Circuit board assembly and its manufacturing method

Abstract

A circuit board assembly and its manufacturing method are disclosed. The circuit board assembly includes a circuit board, electronic components, a metal component, a first heat pipe, and a second heat pipe. The circuit board includes a third circuit substrate, a second dielectric layer, a first circuit substrate, a first dielectric layer, and a second circuit substrate stacked sequentially. The first circuit substrate includes a first surface and a second surface disposed opposite to each other, and a first side surface connecting the first surface and the second surface. The first dielectric layer is in contact with the first surface, and the second dielectric layer is in contact with the second surface. The metal component is embedded in the first circuit substrate, the first heat pipe is embedded in the metal component and exposed on the first side surface, and the second heat pipe protrudes from the first side surface and is connected to the first heat pipe to form a closed loop. Coolant is contained in the first heat pipe and the second heat pipe. The circuit board has an opening that penetrates the first dielectric layer and the second circuit substrate and exposes the metal component. The electronic components are disposed on the metal component.

Description

Technical Field

[0001] This invention relates to the field of circuit boards, and more particularly to a circuit board assembly capable of rapid heat dissipation and its manufacturing method. Background Technology

[0002] With the development of science and technology, more and more components are being integrated into electronic devices, making heat dissipation a crucial parameter affecting their performance. Current electronic devices dissipate heat generated by components mounted on the circuit board using the circuit board itself or metal reinforcing plates mounted on it. However, this heat dissipation method is dependent on the ambient temperature of the circuit board and its effectiveness is relatively poor. Summary of the Invention

[0003] In view of the above, the present invention provides a circuit board assembly and a method for manufacturing the same to solve the above-mentioned technical problems.

[0004] This application provides a circuit board assembly, including a circuit board, electronic components, a metal component, a first heat pipe, and a second heat pipe. The circuit board includes a third circuit substrate, a second dielectric layer, a first circuit substrate, a first dielectric layer, and a second circuit substrate stacked sequentially. The first circuit substrate includes a first surface and a second surface disposed opposite each other, and a first side surface connecting the first and second surfaces. The first dielectric layer is in contact with the first surface, and the second dielectric layer is in contact with the second surface. The metal component is embedded within the first circuit substrate, the first heat pipe is embedded within the metal component and exposed outside the first side surface, and the second heat pipe protrudes from the first side surface and connects to the first heat pipe to form a closed loop. Coolant is contained within the first and second heat pipes. The circuit board has an opening that penetrates the first dielectric layer and the second circuit substrate and exposes the metal component. The electronic component is disposed on the metal component.

[0005] Another method for manufacturing a circuit board assembly according to this application includes the following steps:

[0006] A first circuit board is provided, the first circuit board including a first surface and a second surface disposed opposite to each other;

[0007] A through hole is formed that connects the first and second surfaces;

[0008] The heat pipe assembly is placed in the through hole. The heat pipe assembly includes a metal part and a first heat pipe. The first heat pipe includes a body part and a first interface part. The body part is embedded in the metal part, and the first interface part protrudes from the metal part.

[0009] A first dielectric layer and a second circuit substrate are sequentially stacked on a first surface. The first dielectric layer has a first opening, in which a metal component is exposed. The first dielectric layer also covers a first interface portion, and the second circuit substrate seals the first opening.

[0010] A second dielectric layer and a third circuit substrate are sequentially stacked on the second surface, and the second dielectric layer covers the via.

[0011] The portion of the second circuit board is cut away to expose the first opening, and the portions of the first circuit board, the first dielectric layer, the second circuit board, the second dielectric layer, and the third circuit board are cut away to expose the first interface portion.

[0012] The second heat pipe is connected to the first interface section to form a closed loop with the first heat pipe, and the second heat pipe has a liquid injection hole;

[0013] Coolant is injected into the second heat pipe and the first heat pipe through the injection hole;

[0014] Electronic components are mounted on metal parts.

[0015] In the circuit board assembly and manufacturing method provided in this application, a metal component is embedded in the circuit board and exposed on the surface of the circuit board. A first heat pipe is embedded in the metal component and exposed on the side of the circuit board. A second heat pipe is connected to the first heat pipe and located outside the circuit board. Electronic devices are disposed on the metal component. The heat generated by the electronic devices is absorbed by the coolant in the first and second heat pipes to achieve heat dissipation. On the other hand, it is also transferred to the outside of the circuit board through the second heat pipe to achieve heat dissipation, thereby improving heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of a first circuit board provided in one embodiment of this application.

[0017] Figure 2 In order to be in Figure 1 The diagram shows a cross-section of the first circuit board after a through-hole has been formed.

[0018] Figure 3 for Figure 2 The top view of the first circuit board shown.

[0019] Figure 4 This is a schematic diagram of the structure of a heat pipe assembly provided in one embodiment of this application.

[0020] Figure 5 To be Figure 4 The heat pipe assembly shown is placed Figure 2 The diagram shows a cross-sectional view of a through-hole through which a first circuit board, a second circuit board, a third circuit board, a first dielectric layer, and a second dielectric layer are stacked.

[0021] Figure 6 To be Figure 5 The diagram shows a cross-sectional view of the first circuit substrate, the second substrate, the third substrate, the first dielectric layer, and the second dielectric layer after they are laminated together.

[0022] Figure 7 In order to be in Figure 6 A schematic cross-sectional view of the second and third substrates after the second and third circuit boards are formed.

[0023] Figure 8 To be Figure 7 The diagram shows the cross-sections of the second, first, and third circuit boards after they have been cut and removed.

[0024] Figure 9 To connect the second heat pipe with Figure 8 A schematic diagram of the cross-section after the first heat pipe is connected.

[0025] Figure 10 This is a schematic diagram of a second heat pipe provided in one embodiment of this application.

[0026] Figure 11 In order to be in Figure 9 The diagram shows a cross-section of the first and second heat pipes after coolant has been injected.

[0027] Figure 12 This is a cross-sectional schematic diagram of a circuit board assembly provided in one embodiment of this application.

[0028] Explanation of main component symbols

[0029] First circuit board 10

[0030] First surface 10a

[0031] Second surface 10b

[0032] First grassroots level 11

[0033] First conductive circuit layer 12

[0034] Through hole 101

[0035] Main body 101a

[0036] Extension 101b

[0037] Heat pipe assembly 20

[0038] Metal parts 21

[0039] First heat pipe 22

[0040] Page 1, 21a

[0041] Page 21b

[0042] Second side 21c

[0043] Body part 221

[0044] First interface section 222

[0045] Third page 221a

[0046] Third substrate 601

[0047] Second dielectric layer 50

[0048] First dielectric layer 30

[0049] Second substrate 401

[0050] First opening 30a

[0051] Second grassroots level 41

[0052] First metal layer 42

[0053] Third grassroots level 61

[0054] Second metal layer 62

[0055] Conductive hole 110

[0056] Second conductive circuit layer 43

[0057] Third conductive layer 63

[0058] Second circuit board 40

[0059] Third circuit board 60

[0060] First primary copper layer 431

[0061] First copper plating layer 432

[0062] Second primary copper layer 631

[0063] Second copper plating layer 632

[0064] Second opening 43a

[0065] First through slot 43b

[0066] Second through slot 63b

[0067] Solder resist layer 70

[0068] 70a weld null opening

[0069] Second heat pipe 80

[0070] Second interface section 81

[0071] Injection port 80a

[0072] Adhesive layer 91

[0073] Coolant 90

[0074] Sealing component 92

[0075] Electronic Components 210

[0076] solder pad 210a

[0077] Wire 220

[0078] Thermal adhesive 230

[0079] Circuit board 100

[0080] First side view 10c

[0081] Opening 120

[0082] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0083] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0084] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0085] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined or substituted with each other.

[0086] One embodiment of this application provides a method for manufacturing a circuit board assembly, which includes the following steps.

[0087] Step S1, please refer to Figure 1 A first circuit board 10 is provided, the first circuit board 10 including a first surface 10a and a second surface 10b disposed opposite to each other.

[0088] The first circuit board 10 includes a first base layer 11 and a first conductive line layer 12 stacked along a first direction Z. In this embodiment, the first circuit board 10 includes two first conductive line layers 12, with the first base layer 11 sandwiched between the two first conductive line layers 12. The two surfaces of the two first conductive line layers 12 facing away from the first base layer 11 are designated as a first surface 10a and a second surface 10b. In other embodiments, the number of first conductive line layers 12 is one, with the surface of the first conductive line layer 12 facing away from the first base layer 11 designated as the first surface 10a, and the surface of the first base layer 11 facing away from the first conductive line layer 12 designated as the second surface 10b.

[0089] In this embodiment, the first base layer 11 is a dielectric layer, and the material of the dielectric layer can be polyimide, epoxy resin, glass fiber prepreg, carbon fiber prepreg, etc. In other embodiments, the first base layer 11 includes a dielectric layer and an inner circuit layer stacked together, and the inner circuit layer and the first conductive circuit layer 12 are electrically connected through conductive holes or conductive pillars penetrating the dielectric layer.

[0090] For step S2, please refer to [link / reference]. Figure 2 A through-hole 101 is formed on the first circuit substrate 10, penetrating the first surface 10a and the second surface 10b. The through-hole 101 can be formed by mechanical cutting or laser cutting.

[0091] Please see Figure 3 The through hole 101 includes a main body 101a and two extensions 101b, which extend from the edge of the main body 101a and communicate with it. In this embodiment, the two extensions 101b are located on the same side of the main body 101a. In other embodiments, the two extensions 101b are located on different sides of the main body 101a.

[0092] For step S2, please refer to [link / reference]. Figure 4A heat pipe assembly 20 is provided, comprising a metal component 21 and a first heat pipe 22. The metal component 21 includes a first surface 21a and a second surface 21b disposed opposite each other, and a second side surface 21c connecting the first surface 21a and the second surface 21b. The first heat pipe 22 includes a body portion 221 and two first interface portions 222. The body portion 221 is embedded in the metal component 21 and includes a third surface 221a exposed above the first surface 21a. In this embodiment, the third surface 221a is flush with the first surface 21a. The body portion 221 is generally W-shaped and includes four alternately connected straight segments and three bent segments. In other embodiments, the number of straight segments and the number of bent segments can be set according to actual needs. The two first interface portions 222 are connected to the two outermost straight segments and protrude from the second side surface 21c. In other embodiments, the third surface 221a may protrude from or be lower than the first surface 21a and be exposed outside the first surface 21a, or the first surface 21a may cover the third surface 221a, so that the body portion 221 is completely embedded in the metal part 21.

[0093] Step S3: Place the heat pipe assembly 20 in the through hole 101 to form a first dielectric layer and a second circuit substrate that are sequentially stacked on the first surface 10a, and to form a second dielectric layer and a third circuit substrate that are sequentially stacked on the second surface 10b.

[0094] In some implementations, step S3 includes the following steps S31-S33.

[0095] Step S31, please refer to Figure 5 and Figure 6 The heat pipe assembly 20 is placed in the through hole 101, and the third substrate 601, the second dielectric layer 50, the first circuit substrate 10, the first dielectric layer 30 and the second substrate 401 are sequentially stacked along the first direction Z and pressed together.

[0096] The metal part 21 is housed in the main body 101a, and the two first interface parts 222 are housed in the two extension parts 101b. The first surface 21a is flush with the first surface 10a, and the second surface 21b is flush with the second surface 10b. There is a gap between the heat pipe assembly 20 and the edge of the through hole 101 to facilitate the placement of the heat pipe assembly 20 in the through hole 101.

[0097] A first dielectric layer 30 covers and contacts the first surface 10a. The first dielectric layer 30 has a first opening 30a, the size of which is greater than or equal to the size of the metal part 21 and less than or equal to the size of the main body 101a, such that after the first dielectric layer 30 is pressed onto the first surface 10a, the entire metal part 21 can be exposed through the first opening 30a. After pressing, the entire first surface 21a of the metal part 21 is exposed in the first opening 30a, preventing damage to the heat pipe assembly 20 during subsequent cutting. The first dielectric layer 30 also covers the first interface portion 222.

[0098] The second dielectric layer 50 covers and contacts the second surface 10b, and seals the through hole 101.

[0099] Both the first dielectric layer 30 and the second dielectric layer 50 include polyimide, epoxy resin, glass fiber prepreg, carbon fiber prepreg, etc. During lamination, the first dielectric layer 30 and the second dielectric layer 50 melt and fill the gap between the heat pipe assembly 20 and the edge of the through hole 101, and bond the heat pipe assembly 20 and the first circuit board 10 to improve the stability of the heat pipe assembly 20 within the through hole 101. The second surface 21b and the second side surface 21c of the metal part 21, as well as the periphery of the first interface portion 222, are surrounded by the first dielectric layer 30 and the second dielectric layer 50 to isolate the heat pipe assembly 20 and the first conductive circuit layer 12.

[0100] The second substrate 401 includes a second base layer 41 and a first metal layer 42 stacked together. The second base layer 41 covers and contacts the surface of the first dielectric layer 30 that is opposite to the first surface 10a, and the second base layer 41 also seals the first opening 30a and is not in contact with the heat pipe assembly 20. The third substrate 601 includes a third base layer 61 and a second metal layer 62 stacked together. The third base layer 61 covers and contacts the surface of the second dielectric layer 50 that is opposite to the second surface 10b.

[0101] Both the second base layer 41 and the third base layer 61 can be dielectric layers, and the materials of the dielectric layers can be polyimide, epoxy resin, glass fiber prepreg, carbon fiber prepreg, etc. The materials of the first metal layer 42 and the second metal layer 62 can be copper, gold, silver, etc.

[0102] Step S32, please refer to Figure 6 and Figure 7 A conductive hole 110 is formed that penetrates the third substrate 601, the second dielectric layer 50, the first circuit substrate 10, the first dielectric layer 30, and the second substrate 401. The conductive hole 110 is electrically connected to the first metal layer 42, the first conductive circuit layer 12, and the second metal layer 62.

[0103] In some embodiments, the conductive hole 110 can be formed sequentially by drilling and electroplating processes. In other embodiments, a conductive pillar can also be formed that penetrates the third substrate 601, the second dielectric layer 50, the first circuit substrate 10, the first dielectric layer 30, and the second substrate 401.

[0104] For step S33, please refer to... Figure 6 and Figure 7 A second conductive line layer 43 and a third conductive line layer 63 are formed on the first metal layer 42 and the second metal layer 62. The second substrate 41 and the second conductive line layer 43 constitute the second circuit substrate 40. The third substrate 61 and the third conductive line layer 63 constitute the third circuit substrate 60.

[0105] In some embodiments, a dry film is coated on the surface of the first metal layer 42, and then exposed, developed and electroplated to form the second conductive circuit layer 43; a dry film is coated on the surface of the second metal layer 62, and then exposed, developed and electroplated to form the third conductive circuit layer 63.

[0106] In this embodiment, the second conductive circuit layer 43 includes a first primary copper layer 431 and a first copper plating layer 432 stacked together, and the third conductive circuit layer 63 includes a second primary copper layer 631 and a second copper plating layer 632 stacked together. Both the first primary copper layer 431 and the second primary copper layer 631 are made of copper foil, and the first primary copper layer 431 is formed by etching the first metal layer 42, while the second primary copper layer 631 is formed by etching the second metal layer 62. Both the first copper plating layer 432 and the second copper plating layer 632 are formed by electroplating.

[0107] The second conductive layer 43 has a second opening 43a that penetrates the first primary copper layer 431 and the first copper plating layer 432, exposing a portion of the first dielectric layer 30. The position of the second opening 43a corresponds to the position of the first opening 30a. Along the first direction Z, the orthographic projection of the first opening 30a lies within the orthographic projection of the second opening 43a. In some embodiments, the edge of the second opening 43a is aligned with the edge of the first opening 30a. The second opening 43a is an annular groove. In other embodiments, the second opening 43a can be a through-hole.

[0108] The second conductive layer 43 also has a first through-slot 43b, which penetrates the first primary copper layer 431 and the first copper plating layer 432 and exposes a portion of the second base layer 41. The position of the first through-slot 43b corresponds to the position of the two first interface portions 222. In some embodiments, in the first direction Z, the edge of the first through-slot 43b is aligned with the edge of the extension 101b. The third conductive layer 63 has a second through-slot 63b, which penetrates the second primary copper layer 631 and the second copper plating layer 632 and exposes a portion of the third base layer 61. The position of the second through-slot 63b corresponds to the position of the two first interface portions 222. In some embodiments, in the first direction Z, the edge of the second through-slot 63b is aligned with the edge of the first interface portion 222.

[0109] The second opening 43a, the first through slot 43b, and the second through slot 63b can be formed by mechanical drilling or laser drilling.

[0110] For step S4, please refer to [link / reference]. Figure 7 A solder resist layer 70 is formed on the surface of the second conductive circuit layer 43 and the surface of the third conductive circuit layer 63. The solder resist layer 70 has a solder resist opening 70a, and a second opening 43a, a first through groove 43b, and a second through groove 63b are exposed from the corresponding solder resist opening 70a. A portion of the second conductive circuit layer 43 is also exposed from the solder resist opening 70a to connect electronic devices.

[0111] For step S5, please refer to [link / reference]. Figure 7 and Figure 8 The portion of the second circuit board 40 is cut and removed to expose the first opening 30a, and the portions of the first circuit board 10, the first dielectric layer 30, the second circuit board 40, the second dielectric layer 50, and the third circuit board 60 are cut and removed to expose the first interface portion 222.

[0112] In this embodiment, a portion of the second base layer 41 is cut and removed along the edge of the second opening 43a to expose the first opening 30a; a portion of the second base layer 41 and the first dielectric layer 30 is cut and removed along the edge of the first through groove 43b; and a portion of the third base layer 61 and the second dielectric layer 50 is cut and removed along the edge of the second through groove 63b to expose the first interface portion 222.

[0113] Step S6, please refer to Figure 9 The second heat pipe 80 and the first interface 222 are connected to form a closed loop between the second heat pipe 80 and the first heat pipe 22.

[0114] Please see Figure 9 and Figure 10The second heat pipe 80 includes two second interface portions 81, which are respectively connected to two first interface portions 222 to form a closed loop. The second heat pipe 80 has a liquid injection hole 80a for injecting coolant.

[0115] In this embodiment, the second interface portion 81 is inserted into the first interface portion 222 and abuts against the inner wall of the first interface portion 222 to achieve connection.

[0116] In some embodiments, after the second interface portion 81 is inserted into the first interface portion 222, the contact portions between the second interface portion 81 and the first interface portion 222 are welded together to improve the stability of the connection between the second heat pipe 80 and the first heat pipe 22.

[0117] Please see Figure 9 An adhesive layer 91 is formed by dispensing adhesive at the connection between the second interface portion 81 and the first interface portion 222, and the adhesive layer 91 bonds the first interface portion 222 and the second interface portion 81. In this embodiment, the adhesive layer 91 is located between the outer wall of the second interface portion 81 and the outer wall of the first interface portion 222. In other embodiments, the adhesive layer 91 is located between the inner wall of the first interface portion 222 and the outer wall of the second interface portion 81.

[0118] For step S7, please refer to [link / reference]. Figure 11 Coolant 90 is injected into the second heat pipe 80 and the first heat pipe 22 through the injection hole 80a. Coolant 90 is a non-conductive liquid, which can be pure water, ethylene glycol, etc.

[0119] Step S8, please refer to Figure 11 Insert the sealing component 92 into the injection hole 80a to seal the injection hole 80a.

[0120] The sealing element 92 is detachably connected to the injection port 80a to facilitate the addition of coolant 90. In this embodiment, the sealing element 92 is screwed to the injection port 80a.

[0121] For step S9, please refer to [link / reference]. Figure 12 Electronic device 210 is mounted on the first surface 21a of metal part 21 to obtain circuit board assembly 200.

[0122] In this embodiment, the electronic device 210 is a chip. The electronic device 210 has a solder pad 210a, which is located on the side of the electronic device 210 away from the metal part 21. The solder pad 210a is electrically connected to the second conductive line layer 43 through a wire 220, so as to realize the electrical connection between the electronic device 210 and the second conductive line layer 43.

[0123] In this embodiment, the electronic device 210 is bonded to the first surface 21a of the metal part 21 by thermally conductive adhesive 230.

[0124] Please see Figure 12 This application provides a circuit board assembly 200, including a circuit board 100, a heat pipe assembly 20, a second heat pipe 80, and an electronic device 210. The circuit board 100 includes a third circuit substrate 60, a second dielectric layer 50, a first circuit substrate 10, a first dielectric layer 30, and a second circuit substrate 40, sequentially stacked along a first direction Z. The first circuit substrate 10 includes a first surface 10a and a second surface 10b disposed opposite to each other, and a first side surface 10c connecting the first surface 10a and the second surface 10b. The first dielectric layer 30 covers and contacts the first surface 10a. The second dielectric layer 50 covers and contacts the second surface 10b.

[0125] The heat pipe assembly 20 includes a metal component 21 and a first heat pipe 22. The metal component 21 is embedded in the first circuit substrate 10 and exposed outside the first surface 10a and the second surface 10b, and does not contact the first conductive circuit layer 12. The metal component 21 includes a first surface 21a and a second surface 21b disposed opposite each other, and a second side surface 21c connecting the first surface 21a and the second surface 21b. The second surface 21b and the second side surface 21c are surrounded by a first dielectric layer 30 and a second dielectric layer 50 to isolate the metal component 21 from the first conductive circuit layer 12. The first heat pipe 22 is embedded in the metal component 21 and exposed outside the first side surface 10c. The first heat pipe 22 includes a body portion 221 and two first interface portions 222. The body portion 221 is embedded in the metal component 21 and exposed outside the first surface 21a. The two first interface portions 222 protrude from the second side surface 21c and extend to the first side surface 10c, and do not contact the first conductive circuit layer 12. The periphery of the first interface portion 222 is surrounded by the first dielectric layer 30 and the second dielectric layer 50 to isolate the first interface portion 222 from the first conductive line layer 12.

[0126] The second heat pipe 80 protrudes from the first side 10c and connects to the first interface portion 222, forming a closed loop with the first heat pipe 22. Coolant 90 is contained in both the first heat pipe 22 and the second heat pipe 80. The second heat pipe 80 includes two second interface portions 81, which are inserted into the first interface portion 222. The second heat pipe 80 has a liquid injection hole 80a for injecting coolant 90.

[0127] The circuit board assembly 200 also includes an adhesive layer 91 and a sealing member 92. The adhesive layer 91 is disposed on the surfaces of the first interface portion 222 and the second interface portion 81, and adheres to the first interface portion 222 and the second interface portion 81. The sealing member 92 is partially accommodated in the injection hole 80a and seals the injection hole 80a.

[0128] The circuit board 100 is also provided with an opening 120, which penetrates the first dielectric layer 30 and the second circuit substrate 40 along the first direction Z and exposes the first surface 21a of the metal part 21.

[0129] The circuit board 100 also includes a solder resist layer 70. The solder resist layer 70 is disposed on the surfaces of the second circuit board 40 and the third circuit board 60 opposite to the first circuit board 10.

[0130] An electronic device 210 is disposed on the first surface 21a of the metal component 21 and housed in the opening 120. The electronic device 210 includes a solder pad 210a located on the side of the electronic device 210 opposite to the metal component 21. The solder pad 210a is electrically connected to the second circuit board 40 via a wire 220. Thermally conductive adhesive 230 is sandwiched between the electronic device 210 and the metal component 21.

[0131] The heat generated by the electronic device 210 is transferred to the coolant 90 through the metal part 21 and the first heat pipe 22. The coolant 90 absorbs heat and evaporates, which has the effect of heat dissipation and cooling. The heat is also transferred to the second heat pipe 80 through the coolant 90 and dissipated to the external environment through the second heat pipe 80, which further improves the heat dissipation efficiency.

[0132] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above as a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A circuit board assembly, comprising a circuit board and electronic components, characterized in that, The circuit board includes a third circuit substrate, a second dielectric layer, a first circuit substrate, a first dielectric layer, and a second circuit substrate stacked sequentially. The first circuit substrate includes a first surface and a second surface disposed opposite to each other, and a first side surface connecting the first surface and the second surface. The first dielectric layer is in contact with the first surface, and the second dielectric layer is in contact with the second surface. The circuit board assembly also includes a metal component, a first heat pipe, and a second heat pipe. The metal component is embedded in the first circuit substrate, the first heat pipe is embedded in the metal component and exposed outside the first side surface, and the second heat pipe protrudes from the first side surface and is connected to the first heat pipe to form a closed loop. Coolant is contained in the first heat pipe and the second heat pipe. The circuit board has an opening that penetrates the first dielectric layer and the second circuit substrate and exposes the metal component. The electronic device is disposed on the metal component.

2. The circuit board assembly as claimed in claim 1, characterized in that, The first heat pipe includes two first interface sections, and the second heat pipe includes two second interface sections, which are respectively inserted into the two first interface sections.

3. The circuit board assembly as described in claim 2, characterized in that, The circuit board assembly further includes an adhesive layer that bonds the first interface portion and the second interface portion.

4. The circuit board assembly as claimed in claim 1, characterized in that, The circuit board assembly also includes a sealing element, and the second heat pipe has a liquid injection hole, in which the sealing element is partially accommodated.

5. The circuit board assembly as claimed in claim 1, characterized in that, The circuit board assembly also includes thermally conductive adhesive, which is sandwiched between the electronic device and the metal component.

6. The circuit board assembly as claimed in claim 1, characterized in that, The metal component includes a first surface exposed in the opening, and the first heat pipe is exposed outside the first surface.

7. The circuit board assembly as claimed in claim 1, characterized in that, The metal component includes a first surface and a second surface disposed opposite to each other, and a second side surface connecting the first surface and the second surface. The first surface is exposed in the opening and outside the first surface, and the second surface is exposed outside the second surface. The second surface and the second side surface are surrounded by the first dielectric layer and the second dielectric layer.

8. The circuit board assembly as claimed in claim 1, characterized in that, The circuit board assembly further includes a solder resist layer disposed on the surfaces of the second circuit board and the third circuit board opposite to the first circuit board.

9. A method for manufacturing a circuit board assembly, characterized in that, Includes the following steps: A first circuit board is provided, the first circuit board including a first surface and a second surface disposed opposite to each other; A through hole is formed that connects the first surface and the second surface; A heat pipe assembly is placed in the through hole. The heat pipe assembly includes a metal part and a first heat pipe. The first heat pipe includes a body part and a first interface part. The body part is embedded in the metal part, and the first interface part protrudes from the metal part. A first dielectric layer and a second circuit substrate are sequentially stacked on the first surface. The first dielectric layer has a first opening, and the metal component is exposed in the first opening. The first dielectric layer also covers the first interface portion, and the second circuit substrate seals the first opening. A second dielectric layer and a third circuit substrate are sequentially stacked on the second surface, and the second dielectric layer covers the through-hole; Cut away a portion of the second circuit board to expose the first opening, and cut away portions of the first circuit board, the first dielectric layer, the second circuit board, the second dielectric layer, and the third circuit board to expose the first interface portion. The second heat pipe is connected to the first interface section to form a closed loop with the first heat pipe, and the second heat pipe has a liquid injection hole; Coolant is injected into the second heat pipe and the first heat pipe through the injection hole; Electronic devices are mounted on the metal part.

10. The method for manufacturing a circuit board assembly as described in claim 9, characterized in that, The second heat pipe includes a second interface portion, which is inserted into the first interface portion.

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