Wireless circuit access switch

Abstract

The invention relates to a wireless circuit access switch. In particular, an electronic device may include one or more radios and one or more antennas. The electronic device may include an input-output interface for connection to a radio component or an antenna. To facilitate selective external connection with the radio component and the antenna, the electronic device may include a switch having a first terminal coupled to the radio component, a second terminal coupled to the antenna, and a third terminal coupled to the input-output interface. The switch may be controlled to connect any two of the three terminals to provide corresponding connections, thereby facilitating desired external connections in some scenarios while enabling wireless circuit operation with the radio component and the antenna in other scenarios.

Description

[0001] This application claims priority to U.S. patent application No. 18 / 474,012 filed on September 25, 2023, which is hereby incorporated by reference in its entirety. Technical Field

[0002] The present disclosure relates generally to electronic devices, including electronic devices having wireless circuitry. Background Art

[0003] An electronic device may have wireless capabilities. An electronic device having wireless capabilities may have wireless circuitry including one or more antennas and one or more radio components. A transmission line may connect a radio component to a corresponding antenna.

[0004] However, portions of the wireless circuitry may often be difficult to access, eg, for calibration, testing, debugging, etc. Designing satisfactory connections to the wireless circuitry may be challenging. Summary of the invention

[0005] An electronic device may include one or more radio components and one or more antennas. The electronic device may include an input-output interface circuit, the input-output interface circuit is used to connect the radio component and the antenna. Specifically, the electronic device may include a switch, the switch having a first terminal coupled to the radio component, a second terminal coupled to the antenna, and a third terminal coupled to the input-output interface circuit.

[0006] In an exemplary embodiment, the electronic device may include a system package having radio components and non-radio components mounted on a package substrate. The system package may also have an antenna integrated thereon. The system package may be mounted on a system substrate, and other components of the electronic device are connected through the system substrate. The input-output interface circuit may include an interposer, which is on the package substrate, and radio components such as radio components and / or antennas on the system package can be connected through the interposer (via a switch). The switch may be mounted on the package substrate. The interposer may provide externally facing electrical contacts for the system package. Components outside the system package can be connected to and access internal radio components and / or antennas through these externally facing electrical contacts. The system substrate may include connections to electrical contacts of the interposer, which are arranged at corresponding contacts on the substrate at the system substrate. When the switch is placed in one or more appropriate states, external equipment or equipment (such as calibration, test and / or debugging equipment) can be connected to internal radio components and / or antennas through these contacts on the substrate.

[0007] One aspect of the present disclosure provides an electronic device. The electronic device may include: a radio component; an antenna, the antenna coupled to the radio component; and an input-output interface, the input-output interface for connecting to at least one of the radio component and the antenna. The electronic device may include a switch having a first terminal coupled to the radio component, a second terminal coupled to the antenna, and a third terminal coupled to the input-output interface.

[0008] One aspect of the present disclosure provides an integrated circuit package. The integrated circuit package may include a substrate. The integrated circuit package may include: a radio component, the radio component on the substrate; an antenna, the antenna coupled to the radio component; an interposer, the interposer on the substrate; and a switch, the switch on the substrate. The switch may have a first terminal coupled to the radio component, a second terminal coupled to the antenna, and a third terminal coupled to the interposer.

[0009] One aspect of the present disclosure provides a wireless circuit. The wireless circuit may include: a radio frequency module; an antenna, the antenna coupled to the radio frequency module; and an interface circuit, the interface circuit coupled to the radio frequency module and to the antenna. The wireless circuit may include a switch, the switch having a first state, a second state, and a third state, in which the switch connects the radio frequency module to the antenna, in which the switch connects the radio frequency module to the interface circuit, and in which the switch connects the antenna to the interface circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a block diagram of an illustrative electronic device with wireless circuitry according to some embodiments.

[0011] Figure 2 is a block diagram of an illustrative wireless circuit having a radio component coupled to an antenna, according to some implementations.

[0012] Figure 3 is a block diagram of an illustrative radio circuit having a switch coupled between an antenna, a radio, and an input-output interface for accessing the antenna and / or the radio, according to some embodiments.

[0013] FIG. 4A to FIG. 4C are exemplary states of a switch coupled between an antenna, a radio, and an interface circuit according to some embodiments.

[0014] Figure 5 is a side view of an illustrative wireless system package including an access switch according to some embodiments.

[0015] Figure 6is a plan view of an illustrative wireless system package including an interposer through which wireless circuitry can be accessed via an access switch according to some embodiments.

[0016] Figure 7 is a side view of an illustrative wireless system package including a combined interposer according to some embodiments. DETAILED DESCRIPTION

[0017] Electronic devices such as Figure 1 The electronic device 10 may be provided with a wireless circuit. The wireless circuit may include one or more radio components and one or more antennas. The radio components may be coupled to corresponding antennas. Specifically, a radio frequency transmission line may transmit a radio frequency signal between the radio component and the antenna.

[0018] When the radio component and the antenna are implemented in a tightly integrated and closed system (e.g., arranged on and / or in the same package), it may be difficult for external systems, equipment, devices, and / or components to access the radio component and / or the antenna. Therefore, in order to facilitate access and not interfere with the regular transmission of radio frequency signals between the radio component and the antenna, the wireless circuit can be a switch having a first terminal coupled to the radio component, a second terminal coupled to the antenna, and a third terminal coupled to the interface circuit. Through the interface circuit, the external device or equipment can be connected to the radio component and / or the antenna via the switch. As an example, this can help facilitate calibration, testing, debugging, and / or other actions to be performed on the wireless circuit.

[0019] Figure 1 The electronic device 10 may be: a computing device, such as a laptop computer, a desktop computer, a computer monitor including an embedded computer, a tablet computer, a cellular phone, a media player, or other handheld or portable electronic device; a smaller device, such as a wristwatch device, a hanging device, an earphone or headset device (such as an earbud, a pair of earbuds, or a pair of earbuds with corresponding shells for accommodating the earbuds), a device embedded in glasses; or other equipment worn on the user's head; or other wearable or miniature devices, a television, a computer display that does not include an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which electronic equipment with a display is installed in an information kiosk or a car), a voice-controlled speaker connected to wireless Internet, a home entertainment device, a remote control device, a game controller, a peripheral user input device, a wireless base station or access point, equipment that implements the functions of two or more of these devices; or other electronic equipment.

[0020] like Figure 1As shown in the functional block diagram in , device 10 may include components located on or within an electronic device housing such as housing 12. Housing 12 (sometimes referred to as a shell) may be formed of plastic, glass, ceramic, fiber composite material, metal (such as stainless steel, aluminum, metal alloy), other suitable materials, or combinations of these materials. In some cases, part or all of housing 12 may be formed of a dielectric or other low conductivity material (such as glass, ceramic, plastic, and sapphire). In other cases, housing 12 or at least some of the structures that make up housing 12 may be formed of metal elements.

[0021] Device 10 may include control circuitry 14. Control circuitry 14 may include storage, such as storage circuitry 16. Storage circuitry 16 may include hard drive storage, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory configured to form a solid-state drive), volatile memory (e.g., static random access memory or dynamic random access memory), etc. Storage circuitry 16 may include storage integrated within device 10 and / or removable storage media.

[0022] Control circuitry 14 may include processing circuitry, such as processing circuitry 18. Processing circuitry 18 may be used to control the operation of device 10. Processing circuitry 18 may include one or more processors, microprocessors, microcontrollers, digital signal processors, host processors, baseband processor integrated circuits, application specific integrated circuits, central processing units (CPUs), etc. Control circuitry 14 may be configured to perform operations in device 10 using hardware (e.g., dedicated hardware or circuitry), firmware, and / or software. Software code for performing operations in device 10 may be stored on storage circuitry 16 (e.g., storage circuitry 16 may include a non-transitory (tangible) computer-readable storage medium storing software code). The software code may sometimes be referred to as program instructions, software, data, instructions, or code. The software code stored on storage circuitry 16 may be executed by processing circuitry 18.

[0023] The control circuit 14 may be used to run software on the device 10, such as a satellite navigation application, an Internet browsing application, a Voice over Internet Protocol (VOIP) phone call application, an email application, a media playback application, operating system functions, etc. To support interaction with external equipment, the control circuit 14 may be used to implement a communication protocol. The communication protocols that may be implemented using the control circuit 14 include the Internet Protocol, a wireless local area network (WLAN) protocol (e.g., the IEEE 802.11 protocol - sometimes referred to as Wi-Fi ® ), such as Bluetooth ®The present invention may include a protocol for other short-range wireless communication links such as the IEEE 802.11ad protocol or other wireless personal area network (WPAN) protocols, an IEEE 802.11ad protocol (e.g., an ultra-wideband protocol), a cellular phone protocol (e.g., a 3G protocol, a 4G (LTE) protocol, a 3GPP fifth generation (5G) new air interface (NR) protocol, etc.), an antenna diversity protocol, a satellite navigation system protocol (e.g., a global positioning system (GPS) protocol, a global navigation satellite system (GLONASS) protocol, etc.), an antenna-based spatial ranging protocol (e.g., a radio detection and ranging (RADAR) protocol or other desired distance detection protocol for signals transmitted at millimeter wave and centimeter wave frequencies), or any other desired communication protocol. Each communication protocol may be associated with a corresponding radio access technology (RAT), which specifies a physical connection method for implementing the protocol.

[0024] The device 10 may include input-output circuitry 20. The input-output circuitry 20 may include input-output devices 22. The input-output devices 22 may be used to allow data to be supplied to the device 10 and to allow data to be provided from the device 10 to an external device. The input-output devices 22 may include user interface devices, data port devices, and other input-output components. For example, the input-output devices 22 may include touch sensors, displays (such as touch-sensitive displays and / or force-sensitive displays), light-emitting components such as displays without touch sensor capabilities, buttons (mechanical, capacitive, optical, etc.), scroll wheels, touch pads, keypads, keyboards, microphones, cameras, buttons, speakers, status indicators, audio jacks and other audio port components, digital data port devices, motion sensors (accelerometers, gyroscopes, and / or compasses that detect motion), capacitive sensors, proximity sensors, magnetic sensors, force sensors (such as force sensors coupled to displays to detect pressure applied to the displays), temperature sensors, etc. In some configurations, keyboards, headphones, displays, pointing devices such as touch pads, mice, and joysticks, and other input-output devices may be coupled to the device 10 using wired or wireless connections.

[0025] The input-output circuit 20 may include a radio circuit 24 to support wireless communication and / or radio-based spatial ranging operations. The radio circuit 24 may include one or more antennas 30. The radio circuit 24 may also include one or more radio components 26. Each radio component 26 may include a circuit that operates a signal at a baseband (e.g., a baseband processor circuit), a signal generator circuit, a modulation / demodulation circuit (e.g., one or more modems), a radio frequency transceiver circuit (e.g., a radio frequency transmitter circuit, a radio frequency receiver circuit, a mixer circuit for down-converting a radio frequency signal to a baseband or an intermediate frequency between the radio frequency and the baseband and / or up-converting a signal at the baseband or intermediate frequency to a radio frequency, etc.), an amplifier circuit (e.g., one or more power amplifiers and / or one or more low noise amplifiers (LNAs)), an analog-to-digital converter (ADC) circuit, a digital-to-analog converter (DAC) circuit, a control path, a power path, a signal path (e.g., a radio frequency transmission line, an intermediate frequency transmission line, a baseband signal line, etc.), a switching circuit, a filter circuit, and / or any other circuit that transmits and / or receives a radio frequency signal using the antenna 30. The components of each radio 26 may be mounted on a respective substrate or integrated into a respective integrated circuit, chip, package (e.g., a system-in-package), or system-on-chip (SOC). If desired, the components of multiple radios 26 may share a single substrate, integrated circuit, chip, package, or SOC.

[0026] Any desired antenna structure may be used to form antenna 30. For example, antenna 30 may include antennas having resonant elements formed from loop antenna structures, patch or strip antenna structures, inverted-F antenna structures, slot antenna structures, planar inverted-F antenna structures, helical antenna structures, monopole antenna structures, dipole antenna structures, hybrids of these designs, etc. Filter circuits, switching circuits, impedance matching circuits, and / or other antenna tuning components may be adjusted to adjust the frequency response and wireless performance of antenna 30 over time.

[0027] The transceiver circuit in the radio component 26 can use one or more antennas 30 to transmit radio frequency signals. In other words, the antenna 30 can transmit radio frequency signals for the transceiver circuit. As used herein, the term "transmitting radio frequency signals" means the transmission and / or reception of radio frequency signals (for example, for performing unidirectional and / or bidirectional wireless communication with external wireless communication equipment). The antenna 30 can transmit radio frequency signals by radiating the radio frequency signals into free space (or radiating into free space through an intervening device structure such as a dielectric cover layer). In addition or alternatively, the antenna 30 can receive radio frequency signals from free space (for example, through an intervening device structure such as a dielectric cover layer). The transmission and reception of radio frequency signals by the antenna 30 each involve the excitation or resonance of antenna currents on antenna resonant elements in the antenna by radio frequency signals within the operating frequency band of the antenna.

[0028] Radio 26 may use antenna 30 to transmit and / or receive radio frequency signals within different bands of radio frequencies (sometimes referred to herein as communication bands or simply “bands”). The bands processed by radio 28 may include wireless local area network (WLAN) bands (e.g., Wi-Fi ® (IEEE 802.11) or other WLAN communication bands) such as 2.4 GHz WLAN band (e.g., 2400 MHz to 2480 MHz), 5 GHz WLAN band (e.g., 5180 MHz to 5825 MHz), Wi-Fi ® Band 6E (e.g., 5925MHz to 7125MHz) and / or other Wi-Fi ® frequency bands (e.g., 1875 MHz to 5160 MHz); wireless personal area network (WPAN) bands such as 2.4 GHz Bluetooth ® frequency band or other WPAN communication band; cellular telephone frequency band (e.g., frequency band from about 600 MHz to about 5 GHz, 3G frequency band, 4G LTE frequency band, 5G new radio frequency range 1 (FR1) frequency band below 10 GHz, 5G new radio frequency range 2 (FR2) frequency band between 20 GHz and 60 GHz, etc.); other centimeter or millimeter wave frequency bands between 10 GHz and 300 GHz; near field communication (NFC) frequency band (e.g., 13.56 MHz); satellite navigation frequency band (e.g., GPS frequency band from 1565 MHz to 1610 MHz, global satellite navigation system (GLONASS) frequency band, Beidou satellite navigation system (BDS) frequency band, etc.); ultra-wideband (UWB) frequency band operating under IEEE 802.15.4 protocol and / or other ultra-wideband communication protocols; communication frequency band under 3GPP wireless communication standard family; communication frequency band under IEEE 802.XX standard family, and / or any other desired frequency band of interest.

[0029] Each radio component 26 can transmit and / or receive radio frequency signals according to a corresponding radio access technology (RAT) that determines the physical connection method for the components in the corresponding radio component. If necessary, one or more radio components 26 can implement multiple RATs. As just one example, the radio components 26 in the device 10 may include a UWB radio component for transmitting UWB signals using one or more antennas 30, a Bluetooth (BT) radio component for transmitting BT signals using one or more antennas 30, a Wi-Fi radio component for transmitting WLAN signals using one or more antennas 30, a cellular radio component for transmitting cellular phone signals using one or more antennas 30 (e.g., in the 4G band, 5G FR1 band, and / or 5G FR2 band), an NFC radio component for transmitting NFC signals using one or more antennas 30, and a wireless charging radio component for receiving wireless charging signals using one or more antennas 30 for charging the battery on the device 10. This example is illustrative, and in general, the radio component 26 may include any desired combination of radio components for covering any desired combination of RATs.

[0030] The radio component 26 can use the antenna 30 to transmit and / or receive radio frequency signals, which are used to transmit wireless communication data between the device 10 and external wireless communication equipment such as one or more electronic devices 10' (e.g., one or more other devices, such as the device 10, a wireless access point or a base station, etc.) via the communication link 32. Wireless communication data can be transmitted bidirectionally or unidirectionally by the radio component 26. The wireless communication data can, for example, include data encoded into corresponding data packets, such as wireless data associated with a phone call, streaming content, Internet browsing, wireless data associated with a software application running on the device 10, email messages, etc. The radio component 26 can also use the antenna 30 to perform spatial ranging operations (e.g., to identify the distance between the device 10 and an external object). If desired, the radio component 26 that performs spatial ranging operations may include radar circuits (e.g., frequency modulated continuous wave (FMCW) radar circuits, OFDM radar circuits, FSCW radar circuits, phase coded radar circuits, other types of radar circuits).

[0031] Configurations in which device 10 is a headset, earphone, receiver, or earbud are sometimes described herein as illustrative examples. In these configurations, one or more devices 10' with which device 10 performs wireless communication may include a host device (such as a laptop computer, desktop computer, tablet computer, and / or cellular phone, etc.) to which device 10 is an accessory. In an illustrative configuration in which device 10 is an earbud for one of the user's ears, device 10 may perform wireless communication with device 10', which may be an earbud for the other ear of the user's ear. These configurations of devices 10 and 10' are illustrative. If desired, devices 10 and 10' may include any number of electronic devices that communicate wirelessly with each other.

[0032] Figure 1 The examples are illustrative. Although for the sake of clarity, Figure 1 In the example of , the control circuit 14 is shown as being separate from the wireless circuit 24, but the wireless circuit 24 may include processing circuitry (e.g., one or more processors) and / or storage circuitry, the processing circuitry forming part of the processing circuit 18, and the storage circuitry forming part of the storage circuit 16 of the control circuit 14 (e.g., portions of the control circuit 14 may be implemented on the wireless circuit 24). The wireless circuit 24 may include any desired number of antennas 30. Some or all of the antennas 30 in the wireless circuit 24 may be arranged into one or more phase-controlled antenna arrays for transmitting radio frequency signals on a steerable signal beam. If desired, the antennas 30 may be operated using a multiple-input and multiple-output (MIMO) scheme and / or using a carrier aggregation (CA) scheme.

[0033] Figure 2 yes Figure 1 Functional block diagram of the wireless circuit 24. Figure 2 As shown, each radio 26 may be communicatively coupled to one or more antennas 30 via one or more RF transmission lines 36. As an illustrative example, each RF transmission line 36 may include a ground conductor such as ground conductor 38 and a signal conductor such as signal conductor 40. Transmission lines 36 may be coupled to corresponding antennas 30 using antenna feeds such as antenna feed 46.

[0034] Specifically, ground conductor 38 may be coupled to antenna ground feed terminal 42 of feed 46 at an antenna ground structure of antenna 30. Signal conductor 40 may be coupled to antenna signal feed terminal 44 of feed 46 at an antenna resonating element of antenna 30. In arrangements employing an indirect electromagnetic coupling feeding scheme, signal conductor 40 may be coupled to antenna signal feed terminal 44 at an antenna feed structure, which is electromagnetically coupled to the antenna resonating element of antenna 30.

[0035] If desired, one or more RF transmission lines 36 may be shared between the radio 26 and / or the antenna 30. A RF front end (RFFE) module may be inserted on one or more RF transmission lines 36. The RF front end module may include a substrate, integrated circuit, chip, or package separate from the radio 26, and may include filter circuits, switching circuits, amplifier circuits, impedance matching circuits, RF coupler circuits, and / or any other desired RF circuits for operating on RF signals transmitted through the RF transmission line 36.

[0036] In some illustrative arrangements described herein as illustrative examples, the wireless circuit 24 (such as the radio component 26 and / or the antenna 30) may be mounted to one or more substrates. As illustrative examples, these substrates may include: one or more packaging substrates to which one or more components of the packaging system and / or the integrated circuit (IC) die are mounted (e.g., to implement a system-in-package (SiP)); one or more interposer substrates in which conductive routing structures are formed to route signals between two or more of the IC die, packaging system, printed circuit, etc. attached to opposite sides of the interposer substrate (e.g., to implement an interposer); or any other type of substrate, such as an antenna dielectric support substrate. Because both the illustrative SiP and the illustrative interposer may include conductive (routing) traces, vias, and other structures, the SiP or interposer may sometimes be referred to herein as a printed circuit, and the substrate therein may sometimes be referred to herein as a printed circuit substrate.

[0037] These substrates may include substrates for rigid printed circuit boards and / or flexible printed circuits. As an example, a flexible printed circuit may include a flexible printed circuit substrate formed of polyimide, liquid crystal polymer, other flexible polymer materials or other suitable materials. If necessary, the flexible printed circuit may include a multilayer laminated structure (using a layer of conductive material such as copper and a dielectric material such as a resin, which is laminated together without an intermediate adhesive). If necessary, the multilayer laminated structure may be folded or bent in two or three dimensions, and may maintain a bent or folded shape after bending. As another example, a rigid printed circuit board may include a (rigid) printed circuit substrate formed of a rigid printed circuit board material, such as a glass-filled epoxy or glass-fiber-epoxy laminate, ceramic, other rigid polymer materials or other suitable materials. If necessary, the printed circuit substrate may be formed by one or more of these flexible materials and / or rigid materials at different parts of the substrate.

[0038] exist Figure 2In an illustrative example of, radio component 26 and antenna 30 may be incorporated into a (wireless) system package (such as package 50). System package 50 may include a package substrate (as described above) to which the radio component (such as one or more integrated circuits) and / or other discrete components for radio component 26 are mounted. The components may be soldered or otherwise physically and electrically connected to the package substrate. The antenna elements of antenna 30 may be patterned (e.g., as conductive traces) on a surface of the package substrate and / or disposed elsewhere on package 50, such as on an externally facing surface of package 50. If desired, system package 50 may include components in addition to components of wireless circuitry 24, such as a radio circuit 24 mounted to the package substrate. Figure 1 The components on package 50 may be encapsulated to protect the components and / or their connections to the package substrate. System in package 50 may have electrical contacts coupled to, mounted on, soldered to, and / or otherwise connected to a system printed circuit substrate to connect other components within device 10 (such as in combination with a printed circuit substrate). Figure 1 other components of the device 10 described above).

[0039] Because wireless circuitry 24, such as radio 26 and / or antenna 30, is integrated into an encapsulated package, such as package 50, it may be difficult to provide externally exposed interfaces to access portions of radio 26, antenna 30, and / or other portions of wireless circuitry 24 for calibration, testing, debugging, and / or other purposes. The scenario in which radio 26 and antenna 30 are incorporated into an encapsulated package and are therefore difficult to access illustrates one potentially problematic scenario. In other arrangements in which, for example, radio 26 and / or antenna 30 are enclosed in and / or physically embedded in other difficult-to-remove structures, it may be similarly difficult to access portions of wireless circuitry 24.

[0040] To facilitate access to portions of wireless circuitry 24, such as radio 26 and / or antenna 30, input-output interface circuitry may be provided. If desired, the input-output interface circuitry may provide selective connections to radio 26, antenna 30, and / or other portions of wireless circuitry 24. In addition to providing an interface for connecting to radio 26 and antenna 30, radio 26 and antenna 30 may also be configured to transmit radio frequency signals during normal operation (e.g., in conjunction with a radio frequency). Figure 1Thus, to facilitate external access to radio 26 or antenna 30 during some operating modes and to provide desired connectivity between radios 26 and 30 during some operating modes, wireless circuitry 24 may include a plurality of circuits configured to be placed in different states (e.g., Figure 1 The control circuit 14) is used to adapt the switch to different operation modes.

[0041] Figure 3 is a diagram showing an exemplary switch (such as switch 90) that may be provided in radio circuit 24. Switch 90 may be coupled between a radio component (such as radio component 26) and an antenna (such as antenna 30), may be coupled between radio component 26 and a package input-output interface (such as access interface 94) (sometimes referred to as interface circuit 94 or input-output interface 94), and may be coupled between antenna 30 and access interface 94. Specifically, switch 90 may be a three-input-output terminal switch (e.g., a switch having three data terminals). Switch 90 may additionally include one or more control terminals through which a control signal for switch 90 is received. A first data terminal 92-1 of switch 90 may be coupled to a radio frequency transmission line path 41 (e.g., Figure 2 The second data terminal 92-2 of the switch 90 may be coupled to the radio component 26 via a radio frequency transmission line path 43 (eg, Figure 2 The third data terminal 92-3 may be coupled to the package input-output interface 94 via the RF transmission line path 45.

[0042] During the first operating mode, switch 90 may electrically connect terminals 92 - 1 and 92 - 2 to connect RF transmission line paths 41 and 43 (forming transmission line 36 ), thereby connecting radio 26 and antenna 30 to transmit RF signals therebetween.

[0043] Interface circuit 94 may provide connection 96 to external components (such as systems, external equipment, external devices, etc.) outside system package 50. Thus, during the second operating mode, switch 90 may electrically connect terminals 92-1 and 92-3 to connect RF transmission line paths 41 and 45, thereby connecting radio 26 and interface circuit 94 to transmit RF signals between the radio and the interface circuit. As an example, during the second operating mode, external components (such as test equipment) may be connected to radio 26 via interface circuit 94 and switch 90 to test the functionality of radio 26.

[0044] During the third operating mode, the switch 90 can electrically connect the terminals 92-2 and 92-3 to connect the RF transmission line paths 43 and 45, thereby connecting the antenna 30 to the interface circuit 94 to transmit RF signals between the antenna and the interface circuit. As an example, during the third operating mode, an external device (such as calibration equipment) can be connected to the antenna 30 via the interface circuit and the switch 90 to calibrate the antenna 30 for normal operation.

[0045] These three modes of operation are described above as illustrative examples. If desired, the second mode of operation or the third mode of operation may be omitted. If desired, switch 90 may include additional terminals (e.g., in addition to the second mode of operation or the third mode of operation) coupled to additional radio components of wireless circuit 24. Figure 3 The switch 90 may be coupled to other portions of the wireless circuit 25 in the package 50, other than the wireless circuit 26 and / or the antenna 30, if desired.

[0046] Although each of paths 41, 43, and 45 is described above as a radio frequency transmission line path (e.g., a signal conductor path shielded with or substantially referenced to a ground conductor structure), this illustrates one exemplary configuration. If desired, one or more (e.g., all) of paths 41, 43, and 45 may be a simple conductive path over which, for example, control signals and / or other types of signals may be used to transmit signals using radio 26, antenna 30, or other portions of wireless circuitry 24.

[0047] FIG. 4A to FIG. 4C The corresponding Figure 3 The three exemplary states of the switch 90 of the first operating mode, the second operating mode and the third operating mode are described. FIG. 4A to FIG. 4C As shown, switch 90 may have an internal connection point 91 (sometimes referred to as common connection point 91 or common node 91 ) to which each of external terminals 92 - 1 , 92 - 2 , and 92 - 3 may be connected.

[0048] Specifically, the switch can operate in different states when different pairs of the three terminals 92-1, 92-2, and 92-3 are connected to the connection point 91. The switch 90 can use any suitable structure to provide a conductive path 98 between the corresponding terminal 92 and the connection point 91. If desired, a transistor can be provided between each terminal 92 and the connection point 91 to selectively provide each of the three conductive paths 98. If desired, other types of circuits can be used to present a pair of desired conductive paths 98 in response to one or more control signals.

[0049] like Figure 4A As shown, in the first state of the switch 90, the terminal 92-1 can be electrically connected or shorted to the connection point 91 via the corresponding conductive paths 98, and the terminal 92-2 can be electrically connected or shorted to the connection point 91 via these corresponding conductive paths. In this first state of the switch 90, the terminal 92-3 can be disconnected from the connection point 91 to form an open circuit between the connection point 91 and the terminal 92-3. Therefore, the radio component 26 coupled to the terminal 92-1 is connected to the antenna 30 coupled to the terminal 92-1 via the short-circuit path passing through the connection point 91, and is disconnected from the interface circuit 94 in this first switch state. As an illustrative example, the control circuit 14 ( Figure 1 ) may send a control signal indicating the first state to the switch 90 (one or more control terminals of the switch), and the switch 90 may provide two conductive paths 98 in response to the control signal while removing any conductive path 98 between the connection point 91 and the terminal 92-3.

[0050] like Figure 4B As shown, in the second state of the switch 90, the terminal 92-1 can be electrically connected or shorted to the connection point 91 via the corresponding conductive path 98, and the terminal 92-3 can be electrically connected or shorted to the connection point 91 via these corresponding conductive paths. In this second state of the switch 90, the terminal 92-2 can be disconnected from the connection point 91 to form an open circuit between the connection point 91 and the terminal 92-2. Therefore, the radio component 26 coupled to the terminal 92-1 is connected to the interface circuit 94 coupled to the terminal 92-3 through the short-circuit path passing through the connection point 91, and is disconnected from the antenna 30 in this second switch state. As an illustrative example, the control circuit 14 ( Figure 1 ) may send a control signal indicating the second state to the switch 90 (one or more control terminals of the switch), and the switch 90 may provide two conductive paths 98 in response to the control signal while removing any conductive path 98 between the connection point 91 and the terminal 92-2.

[0051] like Figure 4C As shown, in the second state of the switch 90, the terminal 92-2 can be electrically connected or shorted to the connection point 91 via the corresponding conductive paths 98, and the terminal 92-3 can be electrically connected or shorted to the connection point 91 via these corresponding conductive paths. In this third state of the switch 90, the terminal 92-1 can be disconnected from the connection point 91 to form an open circuit between the connection point 91 and the terminal 92-1. Therefore, the antenna 30 coupled to the terminal 92-2 is connected to the interface circuit 94 coupled to the terminal 92-3 through the short-circuit path via the connection point 91, and is disconnected from the radio component 26 in this third switch state. As an illustrative example, the control circuit 14 ( Figure 1) may send a control signal indicating the first state to the switch 90 (one or more control terminals of the switch), and the switch 90 may provide two conductive paths 98 in response to the control signal while removing any conductive path 98 between the connection point 91 and the terminal 92-1.

[0052] As described above, the control circuit 14 ( Figure 1 ) may provide a control signal to switch 90 to place switch 90 in the first state, the second state, or the third state. Specifically, control circuit 14 may provide a control signal to switch 90 during normal operation of wireless circuit 24 (such as when transmitting radio frequency signals to provide wireless communication functions to device 10 (for example, in conjunction with Figure 1 30). The control circuit 14 may place the switch 90 in the first state to connect the radio 26 to the antenna 30. If desired, the control circuit 14 may place the switch 90 in the second state or the third state to connect portions of the wireless circuit 24 to the interface circuit 94 during calibration, testing, debugging, and / or other operations where access to corresponding portions of the wireless circuit 24 (such as the radio 26 or the antenna 30) is desired. These examples are merely illustrative. In general, the control circuit 14 may place the switch 90 in the second state or the third state to provide access to the radio 26 or the antenna 30 to any type of external system or circuit.

[0053] Figure 5 is an exemplary system package such as package 54, which may be Figure 3 An exemplary implementation of package 50 in FIG. 1 may be incorporated into device 10 ( Figure 1 ). System package 54 (sometimes referred to as integrated circuit package 54) may include a package substrate (such as a printed circuit substrate 64) and a plurality of components 66 (including components 66') mounted to one or both sides of package substrate 64. Substrate 64 may be a rigid printed circuit substrate, or, if desired, may be any other suitable type of substrate (e.g., a flexible printed circuit substrate).

[0054] The components 66 mounted to the package substrate 64 may include one or more integrated circuit dies (e.g., each implementing one or more of the storage circuit 16, the processing circuit 18, the radio component 26, the signal processing circuit and the driver circuit for one or more input-output devices, power management circuits, clock management circuits, or other functional circuits), other active components (e.g., input-output devices 22, programmable devices, diodes, other semiconductor devices, etc.), passive components (e.g., resistors, capacitors, inductors, etc.), electromechanical components, and any other suitable discrete devices. The configuration of the system package 54 including one or more integrated circuit dies is described herein as an illustrative example, and the one or more integrated circuit dies implement corresponding functional subsystems, thereby forming one or more of the control circuit, the wireless circuit, other non-wireless or non-radio input-output circuits, and other functional circuits all within the system package 54. In this example, the package 54 may form a system-in-package (SiP).

[0055] The system package 54 may be encapsulated. Figure 5 As shown, components 66 on a first side of substrate 64 are covered and surrounded by encapsulant 70, and components 66 on a second side of substrate 64 are also covered and surrounded by encapsulant 70. If desired, an electromagnetic shielding layer may be deposited on one or more (e.g., substantially all outwardly facing) sides of encapsulant 70. The shielding layer may shield components in system package 54 from undesirable electromagnetic interference.

[0056] Encapsulation 70 may include encapsulation material, underfill material, molding material, and / or other sealant or encapsulation material. Encapsulation 70 may be formed of any suitable number and type of encapsulant material, such as plastic or specifically thermoplastic, ceramic, other dielectric, etc. Similarly, any suitable process (such as spin coating, molding, underfill, etc.) may be used to form encapsulation 70 and the shielding layer thereon (if present).

[0057] In an exemplary configuration where package 54 is enclosed to protect against undesirable weathering, temperature, and electromagnetic effects, an interposer, such as interposer 68, may be used as an electrical input-output interface through which components 66 on the system package are accessed by and communicate with other components in device 10. Specifically, connection to system substrate 60 may be achieved through externally facing contacts (e.g., contacts 102) on one side of interposer 68, while connection to package substrate 64 may be achieved through contacts on an opposite side of interposer 68. Figure 5 In the example of FIG. 8 , conductive signal paths 72 may connect system substrate 60 to component 66 through interposer 68 and package substrate 64 .

[0058] Some of the components 66 mounted to the substrate 64, such as the component 66', may implement the radio component 26 covering one or more RATs (e.g., an integrated circuit die including one or more radio components, one or more processors implementing the radio component 26, an RF front end module, etc.). RF transmission lines such as the RF transmission line 36 ( Figure 2 ), and if desired, one or more additional RF transmission lines may couple the radio component 26 (eg, the component 66 ′ implementing the radio component 26 ) to the one or more antennas 30 .

[0059] exist Figure 5 In the example of FIG. 1 , one or more conductive paths 74 on the substrate 64 may form a radio frequency transmission line path (e.g., for Figure 2 6). Each conductive path 74 may include a signal conductor that is shielded by, overlaps with, and / or is generally referenced to one or more ground conductors. The ground conductors may connect component 66' implementing radio component 26 to one or more ground structures in device 10, such as ground traces on substrate 64, conductive housing structures, one or more batteries, etc. The signal conductors may connect component 66' implementing radio component 26 to an antenna element, such as an antenna feed structure and / or an antenna resonating element.

[0060] As an example, the radio 66' may implement an integrated circuit die (sometimes referred to herein as an RF module) that forms one or more processors of the radio 26. The radio 66' may be coupled to a transmission line structure formed using paths 74. If desired, a separate radio 66' implementing a front end module (e.g., an impedance matching circuit) may be coupled along one or more paths 74.

[0061] As described above, one or more components 66' within package 62 may form radio components 26 connected to antenna 30. Specifically, one or more conductive structures 84 may serve as feed structures coupled to conductive structures 80, forming one or more antenna resonating elements. The transmission line structure formed by path 74 may couple radio components 66' to antenna feed structures 84. As an example, the transmission line structure may be formed based on a microstrip transmission line, a stripline transmission line, and / or any other suitable type of transmission line. Antenna feed structure 84 may be formed as a via or pin embedded within package 70. In other configurations, antenna feed structure 84 may be or may include a conductive trace external to an antenna carrier structure on which conductive structure 80 is disposed (instead of or in addition to package 70). Conductive structure 84 may also form other antenna elements, such as one or more antenna return paths that couple antenna resonating elements to antenna ground, if desired.

[0062] exist Figure 5In the example of , conductive structures 80 (e.g., one or more antenna resonating elements) are disposed on top of encapsulant 70 on a system package. Alternatively, conductive structures 80 may be formed (e.g., patterned) on one or more dielectric layers that form an antenna support structure, with the dielectric support structure interposed between encapsulant 70 and conductive structures 80. If desired, the dielectric antenna support structure may be a plastic carrier, and a laser direct structuring (LDS) process may be used to pattern and plate conductive structures 80 onto the plastic carrier. If desired, the dielectric antenna support structure may be a printed circuit substrate or other dielectric substrate, and conductive structures 80 may be formed as conductive traces or conductive layers on the substrate. These examples illustrate some of the many possible arrangements.

[0063] If desired, the conductive element 80 may be provided in other suitable ways. Specifically, the conductive structure 80 may be disposed within the package 54, rather than on an outer surface of the package 54. Specifically, the conductive structure 80 may be formed within the encapsulation 70 (using one or more layers within the encapsulation 70 as antenna support structures). In this arrangement, the window in the electromagnetic shielding layer (if present) may overlap one or more portions (e.g., the entirety) of the conductive structure 80 to enable transmission of radio frequency signals through the electromagnetic shielding layer.

[0064] As combined Figure 5 The depicted system package 54 may be mounted to a system substrate 60. The substrate 60 may be a rigid printed circuit board substrate, a flexible printed circuit substrate, a rigid-flex hybrid printed circuit substrate, or any other suitable type of substrate. In some implementations described herein as illustrative examples, the substrate 60 may be a flexible printed circuit substrate for a main system printed circuit that provides structural support and signal routing to and from different functional components or subsystems in the device 10. In these arrangements, the system substrate 60 may extend across substantially the entire device 10, such as from the housing 12 ( Figure 1 ) to the opposite end of the housing 12.

[0065] Other components forming other functional subsystems, such as those forming one or more input-output devices (such as sensors, speakers, microphones, etc.), wireless circuits, control circuits, power management circuits, one or more batteries, or other device components may also be mounted to substrate 60. Connections in substrate 60, such as buses or other conductive paths 72, may transmit signals between these components, for example to and from the substrate 60. Figure 5 54 in the example of the embodiment of the present invention transmits signals. Conductive structures such as conductive metal traces, conductive metal vias, interconnect layers, routing layers, etc. can be disposed on substrate 60 (e.g., embedded in substrate 60, disposed on one or more external surfaces of substrate 60, or otherwise disposed on one or more portions of substrate 60) to form these conductive signal paths.

[0066] By implementing in the manner described above, the interior of the system package 54 can be sealed with the encapsulant 70, and the interposer 68 is generally used to facilitate connections with non-radio components (e.g., non-RF paths 72). As a result, it may be difficult to access the radio components 66' and / or antenna 30 embedded in the system package 54. Therefore, switches such as switch 90 (such as in combination with Figure 3 4 ) may be mounted to substrate 64 or may be generally incorporated within system package 54. Terminals 92-1, 92-2, and 92-3 of switch 90 may be respectively coupled to radio component 66′ (e.g., implementing RF module or radio component 26), antenna 30 (e.g., coupled to antenna feed structure 84 of an antenna resonating element formed by conductive structure 80), and input-output interface circuitry for the RF component (e.g., Figure 3 Interface circuit 94 in.

[0067] In some configurations described herein as examples, package input-output interface circuitry for RF components is formed by additional interposer 98 through which RF signals may be routed (e.g., using conductive paths 74). Thus, external components (such as components external to the system package, components external to device 10 (e.g., calibration equipment, test equipment, debugging equipment, etc.), and / or any other suitable components) may be connected to antenna 30 and radio components 26 implemented within system package 54 via interposer 98 of package 54.

[0068] exist Figure 5 In the example of , interposer 98 may have one or more contacts on a first side that are physically and electrically connected to substrate 64 (and to terminal 92-3), and may have one or more package-exterior-facing contacts (e.g., contact 100) on an opposite side that are physically and electrically connected to substrate 60. Internal routing paths within interposer 98 may connect contacts on one side to contacts on the other side. Path 74 may be disposed on substrate 60. If desired, substrate 60 itself may have contacts 101 (e.g., contact pads, pins, sockets, terminals, etc.) at which path 74 terminates. Figure 5 As shown, contacts 101 on substrate 60 may be connected to externally facing contacts 100 via paths 74 , and external components may be connected to radio components 26 and / or antenna 30 implemented on package 54 via contacts 101 on substrate 60 (via connections 96 ).

[0069] Although in Figure 5In the example of FIG. 5 , interposer 98 is used to provide input-output interface circuitry, but this illustrates one of many possible implementations of package input-output interface circuitry. If desired, contact pads, pins, sockets, terminals, and / or any other suitable signal-carrying structures facing the exterior of the package may provide suitable connections to terminal 92-3 of switch 90 to facilitate connection to antenna 30 and / or radio 26 within system package 54.

[0070] As above combined Figure 3 4 , control circuitry 14 (eg, mounted on substrate 64 ) may provide control signals to switch 90 during different operating modes to place switch 90 in different states, thereby facilitating different types of connections between component 66 ′, antenna feed structure 84 , and interposer 98 .

[0071] Figure 6 is when viewed in direction 99 Figure 5 A plan view of a system package 54 is depicted (with substrate 60 and / or other components such as package 70 removed). Figure 6 As shown, interposer 98 may include a plurality of electrical contacts 100 facing the exterior of the package, such as contacts 100-1, 100-2, and 100-3. These contacts (e.g., contact pads, contact pins, sockets, and / or other types of contacts for making physical and electrical connections) may be coupled to corresponding paths 74 ( Figure 5 ). In some exemplary configurations described herein as examples, contacts 100-1 and 100-3 may be ground contacts, while contact 100-2 may be a signal contact. Thus, contacts 100-1 and 100-3 may be coupled to respective ground conductors of an RF transmission line, while contact 100-2 may be coupled to a signal conductor of the RF transmission line.

[0072] like Figure 6 As further shown, the interposer 68 may similarly provide a plurality of electrical contacts facing the exterior of the package, such as contacts 102. The contacts 102 (e.g., contact pads, contact pins, sockets, and / or other types of contacts for making physical and electrical connections) may be connected to other non-radio components 66 on the substrate 64 within the system package and corresponding signal paths 72 on the substrate 60, rather than to the switch 90 and / or RF components.

[0073] Combination Figure 5 and Figure 6 The described implementation for switch 90 and / or access interface circuit 94 for radio frequency components (e.g., implemented using interposer 98) is an example of one implementation among many possible implementations. If desired, switch 90 and / or access interface circuit may be provided in other ways and / or in other systems.

[0074] Figure 7 Another exemplary system package, such as package 58, is shown in which a switch 90 and / or access interface circuitry for RF components may be provided. Package 58 may be Figure 3 Another exemplary embodiment of package 50 in which the device 10 ( Figure 1 ). Figure 7 In the example, combined with Figure 5 Compared with the direct antenna feeding scheme described above, an indirect electromagnetic coupling antenna feeding scheme is implemented.

[0075] like Figure 7 As shown, conductive paths 74 for transmission line structures may be coupled to conductive feed structures 52 to indirectly feed one or more antenna resonating elements formed using conductive structures 80 via electromagnetic coupling 56. Antenna feed structures 52 may be formed on package substrate 64. As an example, feed structures 52 may be conductive patches deposited, patterned, and / or otherwise disposed on package substrate 64. Feed elements 52 may be formed from conductive metal traces embedded within or on a surface of printed circuit substrate 64. Antenna currents may exist on feed elements 52 based on radio frequency signals transmitted from radio component 26 (e.g., formed by component 66') through the transmission line structures to feed elements 52. These antenna currents on feed elements 52 may excite one or more antenna resonating elements on conductive structures 80 via wireless coupling 56, thereby generating corresponding antenna currents on conductive structures 80 that transmit the radio frequency signals. In a similar manner, radio frequency signals 82 received at conductive structures 80 may induce corresponding antenna currents on feed elements 52 that are transmitted to radio component 26 via wireless coupling 56.

[0076] Since one or more antenna resonating elements on conductive structures 80 are fed via wireless coupling 56, conductive structures 80 may be arranged in any suitable manner that provides adequate coupling between feed element 52 and the antenna resonating elements. As an example, adequate coupling may be indicated by one or more antenna performance metrics (e.g., associated with antenna gain, antenna bandwidth, antenna impedance, etc.) associated with each antenna resonating element being above corresponding thresholds.

[0077] In configurations where an electromagnetic shielding layer is disposed over enclosure 70, windows or openings may be provided in the shielding layer to allow and / or improve wireless coupling 56 between feed element 52 and antenna 30. In other words, the windows in the shielding layer may at least partially overlap feed element 52.

[0078] exist Figure 7In the example of FIG. 5 , input-output interface circuits for the radio components and antenna 30 and input-output interface circuits for non-radio components may share an interposer 104 for connecting to and accessing internal components of the package 58. Figure 7 As shown, the interposer 104 may include a conductive path 72 to the non-RF component 66 and may include a conductive path 74 to the RF component (eg, via the terminal 92 - 3 of the switch 90 ).

[0079] Figures 5 to 7 The examples shown in the figure illustrate some possible implementations of the access switches and / or interface circuits described herein. Other implementations may be used if desired. As an example, in combination with Figure 7 The combined interposer 104 described (instead of Figure 5 and Figure 6 The interposers 68 and 98 in the embodiment of the present invention can be used in a system package 54 ( Figure 5 and Figure 6 ) is used in combination with Figure 5 and Figure 6 The separate interposers 68 and 98 described (instead of Figure 7 The combined interposer 104 in the embodiment of the present invention can be used in a system package 58 ( Figure 7 ), etc. If desired, use of the access switch and / or input-output interface circuitry may be provided in other types of wireless systems, in other types of packages, and / or generally in other environments.

[0080] According to one embodiment, an electronic device is provided, comprising: a radio component; an antenna coupled to the radio component; an input-output interface for connecting to at least one of the radio component and the antenna; and a switch having a first terminal coupled to the radio component, a second terminal coupled to the antenna, and a third terminal coupled to the input-output interface.

[0081] According to another embodiment, the switch has a connection point to which each of the first terminal, the second terminal, and the third terminal are selectively coupled.

[0082] According to another embodiment, the electronic device includes a control circuit configured to place the switch in a first state in which the first terminal and the second terminal are coupled to the connection point and the third terminal is decoupled from the connection point to transmit radio frequency signals between the radio component and the antenna.

[0083] According to another embodiment, the control circuit is configured to place the switch in a second state in which the first terminal and the third terminal are coupled to the connection point and the second terminal is decoupled from the connection point to transmit radio frequency signals between the radio component and the input-output interface.

[0084] According to another embodiment, the control circuit is configured to place the switch in a third state, in which the second terminal and the third terminal are coupled to the connection point and the first terminal is decoupled from the connection point to transmit radio frequency signals between the antenna and the input-output interface.

[0085] According to another embodiment, the electronic device includes: a printed circuit substrate on which the radio component is mounted; and an enclosure over the printed circuit substrate and the radio component, the radio component being coupled to the first terminal of the switch via a first conductive path on the printed circuit substrate.

[0086] According to another embodiment, the printed circuit substrate, the radio component and the encapsulation form a system package, and the antenna is disposed on the system package, and the antenna is coupled to the second terminal of the switch via a second conductive path on the printed circuit substrate.

[0087] According to another embodiment, the switch is mounted on the printed circuit substrate.

[0088] According to another embodiment, the electronic device includes a system substrate, the system package is mounted to the system substrate, and the input-output interface includes an interposer coupled between the printed circuit substrate and the system substrate.

[0089] According to another embodiment, the interposer is coupled to the third terminal of the switch via a third conductive path on the printed circuit substrate.

[0090] According to another embodiment, the interposer includes one or more electrical contacts connected to the system substrate, and one or more components of the electronic device are configured to connect to at least one of the radio component and the antenna via the system substrate and the one or more electrical contacts.

[0091] According to another embodiment, the radio component is coupled to the first terminal of the switch using a first radio frequency transmission line path, the antenna is coupled to the second terminal of the switch using a second radio frequency transmission line path, and the input-output interface is coupled to the third terminal of the switch using a third radio frequency transmission line path.

[0092] According to another embodiment, the switch is a three input-output terminal switch.

[0093] According to one embodiment, an integrated circuit package is provided, comprising: a substrate; a radio component, the radio component being on the substrate; an antenna, the antenna coupled to the radio component; an interposer, the interposer being on the substrate; and a switch, the switch being on the substrate and having a first terminal coupled to the radio component, a second terminal coupled to the antenna, and a third terminal coupled to the interposer.

[0094] According to another embodiment, the integrated circuit package includes an encapsulation over the substrate, the radio component, and the switch, and the interposer includes an external electrical contact connected to the third terminal of the switch.

[0095] In accordance with another embodiment, the antenna includes a feed structure on the substrate coupled to the second terminal of the switch, and the antenna includes an antenna resonating element disposed on the encapsulation and coupled to the feed structure.

[0096] According to another embodiment, the radio component includes a radio integrated circuit, the integrated circuit package includes one or more non-radio integrated circuits, the one or more non-radio integrated circuits are on the substrate, and the encapsulation is disposed over the non-radio integrated circuits.

[0097] According to one embodiment, a wireless circuit is provided, which includes: a radio frequency module; an antenna, which is coupled to the radio frequency module; an interface circuit, which is coupled to the radio frequency module and to the antenna; and a switch, which has a first state, a second state and a third state, in which the switch connects the radio frequency module to the antenna, in the second state, the switch connects the radio frequency module to the interface circuit, and in the third state, the switch connects the antenna to the interface circuit.

[0098] According to another embodiment, the interface circuit includes at least a ground contact and a signal contact, the signal contact being configured to be connected to the RF module when the switch is in the second state and being configured to be connected to the antenna when the switch is in the third state.

[0099] According to another embodiment, the wireless circuit includes a substrate, and the radio frequency module, the interface circuit and the switch are mounted on the substrate.

[0100] The foregoing describes some of the many possible arrangements and various modifications may be made to the described embodiments.The foregoing embodiments may be implemented independently or in any combination.

Claims

1. An electronic device, comprising: Radio components; an antenna coupled to the radio component; an input-output interface for connecting to at least one of the radio component and the antenna; and A switch has a first terminal coupled to the radio, a second terminal coupled to the antenna, and a third terminal coupled to the input-output interface. 2 . The electronic device of claim 1 , wherein the switch has a connection point to which each of the first terminal, the second terminal, and the third terminal is selectively coupled.

3. The electronic device according to claim 2, further comprising: A control circuit is configured to place the switch in a first state in which the first terminal and the second terminal are coupled to the connection point and the third terminal is decoupled from the connection point to pass a radio frequency signal between the radio component and the antenna.

4. An electronic device according to claim 3, wherein the control circuit is configured to place the switch in a second state, in which the first terminal and the third terminal are coupled to the connection point and the second terminal is decoupled from the connection point to transmit radio frequency signals between the radio component and the input-output interface.

5. An electronic device according to claim 4, wherein the control circuit is configured to place the switch in a third state, in which the second terminal and the third terminal are coupled to the connection point and the first terminal is decoupled from the connection point to transmit a radio frequency signal between the antenna and the input-output interface.

6. The electronic device according to claim 1, further comprising: a printed circuit substrate on which the radio component is mounted; and An encapsulation is over the printed circuit substrate and the radio component, wherein the radio component is coupled to the first terminal of the switch via a first conductive path on the printed circuit substrate.

7. An electronic device according to claim 6, wherein the printed circuit substrate, the radio component and the enclosure form a system package, and the antenna is disposed on the system package, and the antenna is coupled to the second terminal of the switch via a second conductive path on the printed circuit substrate.

8. The electronic device of claim 7, wherein the switch is mounted on the printed circuit substrate.

9. The electronic device according to claim 8, further comprising: A system substrate is provided on which the system package is mounted, wherein the input-output interface includes an interposer coupled between the printed circuit substrate and the system substrate.

10. The electronic device of claim 9, wherein the interposer is coupled to the third terminal of the switch via a third conductive path on the printed circuit substrate.

11. The electronic device of claim 10, wherein the interposer comprises one or more electrical contacts connected to the system substrate, and one or more components of the electronic device are configured to connect to at least one of the radio component and the antenna via the system substrate and the one or more electrical contacts.

12. The electronic device of claim 1 , wherein the radio is coupled to the first terminal of the switch using a first radio frequency transmission line path, the antenna is coupled to the second terminal of the switch using a second radio frequency transmission line path, and the input-output interface is coupled to the third terminal of the switch using a third radio frequency transmission line path.

13. The electronic device of claim 1, wherein the switch is a three-input-output terminal switch.

14. An integrated circuit package, comprising: substrate; a radio component, the radio component being on the substrate; an antenna coupled to the radio component; an interposer on the substrate; and A switch is on the substrate and has a first terminal coupled to the radio, a second terminal coupled to the antenna, and a third terminal coupled to the interposer.

15. The integrated circuit package of claim 14, further comprising: An encapsulation is over the substrate, the radio, and the switch, wherein the interposer includes an external electrical contact connected to the third terminal of the switch.

16. The integrated circuit package of claim 15 wherein the antenna comprises a feed structure on the substrate coupled to the second terminal of the switch, and the antenna comprises an antenna resonating element disposed on the encapsulant and coupled to the feed structure.

17. The integrated circuit package of claim 14, wherein the radio component comprises a radio integrated circuit, the integrated circuit package further comprising: One or more non-radio integrated circuits are on the substrate, wherein the encapsulant is disposed over the non-radio integrated circuits.

18. A wireless circuit, comprising: RF module; an antenna, the antenna being coupled to the RF module; an interface circuit, the interface circuit being coupled to the radio frequency module and to the antenna; and A switch having a first state, a second state and a third state. In the first state, the switch connects the RF module to the antenna. In the second state, the switch connects the RF module to the interface circuit. In the third state, the switch connects the antenna to the interface circuit.

19. The wireless circuit of claim 18, wherein the interface circuit comprises at least a ground contact and a signal contact, the signal contact being configured to be connected to the RF module when the switch is in the second state, and being configured to be connected to the antenna when the switch is in the third state.

20. The wireless circuit of claim 18, further comprising: A substrate, the radio frequency module, the interface circuit and the switch are mounted on the substrate.

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