Welding equipment for semiconductor photosensitive element

Abstract

The invention relates to the technical field of wave soldering machines, and discloses semiconductor photosensitive element soldering equipment which comprises a soldering machine body, a tin furnace is installed in the soldering machine body, a nozzle assembly and a filtering assembly are installed in the tin furnace, a top plate is arranged at the top of the tin furnace, and fixing bolts are slidably connected to the four corners of the top plate. The fixing bolts penetrate through the top plate to be in threaded connection with the tin furnace, check blocks are fixedly connected to the two ends of the bottom of the top plate, an annular through groove is formed in the middle of the top plate, a lower limiting ring and an upper limiting ring matched with the annular through groove are fixedly connected to the top of the top plate, and a walking assembly matched with the lower limiting ring and the upper limiting ring is arranged at the top of the top plate. A dumping assembly is fixedly connected to the top of the walking assembly, a slag removing spoon is fixedly connected to the side, close to the tin furnace, of the dumping assembly, and a discharging groove is formed in the upper end of the side wall of the tin furnace. According to the welding equipment for the semiconductor photosensitive element, when tin slag is cleaned daily, slag can be automatically cleaned only by starting the equipment, and the whole slag cleaning process is rapid and convenient.

Description

Technical Field

[0001] The invention relates to the technical field of wave soldering machines, in particular to a soldering device for semiconductor photosensitive elements. Background Art

[0002] Semiconductor photosensitive components, as important devices for photoelectric conversion, have extremely sophisticated and strict production processes. In the production and manufacturing process of semiconductor photosensitive components, the welding process is a key step to ensure its stable performance and reliable connection. This link is inseparable from the support of professional welding equipment. Since the wave soldering machine achieves fast and uniform welding through the contact between the molten solder wave and the component pins, it effectively improves production efficiency and welding quality. Therefore, among the various types of welding equipment, the wave soldering machine has become the most commonly used welding equipment in the production of semiconductor photosensitive components.

[0003] For example, the patent with the patent authorization announcement number CN117283075B discloses a lead-free wave soldering machine for emergency lighting LED lamp production, including a shell, a conveyor is arranged through the shell in the horizontal direction, the lead-free wave soldering machine also includes a substrate cooling component, an air pump, and a refrigeration mechanism. The substrate cooling component is arranged at the lower end of the conveyor, and is used to cool the soldered substrate. The substrate cooling component includes an air cooling component and a cooling nozzle. The air cooling component is used to cool the substrate, and the cooling nozzle is used to cool the solder joints on the substrate. The air pump is connected to the cooling nozzle, and the air pump is used for the initial cooling of the solder joints. The refrigeration mechanism is arranged inside the lead-free wave soldering machine, and the refrigeration mechanism is connected to the cooling nozzle. The refrigeration mechanism is used to provide a cold source to the cooling nozzle, and the cold source is used for the subsequent cooling of the solder joints. This kind of lead-free wave soldering machine for emergency lighting LED lamp production can cool the solder joints and substrates differently.

[0004] The wave soldering machine in the above patent still has certain defects: During the daily operation of the wave soldering machine, in order to ensure smooth startup and maintain high efficiency the next day, the tin slag inside the tin furnace will be cleaned before the end of each day's work. Generally, a special tin slag spoon is used to carefully scoop out the accumulated tin slag in the tin furnace and properly place it in a specially designed tin slag bucket for subsequent processing. However, in the actual operation process, due to the design characteristics of the wave soldering machine, the space between the top of the tin furnace and the bottom of the clamping mechanism is relatively narrow, which undoubtedly brings great inconvenience to the cleaning operation and also affects the efficiency of the cleaning work to a certain extent. Summary of the invention

[0005] In view of the deficiencies of the prior art, the present invention provides a semiconductor photosensitive element welding device, which makes the daily slag cleaning of the tin furnace simpler and more convenient.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a welding device for semiconductor photosensitive elements, comprising a welding machine body, a tin furnace installed inside the welding machine body, a nozzle assembly and a filter assembly installed inside the tin furnace, a top plate provided on the top of the tin furnace, four corners of the top plate are slidably connected with fixing bolts, the fixing bolts penetrate the top plate and are threadedly connected to the tin furnace, both ends of the bottom of the top plate are fixedly connected with stoppers, an annular through groove is provided in the middle position of the top plate, a lower limit ring and an upper limit ring matching the annular through groove are fixedly connected to the top of the top plate, a walking assembly matching the lower limit ring and the upper limit ring is provided on the top of the top plate, a dumping assembly is fixedly connected to the top of the walking assembly, a slag cleaning spoon is fixedly connected to the side of the dumping assembly close to the tin furnace, a discharge groove is provided at the upper end of the side wall of the tin furnace, a material guide pipe matching the discharge groove is fixedly connected to the outer wall of the tin furnace, and a temporary storage and recovery assembly is installed at the end of the material guide pipe away from the tin furnace.

[0007] Furthermore, the walking assembly includes a moving frame, a walking motor and a walking wheel. A walking wheel matching the lower limit ring and the upper limit ring is provided between them. The top of the upper limit ring is slidably connected to the moving frame. The side of the moving frame away from the tin furnace is fixedly connected to the walking motor, and the output end of the walking motor is fixedly connected to the walking wheel.

[0008] Furthermore, the dumping assembly includes a rack plate, a transmission gear, a follower gear and a limit frame, one side of the top plate is fixedly connected to the rack plate, the side of the moving frame away from the tin furnace is rotatably connected to the transmission gear, the top of the moving frame is fixedly connected to the limit frame, the upper end of the limit frame is rotatably connected to the follower gear, one side of the follower gear is fixedly connected to the slag cleaning spoon, the follower gear is meshed with the transmission gear, the top of the slag cleaning spoon is fixedly connected to a conduit, and the bottom of the slag cleaning spoon is fixedly connected to a reinforcement plate.

[0009] Furthermore, the temporary storage recovery component includes a stirring recovery bin, a stirring motor, an agitator and a gate. The top of the stirring recovery bin is fixedly connected to the stirring motor, the interior of the stirring recovery bin is rotatably connected to the agitator, the output end of the stirring motor is fixedly connected to the agitator, and the lower end of the stirring recovery bin close to the material guide pipe is slidably connected to the gate.

[0010] Furthermore, a filter is fixedly connected to the end of the material guide tube away from the tin furnace, and limit frames are fixedly connected to both sides of the material guide tube. A card slot is provided at the end of the limit frame away from the tin furnace, and the limit frame matches the stirring and recovery bin. A card plate is slidably connected to the lower end of the stirring and recovery bin away from the material guide tube, and sliders are fixedly connected to the inner sides of both ends of the card plate. Slide slots matching the sliders are provided on both sides of the stirring and recovery bin, and limit bolts are slidably connected to both ends of the card plate. The ends of the limit bolts pass through the card plate and the limit frame and are threadedly connected to the stirring and recovery bin.

[0011] Furthermore, a plug plate is fixedly connected to the bottom of the mixing recovery bin, a transverse plate matching the plug plate is provided between the two limit frames, and two ends of the transverse plate are respectively fixedly connected to the two limit frames.

[0012] Furthermore, a plurality of limit columns are slidably connected to the middle position of the gate, both ends of the limit columns are fixedly connected to the stirring and recovery bin, the upper end of the limit column is sleeved with a downward-pressing elastic member, the upper end of the downward-pressing elastic member is fixedly connected to the stirring and recovery bin, the lower end of the downward-pressing elastic member is fixedly connected to the gate, a wedge block is fixedly connected to one side of the gate close to the material guide pipe, and an extrusion block matching the wedge block is fixedly connected to the end of the movable frame.

[0013] Furthermore, an extrusion positioning block is slidably connected to one side of the lower end of the limit frame close to the slag cleaning spoon, a storage cavity is opened at the end of the extrusion positioning block away from the slag cleaning spoon, an outward push elastic member is arranged inside the storage cavity, one end of the outward push elastic member is fixedly connected to the extrusion positioning block, and the other end of the outward push elastic member is fixedly connected to the limit frame.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. For the daily cleaning of tin slag in the welding equipment of this type of semiconductor photosensitive element, as long as the walking component is started, the walking component will move with the slag cleaning spoon, so as to gather the tin slag in the slag cleaning spoon. After the slag cleaning spoon moves to the preset position, the dumping component will drive the slag cleaning spoon to rotate, so as to scoop the gathered tin slag out of the tin furnace and let the tin slag enter the temporary storage and recovery component for temporary storage and recovery, so as to facilitate later processing. The whole slag cleaning process is quick, convenient and easy to operate.

[0015] 2. In the welding equipment of this kind of semiconductor photosensitive element, when the traveling assembly approaches the temporary storage and recovery assembly and the transmission gear has not yet contacted the rack plate, the extrusion block will first contact the wedge block, thereby opening the gate of the temporary storage and recovery assembly, so that the internal solder can return to the tin furnace through the guide tube, reducing the waste of solder.

[0016] 3. For this type of semiconductor photosensitive element welding equipment, after the slag is dumped out by the slag cleaning spoon, it will fall back into the tin furnace by gravity. During the falling process of the slag cleaning spoon, the extrusion positioning block will squeeze the slag cleaning spoon, thereby reducing the falling speed of the slag cleaning spoon and preventing the slag cleaning spoon from falling too fast, causing solder splashing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a structural schematic diagram of the tin furnace of the present invention; Figure 3 This is a schematic diagram of the structure of the tin furnace and the stirring recovery bin of the present invention; Figure 4It is a structural schematic diagram of the top plate of the present invention; Figure 5 For the present invention Figure 4 A schematic diagram of the local enlarged structure at point A in the middle; Figure 6 This is a schematic diagram of the connection structure between the material guide pipe and the stirring recovery bin of the present invention; Figure 7 It is a bottom view of the material guide pipe and the stirring recovery bin of the present invention; Figure 8 It is a partial cross-sectional view of the material guide pipe and the stirring recovery bin of the present invention; Fig. 9 This is a schematic diagram of the connection structure between the movable frame and the slag cleaning scoop of the present invention; Fig.10 For the present invention Fig. 9 Schematic diagram of the local enlarged structure at point B in the middle.

[0018] In the figure: 1. welding machine body; 2. tin furnace; 3. top plate; 4. fixing bolt; 5. stopper; 6. lower limit ring; 7. upper limit ring; 8. rack plate; 9. moving frame; 10. travel motor; 11. travel wheel; 12. transmission gear; 13. follower gear; 14. limit frame; 15. slag cleaning spoon; 16. reinforcement plate; 17. guide tube; 18. extrusion positioning block; 19. storage chamber; 20. Push-out elastic member; 21, extrusion block; 22, discharge chute; 23, material guide pipe; 24, filter screen; 25, limit frame; 26, cross plate; 27, card slot; 28, mixing recovery bin; 29, slide; 30, slider; 31, card plate; 32, limit bolt; 33, mixing motor; 34, agitator; 35, limit column; 36, downward pressure elastic member; 37, gate; 38, wedge block; 39, plug plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] See also Figures 1 to 10A welding device for semiconductor photosensitive elements comprises a welding machine body 1, a tin furnace 2 is installed inside the welding machine body 1, a nozzle assembly and a filter assembly are installed inside the tin furnace 2, a top plate 3 is provided on the top of the tin furnace 2, and fixing bolts 4 are slidably connected to the four corners of the top plate 3, the fixing bolts 4 penetrate the top plate 3 and are threadedly connected to the tin furnace 2, and blocks 5 are fixedly connected to the two ends of the bottom of the top plate 3, an annular through groove is opened in the middle position of the top plate 3, a lower limit ring 6 and an upper limit ring 7 matching the annular through groove are fixedly connected to the top of the top plate 3, a walking assembly matching the lower limit ring 6 and the upper limit ring 7 is provided on the top of the top plate 3, a dumping assembly is fixedly connected to the top of the walking assembly, a slag cleaning spoon 15 is fixedly connected to the side of the dumping assembly close to the tin furnace 2, a discharge groove 22 is opened at the upper end of the side wall of the tin furnace 2, a guide pipe 23 matching the discharge groove 22 is fixedly connected to the outer wall of the tin furnace 2, and a temporary storage and recovery assembly is installed at the end of the guide pipe 23 away from the tin furnace 2.

[0021] The semiconductor photosensitive element welding equipment of the present invention, when cleaning the tin slag inside the tin furnace 2 on a daily basis, only needs to start the walking component, and the walking component will move the slag cleaning spoon 15 along the edge of the annular groove, so as to gather the tin slag into the slag cleaning spoon 15, and after the slag cleaning spoon 15 moves to a preset position (i.e., the position of the temporary storage and recovery component), the dumping component will drive the slag cleaning spoon 15 to rotate, so as to scoop out the tin slag gathered in the slag cleaning spoon 15 from the tin furnace 2, and let the tin slag fall into the temporary storage and recovery component for temporary storage treatment, so as to facilitate subsequent treatment , and the slag cleaning spoon 15 can continue to move for the next circle until the tin slag content in the tin furnace 2 is reduced to a certain range, so that the welding machine body 1 can be smoothly started and maintain high efficiency the next day, and then the equipment is turned off. The entire slag cleaning process is quick, convenient and easy to operate. In addition, the internal structures of the welding machine body 1 and the tin furnace 2 in the present invention are similar to the prior art, and the patent authorization announcement number is CN117283075B, which discloses a lead-free wave soldering machine for emergency lighting LED lamp production, so no further elaboration is made here.

[0022] As a preferred technical solution of the present invention, the walking component includes a moving frame 9, a walking motor 10 and a walking wheel 11. A walking wheel 11 matching the lower limit ring 6 and the upper limit ring 7 is provided between the lower limit ring 6 and the upper limit ring 7. The top of the upper limit ring 7 is slidably connected to the moving frame 9. The side of the moving frame 9 away from the tin furnace 2 is fixedly connected to the walking motor 10, and the output end of the walking motor 10 is fixedly connected to the walking wheel 11.

[0023] Specifically, when the slag cleaning scoop 15 needs to move along the annular groove in the middle position of the top plate 3, it is only necessary to start the travel motor 10. The travel motor 10 will drive the travel wheel 11 to rotate between the lower limit ring 6 and the upper limit ring 7, thereby driving the moving frame 9 to move; in addition, the travel motor 10 is powered by a battery, and the battery can be installed on the moving frame 9. Since this power supply method belongs to the existing mature technology and the battery is also an existing mature product, it will not be elaborated on here.

[0024] As a preferred technical solution of the present invention, the dumping assembly includes a rack plate 8, a transmission gear 12, a follower gear 13 and a limit frame 14. The rack plate 8 is fixedly connected to one side of the top plate 3, and the side of the moving frame 9 away from the tin furnace 2 is rotatably connected to the limit frame 14. The top of the moving frame 9 is fixedly connected to the limit frame 14, and the upper end of the limit frame 14 is rotatably connected to the follower gear 13. One side of the follower gear 13 is fixedly connected to the slag cleaning spoon 15, and the follower gear 13 is meshed with the transmission gear 12. The top of the slag cleaning spoon 15 is fixedly connected to a conduit 17, and the bottom of the slag cleaning spoon 15 is fixedly connected to a reinforcement plate 16.

[0025] Specifically, when the moving frame 9 approaches the rack plate 8, the transmission gear 12 will mesh with the rack plate 8. During the movement of the moving frame 9, the rack plate 8 will push the transmission gear 12 to rotate, and the transmission gear 12 will push the follower gear 13 to rotate, and then the follower gear 13 will drive the slag cleaning spoon 15 to rotate in the movement direction of the moving frame 9, thereby scooping up the tin slag inside the tin furnace 2, and the scooped up tin slag will fall into the temporary storage and recovery component through the conduit 17 for temporary storage and processing. In addition, after the moving frame 9 is away from the rack plate 8, the transmission gear 12 will lose the push and restriction of the rack plate 8, and the transmission gear 12 will not be able to continue to push and restrict the follower gear 13, and the slag cleaning spoon 15 fixedly connected to the follower gear 13 will also lose the restriction. At this time, the slag cleaning spoon 15 will rotate to its original position under the action of gravity until it returns to its original position. The reinforcement plate 16 can not only reinforce and protect the slag cleaning spoon 15, but also increase the weight of the lower end of the slag cleaning spoon 15, so that the slag cleaning spoon 15 can return to its original position more easily.

[0026] As a preferred technical solution of the present invention, the temporary storage recovery component includes a stirring recovery bin 28, a stirring motor 33, an agitator 34 and a gate 37. The stirring motor 33 is fixedly connected to the top of the stirring recovery bin 28, the inside of the stirring recovery bin 28 is rotatably connected to the agitator 34, the output end of the stirring motor 33 is fixedly connected to the agitator 34, and the lower end of the stirring recovery bin 28 close to the material guide pipe 23 is slidably connected to the gate 37.

[0027] As a preferred technical solution of the present invention, a filter screen 24 is fixedly connected to one end of the material guide tube 23 away from the tin furnace 2, and a limit frame 25 is fixedly connected to both sides of the material guide tube 23. A card slot 27 is provided at the end of the limit frame 25 away from the tin furnace 2, and the limit frame 25 matches the stirring and recovery bin 28. A card plate 31 is slidably connected to the lower end of the stirring and recovery bin 28 away from the side of the material guide tube 23, and sliders 30 are fixedly connected to the inner sides of both ends of the card plate 31. Slide grooves 29 matching the sliders 30 are provided on both sides of the stirring and recovery bin 28, and limiting bolts 32 are slidably connected to both ends of the card plate 31. The ends of the limiting bolts 32 pass through the card plate 31 and the limit frame 25 and are threadedly connected to the stirring and recovery bin 28.

[0028] Specifically, when installing the stirring and recovery bin 28, you only need to place the stirring and recovery bin 28 on the limit frame 25, then push the stirring and recovery bin 28 until the card plate 31 is aligned with the card slot 27 on the limit frame 25, then push the card plate 31 into the card slot 27, and tighten the limit bolt 32. The installation process is simple and convenient; in addition, after the slag cleaning spoon 15 pours the tin slag and part of the solder into the stirring and recovery bin 28, the stirring motor 33 will drive the stirrer 34 to stir the solder and the tin slag, so that the solder particles wrapped in the tin slag are re-melted into other liquid solders, and finally precipitated to the bottom of the stirring and recovery bin 28, and then open the gate 37, the liquid solder will flow back to the tin furnace 2 through the filter screen 24, and the tin slag will be intercepted for subsequent processing.

[0029] As a preferred technical solution of the present invention, a plug plate 39 is fixedly connected to the bottom of the mixing recovery bin 28, a horizontal plate 26 matching the plug plate 39 is provided between the two limit frames 25, and both ends of the horizontal plate 26 are respectively fixedly connected to the two limit frames 25.

[0030] Specifically, the insert plate 39 will be hooked on the horizontal plate 26, thereby restricting the stirring and recovery bin 28, making the connection between the stirring and recovery bin 28 and the limiting frame 25 more stable.

[0031] As a preferred technical solution of the present invention, a plurality of limit columns 35 are slidably connected to the middle position of the gate 37, both ends of the limit columns 35 are fixedly connected to the stirring and recovery bin 28, the upper end of the limit column 35 is sleeved with a downward pressing elastic member 36, the upper end of the downward pressing elastic member 36 is fixedly connected to the stirring and recovery bin 28, the lower end of the downward pressing elastic member 36 is fixedly connected to the gate 37, a wedge block 38 is fixedly connected to one side of the gate 37 close to the material guide tube 23, and an extrusion block 21 matching the wedge block 38 is fixedly connected to the end of the movable frame 9.

[0032] Specifically, when the moving frame 9 is close to the rack plate 8, but before the transmission gear 12 contacts the rack plate 8, the extrusion block 21 will first contact the wedge block 38, and push the wedge block 38 upward during the movement of the moving frame 9, and the wedge block 38 will drive the gate 37 to move upward. After the gate 37 is opened, the solder inside the stirring recovery bin 28 can return to the tin furnace 2 through the guide pipe 23. When the transmission gear 12 on the moving frame 9 contacts the rack plate 8, the extrusion block 21 has passed the wedge block 38, and under the action of the downward pressure elastic member 36, the gate 37 will fall back to its original position.

[0033] As a preferred technical solution of the present invention, an extrusion positioning block 18 is slidably connected to the side of the lower end of the limit frame 14 close to the slag cleaning spoon 15, and a storage cavity 19 is opened at the end of the extrusion positioning block 18 away from the slag cleaning spoon 15. An outward push elastic member 20 is provided inside the storage cavity 19, and one end of the outward push elastic member 20 is fixedly connected to the extrusion positioning block 18, and the other end of the outward push elastic member 20 is fixedly connected to the limit frame 14.

[0034] Specifically, after the transmission gear 12 disengages from the rack plate 8, the slag cleaning spoon 15 will first contact the extrusion positioning block 18 during its falling process. Since the extrusion positioning block 18 is pushed outward by the outward-pushing elastic member 20, there will be a large sliding friction between the extrusion positioning block 18 and the slag cleaning spoon 15 to hinder the slag cleaning spoon 15 from moving downward. However, since the total gravity of the slag cleaning spoon 15 and the reinforcement plate 16 is greater than the sliding friction, the slag cleaning spoon 15 can still rotate downward, but the rotation speed will be reduced. In this way, when the slag cleaning spoon 15 contacts the solder in the tin furnace 2, the solder will not splash due to excessive impact force, thereby reducing the waste of solder. In addition, the extrusion positioning block 18 will also limit the position of the slag cleaning spoon 15. In this way, during the movement of the moving frame 9, even if the slag cleaning spoon 15 is blocked by the push of the solder, the slag cleaning spoon 15 will not rotate in the opposite direction of the movement direction of the moving frame 9.

[0035] It is worth mentioning that the nozzle assembly and the filter assembly inside the tin furnace 2 in the present invention are both existing mature products. In the present invention, only the outer shell shape of the nozzle assembly and the filter assembly is changed to make them annular like the annular groove in the middle position of the top plate 3 to facilitate the movement of the slag cleaning spoon 15. The internal structure of the nozzle assembly and the filter assembly has not been changed, so they will not be described in detail here.

[0036] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A semiconductor photosensitive element welding device, comprising a welding machine body (1), a tin furnace (2) installed inside the welding machine body (1), a nozzle assembly and a filter assembly installed inside the tin furnace (2), characterized in that: The top of the tin furnace (2) is provided with a top plate (3), and the four corners of the top plate (3) are slidably connected with fixing bolts (4), and the fixing bolts (4) penetrate the top plate (3) and are threadedly connected to the tin furnace (2), and both ends of the bottom of the top plate (3) are fixedly connected with stoppers (5), and an annular through groove is opened in the middle of the top plate (3), and a lower limit ring (6) and an upper limit ring (7) matching the annular through groove are fixedly connected to the top of the top plate (3), and the top of the top plate (3) is provided with a plurality of stoppers (5). A walking assembly matching with a lower limit ring (6) and an upper limit ring (7) is provided at the top, a dumping assembly is fixedly connected to the top of the walking assembly, a slag cleaning spoon (15) is fixedly connected to the side of the dumping assembly close to the tin furnace (2), a discharge groove (22) is provided at the upper end of the side wall of the tin furnace (2), a material guide pipe (23) matching with the discharge groove (22) is fixedly connected to the outer wall of the tin furnace (2), and a temporary storage recovery assembly is installed at the end of the material guide pipe (23) away from the tin furnace (2).

2. The semiconductor photosensitive element welding device according to claim 1, characterized in that: The travel assembly comprises a moving frame (9), a travel motor (10) and a travel wheel (11); a travel wheel (11) matching the lower limit ring (6) and the upper limit ring (7) is provided between the lower limit ring (6) and the upper limit ring (7); the top of the upper limit ring (7) is slidably connected to the moving frame (9); the side of the moving frame (9) away from the tin furnace (2) is fixedly connected to the travel motor (10); and the output end of the travel motor (10) is fixedly connected to the travel wheel (11).

3. The semiconductor photosensitive element welding device according to claim 2, characterized in that: The tipping assembly comprises a rack plate (8), a transmission gear (12), a follower gear (13) and a limit frame (14); one side of the top plate (3) is fixedly connected to the rack plate (8); the side of the moving frame (9) away from the tin furnace (2) is rotatably connected to the transmission gear (12); the top of the moving frame (9) is fixedly connected to the limit frame (14); the upper end of the limit frame (14) is rotatably connected to the follower gear (13); one side of the follower gear (13) is fixedly connected to a slag cleaning spoon (15); the follower gear (13) is meshed with the transmission gear (12); the top of the slag cleaning spoon (15) is fixedly connected to a guide tube (17); and the bottom of the slag cleaning spoon (15) is fixedly connected to a reinforcing plate (16).

4. The semiconductor photosensitive element welding device according to claim 2, characterized in that: The temporary storage recovery component comprises a stirring recovery bin (28), a stirring motor (33), an agitator (34) and a gate (37); the stirring motor (33) is fixedly connected to the top of the stirring recovery bin (28); the agitator (34) is rotatably connected to the interior of the stirring recovery bin (28); the output end of the stirring motor (33) is fixedly connected to the agitator (34); and the gate (37) is slidably connected to the lower end of the stirring recovery bin (28) on a side close to the material guide pipe (23).

5. The semiconductor photosensitive element welding device according to claim 4, characterized in that: The end of the material guide tube (23) away from the tin furnace (2) is fixedly connected to a filter screen (24), and both sides of the material guide tube (23) are fixedly connected to a limit frame (25), and the end of the limit frame (25) away from the tin furnace (2) is provided with a slot (27), and the limit frame (25) matches the stirring recovery bin (28), and the lower end of the stirring recovery bin (28) away from the material guide tube (23) is slidably connected to a clamping plate (31), and the inner sides of both ends of the clamping plate (31) are fixedly connected to sliders (30), and both sides of the stirring recovery bin (28) are provided with sliding grooves (29) matching the sliders (30), and both ends of the clamping plate (31) are slidably connected to limit bolts (32), and the ends of the limit bolts (32) pass through the clamping plate (31) and the limit frame (25) and are threadedly connected to the stirring recovery bin (28).

6. The semiconductor photosensitive element welding device according to claim 5, characterized in that: A plug plate (39) is fixedly connected to the bottom of the mixing recovery bin (28), a transverse plate (26) matching the plug plate (39) is provided between the two limit frames (25), and two ends of the transverse plate (26) are respectively fixedly connected to the two limit frames (25).

7. The semiconductor photosensitive element welding device according to claim 4, characterized in that: A plurality of limit columns (35) are slidably connected to the middle position of the gate (37), both ends of the limit columns (35) are fixedly connected to the stirring recovery bin (28), the upper end of the limit column (35) is sleeved with a downward pressing elastic member (36), the upper end of the downward pressing elastic member (36) is fixedly connected to the stirring recovery bin (28), the lower end of the downward pressing elastic member (36) is fixedly connected to the gate (37), a wedge block (38) is fixedly connected to one side of the gate (37) close to the material guide pipe (23), and an extrusion block (21) matching the wedge block (38) is fixedly connected to the end of the movable frame (9).

8. The semiconductor photosensitive element welding device according to claim 3, characterized in that: An extrusion positioning block (18) is slidably connected to a side of the lower end of the limiting frame (14) close to the slag cleaning spoon (15); a storage cavity (19) is provided at one end of the extrusion positioning block (18) away from the slag cleaning spoon (15); an outward push elastic member (20) is provided inside the storage cavity (19); one end of the outward push elastic member (20) is fixedly connected to the extrusion positioning block (18), and the other end of the outward push elastic member (20) is fixedly connected to the limiting frame (14).

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