Circuit board etching device and etching method thereof

Abstract

The invention discloses a circuit board etching device and an etching method thereof, and relates to the technical field of circuit board etching, the circuit board etching device comprises a bottom base, the upper end of the bottom base is fixedly provided with a top shell, and the bottom base and the top shell are internally provided with a chain conveying structure; etching liquid spraying assemblies are symmetrically arranged in the top shell and located on the left side and the right side of the chain conveying structure, a pre-cleaning assembly is fixedly installed at the position, located at the front end of the top shell, of the front end of the bottom base at the same time, and the pre-cleaning assembly and spraying cleaning nozzles are arranged on the front sides of the etching liquid spraying assemblies, so that cleaning and etching of a circuit board can be integrated; therefore, the problem that dust and sundries are attached to the circuit board again when the circuit board cleaning step and the circuit board etching step are separated and the cleaned circuit board is transferred into the etching equipment can be avoided, on one hand, the etching yield of the circuit board can be guaranteed, on the other hand, the circuit board production step can be simplified, and the circuit board production efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board etching, and in particular to a circuit board etching device and an etching method thereof. Background Art

[0002] Circuit board etching is an important processing technology for manufacturing printed circuit boards (PCBs). The principle is to cover the copper layer on the substrate, and then make an etching pattern through the etching process, leaving only the circuit path that needs to be connected, while the rest is etched away. This process mainly uses chemical liquid to corrode the surface of the copper plate to achieve a clear etching effect. When etching the circuit board, it is necessary to ensure that the surface of the circuit board is clean and tidy, mainly because any dirt, dust or residue may affect the chemical balance of the etching solution, resulting in poor etching effect. These contaminants may act as insulators, hindering the full contact between the etching solution and the copper foil, thereby affecting the uniformity and accuracy of the etching. In addition, contaminants may also trigger chemical reactions and produce slag, further affecting the etching quality and the performance of the circuit board. Therefore, before etching, the surface of the circuit board must be thoroughly cleaned to ensure the smooth progress of the etching process and the reliability of the final product. In the traditional circuit board etching process, cleaning and etching are usually carried out separately. Before etching, there is a special cleaning step to remove impurities, oxide layers and possible dirt on the surface of the circuit board. After the circuit board is cleaned, it is transferred to the etching equipment for etching. During this process, dust and debris are easily attached to the circuit board again, which can easily affect the normal etching of the circuit board, thereby reducing the performance of the circuit board, and further resulting in a low yield rate of the produced circuit boards, which will ultimately increase production costs. Therefore, a circuit board etching device is needed to solve the above problems. Summary of the invention

[0003] The main purpose of the present invention is to provide a circuit board etching device and an etching method thereof, which can effectively solve the problems in the background technology.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] A circuit board etching device comprises a bottom base, a top shell is fixedly installed on the upper end of the bottom base, a chain conveying structure is installed in the bottom base and the top shell, an etching liquid spraying assembly is symmetrically arranged in the top shell and on the left and right sides of the chain conveying structure, the front end of the bottom base is also located at the front end of the top shell and a pre-cleaning assembly is fixedly installed, the pre-cleaning assembly consists of a protective shell, a mounting plate, a U-shaped mounting frame, a mounting square rod, a movable pressure plate, a pushing spring, a movable substrate and cleaning bristles, the mounting plate has two and is symmetrically fixed on the inner walls on the left and right sides of the mounting plate, the U-shaped mounting frame has two and is respectively fixedly installed on one end of the two mounting plates, the mounting square rod has two and is respectively slidably installed on the two U-shaped mounting frames, the movable pressure plate has two and is respectively fixedly installed on the two mounting squares The outer end of the rod, the push springs are two and are respectively sleeved on the two mounting square rods, the movable base plate has two and are respectively fixedly mounted on the inner ends of the two mounting square rods, the cleaning bristles are fixedly mounted on the inner ends of the two movable base plates, and two spray cleaning nozzles are symmetrically installed in the top shell and on the left and right sides of the chain conveying structure, and the spray cleaning nozzles are also located on the front side of the etching liquid spray assembly, and a hot air drying assembly is installed on the bottom base, and the hot air drying assembly consists of a fan, a first connecting pipe, an air heating assembly, a second connecting pipe and a blowing pipe, the first connecting pipe connects the fan to the air heating assembly, the second connecting pipe connects the air heating assembly to the blowing pipe, there are several blowing pipes and they are symmetrically arranged on the left and right sides of the chain conveying structure, and the blowing pipe is located on the front and back sides of the etching liquid spray assembly.

[0006] Preferably, the bottom base is composed of a bottom frame and a second door panel, there are a plurality of second door panels and they are all fixedly mounted on the bottom frame, a liquid collecting tank is mounted in the bottom frame, and a motor is mounted in the bottom frame.

[0007] Preferably, the top shell is composed of a top frame and a first door panel, there are a plurality of first door panels and they are all fixedly mounted on the top frame, and the top frame is fixedly connected to the bottom frame.

[0008] Preferably, the chain conveying structure consists of a conveying chain and a clamping and fixing component, and there are several clamping and fixing components, which are symmetrically fixed on the conveying chain in pairs. The conveying chain is rotatably installed in the bottom base. At the same time, the conveying chain is located above the liquid collection tank, and the conveying chain is connected to the output shaft of the motor installed in the bottom frame.

[0009] Preferably, the etching liquid spray assembly is fixedly mounted on the liquid collecting tank.

[0010] Preferably, the protective shell on the pre-cleaning assembly is fixedly connected to the bottom base and the top shell, and the protective shell is also sleeved on the outside of the chain conveying structure.

[0011] Preferably, a mounting square hole is opened on one side wall of the U-shaped mounting frame on the pre-cleaning component, and the mounting square hole passes through the inside and outside of one side wall of the U-shaped mounting frame, and the mounting square rod is slidably installed in the mounting square hole, and the movable pressure plate and the push spring are both located in the U-shaped mounting frame, and the movable substrate and the cleaning bristles are both located on the inner side of the U-shaped mounting frame, and the two movable substrates are respectively located on the left and right sides of the chain conveying structure.

[0012] Preferably, the spray cleaning nozzle is fixedly installed on the liquid collecting tank, and the spray cleaning nozzle can be connected to the water supply equipment through a pipeline.

[0013] Preferably, the fan, the first connecting pipe, the air heating component and the second connecting pipe on the hot air drying component are all located below the liquid collecting tank, and the fan and the air heating component are fixedly connected to the bottom base, the blowing pipe passes upward through the liquid collecting tank, and the blowing pipe is fixedly connected to the liquid collecting tank, a hot air outlet is opened on the blowing pipe, and an outlet protection net is fixedly installed in the hot air outlet.

[0014] An etching method for a circuit board etching device comprises the following steps:

[0015] S1: First, the motor in the bottom base is started to drive the chain conveying structure to rotate in the bottom base, and then the circuit board to be etched can be fixed between two symmetrically arranged clamping and fixing components on the chain conveying structure, and the circuit board must be placed in front of the pre-cleaning component;

[0016] S2: Then the rotating chain conveying structure moves the circuit board to the pre-cleaning assembly. When the circuit board passes through the pre-cleaning assembly, the cleaning bristles contact and rub against the circuit board under the elastic force of the push spring, so that the cleaning bristles remove the debris on the circuit board;

[0017] S3: Then, the circuit board cleaned by the pre-cleaning component will enter the top shell, and the water supply device connected to the spray cleaning nozzle can be started. At this time, the water supply device will transport the cleaning water to the spray cleaning nozzle, and then the spray cleaning nozzle will spray water onto the circuit board, thereby further cleaning the circuit board, and the water that has cleaned the circuit board will fall into the liquid collection tank;

[0018] S4: The cleaned circuit board is then moved between the plurality of blowing ducts. At this time, the fan and the air heating assembly on the hot air drying assembly can be started, so that the fan sends air into the air heating assembly through the first connecting duct, and the air heated by the air heating assembly enters the blowing duct through the second connecting duct. Finally, the hot air is blown out through the hot air outlet, and blown onto the circuit board, thereby drying the circuit board.

[0019] S5: As the chain conveying structure works, the dried circuit board moves between multiple etching liquid spraying assemblies, and the etching liquid spraying assemblies spray the etching liquid onto the circuit board, thereby etching the circuit board, and the excess etching liquid falls into the liquid collecting tank;

[0020] S6: The etched circuit board will finally pass through a plurality of blowing ducts, so that the hot air blown out of the blowing ducts will dry the etched circuit board, and then the chain conveying structure will send the circuit board out of the top shell, and then the circuit board can be removed from the clamping and fixing assembly on the chain conveying structure.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] (1) By arranging a pre-cleaning assembly and a spray cleaning nozzle on the front side of the etching liquid spray assembly, the cleaning and etching of the circuit board can be integrated, thereby avoiding the problem of dust and debris re-attaching to the circuit board when the cleaned circuit board is transferred to the etching equipment when the cleaning and etching steps of the circuit board are separated. On the one hand, the etching yield of the circuit board can be guaranteed, and on the other hand, the steps of circuit board production can be simplified, thereby improving the efficiency of circuit board production;

[0023] (2) By setting up a pre-cleaning component, the circuit board can be cleaned in advance, so that the dust and impurities that are relatively tightly attached are loosened and fall off, which is beneficial to the cleaning of the circuit board and makes the cleaning effect of the circuit board better;

[0024] (3) By providing a spray cleaning nozzle, dust and impurities that are not removed by the pre-cleaning component can be cleaned, thereby comprehensively cleaning the circuit board, thereby achieving a better cleaning effect of the circuit board;

[0025] (4) By setting up a hot air drying component, on the one hand, the hot air drying component can quickly dry the circuit board after being cleaned by the spray cleaning nozzle, and on the other hand, it can also dry the circuit board that has been sprayed with etching liquid by the etching liquid spray component and etched, thereby speeding up the production efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 A schematic structural diagram of a pre-cleaning component of the present invention from one perspective;

[0028] Figure 3 A schematic structural diagram of the pre-cleaning component of the present invention from another perspective;

[0029] Figure 4 It is a schematic diagram of the structure of the mounting fixing plate, the U-shaped mounting frame, the mounting square rod, the movable pressing plate, the pushing spring, the movable base plate and the cleaning bristles of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of the present invention after partially removing the first door panel and the second door panel;

[0031] Figure 6 For the present invention Figure 5 A magnified view of point A;

[0032] Figure 7 For the present invention Figure 5 The enlarged view of point B;

[0033] Figure 8 For the present invention Figure 5 Enlarged view of point C.

[0034] In the figure: 1. bottom base; 2. top shell; 3. chain conveying structure; 4. etching liquid spray assembly; 5. pre-cleaning assembly; 6. spray cleaning nozzle; 7. hot air drying assembly; 8. liquid collecting tank; 9. top frame; 10. first door panel; 11. conveying chain; 12. clamping and fixing assembly; 13. protective shell; 14. mounting plate; 15. U-shaped mounting frame; 16. mounting square hole; 17. mounting square rod; 18. moving pressure plate; 19. pushing spring; 20. moving substrate; 21. cleaning bristles; 22. fan; 23. first connecting pipe; 24. air heating assembly; 25. second connecting pipe; 26. blowing pipe; 27. hot air outlet; 28. outlet protection net; 29. ​​bottom frame; 30. second door panel. DETAILED DESCRIPTION

[0035] In order to make the technical means, creative features, objectives and effects of the invention easy to understand, the invention is further explained below in conjunction with specific implementation methods.

[0036] In the description of the invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0037] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0038] Embodiment 1:

[0039] like Figure 1-8As shown, the present invention relates to a circuit board etching device, comprising a bottom base 1, a top shell 2 is fixedly installed on the upper end of the bottom base 1, a chain conveying structure 3 is installed in the bottom base 1 and the top shell 2, an etching liquid spraying assembly 4 is symmetrically arranged in the top shell 2 and on the left and right sides of the chain conveying structure 3, and a pre-cleaning assembly 5 is fixedly installed at the front end of the bottom base 1 at the front end of the top shell 2. The pre-cleaning assembly 5 consists of a protective shell 13, a mounting fixing plate 14, a U-shaped mounting frame 15, a mounting square rod 17, a movable pressing plate 18, a pushing spring 19, a movable substrate 20 and a cleaning The cleaning bristles 21 are composed of two mounting plates 14 and are symmetrically fixed on the inner walls of the left and right sides of the mounting plates 14, two U-shaped mounting frames 15 are respectively fixed on one end of the two mounting plates 14, two mounting square rods 17 are respectively slidably mounted on the two U-shaped mounting frames 15, two movable pressure plates 18 are respectively fixed on the outer ends of the two mounting square rods 17, two push springs 19 are respectively sleeved on the two mounting square rods 17, two movable base plates 20 are respectively fixed on the inner ends of the two mounting square rods 17, and the cleaning bristles 21 are fixedly mounted on At the inner ends of the two movable substrates 20, two spray cleaning nozzles 6 are symmetrically installed in the top shell 2 and on the left and right sides of the chain conveying structure 3. The spray cleaning nozzles 6 are also located in front of the etching liquid spray assembly 4. A hot air drying assembly 7 is installed on the bottom base 1. The hot air drying assembly 7 consists of a fan 22, a first connecting pipe 23, an air heating assembly 24, a second connecting pipe 25 and a blowing pipe 26. The first connecting pipe 23 connects the fan 22 with the air heating assembly 24, the second connecting pipe 25 connects the air heating assembly 24 with the blowing pipe 26, and the blowing pipe 2 6 are symmetrically arranged on the left and right sides of the chain conveying structure 3, and the blowing duct 26 is located on the front and rear sides of the etching liquid spray assembly 4. By arranging the pre-cleaning assembly 5 and the spray cleaning nozzle 6 on the front side of the etching liquid spray assembly 4, the cleaning and etching of the circuit board can be integrated, so as to avoid the problem of dust and debris re-attaching to the circuit board when the cleaning and etching steps of the circuit board are separated and the circuit board is transferred to the etching equipment. On the one hand, the etching yield of the circuit board can be guaranteed, and on the other hand, the steps of circuit board production can be simplified and the efficiency of circuit board production can be improved.

[0040] Specifically, the bottom base 1 is composed of a bottom frame 29 and a second door panel 30, there are several second door panels 30 and they are all fixedly installed on the bottom frame 29, a liquid collecting tank 8 is installed in the bottom frame 29, a motor is installed in the bottom frame 29, the top shell 2 is composed of a top frame 9 and a first door panel 10, there are several first door panels 10 and they are all fixedly installed on the top frame 9, the top frame 9 is fixedly connected to the bottom frame 29, the chain conveying structure 3 is composed of a conveying chain 11 and a clamping and fixing assembly 12, there are several clamping and fixing assemblies 12 and they are symmetrically fixedly installed on the conveying chain 11 in pairs, the conveying chain 11 is rotatably installed in the bottom base 1, and at the same time, the conveying chain 11 is located above the liquid collecting tank 8, and the conveying chain 11 is connected to the output shaft of the motor installed in the bottom frame 29, and the etching liquid spray assembly 4 is fixedly installed on the liquid collecting tank 8.

[0041] Furthermore, the protective shell 13 on the pre-cleaning component 5 is fixedly connected to the bottom base 1 and the top shell 2, and the protective shell 13 is also sleeved on the outside of the chain conveying structure 3. A mounting square hole 16 is opened on one side wall of the U-shaped mounting frame 15 on the pre-cleaning component 5, and the mounting square hole 16 penetrates the inside and outside of one side wall of the U-shaped mounting frame 15. The mounting square rod 17 is slidably installed in the mounting square hole 16, and the movable pressure plate 18 and the pushing spring 19 are both located in the U-shaped mounting frame 15. The movable substrate 20 and the cleaning brush bristles 21 are both located on the inner side of the U-shaped mounting frame 15. The two movable substrates 20 are respectively located on the left and right sides of the chain conveying structure 3. By setting the pre-cleaning component 5, the circuit board can be cleaned in advance, so that the dust and impurities that are relatively tightly attached are loosened and fall off, which is beneficial to the cleaning of the circuit board, so that the cleaning effect of the circuit board is better.

[0042] The spray cleaning nozzle 6 is fixedly installed on the liquid collecting tank 8. The spray cleaning nozzle 6 can be connected to the water supply equipment through a pipeline. By setting the spray cleaning nozzle 6, the dust and impurities not removed by the pre-cleaning component 5 can be cleaned, thereby comprehensively cleaning the circuit board, and thus the cleaning effect of the circuit board can be better.

[0043] The fan 22, the first connecting pipe 23, the air heating component 24 and the second connecting pipe 25 on the hot air drying component 7 are all located below the liquid collecting tank 8, and the fan 22 and the air heating component 24 are fixedly connected to the bottom base 1, the blowing pipe 26 passes through the liquid collecting tank 8 upward, and the blowing pipe 26 is fixedly connected to the liquid collecting tank 8, and a hot air outlet 27 is opened on the blowing pipe 26, and an outlet protection net 28 is fixedly installed in the hot air outlet 27. By setting the hot air drying component 7, on the one hand, the hot air drying component 7 can quickly dry the circuit board cleaned by the spray cleaning nozzle 6, and on the other hand, it can also dry the circuit board that has been sprayed with etching liquid by the etching liquid spray component 4 and etched, thereby speeding up the production efficiency of the circuit board.

[0044] Embodiment 2:

[0045] On the basis of Example 1, an etching method of a circuit board etching device comprises the following steps:

[0046] S1: First, start the motor in the bottom base 1 to drive the chain conveying structure 3 to rotate in the bottom base 1, and then fix the circuit board to be etched between two symmetrically arranged clamping and fixing components 12 on the chain conveying structure 3, and at the same time, make the circuit board be in front of the pre-cleaning component 5;

[0047] S2: Then the rotating chain conveying structure 3 moves the circuit board to the pre-cleaning assembly 5. When the circuit board passes through the pre-cleaning assembly 5, the cleaning bristles 21 contact and rub against the circuit board under the elastic force of the push spring 19, so that the cleaning bristles 21 remove the auxiliary debris on the circuit board;

[0048] S3: Then, the circuit board cleaned by the pre-cleaning component 5 will enter the top shell 2, and the water supply device connected to the spray cleaning nozzle 6 can be started. At this time, the water supply device will transport the cleaning water to the spray cleaning nozzle 6, and then the spray cleaning nozzle 6 will spray water onto the circuit board, thereby further cleaning the circuit board, and the water that has cleaned the circuit board will fall into the liquid collection tank 8;

[0049] S4: The cleaned circuit board is then moved between the multiple blowing ducts 26. At this time, the fan 22 and the air heating assembly 24 on the hot air drying assembly 7 can be started, so that the fan 22 sends air into the air heating assembly 24 through the first connecting duct 23, and the air heated by the air heating assembly 24 enters the blowing duct 26 through the second connecting duct 25. Finally, the hot air is blown out through the hot air outlet 27, and blown onto the circuit board, thereby drying the circuit board;

[0050] S5: As the chain conveying structure 3 works, the dried circuit board moves between the multiple etching liquid spraying assemblies 4. At this time, the etching liquid spraying assemblies 4 spray the etching liquid onto the circuit board, thereby etching the circuit board, and the excess etching liquid falls into the liquid collecting tank 8;

[0051] S6: The etched circuit board will finally pass through multiple blowing ducts 26, so that the hot air blown out of the blowing ducts 26 will dry the etched circuit board, and then the chain conveying structure 3 will send the circuit board out of the top shell 2, and then the circuit board can be removed from the clamping and fixing component 12 on the chain conveying structure 3.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board etching device, comprising a bottom base (1), a top shell (2) fixedly mounted on the upper end of the bottom base (1), a chain conveying structure (3) mounted inside the bottom base (1) and the top shell (2), an etching liquid spraying assembly (4) symmetrically arranged inside the top shell (2) and on the left and right sides of the chain conveying structure (3), characterized in that: The front end of the bottom base (1) is also located at the front end of the top shell (2) and is fixedly installed with a pre-cleaning component (5). The pre-cleaning component (5) is composed of a protective shell (13), a mounting plate (14), a U-shaped mounting frame (15), a mounting square rod (17), a movable pressure plate (18), a pushing spring (19), a movable base plate (20) and a cleaning bristle (21). The mounting plate (14) has two and is symmetrically fixedly installed on the inner walls of the left and right sides of the mounting plate (14). The U-shaped mounting frame (15) has two and is respectively fixedly installed on one end of the two mounting plates (14). The mounting square rod (17) has two and is respectively slidably installed on the two U-shaped mounting frames (15). The movable pressure plate (18) has two and is respectively fixedly installed on the outer ends of the two mounting square rods (17). The pushing spring (19) has two and is respectively sleeved on the two mounting square rods (17). The movable base plate (20) has two and is respectively fixedly installed on the two mounting plates (14). The cleaning brush (21) is fixedly mounted on the inner ends of the two movable base plates (20); two spray cleaning nozzles (6) are symmetrically mounted in the top shell (2) and on the left and right sides of the chain conveying structure (3); the spray cleaning nozzles (6) are also located in front of the etching liquid spraying assembly (4); a hot air drying assembly (7) is mounted on the bottom base (1); the hot air drying assembly (7) is composed of a fan (22), a first connecting pipe (23), an air heating assembly (24), a second connecting pipe (25) and a blowing pipe (26); the first connecting pipe (23) connects the fan (22) with the air heating assembly (24); the second connecting pipe (25) connects the air heating assembly (24) with the blowing pipe (26); there are a plurality of blowing pipes (26) which are symmetrically arranged on the left and right sides of the chain conveying structure (3); and the blowing pipe (26) is located on the front and rear sides of the etching liquid spraying assembly (4).

2. A circuit board etching device according to claim 1, characterized in that: The bottom base (1) is composed of a bottom frame (29) and a second door panel (30). There are a plurality of second door panels (30) which are fixedly mounted on the bottom frame (29). A liquid collecting tank (8) is mounted in the bottom frame (29). A motor is mounted in the bottom frame (29).

3. A circuit board etching device according to claim 1, characterized in that: The top shell (2) is composed of a top frame (9) and a first door panel (10). There are a plurality of first door panels (10) which are fixedly mounted on the top frame (9). The top frame (9) is fixedly connected to a bottom frame (29).

4. A circuit board etching device according to claim 3, characterized in that: The chain conveying structure (3) is composed of a conveying chain (11) and a clamping and fixing assembly (12). There are a plurality of clamping and fixing assemblies (12) which are symmetrically fixedly mounted on the conveying chain (11) in pairs. The conveying chain (11) is rotatably mounted in the bottom base (1). At the same time, the conveying chain (11) is located above the liquid collecting tank (8), and the conveying chain (11) is connected to the output shaft of the motor installed in the bottom frame (29).

5. A circuit board etching device according to claim 3, characterized in that: The etching liquid spraying assembly (4) is fixedly mounted on the liquid collecting tank (8).

6. A circuit board etching device according to claim 5, characterized in that: The protective shell (13) on the pre-cleaning component (5) is fixedly connected to the bottom base (1) and the top shell (2), and the protective shell (13) is also sleeved on the outside of the chain conveying structure (3).

7. A circuit board etching device according to claim 5, characterized in that: A mounting square hole (16) is provided on one side wall of the U-shaped mounting frame (15) on the pre-cleaning component (5), and the mounting square hole (16) penetrates the one side wall of the U-shaped mounting frame (15) inside and outside. The mounting square rod (17) is slidably mounted in the mounting square hole (16), and the movable pressure plate (18) and the pushing spring (19) are both located in the U-shaped mounting frame (15). The movable base plate (20) and the cleaning bristles (21) are both located on the inner side of the U-shaped mounting frame (15), and the two movable base plates (20) are respectively located on the left and right sides of the chain conveying structure (3).

8. A circuit board etching device according to claim 1, characterized in that: The spray cleaning nozzle (6) is fixedly mounted on the liquid collecting tank (8), and the spray cleaning nozzle (6) can be connected to a water supply device via a pipeline.

9. A circuit board etching device according to claim 8, characterized in that: The fan (22), the first connecting pipe (23), the air heating component (24) and the second connecting pipe (25) on the hot air drying component (7) are all located below the liquid collecting tank (8), and the fan (22) and the air heating component (24) are fixedly connected to the bottom base (1), the blowing pipe (26) passes through the liquid collecting tank (8) upwards, and the blowing pipe (26) is fixedly connected to the liquid collecting tank (8), and a hot air outlet (27) is opened on the blowing pipe (26), and an outlet protection net (28) is fixedly installed in the hot air outlet (27).

10. An etching method for a circuit board etching device, characterized in that: The following steps are involved: S1: First, the motor in the bottom base (1) is started, thereby driving the chain conveying structure (3) to rotate in the bottom base (1), and then the circuit board to be etched can be fixed between two symmetrically arranged clamping and fixing components (12) on the chain conveying structure (3), and at the same time, the circuit board must be located in front of the pre-cleaning component (5); S2: The rotating chain conveying structure (3) then moves the circuit board toward the pre-cleaning assembly (5). When the circuit board passes through the pre-cleaning assembly (5), the cleaning bristles (21) contact and rub against the circuit board under the elastic force of the push spring (19), so that the cleaning bristles (21) remove the debris on the circuit board; S3: Then, the circuit board cleaned by the pre-cleaning component (5) will enter the top shell (2), and the water supply device connected to the spray cleaning nozzle (6) can be started. At this time, the water supply device will transport the cleaning water to the spray cleaning nozzle (6), and then the spray cleaning nozzle (6) will spray water onto the circuit board, thereby further cleaning the circuit board, and the water that has cleaned the circuit board will fall into the liquid collection tank (8); S4: The cleaned circuit board is then moved between the plurality of blowing ducts (26). At this time, the fan (22) and the air heating assembly (24) on the hot air drying assembly (7) are started, so that the fan (22) sends air into the air heating assembly (24) through the first connecting duct (23), and the air heated by the air heating assembly (24) enters the blowing duct (26) through the second connecting duct (25). Finally, the hot air is blown out through the hot air outlet (27) and blown onto the circuit board, thereby drying the circuit board. S5: As the chain conveying structure (3) works, the dried circuit board moves between the plurality of etching liquid spraying assemblies (4), and the etching liquid spraying assemblies (4) spray the etching liquid onto the circuit board, thereby etching the circuit board, and the excess etching liquid falls into the liquid collecting tank (8); S6: The etched circuit board will eventually pass through a plurality of blowing ducts (26), so that the hot air blown out of the blowing ducts (26) will dry the etched circuit board, and then the chain conveying structure (3) will deliver the circuit board out of the top shell (2), and then the circuit board can be removed from the clamping and fixing assembly (12) on the chain conveying structure (3).

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