PCB multilayer board etching machine and etching process

Abstract

The invention belongs to the field of etching machines, and discloses a PCB multilayer board etching machine and an etching process, the PCB multilayer board etching machine comprises a reaction box, a splash-proof assembly and a support assembly; a camera penetrating through the sealing cover is arranged on the inner side of the sealing cover, a splash-proof assembly is arranged on the side, close to the reaction box, of the camera, and a supporting assembly is arranged between the table body and the reaction box; the supporting assembly comprises a supporting base, a supporting plate, an inserting plate and an elastic piece, the supporting plate is in sealed sliding fit with the upper end of the supporting base, the inserting plate is in sealed sliding fit with the side wall of the supporting base, and the elastic piece is fixed to the end, away from the supporting base, of the inserting plate; the adjusting assembly is driven by the servo motor to point to the supporting assemblies at different angles, and the camera is used for detecting the positions of impurities and sheltering objects at the moment, so that the reaction box is inclined, the impurities can avoid the sheltering objects as much as possible and are taken away by a solution, and the separation of the impurities deposited in the gaps of the PCB multilayer board from the PCB multilayer board is facilitated.

Description

Technical Field

[0001] The present invention belongs to the field of etching machines, and in particular relates to a PCB multilayer board etching machine and an etching process. Background Art

[0002] PCB ferric chloride wet etching is a process that uses chemical solutions to remove unwanted copper from circuit boards. In this process, the ferric chloride solution acts as an etchant to dissolve the exposed copper foil through a chemical reaction, while retaining the copper lines protected by the resist, thereby forming the desired circuit pattern;

[0003] For example, the tipping bucket etcher with publication number CN101880877A utilizes a set of driving devices to make the container rock left and right to reduce the precipitated impurities. However, if the precipitated impurities are already located between adjacent PCB multilayer boards, the left and right rocking direction is the only one, and it is difficult to separate the precipitated impurities from the PCB multilayer boards, thereby affecting the quality of the PCB multilayer boards. Moreover, after the etching is completed, since the etching liquid can be reused, when the etching liquid is recovered, it is usually poured out first, and then the precipitated impurities inside are manually cleaned, and then the etching liquid is poured back. In this process, the etching liquid is frequently moved, which can easily cause harm to the environment or human body. Summary of the invention

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a PCB multilayer etching machine and etching process, which solves the problem in the prior art that precipitated impurities remain in the complex circuit gaps on the PCB multilayer board, and a single shaking method is difficult to separate the impurities from the obstruction in the complex circuits.

[0005] The purpose of this disclosure can be achieved through the following technical solutions:

[0006] A PCB multilayer etching machine, comprising a reaction box, a splash-proof component and a support component;

[0007] The upper end of the reaction box is sealed with a sealing cover, and a camera penetrating the sealing cover is arranged on the inner side of the sealing cover, a splash-proof assembly is arranged on the side of the camera close to the reaction box, and a support plate is arranged below the sealing cover, a spherical body is rotatably matched with the middle part of the lower end of the reaction box, and a table body is rotatably matched with the lower end of the spherical body, and a supporting assembly is arranged between the table body and the reaction box;

[0008] The support assembly includes a support seat, a support plate, an insert plate and an elastic sheet, and the upper end of the support seat is sealed and slidably matched with the support plate, and the side wall of the support seat is sealed and slidably matched with the insert plate, and the elastic sheet is fixed to one end of the insert plate away from the support seat;

[0009] A support platform is fixed at the center of the upper end of the table body, and multiple groups of support components are arranged around the outer side of the support platform. An adjustment component is arranged at the upper end of the table body, and the adjustment component includes a transmission arm, a telescopic plate support spring and a pulley. A transmission arm is coaxially rotated on the inner side of the support platform, and a telescopic plate is slidably arranged on the outer side of the transmission arm. A support spring is fixed between the transmission arm and the telescopic plate, and a pulley is rotatably arranged on the end of the telescopic plate away from the transmission arm, and the lower end of the transmission arm is connected to the output end of the servo motor.

[0010] In some disclosures, a ball groove is provided at the center of the upper end of the support platform, and a limiting groove is provided on the side wall of the support platform and passes through the support platform, and the position of the limiting groove corresponds to the position of the support assembly, and a semicircular groove is provided on the lower end surface of the reaction box, and the semicircular groove is adapted to the sphere.

[0011] In some disclosures, the upper end of the support plate is hinged with a universal joint, the upper end of the universal joint is hinged with a connecting plate, and the upper end of the connecting plate is fixed with a suction cup.

[0012] In some disclosures, a storage tank is provided around the bottom of the reaction box, and a heating interlayer is provided at the bottom of the reaction box, and a heating component is provided inside the heating interlayer.

[0013] In some disclosures, the heating component includes a heating wire and a water injection port, a water injection port is opened at the lower end of the heating interlayer, a heating wire is arranged on the inner side of the water injection port, and clean water is injected into the inner side of the heating interlayer.

[0014] In some disclosures, a plurality of blocking rods are fixed to the upper end surface of the support plate, a plurality of filter holes penetrating the support plate are arranged on the inner side of the support plate, and a connecting rod is fixed between the support plate and the sealing cover.

[0015] In some disclosures, the splash-proof assembly includes a support frame, a hollow groove, a glass plate and a reset assembly. The support frame is fixed to the lower end of the camera, and a through hole is arranged through the inner center of the support frame. A hollow groove is opened on the inner side of the support frame, and a glass plate is slidably arranged on the inner side of the hollow groove, and a reset assembly is arranged on the outer side of the glass plate.

[0016] In some disclosures, the reset assembly includes a tension spring, a sealing box and small steel balls. A plurality of tension springs are arranged on one side of the glass plate, and a sealing box is fixed on the other side of the glass plate, and a plurality of small steel balls are filled inside the sealing box.

[0017] In some disclosures, a cleaning ring is embedded in the inner side of the hollow groove, and when the tension spring is in the original length state, the glass plate and the through hole are coaxially arranged, and the cleaning ring and the through hole are coaxially arranged.

[0018] A PCB multilayer etching process comprises the following steps:

[0019] S1. Before use, enter the picture of the PCB multilayer board after etching and the picture of the PCB multilayer board before etching into the system;

[0020] S2, evenly laying the PCB multilayer board on the upper surface of the support plate, and at the same time, the edge of the PCB multilayer board is stuck between a plurality of blocking rods, and the blocking rods are used to limit the position of the PCB multilayer board, and the sealing cover is buckled on the upper end of the reaction box, and the PCB multilayer board is immersed in the etching solution;

[0021] S3. When the PCB multilayer board is immersed in the etching solution, the camera takes intermittent photos of the PCB multilayer board. The photos taken are transmitted to the display screen, which also displays the photos of the PCB multilayer board before water intrusion and after etching. At this time, the staff compares the photos before etching to find the location of impurities.

[0022] S4. The staff drives the servo motor to rotate according to the position of the impurity, and controls the rotation angle of the servo motor to control the adjustment component to squeeze the elastic sheet on the supporting component at the appropriate position, thereby controlling the inclination angle of the reaction box and the flow direction of the etching solution, thereby changing the position of the impurity by using the flow of the etching solution;

[0023] S5. When etching is completed, the copper sheet after etching is photographed by the camera. The staff compares it with the picture after the moment is completed to observe whether there is any copper foil residue on the circuit to determine whether etching is completed.

[0024] The nouns, conjunctions or adjectives involved in the above technical solution are explained as follows:

[0025] A fixed connection is one where the parts or components are fixed without any relative movement;

[0026] A rotational connection is a connection between parts that allows the parts to rotate relative to each other;

[0027] Threaded connection is a detachable fixed connection with the advantages of simple structure, reliable connection, and convenient assembly and disassembly. It is widely used in the fields of mechanical engineering and connection structures.

[0028] A sliding connection is a connection between parts that allows the parts to slide against each other.

[0029] Beneficial effects of the present disclosure:

[0030] The servo motor drives the adjustment component to point to the support component at different angles, and uses the camera to detect the position of impurities and obstructions at this time, so that the reaction box is tilted, so that the impurities can avoid the obstruction as much as possible and be taken away by the solution, which is conducive to separating the impurities that have been deposited in the gaps of the PCB multilayer boards from the PCB multilayer boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present disclosure;

[0033] Figure 2 is a schematic diagram of the overall structure of the sealing cover and the support plate of the embodiment of the present disclosure;

[0034] Figure 3 is a schematic diagram of the overall structure of the sealing cover, the support plate and the reaction box of the embodiment of the present disclosure;

[0035] Figure 4 is a top view schematic diagram of a table body and a support assembly according to an embodiment of the present disclosure;

[0036] Figure 5 This is an embodiment of the present disclosure Figure 4 Schematic diagram of the overall structure;

[0037] Figure 6 This is an embodiment of the present disclosure Figure 4 AA isometric section structural diagram;

[0038] Figure 7 is a schematic diagram of the internal structure of a reaction box according to an embodiment of the present disclosure;

[0039] Figure 8 is a schematic diagram of the overall structure of the support assembly of an embodiment of the present disclosure;

[0040] Fig. 9 is a schematic diagram of the overall structure of the splash-proof assembly of an embodiment of the present disclosure;

[0041] Fig.10 This is an embodiment of the present disclosure Fig. 9 A schematic diagram of the main view;

[0042] Fig.11 This is an embodiment of the present disclosure Fig.10 BB isometric section structure diagram;

[0043] Fig.12It is a schematic diagram of the overall structure of the adjustment component of an embodiment of the present disclosure.

[0044] In the figure: 1, table body; 101, support table; 102, limit groove; 2, reaction box; 21, storage tank; 22, semicircular groove; 23, heating interlayer; 201, ball groove; 3, sealing cover; 4, camera; 5, support plate; 51, stop rod; 52, filter hole; 53, connecting rod; 6, splashproof component; 61, support frame; 62, hollow groove; 63, glass plate; 64, reset component; 65, cleaning ring; 611, perforation; 641, pull Spring; 642, sealing box; 643, small steel ball; 7, support assembly; 71, support seat; 72, support plate; 73, plug plate; 74, elastic sheet; 720, universal joint; 721, connecting plate; 722, suction cup; 8, adjustment assembly; 81, transmission arm; 82, telescopic plate; 83, support spring; 84, pulley; 9, servo motor; 10, heating assembly; 1001, heating wire; 1002, water inlet; 11, sphere. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0046] The following is a further description of a PCB multilayer board etcher and etching process provided by the present invention in combination with the accompanying drawings and implementation modes.

[0047] Please refer to Figures 1 to 12 , a PCB multilayer etching machine, comprising a reaction box 2, a splash-proof component 6 and a support component 7;

[0048] The upper end of the reaction box 2 is sealed with a sealing cover 3, and a camera 4 penetrating the sealing cover 3 is arranged on the inner side of the sealing cover 3, a splash-proof component 6 is arranged on the side of the camera 4 close to the reaction box 2, and a support plate 5 is arranged below the sealing cover 3, a spherical body 11 is rotatably matched with the middle part of the lower end of the reaction box 2, and a table body 1 is rotatably matched with the lower end of the spherical body 11, and a support component 7 is arranged between the table body 1 and the reaction box 2;

[0049] The support assembly 7 includes a support seat 71, a support plate 72, an insert plate 73 and an elastic sheet 74, wherein the upper end of the support seat 71 is sealed and slidably matched with the support plate 72, and the side wall of the support seat 71 is sealed and slidably matched with the insert plate 73, and the elastic sheet 74 is fixed to one end of the insert plate 73 away from the support seat 71;

[0050] A support platform 101 is fixed at the center of the upper end of the table body 1, and multiple groups of support components 7 are arranged around the outer side of the support platform 101. An adjustment component 8 is arranged on the upper end of the table body 1, and the adjustment component 8 includes a transmission arm 81, a telescopic plate 82, a support spring 83 and a pulley 84. A transmission arm 81 is coaxially rotated on the inner side of the support platform 101, and a telescopic plate 82 is slidably arranged on the outer side of the transmission arm 81. A support spring 83 is fixed between the transmission arm 81 and the telescopic plate 82, and a pulley 84 is rotatably arranged on the end of the telescopic plate 82 away from the transmission arm 81, and the lower end of the transmission arm 81 is connected to the output end of the servo motor 9.

[0051] Before use, pour the ferric chloride solution into the reaction box 2, the ferric chloride solution is mixed with the clean water in the reaction box 2 to form ferric hydroxide and hydrochloric acid, and the solution in the reaction box is an etching solution at this time, and then the PCB multilayer board is placed on the support plate 5, and then the sealing cover 3 is pressed down until the sealing cover 3 is buckled on the upper end surface of the reaction box 2. During the buckling process of the sealing cover 3, the support plate 5 and the PCB multilayer board are driven to move downward until the PCB multilayer board is immersed in the etching solution. At this time, the camera 4 is parallel to the PCB multilayer board and shoots the surface of the PCB multilayer board. After immersion, the etching solution etches the PCB multilayer board, and the FeCl3 concentration decreases during the etching process. At this time, the precipitation of Fe(OH)3 increases to form impurities, and the camera is used to detect whether there are impurities remaining on the PCB multilayer board. , when the east and west sides of the impurity are clamped by the PCB multilayer board, the outer wall of the front pulley 84 of the support component 7 is fitted with the inner wall of the support platform 101, and then the transmission arm 81 is driven to rotate with the center of the circle of the support platform 101 as the axis. In this process, the pulley 84 squeezes the elastic sheet 74, and the elastic sheet 74 is a ring-shaped thin sheet with a raised middle part. When the pulley 84 moves to the middle of the elastic sheet 74, the middle part of the elastic sheet 74 is driven to be concave inward, thereby driving the plug plate 73 to slide to the side close to the support seat 71, and compressing the damping fluid on the inner side of the support seat 71, so that the damping fluid pushes the support plate 72 to slide upward, so that the support component 7 pointed to by the adjustment component 8 at this time protrudes upward, and drives the reaction box 2 above the support component 7 to tilt with the sphere 11 as the center. When the adjustment component 8 After the pulley 84 on the upper part slides out from the elastic sheet 74, the inward extrusion force on the plug plate 73 is weakened, and the elastic sheet 74 recovers elastically, driving the plug plate 73 to be pulled out, so that the support plate 72 slides downward and resets. At this time, multiple support plates 72 are at the same height, and then the transmission arm 81 continues to rotate until the support component 7 squeezed by the adjustment component 8 is located on the south or north side of the reaction box 2, so that the reaction box 2 is tilted on the south side with the sphere 11 as the center of the circle. Compared with the contact between the surfaces, the inclination angle of the reaction box 2 is more flexible with the sphere 11 as the support point, and the force required for the reaction box 2 to tilt is less, so that the solution in the reaction box 2 flows in the north-south direction. Since there is less north-south obstruction of impurities, this flow mode is more likely to remove the impurities clamped on the east and west sides. The impurities held by the reaction box 2 can be taken out. Similarly, when the east-west obstruction of the impurities is less, the pulley 84 on the adjusting component 8 can be driven by the servo motor 9 to move to the east-west supporting component 7. Since the supporting component 7 is arranged around the adjusting component 8, when the adjusting component 8 passes through different supporting components 7, the force condition of each supporting component 7 is the same. If the etching circuit on the inner side of the PCB multilayer board is complicated, the shaking angle of the reaction box 2 can be increased by adding a supporting component 7. This method realizes the multi-directional flow of the solution in the reaction box 2 under the premise of only one servo motor 9, which is beneficial to improve the flexibility of the device, facilitates the cleaning of impurities stuck in the gaps of the PCB multilayer board, and detects through the camera 4, and drives the servo motor 9 only when impurities are stuck on the PCB multilayer board.The servo motor 9 is driven intermittently, so that energy can be saved. When the adjustment component 8 moves to the support component 7 at a suitable position, the servo motor 9 can be driven again, so that the servo motor 9 repeatedly squeezes the support component 7, thereby increasing the flow rate or flow time of the solution inside, which is conducive to removing impurities.

[0052] Please refer to Figures 5 to 7 A ball groove 201 is provided at the center of the upper end of the support platform 101, and a limiting groove 102 penetrating the support platform 101 is provided on the side wall of the support platform 101, and the position of the limiting groove 102 corresponds to the position of the support assembly 7;

[0053] The lower end surface of the reaction box 2 is provided with a semicircular groove 22, and the semicircular groove 22 is adapted to the sphere 11;

[0054] The sphere 11 is placed in the ball groove 201, and the reaction box 2 is buckled on the top of the sphere 11 through the semicircular groove 22 at the bottom thereof, so as to prevent the sphere 11 from rolling at will and limit the position of the sphere 11. The depth of the ball groove 201 is lower than the radius of the sphere 11, so that when the lower end surface of the reaction box 2 is not directly in contact with the upper end surface of the support platform 101, it is convenient for the reaction box 2 to shake on the upper end surface of the support platform 101. At the same time, this method can also quickly locate the position of the reaction box 2, so that the center of the reaction box 2 coincides with the center of the circle of the support platform 101 and the multiple groups of support components 7. The plug plate 73 of the support component 7 is arranged through the limiting groove 102, and when the plug plate 73 is squeezed by the adjustment component 8, it will slide along the limiting groove 102, and the moving path of the plug plate 73 is limited by the limiting groove 102. It is beneficial to improve the sliding stability of the plug plate 73.

[0055] Please refer to Figure 8 The upper end of the support plate 72 is hinged with a universal joint 720, and the upper end of the universal joint 720 is hinged with a connecting plate 721, and the upper end of the connecting plate 721 is fixed with a suction cup 722. When in use, the connecting plate 721 is attached to the bottom surface of the reaction box 2, and the reaction box 2 is fixed to the support assembly 7 through the suction cup 722, so that the reaction box 2 can be removed conveniently. When the inner wall of the reaction box 2 needs to be cleaned, it can be removed and rinsed in a cleaning pool, so as to facilitate the cleaning of a single reaction box 2. At the same time, the connecting plate 721 and the support plate 72 are rotatably connected through the universal joint 720, so that when the reaction box 2 is tilted, the connecting plate 721 can be rotated in multiple directions along the hinge, so that the connecting plate 721 in various directions can always be attached to the reaction box 2, and the connecting plate 721 can be rotated smoothly, and the contact area between the single support assembly 7 and the bottom of the reaction box 2 can be increased through the connecting plate 721, which is conducive to improving the stability of the device.

[0056] Please refer to Figure 7A storage tank 21 is provided around the bottom of the reaction box 2 , and a heating interlayer 23 is provided at the bottom of the reaction box 2 , and a heating component 10 is provided inside the heating interlayer 23 . After the etching is completed, the pulley 84 of the adjusting component 8 is pressed against any group of support components 7, so that the support plate 72 on any group of support components 7 is lifted upward. At this time, the reaction box 2 is in a tilted state, and the solution in the reaction box 2 flows to the lower side. At this time, the precipitation in the reaction box 2 moves along the bottom surface of the reaction box 2 to the storage tank 21 at the edge until it flows into the storage tank 21, thereby collecting the precipitated impurities. When the impurities are collected, the adjusting component 8 is separated from the support component 7 to place the reaction box 2 horizontally. At this time, when the next group of PCB multilayer boards are etched, the reaction box 2 is shaken, and the impurities in the storage tank 21 are blocked by the side wall of the storage tank 21 or slide along the storage tank 21, and will not be removed from the storage tank 21 in large quantities, thereby facilitating repeated use. When the etching solution is repeatedly used, the frequent movement of the etching solution is reduced, thereby reducing harm to the environment or human body.

[0057] The heating assembly 10 includes a heating wire 1001 and a water injection port 1002 . The water injection port 1002 is opened at the lower end of the heating interlayer 23 , and the heating wire 1001 is arranged inside the water injection port 1002 . Clean water is injected into the inside of the heating interlayer 23 .

[0058] The hot water in the heating interlayer 23 is heated by the heating wire 1001 to heat the inner cavity of the reaction box 2, which is beneficial to accelerate the etching speed inside the reaction box 2. Because the heating component 10 is close to the iron hydroxide precipitated impurities, the hydrolysis reaction of Fe3+ can be accelerated, and the iron hydroxide is aggregated into small particles, thereby increasing the size of the precipitated particles and further preventing the precipitated particles from floating upward during the shaking process and hindering the etching of the PCB multilayer board.

[0059] Please refer to Figures 1 to 3 , a plurality of blocking rods 51 are fixed to the upper end surface of the support plate 5, and a plurality of filter holes 52 penetrating the support plate 5 are arranged on the inner side of the support plate 5, and a connecting rod 53 is fixed between the support plate 5 and the sealing cover 3;

[0060] The PCB multilayer board is evenly laid on the upper surface of the support plate 5, and the edge of the PCB multilayer board is clamped between multiple blocking rods 51, and the blocking rods 51 are used to limit the position of the PCB multilayer board. When in use, the sealing cover 3 is fixed in parallel with the support plate 5 through the connecting rod 53, so that even if the reaction box 2 is tilted and shaken, the PCB multilayer board can still be kept parallel to the camera 4, which is beneficial to improve the clarity during shooting. When the PCB multilayer board is taken out, the sealing cover 3 is lifted upwards and the support plate 5 and the PCB multilayer board are pulled out of the etching liquid. During the pulling out process, the etching liquid flows downward from the filter hole 52 to the reaction box 2, which is convenient for next use.

[0061] Please refer to Figure 2 , Fig. 9 , Fig.10 and Fig.11 The splash-proof assembly 6 includes a support frame 61, a hollow groove 62, a glass plate 63 and a reset assembly 64. The support frame 61 is fixed to the lower end of the camera 4, and a through hole 611 is provided through the inner center of the support frame 61. A hollow groove 62 is provided on the inner side of the support frame 61, and a glass plate 63 is slidably provided on the inner side of the hollow groove 62. A reset assembly 64 is provided on the outer side of the glass plate 63;

[0062] When the sealing cover 3 is in a horizontal state, the glass plate 63 is located at the center of the perforation 611 and is blocked between the camera 4 and the etching liquid. When the reaction box 2 shakes, the glass plate 63 can slide repeatedly at the perforation 611 to reduce the contact between the etching liquid and the lens of the camera 4. At the same time, the glass plate 63 is made of transparent material, so that the camera 4 can pass through the glass plate 63 to form an image when shooting, which is beneficial to improve the protection of the camera 4.

[0063] The reset assembly 64 includes a tension spring 641 , a sealing box 642 and small steel balls 643 . A plurality of tension springs 641 are arranged on one side of the glass plate 63 , a sealing box 642 is fixed on the other side of the glass plate 63 , and a plurality of small steel balls 643 are filled inside the sealing box 642 .

[0064] When the reaction box 2 shakes, the reaction box 2 tilts, and the small steel ball 643 in the sealing box 642 rolls toward the lower end along with the tilt angle of the reaction box 2, thereby hitting the sealing box 642 and exerting a force on the sealing box 642 to slide toward the lower side. At the same time, the glass plate 63 is affected by gravity, thereby driving the glass plate 63 to slide in the hollow groove 62 from the perforation 611, and driving multiple tension springs 641 to stretch outward. When the reaction box 2 tends to be horizontal, the force exerted by the small steel ball 643 on the sealing box 642 is weakened. At this time, the gravity exerted on the glass plate 63 and the small steel ball 643 is vertically downward, so that the elastic restoring force of the tension spring 641 drives the glass plate 63 to move to the perforation 611, thereby resetting.

[0065] A cleaning ring 65 is embedded in the inner side of the hollow groove 62. When the tension spring 641 is in its original length state, the glass plate 63 is coaxially arranged with the perforation 611, and the cleaning ring 65 is coaxially arranged with the perforation 611. The cleaning ring 65 is made of ultrafine fiber, so that every time the glass plate 63 slides at the perforation 611 during shaking, the glass plate 63 will contact the cleaning ring 65, so that the friction between the glass plate 63 and the cleaning ring 65 can be used to wipe the etching liquid splashed on the side of the glass plate 63 close to the reaction box 2, thereby reducing the residual time of the etching liquid on the glass plate 63, which is beneficial to prolonging the life of the glass plate 63.

[0066] The following is a further description of a PCB multilayer etching process provided by the present invention in conjunction with the accompanying drawings and implementation methods.

[0067] S1. Before use, enter the picture of the PCB multilayer board after etching and the picture of the PCB multilayer board before etching into the system;

[0068] S2, evenly lay the PCB multilayer board on the upper surface of the support plate 5, and at the same time, the edge of the PCB multilayer board is stuck between the multiple blocking rods 51, and the blocking rods 51 are used to limit the position of the PCB multilayer board, and the sealing cover 3 is buckled on the upper end of the reaction box 2, and the PCB multilayer board is immersed in the etching solution;

[0069] S3, when the PCB multilayer board is immersed in the etching solution, the camera 4 intermittently shoots the PCB multilayer board, and the photographed pictures are transmitted to the display screen, which also displays the pictures of the PCB multilayer board before the water intrusion and the pictures after the etching. At this time, the staff compares the pictures before etching to find the location of impurities;

[0070] S4, the staff drives the servo motor 9 to rotate by the position of the impurity, and controls the rotation angle of the servo motor 9 to control the adjustment component 8 to squeeze the elastic sheet 74 on the supporting component 7 at the appropriate position, thereby controlling the inclination angle of the reaction box 2 and the flow direction of the etching liquid, thereby changing the position of the impurity by using the flow of the etching liquid;

[0071] S5. When etching is completed, the copper sheet after etching is photographed by camera 4. The staff compares it with the picture after the moment is completed to observe whether there is copper foil residue on the circuit to determine whether etching is completed.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0073] The above shows and describes the basic principles, main features and advantages of the present disclosure. Those skilled in the art should understand that the present disclosure is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present disclosure. Without departing from the spirit and scope of the present disclosure, the present disclosure may have various changes and improvements, and these changes and improvements fall within the scope of the present disclosure to be protected.

Claims

1. A PCB multilayer etching machine, characterized in that: include: A reaction box (2), a splash-proof assembly (6) and a support assembly (7); The upper end of the reaction box (2) is sealed with a sealing cover (3), and a camera (4) penetrating the sealing cover (3) is arranged on the inner side of the sealing cover (3), a splash-proof component (6) is arranged on the side of the camera (4) close to the reaction box (2), and a support plate (5) is arranged below the sealing cover (3), a spherical body (11) is rotatably fitted at the middle part of the lower end of the reaction box (2), and a table body (1) is rotatably fitted at the lower end of the spherical body (11), and a supporting component (7) is arranged between the table body (1) and the reaction box (2); The support assembly (7) comprises a support seat (71), a support plate (72), an insert plate (73) and an elastic sheet (74), wherein the upper end of the support seat (71) is sealingly and slidably matched with the support plate (72), and the side wall of the support seat (71) is sealingly and slidably matched with the insert plate (73), and the elastic sheet (74) is fixed to one end of the insert plate (73) away from the support seat (71); A support platform (101) is fixed at the center of the upper end of the table body (1), and multiple groups of support components (7) are arranged around the outer side of the support platform (101). An adjustment component (8) is arranged at the upper end of the table body (1), and the adjustment component (8) comprises a transmission arm (81), a telescopic plate (82), a support spring (83) and a pulley (84). A transmission arm (81) is coaxially rotatably arranged on the inner side of the support platform (101), and a telescopic plate (82) is slidably arranged on the outer side of the transmission arm (81). A support spring (83) is fixed between the transmission arm (81) and the telescopic plate (82), and a pulley (84) is rotatably arranged at one end of the telescopic plate (82) away from the transmission arm (81), and the lower end of the transmission arm (81) is connected to the output end of the servo motor (9).

2. A PCB multilayer etching machine according to claim 1, characterized in that, A ball groove (201) is provided at the center of the upper end of the support platform (101), and a limiting groove (102) penetrating the support platform (101) is provided on the side wall of the support platform (101), the position of the limiting groove (102) corresponds to the position of the support assembly (7), and a semicircular groove (22) is provided on the lower end surface of the reaction box (2), and the semicircular groove (22) is adapted to the sphere (11).

3. A PCB multilayer etching machine according to claim 1, characterized in that, The upper end of the support plate (72) is hinged with a universal joint (720), and the upper end of the universal joint (720) is hinged with a connecting plate (721), and the upper end of the connecting plate (721) is fixed with a suction cup (722).

4. A PCB multilayer etching machine according to claim 2, characterized in that, The bottom of the reaction box (2) is surrounded by a storage tank (21), and the bottom of the reaction box (2) is provided with a heating interlayer (23), and a heating component (10) is arranged inside the heating interlayer (23).

5. A PCB multilayer etching machine according to claim 4, characterized in that, The heating component (10) comprises a heating wire (1001) and a water injection port (1002); the lower end of the heating interlayer (23) is provided with a water injection port (1002); the inner side of the water injection port (1002) is provided with a heating wire (1001); and clean water is injected into the inner side of the heating interlayer (23).

6. A PCB multilayer etching machine according to claim 1, characterized in that, A plurality of blocking rods (51) are fixed to the upper end surface of the support plate (5), a plurality of filter holes (52) penetrating the support plate (5) are arranged on the inner side of the support plate (5), and a connecting rod (53) is fixed between the support plate (5) and the sealing cover (3).

7. A PCB multilayer etching machine according to claim 1, characterized in that, The splash-proof component (6) comprises a support frame (61), a hollow groove (62), a glass plate (63) and a reset component (64); the support frame (61) is fixed to the lower end of the camera (4); a through hole (611) is provided through the inner center of the support frame (61); a hollow groove (62) is provided on the inner side of the support frame (61); a glass plate (63) is slidably provided on the inner side of the hollow groove (62); and a reset component (64) is provided on the outer side of the glass plate (63).

8. A PCB multilayer etching machine according to claim 7, characterized in that, The reset assembly (64) comprises a tension spring (641), a sealing box (642) and small steel balls (643); a plurality of tension springs (641) are arranged on one side of the glass plate (63); a sealing box (642) is fixed on the other side of the glass plate (63); and a plurality of small steel balls (643) are filled inside the sealing box (642).

9. A PCB multilayer etching machine according to claim 8, characterized in that, A cleaning ring (65) is embedded inside the hollow groove (62); when the tension spring (641) is in its original length state, the glass plate (63) and the through hole (611) are coaxially arranged, and the cleaning ring (65) and the through hole (611) are coaxially arranged.

10. A PCB multilayer etching process, using a PCB multilayer etching machine according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Before use, enter the picture of the PCB multilayer board after etching and the picture of the PCB multilayer board before etching into the system; S2, evenly laying the PCB multilayer board on the upper surface of the support plate (5), and at the same time, the edge of the PCB multilayer board is clamped between a plurality of blocking rods (51), and the blocking rods (51) are used to limit the position of the PCB multilayer board, and the sealing cover (3) is buckled on the upper end of the reaction box (2), and the PCB multilayer board is immersed in the etching solution; S3, when the PCB multilayer board is immersed in the etching solution, the camera (4) intermittently photographs the PCB multilayer board, and the photographed pictures are transmitted to the display screen, which also displays the pictures of the PCB multilayer board before the water intrusion and the pictures after the etching. At this time, the staff compares the pictures before the etching to find the location of the impurities; S4, the staff drives the servo motor (9) to rotate according to the position of the impurity, and controls the rotation angle of the servo motor (9) to control the adjustment component (8) to squeeze the elastic sheet (74) on the supporting component (7) at a suitable position, thereby controlling the tilt angle of the reaction box (2) and the flow direction of the etching liquid, thereby changing the position of the impurity by utilizing the flow of the etching liquid; S5. When etching is completed, the copper sheet after etching is photographed by camera (4). The staff compares it with the picture after the moment is completed to observe whether there is copper foil residue on the circuit to determine whether etching is completed.

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