Server, eddy current-based server temperature control method and device, and medium

Abstract

The invention provides a server, an eddy current-based server temperature control method, eddy current-based server temperature control equipment and a medium, the server comprises a server mainboard, an eddy current unit and a power supply unit, and the server mainboard is provided with at least one server element; the eddy current heating unit comprises at least one coil, and the coil is arranged at the position, corresponding to the server element, of the server mainboard and used for heating the server element; and the power supply unit is respectively connected with the eddy current heating unit and the server mainboard and is used for supplying power to the eddy current heating unit and the server mainboard. Server elements are heated through heat energy generated by eddy current, extra energy input is not needed, energy consumption is reduced, and the server can be rapidly heated even in a severe cold environment.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and in particular to a temperature control method, device, equipment and medium for a server based on eddy current. Background Art

[0002] Edge servers refer to any type of server that resides on the logical edge of a network, typically between a private network and the Internet. The computing power of edge servers is rapidly shaping the modern industrial landscape, and the emergence of dynamic applications and modern business infrastructure has made rapid processing and sharing of data inevitable. As various new application scenarios emerge, edge server technology is now gradually replacing traditional centralized servers to meet this growing demand.

[0003] Unlike other common servers in computer rooms, edge servers face harsher, more diverse, and more uncertain environments. For example, the most common severe cold environment may reach minus 40 degrees Celsius or even lower, which is a severe test for any electronic product. In such an environment, edge servers often fail to boot up and cannot enter normal working state, which in turn affects the normal use of edge servers. Therefore, it is crucial to control the temperature of the server within the working range.

[0004] Most existing solutions for heating servers use indirect heating using heating elements such as resistance wires and heating plates, that is, the inner and outer surfaces of the heating elements generate heat and the heat of the heating elements is transferred to the server. However, most of the heat generated by this method will be dissipated into the air, causing direct loss and waste of electricity, and is not suitable for servers in severe cold environments. Summary of the invention

[0005] The present invention provides a temperature control method, device, equipment and medium for a server based on eddy current, which are used to solve the defects of the prior art that heating the server causes waste of electric energy and is not suitable for severe cold environments, thereby saving energy consumption of the server and being suitable for severe cold environments.

[0006] The present invention provides a server, comprising: A server mainboard, wherein at least one server element is arranged on the server mainboard; an eddy current heating unit, the eddy current heating unit comprising at least one coil, the coil being arranged at a position corresponding to the server element on the server mainboard and being used for heating the server element; A power supply unit is connected to the eddy current heating unit and the server mainboard respectively, and is used to supply power to the eddy current heating unit and the server mainboard.

[0007] According to a server provided by the present invention, the eddy current heating unit also includes at least one control switch, which is respectively connected to the power supply module and the corresponding coil, and the control switch corresponds to the coil one by one, and is used to control each coil to be connected or disconnected from the power supply unit.

[0008] According to a server provided by the present invention, the server element includes a first controller, a temperature detection unit, and a second controller; The second controller is connected to the first controller, the temperature detection unit and the eddy current heating unit respectively.

[0009] According to a server provided by the present invention, the server element further includes a processor, a memory module and a hard disk module; The first controller is connected to the processor, the memory module and the hard disk module respectively, and the second controller is connected to the processor, the memory module and the hard disk module respectively.

[0010] According to a server provided by the present invention, the eddy current heating unit includes a plurality of coils with different numbers of turns.

[0011] The present invention further provides a temperature control method of a server based on eddy current, which is applied to any of the above-mentioned servers, and the method comprises: If it is detected that the server is powered on, obtaining temperature information of the server; Determining whether it is necessary to heat the server element to be heated in the server according to the temperature information; If the server element to be heated needs to be heated, the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit to heat the server element to be heated.

[0012] According to a temperature control method of a server based on eddy current provided by the present invention, the server element includes a first controller, a temperature detection unit, and a second controller; the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit, including: Controlling, by the second controller, that the coil corresponding to the first controller is connected to the power supply unit; If it is determined by the second controller that the operating temperature of the first controller reaches a preset temperature threshold, after the first controller completes self-checking, a power-on instruction is sent to the server by the first controller; wherein the operating temperature of the first controller is determined by the temperature information collected by the temperature detection unit; The power-on sequence of each of the server elements is obtained, and based on the power-on sequence, the coil corresponding to each of the server elements to be heated is controlled to be connected to the power supply unit, and the power-on instruction is executed.

[0013] According to a temperature control method of a server based on eddy current provided by the present invention, the server element further includes a processor, a memory module, and a hard disk module; after the coils corresponding to the server elements to be heated are turned on based on the power-on sequence, the method further includes: Obtaining the working status of the server; When the working state indicates that the server is in a normal working state, controlling the coil corresponding to each of the server elements to be heated to be connected to the power supply unit until the working temperature of each of the server elements to be heated reaches a preset temperature threshold corresponding to each of the server elements to be heated; When the working state indicates that the processor stops working and the server components other than the processor work normally, the coil corresponding to the processor is controlled to be disconnected from the power supply unit; When the working state indicates that the processor is turned off and the server components other than the processor are working normally, controlling the coil corresponding to the processor to be disconnected from the power supply unit; After the operating state represents that the operating data of the server is written into the memory module, when each of the server components is turned off, the coils corresponding to the memory and the first controller are controlled to be connected to the power supply unit, and the coils corresponding to the server components other than the memory module and the first controller are controlled to be disconnected from the power supply unit; When the working state represents that the memory information of the server is written into the hard disk module and each of the server elements stops working, the coils corresponding to the hard disk module and the first controller are controlled to be turned on, and the coils corresponding to the server elements other than the hard disk module and the first controller are controlled to be disconnected from the power supply unit; When the working state indicates that the server is in a shutdown state, the coils corresponding to the server elements to be heated are controlled to be disconnected from the power supply unit.

[0014] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, a temperature control method for a server based on eddy current as described above is implemented.

[0015] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the temperature control method of a server based on eddy current as described in any one of the above is implemented.

[0016] The present invention also provides a computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the temperature control method of a server based on eddy current is implemented as described in any one of the above.

[0017] The temperature control method, device, equipment and medium of the server based on eddy current provided by the present invention respectively configure a coil for the server components that need to be heated on the server motherboard. The coil is powered by the power supply unit, and the server components are directly heated by the heat energy generated by the eddy current, without the need for additional energy input, thus reducing energy consumption. At the same time, since the heat energy generated by the eddy current is generated by the resistance inside the conductor, and does not need to be transmitted layer by layer from the outside to the inside, the server can be quickly heated even in a severe cold environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is one of the structural diagrams of the server provided by the present invention.

[0020] Figure 2 It is a structural schematic diagram of the eddy current heating unit provided by the present invention.

[0021] Figure 3 This is the second structural diagram of the server provided by the present invention.

[0022] Figure 4 This is the third structural diagram of the server provided by the present invention.

[0023] Figure 5 This is the fourth structural diagram of the server provided by the present invention.

[0024] Figure 6 This is the fifth structural diagram of the server provided by the present invention.

[0025] Figure 7 It is one of the flow charts of the temperature control method of the server based on eddy current provided by the present invention.

[0026] Figure 8This is the second flow chart of the temperature control method of the server based on eddy current provided by the present invention.

[0027] Fig. 9 It is a structural schematic diagram of the electronic device provided by the present invention.

[0028] Reference numerals: 100: server mainboard; 101: temperature detection unit; 102: chip; 200: eddy current heating unit; 201: coil; 202: control switch; 300: power supply unit; 400: chassis. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The existing heating method is to form a heating plate by winding a resistance wire. The heating plate generates heat on both sides. One side is close to the server motherboard part, and then the heat is conducted to the inside, while the heat on the other side of the heating surface is mostly lost to the air, causing direct loss and waste of electric energy. In addition, since the heat required by the chip is transferred through the server motherboard, and the heat of the motherboard comes from the heating plate, the temperature of the heating plate will be normal, but the temperature of the chip is still insufficient. When the chip reaches the normal working temperature, the temperature of the heating plate will often be too high. At this time, the heating is stopped, and the heat of the heating plate will still be transferred to the motherboard and the chip, causing the chip to exceed the preset temperature. In this way, there will always be inconsistencies between the temperature of the heating plate and the motherboard and the chip part, which also brings troubles to the precise control of the temperature. Due to the large amount of heat loss, the ambient temperature rises, especially in hot weather, which has a great impact on the production environment. Some on-site working temperatures have exceeded 45 degrees, resulting in the use of air conditioning to reduce the temperature, resulting in secondary waste of energy. Since the use of resistance wire for heating requires a higher heating temperature, the resistance wire is easily burned due to high temperature aging. The service life of common resistance wire is only half a year, so the maintenance workload is relatively large, and at the same time, the production cost also increases.

[0031] Therefore, in order to solve the above problems, the present invention provides a server, a temperature control method, a device and a medium for the server based on eddy current. Figure 1-Figure 9 The present invention describes a server, a temperature control method, a device and a medium of the server based on eddy current.

[0032] Figure 1FIG. 1 is a schematic diagram showing the structure of a server according to an exemplary embodiment. Figure 1 As shown, in an exemplary embodiment, the server includes: A server mainboard 100, on which at least one server element is disposed; An eddy current heating unit 200, the eddy current heating unit 200 comprises at least a coil 201, the coil 201 is arranged at a corresponding position of the server element on the server mainboard 100, and is used to heat the server element; A power supply unit 300 is connected to the eddy current heating unit 200 and the server mainboard 100 respectively, and is used to supply power to the eddy current heating unit 200 and the server mainboard 100 .

[0033] In the embodiment of the present invention, Figure 1 and Figure 2 As shown, the eddy current heating unit 200 heats the server components that need to be heated on the server motherboard 100 based on the current provided by the power supply unit 300. The number of coils on the eddy current heating unit 200 corresponds to the number of server components that need to be heated on the server motherboard 100, and each server component that needs to be heated is configured with a coil. The coils are configured at the corresponding positions of the server components that need to be heated, so that the server components are located within the heating range of the corresponding coils.

[0034] Eddy current heating is a heating method that uses electromagnetic induction to generate eddy currents and heats objects through the heat energy generated by the eddy currents. The principle of eddy current heating is based on the physical principles of Faraday's law of electromagnetic induction and Joule's heating effect. It generates eddy currents in conductors through alternating magnetic fields, causing the conductors to heat up. Eddy current heating is widely used in industrial fields such as metal heating, and has the advantages of rapid heating, low energy consumption, and environmental protection.

[0035] The basic principle of eddy current heating is that when a conductor is placed in an alternating magnetic field, an induced current will be generated inside the conductor. This induced current is called eddy current. The generation of eddy current is based on Faraday's law of electromagnetic induction, that is, when a conductor moves in a magnetic field or the magnetic field changes, an induced electromotive force will be generated inside the conductor, thereby generating eddy current. The heat energy generated by eddy current mainly comes from the Joule heating effect generated by eddy current on the internal resistance of the conductor material, that is, the heat generated by the resistance of the conductor itself when the eddy current flows inside the conductor.

[0036] The principle of eddy current heating can be described by a simple formula, namely Joule's law, P=I 2R, where P is the heat generated per unit time, I is the current intensity of the eddy current, and R is the resistance of the conductor. It can be seen that the heat generated by eddy current heating is proportional to the current intensity of the eddy current and the resistance of the conductor, so the heating process can be controlled by controlling the current intensity of the eddy current and the resistance of the conductor. In the server of the present invention, the resistance of the server is determined, so the present invention changes the heating power by controlling the magnitude of the current input into the eddy current heating unit 200 by the power supply unit 300, thereby achieving precise heating of the server element to be heated.

[0037] Eddy current heating has the advantage of rapid heating. This is because eddy current heating uses electromagnetic induction to generate eddy currents, so it can heat the conductor in a very short time. Therefore, this is very important for some processes that require rapid heating and can greatly improve efficiency. At the same time, because eddy current heating directly heats the conductor through the heat energy generated by eddy currents, no additional energy input is required, so energy consumption can be reduced, which meets the requirements of energy conservation and environmental protection. Moreover, since the eddy current generating unit itself does not generate heat, as long as the power supply is stopped, the heating of the server element to be heated will stop, unlike the resistance heater, which will have more waste heat to continue to conduct outward, which makes it possible to accurately control the temperature.

[0038] In addition, eddy current heating also has the advantages of uniform heating and easy operation. This is because the heat energy generated by the eddy current is generated by the resistance inside the conductor, and does not need to be transferred layer by layer from the outside to the inside, so the conductor can be uniformly heated, avoiding local overheating or overcooling. In addition, the operation of the eddy current heating unit 200 is also relatively simple. It only needs to control the current intensity input therein to control the heating process, which is convenient to operate.

[0039] In the embodiment of the present invention, the eddy current heating unit 200 is as follows Figure 2 As shown, the current input is supplied by the power supply unit 300, and the positions of the coils 201 in the eddy current heating unit 200 can be arranged according to the position of the chip 102 on the server motherboard 100 and the link layout. Specifically, when designing the eddy current heating unit, the positions of the coils are reasonably arranged according to the position information of the server components to be heated on the server motherboard, so that each server component can fall into the magnetic field of its corresponding coil, that is, within the heating range of the corresponding coil, and the layout and structure of the coil can be optimized.

[0040] In an exemplary embodiment of the present invention, the structural diagram of the server is as follows Figure 3 , 4 As shown in FIG. 5 , the server includes a chassis 400 that accommodates an eddy current heating unit 200 and a server motherboard 100. The eddy current heating unit 200 can be located at various positions in the chassis 400, and is not necessarily fixed on the base of the chassis 400. Figure 3 As shown, the eddy current heating unit 200 is attached between the base of the chassis 400 and the server motherboard 100. Figure 4 As shown, the eddy current heating unit 200 is disposed on the side of the server mainboard 100. Figure 5 As shown, the eddy current heating unit 200 is disposed at the upper cover of the chassis 400. By changing the location of the eddy current heating unit 200, it can adapt to servers with different structures.

[0041] In an exemplary embodiment of the present invention, the eddy current heating unit 200 also includes at least one control switch 202, and the control switch 202 is respectively connected to the power supply module and the corresponding coil 201, and the control switch corresponds to the coil one by one, and is used to control each coil 201 to be connected or disconnected with the power supply unit 300.

[0042] In the embodiment of the present invention, Figure 2 As shown, each coil 201 is provided with an independent control switch 202. By turning on or off the control switch 202, the conduction or disconnection between the coil 201 and the power supply unit 300 is realized, thereby turning the heating on or off. At the same time, by independently controlling the conduction or off of each control switch 202, zoned heating of the server motherboard 100 can be achieved to meet the requirements of different working states.

[0043] In an exemplary embodiment of the present invention, the server element includes a first controller, a temperature detection unit 101 and a second controller.

[0044] The second controller is connected to the first controller, the temperature detection unit 101 and the eddy current heating unit 200 respectively.

[0045] In the embodiment of the present invention, Figure 6 As shown, a first controller, a temperature detection unit 101 and a second controller are provided on the server mainboard 100, and the second controller is respectively connected to the first controller, the temperature detection unit 101 and the eddy current heating unit 200 by signals. In the embodiment of the present invention, the first controller includes a baseboard management controller (Baseboard Management Controller, BMC), and the second controller includes a complex programmable logic device (Complex Programmable Logic Device, CPLD).

[0046] The temperature detection unit 101 includes a temperature sensor for collecting temperature information of the server or each server component.

[0047] The second controller is used to determine whether to start the eddy current heating unit 200 based on the temperature information collected by the temperature detection unit 101 .

[0048] The first controller may also be used to determine whether to start the eddy current heating unit 200 based on the temperature information collected by the temperature detection unit 101 .

[0049] In an exemplary embodiment of the present invention, the server element further includes a processor, a memory module and a hard disk module.

[0050] The first controller is connected to the processor, the memory module and the hard disk module respectively, and the complex programmable logic device is connected to the processor, the memory module and the hard disk module respectively.

[0051] In the embodiment of the present invention, Figure 6 As shown, the server mainboard 100 is also provided with a processor (CPU), a memory module (MEM), a hard disk module (Disk) and a chip 102 .

[0052] In an exemplary embodiment of the present invention, the eddy current heating unit 200 includes a plurality of coils 201 with different numbers of turns.

[0053] In the embodiment of the present invention, Figure 2 As shown, the number of turns of each coil 201 in the eddy current heating unit 200 may be different, and the number of turns of the coil 201 may be set according to the working temperature requirements of the corresponding server element. That is, for server elements with higher working temperature requirements, high-density coils 201 with more turns can be used to achieve faster heating.

[0054] Figure 7 FIG. 1 is a flow chart showing a method for controlling the temperature of a server based on eddy current according to an exemplary embodiment. Figure 7 As shown, in an exemplary embodiment, the temperature control method of a server based on eddy current is applied to any of the servers described above, including steps 710 to 730, which are described in detail as follows.

[0055] Step 710: If it is detected that the server is powered on, obtain the temperature information of the server.

[0056] In the embodiment of the present invention, after detecting that the server is powered on, the temperature information of the server is obtained to determine whether the server needs to be heated. The temperature information of the server can be determined by the temperature information of the server components with higher temperature requirements in the server motherboard. The temperature requirements of each server component can be obtained according to the optimal working temperature of each server component, and the temperature information of the server components with the top N temperature requirements is selected to determine the temperature information of the server.

[0057] The temperature information of the server may also be determined based on the temperature information of the environment in which the server is located, that is, the temperature value of the environment in which the server is located is directly collected as the temperature information of the server.

[0058] Step 720: Determine whether it is necessary to heat the server element to be heated in the server according to the temperature information.

[0059] In the embodiment of the present invention, whether the server element to be heated in the server needs to be heated is determined according to the temperature information, and the server element to be heated is the server element on the server mainboard that needs to be heated.

[0060] Step 730: If the server element to be heated needs to be heated, the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit to heat the server element to be heated.

[0061] In the embodiment of the present invention, when the server element to be heated needs to be heated, the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit so that the current in the power supply unit flows into the coil to achieve eddy current heating.

[0062] In one embodiment of the present invention, Figure 8 As shown, Figure 8 It is a flow chart of a temperature control method of a server based on eddy current according to an exemplary embodiment. The temperature control method of a server based on eddy current includes steps 810 to 830, which are described in detail as follows.

[0063] Step 810, obtaining temperature information of the server; wherein the temperature information of the server includes temperature data of each server component to be heated.

[0064] In the embodiment of the present invention, the temperature data of each server element to be heated is collected by a temperature detection unit.

[0065] Step 820: Determine whether it is necessary to heat the server components to be heated corresponding to the temperature data according to the temperature data.

[0066] In an embodiment of the present invention, whether the corresponding server element to be heated needs to be heated is determined based on the temperature data of each server element to be heated. A corresponding preset temperature threshold can be set in advance for each server element to be heated, and the temperature data of each server element to be heated is compared with the corresponding preset temperature threshold. If the temperature data of the server element to be heated is lower than the corresponding preset temperature threshold, it is determined that the server element to be heated needs to be heated.

[0067] Step 830: If it is determined that the server element to be heated needs to be heated, the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit based on the temperature data to heat the server element to be heated.

[0068] In the embodiment of the present invention, whether to heat each server element to be heated is determined based on its respective temperature data. When it is determined that heating is required, the corresponding coil of the server element to be heated is controlled to be turned on with the power supply unit according to the corresponding temperature data, so as to achieve accurate control of heating of each server element to be heated. Specifically, when heating, the current flowing into the coil corresponding to the server element to be heated can be determined based on the difference between the temperature data and the preset temperature threshold, so that the server element to be heated can quickly raise its temperature to the preset temperature threshold, so that the server element to be heated can quickly start working.

[0069] In an exemplary embodiment of the present invention, the server element includes a first controller, a temperature detection unit, and a second controller; the controlling the coil corresponding to the server element to be heated to be connected to the power supply unit includes the following steps, which are described in detail as follows.

[0070] The coil corresponding to the first controller is controlled by the second controller to be connected to the power supply unit.

[0071] If it is determined through the second controller that the operating temperature of the first controller reaches a preset temperature threshold, after the first controller completes self-test, a power-on command is sent to the server through the first controller; wherein the operating temperature of the first controller is determined by the temperature information collected by the temperature detection unit.

[0072] The power-on sequence of each of the server elements is obtained, and based on the power-on sequence, the coil corresponding to each of the server elements to be heated is controlled to be connected to the power supply unit, and the power-on instruction is executed.

[0073] In an embodiment of the present invention, when the server is powered on, the power supply unit is first started to supply power to the complex programmable logic device and the temperature detection unit, and the server as a whole is not powered on immediately. The temperature detection unit detects the temperature information of the server. Furthermore, the temperature detection unit can also detect the temperature information of each server component, so as to facilitate the subsequent fine heating of each server component. The complex programmable logic device obtains the temperature information from the temperature detection unit, compares the temperature information with the preset temperature threshold, and when the temperature information is lower than the preset temperature threshold, it determines that the temperature is too low, and transmits a heating signal to the eddy current heating unit. After receiving the heating signal, the eddy current heating unit connects the coil corresponding to the baseboard management controller with the power supply unit according to the heating signal, and at this time, the baseboard management controller is heated first.

[0074] When the operating temperature of the baseboard management controller reaches the preset temperature threshold and completes the self-test, a power-on command is sent to the server main line. The preset temperature threshold can be the minimum temperature required for the baseboard management controller to work, or it can be the optimal temperature for the baseboard management controller to work. In the embodiment of the present invention, after the server is powered on, the power-on command is not executed. At this time, only the heating of the baseboard management controller is turned on to make it in an activated state, so as to ensure that after the power-on command is executed, the server can enter the working state as quickly as possible.

[0075] For a server, the power-on sequence is the power supply sequence of the server components on the server motherboard. From the initial voltage input of the voltage adapter to the final generation of the entire server power supply, there is a strict start-up sequence control. Therefore, the server motherboard has very strict requirements for power-on. Various necessary conditions for power-on must have a sequence, and only when one condition is met can it proceed to the next step. In the embodiment of the present invention, according to the power-on sequence of each server component on the server motherboard, the corresponding heating sequence of each server component is set to ensure the normal startup of the server motherboard, so as to achieve higher efficiency and lower energy consumption.

[0076] In the embodiment of the present invention, according to the power-on sequence, if the processor is set to be powered on first, the eddy current heating unit will first heat the processor to put the processor into an operational state, and then heat and power on the memory module, and so on, until the server enters a normal working environment.

[0077] The temperature of the server motherboard and its server components rises under the operation of the eddy current heating unit. The temperature detection unit continuously reads the temperature information of each server component and transmits it to the baseboard management controller. The baseboard management controller continuously obtains the temperature information and compares it with the preset temperature threshold. If the temperature information is lower than the temperature threshold, a signal is sent to the eddy current heating unit, and the eddy current heating unit continues to work; if the temperature is within the normal operating temperature range, a signal is sent to the eddy current heating unit, and the eddy current heating unit suspends work or reduces the current input to the corresponding coil. When the temperature of all server components is normal, the power-on command is executed, the server is powered on, and enters the working state.

[0078] In an exemplary embodiment of the present invention, the server element further includes a processor, a memory module, and a hard disk module; after turning on the coils corresponding to each of the server elements to be heated based on the power-on sequence, the method further includes the following steps, which are described in detail as follows.

[0079] Get the working status of the server.

[0080] When the working state indicates that the server is in a normal working state, the coil corresponding to each of the server elements to be heated is controlled to be turned on by the power supply unit until the working temperature of each of the server elements to be heated reaches a preset temperature threshold corresponding to each of the server elements to be heated.

[0081] When the working state indicates that the processor stops working and the server components other than the processor work normally, the coil corresponding to the processor is controlled to be disconnected from the power supply unit.

[0082] When the working state indicates that the processor is turned off and the server components other than the processor are working normally, the coil corresponding to the processor is controlled to be disconnected from the power supply unit.

[0083] After the operating state represents that the operating data of the server is written into the memory module, when each of the server components is turned off, the coils corresponding to the memory and the first controller are controlled to be connected to the power supply unit, and the coils corresponding to the server components other than the memory module and the first controller are controlled to be disconnected from the power supply unit.

[0084] When the working state represents that the memory information of the server is written into the hard disk module and each of the server components stops working, the coils corresponding to the hard disk module and the first controller are controlled to be turned on, and the coils corresponding to the server components other than the hard disk module and the first controller are controlled to be disconnected from the power supply unit.

[0085] When the working state indicates that the server is in a shutdown state, the coils corresponding to the server elements to be heated are controlled to be disconnected from the power supply unit.

[0086] In the embodiment of the present invention, ACPI (Advanced Configuration and Power Interface) is an industrial standard. ACPI divides the computer system into six different working states, namely S0 to S5, which represent the following meanings: S0 indicates that the computer system is working normally, that is, all hardware devices in the computer system are turned on or working normally; S1 is also called POS (Power on Suspend), which means the CPU stops working while other hardware devices still work normally. S2 means the CPU is turned off, but the rest of the hardware devices are still working normally. S3 is usually called STR (Suspend to RAM), which means writing the running data of the computer system into the memory and shutting down other hardware devices. S4 is also called STD (Suspend to Disk), which means writing the computer system's memory information to the hard disk and shutting down all hardware devices. S5 indicates that all hardware devices (including power supply) are turned off, that is, the shutdown state.

[0087] The above states S1, S2, S3, and S4 are called hibernation states, and a system in one of these states does not perform any computing tasks and appears to be in a powered-off state. However, unlike a system in a powered-off state (S5), a system in hibernation retains its memory state in RAM or on disk, and the operating system can restore the computer to a working state without restarting.

[0088] The embodiment of the present invention sets different heating modes according to different working states of the server to further optimize the heating effect. For server components that are not involved in the work, the local heating power is reduced, and for server components that are directly powered off, the heating is stopped, thereby reducing the loss of the server and the waste of electricity.

[0089] Specifically, the working status of the server is obtained. If the working status indicates that the server is in a normal working state and all server components are turned on or working normally, all coils and power supply units can be controlled to be turned on to meet the working temperature suitable for each server component.

[0090] If the acquired working state indicates that the processor stops working, and other server components are still working normally, that is, the dormant state S1, the coil corresponding to the control processor is disconnected from the power supply unit, and the heating of the processor is stopped. The heating of other server components to be heated is still turned on to reduce the energy consumption of the server. In another embodiment of the present invention, when the acquired working state is in the dormant state S1, the current input from the power supply unit to the coil corresponding to the processor can be reduced so that the operating temperature of the processor is maintained within the set temperature range, avoiding the need to reheat the processor when the processor is started.

[0091] If the obtained working status indicates that the processor is turned off, other server components are still working normally, that is, sleep state S2, at this time, the coil corresponding to the control processor is disconnected from the power supply unit, and the heating of the processor is stopped. The heating of other server components to be heated is still turned on to reduce server energy consumption.

[0092] If the obtained working status indicates that the server's operating data is written into the memory module, and other server components except the memory module are turned off, that is, the sleep state S3, only the coils corresponding to the first controller and the memory module are connected to the power supply unit, and the connection between the coils corresponding to other server components and the power supply unit is disconnected, so as to greatly reduce the server energy consumption.

[0093] If the obtained working status represents that the server's memory information is written into the hard disk module, then all server components stop working, that is, the sleep state S4. At this time, only the coils corresponding to the first controller and the hard disk module are connected to the power supply unit, and the connection between the coils corresponding to other server components and the power supply unit is disconnected, so as to greatly reduce the server energy consumption.

[0094] If the acquired working status indicates that all server components are turned off, that is, in a shutdown state, the coils corresponding to all server components are disconnected from the power supply units to reduce the energy consumption of the server.

[0095] Fig. 9 An example of a physical structure diagram of an electronic device is shown in FIG. Fig. 9 As shown, the electronic device may include: a processor 910, a communication interface 920, a memory 930 and a communication bus 940, wherein the processor 910, the communication interface 920 and the memory 930 communicate with each other through the communication bus 940. The processor 910 may call the logic instructions in the memory 930 to execute the temperature control method of the server based on eddy current, the method comprising: if it is detected that the server is powered on, obtaining the temperature information of the server; Determining whether it is necessary to heat the server element to be heated in the server according to the temperature information; If the server element to be heated needs to be heated, the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit to heat the server element to be heated.

[0096] In addition, the logic instructions in the above-mentioned memory 930 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0097] On the other hand, the present invention further provides a computer program product, the computer program product includes a computer program, the computer program can be stored in a non-transitory computer-readable storage medium, when the computer program is executed by a processor, the computer can execute the temperature control method of the server based on eddy current provided by the above methods, the method includes: if it is detected that the server is powered on, obtaining the temperature information of the server; Determining whether it is necessary to heat the server element to be heated in the server according to the temperature information; If the server element to be heated needs to be heated, the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit to heat the server element to be heated.

[0098] In another aspect, the present invention further provides a non-transitory computer-readable storage medium having a computer program stored thereon, which is implemented when the computer program is executed by a processor to execute the temperature control method of the server based on eddy current provided by the above methods, the method comprising: if it is detected that the server is powered on, obtaining the temperature information of the server; Determining whether it is necessary to heat the server element to be heated in the server according to the temperature information; If the server element to be heated needs to be heated, the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit to heat the server element to be heated.

[0099] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0100] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A server, characterized in that: include: A server mainboard, wherein at least one server element is arranged on the server mainboard; an eddy current heating unit, the eddy current heating unit comprising at least one coil, the coil being arranged at a position corresponding to the server element on the server mainboard and being used for heating the server element; A power supply unit is connected to the eddy current heating unit and the server mainboard respectively, and is used to supply power to the eddy current heating unit and the server mainboard.

2. The server according to claim 1, characterized in that: The eddy current heating unit further comprises at least one control switch, which is respectively connected to the power supply module and the corresponding coil, and the control switch corresponds to the coil one by one, and is used to control each coil to be connected or disconnected with the power supply unit.

3. The server according to claim 1, characterized in that: The server element includes a first controller, a temperature detection unit, and a second controller; The second controller is connected to the first controller, the temperature detection unit and the eddy current heating unit respectively.

4. The server according to claim 3, characterized in that: The server element also includes a processor, a memory module and a hard disk module; The first controller is connected to the processor, the memory module and the hard disk module respectively, and the second controller is connected to the processor, the memory module and the hard disk module respectively.

5. The server according to any one of claims 1 to 4, characterized in that: The eddy current heating unit includes a plurality of coils with different numbers of turns.

6. A temperature control method for a server based on eddy current, characterized in that: Applied to the server according to any one of claims 1 to 5, the method comprising: If it is detected that the server is powered on, obtaining temperature information of the server; Determining whether it is necessary to heat the server element to be heated in the server according to the temperature information; If the server element to be heated needs to be heated, the coil corresponding to the server element to be heated is controlled to be connected to the power supply unit to heat the server element to be heated.

7. The temperature control method of a server based on eddy current according to claim 6, characterized in that: The server element includes a first controller, a temperature detection unit, and a second controller; the step of controlling the coil corresponding to the server element to be heated to be connected to the power supply unit includes: Controlling, by the second controller, that the coil corresponding to the first controller is connected to the power supply unit; If it is determined by the second controller that the operating temperature of the first controller reaches a preset temperature threshold, after the first controller completes self-checking, a power-on instruction is sent to the server by the first controller; wherein the operating temperature of the first controller is determined by the temperature information collected by the temperature detection unit; The power-on sequence of each of the server elements is obtained, and based on the power-on sequence, the coil corresponding to each of the server elements to be heated is controlled to be connected to the power supply unit, and the power-on instruction is executed.

8. The temperature control method of a server based on eddy current according to claim 7, characterized in that: The server element further includes a processor, a memory module, and a hard disk module; after turning on the coils corresponding to the server elements to be heated based on the power-on sequence, the method further includes: Obtaining the working status of the server; When the working state indicates that the server is in a normal working state, controlling the coil corresponding to each of the server elements to be heated to be connected to the power supply unit until the working temperature of each of the server elements to be heated reaches a preset temperature threshold corresponding to each of the server elements to be heated; When the working state indicates that the processor stops working and the server components other than the processor work normally, the coil corresponding to the processor is controlled to be disconnected from the power supply unit; When the working state indicates that the processor is turned off and the server components other than the processor are working normally, controlling the coil corresponding to the processor to be disconnected from the power supply unit; After the operating state represents that the operating data of the server is written into the memory module, when each of the server components is turned off, the coils corresponding to the memory and the first controller are controlled to be connected to the power supply unit, and the coils corresponding to the server components other than the memory module and the first controller are controlled to be disconnected from the power supply unit; When the working state represents that the memory information of the server is written into the hard disk module and each of the server elements stops working, the coils corresponding to the hard disk module and the first controller are controlled to be turned on, and the coils corresponding to the server elements other than the hard disk module and the first controller are controlled to be disconnected from the power supply unit; When the working state indicates that the server is in a shutdown state, the coils corresponding to the server elements to be heated are controlled to be disconnected from the power supply unit.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the temperature control method of the server based on eddy current is implemented as described in any one of claims 6 to 8.

10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the temperature control method of a server based on eddy current is implemented as claimed in any one of claims 6 to 8.

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