Glue defoaming device and method

Abstract

The invention discloses a glue defoaming device and method, and relates to the technical field of PCB defoaming, the glue defoaming device comprises a rack, and a feeding transmission mechanism and a vacuum transmission mechanism arranged on the rack; a preheating mechanism is arranged at the position, corresponding to the feeding conveying mechanism, of the rack, and a vacuum heating mechanism is arranged at the position, corresponding to the vacuum conveying mechanism, of the rack. The preheating mechanism comprises a preheating box body and a plurality of groups of first heating units arranged in the preheating box body; the vacuum heating mechanism comprises a vacuum heating box arranged at the upper end of the rack, a lifting assembly used for driving the vacuum heating box to ascend and descend, a vacuumizing assembly arranged on the rack and a plurality of second heating units. A visual inspection mechanism is further arranged at the upper end of the vacuum heating box body; the bubble removing efficiency is improved, and the bubble removing effect is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field related to PCB board degassing, and in particular to a glue degassing device and method. Background Art

[0002] In the electronics manufacturing industry, the assembly process of PCB (printed circuit board) usually includes multiple steps, among which SMT (surface mount technology) and DIP (dual in-line package) are two common assembly methods.

[0003] In the production process of PCBA boards, when glue is coated or sprayed onto the PCBA boards, low-viscosity glue is prone to bubbles in the glue layer, affecting the coating quality. Therefore, the PCBA boards need to be debubbled, mainly by using high pressure and high temperature to eliminate the bubbles in the glue layer of the PCBA boards. At present, traditional debubbling machines require manual placement of the PCBA boards in a pressurized cavity, pressurizing and heating the air in the cavity to eliminate the bubbles on the glue layer of the PCBA boards, and then taking out the PCBA boards after the elimination is completed.

[0004] The patent document with patent number CN110876860B discloses a vacuum debubbling machine, including a frame and a loading module, a unloading module, a vertical motion module and two laterally arranged vacuum heating modules fixed on the frame. The loading module and the unloading module are respectively arranged on the front and rear sides of the two vacuum heating modules, and the vertical motion module is arranged between the two laterally arranged vacuum heating modules. The loading module includes a first conveying mechanism and a first lateral motion module. The vacuum heating module includes a vacuum chamber and a heating box. The heating box is provided with a heating assembly and a second conveying mechanism. The unloading module includes a third conveying mechanism and a second lateral motion module. A double vacuum heating module is used to debubble the PCBA board, with high working efficiency and a high degree of automation, which greatly reduces manual operation and further improves the product yield.

[0005] However, during actual use, the inventors found that the above-mentioned vacuum degassing machine had low degassing efficiency and poor degassing effect during actual use, and further improvement is still needed. Summary of the invention

[0006] In order to solve the defects of the prior art, the present invention provides a glue degassing device and method.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: The present invention provides a glue degassing device, comprising: A frame and a feeding conveying mechanism and a vacuum conveying mechanism arranged on the frame; The frame is provided with a preheating mechanism at a position corresponding to the feeding conveying mechanism, and the frame is provided with a vacuum heating mechanism at a position corresponding to the vacuum conveying mechanism; The preheating mechanism comprises a preheating box and a plurality of first heating units arranged inside the preheating box; The vacuum heating mechanism comprises a vacuum heating box disposed at the upper end of a frame, a lifting assembly for driving the vacuum heating box to rise and fall, a vacuum pumping assembly disposed on the frame, and a plurality of groups of second heating units; The upper end of the vacuum heating box is also provided with a visual detection mechanism.

[0008] As a preferred technical solution of the present invention, the vacuum conveying mechanism comprises: A fixed plate and a movable plate, wherein the fixed plate and the movable plate are arranged on the frame and are arranged opposite to each other; The transmission belts are provided in two groups and are respectively arranged on the fixed plate and the movable plate, and the two groups of the transmission belts are driven by a transmission rod arranged between the fixed plate and the movable plate; A transmission drive unit, fixedly disposed on one side of the fixed plate and drivingly connected to one of the groups of transmission belts; And width adjustment components.

[0009] As a preferred technical solution of the present invention, the width adjustment component includes a width adjustment drive unit fixedly arranged on one side of the fixed plate and a threaded rod which is transmission-arranged with the width adjustment drive unit and one end of which is rotationally connected to the fixed plate, and the threaded rod is threadedly transmission-connected to the movable plate.

[0010] As a preferred technical solution of the present invention, the lifting assembly includes: A lifting unit, arranged at the lower end of the frame; A hydraulic rod, connected to the lifting unit and having the other end connected to the vacuum heating box; The guide rods are provided in several groups and are fixedly arranged on the frame. The outer side of the vacuum heating box is slidably connected with the guide rods through several groups of sleeves.

[0011] As a preferred technical solution of the present invention, a vibration mechanism is further provided at the upper end of the frame at a position corresponding to the vacuum conveying mechanism, and the vibration mechanism is used to shake the PCB board placed on the transmission belt.

[0012] As a preferred technical solution of the present invention, the vibration mechanism includes: A vibration driving unit, arranged on the frame; A transmission wheel, connected to the vibration drive unit through a transmission belt; A supporting plate is provided in a plurality of groups and is fixedly arranged on the frame, and the transmission wheel is rotatably arranged on the supporting plate; A bevel gear pair, disposed on the support plate and drivingly connected to the transmission wheel; A rotating rod is rotatably arranged on the supporting plate and is provided with a plurality of groups of cams abutting against the lower end surface of the PCB board.

[0013] As a preferred technical solution of the present invention, the fixed plate and the movable plate are both provided with a buffer assembly on the side close to the PCB board, which includes a mounting plate fixedly connected to the fixed plate or the movable plate, a plurality of groups of buffer springs fixedly arranged at the lower end of the mounting plate, and a pressure block fixedly connected to the buffer spring.

[0014] The invention also discloses a glue degassing method, comprising the following steps: Step 1: Loading process, placing the PCB board that has been coated with glue on the feeding conveyor mechanism to complete the loading process; Step 2: preheating process, controlling the first heating unit to work and preheating the PCB board; Step 3: Transfer process, controlling the PCB board to be transferred from the feeding conveyor mechanism to the vacuum conveyor mechanism; Step 4: Vacuum heating process, first control the lifting component to work and drive the vacuum heating box to descend and seal with the frame, then control the vacuum assembly and the second heating unit to work to complete the vacuuming and secondary heating work.

[0015] As a preferred technical solution of the present invention, the heating temperature of the first heating unit in the preheating process is 30°C-80°C, and the preheating time is 1min-40min. The heating temperature of the second heating unit in the vacuum heating process is 40°C-80°C, and the vacuum heating time is 1min-80min.

[0016] As a preferred technical solution of the present invention, the vacuuming component in step 4 works in a step-by-step vacuuming manner.

[0017] The beneficial effects of the present invention are: 1. In the present invention, a preheating mechanism is provided in conjunction with a vacuum heating mechanism. Before the PCB board is vacuum heated for degassing, a preheating treatment is performed first, which can significantly reduce the viscosity of the glue, so that the fluidity of the glue on the board is better, thereby facilitating the rise and dissipation of bubbles. By preheating in advance, the overall process of vacuum degassing is made more efficient, the required vacuum degree and time are reduced, and the degassing efficiency is improved and the degassing effect is guaranteed.

[0018] 2. In the present invention, a vibration mechanism is provided in conjunction with a vacuum heating mechanism. When the PCB board is subjected to a vacuum degassing process, the vibration mechanism can be controlled to work synchronously to drive the PCB board to shake slightly, thereby further improving the degassing efficiency and degassing effect.

[0019] 3. In the present invention, a vacuum pumping component is provided to work in a gradual vacuum pumping manner. The gradual vacuum pumping process can reduce the vacuum degree through multiple stages, gradually reducing from a high vacuum to the required design vacuum degree. This method can gradually diffuse the bubbles, thereby reducing the impact on the bubble discharge effect. This process not only effectively reduces the number of active bubbles, but also improves the overall quality of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 It is a schematic diagram of the local structure of the present invention.

[0022] Figure 3 It is another partial structural schematic diagram of the present invention.

[0023] Figure 4 It is a structural schematic diagram of the feed conveying mechanism.

[0024] Figure 5 It is a structural schematic diagram of the present invention from another angle.

[0025] Figure 6 It is a structural schematic diagram of the vacuum transmission mechanism.

[0026] Figure 7 for Figure 6 A local enlarged schematic diagram of point A in the middle.

[0027] Figure 8 Another structural schematic diagram of the vacuum transmission mechanism.

[0028] Fig. 9 for Figure 8 A local enlarged schematic diagram of point B in the middle.

[0029] Fig.10 It is a plan view of the vacuum conveying mechanism.

[0030] Fig.11 for Fig.10 A partial enlarged schematic diagram of point C in the middle.

[0031] Fig.12It is a structural schematic diagram of the vibration mechanism.

[0032] Fig.13 It is a process flow chart of the glue defoaming method of the present invention.

[0033] In the figure: 1. frame; 2. feeding conveying mechanism; 3. vacuum conveying mechanism; 31. fixed plate; 32. moving plate; 33. transmission belt; 34. transmission rod; 35. transmission drive unit; 36. width adjustment component; 361. width adjustment drive unit; 362. threaded rod; 4. preheating mechanism; 41. preheating box; 42. first heating unit; 5. vacuum heating mechanism; 51. vacuum heating box; 52. lifting component; 521. lifting unit; 522. hydraulic rod; 523. guide rod; 524. sleeve; 53. vacuum assembly; 54. second heating unit; 6. visual inspection mechanism; 7. vibration mechanism; 71. vibration drive unit; 72. transmission wheel; 73. transmission belt; 74. support plate; 75. bevel gear pair; 76. rotating rod; 77. cam; 8. buffer assembly; 81. mounting plate; 82. buffer spring; 83. pressing block. DETAILED DESCRIPTION

[0034] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0035] Embodiment 1 like Figure 1-Figure 5 As shown, a glue degassing device includes a frame 1 and a feeding conveying mechanism 2 and a vacuum conveying mechanism 3 arranged on the frame 1; the frame 1 is provided with a preheating mechanism 4 at a position corresponding to the feeding conveying mechanism 2, and the frame 1 is provided with a vacuum heating mechanism 5 at a position corresponding to the vacuum conveying mechanism 3; the preheating mechanism 4 includes a preheating box 41 and a plurality of first heating units 42 arranged inside the preheating box 41; the vacuum heating mechanism 5 includes a vacuum heating box 51 arranged at the upper end of the frame 1, a lifting component 52 for driving the vacuum heating box 51 to rise and fall, a vacuuming component 53 arranged on the frame 1, and a plurality of second heating units 54; the upper end of the vacuum heating box 51 is also provided with a visual inspection mechanism 6.

[0036] Among them, by arranging the preheating mechanism 4 in conjunction with the vacuum heating mechanism 5, a preheating treatment is performed before vacuum heating and degassing the PCB board, which can improve the degassing efficiency and ensure the degassing effect, which at least includes the following advantages: Reduce glue viscosity: Preheating can significantly reduce the viscosity of the glue, making the glue more fluid on the PCB board, thereby helping the bubbles to rise and dissipate. The reduction in viscosity makes it easier for bubbles to pass through the glue layer, which not only accelerates the escape of bubbles, but also reduces the defect rate of the final coating; Accelerate bubble release: When glue is heated, the solvent or volatile substances in it will be released more easily, which helps to release existing bubbles in advance, thus reducing the difficulty of vacuum degassing; Improve coating uniformity: Preheating helps the glue to have better fluidity, so that the glue can be more evenly coated on the PCB surface, avoiding local thick or thin areas, thereby improving the consistency of the coating; Improve degassing efficiency: By preheating, the overall vacuum degassing process is more efficient, reducing the required vacuum degree and time, and bubbles can be pulled out more quickly under higher temperature and lower viscosity conditions; Reduce the residual rate: During preheating, small bubbles in the glue are more easily released and discharged, which can effectively reduce the tiny bubbles remaining after coating, thereby improving the quality and reliability of the PCB; Relieve coating stress: Heating can promote glue film formation and balance temperature differences, reducing coating stress caused by temperature differences, which helps reduce problems such as cracking and peeling of the final coating; Improved adhesion: Proper thermal pretreatment can improve the adhesion between the glue and the PCB material, helping to ensure the durability of the glue in subsequent processes.

[0037] Optionally, the first heating unit 42 and the second heating unit 54 are heating rods, and electric energy is input into the heating rods through a heating element (such as a resistance wire). The current inside the heating element passes through the resistance element, and heat is generated according to Joule's law. The heating element converts the electric energy into thermal energy, and the heat is conducted to the outer shell of the heating rod through a heat-conducting material. The surface of the heating rod continues to heat up, and the heat is transferred to the surrounding air by convection or radiation, thereby heating the surrounding environment; The main component of the vacuum assembly 53 is a vacuum pump, and its specific structure will not be described in detail; The visual detection mechanism 6 mainly includes a light source and a camera lens.

[0038] It should be noted that, in order to facilitate observation of the temperature or vacuum degree inside the preheating mechanism 4 and the vacuum heating mechanism 5, it is necessary to respectively set a temperature probe inside the preheating mechanism 4 and the vacuum heating mechanism 5, and set a pressure gauge inside the vacuum heating mechanism 5; Optionally, a set of visual detection mechanisms 6 may be provided at the position of the frame 1 corresponding to the vacuum heating mechanism 5, for real-time observation of the discharge of colloid bubbles from the lower end surface of the PCB board; A camera assembly is also provided inside the preheating box 41 , and the camera assembly is used to monitor the PCB board inside the preheating box 41 .

[0039] Further, if Figure 3-Figure 8 As shown, the vacuum conveying mechanism 3 includes a fixed plate 31 and a movable plate 32, a transmission belt 33, a transmission rod 34, a transmission drive unit 35 and a width adjustment component 36, the fixed plate 31 and the movable plate 32 are arranged on the frame 1 and are arranged opposite to each other; there are two groups of transmission belts 33 and they are respectively arranged on the fixed plate 31 and the movable plate 32, and the two groups of transmission belts 33 are transmitted by the transmission rod 34 arranged between the fixed plate 31 and the movable plate 32; the transmission drive unit 35 is fixedly arranged on one side of the fixed plate 31 and is transmission-connected to one of the groups of transmission belts 33; the width adjustment component 36 includes a width adjustment drive unit 361 fixedly arranged on one side of the fixed plate 31 and a threaded rod 362 transmission-connected to the width adjustment drive unit 361 and one end of which is rotationally connected to the fixed plate 31, and the threaded rod 362 is threadedly transmission-connected to the movable plate 32.

[0040] Among them, the automatic transportation of PCB boards can be achieved by setting up the vacuum conveying mechanism 3.

[0041] In detail, the feed conveyor mechanism 2 and the vacuum conveyor mechanism 3 have the same structure, and the moving plate 32 in the feed conveyor mechanism 2 and the moving plate 32 in the vacuum conveyor mechanism 3 are arranged on the same side to facilitate the smooth transportation of the PCB board; When the PCB board is put into the feeding conveyor mechanism 2, the width adjustment component 36 is first controlled to work, and the width adjustment drive unit 361 works to drive the threaded rod 362 to rotate and then drive the movable plate 32 to move, thereby changing the spacing between the fixed plate 31 and the movable plate 32, until the PCB board can be stably prevented from being placed on the upper end of the transmission belt 33, and then the transmission drive unit 35 is controlled to work, and the transmission drive unit 35 drives one set of transmission belts 33 to rotate, and then drives the other set of transmission belts 33 to rotate through the transmission rod 34, thereby realizing the transportation of the PCB board; In this way, the automatic conveying of PCB boards is realized, and at the same time, it can also adapt to the conveying of PCB boards of different widths.

[0042] Further, if Figure 5As shown, the lifting assembly 52 includes a lifting unit 521, a hydraulic rod 522, a guide rod 523 and a sleeve 524. The lifting unit 521 is arranged at the lower end of the frame 1, and the lifting unit 521 can be optionally a cylinder; the hydraulic rod 522 is connected to the lifting unit 521 and the other end is connected to the vacuum heating box 51; the guide rod 523 is provided with a plurality of groups and is fixedly arranged on the frame 1, and the outer side of the vacuum heating box 51 is slidably connected to the guide rod 523 through a plurality of groups of sleeves 524.

[0043] Among them, by setting up the lifting component 52, the vacuum heating box 51 can be moved stably. When the lifting unit 521 is working, it can drive the hydraulic rod 522 to move stably inside the lifting unit 521 and then drive the vacuum heating box 51 to perform normal lifting work. The setting of multiple sets of sleeves 524 and guide rods 523 can further ensure the stability of the vacuum heating box 51 when moving.

[0044] Further, if Figure 6-Figure 12 As shown, a vibration mechanism 7 is further provided at the upper end of the frame 1 at a position corresponding to the vacuum conveying mechanism 3 , and the vibration mechanism 7 is used to shake the PCB board placed on the transmission belt 33 .

[0045] Among them, by setting up a vibration mechanism 7 to cooperate with the vacuum heating mechanism 5, when the PCB board is subjected to a vacuum degassing process, the vibration mechanism 7 can be controlled to work synchronously to drive the PCB board to shake slightly, which can further improve the degassing efficiency and degassing effect.

[0046] Further, if Figure 6-Figure 12 As shown, the vibration mechanism 7 includes a vibration drive unit 71, a transmission wheel 72, a transmission belt 73, a support plate 74, a bevel gear pair 75, a rotating rod 76 and a cam 77. The vibration drive unit 71 is arranged on the frame 1; the transmission wheel 72 is transmission-connected to the vibration drive unit 71 through the transmission belt 73; the support plate 74 is provided with a plurality of groups and is fixedly arranged on the frame 1, and the transmission wheel 72 is rotationally arranged on the support plate 74; the bevel gear pair 75 is arranged on the support plate 74 and is transmission-connected to the transmission wheel 72; the rotating rod 76 is rotationally arranged on the support plate 74 and the rotating rod 76 is provided with a plurality of groups of cams 77 abutting against the lower end surface of the PCB board; The fixed plate 31 and the movable plate 32 are both provided with a buffer assembly 8 on one side close to the PCB board, which includes a mounting plate 81 fixedly connected to the fixed plate 31 or the movable plate 32, a plurality of groups of buffer springs 82 fixedly arranged at the lower end of the mounting plate 81, and a pressing block 83 fixedly connected to the buffer spring 82.

[0047] In detail, when the vibration mechanism 7 is required to work, it is first necessary to ensure that the PCB board is moved to a suitable position, and the vacuum heating box 51 and the frame 1 are sealed, and then the vibration driving unit 71 is controlled to work. The vibration driving unit 71 will drive the transmission wheel 72 to rotate on the support plate 74 through the transmission belt 73. After the transmission wheel 72 rotates, it will synchronously drive the bevel gear pair 75 to work, and then drive the rotating rod 76 to rotate. After the rotating rod 76 rotates, it will drive multiple groups of cams 77 to rotate synchronously. When the cam 77 rotates, it will reciprocately touch the lower end surface of the PCB board, thereby causing the PCB board to shake; In order to prevent the cam 77 from interfering with components at the lower end of the PCB board, the rotating rod 76 and the cam 77 need to be arranged at one end close to the fixed plate 31 or the movable plate 32 .

[0048] It should be noted that the transmission drive unit 35, the width adjustment drive unit 361 and the vibration drive unit 71 are all motors; The PCB board is arranged between the multiple groups of pressing blocks 83 and the transmission belt 33. When the pressing block 83 is in a stationary state, it is necessary to ensure that the distance between the pressing block 83 and the transmission belt 33 is greater than or equal to the thickness of the PCB board. In order to facilitate the PCB board to quickly enter between the pressing block 83 and the transmission belt 33, a rounded corner can be provided on the pressing block 83; The bevel gear pair 75 is composed of two sets of bevel gears that cooperate with each other.

[0049] Embodiment 2 The components that are the same or corresponding to those in the first embodiment are marked with the same reference numerals as those in the first embodiment. For the sake of simplicity, only the differences from the first embodiment are described below. The second embodiment differs from the first embodiment in that: like Fig.13 As shown, the present invention also discloses a glue degassing method, comprising the following steps: Step 1: Loading process, placing the PCB board coated with glue on the feeding conveyor mechanism 2 to complete the loading process; Step 2: preheating process, controlling the first heating unit 42 to work and preheat the PCB board; Step 3: Transfer process, controlling the PCB board to be transferred from the feeding conveying mechanism 2 to the vacuum conveying mechanism 3; Step 4: Vacuum heating process, first control the lifting component 52 to work and drive the vacuum heating box 51 to descend and complete the sealing with the frame 1, and then control the vacuum assembly 53 and the second heating unit 54 to work to complete the vacuuming and secondary heating work.

[0050] The vacuuming component 53 in step 4 works by vacuuming step by step Among them, by setting up a secondary heating process and adopting a gradual vacuuming method, the bubble discharge efficiency and discharge effect are effectively improved.

[0051] The gradual vacuuming process can reduce the vacuum degree through multiple stages, gradually reducing from high vacuum to the required design vacuum degree. This method can gradually diffuse the bubbles, thereby reducing the impact on the bubble discharge effect. This process not only effectively reduces the number of active bubbles, but also improves the overall quality of the material. By gradually vacuuming, the diffusion and discharge of bubbles can be effectively controlled at each stage. This method of gradually reducing the vacuum degree avoids the glue coating defects that may be caused by the rapid expansion of bubbles due to the sudden rise in vacuum to the greatest extent. The time and vacuum degree of each stage can be fine-tuned according to the characteristics of the specific glue and the number of bubbles to achieve a better degassing effect.

[0052] In the preheating process, the heating temperature of the first heating unit 42 is 30°C-80°C, and the preheating time is 1min-40min. In the vacuum heating process, the heating temperature of the second heating unit 54 is 40°C-80°C, and the vacuum heating time is 1min-80min.

[0053] The specific heating temperature also depends on the type of glue used. For example, when using epoxy resin glue, the heating temperature is generally 60°C-70°C. The recommended preheating time is 10min-30min, which is enough time for the glue to be evenly heated and reduce the viscosity, and does not exceed the heat deformation temperature of the glue. The temperature of vacuum heating needs to be kept below the range of thermal deformation of the glue. The specific temperature setting may depend on the material and application. The vacuum heating time is generally 30min-60min, which varies according to the area and number of bubbles. A larger PCB area or more bubbles will require a longer time. In the actual degassing process, the visual inspection mechanism 6 can be combined to control the temperature and heating time of vacuum heating.

[0054] One working mode of the vacuum assembly 53 is given below: Preparation stage: In this stage, the vacuum equipment is adjusted and it is ensured that the vacuum heating box 51 and the frame 1 are sealed, and the air pressure inside the vacuum heating box 51 is the standard atmospheric pressure (760 mmHg); The first vacuuming stage: the vacuuming assembly 53 works for 2-5 minutes until the air pressure inside the vacuum heating box 51 is 500 mmHg, and the air is quickly evacuated to 500 mmHg to remove most of the gas in the atmosphere and reduce the formation of initial bubbles; Second vacuuming stage: the vacuuming assembly 53 works for 5-10 minutes until the air pressure inside the vacuum heating box 51 reaches 200 mmHg. Since bubbles are smaller under higher pressure, they will diffuse out relatively quickly. At this time, it is necessary to monitor the emergence of bubbles in combination with the visual detection mechanism 6; The third vacuuming stage: the vacuuming assembly 53 works for 5-20 minutes until the air pressure inside the vacuum heating box 51 reaches 100 mmHg. When the air pressure reaches 100 mmHg, the residual amount of bubbles is further reduced. At this time, the viscosity of the glue will gradually decrease, and the emergence of bubbles will be more obvious. Fourth vacuuming stage: the vacuuming assembly 53 works for 5-30 minutes until the air pressure inside the vacuum heating box 51 reaches 50 mmHg, close to the required vacuum degree, and small bubbles in the glue begin to have more opportunities to rise and escape, and the emergence of bubbles is continuously monitored; Fifth vacuuming stage: the vacuuming assembly 53 works for 5-30 minutes until the air pressure inside the vacuum heating box 51 reaches the final designed vacuum degree of 20 mmHg. Under this vacuum degree, the bubbles will basically rise and escape rapidly. This vacuum degree is maintained for a period of time to ensure that most of the bubbles are completely discharged; During the re-pressurization phase, atmospheric pressure can be slowly restored after the monitoring phase is completed. Rapid re-pressurization should be avoided to reduce the regeneration of bubbles.

[0055] In actual operation, the vacuum assembly 53 does not necessarily have to proceed to the fifth vacuum stage to expel all bubbles. Usually, all bubbles will be expelled in the third vacuum stage or the fourth vacuum stage. This is also due to the setting of the preheating mechanism 4. Therefore, during operation, it is necessary to combine the visual inspection mechanism 6 to monitor the bubble discharge situation on the PCB board in real time.

[0056] In addition, when it is difficult to discharge bubbles on some PCB boards, during the fifth vacuuming stage and pressure maintenance period, the vibration mechanism 7 can be controlled to work and cooperate with the vacuum heating mechanism 5 to eliminate the bubbles on the PCB board, thereby accelerating the efficiency of discharging bubbles on the PCB board.

[0057] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A glue degassing device, characterized in that: include: A frame (1), and a feeding conveying mechanism (2) and a vacuum conveying mechanism (3) arranged on the frame (1); The frame (1) is provided with a preheating mechanism (4) at a position corresponding to the feeding conveying mechanism (2), and the frame (1) is provided with a vacuum heating mechanism (5) at a position corresponding to the vacuum conveying mechanism (3); The preheating mechanism (4) comprises a preheating box (41) and a plurality of groups of first heating units (42) arranged inside the preheating box (41); The vacuum heating mechanism (5) comprises a vacuum heating box (51) arranged at the upper end of the frame (1), a lifting component (52) for driving the vacuum heating box (51) to rise and fall, a vacuum pumping component (53) arranged on the frame (1), and a plurality of groups of second heating units (54); A visual detection mechanism (6) is also provided at the upper end of the vacuum heating box (51).

2. The glue degassing device according to claim 1, characterized in that: The vacuum conveying mechanism (3) comprises: A fixed plate (31) and a movable plate (32), wherein the fixed plate (31) and the movable plate (32) are arranged on the frame (1) and are arranged opposite to each other; Two groups of transmission belts (33) are provided and are respectively arranged on the fixed plate (31) and the movable plate (32); the two groups of transmission belts (33) are driven by a transmission rod (34) arranged between the fixed plate (31) and the movable plate (32); A transmission drive unit (35) fixedly disposed on one side of the fixed plate (31) and transmission-connected to one of the groups of transmission belts (33); and a width adjustment component (36).

3. The glue degassing device according to claim 1, characterized in that: The width adjustment assembly (36) comprises a width adjustment drive unit (361) fixedly arranged on one side of the fixed plate (31), and a threaded rod (362) which is transmission-arranged with the width adjustment drive unit (361) and one end of which is rotationally connected to the fixed plate (31); the threaded rod (362) is threadedly transmission-connected to the movable plate (32).

4. The glue degassing device according to claim 1, characterized in that: The lifting assembly (52) comprises: A lifting unit (521) is arranged at the lower end of the frame (1); A hydraulic rod (522), connected to the lifting unit (521) and having the other end connected to the vacuum heating box (51); The guide rods (523) are provided in a plurality of groups and are fixedly arranged on the frame (1); the outer side of the vacuum heating box (51) is slidably connected to the guide rods (523) via a plurality of groups of sleeves (524).

5. The glue degassing device according to claim 1, characterized in that: A vibration mechanism (7) is also provided at the upper end of the frame (1) at a position corresponding to the vacuum conveying mechanism (3), and the vibration mechanism (7) is used to shake the PCB board placed on the transmission belt (33).

6. The glue degassing device according to claim 3, characterized in that: The vibration mechanism (7) comprises: A vibration drive unit (71) arranged on the frame (1); A transmission wheel (72) is connected to the vibration drive unit (71) via a transmission belt (73); A plurality of support plates (74) are provided and fixedly mounted on the frame (1); the transmission wheel (72) is rotatably mounted on the support plates (74); A bevel gear pair (75) disposed on the support plate (74) and in driving connection with the transmission wheel (72); A rotating rod (76) is rotatably disposed on the support plate (74) and is provided with a plurality of groups of cams (77) disposed to abut against the lower end surface of the PCB board.

7. The glue degassing device according to claim 6, characterized in that: The fixed plate (31) and the movable plate (32) are both provided with a buffer assembly (8) on one side close to the PCB board, and the buffer assembly comprises a mounting plate (81) fixedly connected to the fixed plate (31) or the movable plate (32), a plurality of groups of buffer springs (82) fixedly arranged at the lower end of the mounting plate (81), and a pressing block (83) fixedly connected to the buffer spring (82).

8. A method for degassing glue, comprising the degassing glue device as claimed in any one of claims 1 to 7, characterized in that: The following steps are involved: Step 1: Loading process, placing the PCB board that has been coated with glue on the feeding conveyor mechanism (2) to complete the loading process; Step 2: preheating process, controlling the first heating unit (42) to work and preheating the PCB board; Step 3: a transfer process, controlling the PCB board to be transferred from the feed conveying mechanism (2) to the vacuum conveying mechanism (3); Step 4: vacuum heating process, first control the lifting component (52) to work and drive the vacuum heating box (51) to descend and complete the sealing with the frame (1), and then control the vacuum assembly (53) and the second heating unit (54) to work to complete the vacuuming and secondary heating work.

9. The glue degassing method according to claim 8, characterized in that: The heating temperature of the first heating unit (42) in the preheating process is 30°C-80°C, and the preheating time is 1 min-40 min. The heating temperature of the second heating unit (54) in the vacuum heating process is 40°C-80°C, and the vacuum heating time is 1 min-80 min.

10. The glue degassing method according to claim 9, characterized in that: The vacuuming component (53) in step 4 works in a stepwise vacuuming manner.

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