PCB double-sided spraying method

Abstract

This invention relates to a double-sided spraying method for PCB boards, comprising the following steps: First, the PCB board enters a first printing system, where the first printing system performs a spraying action on the PCB board. The PCB board has a first printing surface and a second printing surface. The first printing system performs a spraying action on the first printing surface of the PCB board. Second, the PCB board enters a flipping system, where the flipping system performs a flipping action on the PCB board. Third, the PCB board enters a second printing system, where the second printing system performs a spraying action on the second printing surface of the PCB board, thereby completing the overall spraying work.

Description

Technical Field

[0001] This invention relates to a spraying method, and more particularly to a method for double-sided spraying of PCB boards. Background Technology

[0002] As is well known, a text inkjet printer is a device used to print text or patterns on the surface of various materials. Its working principle is to spray ink directly onto the substrate in the form of tiny droplets through a printhead, forming the desired text or pattern. Text inkjet printers are widely used in many fields, including the marking and labeling of electronic products such as PCB boards and FPC boards.

[0003] In essence, the working principle of a text inkjet printer is that nozzles inside its printhead eject ink in the form of tiny droplets. By controlling the opening and closing of the nozzles, the desired text or pattern can be formed on the substrate. This technology gives text inkjet printers high precision and high resolution, enabling them to print very fine patterns and text.

[0004] Text inkjet printers are particularly useful in the coating of PCBs and FPCs. Printing text and patterns on PCBs allows for the identification and marking of different parts of the circuit board. Marking and labeling can also be performed on flexible circuit boards to meet specific user needs.

[0005] However, traditional inkjet printers generally only have the function of spraying on one side of the substrate. If double-sided spraying is required, manual flipping is required, which is inefficient and the spraying quality cannot be guaranteed. Summary of the Invention

[0006] The technical solution adopted in this invention is: a double-sided spraying method for PCB boards, which includes the following steps:

[0007] Step 1: The PCB board enters the first inkjet printing system, where the first inkjet printing system performs an inkjet printing operation on the PCB board. The PCB board has a first inkjet printing surface and a second inkjet printing surface, which are located on the top and bottom surfaces of the PCB board, respectively. The PCB board enters the first inkjet printing system, where the first inkjet printing system performs an inkjet printing operation on the first inkjet printing surface of the PCB board.

[0008] The second step is for the PCB board to enter the flipping system, which then flips the PCB board.

[0009] The flip-plate system includes a flipping table, a flipping motor, an upper receiving system, and a lower receiving system. The motor output shaft of the flipping motor is connected to the flipping table. The upper receiving system and the lower receiving system are disposed in the flipping table. The flipping table has an inlet and outlet and a functional cavity. The inlet and outlet are connected to the cavity of the flipping table and are located at one end of the flipping table. The functional cavity is located between the upper receiving system and the lower receiving system. The upper receiving system is located above the functional cavity, and the lower receiving system is located below the functional cavity.

[0010] The flip-plate system has a feeding state, a flipping state, and a discharging state. First, the flip-plate system is in the feeding state, and the feeding and discharging ports correspond to the first printing system. The first printing system transfers the PCB board, which has completed the printing action on the first printing surface, into the functional cavity through the feeding and discharging ports. Then, the flip-plate system is in the flipping state, and the upper and lower receiving systems fix the PCB board in the functional cavity. The flipping motor drives the flipping table to flip, so that the feeding and discharging ports correspond to the second printing system. Finally, the flip-plate system is in the discharging state, and the upper and lower receiving systems push the PCB board into the second printing system through the feeding and discharging ports.

[0011] The third step involves the PCB board entering the second printing system, where the second printing system performs printing on the second printing surface of the PCB board to complete the overall printing process.

[0012] The beneficial effects of this invention are as follows: During operation, the printing substrate first enters the first printing system, where it is printed on the first printing surface. Then, the substrate enters the flip-plate system, where it is flipped. Finally, the substrate enters the second printing system, where it is printed on the second printing surface, thus completing the overall printing process. This printing machine features a high degree of automation and a simple, reliable structure. Attached Figure Description

[0013] Figure 1 This is a three-dimensional schematic diagram of the present invention.

[0014] Figure 2 This is a schematic diagram of the flip-plate system of the present invention.

[0015] Figure 3 This is a schematic diagram of the working operation of the flip-plate system of the present invention.

[0016] Figure 4 This is a three-dimensional schematic diagram of the first and second inkjet printing systems of the present invention.

[0017] Figure 5 This is a schematic diagram of the operation of the first and second inkjet printing systems of the present invention.

[0018] Figure 6 This is a schematic diagram of the principle of the flipping table, the upper support system, and the lower support system of the present invention.

[0019] Figure 7 This is a schematic diagram of the operation of the tilting table of the present invention.

[0020] Figure 8 This is a cross-sectional structural diagram of the upper and lower support systems of the present invention.

[0021] Figure 9 This is a schematic diagram illustrating the principle of the inwardly curved, wrapped, and fixed structure of the present invention.

[0022] Figure 10 This is a schematic diagram of the internal bending aid of the present invention.

[0023] Figure 11 This is a schematic diagram of another embodiment of the receiving system of the present invention. Detailed Implementation

[0024] like Figures 1 to 11 As shown, a double-sided spraying method for PCB boards includes the following steps:

[0025] Step 1: PCB board A enters the first inkjet printing system 200, where the first inkjet printing system 200 performs an inkjet coating operation on PCB board A.

[0026] The PCB board A has a first printing surface A1 and a second printing surface A2, wherein the first printing surface A1 and the second printing surface A2 are located on the top and bottom surfaces of the PCB board A, respectively.

[0027] The PCB board A enters the first printing system 200, and the first printing system 200 performs printing on the first printing surface A1 of the PCB board A.

[0028] The second step is that the PCB board A enters the flipping system 100, and the flipping system 100 flips the PCB board A.

[0029] The flip-plate system 100 includes a flip table 400, a flip motor, an upper support system 600, and a lower support system 700. The motor output shaft 500 of the flip motor is connected to the flip table 400, and the upper support system 600 and the lower support system 700 are disposed in the flip table 400.

[0030] like Figure 6As shown, the tilting table 400 has an inlet / outlet 410 and a functional cavity 420. The inlet / outlet 410 is connected to the tilting table cavity 420 and is located at one end of the tilting table 400. The functional cavity 420 is located between the upper receiving system 600 and the lower receiving system 700. The upper receiving system 600 is located above the functional cavity 420, and the lower receiving system 700 is located below the functional cavity 420.

[0031] like Figure 7 As shown, the flip-plate system 100 has a feeding state, a flipping state, and a discharging state. First, the flip-plate system 100 is in the feeding state, and the feeding / discharging port 410 corresponds to the first printing system 200. The first printing system 200 transfers the PCB board A, which has completed the printing action on the first printing surface A1, to the functional cavity 420 through the feeding / discharging port 410. Second, the flip-plate system 100 is in the flipping state, and the upper receiving system 600 and the lower receiving system 700 fix the PCB board A in the functional cavity 420. The flipping motor drives the flipping table 400 to flip, so that the feeding / discharging port 410 corresponds to the second printing system 300. Finally, the flip-plate system 100 is in the discharging state, and the upper receiving system 600 and the lower receiving system 700 push the PCB board A into the second printing system 300 through the feeding / discharging port 410.

[0032] The third step is that the PCB board A enters the second inkjet printing system 300, where the second inkjet printing system 300 performs inkjet printing on the second inkjet printing surface A2 of the PCB board A to complete the overall inkjet printing work.

[0033] like Figure 8 As shown, in the second step, the upper support system 600 includes several upper pulleys 611 and an upper belt 612. The upper belt 612 is wound around the several upper pulleys 611. The upper belt 612 includes an inclined functional surface 610, a retaining rib 620, and a deformable inner cavity 630. The upper belt 612 has an inner side surface 640 and an outer end side surface 650. The inner side surface 640 is pressed onto the several upper pulleys 611. The inclined functional surface 610 is inclinedly connected between the inner side surface 640 and the outer end side surface 650. The retaining rib 620 protrudes from the inner side surface 640. Each upper pulley 611 has a rib groove 621. The retaining rib 620 is engaged in the rib groove 621. The deformable inner cavity 630 is disposed in the upper belt 612.

[0034] The lower receiving system 700 includes a plurality of lower pulleys 711 and a lower belt 712. The lower belt 712 is wound around the plurality of lower pulleys 711. The lower belt 712 has an inner surface 710 and an outer surface 720, wherein the inner surface 710 is pressed against the plurality of lower pulleys 711. The inclined functional surface 610 of the upper belt 612 and the outer surface 720 of the lower belt 712 surround to form the functional cavity 420 of the tilting table 400.

[0035] When the PCB board A is located in the functional cavity 420, that is, when the flipping system 100 is in the feeding state, the flipping state, and the discharging state, the two sides of the second printing surface A2 of the PCB board A are pressed onto the outer side surface 720 of the lower belt 712, and the top edges A3 of the two sides of the first printing surface A1 of the PCB board A are pressed against the upper extrusion area 613 of the inclined functional surface 610 of the upper belt 612. In this state, the upper belt 612 forms an inwardly curved wrapping and fixing structure.

[0036] like Figure 9 As shown, the inner bend wrapping and fixing structure includes a belt top fixing portion 810, a belt bottom fixing portion 820, and a belt inner bend portion 830. The belt top fixing portion 810 is formed at the position where the rib 620 of the upper belt 612 engages with the rib groove 621 of the upper pulley 611. The belt bottom fixing portion 820 is formed at the position where the top edges A3 on both sides of the PC B board A abut against the upper compression area 613 of the upper belt 612. The belt inner bend portion 830 is formed at the position between the inclined functional surface 610 of the upper belt 612 and the deformable inner cavity 630. The belt inner bend portion 830 is located between the belt top fixing portion 810 and the belt bottom fixing portion 820.

[0037] When the PCB board A is located in the functional cavity 420, the top edge A3 on both sides of the PCB board A pushes against the upper belt 612, causing the upper belt 612 to undergo physical deformation. The inner bending portion 830 of the belt bends towards the deformed cavity 630, and the outer end side 650 of the upper belt 612 bends towards the PCB board A, thus forming the inner bending wrapping and fixing structure of the upper belt 612.

[0038] The inward-curved wrapping and fixing structure can wrap around both sides of the PCB board A, and the inward-curved wrapping and fixing structure will not contact the first printing surface A1 of the PCB board A, so as to avoid the upper belt 612 scratching the coating on the first printing surface A1. At the same time, the inward-curved wrapping and fixing structure can increase the contact area between the upper belt 612 and the PCB board A, so that when the PCB board A is located in the functional cavity 420, the flipping system 100 can stably complete the feeding state, the flipping state, and the discharging state.

[0039] like Figure 10 As shown, in specific implementation, the upper support system 600 also includes an inner bending auxiliary device 660. The inner bending auxiliary device 660 includes a cylinder 661, a pull rod 662, and a pressure head 663. The cylinder 661 is located at the top of the tilting table 400. The pull rod 662 is connected to the power output shaft of the cylinder 661. The pressure head 663 is located at the bottom of the pull rod 662 and corresponds to the outer end side 650 of the upper belt 612. When the upper belt 612 forms the inner bending wrapping and fixing structure, the cylinder 661, through the pull rod 662, causes the pressure head 663 to press against the outer end side 650, thereby improving the bending efficiency of the inner bending wrapping and fixing structure. Figure 11 As shown, in specific implementation, the upper support system 600 can also adopt other structures.

[0040] In the first step, the first printing system 200 includes a first printing table 210, a first embedded conveyor belt 220, and a first printing system 230. The first embedded conveyor belt 220 is disposed in the first printing table 210, and the first printing system 230 is disposed above the first printing table 210. The first printing table 210 is provided with a first conveyor belt groove 211 and several first suction cups 212. The first embedded conveyor belt 220 is disposed in the first conveyor belt groove 211. The top of the first embedded conveyor belt 220 has a first conveying surface 221, and the tops of the several first suction cups 212 are simultaneously located on the first suction surface 213.

[0041] like Figure 5As shown, the first inkjet printing system 200 has a first conveying and feeding state and a first adsorption and spraying state. When the first inkjet printing system 200 is in the first conveying and feeding state, the first conveying surface 221 is higher than the first adsorption surface 213. At this time, the second printing surface A2 of the PCB board A is in contact with the first conveying surface 221, and the first embedded conveyor belt 220 drives the PCB board A to move back and forth on the first inkjet printing table 210. When the first inkjet printing system 200 is in the first adsorption and spraying state, the first conveying surface 221 is lower than the first adsorption surface 213. At this time, the second printing surface A2 of the PCB board A is adsorbed and fixed on the first adsorption surface 213, and the first inkjet printing system 230 sprays the first inkjet surface A2 of the PCB board A onto the first inkjet printing table 210. The printing action is performed on the printing surface A1. In practice, the spatial position of the first transmission surface 221 is fixed. The spatial position of the first adsorption surface 213 is adjusted by the up-and-down extension and retraction of several first suction cups 212 on the first printing table 210. When the first printing system 200 is in the first transmission feeding state, the first transmission surface 221 is higher than the first adsorption surface 213. When the first printing system 200 is in the adsorption spraying state, the first transmission surface 221 is lower than the first adsorption surface 213. In specific implementation, the first printing system 230 includes a moving track part and a printhead. The printhead is set at the bottom of the moving track part. The technical content of the first printing system 230 belongs to the prior art and will not be described in detail here.

[0042] In the third step, the second printing system 300 includes a second printing table 310, a second embedded conveyor belt 320, and a second printing system 330. The second embedded conveyor belt 320 is disposed in the second printing table 310, and the second printing system 330 is disposed above the second printing table 310. The second printing table 310 is provided with a second conveyor belt groove 311 and several second suction cups 312. The second embedded conveyor belt 320 is disposed in the second conveyor belt groove 311. The top of the second embedded conveyor belt 320 has a second conveying surface 321, and the tops of the several second suction cups 312 are simultaneously located on the second suction surface 313.

[0043] like Figure 5As shown, the second inkjet printing system 300 has a second conveying and feeding state and a second adsorption and spraying state. When the second inkjet printing system 300 is in the second conveying and feeding state, the second conveying surface 321 is higher than the second adsorption surface 313. At this time, the first printing surface A1 of the PCB board A is in contact with the second conveying surface 321, and the second embedded conveyor belt 320 drives the PCB board A to move back and forth on the second inkjet printing table 310. When the second inkjet printing system 300 is in the second adsorption and spraying state, the second conveying surface 321 is lower than the second adsorption surface 313. At this time, the first printing surface A1 of the PCB board A is adsorbed and fixed on the second adsorption surface 313, and the second inkjet printing system 330 sprays the second inkjet surface of the PCB board A. The printing process is performed on printing surface A2. In practice, the spatial position of the second transmission surface 321 is fixed. Several second suction cups 312 move up and down on the second printing station 310 to adjust the spatial position of the second adsorption surface 313. When the second printing system 300 is in the second transmission feeding state, the second transmission surface 321 is higher than the second adsorption surface 313; when the second printing system 300 is in the second adsorption spraying state, the second transmission surface 321 is lower than the second adsorption surface 313. In specific implementations, the second printing system 330 includes a moving track and a printhead. The printhead is located at the bottom of the moving track. The technical details of the second printing system 330 are prior art and will not be elaborated here. This invention, through the structural design of the first printing system 200 and the second printing system 300, facilitates the transmission of the PCB board A and the fixation of its position during printing, thereby improving overall work efficiency.

[0044] like Figure 7As shown, the flip-plate system 100 has a feeding state, a flipping state, and a discharging state. When the flip-plate system 100 is in the feeding state, the feeding / discharging port 410 corresponds to the first embedded conveyor belt 220 of the first inkjet printing system 200. The first embedded conveyor belt 220 transports the PCB board A, which has completed the inkjet printing action on the first inkjet printing surface A1, through the feeding / discharging port 410 into the functional cavity 420. When the flip-plate system 100 is in the flipping state, the upper receiving system 600 and the lower receiving system 700 fix the PCB board A in the functional cavity 420. In this process, the flipping motor drives the flipping table 400 to flip, so that the inlet / outlet 410 corresponds to the second embedded conveyor belt 320 of the second inkjet printing system 300. When the flipping system 100 is in the discharge state, the upper receiving system 600 and the lower receiving system 700 push the PCB board A through the inlet / outlet 410 onto the second embedded conveyor belt 320 of the second inkjet printing system 300. The second embedded conveyor belt 320 transports the PCB board A to the second inkjet printing system 330, where inkjet printing is performed on the second inkjet printing surface A2 of the PCB board A.

Claims

1. A method for double-sided spraying of PCB boards, characterized in that, Includes the following steps: Step 1: The PCB board enters the first inkjet printing system, where it undergoes an inkjet printing process. The PCB board has a first printing surface and a second printing surface, located on its top and bottom surfaces respectively. The first inkjet printing system then performs an inkjet printing process on the first printing surface of the PCB board. The second step involves the PCB board entering the flipping system, which then flips the PCB board over. The flip-plate system includes a flipping table, a flipping motor, an upper receiving system, and a lower receiving system. The output shaft of the flipping motor is connected to the flipping table. The upper and lower receiving systems are disposed within the flipping table. The flipping table has an inlet / outlet and a functional cavity. The inlet / outlet is connected to the functional cavity and is located at one end of the flipping table. The functional cavity is located between the upper and lower receiving systems, with the upper receiving system positioned above the functional cavity and the lower receiving system positioned below it. The flip-plate system has a feeding state, a flipping state, and a discharging state. First, in the feeding state, the feeding / discharging port corresponds to the first printing system. The first printing system transfers the PCB board, after completing the first printing surface printing action, through the feeding / discharging port into the functional cavity. Then, in the flipping state, the upper and lower receiving systems fix the PCB board in the functional cavity. The flipping motor drives the flipping table to flip, aligning the feeding / discharging port with the second printing system. Finally, in the discharging state, the upper and lower receiving systems push the PCB board through the feeding / discharging port into the second printing system. The third step involves the PCB board entering the second printing system, where the second printing system performs printing operations on the second printing surface of the PCB board to complete the overall printing process. In the second step, the upper receiving system includes several upper pulleys and an upper belt. The upper belt is wound around the pulleys and includes an inclined functional surface, a retaining rib, and a deformable inner cavity. The upper belt has an inner side and an outer end side. The inner side is pressed against the pulleys. The inclined functional surface is inclinedly connected between the inner side and the outer end side. The retaining rib protrudes from the inner side. Each pulley has a groove, and the retaining rib engages in the groove. The deformable inner cavity is located within the upper belt. The lower receiving system includes several lower pulleys and a lower belt. The lower belt is wound around the several lower pulleys and has an inner side and an outer side. The inner side of the belt is pressed against the several lower pulleys. The inclined functional surface of the upper belt and the outer side of the lower belt surround each other to form the functional cavity of the tilting table. The PCB board is located in the functional cavity. When the flipping system is in the feeding state, the flipping state, and the discharging state, the two sides of the second printing surface of the PCB board are pressed against the outer surface of the lower belt, and the top edges of the two sides of the first printing surface of the PCB board are pressed against the upper extrusion area of ​​the inclined functional surface of the upper belt. In this state, the upper belt forms an inwardly curved wrapping and fixing structure. The inner-bend wrapping and fixing structure includes a belt top fixing part, a belt bottom fixing part, and a belt inner bend part. The belt top fixing part is formed by the snap rib of the upper belt engaging with the rib groove of the upper pulley. The belt bottom fixing part is formed by the top edges of the PCB board abutting against the upper compression area of ​​the upper belt. The belt inner bend part is formed between the inclined functional surface of the upper belt and the deformable inner cavity, and is located between the belt top fixing part and the belt bottom fixing part. When the PCB board is located in the functional cavity, the top edges on both sides of the PCB board push against the upper belt, causing the upper belt to undergo physical deformation. The inner bend of the belt bends towards the deformed cavity, and the outer side of the upper belt bends towards the PCB board. The upper belt forms the inner bend wrapping and fixing structure, which can wrap around both sides of the PCB board, and the inner bend wrapping and fixing structure will not contact the first printing surface of the PCB board.

2. The method for double-sided spraying of a PCB board as described in claim 1, characterized in that: The upper support system also includes an inner bending auxiliary device, which includes a cylinder, a pull rod, and a pressure head. The cylinder is located on the top of the tilting table, the pull rod is connected to the power output shaft of the cylinder, and the pressure head is located at the bottom of the pull rod. The pressure head corresponds to the outer end side of the upper belt. When the upper belt forms the inner bending wrapping and fixing structure, the cylinder causes the pressure head to squeeze the outer end side through the pull rod.

3. The method for double-sided spraying of a PCB board as described in claim 1, characterized in that: In the first step, the first printing system includes a first printing table, a first embedded conveyor belt, and a first printing system. The first embedded conveyor belt is disposed within the first printing table, and the first printing system is disposed above the first printing table. The first printing table has a first conveyor belt groove and several first suction cups. The first embedded conveyor belt is disposed within the first conveyor belt groove, and its top has a first conveying surface. The tops of the several first suction cups are simultaneously located on the first suction surface. The first printing system has a first conveying and feeding state and a first adsorption and spraying state. When the first printing system is in the first conveying and feeding state, the first conveying surface is higher than the first adsorption surface. At this time, the second printing surface of the PCB board is in contact with the first conveying surface, and the first embedded conveyor belt drives the PCB board to move back and forth on the first printing table. When the first printing system is in the first adsorption and spraying state, the first conveying surface is lower than the first adsorption surface. At this time, the second printing surface of the PCB board is adsorbed and fixed on the first adsorption surface, and the first printing system performs printing on the first printing surface of the PCB board.

4. The method for double-sided spraying of a PCB board as described in claim 3, characterized in that: In the third step, the second printing system includes a second printing table, a second embedded conveyor belt, and a second printing system. The second embedded conveyor belt is disposed within the second printing table, and the second printing system is disposed above the second printing table. The second printing table has a second conveyor belt groove and several second suction cups. The second embedded conveyor belt is disposed within the second conveyor belt groove, and its top has a second conveying surface. The tops of the several second suction cups are simultaneously located on the second suction surface. The second printing system has a second conveying and feeding state and a second adsorption and spraying state. When the second printing system is in the second conveying and feeding state, the second conveying surface is higher than the second adsorption surface. At this time, the first printing surface of the PCB board is in contact with the second conveying surface, and the second embedded conveyor belt drives the PCB board to move back and forth on the second printing table. When the second printing system is in the second adsorption and spraying state, the second conveying surface is lower than the second adsorption surface. At this time, the first printing surface of the PCB board is adsorbed and fixed on the second adsorption surface, and the second printing system performs printing on the second printing surface of the PCB board. When the flip-plate system is in the feeding state, the feeding / discharging port corresponds to the first embedded conveyor belt of the first printing system. The first embedded conveyor belt transports the PCB board, which has completed the printing action on the first printing surface, through the feeding / discharging port into the functional cavity. When the flip-plate system is in the flipping state, the upper receiving system and the lower receiving system fix the PCB board in the functional cavity. The flipping motor drives the flipping table to flip, so that the feeding / discharging port corresponds to the second embedded conveyor belt of the second printing system. When the flip-plate system is in the discharging state, the upper receiving system and the lower receiving system push the PCB board through the feeding / discharging port onto the second embedded conveyor belt of the second printing system. The second embedded conveyor belt transports the PCB board to the second printing system, where the printing action is performed on the second printing surface of the PCB board.

5. The method for double-sided spraying of a PCB board as described in claim 4, characterized in that: The spatial position of the first conveying surface is fixed. Several first suction cups move up and down within the first printing station to adjust the spatial position of the first suction surface. This ensures that when the first printing system is in the first conveying and feeding state, the first conveying surface is higher than the first suction surface; and when the first printing system is in the first suction spraying state, the first conveying surface is lower than the first suction surface. The spatial position of the second transmission surface is fixed. The spatial position of the second adsorption surface is adjusted by the up-and-down extension and retraction of several second suction cups on the second printing station. When the second printing system is in the second transmission feeding state, the second transmission surface is higher than the second adsorption surface. When the second printing system is in the second adsorption spraying state, the second transmission surface is lower than the second adsorption surface.

6. The method for double-sided spraying of a PCB board as described in claim 5, characterized in that: The first printing system includes a moving track and a printhead, with the printhead located at the bottom of the moving track. The second printing system includes a moving track and a printhead, with the printhead located at the bottom of the moving track.

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