Honeycomb type active phased array front-end structure

By adopting a honeycomb design in the front-end structure of the active phased array, and using the through cavity, blind cavity and guide positioning structure, the problem of insufficient structural integrity and compactness in the prior art is solved, and high integration and efficient thermal management are achieved.

CN119695443AActive Publication Date: 2025-03-25CHINA SHIPBUILDING IND CORP NO 723 RESEARCH INSTITUTE
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Patent Information

Application Number
CN202411871592.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-18
Publication Date
2025-03-25
Estimated Expiration
2044-12-18

AI Technical Summary

Technical Problem

The existing active phased array front-end structure has shortcomings in size, weight, structural integrity and space utilization, and it is difficult to meet the high-density integration and compactness requirements of aerospace electronic equipment.

Method used

The honeycomb front-end structure design is adopted, and the compactness and sealing of the structure are improved by setting multiple through-cavities and blind chambers on the front-end skeleton, power amplifier components and phase change energy storage materials are installed, and the guide positioning structure and sealing bracket are used to improve the compactness and sealing of the structure.

Benefits of technology

The compactness and high integration of the front-end structure are achieved, reducing the working temperature of the amplifier assembly, improving the heat conduction efficiency and space utilization, while reducing assembly complexity and weight.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the field of electronic equipment array surface structure design, in particular to a honeycomb type active phased array front-end structure which comprises a front-end framework, an antenna array and a feed network, a plurality of through cavities and a plurality of blind cavities are formed in the front-end framework, power amplifier assemblies are installed in the through cavities, and the blind cavities are filled with phase change energy storage materials. The blind cavities are distributed around the through cavities to separate the adjacent through cavities, and a heat conduction gasket is arranged on the heat dissipation surface of the power amplifier assembly; the antenna array is mounted on the upper end surface of the front-end framework, and the antenna array is connected with the power amplifier assembly through the feed connector; the feed network is installed on the lower end face of the front-end framework, and the feed network is connected with the power amplifier assembly through the feed connector. According to the device, the working temperature of the power amplifier assembly is reduced, the light weight of the structure is realized, and the space utilization rate is improved.
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Description

Technical Field

[0001] The invention relates to the field of electronic equipment array surface structure design, and in particular to a cellular active phased array front end structure. Background Art

[0002] The active phased array carried on a certain aerospace electronic equipment has a cylindrical shape. Different from the active phased arrays on other platforms (ships, aircraft, and automobiles), it is limited by the shape, platform size, resources, and working environment. The diameter of the cylindrical cross section is usually small, and the requirements in terms of volume, weight, structural rigidity and strength, reliability, heat dissipation, maintenance, storage, and environmental adaptability are very stringent. In addition, with the improvement of the mission requirements of aerospace electronic equipment in recent years, the transmission power density of the active phased array has continued to increase, and the requirements for structural vibration and impact resistance have been greatly improved. The above-mentioned severity has been further improved. Improving the structural integration density and compactness of the array surface is a key technical means to solve these problems. In order to make full use of space and improve structural strength and rigidity, structural design usually adopts an integrated integration solution, such as designing antennas, power amplifier components, feed networks, power supplies and other functional units on a substrate through welding or sintering, reducing mechanical connection interfaces, improving integration, and greatly reducing size, but it will bring about problems such as a significant increase in development and maintenance costs. If the structural design is reasonable and appropriate, it can improve integration to a certain extent while obtaining good repair and maintainability.

[0003] The front end of the active phased array is usually designed according to the sub-array structure, and the large array is combined through the sub-array. Common sub-array forms are brick, blade and tile. The brick sub-array structure integrates the front end of the array into square sub-arrays such as 4×4 channels and 8×8 channels, blindly plug and interconnect and feed them one by one, and install them on a large frame to form a whole array. The blade sub-array structure integrates the front end of the array into long strip sub-arrays such as 2×8 channels and 2×32 channels, blindly plug and interconnect and feed them one by one, and install them on a large frame to form a whole array. The tile sub-array structure layers the power amplifier components, feeding network, and power supply into a tile structure, stacks them layer by layer to form sub-arrays, and then assembles them on a large frame to form a whole array.

[0004] Conventional brick-type, blade-type, and tile-type active front-end subarrays in the prior art mount the power amplifier components on the heat dissipation module and the heat dissipation plate, and then blindly fix them on the front-end skeleton. The skeleton structure is split, the mechanical connection interface increases, the number of structural parts increases, the structural integrity and integrated integration are reduced, and part of the space and weight are occupied by structural parts, connecting fasteners, full-size guide and positioning parts, guide rails, and sealing structures. Since the subarray is large in size and is square or long in shape, it has poor adaptability to the cylindrical structure shape, reducing the utilization rate of limited space. Conventional brick-type, blade-type, and tile-type active phased array front-end subarrays have high channel integration and a large number of blind-plugging channels, but the front-end skeleton has a large span. In order to ensure rigidity, the supporting structure and guide rails are large in size. In particular, the blade-type subarray has a large span in one direction, and it is usually impossible to add beams, columns and other reinforcement structures at a small interval, resulting in poor integrity of the main structural parts, which is not conducive to improving strength and rigidity, nor is it conducive to miniaturization and lightweight design. Due to the large size of the subarray and the large number of blind-plugging channels, the front-end structure of the conventional array mostly uses steel guide locating pins to assemble on the subarray module, and it is necessary to set guide locating part mounting holes or even mounting flanges on the relevant structural parts. The structure is large in size, heavy in weight, and has low space utilization, which increases the assembly links and reduces the accuracy and reliability. Conventional brick-type, blade-type, and tile-type active phased arrays have large size and weight, and low space utilization, which increases the assembly links and reduces the accuracy and reliability. When designing the front-end subarray of the array control system, the power amplifier components are installed on the heat dissipation module and the heat dissipation cold plate and plugged in and out together. The heat dissipation units between the subarrays are relatively independent, and the assembly connection interface is increased, the thermal resistance is increased, and the temperature uniformity is insufficient. There is also a method of pressing and fixing the power amplifier components on the heat dissipation module through a locking mechanism, but the locking mechanism is relatively complex and large in size, which is not conducive to small and lightweight design, and usually in order to reduce the contact thermal resistance, it is necessary to apply thermal interface materials such as silicone grease on the locking surface, which has redundant materials; usually the sealing structure requires a certain width to meet the installation space required for the U-shaped groove of the sealing strip on the end face, and due to the need for the installation of thermal conductivity and phase change energy storage materials, it is impossible to design a local thick wall, which will greatly increase the weight of the front-end skeleton. While the wall thickness increases, it also compresses the installation space of the phase change energy storage material, reducing the heat storage and heat dissipation capacity. In summary, the existing technology mainly has the problems of structural integrity, compactness, integrated integration, and insufficient space utilization, resulting in large size and weight of the structure, which leads to complex structure.

[0005] Therefore, it is necessary to provide a cellular active phased array front-end structure to solve the above problems. Summary of the invention

[0006] The present invention provides a cellular active phased array front end structure to solve the existing problems.

[0007] A cellular active phased array front-end structure of the present invention adopts the following technical solution, including: A front-end frame is provided with a plurality of through cavities and a plurality of blind cavities, wherein a power amplifier component is installed in the through cavity, and a phase change energy storage material is filled in the blind cavity, wherein the blind cavities are distributed around the through cavity to separate adjacent through cavities, and a heat conductive pad is provided on the heat dissipation surface of the power amplifier component; The antenna array is installed on the upper end surface of the front frame and is connected to the power amplifier assembly through a feed connector; And a feeding network is installed on the lower end surface of the front-end frame and is connected to the power amplifier component through a feeding connector.

[0008] Preferably, the front end frame comprises: The upper frame and the lower frame are connected by screws, wherein the through cavity runs through the upper frame and the lower frame, and the blind cavity is arranged on the opposite sides of the upper frame and the lower frame; and a sealing bracket, which is arranged between the opposite surfaces of the upper half frame and the lower half frame, and the sealing bracket is arranged through the corresponding position of the through cavity, the sealing bracket is provided with a mounting protrusion for matching with the blind cavity, and sealing strips are provided between the mounting protrusion and the blind cavity, and between the through cavity and the through opening; Wherein, a closed cavity is formed between each blind cavity and the mounting protrusion of the sealing bracket, and the phase change energy storage material is filled in the closed cavity.

[0009] Preferably, the lower half frame has a sunken surface, the sealing bracket is arranged in the sunken surface, and an installation gap for installing the sealing strip is formed between the outer peripheral surface of the sealing bracket and the inner wall surface of the lower half frame, between the through-hole of the sealing bracket and the cavity wall of the through cavity, and between the installation protrusion of the sealing bracket and the cavity wall of the blind cavity.

[0010] Preferably, the antenna array is connected to the top of the upper frame via an antenna mounting plate; the feed network is connected to the bottom of the lower frame via an adapter plate.

[0011] Preferably, the power amplifier assembly includes: a power amplifier body, a first feed port is arranged on the top of the power amplifier body, and a second feed port is arranged on the bottom of the power amplifier body, wherein the power amplifier body is arranged in the through cavity through a guiding and positioning structure, and the first feed port is connected to the antenna array through a feed connector, and the second feed port is connected to the feed network through the feed connector.

[0012] Preferably, the guiding and positioning structure comprises: A guide boss is arranged on an opposite side surface close to the top of the amplifier body; A guide groove is provided on the opposite surface of the through cavity, and the guide boss matches the guide groove; A wedge-shaped block is arranged at one side of the bottom of the power amplifier body; And an inclined block is arranged on the adapter plate, and the inclined block cooperates with the corresponding wedge-shaped square block of the power amplifier body to guide the power amplifier body so that the wedge-shaped square block enters the square hole opened on the adapter plate.

[0013] Preferably, a mounting flange is provided on one side of the top of the power amplifier body, and the mounting flange is arranged in a groove opened in the upper frame on one side of the through cavity, and the mounting flange is connected to the groove of the upper frame by screws.

[0014] Preferably, the side of the power amplifier body facing away from the mounting flange is a heat dissipation surface, a thermal conductive pad is arranged on the heat dissipation surface, and the heat dissipation surfaces of all the power amplifier bodies are located on the same side of the power amplifier body.

[0015] Preferably, the front end frame is made of aluminum alloy.

[0016] Preferably, the phase change energy storage material is expanded graphite impregnated with paraffin.

[0017] The beneficial effects of the present invention are: 1. Since the blind cavities of the front-end skeleton are distributed around the through cavity to separate adjacent through cavities, the inner cavity of the front-end skeleton forms a honeycomb structure. A power amplifier component is arranged in the through cavity of the front-end skeleton. The power amplifier component transfers heat to the cavity wall of the front-end skeleton through the thermal conductive pad, and transfers heat to the phase change energy storage material through the cavity wall, thereby reducing the operating temperature of the power amplifier component, with small thermal resistance and good temperature control effect.

[0018] 2. A guide positioning structure that is integrally processed with the power amplifier body is adopted, that is, the positioning pins are used to realize one-time positioning of the lower half frame and the feeding network. When the power amplifier components are installed, the bottom is guided by the wedge-shaped square and the inclined block on the adapter plate, and the top is guided by the guide protrusion and the guide groove on the front frame. After entering the effective positioning matching section, the wedge-shaped square enters the square hole, and the guide protrusion completely enters the guide groove to realize upper and lower positioning, avoiding the use of guide pins and pin screw structures for assembly and positioning, reducing assembly and matching links, and due to the overall processing, it has small size, high precision, and stable and reliable guiding and positioning.

[0019] 3. A sealing bracket is used in conjunction with the sunken surface and inner wall of the lower half frame to form a sealing groove. After the sealing strip is installed, the phase change energy storage material can be sealed, which meets the sealing requirements while greatly reducing the thickness of the front-end frame cavity wall, significantly improving the degree of lightweight and increasing space utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1It is a schematic diagram of the front-end structure of a cellular active phased array of the present invention; Figure 2 It is a schematic structural diagram of the front end skeleton of the present invention; Figure 3 is a schematic diagram of the guiding and positioning structure of the present invention; Figure 4 It is a schematic diagram of the guiding and positioning matching process of the present invention; Figure 5 It is a schematic diagram of heat conduction and heat dissipation from the power amplifier component to the thermal conductive pad to the front-end frame of the present invention; Figure 6 It is an exploded view of the front end frame of the present invention.

[0022] In the figure: 1. Antenna array; 1-1. Antenna mounting plate; 2. Front end skeleton; 2-1. Upper skeleton; 2-2. Lower skeleton; 2-3. Through cavity; 2-4. Blind cavity; 2-5. Cavity wall; 2-6. Guide groove; 2-7. Pin hole; 2-8. Sunken surface; 2-9. Inner wall; 3. Power amplifier assembly; 3-1. Guide protrusion; 3-2. Wedge-shaped block; 3-3. Heat dissipation surface; 3-4. Upper feed port; 3-5. Lower feed port; 3-6. Disassembly process hole; 3-7. Mounting flange; 4. Phase change energy storage material; 5. Thermal conductive pad; 6. Sealing bracket; 7. Sealing strip; 8. Feed network; 8-1. Feed network adapter board; 8-2. Bevel block; 8-3. Square hole; 9. Positioning pin; 10. Feed connector. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] An embodiment of a cellular active phased array front-end structure of the present invention is as follows: Figure 1As shown, it includes: a front-end skeleton 2, an antenna array 1 and a feeding network 8; a plurality of through cavities 2-3 and a plurality of blind cavities 2-4 are arranged on the front-end skeleton 2, a power amplifier component 3 is installed in the through cavity 2-3, and a phase change energy storage material 4 is filled in the blind cavity 2-4, wherein the blind cavities 2-4 are distributed around the through cavity 2-3 to separate the adjacent through cavities 2-3; the antenna array 1 is installed on the upper end surface of the front-end skeleton 2, and the antenna array 1 and the power amplifier component 3 are connected through a feeding connector 10; the feeding network 8 is installed on the lower end surface of the front-end skeleton 2, and the feeding network 8 and the power amplifier component 3 are connected through a feeding connector 10, so as to realize blind plug interconnection of the power amplifier component 3 with the antenna array 1 and the feeding network 8 respectively. Among them, the front-end skeleton 2, the antenna array 1 and the feeding network 8 are positioned by pins and pin holes, and the feeding connectors 10 are all floating connectors, which together constitute the front-end blind plug feeding system of the active phased array.

[0025] like Figure 2 and Figure 3 As shown, since a small amount of liquid will precipitate after the phase change energy storage material is liquefied by heat, and will flow to the outside of the device to produce excess material, it is necessary to seal the blind cavity of the front-end skeleton after filling the phase change energy storage material. Therefore, the front-end skeleton 2 in this embodiment includes: an upper skeleton 2-1, a lower skeleton 2-2 and a sealing bracket 6. The upper skeleton 2-1 and the lower skeleton 2-2 are connected by screws. The cavity layout of the upper skeleton 2-1 and the lower skeleton 2-2 is similar to a honeycomb structure. The blind cavity 2-4 is distributed around the through cavity 2-3, and the cavity walls 2-5 are interconnected. The structural integrity and rigidity are good, and the cavity wall 2-5 has a good thermal conductivity. Among them, the through cavity 2-3 runs through the upper skeleton 2-1 and the lower skeleton 2-2, and the blind cavity 2-4 is arranged on the opposite sides of the upper skeleton 2-1 and the lower skeleton 2-2; as shown Figure 6 As shown, the sealing bracket 6 is arranged between the opposite surfaces of the upper half frame 2-1 and the lower half frame 2-2, and the sealing bracket 6 is arranged through the corresponding position of the through cavity 2-3, and the sealing bracket 6 is provided with a mounting protrusion for matching with the blind cavity 2-4, and a sealing strip 7 is provided between the mounting protrusion and the blind cavity 2-4, and between the through cavity 2-3 and the through opening; wherein, as Figure 1 As shown, a closed cavity is formed between each blind cavity 2-4 and the mounting protrusion of the sealing bracket 6, and the phase change energy storage material 4 is filled in the closed cavity. In this embodiment, the front end skeleton 2 is made of 6061 aluminum alloy material; the phase change energy storage material 4 is made of expanded graphite impregnated with paraffin.

[0026] like Figure 6 As shown, the lower half skeleton 2-2 has a sunken surface 2-8, the sealing bracket 6 is arranged in the sunken surface 2-8, and an installation gap for installing the sealing strip 7 is formed between the outer peripheral surface of the sealing bracket 6 and the inner wall surface 2-9 of the lower half skeleton 2-2, between the through-opening of the sealing bracket 6 and the cavity wall 2-5 of the through cavity 2-3, and between the installation protrusion of the sealing bracket 6 and the cavity wall 2-5 of the blind cavity 2-4.

[0027] like Figure 1 and Figure 3 As shown, the antenna array 1 is connected to the top of the upper skeleton 2-1 through the antenna mounting plate 1-1, that is, the antenna mounting plate 1-1 and the antenna array 1 are positioned and connected through the positioning pins 9 and the pin holes; the feeding network 8 is connected to the bottom of the lower skeleton 2-2 through the adapter plate 8-1, that is, the adapter plate 8-1 and the feeding network 8 are positioned and connected through the positioning pins 9 and the pin holes.

[0028] like Figure 3 As shown, the power amplifier assembly 3 includes: a power amplifier body, a first feed port 3-4 is arranged on the top of the power amplifier body, and a second feed port 3-5 is arranged on the bottom of the power amplifier body, wherein the power amplifier body is arranged in the through cavity 2-3 through a guide positioning structure, and the first feed port 3-4 is connected to the antenna array 1 through a feed connector 10, and the second feed port 3-5 is connected to the feed network 8 through the feed connector 10. Specifically, the guide positioning structure includes: a guide boss 3-1, a guide groove 2-6, a wedge-shaped block 3-2 and a guide groove 2-6. and the inclined block 8-2, the guide boss 3-1 is arranged on the opposite side near the top of the power amplifier body; the guide groove 2-6 is opened on the opposite side of the through cavity 2-3, and the guide boss 3-1 matches the guide groove 2-6; the wedge-shaped square 3-2 is arranged on the bottom side of the power amplifier body; the inclined block 8-2 is arranged on the adapter plate 8-1, and the inclined block 8-2 and the corresponding wedge-shaped square 3-2 of the power amplifier body cooperate to guide the power amplifier body, so that the wedge-shaped square 3-2 enters the square hole 8-3 opened on the adapter plate 8-1. Figure 3 As shown, a mounting flange 3-7 is provided on one side of the top of the power amplifier body, and a disassembly process hole 3-6 is provided on the mounting flange 3-7. The mounting flange 3-7 is fixed in a groove provided in the upper half frame 2-1 on one side of the through cavity 2-3 by screws. Figure 4 and Figure 5 As shown, the side of the power amplifier body facing away from the mounting flange 3-7 is a heat dissipation surface 3-3, a thermal conductive pad 5 is arranged on the heat dissipation surface 3-3, and the heat dissipation surfaces 3-3 of all power amplifier bodies are located on the same side.

[0029] Among them, Figure 4As shown in the figure, the guiding and positioning matching process of the power amplifier component 3 is as follows: ① the non-heat dissipation surface on the right side of the power amplifier component 3 is attached to the wall and enters the through cavity 2-3 of the front frame 2 → ② the guiding bosses 3-1 on both sides of the top of the power amplifier component 3 are in contact with the guiding grooves 2-6 on the upper end of the inner wall of the through cavity 2-3 of the front frame 2, and at the same time, the chamfered wedge-shaped block 3-2 at the bottom is in contact with the inclined block 8-2 on the adapter plate 8-1 → ③ the power amplifier component 3 is continued to be pressed down, and under the guiding action of the inclined surface of the inclined block 8-2, the power amplifier component 3 moves downward while displacing to the left, and the thermal conductive pad 5 mounted on the heat dissipation surface 3-3 gradually approaches and contacts the cavity wall 2-5 of the front frame 2, and then undergoes extrusion and creep deformation → ④ when the guide bosses 3-1 at the bottom of the power amplifier component 3 are pressed down, the guide bosses 3-1 at the top of the power amplifier component 3 are in contact with the guiding grooves 2-6 on the upper end of the inner wall of the through cavity 2-3 of the front frame 2, and at the same time, the chamfered wedge-shaped block 3-2 at the bottom is in contact with the inclined block 8-2 on the adapter plate 8-1 → When the boss 3-1 contacts the guide groove 2-6 on the front frame 2, the bottom wedge-shaped block 3-2 of the power amplifier body enters the square hole 8-3 of the adapter plate 8-1 and formally enters the positioning section. At this time, the thickness extrusion deformation of the thermal pad 5 is between 20% and 30%, which is the normal deformation control range of the material. →⑤ As the power amplifier component 3 continues to move downward, the second feed port 3-5 at the bottom of the power amplifier body and the feed connector 10 between the feed network 8 begin to engage, and the thermal pad 5 continues to creep and deform without extrusion deformation. →⑥ When the mounting flange 3-7 of the power amplifier component 3 contacts the groove of the front frame 2, the guiding and positioning matching process is completed, and then it can be tightened with screws. Considering that the power amplifier component 3 is tightly matched, a disassembly process hole 3-6 is set in the middle of the flange 3-7 for easy disassembly. The power amplifier body of the power amplifier assembly 3 quickly conducts the heat it dissipates to the cavity wall 2-5 of the front frame 2 through the thermal pad 5. The front frame 2 is made of aluminum alloy 6061 and has a high thermal conductivity, that is, the thermal pad 5 can quickly diffuse the heat to all parts of the cavity wall 2-5, and then conduct it to the phase change energy storage material 4 in the blind cavity 2-4. The phase change energy storage material 4 used is made of expanded graphite impregnated with paraffin, and has a high thermal conductivity and latent heat value of phase change. In order to reduce the contact thermal resistance, the phase change energy storage material 4 is filled in the blind cavity 2-4 by extrusion to ensure good contact with the blind cavity wall, and the depth of the blind cavity is greater than the height of the energy storage material, so as to provide space for the phase change energy storage material to expand when heated, and prevent the front frame from deforming after the energy storage material expands when heated. Since the plugging and unplugging direction of the power amplifier component 3 is perpendicular to the heat conduction direction, and in order to reduce the contact thermal resistance between the power amplifier component and the cavity wall of the array frame, a thermal pad 5 is mounted between the conduction interfaces. During the plugging and unplugging process of the power amplifier component 3, the thermal pad 5 will produce a sliding displacement along the blind plugging direction and an extrusion displacement along the heat conduction direction, that is, creep will occur inside the thermal pad 5. The thermal pad 5 of the present invention uses an isotropic thermal interface material, and creep will not affect the thermal conductivity of the material. Construct a compact structure, high heat conduction efficiency, and low thermal resistance power amplifier component → thermal pad → cavity wall of the front frame → phase change energy storage material thermal conduction energy storage system.

[0030] It should be noted that the upper half skeleton 2-1 and the lower half skeleton 2-2 of the front-end skeleton 2 both adopt a honeycomb structure design and are integrally processed and formed. The interior is supported by criss-crossed thin cavity walls 2-5. The structure has good integrity, compactness, and rigidity, which can greatly improve the equipment integration and reduce weight. The antenna mounting plate 1-1 and the adapter plate 8-1 are whole-plate structures, and the structural rigidity is further improved after being connected and tightened. The guiding and positioning structure processed with the components is adopted, that is, the positioning pin 9 realizes the one-time positioning of the lower half frame 2-2 and the feeding network 8. When the power amplifier component 3 is installed, the bottom relies on the wedge-shaped square block 3-2 to cooperate with the inclined block 8-2 on the adapter plate 8 for guidance, and the top relies on the guiding protrusion 3-1 to cooperate with the guiding groove 2-6 on the front frame for guidance. After entering the effective positioning and matching section, the wedge-shaped square block 3-2 enters the square hole 8-3, and the guiding protrusion 3-1 completely enters the guiding groove 2-6 to achieve up and down positioning, avoiding the use of guide pins and pin screw structures for assembly and positioning, reducing assembly and matching links, and because it is processed as a whole, it has small size, high precision, and stable and reliable guiding and positioning. The thermal conductive heat dissipation system of the power amplifier component 3 → the thermal conductive pad 5 of the isotropic thermal interface material of creep extrusion → the cavity wall 2-5 of the aluminum alloy → the phase change energy storage material 4 with high thermal conductivity and high latent heat is adopted to realize the rapid temperature control of the power amplifier component, and the temperature uniformity of each power amplifier component is less than 7°C. The phase change energy storage material is sealed by a sealing structure formed by a thin sealing bracket 6, a sunken surface 2-8, an inner wall 2-9 and a sealing strip 7, without leakage. The sealing effect meets the use requirements, and the thickness of the cavity wall 2-5 is reduced by about 35%, which greatly reduces the weight of the equipment and improves space utilization.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A cellular active phased array front-end structure, characterized in that: include: A front end frame (2) is provided with a plurality of through cavities (2-3) and a plurality of blind cavities (2-4), wherein a power amplifier assembly (3) is installed in the through cavity (2-3), and a phase change energy storage material (4) is filled in the blind cavity (2-4), wherein the blind cavities (2-4) are distributed around the through cavity (2-3) to separate adjacent through cavities (2-3), and a heat conductive pad (5) is provided on the heat dissipation surface (3-3) of the power amplifier assembly (3); The antenna array (1) is mounted on the upper end surface of the front frame (2) and is connected to the power amplifier assembly (3) via a feed connector (10); And a feeding network (8) is installed on the lower end surface of the front-end frame (2) and is connected to the power amplifier component (3) via a feeding connector (10).

2. The cellular active phased array front-end structure according to claim 1, characterized in that: The front end frame (2) includes: An upper frame (2-1) and a lower frame (2-2), wherein the upper frame (2-1) and the lower frame (2-2) are connected via screws, wherein the through cavity (2-3) penetrates the upper frame (2-1) and the lower frame (2-2), and the blind cavity (2-4) is arranged on opposite surfaces of the upper frame (2-1) and the lower frame (2-2); and a sealing bracket (6) disposed between opposite surfaces of the upper half frame (2-1) and the lower half frame (2-2), and the sealing bracket (6) is arranged to penetrate corresponding positions of the through cavity (2-3), the sealing bracket (6) is provided with a mounting protrusion for cooperating with the blind cavity (2-4), and sealing strips (7) are provided between the mounting protrusion and the blind cavity (2-4) and between the through cavity (2-3) and the through opening; A closed cavity is formed between each blind cavity (2-4) and the mounting protrusion of the sealing bracket (6), and the phase change energy storage material (4) is filled in the closed cavity.

3. The cellular active phased array front-end structure according to claim 2, characterized in that: The lower half frame (2-2) has a sunken surface (2-8) in it, and the sealing bracket (6) is arranged in the sunken surface (2-8). A mounting gap for mounting the sealing strip (7) is formed between the outer peripheral surface of the sealing bracket (6) and the inner wall surface (2-9) of the lower half frame (2-2), between the through opening of the sealing bracket (6) and the cavity wall (2-5) of the through cavity (2-3), and between the mounting protrusion of the sealing bracket (6) and the cavity wall (2-5) of the blind cavity (2-4).

4. The cellular active phased array front-end structure according to claim 2, characterized in that: The antenna array (1) is connected to the top of the upper frame (2-1) via an antenna mounting plate (1-1); and the feed network (8) is connected to the bottom of the lower frame (2-2) via an adapter plate (8-1).

5. The cellular active phased array front-end structure according to claim 4, characterized in that: The power amplifier assembly (3) comprises: a power amplifier body, a first feed port (3-4) being arranged on the top of the power amplifier body, and a second feed port (3-5) being arranged on the bottom of the power amplifier body, wherein the power amplifier body is arranged in the through cavity (2-3) via a guiding and positioning structure, and the first feed port (3-4) is connected to the antenna array (1) via a feed connector (10), and the second feed port (3-5) is connected to a feed network (8) via the feed connector (10).

6. The cellular active phased array front-end structure according to claim 5, characterized in that: The guiding and positioning structure includes: A guide boss (3-1) is arranged on an opposite side surface close to the top of the power amplifier body; A guide groove (2-6) is formed on the opposite surface of the through cavity (2-3), and the guide boss (3-1) matches the guide groove (2-6); A wedge-shaped block (3-2) is arranged on one side of the bottom of the power amplifier body; and an inclined block (8-2) disposed on the adapter plate (8-1); the inclined block (8-2) and the corresponding wedge-shaped square block (3-2) of the power amplifier body cooperate to guide the power amplifier body so that the wedge-shaped square block (3-2) enters the square hole (8-3) opened on the adapter plate (8-1).

7. The cellular active phased array front-end structure according to claim 5, characterized in that: A mounting flange (3-7) is provided on one side of the top of the power amplifier body. The mounting flange (3-7) is arranged in a groove opened in an upper frame (2-1) on one side of the through cavity (2-3). The mounting flange (3-7) is connected to the groove of the upper frame (2-1) by means of screws.

8. The cellular active phased array front-end structure according to claim 7, characterized in that: A heat dissipation surface (3-3) is provided on the side of the power amplifier body facing away from the mounting flange (3-7). A heat conduction pad (5) is provided on the heat dissipation surface (3-3), and the heat dissipation surfaces (3-3) of all the power amplifier bodies are located on the same side of the power amplifier body.

9. The cellular active phased array front-end structure according to claim 1, characterized in that: The front end frame (2) is made of aluminum alloy.

10. The cellular active phased array front-end structure according to claim 1, characterized in that: The phase change energy storage material (4) is expanded graphite impregnated with paraffin.

Citation Information

Patent Citations

  • Heat dissipation assembly for heat management of phased-array antenna chip

    CN218417132U

  • Lightweight thermal adsorption structure for lithium-ion module

    US20200106143A1

  • Phased array antenna for efficient radiation of heat and arbitrarily polarized microwave signal power

    US5293171A

  • Battery module

    WO2024244173A1