Tin-based spherical welding powder cooling device for SMT (Surface Mount Technology)

Abstract

The invention belongs to the technical field of cooling devices, and discloses a tin-based spherical welding powder cooling device for SMT (Surface Mount Technology), which comprises a mounting plate, a telescopic cylinder is mounted on the mounting plate, the telescopic cylinder is connected with a moving plate, supporting columns are mounted at four corners of the moving plate, the supporting columns are connected with a fan bracket, and a fan is mounted on the fan bracket. Column casings are installed at the four corners of the fan and connected with a cold box. The cold box is provided with a piece containing cavity, a through opening is formed in the upper side of the piece containing cavity, a back plate is installed in the piece containing cavity, a cooling calandria is installed on the back plate, the cooling calandria is connected with a water pump and a water tank, and air holes are formed in the lower side of the piece containing cavity. A T-shaped clamping groove is formed in the cold box, an air hole plate is slidably installed in the T-shaped clamping groove, the air hole plate is provided with an air port with the position customized, an L-shaped plate is installed on the upper side of the cold box, a spring set is installed on the L-shaped plate, and the lower end of the spring set is connected with an L-shaped shifting piece.

Description

Technical Field

[0001] The invention belongs to the technical field of cooling devices, and in particular relates to a cooling device for tin-based spherical solder powder for SMT. Background Art

[0002] SMT is the abbreviation of Surface Mounted Technology. It is the most popular technology and process in the electronic assembly industry. Specifically, SMT is a circuit assembly technology that mounts pinless or short-lead surface mount components (abbreviated as SMC / SMD, called chip components in Chinese) on the surface of a printed circuit board (PCB) or other substrate, and then assembles them by soldering or dip soldering. It compresses traditional electronic components into devices with a volume of only a few tens of times smaller, achieving high density, high reliability, miniaturization, low cost, and automated production of electronic product assembly;

[0003] Tin-based spherical solder powder is a high-purity metal tin powder mainly used in the fields of electronic product packaging, electronic component connection, etc. In order to slow down the reaction speed of flux and tin powder, ensure the welding quality of components and PCBs, thereby extending the effective welding time, and achieve the purpose of including but not limited to oxidation protection, temperature and humidity control, maintaining solder paste performance, and preventing deterioration or failure, the tin-based spherical solder powder needs to be cooled.

[0004] There are two types of cooling devices in the prior art: air cooling and water cooling. In short, air cooling cools by blowing, and water cooling cools by heat transfer. However, in the prior art that can be found, both air cooling and water cooling have a problem that they cannot cool at a fixed point. Large-area cooling wastes wind and water resources. At the same time, the air cooling effect is not good due to the non-concentration of wind power. Due to the large-area circulation of water power, the water temperature rises quickly, which is not conducive to cooling. Therefore, it is necessary to further optimize the structure. Summary of the invention

[0005] In view of the problems raised by the above background technology, the purpose of the present invention is to provide a cooling device for tin-based spherical solder powder for SMT.

[0006] In order to achieve the above technical objectives, the technical solution adopted by the present invention is as follows:

[0007] A tin-based spherical solder powder cooling device for SMT, comprising a mounting plate, a telescopic cylinder is mounted on the mounting plate, a movable plate is connected to the output end of the telescopic cylinder, pillars are mounted at the four corners of the movable plate, the lower ends of all the pillars are connected to a fan bracket, the fan bracket is mounted with a fan, column barrels are mounted at the four corners of the fan, and the lower ends of all the column barrels are connected to a cold box;

[0008] The cold box is provided with a component placement cavity, a through opening is provided on the upper side of the component placement cavity, a back plate is installed at the insertion end of the component placement cavity, a cooling pipe is installed on the back plate, the cooling pipe is located in the component placement cavity, a water pump is connected to the input end of the cooling pipe, a water tank is connected to the output end of the cooling pipe, the water pump is placed in the water tank, and an air hole is provided on the lower side of the component placement cavity;

[0009] The cold box is provided with a T-shaped slot, in which a pore plate is slidably installed, the upper side of the pore plate is hollowed out, the pore plate is provided with an air port with a customized position, an L-shaped plate is installed on the upper side of the cold box, the L-shaped plate is installed with a spring group, the lower end of the spring group is connected with an L-shaped paddle, the L-shaped paddle is plug-in installed on the cold box, and the side of the L-shaped paddle contacts the side of the pore plate.

[0010] It is further defined that the air hole plate is provided with an air cavity, the air cavity is slidably mounted with an air plate, the air plate is provided with customized holes, the air plate is configured with two locking screws, and the locking screws are threadedly connected to the air hole plate. With such a design, the air outlet of only the position with customized holes can be controlled by replacing the air plate. Compared with replacing the entire air hole plate, the production cost of replacing the air plate is lower, and the weight of the air plate is definitely less than that of the air hole plate, so replacement is simpler, more convenient and quicker.

[0011] It is further defined that four guide pillars are fixedly installed on the upper side of the movable plate, and the four guide pillars are slidably installed on the mounting plate, and the mounting plate is provided with sleeves at the sliding installation positions of the guide pillars. Such a design provides a limit for the lifting and lowering movement of the movable plate, thereby ensuring its smooth movement and the accuracy of the circumferential direction of the position, thereby ensuring the accuracy of the output position of the air hole plate.

[0012] It is further defined that mounting holes are provided at the four corners of the mounting plate. Such a design facilitates the mounting plate to be mounted horizontally and firmly on the mounting surface.

[0013] It is further defined that the fan bracket is provided with a rectangular frame at the input end of the fan, and a filter is placed in the rectangular frame. Such a design filters the gas and prevents the gas from contaminating the position requiring cooling.

[0014] It is further defined that the cooling pipe is an S-shaped pipe. Such a design allows the gas to circulate in a one-way flow without any forks, thereby ensuring the cooling effect.

[0015] It is further defined that both the input end and the output end of the cooling exhaust pipe are connected with a hose, and such a design is adapted to the lifting and lowering movement of the movable plate.

[0016] The beneficial effects of the present invention are as follows:

[0017] The present invention integrates water cooling and air cooling, and adds cooling pipes on the basis of air cooling, so that the air temperature of air cooling is reduced and the cooling efficiency is guaranteed;

[0018] The invention can realize the purpose of cooling only the required position by changing the installation of the customized air hole plate, cooling the small area at a fixed point, effectively utilizing wind resources, and ensuring its cooling effect;

[0019] The present invention can achieve height adjustment of the output position of the air hole plate by controlling the operation of the telescopic cylinder, thereby controlling the distance between the output end position of the air hole plate and the cooled component, further enhancing the cooling effect and improving the cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention can be further illustrated by the non-limiting examples given in the accompanying drawings;

[0021] Figure 1 The structure of a cooling device for tin-based spherical solder powder for SMT according to the present invention is shown in FIG. Figure 1 ;

[0022] Figure 2 The structure of a cooling device for tin-based spherical solder powder for SMT according to the present invention is shown in FIG. Figure 2 ;

[0023] Figure 3 Schematic diagram of the explosion structure of an embodiment of a cooling device for tin-based spherical solder powder for SMT according to the present invention Figure 1 ;

[0024] Figure 4 Schematic diagram of the explosion structure of an embodiment of a cooling device for tin-based spherical solder powder for SMT according to the present invention Figure 2 ;

[0025] The main component symbols are described as follows:

[0026] Mounting plate 1; telescopic cylinder 2; moving plate 3; support column 4; fan bracket 5; fan 6; column tube 7; cold box 8; component cavity 9; through port 10; back plate 11; cooling pipe 12; water pump 13; water tank 14; air hole 15; T-shaped slot 16; air hole plate 17; air port 18; L-shaped plate 19; spring assembly 20; L-shaped paddle 21; guide column 22; sleeve 23; mounting hole 24; rectangular frame 25; filter screen 26; hose 27;

[0027] Air cavity 171; air plate 172; customized hole 173; locking screw 174. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0029] like Figure 1 to Figure 4 As shown, a tin-based spherical solder powder cooling device for SMT of the present invention comprises a mounting plate 1, a telescopic cylinder 2 is mounted on the mounting plate 1, a movable plate 3 is connected to the output end of the telescopic cylinder 2, pillars 4 are mounted at the four corners of the movable plate 3, the lower ends of all the pillars 4 are connected to fan brackets 5, the fan bracket 5 is mounted to a fan 6, column barrels 7 are mounted at the four corners of the fan 6, and the lower ends of all the column barrels 7 are connected to cold boxes 8;

[0030] The cold box 8 is provided with a component placement cavity 9, a through opening 10 is provided on the upper side of the component placement cavity 9, a back plate 11 is installed at the insertion end of the component placement cavity 9, a cooling pipe 12 is installed on the back plate 11, the cooling pipe 12 is located in the component placement cavity 9, a water pump 13 is connected to the input end of the cooling pipe 12, a water tank 14 is connected to the output end of the cooling pipe 12, the water pump 13 is placed in the water tank 14, and an air hole 15 is provided on the lower side of the component placement cavity 9;

[0031] The cold box 8 is provided with a T-shaped slot 16, in which a vent plate 17 is slidably installed. The upper side of the vent plate 17 is hollowed out, and the vent plate 17 is provided with an air port 18 with a customized position. An L-shaped plate 19 is installed on the upper side of the cold box 8, and a spring group 20 is installed on the L-shaped plate 19. The lower end of the spring group 20 is also connected with an L-shaped paddle 21, which is plug-in installed on the cold box 8, and the side of the L-shaped paddle 21 contacts the side of the vent plate 17.

[0032] In this embodiment, when using a tin-based spherical solder powder cooling device for SMT, the entire device is installed directly above the required position through the mounting plate 1, and then the water tank 14 is installed at a position on the side that does not interfere with the operation of the equipment. During use, the specifications of the workpiece to be cooled are determined, and the air hole plate 17 corresponding to the specifications is installed in the T-shaped card slot 16. The installation method of the air hole plate 17 is: the L-shaped paddle 21 is pushed upward to make the entrance end of the T-shaped card slot 16 fully open, and then the air hole plate 17 is directly inserted into the T-shaped slide groove 16, and the L-shaped paddle 21 is released. Under the effect of the spring group 20, the L-shaped paddle 21 moves downward to block the side of the air hole plate 17, thereby realizing the position limitation of the air hole plate 17. After the installation position of the air hole plate 17 is determined, the height position of the air hole plate 17 is adjusted to ensure that the gas output from the air hole plate 17 can cool the workpiece at the optimal cooling distance. The height adjustment method is to control the operation of the telescopic cylinder 2. When the position is determined, the operation can be started;

[0033] The fan 6 and the water pump 13 in the water tank 14 are running, and the water pump 13 is running to pump the coolant in the water tank 14 into the cooling pipe 12. The structure that can be further optimized here is that a filter can be installed at the input end of the cooling pipe 12 to ensure that the liquid entering the cooling pipe 12 is clean, and to prevent impurities from blocking and scaling, so as to ensure smooth operation. The flow of coolant in the cooling pipe 12 makes the temperature of the mounting cavity 9 and the entire cold box 8 lower. The operation of the fan 6 discharges the wind into the cold box 8 through the port 10, and the wind is cooled again by the temperature of the cold box 8, and then discharged from the output end of the air hole plate 17. Because the number and position of the air ports 18 at the output end of the air hole plate 17 are customized to match the workpiece to be cooled, the cold air ejected from the air ports 18 will accurately and concentratedly cool the workpiece to be cooled efficiently, without wasting wind in unnecessary areas, thereby ensuring the cooling effect and improving the cooling efficiency.

[0034] Furthermore, when the model of the workpiece is changed, the corresponding air hole plate 17 needs to be replaced. Of course, the air hole plate 17 may not be installed so that the air outlet of the fan 6 covers the entire workpiece. The cooling efficiency is lower but the cooling effect can also be achieved.

[0035] Preferably, the air hole plate 17 is provided with an air cavity 171, and the air cavity 171 is slidably installed with an air plate 172, and the air plate 172 is provided with a customized hole 173. The air plate 172 is configured and installed with two locking screws 174, and the locking screws 174 are threadedly connected to the air hole plate 17. With such a design, by replacing the air plate 172, it is possible to control the air outlet of the position where only the customized hole 173 is provided. Compared with replacing the entire air hole plate 17, the production cost of replacing the air plate 172 is lower, and the weight of the air plate 172 is definitely less than that of the air hole plate 17, so the replacement is simpler, more convenient and quicker. In fact, the structure of the air hole plate 17 can also be considered according to specific circumstances.

[0036] Preferably, four guide pillars 22 are fixedly installed on the upper side of the movable plate 3, and the four guide pillars 22 are slidably installed on the mounting plate 1. The mounting plate 1 is provided with a sleeve 23 at the sliding installation position of the guide pillars 22. Such a design provides a limit for the lifting and lowering movement of the movable plate 3, thereby ensuring its smooth movement and the accuracy of the lateral direction of the position, thereby ensuring the accuracy of the output position of the air hole plate 17. In fact, a structure to ensure the smooth lifting and lowering of the movable plate 3 can also be considered according to specific circumstances.

[0037] Preferably, mounting holes 24 are provided at the four corners of the mounting plate 1. Such a design is conducive to horizontally and firmly mounting the mounting plate 1 on the mounting surface. In fact, the mounting method of the mounting plate 1 can also be considered according to specific circumstances.

[0038] Preferably, the fan bracket 5 is provided with a rectangular frame 25 at the input end of the fan 6, and a filter mesh 26 is placed in the rectangular frame 25. This design filters the gas to prevent the gas from contaminating the position that needs to be cooled. In fact, structural measures for filtering impurities can also be considered according to specific circumstances.

[0039] Preferably, the cooling pipe 12 is an S-shaped pipe. With this design, the gas circulates in one direction without any forks, thus ensuring the cooling effect. In fact, the specifications and shapes of the cooling pipe 12 can also be considered according to specific circumstances.

[0040] Preferably, both the input and output ends of the cooling exhaust pipe 12 are connected with a hose 27. Such a design is adapted to the lifting and lowering movement of the movable plate. In fact, the length of the hose 27 can also be considered according to specific circumstances.

[0041] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A tin-based spherical solder powder cooling device for SMT, comprising a mounting plate (1), characterized in that: The mounting plate (1) is mounted with a telescopic cylinder (2), the output end of the telescopic cylinder (2) is connected with a movable plate (3), the movable plate (3) is mounted with pillars (4) at four corners, the lower ends of all the pillars (4) are connected with fan brackets (5), the fan bracket (5) is mounted with a fan (6), the four corners of the fan (6) are mounted with column tubes (7), and the lower ends of all the column tubes (7) are connected with cold boxes (8); The cold box (8) is provided with a component placement cavity (9), a through opening (10) is provided on the upper side of the component placement cavity (9), a back plate (11) is installed at the insertion end of the component placement cavity (9), a cooling pipe (12) is installed on the back plate (11), the cooling pipe (12) is located in the component placement cavity (9), the input end of the cooling pipe (12) is connected to a water pump (13), the output end of the cooling pipe (12) is connected to a water tank (14), the water pump (13) is placed in the water tank (14), and an air hole (15) is provided on the lower side of the component placement cavity (9); The cold box (8) is provided with a T-shaped slot (16), a vent plate (17) is slidably mounted in the T-shaped slot (16), the upper side of the vent plate (17) is hollowed out, the vent plate (17) is provided with a customized air port (18), an L-shaped plate (19) is mounted on the upper side of the cold box (8), a spring group (20) is mounted on the L-shaped plate (19), the lower end of the spring group (20) is also connected with an L-shaped paddle (21), the L-shaped paddle (21) is plug-in mounted on the cold box (8), and the side of the L-shaped paddle (21) contacts the side of the vent plate (17).

2. A cooling device for tin-based spherical solder powder for SMT according to claim 1, characterized in that: The air hole plate (17) is provided with an air cavity (171), and the air cavity (171) is slidably mounted with an air plate (172), and the air plate (172) is provided with a customized hole (173). The air plate (172) is configured with two locking screws (174), and the locking screws (174) are threadedly connected to the air hole plate (17).

3. A cooling device for tin-based spherical solder powder for SMT according to claim 2, characterized in that: Four guide pillars (22) are fixedly mounted on the upper side of the movable plate (3), and the four guide pillars (22) are slidably mounted on the mounting plate (1), and a sleeve (23) is mounted on the mounting plate (1) at the sliding mounting position of the guide pillars (22).

4. A cooling device for tin-based spherical solder powder for SMT according to claim 3, characterized in that: The four corners of the mounting plate (1) are all provided with mounting holes (24).

5. A cooling device for tin-based spherical solder powder for SMT according to claim 4, characterized in that: The fan bracket (5) is provided with a rectangular frame (25) at the input end of the fan (6), and a filter sheet (26) is placed in the rectangular frame (25).

6. A cooling device for tin-based spherical solder powder for SMT according to claim 5, characterized in that: The cooling pipe (12) is an S-shaped pipe.

7. A cooling device for tin-based spherical solder powder for SMT according to claim 6, characterized in that: The input end and the output end of the cooling exhaust pipe (12) are both connected to a hose (27).

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