CHUCK disk for semiconductor detection

Abstract

The invention relates to the technical field of semiconductors, and discloses a CHUCK disc for semiconductor detection, which is characterized in that a chip silicon wafer is adsorbed on the lower surface of an annular groove, a spraying assembly for cleaning the chip silicon wafer is mounted on a disc body, a cleaning assembly is connected to a rotating part, and when the rotating part is driven by a motor and a gear, the rotating part is driven by the motor and the gear to rotate. And the cleaning assembly performs circular motion on the disc body and is used for cleaning the chip silicon wafer. Through the arrangement of the cleaning assembly, the second roller brush installed on the lower surface of the connecting block rotates along with the connecting block to continuously clean the upper surface of the chip silicon wafer, and when the chip silicon wafer is adsorbed, the second roller brush is located on the upper surface of the chip silicon wafer, so that stains on the surface of the chip silicon wafer are reduced, and the chip silicon wafer cleaning efficiency is improved. The accuracy of a detection result is improved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a CHUCK disk for semiconductor detection. Background Art

[0002] Semiconductor test CHUCK is a device used to fix and position wafers, especially when performing tri-temperature testing. Tri-temperature testing is a chip testing method used to test the reliability and stability of chips at different temperatures.

[0003] The CHUCK plate fixes the wafer in a specific position by mechanical vacuum adsorption or electrostatic adsorption for accurate testing. The existing CHUCK plate is usually set on a robotic arm. The CHUCK plate adsorbs the wafer, and then the robotic arm is adjusted to adjust the CHUCK plate and the wafer to the side of the detection device for detection. However, before the detection, there may be a small amount of dust and impurities on the surface of the wafer, which may affect the accuracy of the wafer detection result. Summary of the invention

[0004] The object of the present invention is to provide a CHUCK tray for semiconductor testing to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a CHUCK disc for semiconductor testing, comprising a disc body, a motor mounted on the disc body, a rotating member mounted on the disc body, and a gear mounted on the output shaft of the motor for driving the rotating member;

[0007] The disk body is provided with an annular cavity and a plurality of channels inside, the plurality of channels are connected with the annular cavity, one end of the channel away from the annular cavity is connected with the middle part of the disk body, and the middle part of the upper surface of the disk body is connected with an air pipe and extends to the inside of the channel;

[0008] The lower surface of the disk body is provided with a plurality of annular grooves, and the annular grooves are connected with the channel;

[0009] A chip silicon wafer is adsorbed on the lower surface of the annular groove, and a spray component for cleaning the chip silicon wafer is installed on the disk body;

[0010] The rotating part is connected with a cleaning component. When the rotating part is driven by the motor and the gear, the cleaning component performs a circular motion on the disk body to clean the chip silicon wafer.

[0011] The purpose of the above arrangement is to connect the air pipe to an external vacuum pump to extract the air from the air pipe. By applying a suitable negative pressure to the air pipe, the gas can flow in the channel and the annular cavity. Since the annular groove is connected to the channel, the lower surface of the annular groove can adsorb the chip silicon wafer under the action of air pressure, so that the chip silicon wafer is stably fixed on the lower surface of the annular groove.

[0012] The motor starts, and the output shaft of the motor drives the gear to rotate. The gear cooperates with the rotating part to drive the rotating part to rotate. When the rotating part is driven to rotate, the cleaning component connected to the rotating part makes a circular motion on the disk body. During the circular motion, the cleaning component cleans the chip silicon wafer adsorbed on the lower surface of the annular groove to remove impurities on the surface of the chip silicon wafer. At the same time, the spray component installed on the disk body is used to clean the chip silicon wafer. The spray component can spray cleaning liquid to cooperate with the cleaning action of the cleaning component to clean the chip silicon wafer in all directions to achieve a better cleaning effect.

[0013] Furthermore, the spray assembly includes a liquid storage box and a cavity, the liquid storage box is installed on the outer wall of the connecting piece, a liquid inlet is provided on the top of the liquid storage box, the bottom of the liquid storage box and the top of the cavity are connected to each other, the bottom of the cavity is connected with a nozzle, and the port of the nozzle faces the chip silicon wafer.

[0014] The purpose of the above arrangement is that the cleaning liquid is added to the liquid storage box through the liquid inlet at the top;

[0015] The liquid flowing into the cavity at the bottom of the liquid storage box is sprayed out through the nozzle connected at the bottom, and the nozzle port is directed toward the chip silicon wafer to realize the spraying of the cleaning liquid on the chip silicon wafer.

[0016] Furthermore, a rotating shaft is rotatably connected to the middle of the cavity, a plurality of blades are evenly connected to the outer wall of the rotating shaft, the blades and the inner wall of the cavity are fitted together, and the output shaft of the motor is connected to the rotating shaft.

[0017] The purpose of the above arrangement is that when the motor is started, the output shaft of the motor drives the rotating shaft in the middle of the cavity to rotate. When the rotating shaft rotates, the blades evenly connected on its outer wall rotate in the cavity. Since the blades and the inner wall of the cavity fit each other, the rotation of the blades will generate pressure on the liquid in the cavity. At the same time, every two blades form a small chamber, which transports the cleaning liquid from the top to the bottom of the cavity.

[0018] Furthermore, the rotating member includes a rotating ring and a gear ring, which are connected to each other, the rotating ring is rotatably connected to the port of the annular groove and is closed, and the gear ring is arranged on the upper surface of the disk body to mesh with the gear.

[0019] The purpose of the above arrangement is that when the motor starts, the gear on the output shaft of the motor drives the gear ring to rotate. Since the gear ring and the rotating ring are connected to each other, the rotation of the gear ring will drive the rotating ring to rotate. The rotating ring is rotatably connected to the port of the annular groove and is closed to ensure its sealing and stability.

[0020] Further, the cleaning assembly includes a connecting block, which is mounted on the upper surface of the rotating ring and communicates with the interior of the annular groove through the rotating ring;

[0021] The distance between the bottom of the liquid storage box and the rotating ring is greater than the height of the connecting block. A sliding cavity is provided inside the connecting block. A first spring is installed on the inner wall of the sliding cavity. A movable frame is slidably connected to the inner wall of the sliding cavity. A limiting ring is installed on the inner wall of the sliding cavity for blocking the first spring.

[0022] The purpose of the above arrangement is that when the rotating ring rotates, the connecting block connected to the upper surface of the rotating ring rotates accordingly, and the interior of the connecting block is connected to the interior of the annular groove through the rotating ring, the air inside the connecting block is extracted, and the movable frame and the first roller brush move toward the lower surface of the chip silicon wafer. Since the first spring is installed on the inner wall of the sliding cavity, the movable frame will compress the first spring when sliding in the sliding cavity, and the limit ring will block the first spring to prevent it from excessive displacement, thereby avoiding clogging of the exhaust hole of the connecting block. The first roller brush connected to the end of the movable frame away from the first spring rotates to contact the lower surface of the chip silicon wafer, and the lower surface of the chip silicon wafer is cleaned as the connecting block rotates.

[0023] Furthermore, the end of the movable frame away from the first spring is rotatably connected to a first roller brush, and when the movable frame and the first roller brush move toward the lower surface of the chip silicon wafer, the lower surface thereof is cleaned;

[0024] A second roller brush is installed on the lower surface of the connecting block.

[0025] The purpose of the above arrangement is that the second roller brush installed on the lower surface of the connecting block continuously cleans the upper surface of the chip silicon wafer as the connecting block rotates. When the chip silicon wafer is adsorbed, the second roller brush is on the upper surface of the chip silicon wafer.

[0026] Furthermore, the plurality of annular grooves are of different diameters, progressively arranged layer by layer, and evenly distributed on the lower surface of the disc body;

[0027] A plurality of through grooves are arranged between the plurality of annular grooves for communication, one end of the plurality of through grooves are centrally connected to the middle of the disc body, and the annular grooves are connected to the channel through the through grooves.

[0028] The purpose of the above-mentioned arrangement is that a number of annular grooves are progressively arranged in different diameters and are evenly distributed on the lower surface of the disk body. The through grooves arranged between the annular grooves connect them, and one end of the through grooves is concentrated and connected in the middle of the disk body. The annular grooves are connected to the channels through the through grooves. Such a structure helps to evenly distribute the gas on the entire lower surface of the disk body, and ensure the adsorption stability of the chip silicon wafer at each annular groove.

[0029] Furthermore, three protrusions are evenly arranged on the outer wall of the connecting piece, and an auxiliary component for cooperating with the protrusions is installed on the outer wall of the connecting block.

[0030] The purpose of the above arrangement is that when the connecting block rotates with the rotating ring, the auxiliary components on the outer wall of the connecting block interact with the protrusions on the outer wall of the connecting piece.

[0031] Furthermore, the auxiliary component includes a groove rail, two of the groove rails are respectively installed on the outer wall of the connecting block, a second spring is installed on the inner wall of the groove rail, an arc claw is slidably connected to the groove rail, a connecting frame is connected between the two arc claws, and one end of the connecting frame is formed into an arc for pushing and fitting with the protrusion.

[0032] The arc-shaped claws are formed into an arc-shaped bend and extend toward the lower surface of the chip silicon wafer, and the two arc-shaped claws are respectively located on the outer sides of the first roller brush.

[0033] The purpose of the above arrangement is that the arc-shaped claws are formed into an arc-shaped bend and extend toward the lower surface of the chip silicon wafer, and the two arc-shaped claws are respectively located on the outside of the first roller brush. When the connecting block rotates, the second spring in the groove where the arc-shaped claws are located will be elastically deformed according to the pushing and matching of the protrusion and the arc-shaped end of the connecting frame, so that the arc-shaped claws can adapt to the pushing of the protrusion, and the arc-shaped claws are retracted to the outside of the chip silicon wafer, thereby facilitating the subsequent separation of the chip silicon wafer;

[0034] During the cleaning process, the cleaning component and the chip silicon wafer rub against each other, which may cause the chip silicon wafer to fall off from the lower surface of the annular groove to a certain extent. The spacing between each bump is large, and there is a large formation, so that the arc-shaped claws are on the lower surface of the chip silicon wafer for a long time, supporting the chip silicon wafer to prevent the chip silicon wafer from accidentally falling. After the chip silicon wafer is cleaned, the bumps and the arc-shaped end of the connecting frame maintain a push-fit cooperation, so that the arc-shaped claws remain away from the chip silicon wafer, making it convenient for the chip silicon wafer to be detached and placed.

[0035] The present invention has the following beneficial effects:

[0036] (1) The present invention provides a cleaning component. When the rotating ring rotates, the connecting block connected to the upper surface of the rotating ring rotates accordingly. The interior of the connecting block is connected to the interior of the annular groove through the rotating ring. The air inside the connecting block is extracted, and the movable frame and the first roller brush move toward the lower surface of the chip silicon wafer. Since the first spring is installed on the inner wall of the sliding cavity, the movable frame will compress the first spring when sliding in the sliding cavity. The limiting ring blocks the first spring to prevent it from excessive displacement, thereby avoiding clogging of the exhaust hole of the connecting block. The first roller brush connected to the end of the movable frame away from the first spring rotates to contact the lower surface of the chip silicon wafer. As the connecting block rotates, the lower surface of the chip silicon wafer is cleaned. The second roller brush installed on the lower surface of the connecting block continuously cleans the upper surface of the chip silicon wafer as the connecting block rotates. When the chip silicon wafer is adsorbed, the second roller brush is on the upper surface of the chip silicon wafer, thereby reducing stains on the surface of the chip silicon wafer and improving the accuracy of the detection result.

[0037] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0040] Figure 2 It is a schematic diagram of the rotating part of the present invention;

[0041] Figure 3 This is a schematic diagram of the internal structure of the disk of the present invention;

[0042] Figure 4 It is a schematic diagram of the rotating part and the cleaning assembly of the present invention;

[0043] Figure 5 It is a schematic diagram of the cleaning component of the present invention;

[0044] Figure 6 It is a schematic diagram of the spray assembly of the present invention;

[0045] Figure 7 It is a schematic diagram of the auxiliary components of the present invention;

[0046] Figure 8 This is a schematic diagram of the disk structure of the present invention;

[0047] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0048] In the figure: 1, disc; 101, annular cavity; 102, channel; 103, annular groove; 2, connecting piece; 3, air pipe; 4, bump; 5, motor; 6, spray assembly; 601, liquid storage box; 602, spray pipe; 603, cavity; 604, blade; 7, cleaning assembly; 701, connecting block; 702, movable frame; 703, first roller brush; 704, first spring; 705, second roller brush; 8, rotating ring; 9, gear ring; 10, auxiliary assembly; 1001, groove rail; 1002, second spring; 1003, arc claw; 1004, connecting frame; 11, gear. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] The present invention is a CHUCK plate for semiconductor testing, such as Figure 1-Figure 8 As shown, it includes a disc body 1, a motor 5 is mounted on the disc body 1, a rotating part is mounted on the disc body 1, and a gear 11 is mounted on the output shaft of the motor 5 for driving the rotating part;

[0051] An annular cavity 101 and a plurality of channels 102 are provided inside the disc body 1. The plurality of channels 102 are connected to the annular cavity 101. One end of the channel 102 away from the annular cavity 101 is connected to the middle of the disc body 1. The middle of the upper surface of the disc body 1 is connected to the air pipe 3 and extends to the inside of the channel 102.

[0052] The lower surface of the disc body 1 is provided with a plurality of annular grooves 103, and the annular grooves 103 are connected with the channel 102;

[0053] The lower surface of the annular groove 103 is adsorbed with a chip silicon wafer, and the disk body 1 is equipped with a spray component 6 for cleaning the chip silicon wafer;

[0054] The rotating member is connected with a cleaning component 7. When the rotating member is driven by the motor 5 and the gear 11, the cleaning component 7 performs a circular motion on the disk body 1 to clean the chip silicon wafer.

[0055] In this embodiment, the purpose of the above arrangement is to connect the air pipe 3 with an external vacuum pump to extract the air from the air pipe 3. By applying a suitable negative pressure to the air pipe 3, the gas can flow in the channel 102 and the annular cavity 101. Since the annular groove 103 is connected to the channel 102, under the action of the air pressure, the lower surface of the annular groove 103 can adsorb the chip silicon wafer, so that the chip silicon wafer is stably fixed on the lower surface of the annular groove 103.

[0056] The motor 5 is started, and the output shaft of the motor 5 drives the gear 11 to rotate. The gear 11 cooperates with the rotating part to drive the rotating part to rotate. When the rotating part is driven to rotate, the cleaning component 7 connected to the rotating part makes a circular motion on the disk body 1. During the circular motion, the cleaning component 7 cleans the chip silicon wafer adsorbed on the lower surface of the annular groove 103 to remove impurities on the surface of the chip silicon wafer. At the same time, the spray component 6 installed on the disk body 1 is used to clean the chip silicon wafer. The spray component 6 can spray cleaning liquid to cooperate with the cleaning action of the cleaning component 7 to clean the chip silicon wafer in all directions to achieve a better cleaning effect.

[0057] As an implementation method, Figure 6 As shown, further:

[0058] The spray assembly 6 includes a liquid storage box 601 and a cavity 603. The liquid storage box 601 is installed on the outer wall of the connecting piece 2. A liquid inlet is provided at the top of the liquid storage box 601. The bottom of the liquid storage box 601 and the top of the cavity 603 are connected to each other. The bottom of the cavity 603 is connected to a nozzle 602, and the port of the nozzle 602 faces the chip silicon wafer.

[0059] In this embodiment, the purpose of the above arrangement is that the cleaning liquid is added to the liquid storage box 601 through the liquid inlet at the top;

[0060] The liquid flowing into the cavity 603 at the bottom of the liquid storage box 601 is sprayed out through the nozzle 602 connected at the bottom, and the nozzle 602 port is directed toward the chip silicon wafer to realize the cleaning liquid spraying on the chip silicon wafer.

[0061] As an implementation method, Figure 6 As shown, further:

[0062] A rotating shaft is rotatably connected to the middle of the cavity 603, and a plurality of blades 604 are evenly connected to the outer wall of the rotating shaft. The blades 604 fit the inner wall of the cavity 603, and the output shaft of the motor 5 is connected to the rotating shaft.

[0063] In this embodiment, the purpose of the above-mentioned arrangement is that when the motor 5 is started, the output shaft of the motor 5 drives the rotating shaft in the middle of the cavity 603 to rotate. When the rotating shaft rotates, the blades 604 evenly connected on its outer wall rotate in the cavity 603. Since the blades 604 and the inner wall of the cavity 603 fit each other, the rotation of the blades 604 will generate pressure on the liquid in the cavity 603. At the same time, every two blades 604 form a small chamber, which transports the cleaning liquid from the top to the bottom of the cavity 603.

[0064] As an implementation method, Figure 2 As shown, further:

[0065] The rotating member includes a rotating ring 8 and a gear ring 9, which are connected to each other. The rotating ring 8 is rotatably connected to the end of the annular groove 103 and is sealed. The gear ring 9 is arranged on the upper surface of the disc body 1 and meshes with the gear 11.

[0066] In this embodiment, the purpose of the above-mentioned arrangement is that when the motor 5 is started, the gear 11 on the output shaft of the motor 5 drives the gear ring 9 to rotate. Since the gear ring 9 and the rotating ring 8 are connected to each other, the rotation of the gear ring 9 drives the rotating ring 8 to rotate. The rotating ring 8 is rotatably connected to the port of the annular groove 103 and is closed to ensure its sealing and stability.

[0067] As an implementation method, Figure 5 As shown, further:

[0068] The cleaning assembly 7 includes a connecting block 701, which is mounted on the upper surface of the rotating ring 8 and communicates with the interior of the annular groove 103 through the rotating ring 8;

[0069] The distance between the bottom of the liquid storage box 601 and the rotating ring 8 is greater than the height of the connecting block 701. A sliding cavity is provided inside the connecting block 701. A first spring 704 is installed on the inner wall of the sliding cavity. A movable frame 702 is slidably connected to the inner wall of the sliding cavity. A limiting ring is installed on the inner wall of the sliding cavity to block the first spring 704.

[0070] In this embodiment, the purpose of the above-mentioned arrangement is that when the rotating ring 8 rotates, the connecting block 701 connected to the upper surface of the rotating ring 8 rotates accordingly, and the interior of the connecting block 701 is connected to the interior of the annular groove 103 through the rotating ring 8, the air inside the connecting block 701 is extracted, and the movable frame 702 and the first roller brush 703 move toward the lower surface of the chip silicon wafer. Since the first spring 704 is installed on the inner wall of the sliding cavity, the movable frame 702 will compress the first spring 704 when sliding in the sliding cavity, and the limiting ring blocks the first spring 704 to prevent it from excessive displacement, thereby avoiding clogging of the exhaust hole of the connecting block 701. The first roller brush 703 connected to the end of the movable frame 702 away from the first spring 704 rotates to contact the lower surface of the chip silicon wafer, and the lower surface of the chip silicon wafer is cleaned as the connecting block 701 rotates.

[0071] As an implementation method, Figure 5 As shown, further:

[0072] One end of the movable frame 702 away from the first spring 704 is rotatably connected to the first roller brush 703. When the movable frame 702 and the first roller brush 703 move toward the lower surface of the chip silicon wafer, the lower surface thereof is cleaned;

[0073] A second roller brush 705 is installed on the lower surface of the connecting block 701 .

[0074] In this embodiment, the purpose of the above-mentioned setting is that the second roller brush 705 installed on the lower surface of the connecting block 701 continuously cleans the upper surface of the chip silicon wafer as the connecting block 701 rotates. When the chip silicon wafer is adsorbed, the second roller brush 705 is on the upper surface of the chip silicon wafer.

[0075] As an implementation method, Figure 8 As shown, further:

[0076] A plurality of annular grooves 103 are of different diameters, progressively arranged layer by layer, and evenly distributed on the lower surface of the disc body 1;

[0077] A plurality of through grooves are provided between the plurality of annular grooves 103 for communication. One ends of the plurality of through grooves are connected together at the middle of the disk body 1 , and the annular grooves 103 are connected with the passage 102 through the through grooves.

[0078] In this embodiment, the purpose of the above-mentioned arrangement is that a plurality of annular grooves 103 are progressively arranged in different diameters and are evenly distributed on the lower surface of the disk body 1. The through grooves arranged between the annular grooves 103 connect them, and one end of the through grooves is concentrated and connected in the middle of the disk body 1. The annular grooves 103 are connected to the channel 102 through the through grooves. Such a structure helps to evenly distribute the gas on the entire lower surface of the disk body 1, thereby ensuring the adsorption stability of the chip silicon wafer at each annular groove 103.

[0079] As an implementation method, Figure 1 As shown, further:

[0080] Three protrusions 4 are evenly arranged on the outer wall of the connecting member 2 , and an auxiliary component 10 for cooperating with the protrusions 4 is installed on the outer wall of the connecting block 701 .

[0081] In this embodiment, the purpose of the above arrangement is that when the connecting block 701 rotates with the rotating ring 8 , the auxiliary component 10 on the outer wall of the connecting block 701 interacts with the protrusion 4 on the outer wall of the connecting member 2 .

[0082] As an implementation method, Figure 7 As shown, further:

[0083] The auxiliary component 10 includes a groove rail 1001, two groove rails 1001 are respectively installed on the outer wall of the connecting block 701, a second spring 1002 is installed on the inner wall of the groove rail 1001, an arc claw 1003 is slidably connected to the groove rail 1001, a connecting frame 1004 is connected between the two arc claws 1003, and one end of the connecting frame 1004 is formed into an arc for pushing and matching with the protrusion 4.

[0084] The arc-shaped claws 1003 are curved in an arc shape and extend toward the lower surface of the chip silicon wafer. The two arc-shaped claws 1003 are respectively located on the outer sides of the first roller brush 703 .

[0085] In this embodiment, the purpose of the above arrangement is that the arc-shaped claws 1003 are formed into an arc-shaped bend and extend to the lower surface of the chip silicon wafer, and the two arc-shaped claws 1003 are respectively located on the outside of the first roller brush 703. When the connecting block 701 rotates, the second spring 1002 in the groove rail 1001 where the arc-shaped claws 1003 are located will be elastically deformed according to the pushing and matching of the protrusion 4 and the arc-shaped end of the connecting frame 1004, so that the arc-shaped claws 1003 can adapt to the push of the protrusion 4, and the arc-shaped claws 1003 are retracted to the outside of the chip silicon wafer, thereby facilitating the subsequent separation of the chip silicon wafer;

[0086] During the cleaning process, the cleaning component 7 and the chip silicon wafer rub against each other, which may cause the chip silicon wafer to fall off from the lower surface of the annular groove 103 to a certain extent. The spacing between each bump 4 is large, and there is a large formation, so that the arc claw 1003 is on the lower surface of the chip silicon wafer for a long time, and the chip silicon wafer is supported to prevent the chip silicon wafer from accidentally falling. After the chip silicon wafer is cleaned, the bump 4 and the arc end of the connecting frame 1004 maintain a push-fit, so that the arc claw 1003 remains away from the chip silicon wafer, which is convenient for the chip silicon wafer to be detached and placed.

[0087] When in use, the air pipe 3 is connected to an external vacuum pump to extract air from the air pipe 3. By applying a suitable negative pressure to the air pipe 3, the gas can flow in the channel 102 and the annular cavity 101. Since the annular groove 103 is connected to the channel 102, under the action of air pressure, the lower surface of the annular groove 103 can adsorb the chip silicon wafer, so that the chip silicon wafer is stably fixed on the lower surface of the annular groove 103;

[0088] The motor 5 is started, and the output shaft of the motor 5 drives the gear 11 to rotate. The gear 11 cooperates with the rotating part to drive the rotating part to rotate. When the rotating part is driven to rotate, the cleaning component 7 connected to the rotating part makes a circular motion on the disk body 1. During the circular motion, the cleaning component 7 cleans the chip silicon wafer adsorbed on the lower surface of the annular groove 103 to remove impurities on the surface of the chip silicon wafer. At the same time, the spray component 6 installed on the disk body 1 is used to clean the chip silicon wafer. The spray component 6 can spray cleaning liquid to cooperate with the cleaning action of the cleaning component 7 to clean the chip silicon wafer in all directions to achieve a better cleaning effect.

[0089] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A CHUCK plate for semiconductor testing, comprising a plate body (1), characterized in that: The disk body (1) is provided with a motor (5), a rotating member is provided with the disk body (1), and a gear (11) is provided on the output shaft of the motor (5) for driving the rotating member; The disk body (1) is provided with an annular cavity (101) and a plurality of channels (102) inside, the plurality of channels (102) are connected to the annular cavity (101), one end of the channel (102) away from the annular cavity (101) is connected to the middle of the disk body (1), and the middle of the upper surface of the disk body (1) is connected to the air pipe (3) and extends to the inside of the channel (102); The lower surface of the disk body (1) is provided with a plurality of annular grooves (103), and the annular grooves (103) are connected to the channel (102); A chip silicon wafer is adsorbed on the lower surface of the annular groove (103), and a spray component (6) for cleaning the chip silicon wafer is installed on the disk body (1); The rotating member is connected to a cleaning component (7). When the rotating member is driven by the motor (5) and the gear (11), the cleaning component (7) performs a circular motion on the disk body (1) to clean the chip silicon wafer.

2. A semiconductor testing CHUCK tray according to claim 1, characterized in that: The spray assembly (6) comprises a liquid storage box (601) and a cavity (603), wherein the liquid storage box (601) is mounted on the outer wall of the connector (2), a liquid inlet is arranged at the top of the liquid storage box (601), the bottom of the liquid storage box (601) and the top of the cavity (603) are connected to each other, the bottom of the cavity (603) is connected to a nozzle (602), and the port of the nozzle (602) faces the chip silicon wafer.

3. A semiconductor testing CHUCK tray according to claim 2, characterized in that: A rotating shaft is rotatably connected to the middle of the cavity (603), a plurality of blades (604) are evenly connected to the outer wall of the rotating shaft, the blades (604) and the inner wall of the cavity (603) are in contact with each other, and the output shaft of the motor (5) is connected to the rotating shaft.

4. A semiconductor testing CHUCK tray according to claim 3, characterized in that: The rotating member comprises a rotating ring (8) and a gear ring (9), wherein the rotating ring (8) and the gear ring (9) are connected to each other, wherein the rotating ring (8) is rotatably connected to the end of the annular groove (103) and is sealed, and the gear ring (9) is arranged on the upper surface of the disc body (1) and meshes with the gear (11).

5. A semiconductor testing CHUCK tray according to claim 4, characterized in that: The cleaning assembly (7) comprises a connecting block (701), which is mounted on the upper surface of the rotating ring (8) and communicates with the interior of the annular groove (103) through the rotating ring (8); The distance between the bottom of the liquid storage box (601) and the rotating ring (8) is greater than the height of the connecting block (701). A sliding cavity is provided inside the connecting block (701). A first spring (704) is installed on the inner wall of the sliding cavity. A movable frame (702) is slidably connected to the inner wall of the sliding cavity. A limiting ring is installed on the inner wall of the sliding cavity for blocking the first spring (704).

6. A semiconductor testing CHUCK tray according to claim 5, characterized in that: One end of the movable frame (702) away from the first spring (704) is rotatably connected to a first roller brush (703), and when the movable frame (702) and the first roller brush (703) move toward the lower surface of the chip silicon wafer, the lower surface is cleaned; A second roller brush (705) is installed on the lower surface of the connecting block (701).

7. A semiconductor testing CHUCK tray according to claim 6, characterized in that: The plurality of annular grooves (103) are of different diameters and are progressively distributed on the lower surface of the disc body (1) in a uniform manner. A plurality of through grooves are provided between the plurality of annular grooves (103) for communication, one end of the plurality of through grooves are connected together at the middle of the disc body (1), and the annular grooves (103) are connected with the channel (102) via the through grooves.

8. A semiconductor testing CHUCK tray according to claim 7, characterized in that: Three protrusions (4) are evenly arranged on the outer wall of the connecting piece (2), and an auxiliary component (10) for cooperating with the protrusions (4) is installed on the outer wall of the connecting block (701).

9. A semiconductor testing CHUCK tray according to claim 8, characterized in that: The auxiliary component (10) comprises a groove rail (1001), two of the groove rails (1001) are respectively mounted on the outer wall of the connecting block (701), a second spring (1002) is mounted on the inner wall of the groove rail (1001), an arc-shaped claw (1003) is slidably connected to the groove rail (1001), a connecting frame (1004) is connected between the two arc-shaped claws (1003), and one end of the connecting frame (1004) is formed in an arc shape for pushing and matching with the protrusion (4).

10. A semiconductor testing CHUCK tray according to claim 9, characterized in that: The arc-shaped claws (1003) are formed into an arc-shaped bend and extend toward the lower surface of the chip silicon wafer. The two arc-shaped claws (1003) are respectively located on the outer sides of the first roller brush (703).

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