Processing method of copper paste sintered copper block-embedded printed circuit board and PCB combination board of copper paste sintered copper block-embedded printed circuit board

Abstract

The invention provides a processing method of a copper paste sintered copper-block-embedded printed circuit board and a PCB combination board thereof, and the method comprises the following steps: S1, preparing an upper layer material, inserting a layer board CS on the front surface, and washing copper-embedded holes corresponding to copper-embedded blocks on inner layer boards corresponding to each layer of the upper layer; s2, processing upper-layer prepregs, and milling embedded copper holes corresponding to the embedded copper blocks in all the upper-layer prepregs; s3, upper layer pressing is conducted, and an upper layer pressing piece is formed; s4, lower-layer material preparation, S5, lower-layer prepreg treatment, S6, lower-layer pressing, and forming of a lower-layer pressing piece; s7, middle prepreg material preparation, wherein middle prepregs are arranged between the upper layer press-fit piece and the lower layer press-fit piece in a stacked mode correspondingly, and a plurality of drill holes used for being filled with copper paste for sintering machining are drilled in the middle prepreg area corresponding to the bottom side of the buried copper block; s8, laminating an upper layer and a lower layer to form a multi-layer circuit board; and the embedded copper block realizes interconnection and conduction of any layer of the inner layer through copper paste sintering in the drill hole.

Description

Technical Field

[0001] The invention relates to a PCB board processing technology, in particular to a processing method of a copper paste sintered copper block printed circuit board and a PCB combined board thereof. Background Art

[0002] With the rapid development of electronic technology, electronic products are developing towards being thinner, lighter and smaller, and the application and popularization of high-power electronic components have resulted in the effective heat dissipation area of ​​electronic products becoming smaller and smaller, while the heat dissipation demand is increasing. Electronic products have higher and higher performance requirements for printed circuit boards, so how to find the best method for heat dissipation and structural design has become a major challenge in current electronic design.

[0003] Common heat dissipation designs for PCB circuit boards generally include high-density heat dissipation holes, metal-based circuit boards, or metal substrates welded on the surface of circuit boards. However, the heat dissipation effect of high-density heat dissipation holes is limited, and drilling space is wasted; while metal-based circuit boards or designs with metal substrates welded on the surface of circuit boards have disadvantages such as large metal material consumption, bulky size, limited structural design, and high cost.

[0004] The heat dissipation method of traditional printed circuit boards can no longer meet the needs of modern electronic products. With the rapid development of new generation information technology, energy-saving and new energy vehicles, power equipment, aerospace and other fields, the solution to the heat dissipation problem has become imminent. Against this background, embedded copper block PCB came into being. The so-called embedded copper block refers to the partial embedding or embedding of copper blocks in the PCB. The heat-generating electronic components are directly installed on the copper blocks, and the heat is quickly dissipated by using the high thermal conductivity of the copper blocks. The embedded copper block PCB board has high thermal conductivity and high heat dissipation, and can effectively solve the heat dissipation problem of high-power electronic components in special application fields. The embedded copper block PCB board not only has good heat dissipation effect, but also saves board space. In recent years, it has been increasingly used in 5G communication equipment and has broad application prospects.

[0005] As a new type of printed circuit board, copper paste sintering buried copper blocks and inner layer interconnected printed circuit boards have the following advantages: a. High reliability. The copper blocks are buried in the inner layer of the printed circuit board by copper paste sintering, which can achieve good electrical and mechanical connections and improve the reliability of the printed circuit board; b. High-density wiring, which can achieve more wiring in a limited space and improve the integration of the printed circuit board; c. Good heat dissipation performance. The copper blocks have good thermal conductivity and can effectively dissipate the heat generated by electronic components, improving the stability and reliability of electronic products.

[0006] However, there are still some problems in the current processing method of copper paste sintered buried copper blocks and inner layer interconnected printed circuit boards, mainly including the following aspects: a. The processing technology is complicated. The processing technology of copper paste sintered buried copper blocks and inner layer interconnected printed circuit boards is relatively complicated and requires multiple steps to complete, including the preparation of copper blocks, the preparation of copper paste, the printing of copper paste, the sintering of copper paste, etc.; b. The processing precision requirements are high. Since the structure of the inner layer interconnected printed circuit board circuit board of copper paste sintered buried copper blocks is relatively complex, the requirements for processing precision are also relatively high, and high-precision processing equipment and processes are required to ensure the processing quality; c. The cost is high. The processing cost of copper paste sintered buried copper blocks and inner layer interconnected printed circuit boards is relatively high, mainly due to the complex processing technology, high processing precision requirements and the need to use some special materials and equipment.

[0007] In summary, there are still some problems in the current processing method of copper paste sintering buried copper block inner layer interconnection printed circuit board, which needs further research and improvement to improve processing efficiency, reduce processing cost and improve processing quality. Summary of the invention

[0008] The embodiment of the present invention provides a processing method for a copper paste sintered buried copper block printed circuit board and a PCB combined board thereof, so as to realize the interconnection between the buried copper block and the inner layer circuit. The printed circuit board is semi-buried in copper blocks, and copper paste is inserted into holes at the buried copper block positions. The copper paste is used to interconnect with the inner core board circuit layer. The problem of interconnection between the buried copper block and any layer of the inner layer graphics is solved through the optimization of design and process, and the processing efficiency and processing quality are effectively improved through process improvement, while the processing cost is reduced.

[0009] The technical solution adopted by the present invention to solve its technical problem is: The technical solution adopted by at least one embodiment of the present invention is as follows: In a first aspect, the present invention provides a method for processing a copper paste sintered copper block printed circuit board, the processing method comprising the following steps: S1. Preparation of upper materials: Prepare the front plug-in layer board CS, the inner layer boards corresponding to the upper layers, and the buried copper blocks required for burying copper, perform milling on the front plug-in layer board CS and the inner layer boards corresponding to the upper layers, and wash and pin the buried copper holes corresponding to the buried copper blocks; S2. Treatment of upper prepreg: When milling holes on all upper prepregs, wash and pin the buried copper holes corresponding to the buried copper blocks; S3, upper layer lamination: align the slots on the front plug-in layer board CS, the inner layer boards corresponding to each upper layer, and all the upper prepregs, and embed copper blocks in the slots and then press them together to form an upper layer lamination; S4, lower layer material preparation: prepare the back welding layer plate SS, the inner layer plates corresponding to each layer of the lower layer, and perform punching processing; S5, lower prepreg treatment; S6, lower layer lamination: align the back welding layer plate SS, the inner layer plates corresponding to each layer of the lower layer, and the grooves or holes on all the lower prepregs, and press them to form a lower layer lamination; S7, preparation of the intermediate prepreg material between the upper and lower layers: an intermediate prepreg is stacked between the upper laminate and the lower laminate, and a plurality of holes for embedding copper slurry for sintering are drilled in the intermediate prepreg area corresponding to the bottom side of the buried copper block; S8, lamination of the upper and lower layers: the upper lamination piece, the middle prepreg and the lower lamination piece are stacked in sequence, and finally a complete PCB board is obtained by lamination; the buried copper block is connected to the inner layer by sintering the copper paste in the drilled hole, and the buried copper block is connected by sintering the copper paste to realize the interconnection of any inner layer.

[0010] Furthermore, step S1 specifically includes: cutting the front plug-in layer board CS and the inner layer boards corresponding to the upper layers respectively → internal light imaging → inner layer etching inspection → punching → milling → matching center → browning processing.

[0011] Furthermore, step S2 specifically includes: respectively cutting the corresponding upper-layer prepregs, milling holes, and processing the auxiliary materials in sequence.

[0012] Furthermore, step S3 specifically also includes: aligning the slots on the front plug-in layer board CS, the inner layer boards corresponding to the upper layers, and all the upper semi-cured sheets, and embedding the buried copper blocks in the slots, and then laminating → reducing copper → drilling → copper plating / board plating → resin plugging → post-solder mask baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing in sequence to form an upper layer pressed part.

[0013] Furthermore, step S4 specifically includes: cutting the back welding layer plate SS and the inner layer plates corresponding to the lower layers respectively → internal light imaging → inner layer etching inspection → punching → matching center → browning processing.

[0014] Furthermore, step S6 specifically also includes: aligning the grooves or holes on the back welding layer board SS, the inner layer boards corresponding to each lower layer, and all the lower semi-cured sheets, and sequentially performing lamination → copper reduction → drilling → copper deposition / board plating → resin plugging → solder mask post-baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing to form a lower layer laminate.

[0015] Furthermore, step S8 specifically also includes: stacking the upper laminate, the middle prepreg and the lower laminate in sequence, through lamination → drilling → copper deposition / board plating → resin plugging → solder mask baking → ceramic grinding → copper reduction → drilling → copper deposition / board plating → subsequent normal process to finally obtain a complete PCB.

[0016] Furthermore, step S1, step S2 and step S3 specifically include: S1. Preparation of upper materials: Prepare the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2, the third inner layer board L3 and the buried copper blocks required for burying copper; The front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3 are respectively processed by cutting → internal light imaging → inner layer etching inspection → punching → milling → matching center → browning; In the milling process, buried copper holes corresponding to buried copper blocks are respectively cleaned and pinned on the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3; S2. Treatment of upper prepreg: The upper prepreg sheet PP1 corresponding to the upper layer is cut → milled → auxiliary materials are processed in sequence; When milling holes on the upper prepreg PP1, the buried copper holes corresponding to the buried copper blocks are respectively cleaned and pinned; S3, upper layer lamination: Align the slots on the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3 and the upper semi-cured sheet PP1, and embed the buried copper blocks in the slots, and then perform lamination → copper reduction → drilling → copper deposition / board plating → resin plugging → post-solder mask baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing in sequence to form the upper layer pressed parts.

[0017] Furthermore, step S4, step S5, step S6 and step S7 specifically include: S4. Preparation of lower layer materials: Prepare the back welding layer plate SS, the fourth inner layer plate L4, the fifth inner layer plate L5 and the sixth inner layer plate L6; The back welding layer plate SS, the fourth inner layer plate L4, the fifth inner layer plate L5 and the sixth inner layer plate L6 are respectively processed by cutting → internal light imaging → inner layer etching inspection → punching → matching center → browning; S5. Processing of lower prepreg: Cut the corresponding lower prepreg PP3 in turn → process the auxiliary materials; S6, lower layer lamination: Align the holes on the back welding layer SS, the fourth inner layer L4, the fifth inner layer L5, the sixth inner layer L6 and the lower prepreg PP3, and perform lamination → copper reduction → drilling → copper deposition / board plating → resin plugging → solder mask post-baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing in sequence to form the lower layer pressed parts; S7. Preparation of the intermediate prepreg material between the upper and lower layers: An intermediate prepreg PP2 for bonding the upper and lower layers is stacked between the corresponding upper and lower laminates, and a plurality of evenly distributed holes for plugging copper paste for sintering are drilled in the intermediate prepreg PP2 area corresponding to the bottom side of the buried copper block; The intermediate prepreg PP2 is processed in sequence of cutting → pasting tape → drilling → plugging holes with copper paste → auxiliary material matching.

[0018] Furthermore, the number of layers of the printed circuit board is 4-20.

[0019] In a second aspect, the present invention provides a PCB combined board, which is manufactured by the above-mentioned copper paste sintering buried copper block printed circuit board processing method.

[0020] The beneficial effects of the present invention are: In the present invention, the buried copper blocks of the circuit board are processed by three pressing methods. First, the upper material is prepared, and the buried copper holes corresponding to the buried copper blocks are respectively cleaned and pinned on the front plug-in layer board CS and the inner layer boards corresponding to the upper layers; and the upper semi-cured sheet is processed, and the buried copper holes corresponding to the buried copper blocks are milled on all the upper semi-cured sheets; then, the upper layer is pressed to form an upper pressed part; then, the lower material is prepared, the lower semi-cured sheet is processed, and the lower layer is pressed to form a lower pressed part; and the middle semi-cured sheet material is prepared, and the middle semi-cured sheet is superimposed between the upper pressed part and the lower pressed part, and a plurality of drill holes for plugging buried copper paste for sintering processing are drilled in the middle semi-cured sheet area corresponding to the bottom side of the buried copper block; finally, the upper and lower layers are pressed to form a multi-layer circuit board, so that the buried copper blocks can be interconnected and conductively connected to any inner layer through the sintering of the copper paste in the drilled holes.

[0021] The overall processing method is simple to operate, and realizes the interconnection between the buried copper block board and any layer of the inner layer pattern. The flatness of the buried copper block board is ensured by half-burying the copper block, and the buried copper block is connected to the inner layer pattern by sintering the copper paste, which can achieve good electrical and mechanical connections and improve the reliability of the printed circuit board. More wiring can be achieved in a limited space, which improves the integration of the printed circuit board. Moreover, the buried copper block has good thermal conductivity, which can effectively dissipate the heat generated by the electronic components, and improve the stability and reliability of electronic products.

[0022] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the enlarged structure of the copper-embedded plate body of the corresponding six-layer circuit board in the present invention; Figure 2 It is an electron microscopic enlarged schematic diagram of the cross-sectional structure of the buried copper block corresponding to the local situation when the copper paste is sintered to interconnect the inner layer in the buried copper block printed circuit board of the present invention. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] In the description of the present invention, the meaning of "several" is one or more, the meaning of "more" is two or more, and the meanings of "greater than", "less than", "exceed" and the like are understood as not including the number itself, and the meanings of "above", "below", "within" and the like are understood as including the number itself. If the terms "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0026] In addition, if there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0027] In addition, in the description of the present invention, unless otherwise clearly defined, the words such as setting, installing, connecting, etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above words in the present invention can be reasonably determined in combination with the specific content of the technical solution.

[0028] A method for processing a copper paste sintered copper block printed circuit board, such as Figure 1 and Figure 2As shown, the processing method of the copper paste sintered copper block printed circuit board comprises the following steps: S1. Preparation of upper materials: Prepare the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2, the third inner layer board L3 and the buried copper block M required for burying copper; The front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3 are respectively processed by cutting → internal light imaging → inner layer etching inspection → punching → milling → matching center → browning; In the milling process, buried copper holes corresponding to buried copper blocks are respectively cleaned and pinned on the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3; S2. Treatment of upper prepreg: The upper prepreg sheet PP1 corresponding to the upper layer is cut → milled → auxiliary materials are processed in sequence; When milling holes on the upper prepreg PP1, the buried copper holes corresponding to the buried copper blocks are respectively cleaned and pinned; S3, upper layer lamination: Align the slots on the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3 with the upper prepreg PP1, and embed the buried copper block M in the slots, and then perform lamination → copper reduction → drilling → copper deposition / board plating → resin plugging → solder mask post-baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing in sequence to form the upper layer pressed parts; S4. Preparation of lower layer materials: Prepare the back welding layer plate SS, the fourth inner layer plate L4, the fifth inner layer plate L5 and the sixth inner layer plate L6; The back welding layer plate SS, the fourth inner layer plate L4, the fifth inner layer plate L5 and the sixth inner layer plate L6 are respectively processed by cutting → internal light imaging → inner layer etching inspection → punching → matching center → browning; S5. Processing of lower prepreg: Cut the corresponding lower prepreg PP3 in turn → process the auxiliary materials; S6, lower layer lamination: Align the holes on the back welding layer SS, the fourth inner layer L4, the fifth inner layer L5, the sixth inner layer L6 and the lower prepreg PP3, and perform lamination → copper reduction → drilling → copper deposition / board plating → resin plugging → solder mask baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing in sequence to form the lower layer pressed parts; S7. Preparation of the intermediate prepreg material between the upper and lower layers: An intermediate prepreg PP2 for bonding the upper and lower layers is stacked between the corresponding upper and lower laminates, and a plurality of evenly distributed drill holes Z for plugging copper paste for sintering are drilled in the intermediate prepreg PP2 area corresponding to the bottom side of the buried copper block M; The middle prepreg PP2 is cut → tape applied → drilling → copper paste plugging → auxiliary material processing in sequence; S8, lamination of upper and lower layers: The upper laminate, the middle prepreg and the lower laminate are stacked in sequence, and a complete PCB is finally obtained by lamination → drilling → copper deposition / board plating → resin plugging → solder mask baking → ceramic grinding → copper reduction → drilling → copper deposition / board plating → following the normal process, and a multi-layer circuit board is formed by lamination; In this embodiment, the buried copper block of the circuit board is processed by three pressing methods, and the copper paste is inserted through the drilled hole of the intermediate semi-cured sheet, and the buried copper block is connected to the inner layer by sintering the copper paste in the drilled hole. The overall processing method is simple to operate, and realizes the interconnection between the buried copper block board and any layer of the inner layer pattern. The flatness of the buried copper block board is ensured by half-burying the copper block, and the buried copper block is connected to the inner layer pattern by sintering the copper paste, which can achieve good electrical and mechanical connections and improve the reliability of the printed circuit board. More wiring can be achieved in a limited space, and the integration of the printed circuit board is improved. In addition, the buried copper block has good thermal conductivity, which can effectively dissipate the heat generated by the electronic components, thereby improving the stability and reliability of the electronic product.

[0029] The above-described embodiments are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Except for the cases listed in the specific embodiments, all equivalent changes made according to the methods and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for processing a copper paste sintered copper block printed circuit board, characterized in that: The processing method comprises the following steps: S1. Preparation of upper materials: Prepare the front plug-in layer board CS, the inner layer boards corresponding to the upper layers, and the buried copper blocks required for burying copper, perform milling on the front plug-in layer board CS and the inner layer boards corresponding to the upper layers, and wash and pin the buried copper holes corresponding to the buried copper blocks; S2. Treatment of upper prepreg: When milling holes on all upper prepregs, wash and pin the buried copper holes corresponding to the buried copper blocks; S3, upper layer lamination: align the slots on the front plug-in layer board CS, the inner layer boards corresponding to each upper layer, and all the upper prepregs, and embed copper blocks in the slots and then press them together to form an upper layer lamination; S4, lower layer material preparation: prepare the back welding layer plate SS, the inner layer plates corresponding to each layer of the lower layer, and perform punching processing; S5, lower prepreg treatment; S6, lower layer lamination: align the back welding layer plate SS, the inner layer plates corresponding to each layer of the lower layer, and the grooves or holes on all the lower prepregs, and press them to form a lower layer lamination; S7, preparation of the intermediate prepreg material between the upper and lower layers: an intermediate prepreg is stacked between the upper laminate and the lower laminate, and a plurality of holes for embedding copper slurry for sintering are drilled in the intermediate prepreg area corresponding to the bottom side of the buried copper block; S8, lamination of the upper and lower layers: the upper lamination piece, the middle prepreg and the lower lamination piece are stacked in sequence, and finally a complete PCB board is obtained by lamination; the buried copper block is connected to the inner layer by sintering the copper paste in the drilled hole, and the buried copper block is connected by sintering the copper paste to realize the interconnection of any inner layer.

2. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: Step S1 specifically also includes: cutting the front plug-in layer board CS and the inner layer boards corresponding to the upper layers respectively → internal light imaging → inner layer etching inspection → punching → milling → matching center → browning processing.

3. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: Step S2 specifically also includes: respectively cutting, milling and processing all the upper prepreg sheets stacked on the upper layer in sequence.

4. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: Step S3 specifically also includes: aligning the slots on the front plug-in layer board CS, the inner layer boards corresponding to the upper layers, and all the upper semi-cured sheets, and embedding the buried copper blocks in the slots, and then laminating → reducing copper → drilling → copper sinking / board plating → resin plugging → post-solder mask baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing to form an upper layer pressed part.

5. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: Step S4 specifically also includes: cutting the back welding layer plate SS and the inner layer plates corresponding to the lower layers respectively → internal light imaging → inner layer etching inspection → punching → matching center → browning processing.

6. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: Step S6 specifically also includes: aligning the grooves or holes on the back welding layer board SS, the inner layer boards corresponding to each lower layer, and all the lower semi-cured sheets, and sequentially performing lamination → copper reduction → drilling → copper deposition / board plating → resin plugging → post-solder mask baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing to form a lower layer laminate.

7. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: Step S8 specifically also includes: stacking the upper laminate, the middle prepreg and the lower laminate in sequence, and finally obtaining a complete PCB through lamination → drilling → copper deposition / board plating → resin plugging → solder mask baking → ceramic grinding → copper reduction → drilling → copper deposition / board plating → subsequent normal process.

8. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: Step S1, step S2 and step S3 specifically include: S1. Preparation of upper materials: Prepare the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2, the third inner layer board L3 and the buried copper blocks required for burying copper; The front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3 are respectively processed by cutting → internal light imaging → inner layer etching inspection → punching → milling → matching center → browning; In the milling process, buried copper holes corresponding to buried copper blocks are respectively cleaned and pinned on the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3; S2. Treatment of upper prepreg: The upper prepreg sheet PP1 corresponding to the upper layer is cut → milled → auxiliary materials are processed in sequence; When milling holes on the upper prepreg PP1, the buried copper holes corresponding to the buried copper blocks are respectively cleaned and pinned; S3, upper layer lamination: Align the slots on the front plug-in layer board CS, the first inner layer board L1, the second inner layer board L2 and the third inner layer board L3 and the upper semi-cured sheet PP1, and embed the buried copper blocks in the slots, and then perform lamination → copper reduction → drilling → copper deposition / board plating → resin plugging → post-solder mask baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing in sequence to form the upper layer pressed parts.

9. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: Step S4, step S5, step S6 and step S7 specifically include: S4. Preparation of lower layer materials: Prepare the back welding layer plate SS, the fourth inner layer plate L4, the fifth inner layer plate L5 and the sixth inner layer plate L6; The back welding layer plate SS, the fourth inner layer plate L4, the fifth inner layer plate L5 and the sixth inner layer plate L6 are respectively processed by cutting → internal light imaging → inner layer etching inspection → punching → matching center → browning; S5. Processing of lower prepreg: Cut the corresponding lower prepreg PP3 in turn → process the auxiliary materials; S6, lower layer lamination: Align the holes on the back welding layer SS, the fourth inner layer L4, the fifth inner layer L5, the sixth inner layer L6 and the lower prepreg PP3, and perform lamination → copper reduction → drilling → copper deposition / board plating → resin plugging → solder mask post-baking → ceramic grinding plate → tool matching → internal light imaging → inner layer etching inspection → punching → matching center → browning processing in sequence to form the lower layer pressed parts; S7. Preparation of the intermediate prepreg material between the upper and lower layers: An intermediate prepreg PP2 for bonding the upper and lower layers is stacked between the corresponding upper and lower laminates, and a plurality of evenly distributed holes for plugging copper paste for sintering are drilled in the intermediate prepreg PP2 area corresponding to the bottom side of the buried copper block; The intermediate prepreg PP2 is processed in sequence of cutting → pasting tape → drilling → plugging holes with copper paste → auxiliary material matching.

10. The method for processing a copper paste sintered copper block printed circuit board according to claim 1, characterized in that: The number of layers of the printed circuit board is 4-20.

11. A PCB bonding board, characterized in that: The PCB combined board is made by using a processing method for a copper paste sintered copper block printed circuit board according to any one of claims 1 to 10.

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