Combination sensor, microphone and electronic device

Abstract

The invention discloses a combined sensor, a microphone and electronic equipment, and relates to the technical field of sensors.The combined sensor comprises a substrate, an outer shell, an inner shell, a pressure sensor module and a microphone module, the substrate is covered with the outer shell, and a first containing cavity is defined by the outer shell and the substrate; the inner shell covers the substrate and divides the first containing cavity into a first rear cavity located on the outer side of the inner shell and a second containing cavity located on the inner side of the inner shell, and the inner shell is connected with the outer shell. The microphone module is arranged on the substrate and divides the second accommodating cavity into a front cavity positioned on the outer side of the microphone module and a second rear cavity positioned on the inner side of the microphone module; the base plate is provided with a communicating hole communicating the first rear cavity and the second rear cavity, and the first rear cavity and the second rear cavity are both independent of the front cavity. The first rear cavity and the second rear cavity are communicated through the communication hole to form a larger microphone rear cavity, so that the volume of the microphone rear cavity is increased, and the signal-to-noise ratio and the bandwidth of the microphone module are further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a combined sensor, a microphone and an electronic device. Background Art

[0002] Microphones and pressure sensors have become standard features of smart hardware such as mobile phones and bracelets. In order to reduce the client assembly space and the number of airways, the development of combined sensors formed by microphones and pressure sensors has become a market trend.

[0003] Currently, the commonly used combination sensors of integrated microphones and pressure sensors are all Bottom type. The main reason is that the traditional Top type combination sensors of integrated microphones and pressure sensors have low signal-to-noise ratio and narrow bandwidth, which cannot meet customers' high-performance requirements.

[0004] However, when customers require a combination sensor with a Top-type integrated microphone and pressure sensor for the entire machine, the products on the market basically cannot meet customer needs. Summary of the invention

[0005] The main purpose of the present invention is to provide a combined sensor, a microphone and an electronic device, aiming to improve the acoustic performance of the Top type combined sensor.

[0006] To achieve the above object, the combined sensor proposed by the present invention comprises:

[0007] substrate;

[0008] A housing, the housing is covered on the substrate and forms a first accommodating cavity with the substrate;

[0009] an inner shell, the inner shell being located in the first accommodating cavity, and the inner shell cover being arranged on the substrate and dividing the first accommodating cavity into a first rear cavity located outside the inner shell and a second accommodating cavity located inside the inner shell, and the inner shell being connected to the outer shell;

[0010] A pressure sensor module, wherein the pressure sensor module is disposed in the first accommodating cavity;

[0011] a microphone module, the microphone module being located in the second accommodating cavity, the microphone module being disposed on the substrate and dividing the second accommodating cavity into a front cavity located outside the microphone module and a second rear cavity located inside the microphone module;

[0012] The substrate is provided with a connecting hole connecting the first rear cavity and the second rear cavity, the outer shell is provided with an outer shell hole, the inner shell is provided with an inner shell hole connecting the front cavity, the outer shell hole is connected with the inner shell hole, and the first rear cavity and the second rear cavity are both independently arranged from the front cavity.

[0013] In one embodiment, the inner shell includes a shell body and a sealing member, the shell body is covered on the substrate and divides the first accommodating cavity into the first rear cavity located on the outside of the shell body and the second accommodating cavity located on the inside of the shell body, the sealing member is located between the shell body and the outer shell, and the two sides of the sealing member are respectively sealed and abutted against the shell body and the outer shell, and the sealing member forms a connecting channel connecting the outer shell hole and the inner shell hole, so that the sound signal can enter the front cavity through the outer shell hole, the connecting channel and the inner shell hole.

[0014] In one embodiment, a communication channel is formed between the shell body and the outer shell, and the sealing member is used to seal the communication channel.

[0015] In one embodiment, the sealing member includes a top surface and a bottom surface, the connecting through hole passes through the top surface and the bottom surface, the top surface is arranged on the side of the outer shell hole facing the front cavity, and the bottom surface is arranged on the side of the inner shell hole facing the outer shell hole, the top surface is sealingly abutted against the outer shell, and the bottom surface is sealingly abutted against the shell body.

[0016] In one embodiment, the outer shell includes a blocking portion, the blocking portion is arranged on a side of the outer shell hole facing the front cavity, the blocking portion is provided with a blocking surface on a side facing the sealing member, the blocking surface is arranged obliquely so that the distance from the blocking surface to the inner shell along the first direction can be gradually reduced along the second direction away from the connecting channel, the first direction is perpendicular to the second direction, and the outer shell hole and the inner shell hole are arranged at intervals along the first direction;

[0017] And / or, the sealing member is an annular sealing rubber layer.

[0018] In one embodiment, a sealing area is provided on the outer wall of the inner shell, the inner shell hole is provided in the sealing area, the sealing area is in contact with the inner wall of the outer shell, and the outer shell hole is provided opposite to the sealing area.

[0019] In one embodiment, the inner shell divides the first rear cavity into a first cavity and a second cavity that are independent of each other, and the connecting hole includes a first through hole, a second through hole, a third through hole and a fourth through hole, the first through hole is connected to the first cavity, the second through hole is connected to the second cavity, the third through hole is connected to the second rear cavity, and the first through hole, the second through hole and the third through hole are all connected to the fourth through hole.

[0020] In one embodiment, there are a plurality of the first through holes, and the plurality of the first through holes are arranged at intervals;

[0021] And / or, the number of the second through holes is multiple, and the multiple second through holes are arranged at intervals;

[0022] And / or, there are multiple third through holes, and the multiple third through holes are arranged at intervals.

[0023] In one embodiment, the diameter of the outer shell hole is larger than the diameter of the inner shell hole.

[0024] In one embodiment, the pressure sensor module is located in the first rear cavity, the pressure sensor module is disposed on the substrate, and the pressure sensor module is spaced apart from the inner shell.

[0025] In one embodiment, the pressure sensor module is located in the first rear cavity, the outer shell includes a side surrounding substrate and a top substrate, the two sides of the side surrounding substrate are respectively connected to the top substrate and the substrate, the top substrate is provided with the outer shell hole, the pressure sensor module is arranged on the side surrounding substrate or the top substrate, and the pressure sensor module is spaced apart from the inner shell.

[0026] In one embodiment, the microphone module includes a microphone MEMS chip and a microphone ASIC chip that are communicatively connected, the microphone MEMS chip is disposed on the substrate and divides the second accommodating cavity into a front cavity located outside the microphone MEMS chip and a second rear cavity located inside the microphone MEMS chip;

[0027] And / or, the pressure sensor module includes a sensor MEMS chip and a sensor ASIC chip that are communicatively connected.

[0028] In one embodiment, the combined sensor further comprises a waterproof and breathable membrane, and the waterproof and breathable membrane covers the inner shell hole;

[0029] Alternatively, the waterproof and breathable membrane covers the shell hole.

[0030] The present invention also provides a microphone, comprising the above-mentioned combined sensor.

[0031] The present invention further provides an electronic device, comprising the above-mentioned microphone.

[0032] The technical solution of the present invention is that an outer shell cover is arranged on a substrate to form a first accommodating cavity with the substrate, and then an inner shell cover is arranged on the substrate to separate the first accommodating cavity into a first rear cavity and a second accommodating cavity that are independent of each other, and then a microphone module is arranged on the substrate to separate the second accommodating cavity into a front cavity and a second rear cavity, and then the first rear cavity and the second rear cavity are connected through a connecting hole to form a larger microphone rear cavity, thereby increasing the volume of the microphone rear cavity, thereby improving the signal-to-noise ratio and bandwidth of the microphone module, and improving the acoustic performance of the microphone module. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0034] Figure 1 A schematic cross-sectional view of an embodiment of a combined sensor provided by the present invention;

[0035] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0036] Figure 3 A schematic cross-sectional view of another embodiment of the combined sensor provided by the present invention;

[0037] Figure 4 A schematic cross-sectional view of another embodiment of the combined sensor provided by the present invention;

[0038] Figure 5 A schematic cross-sectional view of an embodiment of the sealing area and the housing of the combined sensor provided by the present invention being bonded together;

[0039] Figure 6 A schematic cross-sectional view of an embodiment of a waterproof and breathable membrane covering a housing hole in a combined sensor provided by the present invention;

[0040] Figure 7 This is a schematic cross-sectional structural diagram of an embodiment of a waterproof and breathable membrane covering an inner shell hole in a combined sensor provided by the present invention.

[0041] Description of Figure Numbers:

[0042] 100. Combined sensor; 1. Substrate; 11. Connecting hole; 111. First through hole; 112. Second through hole; 113. Third through hole; 114. Fourth through hole; 2. Outer shell; 21. Side substrate; 22. Top substrate; 221. Outer shell hole; 23. Blocking part; 231. Blocking surface; 3. Inner shell; 31. Shell body; 311. Inner shell hole; 32. Seal; 321. Connecting channel; 322. Top surface; 323. Bottom surface; 33. Sealing area; 4. Pressure sensor module; 5. Microphone module; 61. First rear cavity; 611. First cavity; 612. Second cavity; 62. Second rear cavity; 63. Front cavity; 7. Waterproof and breathable membrane; 8. Connecting channel.

[0043] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0046] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] Microphones and pressure sensors have become standard features of smart hardware such as mobile phones and bracelets. In order to reduce the client assembly space and the number of airways, the development of combined sensors formed by microphones and pressure sensors has become a market trend.

[0048] Currently, the commonly used combination sensors of integrated microphones and pressure sensors are all Bottom type. The main reason is that the traditional Top type combination sensors of integrated microphones and pressure sensors have low signal-to-noise ratio and narrow bandwidth, which cannot meet customers' high-performance requirements.

[0049] However, when customers require a combination sensor with a Top-type integrated microphone and pressure sensor for the entire machine, the products on the market basically cannot meet customer needs.

[0050] The inventors have discovered that the existing Top-type combination sensor with an integrated microphone and a pressure sensor is limited by the traditional design, resulting in the size of the back cavity of the microphone of the traditional combination sensor being the same as the cavity of the microphone MEMS itself, while the size of the front cavity of the microphone is the cavity between the housing and the substrate excluding the microphone module and the pressure sensor. In the traditional solution, since the microphone module and the pressure sensor need to be accommodated between the substrate and the housing, the cavity between the substrate and the housing is designed to be relatively large, which results in a small back cavity and a large front cavity of the microphone, resulting in a low signal-to-noise ratio and a narrow bandwidth, which cannot meet customers' high performance requirements.

[0051] The present invention provides a combined sensor, aiming to improve the acoustic performance of a Top type combined sensor.

[0052] See also Figure 1 and Figure 3 In one embodiment of the present invention, the combined sensor 100 includes a substrate 1, an outer shell 2, an inner shell 3, a pressure sensor module 4 and a microphone module 5, wherein the outer shell 2 is covered on the substrate 1 and forms a first accommodating chamber with the substrate 1; the inner shell 3 is located in the first accommodating chamber, and the inner shell 3 is covered on the substrate 1 and divides the first accommodating chamber into a first rear chamber 61 located outside the inner shell 3 and a second accommodating chamber located inside the inner shell 3, and the inner shell 3 is connected to the outer shell 2; the pressure sensor module 4 is arranged in the outer shell 2; the microphone module 5 is located in the second accommodating chamber, and the microphone module 5 is arranged on the substrate 1 and divides the second accommodating chamber into a front chamber 63 located outside the microphone module 5 and a second rear chamber 62 located inside the microphone module 5; the substrate 1 is provided with a connecting hole 11 connecting the first rear chamber 61 and the second rear chamber 62, the outer shell 2 is provided with an outer shell hole 221, and the inner shell 3 is provided with an inner shell hole 311 connecting the front chamber 63, the outer shell hole 221 is connected with the inner shell hole 311, and the first rear chamber 61 and the second rear chamber 62 are both independently arranged with the front chamber 63.

[0053] The technical solution of the present invention is that the outer shell 2 is covered on the substrate 1 and encloses the first accommodating cavity with the substrate 1, and then the inner shell 3 is arranged to cover the substrate 1 to separate the first accommodating cavity into a first rear cavity 61 and a second accommodating cavity that are independent of each other, and then the microphone module 5 is arranged on the substrate 1 to separate the second accommodating cavity into a front cavity 63 and a second rear cavity 62 (equivalent to the microphone rear cavity in the traditional design), and then the first rear cavity 61 and the second rear cavity 62 are connected through the connecting hole 11, so that the first rear cavity 61 and the second rear cavity 62 are connected to form a larger microphone rear cavity. Compared with the microphone rear cavity in the traditional design, the technical solution of the present invention is that the outer shell 2 is covered on the substrate 1 and encloses the first accommodating cavity into a first rear cavity 61 and a second rear cavity 62 that are independent of each other. The embodiment also has a second rear cavity 62, which is a cavity between the outer shell 2 and the substrate 1 except for the pressure sensor module 4 and the inner shell 3, thereby increasing the volume of the microphone rear cavity. Since the inner shell 3 only needs to accommodate the microphone module 5, the inner shell 3 can be designed to be smaller, so that the volume of the front cavity 63 can be reduced by reducing the size of the inner shell 3, and the volume of the second rear cavity 62 can be expanded, so that the volume of the front cavity 63 is relatively small and the volume of the second rear cavity 62 is relatively large, thereby achieving the purpose of improving the signal-to-noise ratio and bandwidth of the microphone module 5, thereby improving the acoustic performance of the microphone module 5. It should be noted that the front cavity 63 and the first rear cavity 61 are not connected to each other, and the front cavity 63 and the second rear cavity 62 are not connected to each other. It should also be noted that the inner shell hole 311 is connected to the front cavity 63, and the outer shell hole 221 is connected to the inner shell hole 311, so that the external sound can enter the front cavity 63 through the outer shell hole 221 and the inner shell hole 311. Among them, the description of the independent arrangement of the two cavities is intended to indicate that the two cavities are not connected to each other.

[0054] Furthermore, the pressure sensor module 4 is located outside the inner shell 3, while the microphone module 5 is located inside the inner shell 3, so that the pressure sensor module 4 and the microphone module 5 are located in two relatively independent spaces, thereby effectively reducing the interference of the pressure sensor module 4 on the microphone module 5 and improving the performance of the microphone module 5 when the microphone module 5 and the pressure sensor module 4 work at the same time.

[0055] Moreover, since the outer side of the microphone module 5 is covered by the inner shell 3, and the outer side of the inner shell 3 is covered by the outer shell 2, the double shell design of the inner shell 3 and the outer shell 2 can more effectively isolate the microphone module 5 from the outside, thereby improving the anti-electromagnetic shielding capability of the microphone module 5. The outer shell 2 can be a metal shell.

[0056] See also Figure 1In one embodiment, the inner shell 3 includes a shell body 31 and a sealing member 32. The shell body 31 is covered on the substrate 1 and divides the first accommodating cavity into a first rear cavity 61 located outside the shell body 31 and a second accommodating cavity located inside the shell body 31. The sealing member 32 is located between the shell body 31 and the outer shell 2. The two sides of the sealing member 32 are sealed and abutted with the shell body 31 and the outer shell 2 respectively. The sealing member 32 is formed with a connecting channel 321 connecting the outer shell hole 221 and the inner shell hole 311, so that the sound signal can enter the front cavity 63 through the outer shell hole 221, the connecting channel 321 and the inner shell hole 311. The sealing member 32 is provided to prevent the front cavity 63 and the first rear cavity 61 from being connected to each other, thereby ensuring the normal operation of the microphone module 5. It should be noted that the external sound signal can enter the front cavity 63 through the outer shell hole 221, the connecting channel 321 and the inner shell hole 311. It should also be noted that the sealing member 32 can be a sealant or a sealing ring, etc., which is not limited here.

[0057] See also Figure 1 and Figure 2 In one embodiment, a communication channel 8 is formed between the shell body 31 and the outer shell 2, and the seal 32 is used to seal the communication channel 8. The seal 32 is provided to seal the communication channel 8, so that the sound signal cannot enter the first rear cavity 61 from the communication channel 8, thereby ensuring the normal operation of the microphone module 5.

[0058] See also Figure 1 and Figure 2 In one embodiment, the sealing member 32 includes a top surface 322 and a bottom surface 323, and the connecting channel 321 passes through the top surface 322 and the bottom surface 323. The top surface 322 is arranged around the side of the outer shell hole 221 facing the front cavity 63, and the bottom surface 323 is arranged around the side of the inner shell hole 311 facing the outer shell hole 221. The top surface 322 is in sealing contact with the outer shell 2, and the bottom surface 323 is in sealing contact with the shell body 31. The area where the top surface 322 of the sealing member 32 contacts the outer shell 2 is arranged around the outer shell hole 221, and the area where the bottom surface 323 of the sealing member 32 contacts the shell body 31 is arranged around the inner shell hole 311, so that the sound signal cannot enter the first rear cavity 61 from the connecting channel 321, thereby ensuring the normal operation of the microphone module 5.

[0059] See also Figure 1 and Figure 2In one embodiment, the outer shell 2 includes a blocking portion 23, which is arranged on the side of the outer shell hole 221 facing the front cavity 63, and a blocking surface 231 is arranged on the side of the blocking portion 23 facing the sealing member 32, and the blocking surface 231 is arranged obliquely so that the distance from the blocking surface 231 to the inner shell 3 along the first direction can be gradually reduced along the second direction in a direction away from the connecting channel 321, the first direction and the second direction are perpendicular, and the outer shell hole 221 and the inner shell hole 311 are arranged at intervals along the first direction; by arranging the blocking portion 23 and arranging on the blocking portion 23 The blocking surface 231 is used to assist in glue dispensing, so that the blocking surface 231 can play a certain blocking role on the glue moving away from the connecting channel 321, reduce the fluidity of the glue, and make it easier to fill the gap between the top surface of the inner shell 3 and the outer shell 2 with glue, so as to separate the front cavity 63 from the first rear cavity 61. In this way, the external sound signal will only enter the front cavity 63 through the outer shell hole 221, the connecting channel 321 and the inner shell hole 311, and will not enter the first rear cavity 61 from the gap between the inner shell 3 and the outer shell 2, thereby ensuring the normal operation of the microphone module 5. Among them, the first direction is Figure 1 The up and down directions shown, the second direction is Figure 1 It should be noted that even if the blocking portion 23 is not provided, glue with a higher viscosity can be used to complete the dispensing. Since the glue with a higher viscosity has a low fluidity, it is not easy to flow into the first rear cavity 61, and the dispensing can also be achieved.

[0060] In one embodiment, the seal 32 is an annular sealant layer, wherein the seal 32 is formed into an annular sealant layer by a dispensing process, so that the sound signal in the connecting channel 321 cannot enter the first rear cavity 61, thereby ensuring the normal operation of the microphone module 5.

[0061] See also Figure 5 In one embodiment, the outer wall of the inner shell 3 is provided with a sealing area 33, the inner shell hole 311 is provided in the sealing area 33, the sealing area 33 is in contact with the inner wall of the outer shell 2, and the outer shell hole 221 is provided opposite to the sealing area 33. By closely contacting the sealing area 33 on the inner shell 3 with the inner wall of the outer shell 2 and covering the outer shell hole 221, it is difficult for the sound signal to enter the first rear cavity 61 from the contact point between the sealing area 33 and the outer shell 2, so that the front cavity 63 and the first rear cavity 61 are not connected to each other, and the sealing area 33 is provided with the inner shell hole 311 connected with the outer shell hole 221, so that the sound signal can enter the front cavity 63 from the outer shell hole 221 and the inner shell hole 311 without entering the first rear cavity 61, thereby ensuring the normal operation of the microphone module 5.

[0062] See also Figure 1 and Figure 4In one embodiment, the inner shell 3 separates the first rear cavity 61 into a first cavity 611 and a second cavity 612 which are independent of each other. The communicating hole 11 includes a first through hole 111, a second through hole 112, a third through hole 113 and a fourth through hole 114. The first through hole 111 is communicated with the first cavity 611, the second through hole 112 is communicated with the second cavity 612, the third through hole 113 is communicated with the second rear cavity 62, and the first through hole 111, the second through hole 112 and the third through hole 113 are all communicated with the fourth through hole 114. The fourth through hole 114 is provided to connect the first through hole 111 and the third through hole 113, so that the first cavity 611 and the second rear cavity 62 are connected. The fourth through hole 114 is provided to connect the second through hole 112 and the third through hole 113, so that the second cavity 612 and the second rear cavity 62 are connected. Therefore, the first cavity 611 and the second cavity 612 are both connected to the second rear cavity 62 and together with the second rear cavity 62 form a larger microphone back cavity, thereby improving the signal-to-noise ratio and bandwidth of the microphone module 5.

[0063] In one embodiment, there are multiple first through holes 111, and the multiple first through holes 111 are arranged at intervals; by setting multiple first through holes 111, since the space within the first through holes 111 can also be counted as a part of the microphone back cavity, setting multiple first through holes 111 can also play a role in increasing the microphone back cavity, thereby improving the signal-to-noise ratio and bandwidth of the microphone module 5.

[0064] In one embodiment, the number of the second through holes 112 is multiple, and the multiple second through holes 112 are arranged at intervals; similarly, by setting up multiple second through holes 112, since the space within the second through holes 112 can also be counted as a part of the microphone back cavity, setting up multiple second through holes 112 can also play a role in increasing the microphone back cavity, thereby improving the signal-to-noise ratio and bandwidth of the microphone module 5.

[0065] In one embodiment, the number of the third through holes 113 is multiple, and the multiple third through holes 113 are arranged at intervals. By providing multiple third through holes 113, since the space in the third through holes 113 can also be counted as a part of the microphone back cavity, providing multiple third through holes 113 can also play a role in increasing the microphone back cavity, thereby improving the signal-to-noise ratio and bandwidth of the microphone module 5.

[0066] See also Figure 1 and Figure 5 In one embodiment, the diameter of the outer shell hole 221 is larger than the diameter of the inner shell hole 311. The outer shell hole 221 is larger than the inner shell hole 311 mainly to reduce the probability of glue blocking the inner shell hole 311 during the glue dispensing process. The diameter of the outer shell hole 221 is designed to be slightly larger than the diameter of the inner shell hole 311 so that there is enough space for glue dispensing.

[0067] See also Figure 1 In one embodiment, the pressure sensor module 4 is located in the first rear cavity 61, the pressure sensor module 4 is arranged on the substrate 1, and the pressure sensor module 4 is spaced apart from the inner shell 3. The pressure sensor module 4 and the microphone module 5 are located in two relatively independent spaces, thereby effectively reducing the interference of the pressure sensor module 4 on the microphone module 5 and improving the performance of the microphone module 5 when the microphone module 5 and the pressure sensor module 4 work at the same time.

[0068] In one embodiment, the pressure sensor module 4 is located in the first rear cavity 61, the housing 2 includes a side substrate 21 and a top substrate 22, the two sides of the side substrate 21 are connected to the top substrate 22 and the substrate 1 respectively, the top substrate 22 is provided with a housing hole 221, the pressure sensor module 4 is arranged on the side substrate 21 or the top substrate 22, and the pressure sensor module 4 is arranged at intervals from the inner shell 3. Compared with setting the pressure sensor module 4 on the substrate 1, by setting the pressure sensor module 4 on the side substrate 21, the area required for setting the pressure sensor module 4 on the substrate 1 is omitted, so that the size of the substrate 1 can be reduced, and then the overall size of the combined sensor 100 can be reduced to meet the development trend of miniaturization. In addition, compared with setting the pressure sensor module 4 on the substrate 1, setting the pressure sensor module 4 on the top substrate 22 can also make the substrate 1 free of extra space to place other components, so that it is easy to realize the diversified functional design of the combined sensor 100. It should be noted that in this embodiment, the housing 2 is not a metal housing, and the housing 2 can include two layers of plates, namely the side substrate 21 and the top substrate 22. Circuits may be arranged inside the side substrate 21 and the top substrate 22, and pads may be arranged on the surface, and the side substrate 21, the top substrate 22 and the substrate 1 may form a three-layer board structure. Specifically, the pressure sensor module 4 may be connected to the pads on the side substrate 21 through gold wires, or the pads of the pressure sensor module 4 may be directly connected to the pads on the side substrate 21 through solder paste; or, the pressure sensor module 4 may be connected to the pads on the top substrate 22 through gold wires, or the pads of the pressure sensor module 4 may be directly connected to the pads on the top substrate 22 through solder paste.

[0069] In one embodiment, the microphone module 5 includes a microphone MEMS chip and a microphone ASIC chip that are communicatively connected, the microphone MEMS chip is arranged on the substrate 1 and divides the second accommodating cavity into a front cavity 63 located on the outside of the microphone MEMS chip and a second rear cavity 62 located on the inside of the microphone MEMS chip; wherein the microphone MEMS chip is electrically connected to the microphone ASIC chip through a gold wire, and the microphone ASIC chip is electrically connected to the substrate 1 through a gold wire.

[0070] In one embodiment, the pressure sensor module 4 includes a sensor MEMS chip and a sensor ASIC chip that are communicatively connected, wherein the sensor MEMS chip is electrically connected to the sensor ASIC chip via a gold wire, and the sensor ASIC chip is electrically connected to the substrate 1 via a gold wire.

[0071] See also Figure 7 In one embodiment, the combined sensor 100 further includes a waterproof breathable membrane 7 , which covers the inner shell hole 311 ; by setting the waterproof breathable membrane 7 to cover the inner shell hole 311 , it is difficult for external water to enter the front cavity 63 and affect the normal operation of the microphone module 5 .

[0072] See also Figure 6 In one embodiment, the combined sensor 100 further includes a waterproof breathable membrane 7, which covers the housing hole 221. By providing the waterproof breathable membrane 7 to cover the housing hole 221, it is difficult for external water to enter the housing 2, thereby improving the waterproof performance of the combined sensor 100.

[0073] The present invention further provides a microphone, which includes the above-mentioned combined sensor 100. Since the microphone adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0074] The present invention further provides an electronic device, the electronic device comprising the above-mentioned microphone. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here. Among them, the electronic device can be a mobile phone, a tablet, a smart watch, a bracelet, etc.

[0075] The above are only exemplary embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A combined sensor, characterized in that: include: substrate; A housing, the housing is covered on the substrate and forms a first accommodating cavity with the substrate; An inner shell, the inner shell is located in the first accommodating cavity, the inner shell cover is arranged on the substrate and divides the first accommodating cavity into a first rear cavity located outside the inner shell and a second accommodating cavity located inside the inner shell, and the inner shell is connected to the outer shell; A pressure sensor module, wherein the pressure sensor module is disposed in the first accommodating cavity; a microphone module, the microphone module being located in the second accommodating cavity, the microphone module being disposed on the substrate and dividing the second accommodating cavity into a front cavity located outside the microphone module and a second rear cavity located inside the microphone module; The substrate is provided with a connecting hole connecting the first rear cavity and the second rear cavity, the outer shell is provided with an outer shell hole, the inner shell is provided with an inner shell hole connecting the front cavity, the outer shell hole is connected with the inner shell hole, and the first rear cavity and the second rear cavity are both independently arranged from the front cavity.

2. The combined sensor according to claim 1, characterized in that: The inner shell includes a shell body and a sealing member, wherein the shell body is covered on the substrate and divides the first accommodating cavity into the first rear cavity located on the outside of the shell body and the second accommodating cavity located on the inside of the shell body, the sealing member is located between the shell body and the outer shell, and the two sides of the sealing member are respectively sealed against the shell body and the outer shell, and the sealing member forms a connecting channel connecting the outer shell hole and the inner shell hole, so that the sound signal can enter the front cavity through the outer shell hole, the connecting channel and the inner shell hole.

3. The combined sensor according to claim 2, characterized in that: A communication channel is formed between the shell body and the outer shell, and the sealing member is used for sealing the communication channel.

4. The combined sensor according to claim 3, characterized in that: The sealing member includes a top surface and a bottom surface, the connecting channel passes through the top surface and the bottom surface, the top surface is arranged on a side of the outer shell hole facing the front cavity, and the bottom surface is arranged on a side of the inner shell hole facing the outer shell hole, the top surface is in sealing contact with the outer shell, and the bottom surface is in sealing contact with the shell body.

5. The combined sensor according to claim 2, characterized in that: The outer shell comprises a blocking portion, the blocking portion is arranged on a side of the outer shell hole facing the front cavity, the blocking portion is provided with a blocking surface on a side facing the sealing member, the blocking surface is arranged obliquely so that the distance from the blocking surface to the inner shell along a first direction can be gradually reduced along a second direction away from the connecting channel, the first direction is perpendicular to the second direction, and the outer shell hole and the inner shell hole are arranged at intervals along the first direction; And / or, the sealing member is an annular sealing rubber layer.

6. The combined sensor according to claim 1, characterized in that: The outer wall of the inner shell is provided with a sealing area, the inner shell hole is provided in the sealing area, the sealing area is in contact with the inner wall of the outer shell, and the outer shell hole is provided opposite to the sealing area.

7. The combined sensor according to claim 1, characterized in that: The inner shell separates the first rear cavity into a first cavity and a second cavity that are independent of each other. The connecting holes include a first through hole, a second through hole, a third through hole and a fourth through hole. The first through hole is connected to the first cavity, the second through hole is connected to the second cavity, the third through hole is connected to the second rear cavity, and the first through hole, the second through hole and the third through hole are all connected to the fourth through hole.

8. The combined sensor according to claim 7, characterized in that: There are a plurality of the first through holes, and the plurality of the first through holes are arranged at intervals; And / or, the number of the second through holes is multiple, and the multiple second through holes are arranged at intervals; And / or, there are multiple third through holes, and the multiple third through holes are arranged at intervals.

9. The combined sensor according to any one of claims 1 to 8, characterized in that: The aperture of the outer shell hole is larger than the aperture of the inner shell hole.

10. The combined sensor according to any one of claims 1 to 8, characterized in that: The pressure sensor module is located in the first rear cavity, the pressure sensor module is arranged on the substrate, and the pressure sensor module is spaced apart from the inner shell.

11. The combined sensor according to any one of claims 1 to 8, characterized in that: The pressure sensor module is located in the first rear cavity, the outer shell includes a side surrounding substrate and a top substrate, the two sides of the side surrounding substrate are respectively connected to the top substrate and the substrate, the top substrate is provided with the outer shell hole, the pressure sensor module is arranged on the side surrounding substrate or the top substrate, and the pressure sensor module is spaced apart from the inner shell.

12. The combined sensor according to any one of claims 1 to 8, characterized in that: The microphone module comprises a microphone MEMS chip and a microphone ASIC chip which are communicatively connected, wherein the microphone MEMS chip is arranged on the substrate and divides the second accommodation cavity into a front cavity located outside the microphone MEMS chip and a second rear cavity located inside the microphone MEMS chip; And / or, the pressure sensor module includes a sensor MEMS chip and a sensor ASIC chip that are communicatively connected.

13. The combined sensor according to any one of claims 1 to 8, characterized in that: The combined sensor further comprises a waterproof and breathable membrane, wherein the waterproof and breathable membrane covers the inner shell hole; Alternatively, the waterproof and breathable membrane covers the shell hole.

14. A microphone, characterized in that: The microphone comprises the combined sensor according to any one of claims 1 to 13.

15. An electronic device, characterized in that: The electronic device comprises the microphone according to claim 14.

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