Light source device and projector

Abstract

A light source device is provided with: a light source unit (10); a heat dissipation unit (20) having a placement surface (21a) on which the light source unit is placed; a pressing member (40) that presses the light source unit against the placement surface; and a fixing part (50) that fixes the pressing member to the heat dissipation part in a state in which the light source part is pressed against the placement surface by the pressing member. The pressing member has a first positioning pin (41) inserted into a first positioning hole (13) formed in the light source unit, and a second positioning pin (42) inserted into a second positioning hole formed in the placement surface.

Description

Technical Field

[0001] The present disclosure relates to a light source device and a projector. Background Art

[0002] Patent Document 1 discloses a projector (projection type image display device) having a light source device having a light source unit (semiconductor laser). In the light source device of Patent Document 1, the light source unit is placed on a placement surface of a heat dissipation unit (holding unit). In addition, in the light source device of Patent Document 1, the light source unit is positioned on the placement surface using a positioning pin (protrusion) protruding from the placement surface.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2020-071379 Summary of the invention

[0006] [Problems to be Solved by the Invention]

[0007] However, when the placement surface of the heat dissipation unit is provided with projections such as positioning pins, the shape of the heat dissipation unit becomes complicated, and thus the manufacturing cost of the heat dissipation unit and the light source device including the heat dissipation unit increases.

[0008] In addition, when the light source unit is placed on the mounting surface after being inserted into the positioning pins protruding from the mounting surface of the heat dissipation unit, it is necessary to move the light source unit in a direction perpendicular to the mounting surface when removing the light source unit from the heat dissipation unit. However, if thermal conductive grease is interposed between the light source unit and the heat dissipation unit in order to efficiently release the heat of the light source unit to the heat dissipation unit, the surface tension of the grease acts between the light source unit and the mounting surface. Therefore, it is difficult to separate the light source unit from the mounting surface in a direction perpendicular to the mounting surface. That is, it is also difficult to remove the light source unit from the heat dissipation unit.

[0009] The present invention has been made in view of the above situation, and an object thereof is to provide a light source device and a projector, wherein the light source device can position a light source unit on a mounting surface while suppressing manufacturing costs and can easily remove the light source unit from a heat dissipation unit.

[0010] [Methods for solving the problem]

[0011] The first scheme of the present invention is a light source device, comprising: a light source unit; a heat dissipation unit having a mounting surface for mounting the light source unit; a pressing member for pressing the light source unit against the mounting surface; and a fixing unit for fixing the pressing member to the heat dissipation unit in a state where the light source unit is pressed against the mounting surface by the pressing member, the pressing member having a first positioning pin and a second positioning pin, the first positioning pin being inserted into a first positioning hole formed in the light source unit, and the second positioning pin being inserted into a second positioning hole formed on the mounting surface.

[0012] A second aspect of the present invention is a projector including the light source device.

[0013] [Effects of the invention]

[0014] According to the present invention, the light source unit can be positioned on the placement surface of the heat dissipation unit, the manufacturing cost of the light source device can be suppressed, and the light source unit can be easily removed from the heat dissipation unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a perspective view showing the appearance of a projector according to one embodiment of the present invention.

[0016] Figure 2 It means in Figure 1 A three-dimensional view of a projector in which an upper cover of a casing is removed.

[0017] Figure 3 Yes means Figure 2 A perspective view showing the positions of the light source device and the air supply fan on the bottom plate of the middle housing.

[0018] Figure 4 Yes means Figure 1~Figure 3 A three-dimensional diagram of the light source device and the air supply fan.

[0019] Figure 5 Yes means Figure 4 A cross-sectional view showing the relationship between the heat dissipation portion and the optical system unit in a light source device.

[0020] Figure 6 Yes means Figure 4 A cross-sectional view showing the relationship between the heat dissipation portion and the optical system unit in a light source device.

[0021] Figure 7 When viewed from the mounting surface Figure 4 A three-dimensional diagram of a state in which the heat dissipation part and the optical system unit are separated in a light source device.

[0022] Figure 8 Observe from other directions Figure 7 A three-dimensional diagram of the state.

[0023] Fig. 9 is Figure 7 A front view of a light source unit, a heat dissipation unit, and a pressing member as viewed from a mounting surface side in a light source device.

[0024] Fig.10 It means in Fig. 9 A cross-sectional view showing the relationship between the light source portion, the heat dissipation portion and the pressing member in the structure.

[0025] Fig.11 yes Fig.10 An enlarged view of part XI in FIG.

[0026] Fig.12 It means in Fig. 9 A cross-sectional view showing the relationship between the light source portion, the heat dissipation portion and the pressing member in the structure.

[0027] Fig.13 When viewed from the mounting surface Fig. 9 A three-dimensional diagram of a state in which a light source portion, a heat dissipation portion, and a pressing member are separated in a structure.

[0028] Fig.14 Observe from other directions Fig.13 A three-dimensional diagram of the state. DETAILED DESCRIPTION

[0029] Below, refer to Figure 1 to Figure 14 One embodiment of the present invention will be described.

[0030] like Figure 1~Figure 3 As shown, the projector 1 of this embodiment is a device that projects image light (image) onto a display surface such as a screen. The projector 1 includes a light source device 3 , an image light forming device 4 , a projection device 5 , a housing 6 , and a blower fan 9 .

[0031] The image light forming device 4 generates image light based on light output from the light source device 3 described later. Although not shown, the image light forming device 4 includes a light modulation element such as a DMD (Digital Micromirror Device) and a liquid crystal panel, and electronic components for controlling the light modulation element.

[0032] The projection device 5 enlarges the image light output from the image light forming device 4 and projects the enlarged image light onto a display surface such as a screen.

[0033] The housing 6 accommodates the light source device 3, the image light forming device 4, the projection device 5, and the air supply fan 9. The housing 6 includes: a bottom plate portion 61 on which the light source device 3, the image light forming device 4, the projection device 5, and the air supply fan 9 are placed; and an upper cover 62 that covers the light source device 3, the image light forming device 4, the projection device 5, and the air supply fan 9 from above.

[0034] like Figure 4 , Figure 7 As shown, the light source device 3 includes a light source section 10 , a heat dissipation section 20 , an optical system unit 30 , and a pressing member 40 .

[0035] The light source unit 10 emits light. Figure 7 , Fig. 9 As shown, the light source device 3 of this embodiment includes a plurality of light source units 10. Figure 9~Figure 13 As shown, each light source unit 10 includes a substrate 11 and a light emitting element 12 mounted on the substrate 11 .

[0036] The light emitting element 12 may be, for example, an LED (Light Emitting Diode) or the like, but in the present embodiment, it is a laser diode. That is, the light source unit 10 of the present embodiment is a laser substrate. The light emitting element 12 may be, for example, a blue semiconductor element that emits a laser in a blue wavelength band, or a red semiconductor element that emits a laser in a red wavelength band. The heat resistance temperature of the blue semiconductor element is relatively high, and the heat generation is relatively large. The heat resistance temperature of the red semiconductor element is lower than that of the blue semiconductor element, and the heat generation is small. The number of light emitting elements 12 provided in the light source unit 10 may be two as shown in the example in the figure, but is not limited thereto.

[0037] like Fig. 9 , Fig.13 , Fig.14 As shown, the heat dissipation portion 20 is used to cool the light source portion 10 , and includes a heat dissipation plate portion 21 , a plurality of heat dissipation fins 22 and an extended heat dissipation portion 24 .

[0038] like Figure 9~Figure 13 As shown, the heat sink portion 21 is formed substantially flat and has a mounting surface 21a on which a plurality of light source portions 10 are mounted. Specifically, the substrate 11 of the light source portion 10 is overlapped and arranged on the mounting surface 21a. The substrate 11 may be in direct contact with the mounting surface 21a, but, for example, heat conductive grease may be interposed between the substrate 11 and the mounting surface 21a to improve heat transfer from the substrate 11 to the heat sink portion 21. The heat sink portion 21 is made of a material having high electrical conductivity, such as copper or aluminum.

[0039] exist Figure 4~Figure 14 In the figure, the X-axis direction represents a first direction along the mounting surface 21a of the heat dissipation plate portion 21, and the Y-axis direction represents a second direction along the mounting surface 21a that is orthogonal to the first direction. In addition, the Z-axis direction represents an orthogonal direction orthogonal to the mounting surface 21a. The Z-axis direction corresponds to the plate thickness direction of the heat dissipation plate portion 21.

[0040] like Fig. 9 , Fig.13As shown, in this embodiment, the number of light source units 10 placed on the placement surface 21a of the heat sink portion 21 is four. In addition, these four light source units 10 are placed on the placement surface 21a in a manner that two are arranged in the first direction and two are arranged in the second direction. In addition, the number of light source units 10 placed on the placement surface 21a and the arrangement of the plurality of light source units 10 (for example, the number of light source units 10 arranged in the first direction and the second direction, respectively) may be arbitrary.

[0041] like Figure 6 As shown in FIG. 1 , the heat sink 21 of the present embodiment has a plurality of recessed portions 211 formed therein, which are recessed from the back surface 21b of the heat sink 21 in the plate thickness direction toward the side opposite to the mounting surface 21a. In addition, a plurality of through holes 212 are formed in the heat sink 21, which penetrate from the bottom surface of each recessed portion 211 to the mounting surface 21a. Fixing screws 60 for fixing the optical system unit 30 described later to the heat sink are inserted through each through hole 212 from the back surface 21b side.

[0042] like Figure 6 , Fig.13 , Fig.14 As shown, a plurality of heat sinks 22 are provided on the back side 21b of the heat sink portion 21. The plurality of heat sinks 22 are respectively formed into a plate shape with a first direction (X-axis direction) along the mounting surface 21a of the heat sink portion 21 as a thickness direction, and are arranged at intervals in the first direction. The plurality of heat sinks 22 protrude only to one side (Y-axis negative direction side) of the heat sink portion 21 in the second direction (Y-axis direction), but may protrude to both sides of the heat sink portion 21, or may not protrude.

[0043] The plurality of heat sinks 22 provided on the back surface 21 b of the heat sink portion 21 are formed avoiding a portion of the back surface 21 b so that the recessed portions 211 and the through holes 212 of the heat sink portion 21 are exposed on the back surface 21 b side.

[0044] like Fig. 9 , 13 As shown in FIG. 14 , the extended heat dissipation portion 24 is located on both sides of the heat dissipation plate portion 21 in the first direction. In addition, the extended heat dissipation portion 24 may be located only on one side of the heat dissipation plate portion 21 in the first direction, for example.

[0045] The extended heat dissipation portion 24 includes a heat pipe 241 and a plurality of heat dissipation fins 242 attached to the heat pipe 241. The heat pipe 241 penetrates the heat dissipation plate portion 21 in the first direction and extends from both ends of the heat dissipation plate portion 21. A plurality of heat pipes 241 (seven in the example shown) are arranged in the second direction.

[0046] The plurality of heat sinks 242 of the extended heat sink 24 are respectively formed into a plate shape with the first direction as the thickness direction. The plurality of heat sinks 242 are arranged at intervals along the first direction on both sides of the heat sink 21 in the first direction. The heat pipe 241 is installed on the plurality of heat sinks 242 in a manner that penetrates the heat sink 242 in the thickness direction thereof.

[0047] In the heat dissipation section 20, by causing air to flow in a direction orthogonal to the plurality of heat dissipation fins 22 and the extended heat dissipation section 24 (Z-axis direction), air can flow between adjacent heat dissipation fins 22 and 242. Thus, it is possible to dissipate heat transferred from the plurality of light source sections 10 to the heat dissipation fins 22 via the heat dissipation plate section 21 and to the plurality of heat dissipation fins 242 via the heat dissipation plate section 21 and the heat pipe 241, that is, it is possible to cool the plurality of light source sections 10.

[0048] like Figure 9~Figure 14 As shown, the pressing member 40 presses the light source unit 10 onto the mounting surface 21a of the heat sink unit 21. In this embodiment, the pressing member 40 presses the plurality of light source units 10 onto the mounting surface 21a. In addition, the pressing member 40 does not press the light emitting element 12 of each light source unit 10 onto the mounting surface 21a, but presses the substrate 11 of each light source unit 10 onto the mounting surface 21a. The pressing member 40 has a first positioning pin 41 and a second positioning pin 42.

[0049] like Fig.10 , 11 14, the first positioning pin 41 is inserted into the first positioning hole 13 formed in the light source unit 10. In this embodiment, the first positioning hole 13 is formed to penetrate the substrate 11 in the thickness direction of the substrate 11. In addition, the first positioning hole 13 may not penetrate the substrate 11, for example.

[0050] The first positioning pin 41 protrudes from the surface of the pressing member 40 pressed against the substrate 11. The first positioning pin 41 may be formed in a columnar shape, for example, but is formed in a hemispherical shape in the present embodiment. The radius of the first positioning pin 41 formed in a hemispherical shape is smaller than the thickness of the substrate 11. Thus, the first positioning pin 41 inserted into the first positioning hole 13 of the substrate 11 can be prevented from penetrating the substrate 11 and protruding to the outside of the substrate 11.

[0051] The number of first positioning pins 41 for the same light source unit 10 can be, for example, three or more, but in the present embodiment, two are provided. By providing a plurality of first positioning pins 41 corresponding to the same light source unit 10, it is possible to suppress or prevent the light source unit 10 pressed by the pressing member 40 on the mounting surface 21a from rotating and shifting in position.

[0052] The number of first positioning pins 41 formed on the pressing member 40 corresponds to the number of light source units 10 pressed against the mounting surface 21a by the pressing member 40. The number of first positioning pins 41 in the pressing member 40 shown in the figure is twice the number of light source units 10.

[0053] like Fig. 9 , 12 As shown in FIGS. 1 and 13 , the second positioning pin 42 is inserted into the second positioning hole 213 formed on the mounting surface 21a of the heat sink 21. The number of the second positioning pins 42 and the second positioning holes 213 corresponding thereto may be, for example, three or more, but in the present embodiment, two are used. By using a plurality of second positioning pins 42, it is possible to suppress or prevent the pressing member 40 from being displaced relative to the mounting surface 21a of the heat sink 21. Fig.13 , Fig.14 As shown, the second positioning hole 213 and the second positioning pin 42 corresponding thereto are circular in shape when viewed from the mounting surface 21 a side.

[0054] The second positioning pins 42 are located outside the region where the plurality of light sources 10 are placed on the placement surface 21a of the heat sink 21. Specifically, the two second positioning pins 42 are located on both sides of the plurality of light sources 10 placed on the placement surface 21a in the first direction (X-axis direction) along the placement surface 21a.

[0055] like Fig. 9 , 12 As shown in Figures 13, the pressing member 40 is fixed to the heat sink portion 21 (heat sink portion 20) by the fixing portion 50 in a state where the light source portion 10 is pressed against the mounting surface 21a by the pressing member 40. In the present embodiment, the fixing portion 50 is an external thread that is screwed with the internal thread 215 formed on the heat sink portion 21 in a state where the pressing member 40 and the substrate 11 of the light source portion 10 are sandwiched between the mounting surface 21a. In the illustrated example, the number of fixing portions 50 corresponding to each light source portion 10 is two, but is not limited thereto, and may be, for example, more than three, or may be one. In the case where the number of fixing portions 50 corresponding to the same light source portion 10 is plural, the light source portion 10 pressed by the pressing member 40 can be stably fixed to the heat sink portion 21.

[0056] Furthermore, the plurality of fixing portions 50 corresponding to the same light source unit 10 penetrate the same light source unit 10. Thus, it is possible to suppress or prevent the fixing of the light source unit 10 by the plurality of fixing portions 50 from being accidentally released.

[0057] In addition, the number of the fixing portions 50 corresponding to the same light source unit 10 is the same as the number of the first positioning pins 41 of the pressing member 40 corresponding to the same light source unit 10. Furthermore, the plurality of fixing portions 50 corresponding to each light source unit 10 (specified light source unit 10) are respectively arranged adjacent to the plurality of first positioning pins 41 corresponding to each light source unit 10. In the illustrated example, the fixing portions 50 and the first positioning pins 41 corresponding to each other are adjacent in the first direction (X-axis direction).

[0058] like Fig. 9 , Fig.12 As shown, the pressing member 40 is provided so as to sandwich the light source unit 10 between the mounting surface 21a of the heat sink portion 21, but does not block the light emitted from the light emitting element 12 of the light source unit 10. Specifically, the pressing member 40 is provided with an exposing hole 43 for exposing the light emitting element 12 in a direction away from the mounting surface 21a (Z-axis positive direction).

[0059] It is preferable to set the thermal conductivity of the pressing member 40 in consideration of the heat resistance temperature and the heat generation amount of the light emitting element 12 of the light source unit 10 .

[0060] For example, when the light emitting element 12 has a high heat resistance temperature (for example, higher than the temperature in the housing 31 of the optical system unit 30 described later) and generates a large amount of heat, such as a blue semiconductor element, it is preferred that the thermal conductivity of the pressing member 40 is high. That is, the pressing member 40 is preferably made of a material with high thermal conductivity, such as copper or aluminum. Due to the high thermal conductivity of the pressing member 40, the heat of the light emitting element 12 can be applied to the heat dissipation portion 20 and released to the pressing member 40, and diffused from the pressing member 40 to the space on the side of the mounting surface 21a of the heat dissipation plate portion 21 (the space in the housing 31).

[0061] On the other hand, when the light emitting element 12 has a low heat resistance temperature (for example, lower than the temperature in the housing 31 of the optical system unit 30) and a small amount of heat generation, such as a red semiconductor element, it is preferable that the thermal conductivity of the pressing member 40 is low. For example, the thermal conductivity of the pressing member 40 is preferably lower than the thermal conductivity of the heat sink 21 (heat sink 20). The thermal conductivity of the pressing member 40 is preferably less than one tenth of the thermal conductivity of the heat sink 21, for example.

[0062] Specifically, when the heat dissipation plate portion 21 is copper (thermal conductivity λ = 380 W / (m·K)) or aluminum (thermal conductivity λ = 220 W / (m·K)), the pressing member 40 may be a resin material or stainless steel. Examples of the resin material include PC (polycarbonate; thermal conductivity λ = 0.2 to 0.4 W / (m·K)), PBT (polybutylene terephthalate; thermal conductivity λ = 0.2 to 0.4 W / (m·K)), PPS (polyphenylene sulfide; thermal conductivity λ = 0.2 to 0.4 W / (m·K)), and LCP (liquid crystal polymer; thermal conductivity λ = 0.3 to 0.6 W / (m·K)). In addition, examples of stainless steel include SUS304 (thermal conductivity λ = 16 W / (m·K)).

[0063] By making the thermal conductivity of the pressing member 40 lower than that of the heat dissipation plate portion 21, the heat of the light source portion 10 (light emitting element 12) can be actively released to the heat dissipation plate portion 21 side, and the heat of the space on the mounting surface 21a side (the space in the housing 31) can be suppressed from being transferred to the light source portion 10 via the pressing member 40. Thus, even if the temperature of the space on the mounting surface 21a side is higher than the heat resistance temperature of the light source portion 10, the pressing member 40 can thermally protect the light source portion 10.

[0064] like Figure 4~Figure 8 As shown, the optical system unit 30 is mounted on the mounting surface 21a of the heat sink 21 on which the light source 10 is arranged. The optical system unit 30 appropriately processes the light (blue light or red light) from the light source 10 and emits white light to the image light forming device 4. The optical system unit 30 includes a plurality of optical system components (not shown) for appropriately processing the light from the light source 10 and a housing 31 for housing these optical system components.

[0065] The housing 31 of the optical system unit 30 has an opening 32 for allowing light emitted from the light source section 10 to enter the interior of the housing 31. The edge 321 of the opening 32 of the housing 31 is in close contact with the area around the light source section 10 and the pressing member 40 in the mounting surface 21a. Specifically, an elastic body 33 such as an O-ring is provided at the edge 321 of the opening 32 of the housing 31. By pressing the elastic body 33 against the mounting surface 21a, the edge 321 of the opening 32 of the housing 31 can be in close contact with the mounting surface 21a without a gap. In a state where the edge 321 of the opening 32 of the housing 31 is in close contact with the mounting surface 21a, the light source section 10 mounted on the mounting surface 21a is covered by the housing 31. Thus, it is possible to suppress or prevent dust on the outside of the housing 31 from reaching the light source section 10.

[0066] like Figure 5 , Figure 7 , Figure 8As shown, the housing 31 has a third positioning pin 34 inserted into the third positioning hole 214 formed on the mounting surface 21a of the heat sink portion 21. The third positioning pin 34 is provided at the edge 321 of the opening 32 of the housing 31. The third positioning pin 34 is arranged on the inner side of the location where the elastic body 33 is provided in the edge 321 of the opening 32 in a manner not to interfere with the aforementioned elastic body 33. The number of the third positioning pins 34 and the third positioning holes 214 corresponding thereto may be, for example, three or more, but in the present embodiment, two. By making the number of the third positioning pins 34 plural, it is possible to suppress or prevent the optical system unit 30 including the housing 31 from being displaced relative to the mounting surface 21a of the heat sink portion 21.

[0067] like Figure 8 , Fig. 9 As shown, the shape of the third positioning hole 214 and the corresponding third positioning pin 34 observed from the side of the mounting surface 21a is circular. The shape of the third positioning hole 214 observed from the side of the mounting surface 21a is the same as the circular shape of the second positioning hole 213 described above, but the sizes of the second positioning hole 213 and the third positioning hole 214 are different from each other. In this embodiment, the size of the third positioning hole 214 is larger than the size of the second positioning hole 213, but it is not limited to this.

[0068] like Figure 6 , Figure 8 As shown in FIG. 1 , the housing 31 of the optical system unit 30 has an internal thread hole 35. A fixing screw 60 for fixing the housing 31 to the mounting surface 21a of the heat sink 21 is screwed into the internal thread hole 35. The internal thread hole 35 is arranged at a position that does not interfere with the installation position of the elastic body 33 and the third positioning pin 34 in the edge portion 321 of the opening 32 of the housing 31. By screwing the fixing screw 60 into the internal thread hole 35 of the housing 31 in a state where the heat sink 21 is sandwiched between the fixing screw 60 and the housing 31, the edge portion 321 of the opening 32 of the housing 31 can be kept in close contact with the mounting surface 21a.

[0069] like Figure 4 As shown, the air supply fan 9 is arranged to face the heat sink portion 21 via the plurality of heat sinks 22, and is also arranged to face the extended heat sink 24. The air supply fan 9 supplies air in the orthogonal direction (Z-axis direction) toward the plurality of heat sinks 22 and the extended heat sink 24. The air supply by the air supply fan 9 allows air to pass between adjacent heat sinks 22 and 24, thereby cooling the plurality of light source portions 10.

[0070] In the light source device 3 of the present embodiment and the projector 1 including the light source device 3, the light source unit 10 is positioned relative to the pressing member 40 by inserting the first positioning pin 41 of the pressing member 40 into the first positioning hole 13 of the light source unit 10. In addition, the pressing member 40 is positioned relative to the heat dissipation unit 20 by inserting the second positioning pin 42 of the pressing member 40 into the second positioning hole 213 of the heat dissipation unit 20. Thus, the light source unit 10 can be positioned relative to the mounting surface 21a of the heat dissipation unit 20 via the pressing member 40. Therefore, even if the heat dissipation unit 20 does not have a convex portion such as a positioning pin protruding from the mounting surface 21a, the light source unit 10 can be positioned at a predetermined position on the mounting surface 21a.

[0071] In a state where the pressing member 40 presses the light source unit 10 against the mounting surface 21 a of the heat dissipation unit 20 , the pressing member 40 is fixed to the heat dissipation unit 20 by the fixing unit 50 , thereby fixing the light source unit 10 to the mounting surface 21 a via the pressing member 40 .

[0072] Furthermore, since no projections such as positioning pins are formed on the mounting surface 21 a of the heat dissipation unit 20 , the shape of the heat dissipation unit 20 (particularly the shape of the mounting surface 21 a ) can be simplified. Therefore, the manufacturing cost of the light source device 3 including the heat dissipation unit 20 can be reduced.

[0073] In addition, the light source unit 10 is positioned on the mounting surface 21a of the heat dissipation unit 20 via the pressing member 40. Therefore, even if the light source unit 10 is arranged on the mounting surface 21a via the thermal conductive grease, the light source unit 10 can be easily removed from the heat dissipation unit 20. To explain this point, when the light source unit 10 is removed from the heat dissipation unit 20, after the pressing member 40 is removed from the heat dissipation unit 20, the light source unit 10 can be separated from the edge of the mounting surface 21a by moving along the mounting surface 21a. Therefore, even if the surface tension based on the thermal conductive grease acts between the light source unit 10 and the mounting surface 21a, the light source unit 10 can be easily removed from the heat dissipation unit 20.

[0074] In the light source device 3 of the present embodiment and the projector 1 including the light source device 3, the optical system unit 30 includes the third positioning pin 34 inserted into the third positioning hole 214 formed on the mounting surface 21a of the heat dissipation section 20. Thus, even if the positioning pin of the optical system unit 30 is not formed on the mounting surface 21a of the heat dissipation section 20, the optical system unit 30 can be positioned relative to the heat dissipation section 20.

[0075] In addition, in the light source device 3 of the present embodiment and the projector 1 including the light source device 3, the sizes of the second positioning hole 213 and the third positioning hole 214 as viewed from the mounting surface 21a side are different from each other. Thus, it is possible to suppress or prevent the second positioning pin 42 of the pressing member 40 and the third positioning pin 34 of the optical system unit 30 from being inserted into the second and third positioning holes 213 and 214 of the heat dissipation portion 20.

[0076] In addition, in the light source device 3 of the present embodiment and the projector 1 including the light source device 3, the pressing member 40 is configured to press the plurality of light source units 10 together on the mounting surface 21a. In addition, the pressing member 40 has a plurality of first positioning pins 41 corresponding to the plurality of light source units 10, respectively. Therefore, only one pressing member 40 is required for the plurality of light source units 10 mounted on the mounting surface 21a of the heat dissipation unit 20. Thus, the number of components of the light source device 3 can be reduced, and the manufacturing cost of the light source device 3 and the projector 1 can be reduced.

[0077] In addition, in the light source device 3 of the present embodiment and the projector 1 including the light source device 3, the first positioning pin 41 is formed in a hemispherical shape. Therefore, compared with the case where the first positioning pin 41 is formed in a columnar shape, even if the thickness of the substrate 11 (light source unit 10) is small, the first positioning pin 41 can be simply inserted into the first positioning hole 13 of the light source unit 10, and the light source unit 10 can be positioned with higher accuracy relative to the pressing member 40. Specifically, the first positioning pin 41 is guided to the inside of the first positioning hole 13 by the hemispherical surface of the first positioning pin 41, and the first positioning pin can be simply inserted into the positioning insertion hole. In addition, by making the aperture of the first positioning hole 13 correspond to the diameter of the hemispherical first positioning pin 41, the light source unit 10 can be positioned with high accuracy relative to the pressing member 40.

[0078] As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It can change suitably within the range which does not deviate from the summary.

[0079] In the present invention, for example, the shapes of the second positioning hole 213 and the third positioning hole 214 as viewed from the mounting surface 21a side may be different from each other, and the shapes and sizes of the second positioning hole 213 and the third positioning hole 214 as viewed from the mounting surface 21a side may be different from each other. Even with such a structure, as in the case of the above-mentioned embodiment, it is possible to suppress or prevent the second positioning pin 42 of the pressing member 40 and the third positioning pin 34 of the optical system unit 30 from being inserted into the second positioning hole 213 and the third positioning hole 214 of the heat dissipation portion 20.

[0080] [Explanation of Reference Numerals]

[0081] 1 Projector

[0082] 3 Light source device

[0083] 10 Light source

[0084] 13 First positioning hole

[0085] 20 Heat dissipation

[0086] 21 Radiator

[0087] 21a Loading surface

[0088] 213 Second positioning hole

[0089] 214 The third positioning hole

[0090] 30 Optical system unit

[0091] 31 Shell

[0092] 34 Third positioning pin

[0093] 40 Pressing member

[0094] 41 First positioning pin

[0095] 42 Second positioning pin

[0096] 50 Fixed part

Claims

1. A light source device, comprising: Light source department; A heat dissipation unit having a placement surface on which the light source unit is placed; A pressing member presses the light source portion onto the mounting surface; and a fixing portion, fixing the pressing member to the heat dissipation portion in a state where the light source portion is pressed to the mounting surface by the pressing member, The pressing member includes a first positioning pin and a second positioning pin. The first positioning pin is inserted into a first positioning hole formed in the light source portion, and the second positioning pin is inserted into a second positioning hole formed in the mounting surface.

2. The light source device according to claim 1, wherein: The heat dissipation portion does not have a convex portion protruding from the placement surface.

3. The light source device according to claim 1 or 2, wherein: The light source device includes an optical system unit that processes light emitted from the light source portion. The optical system unit includes a third positioning pin inserted into a third positioning hole formed in the mounting surface.

4. The light source device according to claim 3, wherein: The second positioning hole and the third positioning hole are different from each other in at least one of size and shape when viewed from the mounting surface side.

5. The light source device according to claim 3, wherein: The number of the third positioning pins is plural.

6. The light source device according to claim 1 or 2, wherein: The pressing member is configured to collectively press the plurality of light source units against the placement surface, and the pressing member includes a plurality of first positioning pins corresponding to the plurality of light source units, respectively.

7. The light source device according to claim 1 or 2, wherein: The first positioning pin is formed in a hemispherical shape.

8. The light source device according to claim 6, wherein: The light source unit comprises: a substrate formed with the first positioning hole; and a light emitting element mounted on the substrate. The radius of the first positioning pin is smaller than the thickness of the substrate.

9. The light source device according to claim 1 or 2, wherein: The thermal conductivity of the pressing member is lower than the thermal conductivity of the heat dissipating portion.

10. The light source device according to claim 1 or 2, wherein: There are plural first positioning pins corresponding to the same light source unit.

11. The light source device according to claim 1 or 2, wherein: The fixing portion sandwiches the pressing member and the light source portion between the fixing portion and the mounting surface. There are multiple fixing parts corresponding to the same light source part.

12. The light source device according to claim 11, wherein: The plurality of fixing portions corresponding to the same light source portion penetrate the same light source portion.

13. The light source device according to claim 11, wherein: The number of the first positioning pins corresponding to the same light source portion is the same as the number of the fixing portions. The plurality of first positioning pins corresponding to the prescribed light source units are respectively arranged adjacent to the plurality of fixing units corresponding to the prescribed light source units.

14. The light source device according to claim 1 or 2, wherein: The second positioning pin is located outside a region of the mounting surface where the light source unit is mounted.

15. The light source device according to claim 1 or 2, wherein: The number of the second positioning pins is plural.

16. A projector comprising the light source device according to claim 1 or 2.

Images