HDI high-speed circuit board production technology

Abstract

The invention discloses an HDI high-speed circuit board production technology, which comprises the following production steps: S1, cutting: setting the size of a working board according to the equipment process capability and the board utilization rate, and then cutting the board into corresponding sizes; s2, inner-layer wet film: enabling the wet film resist to be irradiated by ultraviolet light, and decomposing the photoinitiator into free radicals; according to the HDI high-speed circuit board production technology, an existing HDI high-speed circuit board is utilized, local operation is carried out through an embedded material, partitioning is synchronously carried out on the same layer through a difference method, hierarchical copper thickness management and control are carried out, a non-high operation area and a power supply part are processed through a copper thickness technology, and all aspects of tests meet the requirements and are delivered to clients, so that the produced HDI high-speed circuit board has the advantages that the production efficiency is improved, and the production cost is reduced. The HDI high-speed circuit board has the effects of good heat dissipation and good signal transmission performance, and the overall strength and anti-pressure capability of the HDI high-speed circuit board can be improved by adopting a lamination process.

Description

Technical Field

[0001] The present invention relates to the technical field of high-order HDI high-speed circuit board production, and in particular to a HDI high-speed circuit board production technology. Background Art

[0002] HDI high-speed circuit board High-density interconnection high-speed circuit board is a technology for producing printed circuit boards. It uses micro-blind buried hole technology to make the line distribution density higher. HDI high-speed circuit board is a compact product designed for small-capacity users. As people's demand for information increases, it drives electronic products to develop at a high speed, especially in the field of communications; Defects: In the existing HDI laminated circuit board, the DDR storage components connected to the HDI board are prone to loosening, and the electronic version has poor resistance to pressure. After being impacted, the internal circuits and electronic components will be deformed or damaged. In order to solve the above defects, the prior art (application number 201920770972.7, Chinese patent with authorization announcement date of 2020-02-21) discloses a high-speed interconnection HDI laminated circuit board based on DDR. By connecting to the base slot, a chip slot is set inside the slot, so that the DDR storage component can be inserted into the slot and can also work. The DDR storage component in the slot can be squeezed and fixed by the rubber splint, and the DDR storage component in the slot can be more secure in the slot. In order to ensure stability, the DDR memory components will not stop working due to looseness, which reduces the subsequent maintenance work. At the same time, it also prevents the DDR memory components from having poor contact due to looseness, and the power board will not stop working; by installing the support columns on both sides of the HDI electronic board, because the support columns are higher than the electronic components in the electronic board, it can prevent external forces from touching the electronic components, so that the electronic components are damaged due to external squeezing or collision, thereby reducing the service life of the circuit board; above the first circuit board, there is a rubber block in the groove, which can prevent the sub-board from moving back and forth and prevent the collision between the two boards, which changes the previous situation where the circuit boards are stacked and combined, and each fastener needs to be operated, which is laborious and time-consuming; the groove installed on the support column, because the support column has a certain height, can make the second circuit board stuck on the top of the first circuit board, and there is a rubber block in the groove, which can prevent the sub-board from moving back and forth and prevent the collision between the two boards, which changes the previous situation where the circuit boards are stacked and combined, and each fastener needs to be operated, which is laborious and time-consuming.

[0003] At present, HDI high-speed circuit boards are laminated with PP and 1 / 3oz copper foil. After lamination, the conventional FR-4 circuit board process is used. When high-speed calculation occurs, the speed drops significantly and the thermal solution is poor, which affects the overall effect. The existing methods have the following shortcomings: (1) The material is relatively simple, which leads to poor thermal solution for calculation and affects the calculation; (2) There is no integrated merger design, and the thickness control design is adopted to distinguish the functions of different areas at the same level. Therefore, we propose an HDI high-speed circuit board production technology to solve the above problems. Summary of the invention

[0004] The purpose of the present invention is to provide a HDI high-speed circuit board production technology to solve the problem that the existing HDI high-speed circuit boards on the market are relatively single in materials, the heat caused by operation is not well solved, which affects the operation, and there is no integrated merger design, and the thickness control design is differentiated by functions of different areas at the same level.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A HDI high-speed circuit board production technology, including the following production steps: S1, cutting: setting the size of the working board according to the equipment process capability and the board utilization rate, and then cutting the board into the corresponding size; S2, inner layer wet film: subjecting the wet film resist to ultraviolet light irradiation, the photoinitiator decomposes into free radicals, and excites the monomer to produce a polymerization reaction to form a polymer compound to transfer the pattern to the copper surface, and after development and using acidic etching solution (sodium hypochlorite, hydrochloric acid, additives), the customer's required pattern is etched out; S3, CNC molding: fixing the HDI board to be processed on the workbench of the high-precision CNC equipment to ensure that the board surface is flat and firm, and convenient for query and measurement at any time, and through the automatic tool setting method of the high-precision CNC equipment, determine the relative position between the tool and the workpiece to ensure the accuracy of the processing, and then use the high-precision CNC equipment to mold the required size of the high-speed material using a CNC knife; S4, lamination: using a high-speed adhesive sheet and a buffer material (the thickness accuracy needs to reach 0.02mm), through Pin -Lam system alignment, the alignment accuracy must be controlled within 0.05mm, and the high-speed material needs to be embedded into the normal material during the sandwich lamination process; S5, drilling: set positioning marks on the circuit board, select a suitable drill bit for drilling, use laser or mechanical methods to mark the exact position of the drilling on the circuit board, and select a suitable drill bit for drilling according to the designed hole diameter and hole depth. During the drilling process, the drill speed, feed speed and cutting depth need to be controlled to ensure the drilling accuracy and surface quality. For small holes For drilling, laser drilling technology can be used to achieve precise drilling using the high energy density of the laser beam. After drilling, the hole wall needs to be processed to remove defects such as burrs and resin smears. At the same time, the hole wall needs to be metallized to form a conductive layer. The purpose of this process is to drill through holes on the board surface, and then chemically plate copper to achieve electrical conductivity of the upper and lower layers of copper; S6, laser drilling: using laser focusing reaction, using carbon dioxide and other gases to directly process blind holes on the copper surface; S7, horizontal copper deposition: copper deposition is plated with a layer of 0.3-0.6um thin copper is used to achieve electrical conductivity between the upper and lower layers of the board; S8, UVCP hole filling: the copper in the laser blind hole and the copper on the surface are thickened, and the hole filling depression is controlled within 5um; S9, DVCP copper plating: the copper in the through hole and the copper on the surface are thickened by electroplating to meet the customer's requirements to ensure the electrical performance requirements of the end customer; S10, graphic production: according to the domain copper thickness design, the position where the thin copper thickness is required is covered with dry film, and the area that needs special thickening is reserved; S11, local thickening treatment: according to the data, the power supply part or high current area The copper thickness is added to a certain copper thickness; S12, graphic production: according to the domain copper thickness design, the location where thick copper is required is covered with dry film, and the thin copper area is reserved; S13, local copper reduction treatment: the thin copper area is located, using the acidic etching solution (sodium hypochlorite, hydrochloric acid, additives) of the vacuum etcher to etch out all the high-speed signal areas and control the copper thickness between 35-45um; S14, graphic laser imaging processing: using the principle of laser imaging, the graphics are processed according to the customer's data at the uneven surface. The design here is very critical, and the thin copper position needs It is necessary to make synchronous adjustments according to the design of the thick copper position and design compensation in different areas; S15, vacuum etching: use sodium hypochlorite, hydrochloric acid, and oxidant etching solution, and use vacuum to absorb excess residual solution to prevent the pool effect, and etch out all the graphics required by the customer to form high-precision graphics; S16, solder mask: according to the customer's information, a layer of solder mask ink is printed on the surface to protect the high-precision circuit from being corroded by the environment such as the solution, thereby affecting the accuracy, and simultaneously prevent the risk of customer welding short circuit; S17, characters: some of the customer's logo letters, graphics and company Logo is printed on it for easy identification; S18, gold plating: surface treatment is performed according to customer requirements, such as chemical silver plating, chemical gold plating, organic solderability film and other processes. The thickness of the surface treatment must meet customer requirements; S19, molding: using a gong machine and a gong knife to gong out the size required by the customer; S20, testing: open and short circuit tests are performed on the working board; S21, FQC: products are inspected according to customer standards, and boards that meet the requirements are put into the warehouse; S22, packaging: packaging is performed according to the packaging method required by the customer, and high-speed boards are packaged in aluminum foil vacuum packaging. .

[0006] Preferably, selecting a substrate with high strength and good mechanical properties, such as high-performance epoxy resin, ceramic, etc., in S1 can effectively improve the compressive performance of the circuit board. At the same time, adding reinforcing materials, such as glass fiber, carbon fiber, etc., to the substrate can further enhance the strength and stability of the circuit board.

[0007] Preferably, the forming accuracy in S3 is controlled within 0.05 mm, the normal material is formed by CNN depth control, and the depth control accuracy needs to reach 0.03 mm, the bonding material is formed by CNC, and the forming accuracy is controlled within 0.05 mm.

[0008] Preferably, in S4, the substrates manufactured through the inner layer are stacked together to ensure the alignment and position accuracy between the layers, and a hot press is used to combine the different layers together under high temperature and high pressure. After the stacking is completed, a high-precision temperature average performance is less than 1.5°C customized equipment and a special pressing process for high-speed materials are used. Through the physical and chemical properties of the material and the principle of high temperature and high pressure, the resin is fully filled and cured after high pressure and high temperature to form an embedded mixed high-speed material. The circuit board is then cooled to solidify and achieve the required physical and electrical properties.

[0009] Preferably, the flatness of the laminating equipment in S4 is less than 0.1 mm (all layers), and the temperature difference of all hot plates is controlled at + / -1.5°C at 200°C, and 250°C resistant composite paper is used as the buffer material.

[0010] Preferably, the blind hole in S6 has a diameter of 0.1 mm, and the thickness of the dielectric layer is controlled to be 60-100 um.

[0011] Preferably, the S8 adopts horizontal copper deposition technology, the copper thickness is controlled at 0.3-0.6um, and the UVCP automatic electroplating equipment copper powder + mesh technology is adopted to control the uniformity of copper thickness within the extreme difference of 5um, and adopts 3-component light agent and immersion jet design to perform pre-plating, slow plating, burst plating and steady plating to achieve flatness effect to ensure the electrical performance requirements of end customers.

[0012] Preferably, the compensation in S14 is controlled between 0.03-0.09 mm, with less compensation (0.03-0.04 mm) at the thick copper position and more compensation (0.08-0.09 mm) at the thin copper position, and different compensations are applied at different positions.

[0013] Preferably, the LDI exposure process is adopted in S14, and no film is used to transfer the image throughout the process. Instead, laser imaging technology is adopted, and the accuracy is controlled within 5um. The position accuracy is controlled by an automatic expansion and contraction measurement system, and the automatic position accuracy is controlled within 25um.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the HDI high-speed circuit board production technology adopts a new structural design, and its specific contents are as follows: (1) utilizing the existing HDI high-speed circuit board, local operations are performed by embedding materials, and the difference method is used to perform partitioning on the same layer, hierarchical copper thickness control, non-high-computing areas, and the power supply part are processed by copper thickness technology, and then tested in various aspects to meet the requirements and delivered to customers, so that the produced HDI high-speed circuit board has good heat dissipation and excellent signal transmission performance, and the lamination process is adopted to improve the overall strength and compressive resistance of the HDI high-speed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The figure is a schematic diagram of the production process of the HDI high-speed circuit board of the present invention. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figure 1The present invention provides a technical solution: a HDI high-speed circuit board production technology, including the following production steps: S1, cutting: the size of the working board is set according to the equipment process capability and the board utilization rate, and then the board is cut into the corresponding size, and the substrate with high strength and good mechanical properties is selected in S1, such as high-performance epoxy resin, ceramic, etc., which can effectively improve the compressive performance of the circuit board, and reinforcing materials such as glass fiber, carbon fiber, etc. are added to the substrate to further enhance the strength and stability of the circuit board; S2, inner wet film: the wet film resist is exposed to ultraviolet light, the photoinitiator is decomposed into free radicals, and the monomer is stimulated to produce a polymerization reaction to form a polymer compound to transfer the pattern to the copper surface, and after development and using acidic etching solution (sodium hypochlorite, hydrochloric acid, additives), the pattern required by the customer is etched out; S3, CNC molding: the HDI board to be processed is fixed on the workbench of the high-precision CNC equipment to ensure that the board surface is flat and firm, and convenient for query and measurement at any time, and the relative position between the tool and the workpiece is determined by the automatic tool setting method of the high-precision CNC equipment to ensure that the processing The accuracy of the work is ensured, and then the required size of the high-speed material is formed by CNC cutter through high-precision CNC equipment; S4, lamination: high-speed adhesive sheet and buffer material (thickness accuracy needs to reach 0.02mm), through the Pin-Lam system alignment, the alignment accuracy must be controlled within 0.05mm, through sandwich lamination, during the lamination process, the high-speed material needs to be embedded in the normal material, and the substrates manufactured through the inner layer are stacked together in S4 to ensure the alignment and position accuracy between the layers, and a hot press is used under high temperature and high pressure After the different layers are combined together, and after the lamination is completed, a high-precision temperature average performance is less than 1.5℃ customized equipment is used, and a special pressing process for high-speed materials is used. Through the physical and chemical properties of the materials, the principle of high temperature and high pressure is used to make the resin fully filled and solidified after high pressure and high temperature to form an embedded mixed high-speed material. After that, the circuit board is cooled to solidify and achieve the required physical and electrical properties. The flatness of the laminating equipment in S4 is less than 0.1mm (all layers), and all hot plates are at 200℃, and the temperature difference must be controlled within + / -1.5℃, and use 250℃ resistant composite paper as buffer material; S5, drilling: set positioning marks on the circuit board, select a suitable drill bit for drilling, use laser or mechanical methods to mark the exact location of the drilling on the circuit board, and select a suitable drill bit for drilling according to the designed hole diameter and hole depth. During the drilling process, it is necessary to control the drill bit speed, feed speed and cutting depth to ensure the accuracy and surface quality of the drilling. For drilling holes with small apertures, laser drilling technology can be used to achieve precise drilling using the high energy density of the laser beam. After drilling, the hole wall needs to be processed to remove burrs, resin smears and other defects. At the same time, the hole wall needs to be metallized to form a conductive layer. The purpose of this process is Through holes are drilled on the board surface, and then chemical copper is plated in the later process to achieve electrical conductivity between the upper and lower layers of copper; S6, laser drilling: using laser focusing reaction, using carbon dioxide and other gases to directly process blind holes on the copper surface, and the blind hole diameter in S6 is 0.1mm, and the thickness of the dielectric layer is controlled at 60-100um; S7, horizontal copper plating: copper plating is to plate a layer of 0.3-0.6um thin copper in the drilled hole to achieve electrical conductivity between the upper and lower layers of the board; S8, UVCP hole filling: the copper in the laser blind hole and the copper on the surface are thickened, and the hole filling depression is controlled within 5um. S8 adopts horizontal copper plating technology, the copper thickness is controlled at 0.3-0.6um, and UVCP automatic electroplating equipment copper powder + mesh technology is used to make the copper The thickness uniformity is controlled within the extreme difference of 5um, and a three-component light agent and immersion jet design are used to perform pre-plating, slow plating, burst plating, and steady plating to achieve the flatness effect to ensure the electrical performance requirements of the end customers; S9, DVCP copper plating: electroplating thickens the copper in the through hole and the copper on the surface to meet the customer's requirements to ensure the electrical performance requirements of the end customers; S10, graphic production: according to the domain copper thickness design, the position where the thin copper thickness is required is covered with dry film, and the area that needs special thickening is reserved; S11, local thickening treatment: according to the data, the copper thickness of the power supply part or the high current area is increased to a certain copper thickness; S12, graphic production: according to the domain copper thickness design, the position where the thick copper is required Use dry film to cover and reserve the thin copper area; S13, local copper reduction treatment: use the acidic etching solution (sodium hypochlorite, hydrochloric acid, additives) of the vacuum etcher to etch out all the high-speed signal areas in the thin copper area, and the copper thickness is controlled between 35-45um; S14, graphic laser imaging processing: use the laser imaging principle to process the graphics according to the customer's data at the uneven surface. The design here is very critical, and the thin copper position needs to be adjusted synchronously according to the design of the thick copper position, and the compensation design is divided into regions. In S14, the compensation is controlled between 0.03-0.09mm, the thick copper position has less compensation (0.03-0.04mm), and the thin copper position has more compensation (0.08-0.09mm), different positions have different compensations, the LDI exposure process is adopted in the S14, and the film transfer image is not used in the whole process. The laser imaging technology is adopted, and the accuracy is controlled within 5um, and the position accuracy control adopts the automatic expansion and contraction measurement system, and the automatic position accuracy is controlled within 25um; S15, vacuum etching: using sodium hypochlorite, hydrochloric acid, and oxidant etching solution, and vacuuming away the excess residual solution to prevent the pool effect, and all the graphics required by the customer are bitten out to form high-precision graphics; S16, solder mask: according to the customer's information, a layer of solder mask ink is printed on the surface to protect the high-precision circuit from being corroded by the environment such as the solution, thereby affecting the accuracy, and at the same time Step 1: Prevent the risk of short circuit in welding by customers; S17, Characters: Print some of the customer's identification letters, graphics and company logos for easy identification; S18, Gold plating: Surface treatment is performed according to customer requirements, such as chemical silver plating, chemical gold plating, organic solder-preservative film and other processes. The thickness of the surface treatment must meet customer requirements; S19, Forming: Use a gong machine and a gong knife to gong out the size required by the customer; S20, Testing: Perform an open and short circuit test on the working board; S21, FQC: Inspect the product according to customer standards, and put the boards that meet the requirements into the warehouse; S22, Packaging: Pack according to the packaging method required by the customer, and high-speed boards are packed in aluminum foil vacuum packaging. .

[0018] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A HDI high-speed circuit board production technology, characterized in that: The production steps include: S1. Cutting: Set the size of the work plate according to the equipment process capability and plate utilization rate, and then cut the plate into the corresponding size; S2, inner wet film: expose the wet film resist to ultraviolet light, the photoinitiator decomposes into free radicals, stimulates the monomer to produce a polymerization reaction to form a high molecular compound to transfer the pattern to the copper surface, and then after development and using acidic etching solution (sodium hypochlorite, hydrochloric acid, additives), the pattern required by the customer is etched out; S3, CNC molding: Fix the HDI board to be processed on the workbench of high-precision CNC equipment to ensure that the board surface is flat and firm, and convenient for query and measurement at any time. The automatic tool setting method of high-precision CNC equipment is used to determine the relative position between the tool and the workpiece to ensure the accuracy of processing. Then, the high-precision CNC equipment is used to mold the required size of the high-speed material using CNC cutters; S4, Lamination: Use high-speed adhesive sheets and buffer materials (thickness accuracy needs to reach 0.02mm), align through the Pin-Lam system, the alignment accuracy must be controlled within 0.05mm, and laminate in a sandwich manner. During the lamination process, the high-speed material needs to be embedded in the normal material; S5. Drilling: Set positioning marks on the circuit board, select a suitable drill bit for drilling, use laser or mechanical methods to mark the exact location of the drilling on the circuit board, and select a suitable drill bit for drilling according to the designed hole diameter and hole depth. During the drilling process, the drill speed, feed speed and cutting depth need to be controlled to ensure the accuracy and surface quality of the drilling. For drilling holes with small apertures, laser drilling technology can be used to achieve precise drilling using the high energy density of the laser beam. After drilling, the hole wall needs to be processed to remove defects such as burrs and resin smears. At the same time, the hole wall needs to be metallized to form a conductive layer. The purpose of this process is to drill through holes on the board surface, and then chemical copper plating is performed to achieve electrical conductivity between the upper and lower copper layers. S6, Laser drilling: Using laser focusing reaction, using carbon dioxide and other gases to directly process blind holes on the copper surface; S7, Horizontal copper plating: Copper plating is to plate a layer of 0.3-0.6um thin copper in the drilled hole to achieve electrical conductivity between the upper and lower layers of the board; S8, UVCP hole filling: thicken the copper inside the laser blind hole and the copper on the surface, and control the hole filling depression within 5um; S9, DVCP copper plating: electroplating thickens the copper in the through hole and the copper on the surface to meet customer requirements to ensure the electrical performance requirements of the end customer; S10, Graphics production: According to the domain copper thickness design, the location where thin copper thickness is required is covered with dry film, and the area that needs special thickening is reserved; S11. Local thickening treatment: according to the data, the copper thickness of the power supply part or high current area is increased to a certain thickness; S12, Graphics production: According to the domain copper thickness design, the location where thick copper is required is covered with dry film, and the thin copper area is reserved; S13, local copper reduction treatment: the thin copper area is etched out completely in the high-speed signal area using the acidic etching solution (sodium hypochlorite, hydrochloric acid, additives) of the vacuum etcher, and the copper thickness is controlled between 35-45um; S14, Graphic laser imaging processing: Using the principle of laser imaging, the graphics are processed according to the customer's information at the uneven surface. The design here is very critical, and the thin copper position needs to be adjusted synchronously according to the design of the thick copper position, and the compensation design is divided into different areas; S15, Vacuum etching: Use sodium hypochlorite, hydrochloric acid, and oxidant etching solution, and use vacuum to suck away excess residual solution to prevent the pool effect, and etch out all the graphics required by the customer to form high-precision graphics; S16, Solder mask: According to the customer's information, a layer of solder mask ink is printed on the surface to protect the high-precision circuit from being corroded by chemicals and other environmental factors, thereby affecting the accuracy, and simultaneously prevent the risk of short circuit in customer welding; S17, Characters: Print some of the customer's identification letters, graphics and company logos for easy identification; S18, chemical gold plating: surface treatment according to customer requirements, such as chemical silver plating, chemical gold plating, organic solderability film and other processes. The thickness of the surface treatment must meet customer requirements; S19, Forming: Use gong machine and gong cutter to gong out the size required by customers; S20, test: perform open and short circuit test on the working board; S21, FQC: Check the products according to customer standards, and put the boards that meet the requirements into the warehouse; S22. Packaging: Packaging is carried out according to the packaging method required by the customer. High-speed plates are packaged in aluminum foil vacuum packaging.

2. The HDI high-speed circuit board production technology according to claim 1, characterized in that: In S1, a substrate with high strength and good mechanical properties, such as high-performance epoxy resin, ceramic, etc., is selected to effectively improve the compressive performance of the circuit board. At the same time, reinforcing materials, such as glass fiber, carbon fiber, etc., are added to the substrate to further enhance the strength and stability of the circuit board.

3. The HDI high-speed circuit board production technology according to claim 1, characterized in that: The forming accuracy of S3 is controlled within 0.05mm. Normal materials are formed by CNN depth control, and the depth control accuracy needs to reach 0.03mm. Adhesive materials are formed by CNC, and the forming accuracy is controlled within 0.05mm.

4. The HDI high-speed circuit board production technology according to claim 1, characterized in that: In the S4, the substrates manufactured through the inner layer are stacked together to ensure the alignment and position accuracy between the layers, and a hot press is used to combine the different layers together under high temperature and high pressure. After the stacking is completed, a high-precision temperature average performance is less than 1.5°C customized equipment is used, and a special pressing process for high-speed materials is used. Through the physical and chemical properties of the material and the principle of high temperature and high pressure, the resin is fully filled and cured after high pressure and high temperature to form an embedded mixed high-speed material. The circuit board is then cooled to solidify and achieve the required physical and electrical properties.

5. The HDI high-speed circuit board production technology according to claim 1, characterized in that: The flatness of the laminating equipment in S4 is less than 0.1mm (all layers), and the temperature difference of all hot plates should be controlled at + / -1.5°C at 200°C, and 250°C resistant composite paper is used as the buffer material.

6. The HDI high-speed circuit board production technology according to claim 1, characterized in that: The blind hole diameter in S6 is 0.1 mm, and the thickness of the dielectric layer is controlled to be 60-100 um.

7. The HDI high-speed circuit board production technology according to claim 1, characterized in that: The S8 adopts horizontal copper deposition technology, and the copper thickness is controlled at 0.3-0.6um. The UVCP automatic electroplating equipment copper powder + mesh technology is used to control the uniformity of copper thickness within the extreme difference of 5um. In addition, a three-component light agent and an immersion jet design are used to perform pre-plating, slow plating, burst plating, and steady plating to achieve a flatness effect to ensure the electrical performance requirements of end customers.

8. The HDI high-speed circuit board production technology according to claim 1, characterized in that: The compensation in S14 is controlled between 0.03-0.09 mm, with less compensation (0.03-0.04 mm) at thick copper locations and more compensation (0.08-0.09 mm) at thin copper locations. Different locations have different compensations.

9. The HDI high-speed circuit board production technology according to claim 1, characterized in that: The S14 adopts the LDI exposure process, and does not use film to transfer the image throughout the process. Instead, it adopts laser imaging technology, and the accuracy is controlled within 5um. The position accuracy control adopts an automatic expansion and contraction measurement system, and the automatic position accuracy is controlled within 25um.

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