan; 5. Thermal grease; 6. Connectors; 61. Connecting plate; 611. Rubber ferrule; 62. Positioning column; 621. Adjustment sleeve; 622. Compression spring; 63. Positioning sleeve; 64. Connecting end; 7. Sealing plate; 71. Pull ring; 8. Temperature sensor. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-4 This application is described in further detail.

[0030] The embodiments of the present application disclose an AI-assisted heat dissipation structure for an industrial computer and its application process.

[0031] Reference Figures 1 to 3 The AI-assisted heat dissipation structure of industrial control computers and its application process include a housing 1 and a heat dissipation module 2. A central control screen 11 is fixedly arranged on the side wall of the housing 1, and an air inlet 12 is fixedly arranged on the side of the central control screen 11 on the housing 1, and a filter plate 121 is bolted to the air inlet 12. The heat dissipation module 2 is located at the position of the CPU01 in the housing 1, and includes a heat conduction mechanism 3 and a heat dissipation mechanism 4, wherein the heat conduction mechanism 3 includes a heat conduction plate 31 and a heat pipe 32, the heat pipe 32 is arranged in a U shape, and a plurality of heat conduction plates 31 are evenly distributed along the length direction of the heat conduction plate 31. In this embodiment, six heat pipes are taken as an example, and the heat conduction plates 31 are fixedly sleeved on the horizontal sections of the six heat pipes 32. The upper surface of the CPU01 is evenly coated with thermal grease 5, and the heat conduction plate 31 is in contact with the surface of the CPU01 coated with the thermal grease 5, and the heat conduction plate 31 is installed in the housing 1 through a connector 6 to keep in contact with the surface of the CPU01. The heat dissipation mechanism 4 includes a water-cooling plate 41, a heat sink group 42 and a fan assembly 43. The water-cooling plate 41 is fixedly sleeved on the vertical section on the same side of the six heat pipes 32, and two water-cooling plates 41 are arranged in parallel, and the heat sink group 42 is connected between the two water-cooling plates 41, and the ends of the heat sink group 42 are in close contact with the water-cooling plates 41 on both sides.

[0032] Reference Figures 1 to 3 When the industrial computer is running, the heat generated by CPU01 is quickly transferred to the heat pipe 32 through the heat conducting plate 31. The coolant in the heat pipe 32 evaporates due to the heat, and rises to the water cooling plate 41 along the vertical section of the heat pipe 32. Part of the heat is transferred to the heat sink group 42 through the water cooling plate 41, and then the fan assembly 43 takes the heat on the heat sink group 42 out of the housing 1 through air convection, thereby achieving efficient heat dissipation.

[0033] Reference Figure 3 The connecting member 6 includes a connecting plate 61, a positioning column 62, a positioning sleeve 63 and a connecting terminal 64. The connecting plate 61 is fixedly arranged on the end side wall of the heat conducting plate 31 parallel to the arrangement direction of the heat pipe 32. The positioning column 62 is located directly below the connecting plate 61 and is fixedly arranged on the inner bottom wall of the casing 1, and one is provided at each end of the corresponding connecting plate 61 in the length direction. The positioning sleeve 63 is slidably sleeved on the positioning column 62. The connecting terminal 64 is spherically fixedly arranged on the top of the positioning sleeve 63. A rubber sleeve 611 is fixedly arranged on the connecting plate 61 corresponding to each connecting terminal 64. When the connecting plate 61 is connected to the positioning sleeve 63, the rubber sleeve 611 is sleeved at the connection between the connecting terminal 64 and the positioning sleeve 63.

[0034] Reference Figure 3In order to reduce the damage to CPU01, the bottom end of the positioning column 62 is threadedly rotated to adjust the sleeve 621, and a compression spring 622 is abutted between the adjustment sleeve 621 and the positioning sleeve 63, and the compression spring 622 is sleeved on the positioning column 62.

[0035] Reference Figure 4 A plurality of baffles 411 are arranged in the water-cooling plate 41 along the distribution direction of the heat pipes 32. Some of the baffles 411 are fixed on the top wall of the inner cavity of the water-cooling plate 41, and the remaining baffles 411 are fixed on the bottom wall of the inner cavity of the water-cooling plate 41. The baffles 411 separate the inner cavity of the water-cooling plate 41 into guide channels arranged in a serpentine shape, and one baffle 411 is arranged between two adjacent baffles 411 where the heat pipes 32 are located.

[0036] Reference Figure 3 , the opposite side walls of the two water-cooling plates 41 are vertically distributed with a plurality of parallel plug-in slots 412, the plug-in slots 412 are T-shaped, and the ends of the plurality of plug-in slots 412 on the same side in the length direction extend to the side walls of the water-cooling plate 41, the heat sink group 42 includes a plurality of parallel heat dissipation fins 421, the heat dissipation fins 421 correspond to the plug-in slots 412 one by one, and a plug-in strip 4211 is fixedly provided at the end of each heat dissipation fin 421, the plug-in strip 4211 is plugged into and matched with the corresponding plug-in slot 412, the top wall of the water-cooling plate 41 near the open end of the plug-in slot 412 vertically penetrates the plurality of plug-in slots 412 and is plugged with a blocking plate 7, and a pull ring 71 is fixedly provided on the top wall of the blocking plate 7 extending out of the water-cooling plate 41, and each plug-in strip 4211 is limited in the plug-in slot 412 by the blocking plate 7.

[0037] Reference Figure 3 When a single damaged heat sink fin 421 needs to be replaced, the user only needs to remove the sealing plate 7 through the pull ring 71, and then replace the damaged heat sink fin 421, and then insert the sealing plate 7 back to its original position.

[0038] Reference Figure 3 In order to improve the installation efficiency of the heat dissipation fins 421, a concave strip 422 is fixedly provided on the top wall of the end of each heat dissipation fin 421 close to the water-cooling plate 41, and a convex strip 423 is fixedly provided on the bottom wall of the end thereof. The convex strip 423 is plugged into and matched with the concave strip 422. The two adjacent heat dissipation fins 421 are limited in the vertical direction by the plug-in cooperation between the relative concave strips 422 and the convex strips 423, so that they can only slide and cooperate in the horizontal direction, thereby improving the working stability of the heat dissipation fin group 42.

[0039] Reference Figure 2The fan assembly 43 includes an intake fan 431 and an exhaust fan 432. The intake fan 431 is arranged on the side wall of the housing 1 on the side of the air intake direction of the heat sink group 42, and is located at the air inlet 12. The inner side wall of the housing 1 is fixedly provided with limit slots 13 on both sides of the intake fan 431. A block 4311 is integrally formed on the housing of the intake fan 431 corresponding to the limit slots 13. The intake fan 431 is located between the two limit slots 13, and the block 4311 and the limit slot 13 are vertically slidably matched. Similarly, the exhaust fan 432 is installed on the side wall of the housing 1 on the side of the air outlet direction of the heat sink group 42. The replaceable assembly of the intake fan 431 and the exhaust fan 432 is convenient for users to replace damaged intake fans 431 and exhaust fans 432 in time.

[0040] Reference Figure 2 In order to intelligently control the rotation speed of the fan assembly 43 , a temperature sensor 8 for real-time detection of the temperature of the CPU 01 is installed on one side of the CPU 01 in the housing 1 , and the temperature sensor 8 is electrically connected to the fan assembly 43 .

[0041] The application process of the AI-assisted industrial computer heat dissipation structure includes the following steps: S1, apply thermal conductive silicone grease 5 on the surface of CPU01; S2, align the rubber sleeves 611 on the connecting plate 61 with the connecting terminals 64 one by one and press them down until the connecting terminals 64 pass through the rubber sleeves 611, so that the heat conducting plate 31 and the surface of the CPU 01 coated with the thermal grease 5 are kept in contact; S3, starting the intake fan 431 and the exhaust fan 432 to form an air circulation path in the housing 1; S4, run the industrial computer, so that the heat generated by CPU01 is transferred to the heat conducting plate 31 through the thermal grease 5, and the heat conducting plate 31 conducts the heat to the running water cooling plate 41 through the heat pipe 32, and the coolant circulating in the guide channel in the water cooling plate 41 exchanges heat with the heat pipe 32, so that the heat on the heat pipe 32 is dispersed to the whole body of the water cooling plate 41, and the initial cooling is achieved, and the excess heat is transferred to the heat sink group 42, and the intake fan 431 sucks cold air from the outside of the housing 1, and the cold air passes through the heat sink group 42 to take away the heat, and then the exhaust fan 432 discharges the hot air in the housing 1 out of the housing 1; S5. According to the detection result of the temperature sensor 8, the rotation speeds of the intake fan 431 and the exhaust fan 432 are adjusted by the control unit in the industrial computer.

[0042] The implementation principle of the AI-assisted heat dissipation structure of the industrial computer and its application process in the embodiment of the present application is as follows: the industrial computer is operated, and the heat generated by the CPU01 is transferred to the heat conducting plate 31 through the thermal grease 5. The heat conducting plate 31 conducts the heat to the running water-cooling plate 41 through the heat pipe 32, and the heat exchange between the coolant circulating in the guide channel in the water-cooling plate 41 and the heat pipe 32 is carried out, so that the heat on the heat pipe 32 is dispersed to the whole body of the water-cooling plate 41, achieving preliminary cooling, and transferring the excess heat to the heat sink group 42, the intake fan 431 sucks in cold air from outside the casing 1, and the cold air passes through the heat sink group 42 to take away the heat, and then the exhaust fan 432 discharges the hot air in the casing 1 out of the casing 1.

[0043] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. The AI-assisted industrial computer heat dissipation structure is characterized by , comprising a housing (1) and a heat dissipation module (2) located in the housing (1), the heat dissipation module (2) comprising a heat conduction mechanism (3) arranged in close contact with a CPU (01) and a heat dissipation mechanism (4) connected to the heat conduction mechanism (3), the heat conduction mechanism (3) comprising a heat conduction plate (31) arranged in close contact with the upper surface of the CPU (01) and a plurality of heat pipes (32) passing through the heat conduction plate (31), the heat pipes (32) being arranged in a U shape and evenly distributed along the length direction of the heat conduction plate (31), the heat conduction plate (31) being sleeved on the horizontal sections of the plurality of heat pipes (32), the heat dissipation mechanism (4) comprising heat conduction plates (31) and heat pipes (32) being sleeved together on the upper surface of the CPU (01), A water cooling plate (41) on the vertical section on the same side of a plurality of heat pipes (32), a heat sink group (42) arranged between two water cooling plates (41), and a fan assembly (43) for cooling the heat sink group (42), wherein the ends of the heat sink group (42) are in close contact with the water cooling plates (41) on both sides, and the fan assembly (43) comprises an intake fan (431) and an exhaust fan (432), wherein the intake fan (431) is arranged on a side wall of the casing (1) on the side of the heat sink group (42) in the air intake direction, and the exhaust fan (432) is arranged on a side wall of the casing (1) on the side of the heat sink group (42) in the air outlet direction.

2. The AI-assisted industrial computer heat dissipation structure according to claim 1 is characterized in that A plurality of baffles (411) are arranged inside the water cooling plate (41) along the distribution direction of the heat pipe (32), some of the baffles (411) are connected to the top wall of the inner cavity of the water cooling plate (41), and the remaining baffles (411) are connected to the bottom wall of the inner cavity of the water cooling plate (41), and the plurality of baffles (411) separate the inner cavity of the water cooling plate (41) into guide channels arranged in a serpentine shape, and one baffle (411) is arranged on each of two adjacent baffles (411) where the heat pipe (32) is located.

3. The AI-assisted industrial computer heat dissipation structure according to claim 1 is characterized in that The upper surface of the CPU (01) facing the heat conducting plate (31) is evenly coated with thermal conductive silicone grease (5).

4. The AI-assisted industrial computer heat dissipation structure according to claim 1 is characterized in that A temperature sensor (8) for detecting the temperature of the CPU (01) in real time is provided on one side of the CPU (01) in the housing (1), and the temperature sensor (8) is electrically connected to the fan assembly (43).

5. The AI-assisted industrial computer heat dissipation structure according to claim 1 is characterized in that The opposite side walls of the two water-cooling plates (41) are vertically distributed with a plurality of parallel plug-in slots (412), the plug-in slots (412) are arranged in a T-shape, and the ends of the plurality of plug-in slots (412) on the same side in the length direction extend to the side wall of the water-cooling plate (41), the heat sink group (42) includes a plurality of parallel heat sink fins (421), the heat sink fins (421) correspond one to one with the plug-in slots (412), and each heat sink The ends of the fins (421) are each provided with a plug strip (4211) that is plugged into the plug slot (412); a top wall of the water cooling plate (41) close to the open end of the plug slot (412) is vertically penetrated through a plurality of plug slots (412) and plugged with a blocking plate (7); and a pull ring (71) is provided on the top wall of the blocking plate (7) extending out of the water cooling plate (41); and each of the plug strips (4211) is limited in position in the plug slot (412) by the blocking plate (7).

6. The AI-assisted industrial computer heat dissipation structure according to claim 5 is characterized in that Each of the heat dissipation fins (421) is provided with a concave strip (422) on the top wall of the end portion close to the water cooling plate (41), and a convex strip (423) plug-fitting with the concave strip (422) is provided on the bottom wall of the end portion, and two adjacent heat dissipation fins (421) are vertically limited by plugging and fitting between the relative concave strips (422) and the convex strips (423).

7. The AI-assisted industrial computer heat dissipation structure according to claim 1 is characterized in that The casing (1) is provided with a plurality of positioning posts (62) around the CPU (01), each of the positioning posts (62) being slidably sleeved with a positioning sleeve (63), a compression spring (622) being connected between the positioning sleeve (63) and the inner bottom wall of the casing (1), the compression spring (622) being sleeved on the corresponding positioning post (62), the top of each positioning sleeve (63) being provided with a spherical connecting end (64), the heat conducting plate (31) being provided with connecting plates (61) on both sides parallel to the arrangement direction of the heat pipes (32), the connecting plate (61) being provided with a rubber sleeve (611) corresponding to each connecting end (64), the rubber sleeve (611) being sleeved at the connection between the connecting end (64) and the positioning sleeve (63).

8. The AI-assisted industrial computer heat dissipation structure according to claim 7 is characterized in that The bottom end of the positioning column (62) is threadedly rotated to rotate the adjusting sleeve (621), and the compression spring (622) is abutted between the adjusting sleeve (621) and the positioning sleeve (63).

9. The application process of the AI-assisted industrial computer heat dissipation structure is characterized by: The following steps are involved: S1, applying thermal conductive silicone grease (5) on the surface of CPU (01); S2, aligning the rubber sleeves (611) on the connecting plate (61) with the connecting ends (64) one by one and pressing them down until the connecting ends (64) pass through the rubber sleeves (611), so that the heat conducting plate (31) and the surface of the CPU (01) coated with the thermal grease (5) remain in contact with each other; S3, starting the air intake fan (431) and the exhaust fan (432) to form an air circulation path in the housing (1); S4, running the industrial computer, so that the heat generated by the CPU (01) is transferred to the heat conducting plate (31) through the thermal grease (5), and the heat conducting plate (31) conducts the heat to the running water cooling plate (41) through the heat pipe (32), and the heat exchange between the coolant circulating in the guide channel in the water cooling plate (41) and the heat pipe (32) is carried out, so that the heat on the heat pipe (32) is dispersed to the surrounding of the water cooling plate (41), achieving initial cooling, and the excess heat is transferred to the heat sink group (42), the intake fan (431) sucks cold air from outside the casing (1), the cold air passes through the heat sink group (42) to take away the heat, and then the exhaust fan (432) discharges the hot air in the casing (1) out of the casing (1); S5. According to the detection result of the temperature sensor (8), the rotation speeds of the intake fan (431) and the exhaust fan (432) are adjusted by a control unit in the industrial computer.

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