Mold device, manufacturing method of wafer-level lens and wafer-level lens

Abstract

The invention discloses a mold device, a wafer level lens manufacturing method and a wafer level lens, the mold device comprises a working mold for manufacturing an optical lens of the wafer level lens, the working mold comprises a first concave part and a second concave part which are located on the first side of the working mold, the second concave part surrounds the periphery of the first concave part, the first concave part is used for being filled with a resin material to manufacture the optical lens, the second concave part is used for being filled with a resin material to manufacture a supporting structure of a wafer-level lens, and the first concave part and the second concave part have the same maximum height; when the wafer-level lens is manufactured, the optical lens and the supporting structure are integrally formed, and the consistency of the maximum height of the optical lens and the maximum height of the supporting structure is better.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a mold device, a method for manufacturing a wafer-level lens, and a wafer-level lens. Background Art

[0002] Wafer-level lens manufacturing technology includes the wafer cutting process, the purpose of which is to divide the wafer with the lens printed on it into multiple independent lens chips. Currently, there are three common cutting methods in the semiconductor industry: mechanical blade cutting, laser cutting and plasma cutting.

[0003] When the mechanical blade cuts, the blade applies a certain force on the wafer and moves along a predetermined path, separating the wafer-level lens into individual lens chips through friction and cutting. In order to ensure the stability of the cutting, a UV film is needed to fix the wafer-level lens. During the cutting process, the UV film needs to firmly adhere to the wafer-level lens to prevent it from moving or displacing.

[0004] In the prior art, in order to further prevent cracking and breakage during the cutting process, glue is usually dispensed on the periphery of the wafer-level lens. The glue dispensing area corresponds to the non-lens area of ​​the wafer. The glue used has a certain viscosity. After dispensing, the glue particles have a certain height. The height of the glue particles matches the height of the lens, which can support the wafer during cutting. However, this additional glue dispensing process is time-consuming, and there are large errors in the height between each glue particle and between the glue particle and the lens, which will still cause deviation during cutting and even cracking. Summary of the invention

[0005] One of the purposes of the present invention is to provide a mold device to solve the technical problem of wafer-level lens cutting deviation in the prior art.

[0006] To achieve one of the above-mentioned purposes of the invention, one embodiment of the present invention provides a mold device for manufacturing a wafer-level lens, including a working mold for manufacturing an optical lens of the wafer-level lens, the working mold including a first recessed portion and a second recessed portion located on a first side thereof, the second recessed portion being arranged around the outer periphery of the first recessed portion, the first recessed portion being used to fill a resin material to manufacture the optical lens, the second recessed portion being used to fill a resin material to manufacture a supporting structure of the wafer-level lens, and the first recessed portion and the second recessed portion having the same maximum height.

[0007] As a further improvement of an embodiment of the present invention, a plurality of the first recessed portions are distributed in an array, and the second recessed portions are spaced apart from the first recessed portions.

[0008] As a further improvement of an embodiment of the present invention, an anti-sticking layer is provided on the first side surface of the working mold.

[0009] As a further improvement of one embodiment of the present invention, it includes a mother mold for making the working mold, the mother mold includes a first protrusion and a second protrusion located on the same side, the second protrusion is located on the periphery of the first protrusion, the first protrusion and the second protrusion have the same maximum height, the shapes of the first protrusion and the first recessed portion match, and the shapes of the second protrusion and the second recessed portion match.

[0010] As a further improvement of one embodiment of the present invention, the mother mold includes a third recessed portion and a fourth recessed portion located on the same side, the fourth recessed portion is located on the outer periphery of the third recessed portion, the third recessed portion and the fourth recessed portion have the same maximum height, the third recessed portion and the first recessed portion have the same shape, and the fourth recessed portion and the second recessed portion have the same shape.

[0011] As a further improvement of an embodiment of the present invention, the mother mold includes a first metal mold core, the first metal mold core includes a single third recessed portion, and the third recessed portion has the same shape as the first recessed portion.

[0012] As a further improvement of one embodiment of the present invention, the mother mold includes a second metal mold core, the second metal mold core includes a single fourth recessed portion, and the fourth recessed portion and the second recessed portion have the same shape.

[0013] One of the purposes of the present invention is to provide a method for manufacturing a wafer-level lens, comprising the following steps:

[0014] Providing a working mold, the working mold comprising a first recessed portion and a second recessed portion located on a first side thereof, the second recessed portion being located on the outer periphery of the first recessed portion, and the first recessed portion and the second recessed portion having the same maximum height;

[0015] A wafer-level lens is manufactured on the first side of the working mold, wherein the wafer-level lens includes an optical lens embossed by a first recessed portion, and the wafer-level lens includes a supporting structure embossed by a second recessed portion.

[0016] As a further improvement of an embodiment of the present invention, “manufacturing a wafer-level lens on the first side of the working mold” comprises the steps of:

[0017] Filling a first side of the working mold with a resin material;

[0018] providing a wafer-level substrate and imprinting a resin material on a first side of the working mold;

[0019] The resin material is solidified between the working mold and the wafer-level substrate, and the resin material adheres to the wafer-level substrate to form a wafer-level lens.

[0020] As a further improvement of one embodiment of the present invention, "providing a working mold" includes the steps of:

[0021] Filling a resin material in a metal mold core of a mother mold; the metal mold core comprises a first protrusion and a second protrusion, the second protrusion is located at the periphery of the first protrusion, and the first protrusion and the second protrusion have the same maximum height;

[0022] imprinting a resin material with a first substrate;

[0023] The resin material is solidified between the metal mold core and the first substrate to form a working mold, the first recessed portion is embossed by the first convex portion, and the second recessed portion is embossed by the second convex portion.

[0024] As a further improvement of one embodiment of the present invention, "providing a working mold" includes the steps of:

[0025] Dispensing glue on the surface of the master mold substrate to form a plurality of array colloids;

[0026] The colloid is embossed with a first metal mold to form a master mold; the first metal mold includes a single third recessed portion, and the third recessed portion has the same shape as the first recessed portion; the colloid includes a third protruding portion embossed by the third recessed portion.

[0027] As a further improvement of one embodiment of the present invention, before "forming a master mold", the process includes: using a second metal mold to emboss a colloid; the second metal mold includes a single fourth recessed portion, and the fourth recessed portion has the same shape as the second recessed portion; the colloid includes a fourth protruding portion embossed by the fourth recessed portion.

[0028] As a further improvement of one embodiment of the present invention, the step of “forming a master mold” includes the following steps:

[0029] Filling the surface of the master mold where the colloid is disposed with a resin material;

[0030] imprinting a resin material with a first substrate;

[0031] The resin material is solidified between the colloid and the first substrate to form a working mold, the first recessed portion is embossed by the third convex portion, and the second recessed portion is embossed by the fourth convex portion.

[0032] As a further improvement of one embodiment of the present invention, the process of forming a master mold includes the following steps:

[0033] Filling the surface of the master mold where the colloid is disposed with a resin material;

[0034] imprinting a resin material with a first substrate;

[0035] The resin material is solidified between the colloid and the first substrate to form an intermediate mold; the intermediate mold comprises a first concave portion formed by embossing of the colloid and a thickened portion located at the periphery of the first concave portion;

[0036] The intermediate mold is cut along a cutting line to obtain the working mold; the cutting line passes through the thickened portion to form the second recessed portion.

[0037] One of the objectives of the present invention is to provide a wafer-level lens, which is manufactured using the wafer-level lens manufacturing method of any of the above technical solutions.

[0038] As a further improvement of an embodiment of the present invention, the optical lens and the supporting structure are integrally formed.

[0039] As a further improvement of an embodiment of the present invention, the optical lenses are arranged on both sides of the wafer-level lens, and the supporting structure is arranged on at least one side of the wafer-level lens.

[0040] Compared with the prior art, the present invention provides a mold device, in which a working mold includes a first recessed portion for making an optical lens of a wafer-level lens, and a second recessed portion for making a supporting structure of the wafer-level lens, so that the operability of making the wafer-level lens is better; the optical lens and the supporting structure of the wafer-level lens are integrally formed, and the maximum height of the optical lens and the maximum height of the supporting structure are more consistent. When cutting the wafer-level lens, the supporting structure provides a more stable supporting force, thereby improving the deviation and cracking phenomena. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 Schematic diagram of a mold device and a wafer-level lens in one embodiment of the present invention.

[0042] Figure 2 Schematic diagram of a working mold in one embodiment of the present invention.

[0043] Figure 3 Schematic diagram of a master mold in multiple embodiments of the present invention.

[0044] Figure 4-5 It is a schematic diagram of an optical lens on one side of a wafer-level lens manufactured in one embodiment of the present invention.

[0045] Figure 6-7 It is a schematic diagram of the wafer-level lens double-sided optical lens molding in one embodiment of the present invention.

[0046] Figure 8 Schematic diagram of cutting wafer-level lenses in one embodiment of the present invention.

[0047] Fig. 9 It is a schematic diagram of a working mold provided in the first embodiment of the present invention.

[0048] Fig.10 It is a schematic diagram of a working mold provided in the second embodiment of the present invention.

[0049] Fig.11 It is a schematic diagram of a working mold provided in the third embodiment of the present invention. DETAILED DESCRIPTION

[0050] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0051] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In addition, the terms "first", "second", "third", "fourth", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0052] The terms "connected", "connected to" or any other variants are intended to cover various relative positions in a connection relationship, so as to include direct connection or indirect connection. Among them, the direct connection can be formed by a gas pipeline, the indirect connection can be a connection relationship established by a device such as a valve body, a sensor, etc., can be a connection relationship established by a gas circuit component such as a brake control unit, or can be a connection relationship established by any other medium such as air.

[0053] See also Figure 1 , is a structural schematic diagram of a mold device 100 and a wafer-level lens 200 provided in one embodiment of the present invention.

[0054] The mold device 100 is used to manufacture a wafer-level lens 200. The mold device 100 includes a working mold 10 for manufacturing an optical lens 210 of the wafer-level lens 200. The working mold 10 includes a first recessed portion 11 and a second recessed portion 12 located on a first side thereof. The second recessed portion 12 is arranged around the outer periphery of the first recessed portion 11. The first recessed portion 11 is used to fill a resin material to manufacture the optical lens 210. The second recessed portion 12 is used to fill a resin material to manufacture a supporting structure 220 of the wafer-level lens 200. The first recessed portion 11 and the second recessed portion 12 have the same maximum height.

[0055] The optical lens 210 and the support structure 220 are manufactured simultaneously by using the working mold 10, so that the operability of manufacturing the wafer-level lens is better; the optical lens 210 and the support structure 220 are integrally formed, and the optical lens 210 and the support structure 220 also have the same maximum height, and the consistency of the maximum height of the two is higher. During cutting, the support structure 220 provides a more stable supporting force to prevent displacement and cracking.

[0056] Combination Figure 2 As shown, a plurality of the first recessed portions 11 are distributed in an array, and the second recessed portions 12 are spaced apart from the first recessed portions 11 to reserve cutting path spaces.

[0057] It can be understood that the first recessed portion 11 is used to match the shape of the optical lens 210, and the shape of the second recessed portion 12 can be selected to be rectangular, dot-shaped or convex.

[0058] In one embodiment, an anti-sticking layer is provided on the first side surface of the working mold 10 . Specifically, anti-sticking layers are provided on the surfaces of the first recessed portion 11 and the second recessed portion 12 to facilitate demolding of the wafer-level lens 200 .

[0059] The anti-sticking layer may be a fluoride-containing AF solution, usually an anti-fingerprint solution, the main component of which includes fluoride, especially perfluoropolyether (PFPE) polymer. Methods for providing the anti-sticking layer include vacuum evaporation, spin coating, spray coating, etc.

[0060] The anti-sticking layer may be a complex formed by trivalent chromium and fatty acid chains, which react with polar groups on the surface of the material and can be cured on the surface of the substrate to form an insoluble polymer layer. The method for providing the anti-sticking layer is usually an immersion method.

[0061] The anti-sticking layer can be selected as a nanocrystalline ceramic chromium nitride film, which is applied to the complex surface of the wafer-level imprint mold through cathode arc plasma deposition technology. The chromium nitride film has a high deposition rate and good film uniformity, which makes this technology more advantageous in the application of high-lens wafer-level molds.

[0062] In one embodiment, the mold device 100 includes a mother mold for making the working mold 10, and the mother mold includes a first protrusion 31 and a second protrusion 32 located on the same side, the second protrusion 32 is located on the outer periphery of the first protrusion 31, the first protrusion 31 and the second protrusion 32 have the same maximum height, the shapes of the first protrusion 31 and the first recessed portion 11 match, and the shapes of the second protrusion 32 and the second recessed portion 12 match.

[0063] It is understandable that the surface of the mother mold used to form the working mold is also provided with an anti-sticking layer, which is beneficial to the subsequent demoulding of the working mold 10.

[0064] Combination Figure 3 As shown in a, the mother mold includes a metal mold core 30, and the metal mold core 30 is processed by ultra-precision processing equipment to form the first protrusion 31 and the second protrusion 32. The working mold 10 is directly stamped from the metal mold core 30, so the first recessed portion 11 and the second recessed portion 12 are formed correspondingly, which has better operability.

[0065] The metal mold core 30 is manufactured by cutting a base material made of hard metal such as super steel or ceramics. The metal mold core 30 is processed in an array to form a plurality of first protrusions 31 and second protrusions 32 located on the periphery of the first protrusions 31 .

[0066] The metal mold core 30 is provided with an anti-sticking layer on one side surface of the metal mold core 30 corresponding to the first protrusion 31 and the second protrusion 32 .

[0067] In the above embodiment, the first raised portion 31 of the metal mold core 30 has the same shape as the optical lens 210 to be formed, and the second raised portion 32 has the same shape as the supporting structure 220 to be formed. The metal mold core 30 is pressed once to form the first recessed portion 11 and the second recessed portion 12. After another press, the optical lens 210 and the supporting structure 220 can be formed by press-molding the tool mold.

[0068] In one embodiment, the female mold includes a third recessed portion and a fourth recessed portion located on the same side, the fourth recessed portion is located on the outer periphery of the third recessed portion, the third recessed portion and the fourth recessed portion have the same maximum height, the third recessed portion and the first recessed portion have the same shape, and the fourth recessed portion and the second recessed portion have the same shape.

[0069] Different from the above-mentioned embodiment, the mold surface of the metal mold core of the mother mold is exactly opposite to the optical lens 210 and the support structure 220 to be produced. Therefore, it can be understood that two stampings are required to obtain the working mold 10 with the first recessed portion 11 and the second recessed portion 12, and then the wafer-level lens 200 is produced by the working mold 10.

[0070] In one embodiment, the mother mold includes a first metal mold core 40, and the first metal mold core 40 includes a single third recessed portion 41, and the third recessed portion 41 has the same shape as the first recessed portion 11. In this embodiment, the first metal mold core 40 is stamped once to form a single structure identical to the optical lens 210, thereby reducing the cost of using the mold.

[0071] An anti-sticking layer is disposed on a surface of one side of the first metal mold core 40 corresponding to the third recessed portion 41 .

[0072] In the above embodiment, the first metal mold core 40 needs to be used together with the first mother mold substrate 42 and the first mother resin mold 43 to form a mother mold, which will be described in detail in the following manufacturing method.

[0073] In one embodiment, the mother mold includes a second metal mold core 50, and the second metal mold core 50 includes a single fourth recessed portion 51, and the fourth recessed portion 51 has the same shape as the second recessed portion 12. In this embodiment, the second metal mold core 50 is stamped once to form a single structure identical to the support structure 220, thereby reducing the cost of using the mold.

[0074] An anti-sticking layer is disposed on a surface of one side of the second metal mold core 50 corresponding to the fourth recessed portion 51 .

[0075] In the above embodiment, the second metal mold core 50 needs to be used together with the second mother mold substrate 52 and the second mother resin mold 53 to form a mother mold, which will be described in detail in the following manufacturing method.

[0076] This case also protects a method for manufacturing a wafer-level lens 200, combined with Figure 4-7 As shown, the following steps are included:

[0077] S1: Provide a working mold 10, wherein the working mold 10 includes a first recessed portion 11 and a second recessed portion 12 located on a first side thereof, wherein the second recessed portion 12 is located on the periphery of the first recessed portion 11, and the first recessed portion 11 and the second recessed portion 12 have the same maximum height. The working mold 10 is provided with the first recessed portion 11 and the second recessed portion 12 at the same time, so that the operability is better during subsequent embossing.

[0078] The first recessed portion 12 matches the shape of the optical lens 210 to be semicircular or arc-shaped, and the second recessed portion 12 is rectangular to form a rectangular support structure 220 with good flatness.

[0079] S3: manufacturing a wafer-level lens 200 on the first side of the working mold 10 , wherein the wafer-level lens 200 includes an optical lens 210 embossed by the first recessed portion 11 , and the wafer-level lens 200 includes a supporting structure 220 embossed by the second recessed portion 12 .

[0080] In this way, the working mold 10 forms the optical lens 210 and the supporting structure 220 of the wafer-level lens 200 in one step, and the formed optical lens 210 and the supporting structure 220 must also have the same maximum height. Compared with forming the supporting structure 220 by dispensing glue on the periphery of the optical lens 210, the supporting structure 220 formed in one step in this case has better consistency in maximum height.

[0081] In actual molding, the support structure 220 may not be exactly the same height as the optical lens 210. It is allowed that the support structure 220 is 20um-40um shorter than the optical lens 210. It is understandable that although the maximum height is the same in theory, a certain range of tolerance must be allowed in actual applications.

[0082] In one embodiment, “manufacturing a wafer-level lens 200 on the first side of the working mold 10” comprises the following steps:

[0083] S31: Filling the first side of the working mold 10 with resin material; as the resin material for optical components, an energy-curable resin that is cured by applying energy is used, such as a light-curable resin that is cured by applying light and a thermosetting resin that is cured by applying heat. In particular, a UV-curable resin that is cured by irradiating UV light is preferred. Figure 4-5 As shown, in layman's terms, it is a flowable colloid.

[0084] S32: providing a wafer-level substrate 230 , and embossing a resin material on the first side of the working mold 10 ; the resin material is embossed and filled into the first recessed portion 11 and the second recessed portion 12 , and is formed into an optical lens 210 and a support structure 220 .

[0085] S33: solidifying the resin material between the working mold 10 and the wafer-level substrate 230, and the resin material adheres to the wafer-level substrate 230 to form a wafer-level lens 200. It can be understood that the first side surface of the working mold 10 is provided with an anti-sticking layer, so as to prevent the resin material from adhering to the working mold 10.

[0086] It is understandable that in this case, the wafer-level lens 200 includes a double-sided optical lens 210, and therefore, double-sided embossing is required.

[0087] Specifically, combined Figure 6-7 As shown, the steps include:

[0088] S311 : Filling the first side of the working mold 10 with resin material.

[0089] S321 : providing a wafer-level substrate 230 , and imprinting a resin material on a first side of the working mold 10 ; during the first imprinting, the resin material is imprinted on the first side of the wafer-level substrate 230 .

[0090] S331: solidify the resin material between the working mold 10 and the first side of the wafer-level substrate 230, and the resin material adheres to the first side of the wafer-level substrate 230. As described above, the first side of the wafer-level substrate 230 molds the optical lens 210 and the support structure 220.

[0091] After the above steps, the tool mold 10 may be removed first, and then the second embossing may be performed. Alternatively, the tool mold 10 may not be removed first, and the second embossing may be performed directly, and then the molds may be removed together after the two embossings.

[0092] Continue to include steps:

[0093] S311: Filling the first side of the working mold 10 with resin material again, which may be the original working mold 10 or another working mold. The other working mold may optionally not include the second recessed portion 12. In other words, the other side of the wafer-level lens may not be provided with a support structure 220.

[0094] S322 : turning over the wafer-level substrate 230 , and printing a resin material on the second side of the wafer-level substrate 230 .

[0095] S332: solidifying the resin material between the working mold 10 and the second side of the wafer-level substrate 230, so that the resin material adheres to the second side of the wafer-level substrate 230, thereby forming a wafer-level lens 200 with a double-sided optical lens 210.

[0096] The method for manufacturing the wafer-level lens 200 includes a demolding process to obtain a separate wafer-level lens 200 .

[0097] The manufacturing method of the wafer-level lens 200 includes a cutting process, wherein a separate wafer-level lens 200 is fixed to an adhesive film, and the support structure 220 and the optical lens 210 can both be supported on the adhesive film. When cutting into independent optical lens chips, the support structure 220 provides a more stable support force to prevent the wafer-level lens 200 from splitting.

[0098] In the first embodiment, combined Fig. 9 As shown in a, "providing a working mold 10" includes the steps of:

[0099] S111: Filling resin material into the metal mold core 30 of the mother mold; the metal mold core 30 includes a first protrusion 31 and a second protrusion 32, the second protrusion 32 is located at the periphery of the first protrusion 31, and the first protrusion 31 and the second protrusion 32 have the same maximum height.

[0100] The resin material used for the molding working mold 10 should have appropriate flexibility and excellent surface hydrophobicity. When UV curable resin is used as the resin for the optical component, a resin with high ultraviolet transmittance is preferred, and a resin with a transmittance of more than 90% is particularly preferred. Silicone resins and fluorine resins are particularly preferred because they have appropriate flexibility and good demolding properties relative to UV curable resins.

[0101] S112: using the first substrate 101 to print a resin material; combining Fig. 9 As shown in b-9c, the first substrate is equivalent to the substrate of the working mold, and the working mold 10 includes a first substrate 101 and a resin mold 102 formed on the first substrate, and the resin mold 102 includes the first recessed portion 11 and the second recessed portion 12.

[0102] S112 : curing the resin material between the metal mold core 30 and the first substrate 101 to form a working mold 10 , wherein the first recessed portion 11 is embossed by the first convex portion 31 , and the second recessed portion 12 is embossed by the second convex portion 32 .

[0103] In the first embodiment, the metal mold core 30 is integrally processed to form the first protrusion 31 and the second protrusion 32 in an array, which has high operability but high mold cost.

[0104] In the second embodiment, combined Fig.10 As shown, "providing a working mold 10" includes the steps of:

[0105] S121 : dispensing glue on the surface of the mother mold substrate to form a plurality of array colloids; specifically, dispensing glue on the first mother mold substrate 42 to form the first mother resin mold 43 .

[0106] S122: Use the first metal mold core 40 to emboss the colloid to form a mother mold; the first metal mold core includes a single third recessed portion 41, and the third recessed portion 41 has the same shape as the first recessed portion 11; the colloid includes a third protruding portion embossed by the third recessed portion 41.

[0107] Combination Fig.10 As shown in a, the first metal mold core 40 prints colloid to form a first mother resin mold 43 located on the surface of the first mother mold substrate 42, and the first mother resin mold 43 includes the third protrusion.

[0108] In the second embodiment, the step of “forming a master mold” includes the following steps:

[0109] Combination Fig.10 As shown in b, the surface of the mother mold where the colloid is set is filled with resin material; and the working mold 10 is started to be made.

[0110] The resin material is imprinted with the first substrate 101 .

[0111] The resin material is solidified between the colloid and the first substrate 101 to form an intermediate mold 10a; the intermediate mold 10a includes a first recessed portion 11 formed by embossing of the colloid and a thickened portion 13 located at the periphery of the first recessed portion.

[0112] Combination Fig.10 As shown in c, at this time, the middle mold 10a has not yet formed the second recessed portion 12. Due to the limitation of the imprinting process of the first metal mold core 40, the lowest point of the third recessed portion 41 is at a distance from the first mother mold substrate 42. After being copied to the middle mold 10a, there is a thick mold layer around the first recessed portion 11.

[0113] The intermediate mold 10a is cut along a cutting line to obtain the working mold 10; the cutting line passes through the thickened portion 13 to form the second recessed portion 12. Fig.10 As shown in FIG. d , the first mother resin mold 43 corresponding to the intermediate mold 10 a is cut thin, and further cut at the thickened portion 13 to form the second recessed portion 12 .

[0114] In the third embodiment, combined with Fig.11 As shown, "providing a working mold 10" includes the steps of:

[0115] S131 : dispensing glue on the surface of the mother mold substrate to form a plurality of array colloids; specifically, dispensing glue on the second mother mold substrate 52 to form the second mother resin mold 53 .

[0116] S132: Use the first metal mold core 40 to emboss the colloid to form a mother mold; the first metal mold core includes a single third recessed portion 41, and the third recessed portion 41 has the same shape as the first recessed portion 11; the colloid includes a third protruding portion embossed by the third recessed portion 41.

[0117] Combination Fig.11 As shown in a, the first metal mold core 40 prints colloid to form a second mother resin mold 53 located on the surface of the second mother mold substrate 52, and the second mother resin mold 53 includes the third protrusion.

[0118] In the third embodiment, before “forming the master mold”, the steps include: imprinting a colloid with a second metal mold core 50; the second metal mold core 50 includes a single fourth recessed portion 51, and the fourth recessed portion 51 has the same shape as the second recessed portion 12; the colloid includes a fourth protruding portion imprinted by the fourth recessed portion 51.

[0119] Combination Fig.11As shown in a, in the third embodiment, the fourth protrusion is a dot-shaped protrusion, and it can be seen that the corresponding support structure 220 is also a dot-shaped protrusion. The first metal mold core 40 and the second metal mold core 50 simultaneously emboss the colloid to form a second resin mold 53 having a third protrusion and a fourth protrusion.

[0120] In the third embodiment, combined with Fig.11 As shown in b-11c, the steps after "forming the master mold" include:

[0121] The surface of the mother mold where the colloid is set is filled with resin material; and the second mother resin mold 53 is filled with resin material to form the working mold 10 .

[0122] The resin material is imprinted with the first substrate 101 .

[0123] The resin material is solidified between the colloid and the first substrate 101 to form a working mold 10 , wherein the first recessed portion 11 is embossed by the third convex portion, and the second recessed portion 12 is embossed by the fourth convex portion.

[0124] Combination Fig.11 As shown in d, due to the limitation of the stamping process of the first metal mold core 40 and the second metal mold core 50, the mold layer near the first recessed portion 11 and the second recessed portion 12 may also be thicker, and the working mold 10 can be cut and thinned. Different from the second embodiment, in the third embodiment, the second mother resin mold 53 can be cut parallel to the horizontal direction.

[0125] The present invention also protects a wafer-level lens 200, which is made using any of the above-mentioned methods for making a wafer-level lens. The important features of the wafer-level lens 200 are: the optical lens 210 and the support structure 220 are integrally formed, which is easy to operate; and the height consistency of the optical lens 210 and the support structure 220 is good.

[0126] The beneficial effects of the present invention are: the working mold 10 includes a first recessed portion 11 for making an optical lens 210 of a wafer-level lens, and a second recessed portion 12 for making a supporting structure 220 of a wafer-level lens, so that the operability of making the wafer-level lens 200 is better; the optical lens 210 and the supporting structure 220 of the wafer-level lens are integrally formed, and the maximum height of the optical lens and the maximum height of the supporting structure are more consistent. When cutting the wafer-level lens 200, the supporting structure 220 provides a more stable supporting force, thereby improving the offset and cracking phenomena.

[0127] It can be formed by referring to any of the technical solutions provided above, and will not be described in detail here.

[0128] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0129] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A mold device for making a wafer-level lens, characterized in that: A working mold for producing an optical lens of the wafer-level lens is provided, wherein the working mold includes a first recessed portion and a second recessed portion located on a first side thereof, wherein the second recessed portion is arranged around the outer periphery of the first recessed portion, wherein the first recessed portion is used to be filled with a resin material to produce the optical lens, and wherein the second recessed portion is used to be filled with a resin material to produce a supporting structure of the wafer-level lens, and wherein the first recessed portion and the second recessed portion have the same maximum height.

2. The mold device according to claim 1, characterized in that: The first recessed portions are distributed in an array, and the second recessed portions are spaced apart from the first recessed portions.

3. The mold device according to claim 1, characterized in that: An anti-sticking layer is provided on the first side surface of the working mold.

4. The mold device according to claim 1, characterized in that: It includes a mother mold for making the working mold, the mother mold includes a first protrusion and a second protrusion located on the same side, the second protrusion is located on the periphery of the first protrusion, the first protrusion and the second protrusion have the same maximum height, the shapes of the first protrusion and the first recessed portion match, and the shapes of the second protrusion and the second recessed portion match.

5. The mold device according to claim 1, characterized in that: The female mold includes a third recessed portion and a fourth recessed portion located on the same side, the fourth recessed portion is located at the outer periphery of the third recessed portion, the third recessed portion and the fourth recessed portion have the same maximum height, the third recessed portion and the first recessed portion have the same shape, and the fourth recessed portion and the second recessed portion have the same shape.

6. The mold device according to claim 1, characterized in that: The mother mold includes a first metal mold core, the first metal mold core includes a single third recessed portion, and the third recessed portion has the same shape as the first recessed portion.

7. The mold device according to claim 1, characterized in that: The mother mold includes a second metal mold core, and the second metal mold core includes a single fourth recessed portion, and the fourth recessed portion and the second recessed portion have the same shape.

8. A method for manufacturing a wafer-level lens, characterized in that: The following steps are involved: Providing a working mold, the working mold comprising a first recessed portion and a second recessed portion located on a first side thereof, the second recessed portion being located on the outer periphery of the first recessed portion, and the first recessed portion and the second recessed portion having the same maximum height; A wafer-level lens is manufactured on the first side of the working mold, wherein the wafer-level lens includes an optical lens embossed by a first recessed portion, and the wafer-level lens includes a supporting structure embossed by a second recessed portion.

9. The method for manufacturing a wafer-level lens according to claim 8, characterized in that: "Making a wafer-level lens on the first side of the working mold" comprises the steps of: Filling a first side of the working mold with a resin material; providing a wafer-level substrate and imprinting a resin material on a first side of the working mold; The resin material is solidified between the working mold and the wafer-level substrate, and the resin material adheres to the wafer-level substrate to form a wafer-level lens.

10. The method for manufacturing a wafer-level lens according to claim 8, characterized in that: "Providing a working mold" includes the following steps: Filling a resin material in a metal mold core of a mother mold; the metal mold core comprises a first protrusion and a second protrusion, the second protrusion is located at the periphery of the first protrusion, and the first protrusion and the second protrusion have the same maximum height; imprinting a resin material with a first substrate; The resin material is solidified between the metal mold core and the first substrate to form a working mold, the first recessed portion is embossed by the first convex portion, and the second recessed portion is embossed by the second convex portion.

11. The method for manufacturing a wafer-level lens according to claim 8, characterized in that: "Providing a working mold" includes the following steps: Dispensing glue on the surface of the master mold substrate to form a plurality of array colloids; The colloid is embossed with a first metal mold to form a master mold; the first metal mold includes a single third recessed portion, and the third recessed portion has the same shape as the first recessed portion; the colloid includes a third protruding portion embossed by the third recessed portion.

12. The method for manufacturing a wafer-level lens according to claim 11, characterized in that: Before "forming the mother mold", the process includes: using a second metal mold to emboss the colloid; the second metal mold includes a single fourth recessed portion, and the fourth recessed portion has the same shape as the second recessed portion; the colloid includes a fourth protruding portion embossed by the fourth recessed portion.

13. The method for manufacturing a wafer-level lens according to claim 12, characterized in that: "Forming the master mold" includes the following steps: Filling the surface of the master mold where the colloid is disposed with a resin material; imprinting a resin material with a first substrate; The resin material is solidified between the colloid and the first substrate to form a working mold, the first recessed portion is embossed by the third convex portion, and the second recessed portion is embossed by the fourth convex portion.

14. The method for manufacturing a wafer-level lens according to claim 11, characterized in that: "Forming the master mold" includes the following steps: Filling the surface of the master mold where the colloid is disposed with a resin material; imprinting a resin material with a first substrate; The resin material is solidified between the colloid and the first substrate to form an intermediate mold; the intermediate mold comprises a first concave portion formed by embossing of the colloid and a thickened portion located at the periphery of the first concave portion; The intermediate mold is cut along a cutting line to obtain the working mold; the cutting line passes through the thickened portion to form the second recessed portion.

15. A wafer-level lens, characterized in that: The wafer-level lens is manufactured using the method for manufacturing the wafer-level lens according to any one of claims 8 to 14.

16. The wafer-level lens according to claim 15, characterized in that: The optical lens and the supporting structure are integrally formed.

17. The wafer-level lens according to claim 15, characterized in that: The optical lenses are arranged on both sides of the wafer-level lens, and the supporting structure is arranged on at least one side of the wafer-level lens.

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