Package structure and manufacturing method thereof
By setting slots on the packaging substrate and setting connecting electronic components and functional electronic components therein, electrical connection is achieved using the conductive adhesive layer, the problem of space occupation and thickness increase when the circuit board is connected to the chip is solved, and a highly integrated and thinner packaging structure is realized.
Patent Information
- Application Number
- CN202311197126.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-15
- Publication Date
- 2025-03-25
AI Technical Summary
The existing circuit board-chip connection technology has problems of space occupation and increased thickness, which limits the high integration and lightweight development of electronic products.
By providing multiple slots on the packaging substrate and providing connecting electronic components and functional electronic components in the slots, electrical connection is achieved using a conductive adhesive layer to simplify the manufacturing process.
The cloth density of the packaging substrate is improved, and the packaging structure is highly integrated and thinner, while the stability and durability are enhanced.
Smart Images
Figure CN119694894A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of circuit board manufacturing, and in particular to a packaging structure and a manufacturing method thereof. Background Art
[0002] The connection technology between the circuit board and the chip is mainly realized through the ball grid array packaging technology, that is, the multiple array-distributed solder balls on the chip are soldered to the corresponding pads on the circuit board through the reflow process. However, the connection process between the circuit board and the chip has the following problems: 1. The connection between the pad and the internal conductor via of the circuit board requires a certain layout space, which limits the reduction of the length or width of the circuit board; 2. Direct surface mounting of the chip will increase the total thickness of the circuit board. The above problems limit the high integration and lightweight development of electronic products. Summary of the invention
[0003] In order to solve the above deficiencies of the prior art, the present application provides a packaging structure.
[0004] In addition, the present application also provides a method for manufacturing a packaging structure.
[0005] A method for manufacturing a packaging structure, comprising the steps of: arranging a plurality of slots at intervals on a packaging substrate, wherein the packaging substrate comprises a circuit layer and an insulating layer arranged on one side of the circuit layer, wherein the slots penetrate the insulating layer, and a portion of the circuit layer is exposed at the bottom of the slots. Arranging a connecting electronic component in each of the slots, wherein one end of the connecting electronic component is connected to the circuit layer, and the other end protrudes from the insulating layer. Arranging a functional electronic component in the insulating layer, wherein the functional electronic component comprises each welding foot arranged toward the insulating layer, and each welding foot is connected to the other end of one of the functional electronic components, to obtain the packaging structure.
[0006] In some possible implementations, before the step of “arranging a connecting electronic component in each of the slots”, the method further includes: disposing a metal layer in each of the slots, and disposing a conductive adhesive layer on the metal layer.
[0007] The step of “arranging a connecting electronic component in each of the slots” includes: arranging the connecting electronic component in the conductive adhesive layer.
[0008] In some possible implementations, the step of “arranging functional electronic components on the insulating layer” includes: connecting each of the functional electronic components and each corresponding connecting electronic component by reflow soldering.
[0009] In some possible implementations, the method further includes the step of providing a covering film on the circuit layer, wherein the covering film includes an adhesive layer and a protective layer, and the adhesive layer is connected between the protective layer and the circuit layer.
[0010] In some possible implementations, the method further includes the step of disposing a filling body between the electronic component and the insulating layer, wherein the filling body covers each of the welding pins.
[0011] In some possible implementations, the method for manufacturing the package substrate includes the steps of: providing a copper-clad substrate, the copper-clad substrate including the insulating layer and a copper foil layer disposed on one side of the insulating layer; etching the copper foil layer to form the circuit layer to obtain an intermediate; and providing a plurality of the grooves in the intermediate, each of the grooves penetrating the insulating layer to obtain the package substrate.
[0012] A packaging structure includes a packaging substrate, a plurality of connecting electronic components and a functional electronic component. The packaging substrate includes an insulating layer and a circuit layer arranged on one side of the insulating layer. The packaging substrate is provided with a plurality of slots at intervals, each of which penetrates the insulating layer, and a portion of the circuit layer is exposed at the bottom of the slot. Each of the connecting electronic components is partially accommodated in one of the slots, one end of each of the connecting electronic components is connected to the circuit layer, and the other end protrudes from the insulating layer. The functional electronic component includes a plurality of welding pins, each of which is connected to the other end of a functional electronic component.
[0013] In some possible implementations, each of the slots also penetrates a portion of the circuit layer.
[0014] In some possible implementations, a metal layer is further included, and the metal layer is disposed on the inner periphery of each of the slots, and the connecting electronic component is connected to the metal layer.
[0015] In some possible implementations, a conductive adhesive layer is further included, wherein the conductive adhesive layer is disposed on the metal layer, and the conductive adhesive layer fills a gap between the metal layer and the connecting electronic element.
[0016] The manufacturing method of the packaging structure provided in the present application is to set a plurality of grooves on the packaging substrate and then set connecting electronic components in the grooves. The connecting electronic components can not only achieve the purpose of electrically connecting the functional electronic components to the connecting pads, but also help to increase the layout density of the packaging substrate, which is beneficial to the high integration and lightweight of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A schematic cross-sectional view of a copper clad substrate provided in one embodiment of the present application.
[0018] Figure 2 For etching Figure 1 A schematic cross-sectional view of a copper-clad substrate formed as an intermediate is shown.
[0019] Figure 3 for Figure 2The intermediate body shown is provided with grooves to form a cross-sectional schematic diagram of a packaging substrate.
[0020] Figure 4 for Figure 3 The schematic cross-sectional view of a metal layer disposed in a groove of a package substrate is shown.
[0021] Figure 5 for Figure 4 The schematic cross-sectional view of the metal layer of the package substrate being provided with a conductive adhesive layer is shown.
[0022] Figure 6 for Figure 5 The schematic cross-sectional view of the conductive adhesive layer of the package substrate being connected to the electronic components is shown.
[0023] Figure 7 for Figure 6 The cross-sectional view of the connected electronic components connected to the functional electronic components to form a package structure is shown.
[0024] Main component symbols
[0025] Package structure 100
[0026] Copper clad substrate 10
[0027] Insulation layer 12
[0028] Copper foil layer 11
[0029] Circuit layer 13
[0030] Connection pad 131
[0031] Wire trough 132
[0032] Intermediate 14
[0033] Covering film 15
[0034] Adhesive layer 151
[0035] Protective layer 152
[0036] Slot 20
[0037] Metal layer 21
[0038] Conductive adhesive layer 22
[0039] Package substrate 23
[0040] Connecting electronic components 30
[0041] Functional electronic components 40
[0042] Solder pin 41
[0043] Ontology 42
[0044] Thickness direction A
[0045] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0046] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.
[0047] See also Figures 1 to 7 The present application embodiment provides a method for manufacturing a packaging structure 100, comprising the steps of:
[0048] S1: Please see Figure 1 , a copper clad substrate 10 is provided, the copper clad substrate 10 is a single-sided copper clad substrate, the copper clad substrate 10 includes an insulating layer 12 and a copper foil layer 12 disposed on one side of the insulating layer 12. The insulating layer 12 has a thickness direction A, and the copper foil layer 12 is stacked along the thickness direction A.
[0049] In this embodiment, the material of the insulating layer 12 includes but is not limited to polyimide (PI), polyester resin (PET), polyethylene naphthalate diformic acid glycol ester (PEN), liquid crystal polymer (LCP) and modified polyimide (MPI).
[0050] S2: See Figure 2 , etching the copper foil layer 12 to form a circuit layer 13, the circuit layer 13 includes a plurality of spaced connection pads 131, a wire groove 132 is provided between each two adjacent connection pads 131, and a side portion of the insulating layer 12 facing the circuit layer 13 is exposed at the bottom of the wire groove 132, thereby obtaining an intermediate 14.
[0051] In this embodiment, the formation of the circuit layer 13 specifically includes the steps of: setting a dry film (not marked) on the copper foil layer 12; exposing and developing the dry film to form a photosensitive pattern (not marked), the photosensitive pattern having a plurality of etching grooves (not marked), and the etching grooves are roughly corresponding to the line grooves 132; injecting etching solution into the etching grooves, the etching solution etches away part of the copper foil layer 12 through a chemical reaction, thereby forming the circuit layer 13, and removing the photosensitive pattern.
[0052] S3: See Figure 3 A plurality of slots 20 are provided in the intermediate body 14, and each of the slots 20 is substantially staggered with the wire slots 132. That is, the slots 20 and the connection pads 131 are substantially arranged in one-to-one correspondence. Part of the connection pads 131 is exposed in the slots 20 toward one side of the insulating layer 12, thereby obtaining a packaging substrate 23.
[0053] In this embodiment, the multiple slots 20 are provided specifically including: penetrating the insulating layer 12 and part of the connecting pads 131 by laser etching, thereby forming a primary slot (not shown). The primary slot is further cleaned by plasma blowing, thereby removing the remaining debris of the insulating layer 12 or the connecting pad 131, thereby forming the slots 20.
[0054] S4: See Figure 4 A metal layer 21 is disposed on the side wall of each of the slots 20, and the metal layer 21 is connected to the connection pad 131. The metal layer 21 is formed by electroplating. The material of the metal layer 21 is a copper-nickel-gold alloy. The metal layer 21 is used to improve the conductivity and connection performance of the connection pad 131. At the same time, the metal layer 21 can also prevent the oxidation and rust of the connection pad 131, thereby improving the durability of the connection pad 131.
[0055] S5: See Figure 5 A conductive adhesive layer 22 is disposed on each of the metal layers 21 , and a portion of the conductive adhesive layer 22 is filled into the bottom of the groove 20 to achieve electrical connection between the metal layer 21 and the conductive adhesive layer 22 .
[0056] In this embodiment, the conductive adhesive layer 22 includes polymer resin, conductive filler and additives. The polymer resin provides gelling properties and is the matrix of the conductive adhesive. The conductive filler determines the conductive properties of the colloid. Silver, copper, silver glass, metal oxides and carbon black are commonly used conductive fillers. The additives are used to adjust the properties of the colloid, such as solvents to improve fluidity and plasticizers to improve the mechanical properties of the colloid.
[0057] S6: See Figure 6 A connecting electronic component 30 is disposed in each of the slots 20, and one end of the connecting electronic component 30 is connected to the metal layer 21 and the connecting pad 131 through the conductive adhesive layer 22. In addition, the conductive adhesive layer 22 also fills the gap between the metal layer 21 and the connecting electronic component 30. In this embodiment, the connecting electronic component 30 includes a resistor, a capacitor, an inductor, etc.
[0058] In this example, see Figure 6 , step S6 further includes:
[0059] S61: a covering film 15 is provided on the circuit layer 13, wherein the covering film 15 comprises an adhesive layer 151 and a protective layer 152, wherein the adhesive layer 151 is connected between the protective layer 152 and the circuit layer 13. The material of the protective layer 152 comprises one or more of polyimide, polyurethane, polycarbonate, polyester or silicon nitride. The protective layer 152 is used to protect the circuit layer 13 and prevent the circuit layer 13 from being directly exposed to the external environment.
[0060] S7: See Figure 7 , a functional electronic component 40 is set on the insulating layer 12 away from the functional electronic component 40, and the functional electronic component 40 includes a plurality of welding pins 41 set toward the insulating layer 12, and each of the welding pins 41 is connected to the other end of one of the connecting electronic components 30 to obtain the packaging structure 100.
[0061] In this embodiment, the functional electronic component 40 includes a chip, a microcontroller, a digital signal processor, a field programmable gate array, an application-specific integrated circuit, various sensors, and a laser diode, etc. Specifically, the functional electronic component 40 also includes a body 42, and a plurality of welding pins 41 are disposed on a side of the body 42 facing the insulating layer 12. Specifically, the plurality of welding pins 41 are ball grid array solder balls, and the plurality of welding pins 41 are roughly distributed in an array on one side of the body 42.
[0062] In other embodiments of the present application, the method for manufacturing the package structure 100 further includes the steps of:
[0063] S8: A filling body (not shown) is arranged between the functional electronic element 40 and the insulating layer 12, and the filling body wraps the plurality of welding pins 41. The filling body can also be used to support the body 42.
[0064] Compared with the prior art, the manufacturing method of the package structure 100 provided in the present application has the following advantages:
[0065] (i) By setting a plurality of grooves 20 on the packaging substrate 23 and then setting connecting electronic components 30 in the grooves 20, the connecting electronic components 30 can not only achieve the purpose of electrically connecting the functional electronic components 40 to the connecting pads 131, but also help to increase the density of the packaging substrate 23, which is beneficial to the high integration and thinness of the packaging structure 100.
[0066] (ii) By providing a conductive adhesive layer 22 in the slot 20, the conductive adhesive layer 22 can not only realize the electrical connection between the electronic component 30 and the connection pad 131, but also serve the purpose of fixing the electronic component 30, which is beneficial to improving the stability and durability of the packaging structure 100.
[0067] (iii) By disposing the connecting electronic component 30 in the slot 20 , it is not necessary to fill the slot 20 with copper, which is helpful to simplify the manufacturing process of the packaging structure 100 .
[0068] See also Figure 7 , an embodiment of the present application further provides a packaging structure 100, comprising a packaging substrate 23, a plurality of connecting electronic components 30 and a functional electronic component 40. The packaging substrate 23 comprises an insulating layer 12 and a circuit layer 13 disposed on one side of the insulating layer 12. The packaging substrate 23 is provided with a plurality of slots 20 at intervals, each of the slots 20 penetrates the insulating layer 12, and a portion of the circuit layer 13 is exposed at the bottom of the slots 20. Each of the connecting electronic components 30 is partially accommodated in one of the slots 20, one end of each of the connecting electronic components 30 is connected to the circuit layer 13, and the other end protrudes from the insulating layer 12. The functional electronic component 40 comprises a plurality of welding pins 41, each of the welding pins 41 is connected to the other end of one of the functional electronic components 40.
[0069] See also Figure 7 In this embodiment, each of the slots 20 also penetrates a portion of the circuit layer 13, thereby facilitating an increase in the contact area between the connecting electronic component 30 and the connecting pad 131. The packaging structure 100 further includes a metal layer 21 and a conductive adhesive layer 22. The metal layer 21 is disposed on the side wall of each of the slots 20, and the connecting electronic component 30 is connected to the metal layer 21. The conductive adhesive layer 22 is disposed on the metal layer 21, and the conductive adhesive layer 22 fills the gap between the metal layer 21 and the connecting electronic component 30.
[0070] The above description is only an optimized specific implementation of the present application, but it cannot be limited to this implementation in the actual application process. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.
Claims
1. A method for manufacturing a packaging structure, characterized in that: Includes steps: A plurality of slots are arranged at intervals on a packaging substrate, wherein the packaging substrate comprises a circuit layer and an insulating layer arranged on one side of the circuit layer, the slots penetrate the insulating layer, and a portion of the circuit layer is exposed at the bottom of the slots; A connecting electronic component is arranged in each of the slots, one end of the connecting electronic component is connected to the circuit layer, and the other end protrudes out of the insulating layer; A functional electronic component is arranged on the insulating layer, wherein the functional electronic component comprises a plurality of welding pins arranged toward the insulating layer, and each of the welding pins is connected to the other end of one of the connecting electronic components to obtain the packaging structure.
2. The manufacturing method according to claim 1, characterized in that Before the step of "arranging a connecting electronic component in each of the slots", the method further includes: Disposing a metal layer in each of the slots, and Disposing a conductive adhesive layer on the metal layer; The step of "arranging a connecting electronic component in each of the slots" includes: The connecting electronic element is arranged on the conductive adhesive layer.
3. The manufacturing method according to claim 1, characterized in that: The step of "arranging functional electronic components on the insulating layer" includes: Each functional electronic component and each corresponding connecting electronic component are connected by reflow soldering.
4. The manufacturing method according to claim 1, characterized in that: Also includes the steps: A covering film is arranged on the circuit layer, wherein the covering film comprises an adhesive layer and a protective layer, and the adhesive layer is connected between the protective layer and the circuit layer.
5. The manufacturing method according to claim 1, characterized in that: Also includes the steps: A filling body is arranged between the electronic element and the insulating layer, and the filling body covers each of the welding pins.
6. The manufacturing method according to claim 1, characterized in that: The method for manufacturing the packaging substrate comprises the steps of: Providing a copper-clad substrate, the copper-clad substrate comprising the insulating layer and a copper foil layer disposed on one side of the insulating layer; Etching the copper foil layer to form the circuit layer to obtain an intermediate; A plurality of the grooves are arranged in the intermediate body, each of the grooves penetrates through the insulating layer, so as to obtain the packaging substrate.
7. A packaging structure, characterized in that: include: A packaging substrate, the packaging substrate comprising an insulating layer and a circuit layer arranged on one side of the insulating layer, the packaging substrate being provided with a plurality of slots at intervals, each of the slots penetrating the insulating layer, and a portion of the circuit layer being exposed at the bottom of the slot; A plurality of connecting electronic components, each of which is partially accommodated in one of the slots, one end of each of which is connected to the circuit layer, and the other end of which protrudes out of the insulating layer; A functional electronic component comprises a plurality of welding pins, each of which is connected to the other end of the functional electronic component.
8. The packaging structure according to claim 7, characterized in that: Each of the slots also penetrates a portion of the circuit layer.
9. The packaging structure according to claim 7, characterized in that: It also includes a metal layer, which is arranged on the inner periphery of each of the slots, and the connecting electronic element is connected to the metal layer.
10. The packaging structure according to claim 9, characterized in that: It also includes a conductive adhesive layer, which is arranged on the metal layer and fills the gap between the metal layer and the connecting electronic element.