Printed circuit board module and electronic device

Abstract

The invention relates to a printed circuit board module and an electronic device including the same. A printed circuit board module according to one aspect includes: a printed circuit board including a hole; the heat dissipation component is arranged on the printed circuit board and comprises a first surface formed on the upper surface and a second surface arranged downwards in a step shape relative to the first surface; and an electronic component disposed on the second surface, in which a region corresponding to a formation region of the second surface on a lower surface of the heat dissipation member is provided with a protrusion protruding downward than other regions and coupled with the hole.

Description

Technical Field

[0001] Teachings according to exemplary and non-limiting embodiments of the present invention generally relate to a printed circuit board module and an electronic device including the printed circuit board module. Background Art

[0002] The electronic device includes a housing, a printed circuit board disposed in the housing, and one or more electronic components disposed on the printed circuit board. Since the electronic components generate heat when working, and the heat may overload the electronic components and cause the set functions to fail, the heat dissipation structure of the module including the printed circuit board is a necessary consideration.

[0003] In recent years, electronic devices have been miniaturized in consideration of vehicle fuel efficiency, but it is difficult to arrange electronic components including a printed circuit board in a housing because the space in the housing is narrow and electrical noise is generated between a plurality of electronic components.

[0004] [Related technical literature]

[0005] [Patent Document]

[0006] (Patent Document 1) Korean Utility Model Publication No. 20-1998-0061577 (published on November 5, 1998) Summary of the invention

[0007] Technical issues

[0008] The present invention aims to provide a printed circuit board module which can improve heat dissipation efficiency and ensure a larger space in a housing for placing components through miniaturization, and an electronic device including the printed circuit board module.

[0009] Technical Solution

[0010] In one general aspect of the present invention, there may be provided a printed circuit board module comprising:

[0011] a printed circuit board, including holes;

[0012] a heat dissipation member (heat sink) disposed on the printed circuit board, comprising a first surface formed on the upper surface and a second surface disposed in a stepped manner downward relative to the first surface; and

[0013] The electronic component is disposed on the second surface, wherein a region of the lower surface of the heat dissipation member corresponding to a formation region of the second surface is provided with a protrusion protruding downward more than other regions and engaging with the hole.

[0014] In another general aspect of the present invention, there may be provided an electronic device comprising:

[0015] case;

[0016] a printed circuit board including a printed circuit board module disposed in the housing and including a hole;

[0017] a heat dissipation member (heat sink) provided on the printed circuit board, the heat dissipation member including a first surface formed on the upper surface and a second surface provided in a stepped shape downward relative to the first surface; and

[0018] The electronic component is provided on the second surface, and the heat dissipation member has a protrusion which protrudes downward from an area corresponding to a formation area of ​​the second surface and engages with the hole.

[0019] Beneficial Effects

[0020] According to this exemplary embodiment, a hole is formed on the printed circuit board, a protrusion of the heat dissipation component is provided in the hole, and the surface on the heat dissipation component on which the electronic components are provided is formed at a lower height than other areas, so that the area for providing the electronic components can be reduced in the up and down directions, thereby ensuring a larger space within the housing and facilitating the heat dissipation of the driving heat of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a perspective view of a printed circuit board module according to a first exemplary embodiment of the present invention.

[0022] Figure 2 is a top plan view of a printed circuit board module according to a first exemplary embodiment of the present invention.

[0023] Figure 3 is a top plan view of a bottom surface of a printed circuit board module according to a first exemplary embodiment of the present invention.

[0024] Figure 4 is an exploded perspective view of a printed circuit board module according to a first exemplary embodiment of the present invention.

[0025] Figure 5 is a cross-sectional view of a combined structure of a printed circuit board, an electronic component, a heat sink, and a bracket according to a first exemplary embodiment of the present invention.

[0026] Figure 6 is a perspective view of a printed circuit board module according to a second exemplary embodiment of the present invention.

[0027] Figure 7 is a top plan view of a printed circuit board module according to a second exemplary embodiment of the present invention.

[0028] Figure 8 is an exploded perspective view of a printed circuit board module according to a second exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0029] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0030] However, the present invention is not limited to the given exemplary embodiments described, but may be implemented in various different forms, and one or more components in the exemplary embodiments may be optionally combined or replaced between the embodiments within the scope of the present invention.

[0031] In addition, unless otherwise clearly defined and explained, the terms (including technical terms and scientific terms) used in the embodiments of the present invention should be interpreted according to the meaning understood by ordinary technicians in the field to which the present invention belongs, and common terms, such as terms defined in dictionaries, should be interpreted according to their meaning in the context of the relevant field.

[0032] Furthermore, the terms used in the embodiments of the present invention are intended to describe the embodiments but are not intended to limit the present invention.

[0033] In this specification, unless the context otherwise requires, the singular may include the plural, and a reference to "at least one (or more) of A and (or) B and C" may include one or more of any combinations of A, B and C that can be combined.

[0034] In addition, the terms first, second, A, B, (a), (b), etc. may be used to describe the components of the embodiments of the present invention. These terms are only used to distinguish one component from another component, and are not intended to limit the nature, order or sequence of these components by these terms.

[0035] In addition, when a component is described as being “connected,” “coupled” or “attached” to another component, it can include the case where the component is directly “connected,” “coupled” or “attached” to the other component, as well as the case where the component is “connected,” “coupled” or “attached” to another component located between the component and the other component.

[0036] Furthermore, when described as being formed or disposed “above” or “below” each component, “above” or “below” includes not only a case where two components are in direct contact with each other, but also a case where one or more other components are formed or disposed between the two components. Furthermore, when expressed as “above” or “below”, it may include both upward and downward meanings relative to a single component.

[0037] Figure 1 is a perspective view of a printed circuit board module according to a first exemplary embodiment of the present invention, Figure 2 is a top view of a printed circuit board module according to a first exemplary embodiment of the present invention, Figure 3 is a top view of a bottom surface of a printed circuit board module according to a first exemplary embodiment of the present invention, Figure 4is an exploded perspective view of a printed circuit board module according to a first exemplary embodiment of the present invention, Figure 5 is a cross-sectional view of a combined structure of a printed circuit board, an electronic component, a heat sink, and a bracket according to a first exemplary embodiment of the present invention.

[0038] Now refer to Figures 1 to 5 The printed circuit board module 10 according to the first exemplary embodiment of the present invention may be disposed in a housing. The housing may form the exterior of the electronic device and may form a space in which the printed circuit board module 10 is disposed.

[0039] The printed circuit board module 10 may include a printed circuit board 100 , an electronic component 110 , a heat sink 130 , and a bracket 150 .

[0040] The printed circuit board 100 may be formed in a plate shape and disposed in a space within a housing. On a surface of the printed circuit board 100 , one or more elements for driving electronic devices may be disposed. The elements may be disposed on an upper surface or a lower surface of the printed circuit board 100 .

[0041] The printed circuit board 100 may include a hole 102. The hole 102 may be formed to penetrate the other surface of the printed circuit board 100 from one surface. The hole 102 may have a rectangular cross-sectional shape, but there is no restriction on the shape of the hole 102. The cross-sectional area of ​​the hole 102 may be formed to be larger than the cross-sectional area of ​​the protrusion 133 of the heat dissipation member 130, which will be described later. The hole 102 may include a first side, a second side opposite to the first side, a third side connecting the first side with the second side, and a fourth side connecting the first side with the second side and opposite to the third side. The first side and the second side may be longer than the third side and the fourth side. The first side and the second side may be arranged to face each other in a first direction (X), and the third side and the fourth side may be arranged to face each other in a second direction (Y) perpendicular to the first direction (X).

[0042] The printed circuit board 100 may include a pin hole 104. The pin hole 104 may be disposed outside the hole 102. The pin hole 104 may be disposed outside the first side of the hole 102. The pin hole 104 may be provided in plurality, spaced apart from each other along the longitudinal direction of the first side outside the first side. The pin hole 104 may be combined with a pin 112 of the electronic component 110, which will be described later.

[0043] The electronic component 110 may be disposed on the printed circuit board 100. The electronic component 110 may be used to drive an electronic device, and may be electrically and physically connected to the printed circuit board 100. The electronic component 110 may include a core and pins 112 extending from the core.

[0044] The core may have a hexahedral shape. A plurality of step (step) surfaces 117, 118 of different heights in the up and down directions may be formed on the upper surface of the core. The plurality of step surfaces 117, 118 may include a first step surface 117 and a second step surface 118. The first step surface 117 and the second step surface 118 may be adjacent in the first direction (X). The first step surface 117 may be set lower than the second step surface 118. The second step surface 118 may be set above the first step surface 117. The second step surface 118 may be set adjacent to the first side of the hole 102. The first step surface 117 may be set adjacent to the second side of the hole 102.

[0045] The first through hole 114 may be formed in the upper surface of the core. The first through hole 114 may be formed to penetrate downward from the upper surface of the core. The first through hole 114 may be disposed on the first stepped surface 117.

[0046] The pin 112 may be formed to protrude outward from one side of the core. At least one pin 112 may be provided on one side of the core adjacent to the second step surface 118. The pin 112 may have at least one bending region. Through the bending region, the pin 112 may include a plurality of mutually perpendicular regions. In one example, the pin 112 may include a horizontal region protruding from one side of the core parallel to the printed circuit board 100 and a vertical region that bends downward and extends from the elongated end of the horizontal region. The end of the pin 112, i.e., the lower end of the vertical region, may be coupled to the pin hole 104 of the printed circuit board 100. The pin 112 may be soldered into the pin hole 104. The pin 112 may be provided in plurality, corresponding to the number of the pin holes 104, and may be spaced apart from each other along the side of the core.

[0047] The heat dissipation member 130 may be disposed between the printed circuit board 100 and the electronic component 110. The heat dissipation member 130 may be formed of a metal material. The heat dissipation member 130 may contact the surface of the electronic component 110 to dissipate the heat generated by driving the electronic component 110 to the outside. The heat dissipation member 130 may be called a heat sink.

[0048] The heat sink 130 may be formed in the shape of a plate. The surface of the heat sink 130, i.e., the upper and lower parts of the heat sink 130, may be formed with a plurality of stepped (staircase) surfaces having different heights in the up-down direction. The upper surface of the heat sink 130 may have a first surface 131 and a second surface 132 arranged in a stepped manner downward relative to the first surface 131. The lower surface of the heat sink 130 may have a protrusion 133 protruding downward from other areas. The lower surface of the protrusion 133 may be arranged in a stepped manner downward from the lower surface of the heat sink 130 compared to other areas. The second surface 132 may be the upper surface of the protrusion 133.

[0049] The second surface 132 or the protrusion 133 may include a first side (a, see Figure 4 ), a second side b facing the second side of the hole 102, a third side c facing the third side of the hole 102, and a fourth side d facing the fourth side of the hole 102. The first side a and the second side b may be arranged opposite to each other, and the third side c and the fourth side d may be arranged opposite to each other. The first side a and the second side b may be arranged perpendicular to the third side c or the fourth side d, respectively. The first side a and the second side b may be longer than the third side c and the fourth side d, respectively.

[0050] The first side a of the second surface 132 may be open in the first direction (X) parallel to the printed circuit board 100. The first side a of the second surface 132 may form an edge of the heat dissipation member 130. Therefore, a disposition area of ​​the pins 112 extending from the core may be ensured.

[0051] When the printed circuit board 100 is combined with the heat sink 130, the protrusion 133 may be combined in the hole 102. At least a portion of the protrusion 133 may be disposed inside the hole 102. At least a portion of the protrusion 133 may be disposed to overlap the printed circuit board 100 in a direction parallel to the printed circuit board 100. The electronic component 130 may be disposed so that at least a portion thereof overlaps the printed circuit board 100 in a horizontal direction. The lower surface of the electronic component 130 may be disposed lower than the upper surface of the printed circuit board 100.

[0052] When the printed circuit board 100 is combined with the heat sink 130, the lower surface of the protrusion 133 may form a plane coplanar with the lower surface of the printed circuit board 100. Alternatively, the lower surface of the protrusion 133 may be stepped upward or downward from the lower surface of the printed circuit board 100. However, even in this case, the lower surface of the protrusion 133 may be set lower than the upper surface of the printed circuit board 100.

[0053] The lower surface of the heat sink 130 may be soldered to the upper surface of the printed circuit board 100 except for the formation area of ​​the protrusion 133. The upper surface of the printed circuit board 100 to which the lower surface of the heat sink 130 is soldered may be a ground area.

[0054] The heat sink 130 may include a first coupling hole 136. The first coupling hole 136 may be formed to penetrate downward from the upper surface of the heat sink 130. There may be a plurality of first coupling holes 136, and they may be disposed opposite to each other with respect to the second surface 132 or the protrusion 133. A plurality of first coupling holes 136 may be disposed on the outer side of the second surface 132 or the protrusion 133.

[0055] The first coupling hole 136 may have a rectangular cross-sectional shape. The protrusion 138 may be formed on the inner surface of the first coupling hole 136. The protrusion 138 may have a shape that protrudes more from the inner surface of the first coupling hole 136 than other areas. The protrusion 138 may be coupled with the second coupling hole 158 of the bracket 150, which will be described later. The upper surface of the protrusion 138 may have an inclined surface to facilitate engagement with the bracket 150.

[0056] The bracket 150 may be coupled to the printed circuit board 100 , thereby fixing the electronic component 110 and the heat sink 130 to the printed circuit board 100 .

[0057] The bracket 150 may be formed of a metal material.

[0058] The bracket 150 may include an upper surface portion 151 and a plurality of side portions 156 provided at both ends of the upper surface portion 151. The upper surface portion 151 and the plurality of side portions 156 may be integrally formed.

[0059] The upper surface portion 151 may be provided on the electronic component 110. The upper surface portion 151 may be arranged to cover the upper surface of the electronic component 110. At least a portion of a lower surface of the upper surface portion 151 may contact the upper surface of the electronic component 110. The upper surface portion 151 may be combined with the first step surface 117.

[0060] The upper surface portion 151 may include a first region 152 and a plurality of second regions 154 disposed on both sides of the first region 152. The first region 152 may be disposed parallel to the first step surface 117 and may have a lower surface in contact with the first step surface 117. The first region 152 may include a second through hole 153. The second through hole 153 may be formed to penetrate the lower surface from the upper surface of the upper surface portion 151 and may be disposed in an upward direction of the first through hole 114. The bracket 150 may be threadedly coupled to the electronic component 110 by a screw engaged with the second through hole 153 and the first through hole 114.

[0061] The second region 154 may extend outward from both ends of the first region 152. The second region 154 may be inclined such that the distance from the upper surface of the electronic component 110 increases with the distance from the first region 152. The second region 154 may be disposed at least partially spaced apart from the first step surface 117.

[0062] The plurality of side portions 156 may extend downward from both ends of the upper surface portion 151. The plurality of side portions 156 may be arranged to cover the side of the electronic component 110. The plurality of side portions 156 may be spaced apart from the side edge of the electronic component 110.

[0063] The plurality of side portions 156 may be coupled to the first coupling hole 136 of the heat dissipation member (heat sink, 130). The plurality of side portions 156 may include a second coupling hole 158. The second coupling hole 158 may be formed to penetrate from the inner surface to the outer surface of the side portion 156, and may be coupled to the protrusion 138. Through the engagement of the protrusion 138 with the second coupling hole 158, the engagement of the bracket 150 with the heat sink 130 may be ensured.

[0064] A hook portion 157 may be formed at the lower end of the plurality of side portions 156. The hook portion 157 may be inclined downward to increase the distance from the side of the electronic component 110. The hook portion 157 may contact the inner surface of the first coupling hole 136 on the side opposite to the side where the protrusion 138 is formed.

[0065] In a case where the protrusion 138 is engaged in the second combining hole 158 , each of the plurality of side portions 156 may have an elastic restoring force in a direction pressing a lower surface of the protrusion 138 .

[0066] In addition, the side portion 156 may be inclined such that a horizontal distance from the side of the electronic component 110 increases toward a lower end.

[0067] According to the above structure, a hole can be formed on the printed circuit board, a protrusion of the heat dissipation component is provided in the hole, and the surface on the heat dissipation component where the electronic components are provided is formed to be smaller than other areas, so that the area for providing the electronic components can be reduced based on the up and down directions, thereby ensuring a larger space in the housing, and having the advantage of easily dissipating the driving heat of the electronic components.

[0068] On the other hand, although the present embodiment is described by taking the structure of combining with the heat sink 130 through the hole 102 in the printed circuit board 100 as an example, it is not limited thereto, and the printed circuit board 100 may realize a groove formed more recessed than other areas, so that the protrusion 133 of the heat sink 130 in the groove may be combined. In this case, the lower surface of the protrusion 133 may contact the bottom surface of the groove.

[0069] A printed circuit board module according to a second embodiment of the present invention will be described below.

[0070] Figure 6 is a perspective view of a printed circuit board module according to a second exemplary embodiment of the present invention, Figure 7 is a top view of a printed circuit board module according to a second exemplary embodiment of the present invention, Figure 8 is an exploded perspective view of a printed circuit board module according to a second exemplary embodiment of the present invention.

[0071] Except for adding a reinforcement piece 240 to the heat dissipation member, the other aspects of the second embodiment are the same as those of the first embodiment. Therefore, only the characteristic parts of this embodiment are described below, and the description of the first embodiment is used for the rest.

[0072] Reference Figures 6 to 8 The heat dissipation member 230 according to the second embodiment may be disposed on the printed circuit board 200. On the upper surface of the printed circuit board 200, a grounding region 206 may be formed in the arrangement region of the heat dissipation member 230. The grounding region 206 may be provided in plural and may be arranged opposite to each other with respect to the hole 202 in the printed circuit board 200. The grounding region 206 may have approximately At least a portion of the lower surface of the heat dissipation member 230 may be welded to the grounding region 206 .

[0073] The heat dissipation member (heat sink, 230) may include a reinforcement member 240. In addition to the first side of the heat sink 230 facing the pin hole 204, the reinforcement member 240 may be respectively arranged on the second side, the third side and the fourth side of the heat sink 230. The reinforcement member 240 may include a plurality of plates perpendicular or parallel to each other. Referring to the reinforcement member 240 arranged on the third side or the fourth side of the heat sink 230, the reinforcement member 240 may include: a first plate 242, which protrudes upward more from the upper surface of the heat sink 230 than other areas; a second plate 244, which is bent from the upper end of the first plate 242 and extends outward from the upper end of the first plate 242; a third plate 246, which is bent downward from the outer end of the second plate 244 and extends outward; and a fourth plate 248, which extends outward from the bottom of the third plate 246. The first plate 242 and the third plate 246 may be arranged parallel to each other. The second plate 244 and the fourth plate 248 may be arranged parallel to each other. The first plate 242 and the third plate 246 may be disposed perpendicularly to the second plate 244 or the fourth plate 248 , respectively.

[0074] According to the above structure, there are advantages in that the heat dissipation efficiency can be improved by increasing the surface area inside the heat dissipation member 230, and the strength inside the heat dissipation member 230 can be enhanced.

[0075] On the other hand, the second side, third side and fourth side of the reinforcement 240 may have different shapes, in which case the reinforcement 240 is arranged on the second side to form a relatively long elongated side and may include more plates than the reinforcement 240 arranged on the third side or the fourth side.

[0076] Although all parts including embodiments of the present invention have been described above as combinations or combined operations, the present invention is not necessarily limited to these embodiments, that is, all parts can be optionally combined in one or more combinations, as long as they fall within the scope of the present invention. In addition, unless otherwise specifically stated, the terms "including", "consisting of", "consisting of" or "having" used herein are intended to indicate that the parts discussed may be inherent, and therefore should be interpreted as including rather than excluding other parts. Unless otherwise defined, all terms (including technical terms or scientific terms) should have the same meanings as those generally understood by ordinary technicians in the technical field to which the present invention belongs. Unless clearly defined in the present invention, commonly used terms (such as terms defined in dictionaries) should be interpreted as being consistent with the contextual meanings in the relevant field, and should not be interpreted in an idealized or overly formalized manner.

[0077] The above description is only an exemplary description of the technical concept of the present invention, and various modifications and changes will be obvious to those of ordinary skill in the art to which the present invention belongs without departing from the basic features of the present invention. Therefore, the embodiments disclosed herein are intended to illustrate rather than limit the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the following claims, and all technical concepts within its scope should be deemed to fall within the scope of the present invention.

Claims

1. A printed circuit board module, comprising: a printed circuit board, including holes; A heat dissipation member, i.e., a heat sink, is disposed on the printed circuit board, the heat dissipation member comprising a first surface formed on an upper surface and a second surface disposed downwardly in a stepped shape relative to the first surface; as well as an electronic component disposed on the second surface, The area of ​​the lower surface of the heat dissipation member corresponding to the area where the second surface is formed is provided with a protrusion that protrudes downward more than other areas and is combined with the hole.

2. The printed circuit board module according to claim 1, wherein: At least a portion of the lower surface of the heat dissipation member is soldered to the printed circuit board.

3. The printed circuit board module according to claim 1, wherein: The electronic component includes a core disposed on the second surface and pins extending from the core, and Wherein, the printed circuit board is provided with a pin hole, and the pin is coupled to the pin hole.

4. The printed circuit board module according to claim 1, wherein: The second surface includes a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and a fourth side opposite to the third side, and wherein the pins are at least partially arranged on the first side, and The first side forms an edge of the heat dissipation component.

5. The printed circuit board module according to claim 1, wherein: The lower surface of the protrusion forms the same plane as the lower surface of the printed circuit board.

6. The printed circuit board module according to claim 1, wherein: The lower surface of the electronic component is disposed lower than the upper surface of the printed circuit board.

7. The printed circuit board module according to claim 1, further comprising a bracket, the bracket being disposed on the electronic component and combined with the printed circuit board, in, The bracket includes an upper surface portion provided on an upper surface of the electronic component, and side portions bent from both ends of the upper surface portion, extending downward, and provided to cover side surfaces of the electronic component.

8. The printed circuit board module according to claim 7, wherein: The heat dissipation member includes a first coupling hole and the side portion is coupled to the first coupling hole.

9. The printed circuit board module according to claim 8, wherein: A protrusion is formed at an inner side of the first coupling hole, and the side portion includes a second coupling hole into which the protrusion is coupled.

10. An electronic device comprising: case; a printed circuit board including a hole and disposed in the housing; A heat dissipation member, i.e., a heat sink, is disposed on the printed circuit board, the heat dissipation member comprising a first surface formed on the upper surface and a second surface disposed downwardly in a stepped shape relative to the first surface; as well as An electronic component is provided on the second surface, and the heat dissipation member has a protrusion which protrudes downward from an area corresponding to a formation area of ​​the second surface and engages with the hole.

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