Vacuum-pumping system, semiconductor process equipment and vacuum-pumping method

Abstract

The invention relates to a vacuumizing system, semiconductor process equipment and a vacuumizing method. The vacuumizing system is used for vacuumizing a process chamber of semiconductor process equipment and comprises an energy storage module, a vacuumizing module and a gating control module. And the energy storage module is connected with the process chamber. The vacuumizing module is connected with the process chamber and the energy storage module. The gating control module is respectively connected with the energy storage module and the vacuumizing module, and is configured as follows: in an energy storage stage, the vacuumizing module and the energy storage module are conducted, so that the energy storage module stores output energy of the vacuumizing module; in the first pressure reduction stage, the energy storage module and the process chamber are conducted, so that the energy storage module conducts pressure reduction on the process chamber for the first time; and in the second depressurization stage, connection between the energy storage module and the process chamber and connection between the energy storage module and the vacuumizing module are cut off, and the vacuumizing module and the process chamber are conducted, so that the vacuumizing module depressurizes the process chamber for the second time. The energy storage stage is located in an interval stage corresponding to a process procedure in the process chamber.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a vacuum pumping system, semiconductor process equipment and a vacuum pumping method. Background Art

[0002] Most of the process steps involved in semiconductor manufacturing, such as deposition, plating / coating, and ion implantation, need to be carried out in a vacuum environment in a process chamber. However, in the related art, the vacuum environment of the process chamber is achieved by vacuuming with a vacuum pump or vacuum pumping equipment, which has the problems of a long process of reducing the pressure in the process chamber, a short effective working time of the vacuum pump or vacuum pumping equipment, and a high construction cost. Summary of the invention

[0003] Based on this, the embodiments of the present application provide a vacuum pumping system, semiconductor process equipment and a vacuum pumping method, which can shorten the pressure reduction time of the process chamber and reduce the construction cost of the vacuum pumping system, thereby helping to improve the production efficiency of the semiconductor process and reduce its production cost.

[0004] In order to achieve the above-mentioned purpose, on the one hand, some embodiments of the present application provide a vacuum system for vacuuming the process chamber of a semiconductor process equipment. The vacuum system includes: an energy storage module, a vacuum module and a gating control module. Among them, the energy storage module is connected to the process chamber. The vacuum module is connected to the process chamber and the energy storage module respectively. The gating control module is connected to the energy storage module and the vacuum module respectively, and is configured as follows: in the energy storage stage, the vacuum module and the energy storage module are turned on, so that the energy storage module stores the output energy of the vacuum module; in the first pressure reduction stage, the energy storage module and the process chamber are turned on, so that the energy storage module performs the first pressure reduction on the process chamber; in the second pressure reduction stage, the connection between the energy storage module and the process chamber and between the energy storage module and the vacuum module is turned off, and the vacuum module and the process chamber are turned on, so that the vacuum module performs the second pressure reduction on the process chamber. The energy storage stage is located in the interval stage of the corresponding process in the process chamber.

[0005] In some embodiments of the present application, the vacuum system further includes a pressure acquisition module, which is connected to the process chamber and the energy storage module respectively, and is used to collect the first gas pressure in the process chamber and the second gas pressure in the energy storage module in real time.

[0006] Correspondingly, the gating control module is also connected to the pressure acquisition module and is configured to: in the energy storage stage, make the second gas pressure reach the first target pressure; in the first pressure reduction stage, make the first gas pressure approach or equal to the second gas pressure; and in the second pressure reduction stage, make the first gas pressure reach the second target pressure. The second target pressure is less than the first target pressure.

[0007] In some embodiments of the present application, the energy storage module includes: an energy storage device, a first control valve and a second control valve. The first control valve connects the energy storage device and the vacuum module. The second control valve connects the energy storage device and the process chamber.

[0008] Correspondingly, the gating control module is connected to the first control valve and the second control valve respectively, and is configured to: turn on the first control valve in the energy storage stage; turn on the second control valve in the first pressure reduction stage; and turn off the first control valve and the second control valve in the second pressure reduction stage.

[0009] Illustratively, the energy storage device includes a vacuum tank.

[0010] In some embodiments of the present application, the vacuum pumping module includes: a vacuum pumping device and a third control valve. The third control valve connects the vacuum pumping device and the process chamber.

[0011] Correspondingly, the gating control module is connected to the third control valve and is configured to: turn off the third control valve in the energy storage stage and the first pressure reduction stage; and turn on the third control valve in the second pressure reduction stage.

[0012] Illustratively, the vacuuming device comprises a vacuum pump.

[0013] In some other embodiments of the present application, the vacuum module includes: a vacuum device. The energy storage module includes: an energy storage device, and a first control valve connecting the energy storage device and the vacuum device. The vacuum system also includes: a three-way valve. The three-way valve has a first port, a second port and a third port; the first port is connected to the process chamber, the second port is connected to the energy storage device, and the third port is connected to the vacuum device.

[0014] Correspondingly, the selection control module is connected to the first control valve and the three-way valve respectively, and is configured as follows: in the energy storage stage, the first control valve is turned on; in the first pressure reduction stage, the first port and the second port in the three-way valve are turned on; in the second pressure reduction stage, the first control valve and the first port and the second port in the three-way valve are turned off, and the first port and the third port in the three-way valve are turned on.

[0015] On the other hand, the present application also provides a semiconductor process equipment according to some embodiments, including a vacuum pumping system as described in any of the above embodiments.

[0016] On the other hand, the present application also provides a vacuum pumping method according to some embodiments, which is applied to the vacuum pumping system or semiconductor process equipment described in some embodiments above. The vacuum pumping method includes an energy storage stage, a first pressure reduction stage and a second pressure reduction stage. The energy storage stage is located in the interval stage of the corresponding process in the process chamber. The vacuum pumping method includes the following steps.

[0017] In the energy storage stage, the vacuum pumping module and the energy storage module are turned on so that the energy storage module stores the output energy of the vacuum pumping module.

[0018] In the first pressure reduction stage, the energy storage module and the process chamber are connected so that the energy storage module reduces the pressure of the process chamber for the first time.

[0019] In the second pressure reduction stage, the connection between the energy storage module and the process chamber and between the energy storage module and the vacuum module is cut off, and the vacuum module and the process chamber are connected, so that the vacuum module reduces the pressure of the process chamber for the second time.

[0020] In some embodiments of the present application, the vacuuming method further includes the following steps.

[0021] The first gas pressure in the process chamber and the second gas pressure in the energy storage module are collected in real time.

[0022] During the energy storage stage, the second gas pressure in the energy storage module is made to reach the first target pressure.

[0023] In the first pressure reduction stage, the first gas pressure in the process chamber is made to approach or be equal to the second gas pressure in the energy storage module.

[0024] In the second pressure reduction stage, the pressure of the first gas in the process chamber is made to reach a second target pressure.

[0025] Illustratively, the second target pressure is lower than the first target pressure.

[0026] The embodiments of the present application may or at least have the following advantages:

[0027] In the embodiment of the present application, the interval stage of the process corresponding to the process in the process chamber is used as the energy storage stage, and the vacuum module and the energy storage module can be turned on during the energy storage stage, so that the energy storage module stores the output energy of the vacuum module. In this way, when the process starts to be executed in the process chamber, the energy storage module and the process chamber can be turned on first to enter the first pressure reduction stage, so as to achieve rapid pressure reduction of the process chamber (i.e., the first pressure reduction), and after the rapid pressure reduction of the process chamber, the second pressure reduction stage can be entered, the connection between the energy storage module and the process chamber and between the energy storage module and the vacuum module is cut off, and the vacuum module and the process chamber are turned on, so that the vacuum module directly reduces the pressure of the process chamber continuously (the second pressure reduction).

[0028] Therefore, the vacuum system provided by the embodiment of the present application can utilize the interval stage of the process to store energy in the energy storage module, and can quickly reduce the pressure of the process chamber through the energy storage module at the beginning of the process, and directly reduce the pressure through the vacuum module after the process chamber is reduced to a certain degree, thereby ensuring that the energy storage module and the vacuum module both work in an effective time, and can take into account the pressure reduction speed of the energy storage module to reduce the pressure of the process chamber and the continuous pressure reduction ability of the vacuum module to the medium and low pressure process chambers, so as to effectively shorten the pressure reduction time required for the process chamber to achieve a vacuum environment. In addition, the vacuum system provided by the embodiment of the present application can also avoid the use of a larger volume of energy storage modules and a larger number of vacuum modules, thereby avoiding energy waste and reducing the construction cost of the vacuum system. In summary, the embodiment of the present application is conducive to improving the production efficiency of semiconductor processes and reducing their production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 is a schematic structural diagram of a vacuum pumping system provided in some embodiments;

[0031] Figure 2 is a schematic structural diagram of another vacuum pumping system provided in some embodiments;

[0032] Figure 3 It is a structural schematic diagram of another vacuum pumping system provided in some embodiments;

[0033] Figure 4 for Figure 3 The schematic diagram of the working state of the vacuum pumping system in the energy storage stage, the first pressure reduction stage and the second pressure reduction stage is shown;

[0034] Figure 5 It is a structural schematic diagram of another vacuum pumping system provided in some embodiments;

[0035] Figure 6 A schematic flow chart of a vacuuming method provided in some embodiments;

[0036] Figure 7 A pressure drop curve diagram of a process chamber during a first pressure drop stage and a second pressure drop stage is provided in some embodiments.

[0037] Description of reference numerals:

[0038] 10-process chamber, 20-energy storage module, 21-energy storage device, 22-first control valve, 23-second control valve, 30-vacuum pumping module, 31-vacuum pumping device, 32-third control valve, 40-selection control module, 50-pressure acquisition module, 60-three-way valve. DETAILED DESCRIPTION

[0039] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0041] It should be understood that when an element or layer is referred to as being "on," "adjacent to," or "connected to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be an intervening element or layer. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, doping types, and / or portions, these elements, components, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, doping type, or portion from another element, component, region, layer, doping type, or portion. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion.

[0042] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0043] The embodiments of the present application provide a vacuum pumping system, semiconductor process equipment and a vacuum pumping method for evacuating the process chamber of the semiconductor process equipment for application in various semiconductor-related process steps such as deposition process, plating / coating process and ion implantation process, thereby shortening the pressure reduction time of the process chamber and reducing the construction cost of the vacuum pumping system, thereby facilitating improving the production efficiency of the semiconductor process and reducing its production cost.

[0044] See also Figure 1 The vacuum pumping system includes: an energy storage module 20, a vacuum pumping module 30 and a gating control module 40. The energy storage module 20 is connected to the process chamber 10. The vacuum pumping module 30 is connected to the process chamber 10 and the energy storage module 20 respectively. The gating control module 40 is connected to the energy storage module 20 and the vacuum pumping module 30 respectively, and is configured as follows: in the energy storage stage, the vacuum pumping module 30 and the energy storage module 20 are connected, so that the energy storage module 20 stores the output energy of the vacuum pumping module 30; in the first pressure reduction stage, the energy storage module 20 and the process chamber 10 are connected, so that the energy storage module 20 reduces the pressure of the process chamber 10 for the first time; in the second pressure reduction stage, the connection between the energy storage module 20 and the process chamber 10 and between the energy storage module 20 and the vacuum pumping module 30 is cut off, and the vacuum pumping module 30 and the process chamber 10 are connected, so that the vacuum pumping module 30 reduces the pressure of the process chamber 10 for the second time. The energy storage stage is located in the interval stage of the corresponding process in the process chamber.

[0045] In the embodiment of the present application, the interval stage of the process corresponding to the process in the process chamber 10 is used as the energy storage stage, and the vacuum module 30 and the energy storage module 20 can be turned on during the energy storage stage, so that the energy storage module 20 stores the output energy of the vacuum module 30. In this way, when the process starts to be executed in the process chamber 10, the energy storage module 20 and the process chamber 10 can be turned on first to enter the first pressure reduction stage, so as to achieve rapid pressure reduction of the process chamber 10 (i.e., the first pressure reduction), and after the rapid pressure reduction of the process chamber 10, the second pressure reduction stage can be entered, the connection between the energy storage module 20 and the process chamber 10 and between the energy storage module 20 and the vacuum module 30 is cut off, and the vacuum module 30 and the process chamber 10 are turned on, so that the vacuum module 30 directly reduces the pressure of the process chamber 10 continuously (the second pressure reduction).

[0046] Therefore, the vacuum pumping system provided in the embodiment of the present application can utilize the interval stages of the process to store energy in the energy storage module 20, and can quickly reduce the pressure of the process chamber 10 through the energy storage module 20 at the beginning of the process, and directly reduce the pressure through the vacuum pumping module 30 after the process chamber 10 is reduced to a certain level, thereby ensuring that both the energy storage module 20 and the vacuum pumping module 30 work in an effective time, and can take into account the pressure reduction speed of the energy storage module 20 for reducing the pressure of the process chamber 10 and the continuous pressure reduction capability of the vacuum pumping module 30 for the medium and low pressure process chamber 10, so as to effectively shorten the pressure reduction time required for the process chamber 10 to achieve a vacuum environment. Furthermore, the vacuum pumping system provided by the embodiment of the present application can also avoid using a larger volume energy storage module (for example, if the energy storage module is always used to reduce the pressure of the medium and low pressure process chambers, the volume of the energy storage module needs to be doubled, and the volume of the energy storage module may even be required to be more than 1000 times that of the process chamber) and a large number of vacuum pumping modules (for example, if the process chamber is directly reduced in pressure by relying solely on the vacuum pumping module, a large number of vacuum pumping modules need to be configured simultaneously to match the process requirements), thereby avoiding energy waste and reducing the cost of building the vacuum pumping system. In summary, the embodiment of the present application is conducive to improving the production efficiency of semiconductor processes and reducing their production costs.

[0047] In some embodiments of this application, please refer to Figure 2 The vacuum pumping system further includes a pressure acquisition module 50. The pressure acquisition module 50 is connected to the process chamber 10 and the energy storage module 20 respectively, and is used to collect the first gas pressure in the process chamber 10 and the second gas pressure in the energy storage module 20 in real time.

[0048] Correspondingly, the gating control module 40 is also connected to the pressure acquisition module 50, and is configured to: in the energy storage stage, make the second gas pressure in the energy storage module 20 reach the first target pressure; in the first pressure reduction stage, make the first gas pressure in the process chamber 10 approach or equal to the second gas pressure in the energy storage module 20; and in the second pressure reduction stage, make the first gas pressure in the process chamber 10 reach the second target pressure. The second target pressure is less than the first target pressure, and the second target pressure is, for example, vacuum pressure.

[0049] For example, the pressure acquisition module 50 includes pressure sensors respectively disposed in the process chamber 10 and the energy storage module 20. The gating control module 40 is connected to each pressure sensor and can perform corresponding gating control actions according to the gas pressure transmitted by each pressure sensor.

[0050] In the embodiment of the present application, the first gas pressure in the process chamber 10 and the second gas pressure in the energy storage module 20 are collected in real time by the pressure acquisition module 50, and the first gas pressure and the second gas pressure are fed back to the gating control module 40, so that the gating control module 40 can easily realize automatic and precise control of the energy storage module 20 and the vacuum module 30, so as to further improve the production efficiency and production yield of the semiconductor process.

[0051] In some embodiments of this application, please refer to Figure 3 The energy storage module 20 includes: an energy storage device 21, a first control valve 22, and a second control valve 23. The first control valve 22 connects the energy storage device 21 and the vacuum module 30. The second control valve 23 connects the energy storage device 21 and the process chamber 10. Correspondingly, the gating control module 40 is connected to the first control valve 22 and the second control valve 23, respectively, and is configured to: in the energy storage stage, turn on the first control valve 22; in the first pressure reduction stage, turn on the second control valve 23; in the second pressure reduction stage, turn off the first control valve 22 and the second control valve 23.

[0052] For example, the energy storage device 21 includes but is not limited to a vacuum tank, and may also be other energy storage and pressure reduction devices that can store energy and reduce the pressure of the process chamber 10 .

[0053] Please continue reading Figure 3 In some embodiments of the present application, the vacuum module 30 includes: a vacuum device 31 and a third control valve 32. The third control valve 32 connects the vacuum device 31 and the process chamber 10. Accordingly, the gating control module 40 is connected to the third control valve 32 and is configured to: turn off the third control valve 32 in the energy storage stage and the first pressure reduction stage; and turn on the third control valve 32 in the second pressure reduction stage.

[0054] By way of example, the vacuum extraction device 31 includes, but is not limited to, a vacuum pump.

[0055] It should be added that Figure 3 Taking the vacuum pumping system shown in the figure as an example, the following embodiments describe in detail the method of using the vacuum pumping system, especially the on-off status of each control valve in the vacuum pumping system at different stages.

[0056] See also Figure 4 , Figure 4 Figure (a) is a schematic diagram of the working state of the vacuum system in the energy storage stage. Figure 4 Figure (b) is a schematic diagram of the working state of the vacuum system in the first pressure reduction stage. Figure 4 Figure (c) in the figure is a schematic diagram of the working state of the vacuum system in the second pressure reduction stage. Figure 4As shown in FIG. 1 (a), the gate control module 40 selects to conduct the first control valve 22 and keeps the second control valve 23 and the third control valve 32 closed. In the first pressure reduction stage, Figure 4 As shown in FIG. (b), the gating control module 40 selects to conduct the first control valve 22 and the second control valve 23, and keeps the third control valve 32 closed, and the energy storage device 21 quickly reduces the pressure of the process chamber 10. When the first gas pressure in the process chamber 10 is similar (equal or close) to the second gas pressure in the energy storage module 20, the second pressure reduction stage is entered. In the second pressure reduction stage, Figure 4 As shown in FIG. 5( c ), the gating control module 40 selects to close the first control valve 22 and the second control valve 23 , and selects to open the third control valve 32 , and the vacuum pumping device 31 continuously reduces the pressure of the process chamber 10 .

[0057] It is understood that in some embodiments, the gating control module 40 includes a controller. The controller can also be connected to the energy storage device 21 and / or the vacuum device 31 to control the operation of the energy storage device 21 and / or the vacuum device 31, for example, to control the start and shut down thereof and adjust the operation parameters thereof.

[0058] In other embodiments of the present application, the vacuum system may also adopt other structural designs. Figure 5 The vacuum pumping module 30 includes: a vacuum pumping device 31. The energy storage module 20 includes: an energy storage device 21, and a first control valve 22 connecting the energy storage device 21 and the vacuum pumping device 31. The vacuum pumping system also includes: a three-way valve 60. The three-way valve 60 has a first port, a second port and a third port; the first port is connected to the process chamber 10, the second port is connected to the energy storage device 21, and the third port is connected to the vacuum pumping device 31.

[0059] Correspondingly, the selection control module 40 is connected to the first control valve 22 and the three-way valve 60, respectively, and is configured as follows: in the energy storage stage, the first control valve 22 is turned on; in the first pressure reduction stage, the first port and the second port in the three-way valve 60 are turned on; in the second pressure reduction stage, the first control valve 22 and the first port and the second port in the three-way valve 60 are turned off, and the first port and the third port in the three-way valve 60 are turned on.

[0060] Understandably, Figure 5 The vacuum system shown in Figure 3 The vacuum system shown in is similar in use. Figure 5 The method of using the vacuum system shown can refer to the above Figure 3 The method of using the vacuum system shown is adaptive and will not be described in detail here.

[0061] In the embodiment of the present application, a three-way valve 60 is used to connect the process chamber 10, the energy storage device 21 and the vacuum pumping device 31, which can reduce the number of related control valves in the vacuum pumping system, thereby simplifying the structure of the vacuum pumping system.

[0062] Some embodiments of the present application further provide a semiconductor process equipment, including the vacuum pumping system described in any of the above embodiments. The semiconductor process equipment also has the technical advantages of the above vacuum pumping system, which will not be described in detail here.

[0063] In some examples, semiconductor process equipment includes, but is not limited to, deposition equipment, plating / coating equipment, and ion implantation equipment, among others.

[0064] Some embodiments of the present application also provide a vacuum pumping method, which can be applied to the vacuum pumping system or semiconductor process equipment described in some of the above embodiments. The vacuum pumping method also has the technical advantages of the above vacuum pumping system, which will not be described in detail here.

[0065] The vacuum pumping method provided in the embodiment of the present application includes an energy storage stage, a first pressure reduction stage, and a second pressure reduction stage. The energy storage stage is located in the process chamber at the interval stage of the corresponding process. Energy storage can be performed before the process is officially started without occupying the process time of the process. Figure 6 The vacuuming method may include the following steps S100 to S300.

[0066] S100, energy storage stage, the vacuum pumping module and the energy storage module are turned on, so that the energy storage module stores the output energy of the vacuum pumping module.

[0067] S200, a first pressure reduction stage, connecting the energy storage module and the process chamber so that the energy storage module reduces the pressure of the process chamber for the first time.

[0068] S300, a second pressure reduction stage, disconnecting the connection between the energy storage module and the process chamber and between the energy storage module and the vacuum module, connecting the vacuum module and the process chamber, and allowing the vacuum module to reduce the pressure of the process chamber for the second time.

[0069] It should be added that, in some embodiments of the present application, the vacuum pumping method further includes: collecting the first gas pressure in the process chamber and the second gas pressure in the energy storage module in real time.

[0070] Accordingly, in the energy storage stage of step S100 , the second gas pressure in the energy storage module is made to reach the first target pressure.

[0071] Here, the first target pressure is related to factors such as the duration of the interval phase of the process, the energy storage size of the energy storage module, and the output energy size of the vacuum device, and can be selected and set to match the needs.

[0072] In the first pressure reduction stage of step S200 , the first gas pressure in the process chamber is made to approach or be equal to the second gas pressure in the energy storage module.

[0073] In the second depressurization stage of step S300 , the pressure of the first gas in the process chamber is made to reach a second target pressure.

[0074] For example, the second target pressure is less than the first target pressure. The second target pressure is, for example, a vacuum pressure, that is, when the first gas pressure in the process chamber reaches the second target pressure, a vacuum environment is formed in the process chamber.

[0075] Figure 7 An exemplary pressure drop curve diagram of the process chamber in the first pressure drop stage t1 and the second pressure drop stage t2 is given. Figure 7 In the first depressurization stage t1, the pressure in the process chamber drops rapidly and can be reduced to a medium-low pressure state in a very short time. It can be understood that when the first gas pressure in the process chamber approaches or is equal to the second gas pressure in the energy storage module, the rate of decrease of the gas pressure in the process chamber will be significantly slowed down, and the second depressurization stage t2 can be entered at this time, and the vacuum pumping device will continue to reduce the pressure of the process chamber until the vacuum environment in the process chamber is completed.

[0076] In the description of this specification, the description with reference to the terms "some embodiments", "some examples", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0077] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application.

Claims

1. A vacuum system, characterized in that: Used to evacuate the process chamber of semiconductor process equipment; The vacuum system comprises: An energy storage module connected to the process chamber; A vacuum module, connected to the process chamber and the energy storage module respectively; A gating control module is connected to the energy storage module and the vacuum module respectively, and is configured to: in the energy storage stage, connect the vacuum module and the energy storage module so that the energy storage module stores the output energy of the vacuum module; in the first pressure reduction stage, connect the energy storage module and the process chamber so that the energy storage module reduces the pressure of the process chamber for the first time; in the second pressure reduction stage, cut off the connection between the energy storage module and the process chamber and between the energy storage module and the vacuum module, connect the vacuum module and the process chamber so that the vacuum module reduces the pressure of the process chamber for the second time; The energy storage stage is located in the process chamber at an interval stage corresponding to the process step.

2. The vacuum system according to claim 1, characterized in that: Also includes: a pressure collection module, connected to the process chamber and the energy storage module respectively, and used for collecting the first gas pressure in the process chamber and the second gas pressure in the energy storage module in real time; Wherein, the gating control module is also connected to the pressure acquisition module and is configured to: in the energy storage stage, make the second gas pressure reach the first target pressure; in the first pressure reduction stage, make the first gas pressure tend to or be equal to the second gas pressure; and in the second pressure reduction stage, make the first gas pressure reach the second target pressure; the second target pressure is less than the first target pressure.

3. The vacuum system according to claim 1 or 2, characterized in that: The energy storage module comprises: Energy storage device; a first control valve, connecting the energy storage device and the vacuum pumping module; a second control valve, connecting the energy storage device and the process chamber; Among them, the gating control module is connected to the first control valve and the second control valve respectively, and is configured to: turn on the first control valve in the energy storage stage; turn on the second control valve in the first pressure reduction stage; and turn off the first control valve and the second control valve in the second pressure reduction stage.

4. The vacuum system according to claim 3, characterized in that: The energy storage device comprises a vacuum tank.

5. The vacuum system according to claim 3, characterized in that: The vacuum module comprises: Vacuum extraction device; a third control valve, connecting the vacuum pumping device and the process chamber; The gating control module is connected to the third control valve and is configured to: turn off the third control valve in the energy storage stage and the first pressure reduction stage; and turn on the third control valve in the second pressure reduction stage.

6. The vacuum system according to claim 5, characterized in that: The vacuuming device comprises a vacuum pump.

7. The vacuum system according to claim 1 or 2, characterized in that: The vacuum pumping module comprises: a vacuum pumping device; The energy storage module comprises: an energy storage device, and a first control valve connecting the energy storage device and the vacuum pumping device; The vacuum system also includes: A three-way valve having a first port, a second port and a third port; the first port is connected to the process chamber, the second port is connected to the energy storage device, and the third port is connected to the vacuum pumping device; Among them, the selection control module is connected to the first control valve and the three-way valve respectively, and is configured as follows: in the energy storage stage, the first control valve is turned on; in the first pressure reduction stage, the first port and the second port in the three-way valve are turned on; in the second pressure reduction stage, the first control valve and the first port and the second port in the three-way valve are turned off, and the first port and the third port in the three-way valve are turned on.

8. A semiconductor process equipment, characterized in that: Comprising a vacuum pumping system as claimed in any one of claims 1 to 7.

9. A vacuuming method, characterized in that: Applicable to the vacuum pumping system according to any one of claims 1 to 7 or the semiconductor process equipment according to claim 8; the vacuum pumping method comprises an energy storage stage, a first pressure reduction stage and a second pressure reduction stage; the energy storage stage is located in the interval stage of the corresponding process in the process chamber; the vacuum pumping method further comprises: In the energy storage stage, the vacuum pumping module and the energy storage module are turned on, so that the energy storage module stores the output energy of the vacuum pumping module; In the first pressure reduction stage, the energy storage module and the process chamber are connected so that the energy storage module reduces the pressure of the process chamber for the first time; In the second pressure reduction stage, the connection between the energy storage module and the process chamber and between the energy storage module and the vacuum module is cut off, and the vacuum module and the process chamber are connected, so that the vacuum module reduces the pressure of the process chamber for the second time.

10. The vacuuming method according to claim 9, characterized in that: The vacuuming method further comprises: collecting the first gas pressure in the process chamber and the second gas pressure in the energy storage module in real time; During the energy storage stage, the second gas pressure reaches a first target pressure; In the first pressure reduction stage, the first gas pressure is made to approach or be equal to the second gas pressure; In the second pressure reduction stage, the first gas pressure is made to reach a second target pressure; wherein the second target pressure is lower than the first target pressure.

Images