Wafer cutting device for semiconductor sealing and testing

Abstract

The invention discloses a wafer cutting device for semiconductor sealing and testing, and relates to the technical field of wafer processing. The laser cutting machine comprises a machining table, a laser cutting machine body is arranged on the upper portion of the inner wall of the machining table, and a discharging device is arranged at the top of the machining table and comprises a through hole disc, a belt ring, a motor, a belt wheel, a plurality of first through hole frames, a plurality of side baffles and a plurality of bearing discs. The through hole disc penetrates through the top of the machining table and is rotationally installed on the top of the machining table, a plurality of through holes are formed in the eccentric position of the top of the through hole disc, and the belt ring is fixed to the bottom of the through hole disc. According to the invention, through the arrangement of the discharging device, the through hole disc and the bearing disc drive the wafer supporting plate to carry out feeding and discharging on the wafer needing to be cut, and the wafer feeding and discharging steps are simplified, so that the cutting operation and the feeding and discharging operation of the wafer can be synchronously carried out, and the production efficiency of wafer cutting is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a wafer cutting device for semiconductor packaging and testing. Background Art

[0002] Wafer cutting devices are used to accurately cut semiconductor wafers into small pieces (chips). The equipment uses high-precision tools and control systems to ensure positioning and speed during the cutting process to reduce material waste and improve production efficiency. It is widely used in the semiconductor manufacturing industry and is suitable for wafers of different materials to ensure the quality and consistency of chips.

[0003] The Chinese patent with patent announcement number CN217433365U discloses a semiconductor wafer cutting device, which specifically relates to the field of semiconductor wafer cutting technology, including a base, a support column fixedly provided on the top of the base, a sliding seat provided on the outside of the support column, a slider fixedly provided on one side of the sliding seat, a moving slider provided on the outside of the slider, a support rod fixedly provided on one side of the moving slider, a sliding block provided on the outside of the support rod, a laser cutting machine fixedly provided at the bottom of the sliding block, and a separation mechanism provided at the bottom of the laser cutting machine. The patent sets up an adjustable cutting mechanism, which plays a role of fixing the wafer through a fixed table in conjunction with a fixed clamping block, and a pressure pump cooperates with a water outlet pipe to cool down and rinse the wafer during cutting. When the cutting is completed, molecular attraction is generated between the liquid-filled wafer and the fixed table, and only the automatic telescopic rod needs to drive the supporting circular plate to move upward, thereby separating the wafer and facilitating the wafer to be taken.

[0004] However, the current cutting device has the following problems: in the actual process of processing and cutting wafers, the cutting device is not convenient for quickly replacing wafers for cutting. The wafer needs to be loaded each time the wafer is cut, and then unloaded after the wafer cutting is completed. This operation of loading and unloading and cutting wafers consumes a lot of time and reduces the overall production efficiency. Under high demand conditions, this low efficiency may lead to insufficient production capacity. Therefore, we propose a wafer cutting device for semiconductor packaging and testing. Summary of the invention

[0005] In view of the deficiencies of the prior art, the present invention provides a wafer cutting device for semiconductor packaging and testing, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a wafer cutting device for semiconductor packaging and testing, comprising a processing table, a laser cutting machine body is arranged above the inner wall of the processing table, a material discharge device is arranged on the top of the processing table, and the material discharge device comprises a through-hole disk, a belt ring, a motor, a pulley, a plurality of through-hole racks, a plurality of side baffles, and a plurality of supporting disks, the through-hole disk penetrates and is rotatably installed on the top of the processing table, and a plurality of through holes are opened at the eccentric position of the top of the through-hole disk, the belt ring is fixed to the bottom of the through-hole disk, and the motor is fixed to the processing The inner wall of the table, the pulley is fixed on the top of the output end of the motor, and the pulley and the belt ring are connected by belt transmission, a plurality of through-hole frames are respectively fixed on the inner walls below the plurality of through-holes of the through-hole disk, a plurality of carrying plates are respectively fixed on the top of the through-hole frame by springs, a plurality of side baffles are evenly fixed on the top of the through-hole disk, and two of the plurality of side baffles form a group, and the two side baffles are respectively located on both sides of a single through-hole of the through-hole disk, a wafer support plate is placed on the top of the carrying plate, and a notch is provided on the front side of the top of the processing table, The recess is used to accommodate a loading robot for the wafer pallet, and two limit plates are fixed to one side of the top of the processing table. The two limit plates are used to limit the movement trajectory of the unloading robot for the wafer pallet, and the two limit plates are located on the discharge side of the processing table. The outside of the through-hole disk and the carrying disk are both provided with notches for accommodating a loading robot for the wafer pallet. The wafer pallet is placed on the carrying disk by the loading robot, and the two side baffles will limit the wafer pallet to the carrying disk. The pulley is driven by a motor to rotate, and the pulley drives the belt ring to rotate through the belt, and the belt ring drives the through-hole disk to rotate. The through-hole plate will drive the carrier plate without the wafer pallet to rotate to the recess. At this time, the loading mechanism can place the wafer pallet on the carrier plate again. At the same time, in this process, the through-hole plate will drive the carrier plate with the wafer pallet to rotate to the lower position of the laser cutting machine body. The laser cutting machine body can be started to perform laser cutting on the wafer on the wafer pallet. After the laser cutting of the wafer on the wafer pallet is completed, the through-hole plate is driven by the motor to rotate again. The through-hole plate will drive the cut wafer to rotate to the discharge side of the processing table, and the unloading robot will take away the wafer pallet placed on the carrier plate.

[0007] According to the above technical solution, the discharge device also includes a plurality of elastic telescopic rods, and the plurality of elastic telescopic rods are evenly fixed at the top eccentric point of the through-hole disk, and the telescopic end of the elastic telescopic rod is arranged toward the direction of the carrying disk, and a card slot matching the telescopic end of the elastic telescopic rod is provided on the outside of the wafer pallet. At the same time, when the loading robot places the wafer pallet on the carrying disk, the loading robot will drive the card slot of the wafer pallet to overlap with the telescopic end of the elastic telescopic rod, so that the elastic telescopic rod limits the position of the wafer pallet.

[0008] According to the above technical scheme, the discharge device also includes an arc plate, which is fixed on the top of the processing table and is located on the side of the processing table away from the discharge material. The inner wall of the arc plate is set as a rough surface, and the outer wall of the wafer support plate is set as a rough surface. The arc plate is located on the movement trajectory of the wafer support plate. When the loading robot places the wafer support plate on the carrying plate, the telescopic end of the elastic telescopic rod is not inserted into the card slot of the wafer support plate. When the through-hole plate drives the wafer support plate to rotate through the carrying plate, since the wafer support plate is not restricted by the telescopic end of the elastic telescopic rod, the wafer support plate can rotate between the two side baffles. Under the action of the friction force between the arc plate and the wafer support plate, the through-hole plate drives the wafer support plate to rotate through the carrying plate. During the process, the wafer support plate will rotate between the two side baffles until the card slot of the wafer support plate rotates to the telescopic end of the elastic telescopic rod, and then the telescopic end of the elastic telescopic rod will be inserted into the card slot of the wafer support plate.

[0009] According to the above technical scheme, a lifting device is provided at the bottom of the through hole disk, and the lifting device includes a raised ring and a plurality of resistance columns. The raised ring is fixed to the bottom of the inner wall of the processing table, and a trapezoidal block is fixed to the top of the raised ring. The trapezoidal block of the raised ring is located on the discharge side of the processing table. Several resistance columns are respectively fixed to the bottom of several supporting disks, and the resistance columns vertically penetrate the through hole frame one. The bottom of the resistance column contacts the top surface of the raised ring. Each time the through hole disk rotates, the through hole disk will drive the resistance column to rotate through the supporting disk. When the resistance column rotates to the trapezoidal block of the raised ring, the trapezoidal block of the raised ring will drive the resistance column to move upward, and the resistance column pushes the supporting disk to lift up. The spring corresponding to the supporting disk is stretched, and the supporting disk lifts the wafer pallet.

[0010] According to the above technical solution, the pushing device also includes an L-shaped rod and a scraper ring. The L-shaped rod is fixed at the outer wall of the resistance column, and the scraper ring is fixed at the top of the L-shaped rod. The scraper ring contacts the inner wall of the through hole of the through hole disk. When the resistance column moves upward, the L-shaped rod will move upward, and the L-shaped rod will drive the scraper ring to move upward, and the scraper ring will scrape the inner wall of the through hole of the through hole disk.

[0011] According to the above technical solution, the ejecting device also includes a slider, a spring sheet, a bump plate, a push rod, and an L-shaped knocking rod. The slider is slidably installed on the outer wall of the cross bar of the L-shaped rod, the spring sheet is arranged between the slider and the L-shaped rod, the bump plate is fixed at the eccentric position of the bottom of the through-hole frame, and a semi-arc bump is fixed on the outer wall of the bump plate, the push rod is fixed on the outer wall of the slider, and the end of the push rod away from the slider is arranged in a semi-arc shape, the semi-arc bump of the bump plate is located on the semi-arc motion trajectory of the push rod, the middle part of the L-shaped knocking rod is fixed to the bottom of the slider, one end of the L-shaped knocking rod is in contact with the outer wall of the abutment column, and the L The other end of the L-shaped knocking rod contacts the outer wall of the L-shaped rod, and at the same time, the L-shaped rod drives the slider to move, and the slider drives the push rod to move. When the semi-arc shape of the push rod moves to the semi-arc bump position of the bump plate, the semi-arc bump of the bump plate pushes the semi-arc shape of the push rod to drive the slider to move away from the resistance column, and the slider drives the vertical rod of the L-shaped knocking rod away from the L-shaped rod, and the cross bar of the L-shaped knocking rod away from the resistance column. When the semi-arc bump of the bump plate no longer pushes the semi-arc shape of the push rod, under the elastic force of the spring sheet, the spring sheet drives the slider to reset, and the slider drives the vertical rod of the L-shaped knocking rod to knock the L-shaped rod, and the cross bar of the L-shaped knocking rod to knock the resistance column.

[0012] According to the above technical scheme, an anti-misalignment device is provided at the bottom of the through-hole plate, and the anti-misalignment device includes a U-shaped frame, a folding bag, a pressure plate, a plurality of oblique air nozzles, a chicken claw-shaped tube, a through-hole frame 2, a connecting column, an inner annular skewed groove cylinder, and a one-way air inlet nozzle. The U-shaped frame is fixed to the bottom of the processing table, the folding bag is fixed to the top of the U-shaped frame, the pressure plate is fixed to the top of the folding bag, the chicken claw-shaped tube is fixed to the top of the pressure plate, a plurality of the oblique air nozzles are evenly and equidistantly fixed to the bottom of the horizontal tube of the chicken claw-shaped tube, the one-way air inlet nozzle is fixed to the bottom of the folding bag, the inner annular skewed groove cylinder is fixed to the bottom of the inner wall of the processing table, and an annular oblique groove is opened on the inner wall of the inner annular skewed groove cylinder, one end of the connecting column is fixed to the outer wall of the pressure plate, and the other end of the connecting column is slidably installed on the inner annular skewed groove cylinder. The folding tube is arranged at the lower end of the vertical tube of the chicken claw-shaped tube, and the upper end of the vertical tube of the chicken claw-shaped tube passes through and is rotatably installed on the top of the second through-hole frame. The one-way air inlet nozzle is used to control the one-way air intake of the folding bag, and the oblique air nozzle is a one-way air outlet structure, and the oblique air nozzle is used to control the one-way air outlet of the folding bag. When the through-hole disk rotates, the inner annular inclined groove cylinder will be driven to rotate, and the annular inclined groove of the inner annular inclined groove cylinder pushes the connecting column to drive the pressure plate to move back and forth up and down. Each time the pressure plate moves downward, the pressure plate will squeeze the folding bag, and the air in the folding bag will be transmitted to the oblique air nozzle through the chicken claw-shaped tube and sprayed out. The air sprayed from the oblique air nozzle will blow and clean the surface of the carrier plate.

[0013] The present invention provides a wafer cutting device for semiconductor packaging and testing, which has the following beneficial effects:

[0014] (1) The present invention arranges a discharge device so that the carrier plate, side baffle plate, motor, pulley, belt ring, through-hole plate, notch, and laser cutting machine body cooperate, so that the through-hole plate and the carrier plate drive the wafer support plate to load and unload the wafers to be cut, thereby simplifying the steps of wafer loading and unloading, so that the wafer cutting operation and loading and unloading operation can be carried out simultaneously, thereby improving the production efficiency of wafer cutting; at the same time, the wafer support plate, the carrier plate, and the elastic telescopic rod cooperate, so that the elastic telescopic rod limits the position of the wafer support plate, thereby avoiding This eliminates the problem that the wafer pallet is displaced after being placed on the carrier plate, and the laser cutting machine body cannot accurately align the wafer when cutting the wafer, resulting in the cutting line being offset, which affects the quality of the final product. At the same time, the wafer pallet, the carrier plate, the elastic telescopic rod, the elastic telescopic rod, and the arc plate cooperate so that the telescopic end of the elastic telescopic rod can be inserted into the slot of the wafer pallet, thereby ensuring that the telescopic end of the elastic telescopic rod can also be inserted into the slot of the wafer pallet when the loading robot does not drive the slot of the wafer pallet to align with the telescopic end of the elastic telescopic rod.

[0015] (2) The present invention arranges a lifting device so that the through-hole plate, the supporting plate, the abutment column and the raised ring cooperate with each other, so that the supporting plate lifts the wafer support plate, thereby facilitating the unloading robot to remove the wafer support plate from the supporting plate, thereby ensuring that the wafer cutting operation can be carried out in an orderly manner; at the same time, the abutment column and the L-shaped rod cooperate to drive the scraper ring to move upward, and the scraper ring scrapes the inner wall of the through hole of the through-hole plate, thereby avoiding the problem that impurities generated during the wafer cutting process penetrate into the space between the supporting plate and the through hole of the through-hole plate and affect the displacement of the supporting plate; at the same time, the L-shaped rod, the slider, the push rod and the raised block plate cooperate so that the slider drives the vertical rod of the L-shaped knocking rod to knock the L-shaped rod, and the horizontal rod of the L-shaped knocking rod knocks the abutment column, and the L-shaped rod vibrates and drives the scraper ring to vibrate, thereby improving the efficiency of the scraper ring in scraping off impurities adhered to the inner wall of the through-hole plate, and the abutment column vibrates and drives the supporting plate to vibrate. The vibration of the supporting plate can avoid the problem of the supporting plate getting stuck during operation. When the supporting plate is stuck, an appropriate amount of vibration may help to restore the normal operation of the supporting plate.

[0016] (3) The present invention sets an anti-misalignment device so that the through-hole plate, the inner annular inclined groove cylinder, the connecting column and the pressure plate cooperate to squeeze the folding bag. The air in the folding bag is transmitted to the inclined air nozzle through the chicken claw-shaped tube and sprayed out. The air sprayed from the inclined air nozzle will blow and clean the surface of the carrier plate, thereby avoiding the problem that impurities will interfere with the contact between the wafer pallet and the carrier plate when the wafer pallet is placed on the carrier plate next time, resulting in unstable position of the wafer pallet, thereby affecting the accuracy of wafer cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A schematic diagram of the present invention as a whole;

[0018] Figure 2 A partial cross-section diagram of the present invention Figure 1 ;

[0019] Figure 3 A partial cross-section diagram of the present invention Figure 2 ;

[0020] Figure 4 Schematic diagram of the discharge device of the present invention Figure 1 ;

[0021] Figure 5 Schematic diagram of the discharge device of the present invention Figure 2 ;

[0022] Figure 6 It is a schematic diagram of the material ejecting device of the present invention;

[0023] Figure 7 It is a partial structural schematic diagram of the ejecting device of the present invention;

[0024] Figure 8 A partial cross-sectional view of the anti-misalignment device of the present invention Figure 1 ;

[0025] Fig. 9 A partial cross-sectional view of the anti-misalignment device of the present invention Figure 2 ;

[0026] Fig.10 Schematic diagram of the inner annular skewed groove cylinder of the present invention.

[0027] In the figure: 1. processing table; 2. laser cutting machine body; 3. notch; 4. limit plate; 5. wafer support plate; 6. material discharge device; 61. through-hole plate; 62. belt ring; 63. motor; 64. pulley; 65. through-hole frame one; 66. elastic telescopic rod; 67. side baffle; 68. bearing plate; 69. arc plate; 7. material lifting device; 71. raised ring; 72. abutment column; 73. L-shaped rod; 74. scraper ring; 75. slider; 76. spring piece; 77. bump plate; 78. push rod; 79. L-shaped knocking rod; 8. anti-misalignment device; 81. U-shaped frame; 82. folding bag; 83. pressure plate; 84. oblique air nozzle; 85. chicken claw-shaped tube; 86. through-hole frame two; 87. connecting column; 88. inner annular oblique groove cylinder; 89. one-way air inlet nozzle. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0029] See also Figure 1- Fig.10 An embodiment of the present invention is: a wafer cutting device for semiconductor packaging and testing, comprising a processing table 1, a laser cutting machine body 2 is arranged above the inner wall of the processing table 1, a material discharge device 6 is arranged on the top of the processing table 1, and the material discharge device 6 comprises a through-hole disk 61, a belt ring 62, a motor 63, a pulley 64, a plurality of through-hole racks 65, a plurality of side baffles 67, and a plurality of supporting disks 68. The through-hole disk 61 penetrates and is rotatably installed on the top of the processing table 1, and a plurality of through holes are opened at the eccentric position of the top of the through-hole disk 61. The belt ring 62 is fixed to the bottom of the through-hole disk 61, the motor 63 is fixed to the inner wall of the processing table 1, the pulley 64 is fixed to the top of the output end of the motor 63, and the pulley 64 and the belt ring 62 are connected by belt transmission, a plurality of through-hole racks 65 are respectively fixed to the inner wall below the plurality of through holes of the through-hole disk 61, a plurality of supporting disks 68 are respectively fixed to the top of the through-hole rack 65 by springs, and a plurality of side baffles The plate 67 is evenly fixed on the top of the through-hole disk 61 in a circumference, and two side baffles 67 among the several side baffles 67 form a group, and the two side baffles 67 are respectively located on both sides of a single through-hole of the through-hole disk 61. A wafer pallet 5 is placed on the top of the carrying disk 68, and a recess 3 is provided on the front side of the top of the processing table 1, and the recess 3 is used to accommodate a loading robot for the wafer pallet 5. Two limit plates 4 are fixed on one side of the top of the processing table 1, and the two limit plates 4 are used to limit the movement trajectory of the unloading robot for the wafer pallet 5, and the two limit plates 4 are located on the discharge side of the processing table 1. Notches for accommodating the loading robot for the wafer pallet 5 are provided on the outside of the through-hole disk 61 and the carrying disk 68. Through the arrangement of the above-mentioned structure, the through-hole disk 61 and the carrying disk 68 drive the wafer pallet 5 to load and unload the wafers to be cut, which simplifies the steps of loading and unloading the wafers, so that the wafer cutting operation and the loading and unloading operation can be carried out simultaneously, thereby improving the production efficiency of wafer cutting.

[0030] The discharge device 6 also includes a plurality of elastic telescopic rods 66, which are evenly fixed at the top eccentric point of the through-hole plate 61 around the circumference, and the telescopic end of the elastic telescopic rod 66 is arranged in the direction of the supporting plate 68. A card slot matching the telescopic end of the elastic telescopic rod 66 is provided on the outside of the wafer pallet 5. Through the arrangement of the above structure, the card slot of the wafer pallet 5 coincides with the telescopic end of the elastic telescopic rod 66, so that the elastic telescopic rod 66 limits the position of the wafer pallet 5, thereby avoiding the displacement of the wafer pallet 5 after being placed on the supporting plate 68, and the laser cutting machine body 2 cannot accurately align the wafer when cutting the wafer, resulting in the cutting line offset, affecting the quality of the final product.

[0031] The discharge device 6 also includes an arc plate 69, which is fixed on the top of the processing table 1, and the arc plate 69 is located on the side of the processing table 1 away from the discharge, the inner wall of the arc plate 69 is set as a rough surface, and the outer wall of the wafer support plate 5 is set as a rough surface. The arc plate 69 is located on the movement trajectory of the wafer support plate 5. Through the setting of the above structure, the telescopic end of the elastic telescopic rod 66 will be stuck in the slot of the wafer support plate 5, thereby ensuring that when the loading robot does not drive the slot of the wafer support plate 5 to align with the telescopic end of the elastic telescopic rod 66, the telescopic end of the elastic telescopic rod 66 can also be stuck in the slot of the wafer support plate 5.

[0032] A lifting device 7 is provided at the bottom of the through-hole plate 61, and the lifting device 7 includes a raised ring 71 and a plurality of abutment columns 72. The raised ring 71 is fixed to the bottom of the inner wall of the processing table 1, and a trapezoidal block is fixed to the top of the raised ring 71. The trapezoidal block of the raised ring 71 is located on the discharge side of the processing table 1. The plurality of abutment columns 72 are respectively fixed to the bottom of a plurality of supporting plates 68, and the abutment columns 72 vertically penetrate the through-hole frame 65. The bottom of the abutment columns 72 contacts with the top surface of the raised ring 71. Through the arrangement of the above structure, the supporting plate 68 lifts the wafer pallet 5, which is convenient for the unloading robot to remove the wafer pallet 5 from the supporting plate 68, thereby ensuring that the wafer cutting operation can be carried out in an orderly manner.

[0033] The lifting device 7 also includes an L-shaped rod 73 and a scraper ring 74. The L-shaped rod 73 is fixed on the outer wall of the abutment column 72, and the scraper ring 74 is fixed on the top of the L-shaped rod 73. The scraper ring 74 contacts the inner wall of the through hole of the through hole plate 61. Through the arrangement of the above structure, the L-shaped rod 73 drives the scraper ring 74 to move upward, and the scraper ring 74 scrapes the inner wall of the through hole of the through hole plate 61, thereby avoiding the impurities generated during the wafer cutting process from entering between the supporting plate 68 and the through hole of the through hole plate 61, affecting the displacement of the supporting plate 68.

[0034] The ejecting device 7 also includes a slider 75, a spring piece 76, a bump plate 77, a push rod 78, and an L-shaped knocking rod 79. The slider 75 is slidably mounted on the outer wall of the cross bar of the L-shaped rod 73. The spring piece 76 is arranged between the slider 75 and the L-shaped rod 73. The bump plate 77 is fixed at the eccentric position of the bottom of the through-hole frame 65, and a semi-arc bump is fixed on the outer wall of the bump plate 77. The push rod 78 is fixed on the outer wall of the slider 75, and the end of the push rod 78 away from the slider 75 is arranged in a semi-arc shape. The semi-arc bump of the bump plate 77 is located on the semi-arc motion trajectory of the push rod 78. The middle part of the L-shaped knocking rod 79 is fixed to the bottom of the slider 75, and one end of the L-shaped knocking rod 79 is fixed to the abutment The outer wall of the contact column 72 is in contact, and the other end of the L-shaped knocking rod 79 is in contact with the outer wall of the L-shaped rod 73. Through the arrangement of the above-mentioned structure, the slider 75 drives the vertical rod of the L-shaped knocking rod 79 to knock the L-shaped rod 73, and the horizontal rod of the L-shaped knocking rod 79 knocks the contact column 72. The L-shaped rod 73 vibrates and drives the scraper ring 74 to vibrate, thereby improving the efficiency of the scraper ring 74 in scraping off impurities adhered to the inner wall of the through-hole plate 61. The resistance column 72 vibrates and drives the supporting plate 68 to vibrate. The vibration of the supporting plate 68 can avoid the problem of the supporting plate 68 getting stuck during operation. When the supporting plate 68 is stuck, an appropriate amount of vibration may help to restore the normal operation of the supporting plate 68.

[0035] When in use, the wafer pallet 5 is placed on the carrying plate 68 through the loading robot, and the two side baffles 67 will limit the wafer pallet 5 on the carrying plate 68. The pulley 64 is driven to rotate by the motor 63. The pulley 64 drives the belt ring 62 to rotate through the belt, and the belt ring 62 drives the through-hole plate 61 to rotate. When the through-hole plate 61 drives the carrying plate 68 without the wafer pallet 5 to rotate to the recess 3, the loading machine can place the wafer pallet 5 on the carrying plate 68 again. At the same time, in this process, the through-hole plate 61 will drive the carrying plate 68 with the wafer pallet 5 to rotate to the lower position of the laser cutting machine body 2, and start the laser cutting machine body. 2 can perform laser cutting on the wafer on the wafer support plate 5. When the laser cutting of the wafer on the wafer support plate 5 is completed, the motor 63 is used to drive the through-hole plate 61 to rotate again. The through-hole plate 61 will drive the cut wafer to rotate to the discharge side of the processing table 1. The unloading robot will take away the wafer support plate 5 placed on the carrier plate 68. The through-hole plate 61 and the carrier plate 68 drive the wafer support plate 5 to load and unload the wafer to be cut, which simplifies the steps of wafer loading and unloading, so that the wafer cutting operation and the loading and unloading operation can be carried out simultaneously, thereby improving the production efficiency of wafer cutting. At the same time, the loading robot places the wafer support plate 5 on the carrier plate 68, The loading mechanism will drive the card slot of the wafer support plate 5 to coincide with the telescopic end of the elastic telescopic rod 66, so that the elastic telescopic rod 66 limits the position of the wafer support plate 5, thereby avoiding the wafer support plate 5 from being displaced after being placed on the carrier plate 68, and the laser cutting machine body 2 cannot accurately align the wafer when cutting the wafer, resulting in the cutting line being offset, affecting the quality of the final product; when the loading robot places the wafer support plate 5 on the carrier plate 68, the telescopic end of the elastic telescopic rod 66 is not inserted into the card slot of the wafer support plate 5, and the through-hole plate 61 drives the wafer support plate 5 to rotate via the carrier plate 68. Since the wafer support plate 5 is not moved by the elastic telescopic rod 66, 6 is limited by the telescopic end, therefore, the wafer pallet 5 can rotate between the two side baffles 67, and under the action of the friction force between the arc plate 69 and the wafer pallet 5, the through-hole plate 61 drives the wafer pallet 5 to rotate through the supporting plate 68. During the rotation process, the wafer pallet 5 will rotate between the two side baffles 67 until the slot of the wafer pallet 5 rotates to the telescopic end of the elastic telescopic rod 66, and then, the telescopic end of the elastic telescopic rod 66 will be stuck in the slot of the wafer pallet 5, thereby ensuring that the telescopic end of the elastic telescopic rod 66 can also be stuck in the slot of the wafer pallet 5 when the loading robot does not drive the slot of the wafer pallet 5 to align with the telescopic end of the elastic telescopic rod 66.

[0036] Each time the through-hole disk 61 rotates, the through-hole disk 61 drives the abutment column 72 to rotate through the carrying disk 68. When the abutment column 72 rotates to the trapezoidal block of the raised ring 71, the trapezoidal block of the raised ring 71 drives the abutment column 72 to move upward, and the abutment column 72 pushes the carrying disk 68 upward. The spring corresponding to the carrying disk 68 is stretched, and the carrying disk 68 lifts the wafer support plate 5, which is convenient for the unloading robot to remove the wafer support plate 5 from the carrying disk 68, thereby ensuring the wafer cutting operation. The operation can be carried out in an orderly manner; at the same time, when the resistance column 72 moves upward, it will drive the L-shaped rod 73 to move upward, and the L-shaped rod 73 will drive the scraper ring 74 to move upward, and the scraper ring 74 will scrape the inner wall of the through hole of the through hole plate 61, thereby avoiding the problem that impurities generated during the wafer cutting process penetrate into the space between the carrier plate 68 and the through hole of the through hole plate 61, affecting the displacement of the carrier plate 68; at the same time, the L-shaped rod 73 drives the slider 75 to move, and the slider 75 drives the push rod 78 to move. When the semi-arc of the push rod 78 When the semi-arc protrusion of the protrusion plate 77 no longer pushes the semi-arc protrusion of the push rod 78, the spring piece 76 drives the slide block 75 to reset under the elastic force of the spring piece 76, and the slide block 75 drives the L-shaped knocking rod 79 to move in the direction away from the abutment column 72. The vertical rod of the striking rod 79 strikes the L-shaped rod 73, and the horizontal rod of the L-shaped striking rod 79 strikes the resistance column 72. The L-shaped rod 73 vibrates and drives the scraper ring 74 to vibrate, thereby improving the efficiency of the scraper ring 74 in scraping off impurities adhered to the inner wall of the through-hole plate 61. The resistance column 72 vibrates and drives the supporting plate 68 to vibrate. The vibration of the supporting plate 68 can avoid the problem of the supporting plate 68 getting stuck during operation. When the supporting plate 68 is stuck, an appropriate amount of vibration may help restore the normal operation of the supporting plate 68.

[0037] See also Figure 1 - Fig.10 On the basis of the above embodiment, in another embodiment of the present invention, an anti-misalignment device 8 is provided at the bottom of the through-hole plate 61.

[0038] The anti-dislocation device 8 includes a U-shaped frame 81, a folding capsule 82, a pressure plate 83, a plurality of oblique air nozzles 84, a chicken claw-shaped tube 85, a through-hole frame 86, a connecting column 87, an inner annular inclined groove cylinder 88, and a one-way air inlet nozzle 89. The U-shaped frame 81 is fixed to the bottom of the processing table 1, the folding capsule 82 is fixed to the top of the U-shaped frame 81, the pressure plate 83 is fixed to the top of the folding capsule 82, the chicken claw-shaped tube 85 is fixed to the top of the pressure plate 83, and the plurality of oblique air nozzles 84 are fixed to the top of the folding capsule 82. The unidirectional air inlet nozzle 89 is fixed at the bottom of the horizontal tube of the chicken claw-shaped tube 85 at uniform intervals, the inner annular chute tube 88 is fixed at the bottom of the inner wall of the processing table 1, and an annular chute is provided at the inner wall of the inner annular chute tube 88. One end of the connecting column 87 is fixed at the outer wall of the pressure plate 83, and the other end of the connecting column 87 is slidably installed inside the annular chute of the inner annular chute tube 88. The middle part of the through hole plate 61 is provided with a hole for accommodating the chicken claw-shaped tube 85. The circular mouth of the claw-shaped tube 85 and the second through-hole frame 86 are fixed on the inner wall of the circular mouth of the through-hole plate 61. The lower end of the vertical tube of the chicken claw-shaped tube 85 is set as a folding tube. The upper end of the vertical tube of the chicken claw-shaped tube 85 passes through and is rotatably installed on the top of the second through-hole frame 86. The one-way air inlet nozzle 89 is used to control the one-way air intake of the folding bag 82. The oblique air nozzle 84 is a one-way air outlet structure, and the oblique air nozzle 84 is used to control the one-way air outlet of the folding bag 82. Through the setting of the above structure, the pressure plate 83 will squeeze the folding bag 82, and the air in the folding bag 82 is transmitted to the oblique air nozzle 84 through the chicken claw-shaped tube 85 and sprayed out. The air sprayed by the oblique air nozzle 84 will blow and clean the surface of the carrier plate 68, thereby avoiding the problem that when the carrier plate 68 is placed on the wafer pallet 5 next time, impurities will interfere with the contact between the wafer pallet 5 and the carrier plate 68, resulting in an unstable position of the wafer pallet 5, thereby affecting the accuracy of wafer cutting.

[0039] When in use, when the through-hole disk 61 rotates, the inner annular inclined groove cylinder 88 will be driven to rotate, and the annular inclined groove of the inner annular inclined groove cylinder 88 will push the connecting column 87 to drive the pressure plate 83 to move up and down reciprocatingly. Every time the pressure plate 83 moves downward, the pressure plate 83 will squeeze the folding bag 82, and the air in the folding bag 82 will be transmitted to the inclined air nozzle 84 through the chicken claw-shaped tube 85 and sprayed out. The air sprayed by the inclined air nozzle 84 will blow and clean the surface of the carrier plate 68, thereby preventing impurities from interfering with the wafer pallet 5 and the carrier plate when the wafer pallet 5 is placed on the carrier plate 68 next time. The contact between 68 causes the position of the wafer support plate 5 to be unstable, thereby affecting the accuracy of wafer cutting. Each time the pressure plate 83 moves upward, the pressure plate 83 will stretch the folding bag 82. At this time, the folding bag 82 is supplemented with air through the one-way air inlet nozzle 89. The through-hole plate 61 here will drive the through-hole frame 2 86 to rotate when it rotates. Since the chicken claw-shaped tube 85 and the pressure plate 83 are fixed, and the chicken claw-shaped tube 85 and the through-hole frame 2 86 penetrate and rotate, the chicken claw-shaped tube 85 will not rotate with the rotation of the through-hole frame 2 86.

[0040] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer cutting device for semiconductor packaging and testing, comprising a processing table (1), wherein a laser cutting machine body (2) is arranged above the inner wall of the processing table (1), characterized in that: A material discharge device (6) is arranged on the top of the processing table (1), and the material discharge device (6) comprises a through-hole disk (61), a belt ring (62), a motor (63), a belt pulley (64), a plurality of through-hole frames (65), a plurality of side baffles (67), and a plurality of bearing disks (68). The through-hole disk (61) penetrates and is rotatably mounted on the top of the processing table (1), and a plurality of through holes are opened at an eccentric position on the top of the through-hole disk (61). The belt ring (62) is fixed to the bottom of the through-hole disk (61), the motor (63) is fixed to the inner wall of the processing table (1), and the belt pulley (64) is fixed to the output end of the motor (63). The top of the output end is connected with the pulley (64) and the belt ring (62) by belt transmission, a plurality of through-hole racks (65) are respectively fixed on the inner wall below the plurality of through-holes of the through-hole disk (61), a plurality of supporting disks (68) are respectively fixed on the top of the through-hole racks (65) by springs, a plurality of side baffles (67) are evenly fixed on the top of the through-hole disk (61) in a circumference, and two side baffles (67) among the plurality of side baffles (67) form a group, and the two side baffles (67) are respectively located on both sides of a single through-hole of the through-hole disk (61), and a wafer support plate (5) is placed on the top of the supporting disk (68).

2. The wafer cutting device for semiconductor packaging and testing according to claim 1, characterized in that: The discharge device (6) also includes a plurality of elastic telescopic rods (66), which are evenly fixed at the top eccentric position of the through-hole plate (61) in a circumferential manner, and the telescopic ends of the elastic telescopic rods (66) are arranged in a direction toward the supporting plate (68), and a slot matching the telescopic ends of the elastic telescopic rods (66) is provided on the outside of the wafer support plate (5).

3. The wafer cutting device for semiconductor packaging and testing according to claim 2, characterized in that: The discharge device (6) further comprises an arc plate (69), wherein the arc plate (69) is fixed on the top of the processing table (1), and the arc plate (69) is located on a side of the processing table (1) away from the discharge.

4. The wafer cutting device for semiconductor packaging and testing according to claim 3, characterized in that: The inner wall of the arc plate (69) is provided as a rough surface, the outer wall of the wafer support plate (5) is provided as a rough surface, and the arc plate (69) is located on the movement track of the wafer support plate (5).

5. The wafer cutting device for semiconductor packaging and testing according to claim 4, characterized in that: A recess (3) is provided on the front side of the top of the processing table (1), and the recess (3) is used to accommodate a loading robot for a wafer pallet (5). Two limit plates (4) are fixed on one side of the top of the processing table (1), and the two limit plates (4) are used to limit the movement trajectory of a unloading robot for the wafer pallet (5). The two limit plates (4) are located on the discharge side of the processing table (1). The outside of the through-hole plate (61) and the supporting plate (68) are both provided with a notch for accommodating a loading robot for a wafer pallet (5).

6. The wafer cutting device for semiconductor packaging and testing according to claim 5, characterized in that: A material pushing device (7) is provided at the bottom of the through hole plate (61), and the material pushing device (7) comprises a raised ring (71) and a plurality of abutment columns (72). The raised ring (71) is fixed to the bottom of the inner wall of the processing table (1), and a trapezoidal block is fixed to the top of the raised ring (71). The trapezoidal block of the raised ring (71) is located on the discharge side of the processing table (1). The plurality of abutment columns (72) are respectively fixed to the bottom of a plurality of supporting plates (68), and the abutment columns (72) vertically penetrate the through hole frame (65). The bottom of the abutment columns (72) contacts the top surface of the raised ring (71).

7. The wafer cutting device for semiconductor packaging and testing according to claim 6, characterized in that: The ejecting device (7) further comprises an L-shaped rod (73) and a scraper ring (74), wherein the L-shaped rod (73) is fixed on the outer wall of the abutment column (72), and the scraper ring (74) is fixed on the top of the L-shaped rod (73), and the scraper ring (74) contacts the inner wall of the through hole of the through hole plate (61).

8. The wafer cutting device for semiconductor packaging and testing according to claim 7, characterized in that: The ejecting device (7) further comprises a slider (75), a spring sheet (76), a convex plate (77), a push rod (78), and an L-shaped knocking rod (79). The slider (75) is slidably mounted on the outer wall of the cross bar of the L-shaped rod (73). The spring sheet (76) is arranged between the slider (75) and the L-shaped rod (73). The convex plate (77) is fixed at the eccentric position of the bottom of the through hole frame (65). A semi-arc convex block is fixed on the outer wall of the convex plate (77). The push rod (78) is provided with a push rod (79). The push rod (78) is fixed on the outer wall of the slider (75), and the end of the push rod (78) away from the slider (75) is arranged in a semi-arc shape, the semi-arc protrusion of the protrusion plate (77) is located on the semi-arc movement trajectory of the push rod (78), the middle part of the L-shaped knocking rod (79) is fixed on the bottom of the slider (75), one end of the L-shaped knocking rod (79) contacts the outer wall of the abutment column (72), and the other end of the L-shaped knocking rod (79) contacts the outer wall of the L-shaped rod (73).

9. The wafer cutting device for semiconductor packaging and testing according to claim 8, characterized in that: The bottom of the through-hole plate (61) is provided with an anti-misalignment device (8), and the anti-misalignment device (8) comprises a U-shaped frame (81), a folding bag (82), a pressure plate (83), a plurality of oblique air nozzles (84), a chicken claw-shaped tube (85), a second through-hole frame (86), a connecting column (87), an inner annular inclined groove cylinder (88), and a one-way air inlet nozzle (89). The U-shaped frame (81) is fixed to the bottom of the processing table (1), the folding bag (82) is fixed to the top of the U-shaped frame (81), the pressure plate (83) is fixed to the top of the folding bag (82), the chicken claw-shaped tube (85) is fixed to the top of the pressure plate (83), a plurality of oblique air nozzles (84) are evenly and equidistantly fixed to the bottom of the horizontal tube of the chicken claw-shaped tube (85), and the one-way air inlet nozzle (89) is fixed to the top of the pressure plate (83). The air nozzle (89) is fixed to the bottom of the folding bag (82), the inner annular inclined groove cylinder (88) is fixed to the bottom of the inner wall of the processing table (1), and an annular inclined groove is opened on the inner wall of the inner annular inclined groove cylinder (88), one end of the connecting column (87) is fixed to the outer wall of the pressure plate (83), and the other end of the connecting column (87) is slidably installed inside the annular inclined groove of the inner annular inclined groove cylinder (88), and a circular opening for accommodating the chicken claw-shaped tube (85) is opened in the middle of the through hole plate (61), and the through hole frame (86) is fixed to the inner wall of the circular opening of the through hole plate (61), the lower end of the vertical tube of the chicken claw-shaped tube (85) is set as a folding tube, and the upper end of the vertical tube of the chicken claw-shaped tube (85) passes through and is rotatably installed on the top of the through hole frame (86).

10. The wafer cutting device for semiconductor packaging and testing according to claim 9, characterized in that: The one-way air inlet nozzle (89) is used to control the one-way air inlet of the folding bag (82), and the oblique air nozzle (84) is a one-way air outlet structure, and the oblique air nozzle (84) is used to control the one-way air outlet of the folding bag (82).

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