Semiconductor wafer grinding equipment

Abstract

The invention provides semiconductor wafer grinding equipment which comprises a workbench, a grinding box, a transverse and longitudinal moving mechanism, a clamping and rotating mechanism, a grinding mechanism and a detection mechanism, and the grinding box comprises a first box body and a second box body; the transverse and longitudinal moving mechanism is fixedly mounted on the workbench; the clamping and rotating mechanism comprises a clamping and rotating assembly and a supporting and rotating assembly, the supporting and rotating assembly is installed on the workbench, the clamping and rotating assembly is installed on the transverse and longitudinal moving mechanism, and the supporting and rotating assembly is matched with the clamping and rotating assembly to clamp a silicon rod to be ground between the supporting and rotating assembly and can drive the silicon rod to rotate; the grinding mechanism comprises a first air cylinder, a buffering assembly and a grinding assembly. The grinding assembly is used for grinding the outer surface of the silicon rod. The detection mechanism is used for detecting the flatness of the outer surface of the ground silicon rod, and after the silicon rod is detected to be qualified, the clamping rotating assembly clamps and fixes the silicon rod and drives the silicon rod to move out of the first box body through the transverse moving mechanism and the longitudinal moving mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer grinding equipment, and in particular to a semiconductor wafer grinding equipment. Background Art

[0002] Semiconductor wafers are primarily made of ultra-pure semiconductor materials, usually silicon. Silicon is abundant and easily forms stable oxides, making it an ideal material for modern CMOS processes. Other materials are also used to make wafers, such as sapphire (an electrical insulator), gallium arsenide (which has better optoelectronic properties and higher electron speed / mobility, used in high-speed transistors, lasers, and solar cells), and germanium (used in integrated optics and infrared imaging / detection applications).

[0003] Currently, the production of wafers requires the use of laser cutting equipment to cut silicon rods into extremely thin silicon slices, and then use optical and chemical etching methods to add circuits and electronic components to form wafers. Before laser cutting of the silicon rods, the surface and ends are prone to wear and scratches during transportation, so it is necessary to use grinding equipment to grind the surface in advance to make its surface smooth.

[0004] In the existing silicon rod grinding process, when the silicon rod is fixed and when the grinding roller contacts the silicon rod for grinding, it is impossible to accurately control the pressure generated between them, which can easily lead to damage of the silicon rod. In addition, there is a lack of detection of the surface flatness of the silicon rod during grinding. All of the above factors can easily lead to an increase in the defective rate. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a semiconductor wafer grinding device.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A semiconductor wafer grinding device comprises: a workbench; a grinding box, the grinding box comprises a box body 1 and a box body 2, the box body 1 is connected from top to bottom and fixedly mounted on the table top of the workbench, the box body 1 is provided with a plurality of openings at equal angles with its axis as the center, one side of the box body 2 is open, and the open side thereof is fixedly connected to the opening; a transverse and longitudinal moving mechanism, the transverse and longitudinal moving mechanism is fixedly mounted on the workbench; a clamping and rotating mechanism, the clamping and rotating mechanism comprises a clamping and rotating assembly and a supporting and rotating assembly, the supporting and rotating assembly is mounted on the workbench, the clamping and rotating assembly is mounted on the transverse and longitudinal moving mechanism, a silicon rod to be ground is placed on the supporting and rotating assembly, the supporting and rotating assembly cooperate with the clamping and rotating assembly to clamp the silicon rod to be ground between them and can drive it to rotate; a grinding mechanism, the grinding mechanism comprises a cylinder 1 , a buffer assembly and a grinding assembly, wherein the cylinder one is fixedly mounted on the box body two, the output end of the cylinder one passes through the box body two and is fixedly connected to the buffer assembly, the grinding assembly is fixedly connected to the buffer assembly, the cylinder one drives the grinding assembly to make a linear motion, contacts with the outer surface of the silicon rod to be ground, and grinds the outer surface; and a detection mechanism, the detection mechanism is provided with a plurality of them, which are installed in the box body one at equal angles with the central axis of the box body one as the center, the detection mechanism includes a linear motion unit and a micro laser scanner, the micro laser scanner is mounted on the linear motion unit, and the linear motion unit drives the micro laser scanner to make an up and down linear motion to detect the flatness of the outer surface of the ground silicon rod, and after the detection is qualified, the clamping and rotating assembly clamps and fixes the silicon rod and drives it to move out of the box body one through the horizontal and vertical moving mechanisms.

[0008] The lateral and longitudinal movement mechanism comprises: a lateral movement component, the lateral movement component comprises a mounting frame 1, a motor 1, a slider 1 and a guide rod 1, the mounting frame 1 is a U-shaped structure, which is fixedly mounted on the workbench, the motor 1 is fixedly mounted on the mounting frame 1, a screw 1 is fixedly mounted on the output shaft of the motor 1, the end of the screw 1 away from the motor 1 is rotatably connected to the mounting frame 1, the slider 1 is threadedly connected to the screw 1, a guide hole 1 is provided on the slider 1, the guide rod 1 passes through the guide hole 1, and both ends of the guide rod 1 are fixedly connected to the mounting frame 1; and a longitudinal movement component Parts, the longitudinal moving component includes a mounting frame 2, a motor 2, a slider 2, a guide rod 2 and a support frame, the mounting frame 2 is vertically fixedly installed on the slider 1, the motor 2 is fixedly installed on the top of the mounting frame 2, the output shaft of the motor 2 is fixedly installed with a screw 2, and the end of the screw 2 away from the motor 2 is rotatably connected to the mounting frame; the slider 2 is a T-shaped structure, which is threadedly connected to the screw 2, and a guide hole 1 is opened on the slider 2, the guide rod 2 passes through the guide hole 2, and its two ends are fixedly connected to the mounting frame 2, and one end of the support frame is fixedly connected to the slider 2.

[0009] The clamping rotating assembly includes: a cylinder 2, which is fixedly mounted on the support frame, and its output end passes through the support frame; a connecting disk, which is fixedly connected to the output end of the cylinder 2, and a groove 1 is opened at the bottom center of the connecting disk, and a connecting bearing is fixedly installed in the groove 1; a buffer unit 1, which includes a sleeve 1, a sleeve rod 1 and a buffer spring 1, one end of the sleeve 1 is fixedly connected to the inner ring of the connecting bearing, the sleeve rod 1 is slidably connected in the sleeve 1, the buffer spring 1 is located in the sleeve 1, and the two ends of the buffer spring 1 are respectively fixedly connected to a limit plate 1 and a limit plate A positioning plate 2, a pressure sensor 1 is fixedly installed in the sleeve 1, the limiting plate 1 is fixedly connected to the pressure sensor 1, the limiting plate 2 is fixedly connected to one end of the sleeve rod 1 located in the sleeve 1, and the other end of the sleeve rod 1 is fixedly connected to a pressure pad; an annular connecting cover, the annular connecting cover is fixedly connected to the bottom of the connecting disk; and a clamping unit, the clamping unit includes a plurality of electric telescopic rods, the electric telescopic rods are fixedly installed on the outer wall of the annular connecting cover at equal angles with the center of the annular connecting cover as the center, and the movable ends of the electric telescopic rods pass through the annular connecting cover to the inside thereof and are fixedly installed with clamping blocks.

[0010] The supporting rotating assembly includes: motor three, which is fixedly installed on the top of the workbench, and the output shaft of motor three passes through the workbench to its outside; a support table, which is fixedly connected to the output shaft of motor three, and the surface of the support table is provided with groove two, and a support pad is installed in the groove two.

[0011] The buffer assembly includes: a buffer unit 2, the buffer unit 2 includes a sleeve 2, a sleeve rod 2 and a buffer spring 2, one end of the sleeve 2 is fixedly connected to the output end of the cylinder 1, the sleeve rod 1 is slidably connected in the sleeve 1, the buffer spring 2 is located in the sleeve 2, the two ends of the buffer spring 2 are respectively fixedly connected to a limit plate 3 and a limit plate 4, a pressure sensor 2 is fixedly installed in the sleeve 2, the limit plate 3 is fixedly connected to the pressure sensor 2, and the limit plate 4 is fixedly connected to one end of the sleeve rod 2 located in the sleeve 2; and a buffer unit 3, the buffer unit 3 includes a connecting plate, the connecting plate is fixedly connected to one end of the sleeve rod 2 located outside the sleeve 2, and a plurality of buffers are fixedly installed at equal intervals on one side of the connecting plate away from the buffer unit 2.

[0012] The grinding assembly includes: a U-shaped plate, which is fixedly connected to one end of the buffer away from the connecting plate; a grinding roller, which is rotatably installed in the U-shaped plate; and a motor four, which is fixedly installed on the U-shaped plate, and the output end of the motor four is fixedly connected to the grinding roller, and the motor four drives the grinding roller to rotate.

[0013] The linear motion unit includes: a mounting plate, which is fixedly connected to the box body; a linear slide rail, which is fixedly mounted on the mounting plate; and an electric slider, which is mounted on the linear slide rail, and the micro laser scanner is mounted on the electric slider. A protective cover is also installed on the electric slider, and the micro laser scanner is located inside the protective cover.

[0014] The device further comprises a dust suction mechanism, which comprises: a dust suction part, which is a box structure with a hollow center, the dust suction part is fixedly mounted on the top of the box, and a dust suction hole is arranged at the bottom of the dust suction part; and a dust suction fan, the dust suction end of the dust suction fan is sealedly connected with a dust suction pipe, and one end of the dust suction pipe away from the dust suction fan is sealedly connected with the dust suction part and communicated with it.

[0015] It also includes a control mechanism, which includes a control box, a controller is installed in the control box, a display screen and a control switch are installed on the control box, the display screen and the control switch are electrically connected to the controller, and the cylinder 1, the micro laser scanner, the motor 1, the motor 2, the cylinder 2, the pressure sensor 1, the pressure sensor 2, the electric telescopic rod, the motor 3, the motor 4, the electric slider and the dust suction fan are electrically connected to the controller respectively.

[0016] Beneficial effects of the present invention:

[0017] The semiconductor wafer grinding equipment of the present invention realizes the fixation and rotation of the silicon rod by means of the provided clamping rotating assembly and the supporting rotating assembly. When the silicon rod is subjected to grinding processing, the force generated between the silicon rod and the grinding mechanism is used to achieve the buffering and shock absorption of the silicon rod grinding process through the buffer unit 2 and the buffer unit 3. At the same time, the longitudinal force generated by the buffer unit 1 in the clamping rotating assembly is buffered and shock absorbed. The force generated between the silicon rod and the silicon rod is controlled by the pressure sensor 1 and the pressure sensor 2, so as to achieve the purpose of reducing the damage of the silicon rod due to uneven force during the processing; in addition, the flatness of the surface of the silicon rod is detected by the provided detection mechanism, so as to improve the yield rate of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the overall structure of a semiconductor wafer grinding device according to an embodiment of the present invention;

[0019] Figure 2 for Figure 1 The enlarged structural diagram at A in the middle;

[0020] Figure 3 Another overall structural schematic diagram of a semiconductor wafer grinding device according to an embodiment of the present invention;

[0021] Figure 4 A schematic plan view of a semiconductor wafer grinding device according to an embodiment of the present invention;

[0022] Figure 5 It is a structural schematic diagram of a clamping and rotating assembly according to an embodiment of the present invention;

[0023] Figure 6 It is a structural schematic diagram of a supporting rotating assembly according to an embodiment of the present invention;

[0024] Figure 7 A schematic plan view of the connection between a buffer unit 1 and a connection disk according to an embodiment of the present invention;

[0025] Figure 8 A schematic diagram of the connection between a grinding box, a grinding mechanism and a detection mechanism according to an embodiment of the present invention;

[0026] Fig. 9 It is a plan view of a grinding box, a grinding mechanism and a detection mechanism according to an embodiment of the present invention;

[0027] Fig.10 for Figure 8 The enlarged structural diagram at B in the middle;

[0028] Fig.11 This is a schematic diagram of the structure of box body 1 and box body 2 according to an embodiment of the present invention;

[0029] Fig.12A schematic structural diagram of a grinding mechanism according to an embodiment of the present invention;

[0030] Fig.13 FIG. 1 is a schematic plan view of a buffer unit 2 according to an embodiment of the present invention.

[0031] Description of reference numerals:

[0032] 1- Workbench;

[0033] 2-grinding box, 21-box body 1, 211-opening, 22-box body 2;

[0034] 3- transverse and longitudinal movement mechanism, 31- transverse movement assembly, 311- mounting frame 1, 312- motor 1, 313- screw 1, 314- slider 1, 315- guide rod 1; 32- longitudinal movement assembly, 321- mounting frame 2, 322- motor 2, 323- screw 2, 324- slider 2, 325- guide rod 2, 326- support frame;

[0035] 4-clamping rotating mechanism, 41-clamping rotating assembly, 411-cylinder II, 412-connecting plate, 413-groove I, 414-connecting bearing, 415-buffer unit I, 4151-sleeve I, 4152-sleeve rod I, 4153-buffer spring I, 4154-limiting plate I, 4155-limiting plate II, 4156-pressure sensor I, 4157-pressure pad, 416-annular connecting cover, 417-electric telescopic rod, 418-clamping block;

[0036] 42-supporting rotating assembly, 421-motor three, 422-supporting platform, 423-supporting pad;

[0037] 5-grinding mechanism, 51-cylinder 1, 52-buffer assembly, 53-grinding assembly;

[0038] 521-buffer unit 2, 5211 sleeve 2, 5212 sleeve rod 2, 5213-buffer spring 2, 5214-limit plate 3, 5215-limit plate 4, 5216-pressure sensor 2;

[0039] 522-buffer unit three, 5221-connecting plate, 5222-buffer;

[0040] 531-U-shaped plate, 532-grinding roller, 533-motor 4;

[0041] 6-detection mechanism, 61-linear motion unit, 611-mounting plate, 612-linear slide rail, 613-electric slide, 62-micro laser scanner, 63-protective cover;

[0042] 7-dust suction mechanism, 71-dust suction unit, 72-dust suction fan, 73-dust suction pipe;

[0043] 8- Control box. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] like Figure 1-Figure 13 As shown, a semiconductor wafer grinding device according to an embodiment of the present invention may include a workbench 1, a grinding box 2, a lateral and longitudinal moving mechanism 3, a clamping and rotating mechanism 4, a grinding mechanism 5 and a detection mechanism 6.

[0046] Specifically, the grinding box 2 includes a box body 1 21 and a box body 22, wherein the box body 1 21 is through-through from top to bottom and fixedly mounted on the table top of the workbench 1, and a plurality of openings 211 are provided on the box body 1 21 at equal angles with its axis as the center, and one side of the box body 22 is open, and its open side is fixedly connected to the opening 211; the horizontal and vertical moving mechanism 3 is fixedly mounted on the workbench 1; the clamping and rotating mechanism 4 includes a clamping and rotating assembly 41 and a supporting and rotating assembly 42, wherein the supporting and rotating assembly 42 is mounted on the workbench 1, and the clamping and rotating assembly 41 is mounted on the horizontal and vertical moving mechanism 3, and the silicon rod to be ground is placed on the supporting and rotating assembly 42, and the supporting and rotating assembly 42 cooperates with the clamping and rotating assembly 41 to clamp the silicon rod to be ground between them and can drive it to rotate; the grinding mechanism 5 includes a cylinder 1 51, a buffer assembly 52 and a grinding assembly 5 3, wherein the cylinder 1 51 is fixedly mounted on the box 2 22, the output end of the cylinder 1 51 passes through the box 2 22 and is fixedly connected to the buffer assembly 52, the grinding assembly 53 is fixedly connected to the buffer assembly 52, the cylinder 1 51 drives the grinding assembly 53 to make linear motion, contact with the outer surface of the silicon rod to be ground, and grinds its outer surface; a plurality of detection mechanisms 6 are provided, which are installed in the box 1 21 at equal angles with the central axis of the box 1 21 as the center, the detection mechanism 6 includes a linear motion unit 61 and a micro laser scanner 62, the micro laser scanner 62 is installed on the linear motion unit 61, and the linear motion unit 61 drives the micro laser scanner 62 to make up and down linear motion to detect the flatness of the outer surface of the ground silicon rod. After the detection is qualified, the clamping and rotating assembly 41 clamps and fixes the silicon rod and drives it to move out of the box 1 21 through the horizontal and vertical moving mechanisms 3.

[0047] In one embodiment of the present invention, Figure 1 , Figure 2 and Figure 3As shown, the transverse and longitudinal movement mechanism 3 may include a transverse movement component 31 and a longitudinal movement component 32, wherein the transverse movement component 31 includes a mounting frame 311, a motor 312, a slider 314 and a guide rod 315, wherein the mounting frame 311 is a U-shaped structure, which is fixedly mounted on the workbench 1, the motor 312 is fixedly mounted on the mounting frame 311, the output shaft of the motor 312 is fixedly mounted with a screw 313, the end of the screw 313 away from the motor 312 is rotatably connected to the mounting frame 311, the slider 314 is threadedly connected to the screw 313, the slider 314 is provided with a guide hole 1, the guide rod 315 passes through the guide hole 1, and its two ends are fixed to the mounting frame 311 The longitudinal moving assembly 32 comprises a mounting frame 321, a motor 322, a slider 324, a guide rod 325 and a support frame 326, wherein the mounting frame 321 is vertically fixedly mounted on the slider 314, the motor 322 is fixedly mounted on the top of the mounting frame 321, the output shaft of the motor 322 is fixedly mounted with a screw 323, and the end of the screw 323 away from the motor 322 is rotatably connected to the mounting frame; the slider 324 is in a T-shaped structure, which is threadedly connected to the screw 323, the slider 324 is provided with a guide hole 1, the guide rod 325 passes through the guide hole 2, and its two ends are fixedly connected to the mounting frame 321, and one end of the support frame 326 is fixedly connected to the slider 324.

[0048] When the longitudinal moving assembly 32 is moving horizontally, the motor 1 312 is started, the motor 1 312 drives the screw 1 313 to rotate, and the slider 1 314 on the screw 1 313 moves linearly along the guide rod 1 315, thereby driving the longitudinal moving assembly 32 to move. When the longitudinal moving assembly 32 drives the clamping rotating assembly 41 to move longitudinally, the motor 2 322 is started, the motor 2 322 drives the electric screw 2 323 to rotate, and the slider 2 324 on the screw 2 323 moves linearly along the guide rod 2 325, thereby driving the clamping rotating assembly 41 to move longitudinally.

[0049] In one embodiment of the present invention, Figure 5 and Figure 7As shown, the clamping rotating assembly 41 may include a cylinder 411, a connecting disk 412, a buffer unit 415, an annular connecting cover 416 and a clamping unit, wherein the cylinder 411 is fixedly mounted on the support frame 326, and its output end passes through the support frame 326; the connecting disk 412 is fixedly connected to the output end of the cylinder 411, and a groove 413 is provided at the bottom center of the connecting disk 412, and a connecting bearing 414 is fixedly installed in the groove 413; the buffer unit 415 includes a sleeve 4151, a sleeve rod 4152 and a buffer spring 4153, one end of the sleeve 4151 is fixedly connected to the inner ring of the connecting bearing 414, the sleeve rod 4152 is slidably connected in the sleeve 4151, the buffer spring 4153 is located in the sleeve 4151, and the buffer spring 4153 is located in the sleeve 4151. The two ends of 4153 are respectively fixedly connected to the limit plate 1 4154 and the limit plate 2 4155, a pressure sensor 4156 is fixedly installed in the sleeve 1 4151, the limit plate 1 4154 is fixedly connected to the pressure sensor 1 4156, the limit plate 2 4155 is fixedly connected to one end of the sleeve rod 1 4152 located in the sleeve 1 4151, and the other end of the sleeve rod 1 4152 is fixedly connected to a pressure pad 4157; the annular connecting cover 416 is fixedly connected to the bottom of the connecting disk 412; the clamping unit includes a plurality of electric telescopic rods 417, the electric telescopic rods 417 are fixedly installed on the outer wall of the annular connecting cover 416 at equal angles with the center of the annular connecting cover 416 as the center, and the movable ends of the electric telescopic rods 417 pass through the annular connecting cover 416 to the inside thereof and are fixedly installed with clamping blocks 418.

[0050] like Figure 4 and Figure 6 As shown, the supporting rotating assembly 42 may include a motor three 421 and a support platform 422, wherein the motor three 421 is fixedly installed on the top inside the workbench 1, and the output shaft of the motor three 421 passes through the workbench 1 to its outside; the support platform 422 is fixedly connected to the output shaft of the motor three 421, and the surface of the support platform 422 is provided with a groove two, and a support pad 423 is installed in the groove two.

[0051] In the embodiment of the present invention, during grinding, the silicon rod is placed at the center position of the groove 2 of the support table 422, the lateral and longitudinal moving mechanism 3 drives the clamping rotating assembly 41 to move to the top of the silicon rod, and then the cylinder 2 411 is started, and the cylinder 2 411 drives the connecting plate 412 to move linearly downward until the pressure pad 4157 of the buffer unit 1 415 abuts against the top of the silicon rod. The pressure pad 4157 can be made of rubber or silicone pad. After the pressure pad 4157 abuts against the top of the silicon rod, the pressure pad 4157 squeezes the sleeve rod 1 4152 to slide in the sleeve 1 4151, and the sleeve rod 1 4152 squeezes the buffer spring 1 4153. The limit plate 1 4154 applies a certain pressure to the pressure sensor 1 4156, and the pressure sensor 1 4156 detects the generated pressure, thereby controlling the pressure generated when the pressure pad 4157 abuts against the silicon rod to avoid damage to the silicon rod.

[0052] When grinding the silicon rod, the motor three 421 drives the support platform 422 to rotate. Since the buffer unit 415 is connected to the inner ring of the bearing, the buffer unit 415 can rotate, and the buffer unit 415 abuts against the top of the silicon rod, so that the silicon rod can rotate between the clamping rotating assembly 41 and the supporting rotating assembly 42.

[0053] In one embodiment of the present invention, Fig.12 and Fig.13 As shown, the buffer assembly 52 may include a buffer unit 2 521 and a buffer unit 3 522. Specifically, the buffer unit 2 521 may include a sleeve 2 5211, a sleeve rod 2 5212 and a buffer spring 2 5213, wherein one end of the sleeve 2 5211 is fixedly connected to the output end of the cylinder 1 51, the sleeve rod 1 4152 is slidably connected in the sleeve 1 4151, the buffer spring 2 5213 is located in the sleeve 2 5211, and the two ends of the buffer spring 2 5213 are respectively fixedly connected to the limit plate 3 5214 and the limit plate 4 5215, a pressure sensor 2 5216 is fixedly installed in the sleeve 2 5211, the limit plate 3 5214 is fixedly connected to the pressure sensor 2 5216, and the limit plate 4 5215 is fixedly connected to one end of the sleeve rod 2 5212 located in the sleeve 2 5211. Specifically, the buffer unit three 522 includes a connecting plate 5221, which is fixedly connected to one end of the sleeve rod 5212 located outside the sleeve 5211, and a plurality of buffers 5222 are fixedly installed at equal intervals on one side of the connecting plate 5221 away from the buffer unit two 521.

[0054] In the embodiment of the present invention, the cross-section of the box body 21 is square or circular, and four grinding mechanisms 5 are arranged, which are distributed at 90 degrees with the central axis of the box body 21 as the center. After the silicon rod is fixed between the clamping rotating assembly 41 and the supporting rotating assembly 42, the cylinder 1 51 is started, and the cylinder 1 51 pushes the buffer unit 2 521 and the buffer unit 3 522 to move, thereby pushing the grinding assembly 53 to contact the surface of the silicon rod from four directions respectively. The pressure sensor 2 5216 can detect the pressure generated by the contact between the grinding assembly 53 and the silicon rod to avoid damage to the silicon rod. In addition, the pressure detected by the pressure sensor 2 5216 can also more accurately control the grinding amount of the silicon rod. When the silicon rod is polished, an action force and a reaction force are generated between the silicon rod and the polishing assembly 53, and the reaction force acts on the buffer unit 3 522 and the buffer unit 1 415. The deformation of the buffer spring 2 5213 and the buffer 5222 realizes the mitigation and damping of the silicon rod polishing process, that is, soft contact, thereby reducing the damage of the silicon rod due to uneven force during the processing. Exemplarily, the buffer 5222 can be a hydraulic buffer 5222. Of course, the present invention is not limited to this, and a pneumatic buffer 5222, a spring buffer 5222, etc. can also be used.

[0055] In one embodiment of the present invention, Fig.12 As shown, the grinding assembly 53 may include a U-shaped plate 531, a grinding roller 532 and a motor 533, wherein the U-shaped plate 531 is fixedly connected to one end of the buffer 5222 away from the connecting plate 5221; the grinding roller 532 is rotatably installed in the U-shaped plate 531; the motor 533 is fixedly installed on the U-shaped plate 531, and the output end of the motor 533 is fixedly connected to the grinding roller 532, and the motor 533 drives the grinding roller 532 to rotate.

[0056] After the grinding roller 532 contacts the silicon rod from four directions, the motor 533 is started, and the motor 533 drives the grinding roller 532 to rotate. The grinding roller 532 applies pressure to the silicon rod to complete the grinding of the surface of the silicon rod, further making its surface flat and improving the surface flatness.

[0057] In one embodiment of the present invention, Figure 8 , Fig. 9 and Fig.10 As shown, the linear motion unit 61 may include a mounting plate 611, a linear slide rail 612 and an electric slider 613, wherein the mounting plate 611 is fixedly connected to the box body 21; the linear slide rail 612 is fixedly mounted on the mounting plate 611; the electric slider 613 is mounted on the linear slide rail 612, the micro laser scanner 62 is mounted on the electric slider 613, and a protective cover 63 is also installed on the electric slider 613, and the micro laser scanner 62 is located inside the protective cover 63.

[0058] After the initial grinding, the grinding of the silicon rod is suspended, and the electric slider 613 is started. The electric slider 613 moves up and down on the linear guide rail, thereby driving the micro laser scanner 62 to move up and down, realizing the scanning detection of the silicon rod up and down, and detecting the flatness of its surface. Among them, there are four detection mechanisms 6, which are respectively distributed between adjacent grinding mechanisms 5. They are distributed at 90 degrees with their central axis as the center in the box body 21, and the surface flatness of four positions of the silicon rod is detected respectively. Its flatness is comprehensively judged by detecting multiple data. If it does not meet the qualified standard, the surface of the silicon rod continues to be ground. If it meets the qualified standard, the electric telescopic rod 417 is started, and the electric telescopic rod 417 clamps the top of the silicon rod from multiple directions, and takes it out of the box body 21 through the horizontal and vertical mechanisms.

[0059] In one embodiment of the present invention, Figure 1 and Figure 4 As shown, the present invention also includes a dust suction mechanism 7, specifically, the dust suction mechanism 7 may include a dust suction part 71 and a dust suction fan 72, wherein the dust suction part 71 is a box structure with a hollow center, the dust suction part 71 is fixedly installed on the top of the box body 21, and a dust suction hole is provided at the bottom of the dust suction part 71; the dust suction end of the dust suction fan 72 is sealedly connected with a dust suction pipe 73, and the end of the dust suction pipe 73 away from the dust suction fan 72 is sealedly connected and communicated with the dust suction part 71.

[0060] During the grinding process of the silicon rod, the dust suction fan 72 is started to absorb the dust and impurities generated in the box body 21 through the dust suction part 71.

[0061] In one embodiment of the present invention, Figure 1 As shown, the present invention also includes a control mechanism, which may include a control box 8, in which a controller is installed. By way of example, the controller may be a single-chip microcomputer or a PLC. A display screen and a control switch are installed on the control box 8, and the display screen and the control switch are electrically connected to the controller. The cylinder 1 51, the micro laser scanner 62, the motor 1 312, the motor 2 322, the cylinder 2 411, the pressure sensor 1 4156, the pressure sensor 2 5216, the electric telescopic rod 417, the motor 3 421, the motor 4 533, the electric slider 613 and the dust suction fan 72 are electrically connected to the controller respectively.

[0062] The pressure data detected by the pressure sensor 1 4156 and the pressure sensor 2 5216 are displayed on the display screen. Meanwhile, the detection data of the silicon rod by the micro laser scanner 62 is also displayed on the display screen.

[0063] According to the semiconductor wafer grinding equipment of the embodiment of the present invention, the silicon rod is fixed and rotated by the provided clamping rotating assembly 41 and the supporting rotating assembly 42. When the silicon rod is ground, the force generated between the silicon rod and the grinding mechanism is buffered and damped through the buffer unit 2 521 and the buffer unit 3 522 during the grinding process of the silicon rod. At the same time, the longitudinal force generated is buffered and damped through the buffer unit 1 415 in the clamping rotating assembly 41. The force generated between the silicon rod and the silicon rod is controlled through the pressure sensor 1 4156 and the pressure sensor 2 5216, so as to reduce the damage of the silicon rod due to uneven force during the processing. In addition, the flatness of the surface of the silicon rod is detected by the provided detection mechanism 6, so as to improve the yield rate of the wafer.

[0064] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0065] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for those of ordinary skill in the art, various modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A semiconductor wafer grinding device, characterized in that: include: Workbench; A grinding box, the grinding box comprising a first box body and a second box body, the first box body is through-through from top to bottom and fixedly mounted on the table top of the workbench, the first box body is provided with a plurality of openings at equal angles with its axis as the center, one side of the second box body is open, and the open side thereof is fixedly connected to the opening; A transverse and longitudinal moving mechanism, wherein the transverse and longitudinal moving mechanism is fixedly mounted on the workbench; A clamping and rotating mechanism, the clamping and rotating mechanism comprising a clamping and rotating assembly and a supporting and rotating assembly, the supporting and rotating assembly being mounted on the workbench, the clamping and rotating assembly being mounted on the transverse and longitudinal moving mechanisms, the silicon rod to be ground being placed on the supporting and rotating assembly, the supporting and rotating assembly cooperating with the clamping and rotating assembly to clamp the silicon rod to be ground therebetween and drive it to rotate; A grinding mechanism, the grinding mechanism comprising a cylinder 1, a buffer assembly and a grinding assembly, the cylinder 1 is fixedly mounted on the box body 2, the output end of the cylinder 1 passes through the box body 2 and is fixedly connected to the buffer assembly, the grinding assembly is fixedly connected to the buffer assembly, the cylinder 1 drives the grinding assembly to perform linear motion, contacts with the outer surface of the silicon rod to be ground, and grinds the outer surface; and The detection mechanism is provided with a plurality of detection mechanisms, which are installed in the box body one at equal angles with the central axis of the box body one as the center. The detection mechanism includes a linear motion unit and a micro laser scanner. The micro laser scanner is installed on the linear motion unit, and the linear motion unit drives the micro laser scanner to perform up and down linear motion to detect the flatness of the outer surface of the ground silicon rod. After the detection is qualified, the clamping and rotating assembly clamps and fixes the silicon rod and drives it to move out of the box body one through the horizontal and vertical moving mechanisms.

2. The semiconductor wafer grinding equipment according to claim 1, characterized in that: The lateral and longitudinal movement mechanisms include: A lateral movement assembly, the lateral movement assembly comprising a mounting frame 1, a motor 1, a slider 1 and a guide rod 1, the mounting frame 1 is a U-shaped structure, which is fixedly mounted on the workbench, the motor 1 is fixedly mounted on the mounting frame 1, a screw 1 is fixedly mounted on the output shaft of the motor 1, an end of the screw 1 away from the motor 1 is rotatably connected to the mounting frame 1, the slider 1 is threadedly connected to the screw 1, a guide hole 1 is formed on the slider 1, the guide rod 1 passes through the guide hole 1, and both ends of the guide rod 1 are fixedly connected to the mounting frame 1; and A longitudinal moving component, which includes a mounting frame 2, a motor 2, a slider 2, a guide rod 2 and a support frame. The mounting frame 2 is vertically fixedly mounted on the slider 1, the motor 2 is fixedly mounted on the top of the mounting frame 2, the output shaft of the motor 2 is fixedly mounted with a screw 2, and the end of the screw 2 away from the motor 2 is rotatably connected to the mounting frame; the slider 2 is a T-shaped structure, which is threadedly connected to the screw 2, a guide hole 1 is opened on the slider 2, the guide rod 2 passes through the guide hole 2, and its two ends are fixedly connected to the mounting frame 2, and one end of the support frame is fixedly connected to the slider 2.

3. The semiconductor wafer grinding equipment according to claim 1, characterized in that: The clamping and rotating assembly comprises: Cylinder 2, wherein the cylinder 2 is fixedly mounted on the support frame, and an output end thereof passes through the support frame; A connecting plate, the connecting plate is fixedly connected to the output end of the second cylinder, a groove 1 is provided at the center of the bottom of the connecting plate, and a connecting bearing is fixedly installed in the groove 1; A buffer unit 1, the buffer unit 1 comprises a sleeve 1, a sleeve rod 1 and a buffer spring 1, one end of the sleeve 1 is fixedly connected to the inner ring of the connecting bearing, the sleeve rod 1 is slidably connected in the sleeve 1, the buffer spring 1 is located in the sleeve 1, the two ends of the buffer spring 1 are respectively fixedly connected to a limit plate 1 and a limit plate 2, a pressure sensor 1 is fixedly installed in the sleeve 1, the limit plate 1 is fixedly connected to the pressure sensor 1, the limit plate 2 is fixedly connected to one end of the sleeve rod 1 located in the sleeve 1, and the other end of the sleeve rod 1 is fixedly connected to a pressure pad; an annular connection cover, the annular connection cover is fixedly connected to the bottom of the connection plate; and The clamping unit comprises a plurality of electric telescopic rods, which are fixedly mounted on the outer wall of the annular connection cover at equal angles with the center of the annular connection cover as the center, and the movable ends of the electric telescopic rods pass through the annular connection cover to the inside thereof and are fixedly mounted with clamping blocks.

4. The semiconductor wafer grinding equipment according to claim 3, wherein the supporting rotating assembly comprises: Motor 3, wherein the motor 3 is fixedly mounted on the top of the workbench, and the output shaft of the motor 3 passes through the workbench to the outside; as well as A support platform is fixedly connected to the output shaft of the motor three, and a groove two is provided on the surface of the support platform, and a support pad is installed in the groove two.

5. The semiconductor wafer grinding equipment according to claim 4, characterized in that: The buffer assembly comprises: A buffer unit 2, the buffer unit 2 comprising a sleeve 2, a sleeve rod 2 and a buffer spring 2, one end of the sleeve 2 is fixedly connected to the output end of the cylinder 1, the sleeve rod 1 is slidably connected in the sleeve 1, the buffer spring 2 is located in the sleeve 2, both ends of the buffer spring 2 are respectively fixedly connected to a limit plate 3 and a limit plate 4, a pressure sensor 2 is fixedly installed in the sleeve 2, the limit plate 3 is fixedly connected to the pressure sensor 2, and the limit plate 4 is fixedly connected to one end of the sleeve rod 2 located in the sleeve 2; and The buffer unit three comprises a connecting plate, the connecting plate is fixedly connected to one end of the sleeve rod two located outside the sleeve two, and a plurality of buffers are fixedly installed at equal intervals on one side of the connecting plate away from the buffer unit two.

6. The semiconductor wafer grinding equipment according to claim 5, characterized in that: The grinding assembly comprises: A U-shaped plate, the U-shaped plate being fixedly connected to an end of the buffer away from the connecting plate; a grinding roller, the grinding roller being rotatably mounted in the U-shaped plate; and Motor 4, wherein the motor 4 is fixedly mounted on the U-shaped plate, the output end of the motor 4 is fixedly connected to the grinding roller, and the motor 4 drives the grinding roller to rotate.

7. The semiconductor wafer grinding equipment according to claim 6, characterized in that: The linear motion unit comprises: A mounting plate, the mounting plate being fixedly connected to the box body 1; A linear slide rail, the linear slide rail is fixedly mounted on the mounting plate; and An electric slider is installed on the linear slide rail, the micro laser scanner is installed on the electric slider, a protective cover is also installed on the electric slider, and the micro laser scanner is located inside the protective cover.

8. The semiconductor wafer grinding equipment according to claim 7, characterized in that: It also includes a dust suction mechanism, which includes: A dust suction part, wherein the dust suction part is a box structure with a hollow center, the dust suction part is fixedly installed on the top of the box, and a dust suction hole is provided at the bottom of the dust suction part; and A dust suction fan, wherein the dust suction end of the dust suction fan is sealedly connected with a dust suction pipe, and one end of the dust suction pipe away from the dust suction fan is sealedly connected and communicated with the dust suction part.

9. The semiconductor wafer grinding equipment according to claim 8, characterized in that: It also includes a control mechanism, which includes a control box, a controller is installed in the control box, a display screen and a control switch are installed on the control box, the display screen and the control switch are electrically connected to the controller, and the cylinder 1, the micro laser scanner, the motor 1, the motor 2, the cylinder 2, the pressure sensor 1, the pressure sensor 2, the electric telescopic rod, the motor 3, the motor 4, the electric slider and the dust suction fan are electrically connected to the controller respectively.

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