Multi-wafer storage cavity

Abstract

The invention provides a multi-wafer storage cavity, which comprises a cavity body, two opposite side surfaces of which are respectively provided with a first wafer inlet / outlet and a second wafer inlet / outlet; the rotation support is located in the cavity and rotates along the rotation center of the rotation support, and a plurality of object placing tables used for bearing wafers are arranged on the rotation support in a rotation mode so that the wafers can be in a horizontal state all the time; the conveying part is used for lifting or lowering a wafer, the wafer to be processed is lifted by the conveying part from the object placing table on the lowest side and leaves the object placing table, and the processed wafer is lowered by the conveying part on the object placing table on the lowest side and is located on the object placing table; the linear driving part is used for driving the conveying part to enter and exit from the cavity through the first sheet inlet and outlet; the wafer taking-out action of the mechanical arm is concentrated, the mechanical arm can carry out other moving work by utilizing the integrated time, and the utilization rate of the mechanical arm can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer production, in particular to a multi-wafer storage cavity. Background Art

[0002] Currently, when wafers undergo processes such as coating and etching, the usual structure is that an external platform corresponds to several process chambers. The robot in the platform transports the wafers to different process chambers for process treatment. After the process is completed, the process chamber is opened, and the robot takes the wafer out of the process chamber and places it in a wafer box on the external platform. The wafer is then taken out of the wafer box and placed in other process chambers.

[0003] In the process of the robot grabbing and transferring the wafer position, it is necessary to wait for the process to be completed and the cavity to be opened before the wafer can be taken out. The waiting time of the robot is long and the utilization efficiency is low. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a multi-wafer storage chamber, which is convenient for the robot to concentrate the action of taking out the wafers, integrates the original waiting time of the robot, and allows the robot to use the integrated time to perform other mobile work, which is conducive to improving the utilization rate of the robot. The technical solution adopted by the present invention is: A multi-wafer storage chamber, comprising: The cavity has two opposite sides respectively provided with a first sheet inlet and outlet opening and a second sheet inlet and outlet opening; A swivel bracket is located in the cavity and rotates along its own rotation center. A plurality of placement tables for carrying wafers are rotatably arranged on the swivel bracket so that the wafers are always in a horizontal state; The conveyor is used to lift or lower the wafers. The wafers to be processed are lifted by the conveyor from the lowermost placement table and leave the placement table. The processed wafers are lowered by the conveyor at the lowermost placement table and sit on the placement table. A linear driving member, used for driving the conveying member to enter and exit the cavity through the first sheet entry and exit port; Wherein, the first sheet entry and exit port, the lowermost storage platform, the conveying member and the linear driving member have corresponding heights.

[0005] Furthermore, the conveying member comprises: A substrate having a vacuum channel disposed therein; A placement plate is arranged parallel to and above the substrate; A plurality of metal bellows are evenly arranged between the base plate and the placement plate, any of the metal bellows is arranged vertically, and any of the metal bellows is communicated with the vacuum channel.

[0006] Furthermore, a cooling channel which does not interfere with the vacuum channel is arranged inside the substrate.

[0007] Furthermore, the conveying member further comprises: The giving way grooves extend from one end of the substrate and one end of the placement plate to the other end of the substrate and the other end of the placement plate respectively.

[0008] Furthermore, the swivel bracket further comprises: Rotating wheel; A plurality of fixed frames, one side of any of the fixed frames being fixedly connected to the edge of the rotary wheel, and the plurality of fixed frames being arranged on the rotary wheel at equal intervals; Wherein, a plurality of the storage tables are rotatably connected to the sides of a plurality of the fixing frames away from the rotating wheel.

[0009] Furthermore, a heating element is provided in the cavity at a side close to the second sheet inlet and outlet.

[0010] Furthermore, a first switch is provided at the first sheet entry and exit port.

[0011] Furthermore, a second switch is provided at the second sheet entry and exit port.

[0012] Advantages of the present invention: The robot adopts a rotary support, a conveyor, a first inlet and outlet, and a second inlet and outlet. After the wafer process is completed, the conveyor takes out the wafer from the process chamber, and the wafer enters the chamber from the first inlet and outlet and is temporarily stored in the chamber. The robot can handle other tasks during this period. When the wafers on the rotary support are full, the robot enters the chamber from the second inlet and outlet to take out the wafers in a centralized manner, realizing the centralized transition of wafers, integrating the original waiting time of the robot, and improving the use efficiency of the robot. A substrate, a placement plate, a metal bellows and a vacuum channel are used. The vacuum channel is connected to a vacuum pump to perform vacuuming, so that the metal bellows can be extended and retracted in a small vertical range, and the placement plate can be lifted and lowered in a small range. The placement plate cooperates with the storage table to complete the placement and removal of wafers. The power source of the placement plate can be shared with the power source of other process chambers, saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a cutaway structural diagram of the present invention.

[0014] Figure 2 This is a usage state diagram of the present invention.

[0015] Figure 3 This is a structural diagram of the conveyor.

[0016] Figure 4 A cross-sectional view of the substrate.

[0017] Figure 5 Schematic diagram of the assembly of the substrate and the metal bellows.

[0018] In the figure: 10-cavity, 10a-first sheet inlet and outlet, 10b-second sheet inlet and outlet, 110-rotating bracket, 111-rotating wheel, 112-fixing frame, 113-storage table, 120-conveyor, 121-substrate, 122-placing plate, 122a-shaped groove, 123-metal bellows, 124-allowing groove, 130-linear driving part, 140-heating part, 150-first switch, 160-second switch, 20-process chamber. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0020] Please see attached Figure 1 The present application proposes a multi-wafer storage chamber, comprising: a chamber 10, wherein two opposite sides are respectively provided with a first wafer inlet and outlet port 10a and a second wafer inlet and outlet port 10b; a rotary support 110, located in the chamber 10 and rotating along its own rotation center, and a plurality of wafer placing tables 113 for carrying wafers are rotatably arranged on the rotary support 110, so that the wafers are always in a horizontal state; a conveying member 120, used to lift or lower the wafers, and the wafers to be processed are placed from the lowermost wafer placing table 113 The processed wafer is lifted by the conveyor member 120 at the platform 113 and leaves the storage platform 113, and is lowered by the conveyor member 120 at the lowest storage platform 113 and sits on the storage platform 113; the linear drive member 130 is used to drive the conveyor member 120 to enter and exit the cavity 10 through the first inlet and outlet port 10a; wherein the first inlet and outlet port 10a, the lowest storage platform 113, the conveyor member 120 and the linear drive member 130 have corresponding heights.

[0021] When using, if attached Figure 1 and attached Figure 2As shown, the chamber 10 is connected to the process chamber 20, and the first film inlet and outlet port 10a is opposite to the film inlet and outlet port of the process chamber 20. In one embodiment, the rotation center of the swivel bracket 110 is along the front-back direction of the chamber 10, and the rotation of the swivel bracket 110 is achieved by driving the swivel bracket 110 to rotate by a motor; the first film inlet and outlet port 10a is located on the left side of the swivel bracket 110, and the opening or closing of the first film inlet and outlet port 10a is controlled by a first switch 150; the second film inlet and outlet port 10b is located on the right side of the swivel bracket 110, and the opening or closing of the second film inlet and outlet port 10b is controlled by a second switch 160; the main body of the linear drive member 130 is arranged outside the right side of the chamber 10 to reduce the occupied space inside the chamber 10.

[0022] The following is a detailed description of the working process of the present invention and the robot: In the first stage, the second switch 160 opens the second inlet and outlet 10b, and the robot grabs the wafer to be processed and enters the chamber 10 from the second inlet and outlet 10b, and places it on the storage table 113 closest to the second inlet and outlet 10b. With the rotation of the rotary support 110 and the repeated actions of the robot, all the storage tables 113 are loaded with wafers, and then the second switch 160 closes the second inlet and outlet 10b, and the work of the robot is temporarily terminated, and the robot can be called to participate in other grabbing work; In the second stage, the first switch 150 opens the first inlet and outlet port 10a, the conveyor 120 lifts the lowermost wafer from the storage table 113, and then the conveyor 120 drives the linear drive 130 to deliver the wafer from the first inlet and outlet port 10a into the process chamber 20, the ejector pins in the process chamber 20 rise, the conveyor 120 lowers the wafer, the wafer leaves the conveyor 120 and sits on the ejector pins, as the ejector pins descend, the wafer sits on the wafer carrier, the empty conveyor 120 withdraws, the first inlet and outlet port 10a is closed, and the wafer processing is waiting to be completed; In the third stage, the wafer process is completed, the first inlet and outlet port 10a is opened, and the empty conveyor 120 enters the process chamber 20 under the drive of the linear drive member 130. The ejector pins in the process chamber 20 rise to lift the wafer, and the conveyor 120 lifts the wafer. The wafer leaves the ejector pins and sits on the conveyor 120, and is sent back into the chamber 10. The wafer is placed on the storage table 113. As the rotary support 110 rotates, the processed wafer is transferred to the next station, and the unprocessed wafer is transferred to the bottom. The conveying action of the conveyor 120 is repeated until all wafers are processed and the first inlet and outlet port 10a is closed. In the fourth stage, the second wafer inlet and outlet port 10 b is opened, the robot arm is moved back to the chamber 10 , and all wafers on the rotary support 110 are removed in sequence.

[0023] Through the above cooperation between the wafer storage chamber and the manipulator, it can be understood that in the prior art, before a single access to the wafer, the manipulator needs to be transferred from other stations to the process chamber 20 in advance, which is called the waiting time. For example, the single waiting time from the original station of the manipulator is 5 seconds, and the time for the manipulator to return to the original station to continue working after the wafer is taken away and stored is 5 seconds, then the transfer time of the manipulator required for accessing 10 wafers is 100 seconds. By adopting the present invention, the access operation of the manipulator is centralized, and the manipulator only needs to be transferred once for 10 wafers, and the waiting time of the manipulator is only 10 seconds, and the manipulator does not need to frequently travel back and forth between the stations. After integrating the original waiting time, the manipulator can go to other stations to work, thereby improving the use efficiency of the manipulator.

[0024] It should be noted that the heights of the first wafer inlet and outlet 10a, the lowermost storage table 113, the conveying member 120 and the linear drive member 130 of the present application correspond to each other, so that the movement path of the wafer in and out of the process chamber 20 is always on the same horizontal line. The movement path of the wafer is single, which is not only convenient for control, but also for positioning, reducing the difficulty of designing the wafer storage chamber.

[0025] In a specific embodiment, the first switch 150 and the second switch 160 are gate valves respectively, and a simple and stable valve body structure is adopted to realize stable switching of the first inlet and outlet port 10a and the second inlet and outlet port 10b.

[0026] In some embodiments, the linear drive member 130 is a common linear conveying structure in the prior art, such as a cylinder, a ball screw feeding mechanism, a gear rack feeding mechanism, etc., which will not be described in detail here.

[0027] Please see attached Figure 3 -Attached Figure 5 The conveying member 120 includes: a substrate 121, which is provided with a vacuum channel 121a; a placement plate 122, which is arranged parallel to the substrate 121; a plurality of metal bellows 123, which are evenly arranged between the substrate 121 and the placement plate 122, and any of the metal bellows 123 is arranged vertically, and any of the metal bellows 123 is connected to the vacuum channel 121a.

[0028] In one embodiment, there are four metal bellows 123 arranged in a rectangular shape, and the vacuum channel 121a is connected to a vacuum pump or a vacuum system to vacuum the metal bellows 123. The contraction of the metal bellows 123 is controlled by the negative pressure to achieve a small rise and fall of the placement plate 122. The rise and fall of the placement plate 122 creates a height difference between the placement plate 122 and the placement table 113, so that the placement plate 122 can lift or lower the wafer.

[0029] It can be understood that in this embodiment, the expansion and contraction trajectory of the metal bellows 123 can be controlled by controlling the ratio of the diameter and height of the metal bellows 123, so that the metal bellows 123 has only expansion and contraction movements and no bending movements.

[0030] The conveying process of the conveying member 120 in the second stage of the present invention is described as follows: The conveying member 120 corresponds to the lowermost placement table 113, and the negative pressure in the vacuum channel 121a causes the metal bellows 123 to contract, and the placement plate 122 is located below the placement table 113 and lower than the placement plate 122, and the wafer is seated on the placement table 113; the negative pressure in the vacuum channel 121a causes the metal bellows 123 to extend, and the placement plate 122 gradually rises and is higher than the placement table 113, and the wafer is caught by the placement plate 122 and is lifted with the placement plate 122, thereby completing the lifting of the wafer; the wafer to be processed is sent into the process chamber 20, and the negative pressure in the vacuum channel 121a causes the placement plate 122 to gradually descend and be lower than the ejector pin on the wafer carrier in the process chamber, and the wafer is seated on the ejector pin, and the wafer is lowered as the ejector pin descends; the empty conveying member 120 withdraws to correspond to the lowermost placement table 113, and a conveying cycle ends.

[0031] The conveying process of the conveying member 120 in the third stage of the present invention is described as follows: The conveying member 120 enters the process chamber 20, and the negative pressure in the vacuum channel 121a causes the metal bellows 123 to stretch, the ejector pin rises to lift the wafer from the wafer carrier, and the placement plate 122 gradually rises and is higher than the ejector pin. The wafer is caught by the placement plate 122 and is lifted along with the placement plate 122, thus completing the lifting of the wafer. The processed wafer enters the cavity 10, and the negative pressure in the vacuum channel 121a causes the placement plate 122 to gradually descend and be lower than the placement table 113, and the wafer sits on the placement table 113, thus completing the lowering of the wafer, and a conveying cycle ends.

[0032] From the above description of the conveying process of the conveying member 120 , it can be seen that the conveying member 120 has simple and fast movements and can adapt to the process environment in the process chamber 20 . The vacuum channel 121a can share a vacuum system with the process chamber 20 , saving costs.

[0033] In one embodiment, please refer to the attached Figure 3 and attached Figure 4 A cooling channel 121b that does not interfere with the vacuum channel 121a is disposed inside the substrate 121. The cooling channel 121b allows the cooling liquid to flow through the cooling channel to cool the wafer on the placement plate 122 by heat transfer.

[0034] In one embodiment, in order to facilitate the positioning of the wafer by the placement plate 122, the placement plate 122 also includes a shaped groove 122a, which is formed downward from the top of the placement plate 122 and whose shape is adapted to the outer shape of the wafer; when the wafer is located on the placement plate 122, it is stuck in the shaped groove 122a to prevent the wafer position from shifting and affecting the grasping.

[0035] In this embodiment, a groove adapted to the shape of the wafer is also provided on the placement table 113, and the shape of the groove is complementary to the shape groove 122a, so that the shape of the groove and the shape groove 122a are combined into a complete wafer shape; in this way, not only the positioning of the wafer on two different carriers is achieved and the positioning accuracy is improved, but the placement table 113 and the placement plate 122 can also share a set of molds to further reduce costs.

[0036] In one embodiment, please refer to the attached Figure 3 , the conveyor 120 further includes a clearance groove 124, which extends from one end of the substrate 121 and one end of the placement plate 122 to the other end of the substrate 121 and the other end of the placement plate 122. In this embodiment, the clearance groove 124 is respectively arranged at the middle position of the substrate 121 and the middle position of the placement plate 122, and the metal bellows 123 are distributed at the front and rear sides of the clearance groove 124; when the conveyor 120 enters the process chamber 20 in the horizontal direction, the clearance groove 124 avoids the ejector pin under the wafer stage, so that the placement plate 122 can face the center of the wafer stage, and as the placement plate 122 descends, the wafer is accurately placed on the wafer stage, which is conducive to accurate wafer placement.

[0037] Please see attached Figure 1 As an embodiment of the present application, the rotating bracket also includes: a rotating wheel 111; a plurality of fixed frames 112, one side of any of the fixed frames 112 is fixedly connected to the edge of the rotating wheel 111, and a plurality of the fixed frames 112 are arranged on the rotating wheel 111 at equal intervals; wherein, a plurality of the storage platforms 113 are respectively rotatably connected to the edges of the plurality of the fixed frames 112 away from the rotating wheel 111.

[0038] Specifically, in the attached Figure 1 In the figure, the rotating wheel 111 is in the shape of a wheel, and its center is connected to the motor through an axis to realize rotating motion, and the fixed frame 112 is fixed on the outer ring of the rotating wheel 111; the fixed frame 112 is a rectangular frame, and the plane where the rectangular frame is located is parallel to the axis of the rotating wheel 111; the storage table 113 is roughly in the shape of a clamp and extends in the front-to-back direction, the top of the clamp is sleeved in the middle of the outer side of the fixed frame 112, and the claw on the lower side of the clamp faces inward and is used to carry the wafer.

[0039] It should be noted that, in the front-to-back direction, the length of the fixed frame 112 is greater than the length of the storage table 113 and the diameter of the wafer; when the wafer is fed into the chamber 10 from the second wafer entry and exit port 10b, as the robot releases the wafer, the wafer passes through the fixed frame 112 and the inner side of the storage table 113 and sits on the storage table 113; when the wafer moves to the uppermost side with the rotating wheel 111, the storage table 113 is located inside the fixed frame 112; when the wafer moves to the lowermost side with the rotating wheel 111, the storage table 113 is located at the lower side of the fixed frame 112. The fixed frame 112 can avoid the moving space required by the storage table 113 and does not affect the bearing capacity of the wafer.

[0040] As an embodiment of this application, please refer to the attached Figure 2 A heating element 140 is provided on one side of the cavity 10 near the second wafer inlet and outlet port 10b. The heating element 140 is a heating structure such as a heating rod, a heating wire, or a heating lamp, which can preheat the wafer entering the cavity 10 to facilitate it to meet the process requirements.

[0041] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A multi-wafer storage chamber, characterized in that: include: A cavity (10), wherein two opposite side surfaces are respectively provided with a first sheet inlet and outlet opening (10a) and a second sheet inlet and outlet opening (10b); A swivel bracket (110) is located in the cavity (10) and rotates along its own rotation center, and a plurality of storage tables (113) for carrying wafers are rotatably arranged on the swivel bracket (110) so that the wafers are always in a horizontal state; The conveyor (120) is used to lift or lower wafers, wherein the wafer to be processed is lifted by the conveyor (120) from the lowermost placement table (113) and leaves the placement table (113), and the processed wafer is lowered by the conveyor (120) at the lowermost placement table (113) and sits on the placement table (113); A linear driving member (130) used for driving the conveying member (120) to enter and exit the cavity (10) through the first sheet entry and exit opening (10a); The first sheet entry and exit port (10a), the lowermost storage platform (113), the conveying member (120) and the linear drive member (130) are at corresponding heights.

2. The multi-wafer storage chamber according to claim 1, characterized in that: The conveying member (120) comprises: A substrate (121), wherein a vacuum channel (121a) is provided inside the substrate; A placement plate (122) is arranged parallel to and above the substrate (121); A plurality of metal bellows (123) are evenly arranged between the base plate (121) and the placement plate (122); any one of the metal bellows (123) is arranged vertically, and any one of the metal bellows (123) is in communication with the vacuum channel (121a).

3. The multi-wafer storage chamber according to claim 2, characterized in that: A cooling channel (121b) which does not interfere with the vacuum channel (121a) is arranged inside the substrate (121).

4. The multi-wafer storage chamber according to claim 2, characterized in that: The placement plate (122) further includes: A shaped groove (122a) is formed by being recessed downward from the top of the placement plate (122), and its shape is adapted to the outer shape of the wafer.

5. The multi-wafer storage chamber according to claim 2, characterized in that: The conveying member (120) further comprises: The clearance groove (124) extends from one end of the base plate (121) and one end of the placement plate (122) to the other end of the base plate (121) and the other end of the placement plate (122).

6. The multi-wafer storage chamber according to any one of claims 1 to 5, characterized in that: The swivel bracket (110) further comprises: Rotating wheel (111); a plurality of fixed frames (112), one side of any of the fixed frames (112) being fixedly connected to the edge of the rotary wheel (111), and the plurality of fixed frames (112) being arranged on the rotary wheel (111) at equal intervals; Wherein, the plurality of storage tables (113) are rotatably connected to the edges of the plurality of fixed frames (112) away from the rotating wheel (111).

7. The multi-wafer storage chamber according to any one of claims 1 to 5, characterized in that: A heating element (140) is provided in the cavity (10) on a side close to the second sheet inlet and outlet (10b).

8. The multi-wafer storage chamber according to any one of claims 1 to 5, characterized in that: A first switch (150) is provided at the first film entry and exit port (10a).

9. The multi-wafer storage chamber according to any one of claims 1 to 5, characterized in that: A second switch (160) is provided at the second film inlet and outlet port (10b).

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