Material taking control method, device and equipment and storage medium

Abstract

The embodiment of the invention discloses a material taking control method, device and equipment and a storage medium, an optical fiber signal obtained by scanning a material box through a scanning optical fiber is obtained, at least one layer of wafer is placed in the material box, the scanning optical fiber and a mechanical arm are installed on the same motion motor, and the motion motor is used for driving the scanning optical fiber and the mechanical arm to move; based on the optical fiber signal, determining a first motor position when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and determining a second motor position when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer; based on the first motor position and the second motor position, determining a safe position range of the motion motor when the manipulator safely takes out the wafer from the target material layer or the next layer of the target material layer; and based on the safe position range, the manipulator is controlled to take the material from the target material layer or the next layer of the target material layer, so that the risk of wafer fragments caused by the fact that the manipulator touches the wafer in the process of stretching into the material box can be reduced, and the material taking safety is improved.

Description

Technical Field

[0001] The present disclosure relates to wafer manufacturing technology, wafer testing technology, and in particular to a material fetching control method, device, equipment and storage medium. Background Art

[0002] In chip production, multiple process steps need to be performed on wafers, and different process steps are carried out on different devices. Most devices need to use robots to take out the transferred wafers from the material box. In the relevant technology, a fixed robot material taking position is set, so that the robot can take out the wafer from the material box based on the fixed material taking position. However, when the robot takes the wafer, if there are abnormalities in the placement of the material box, the shape of the wafer, etc., there will be a risk of the robot hitting and damaging the wafer, and the wafer will be broken into pieces. How to safely take out the wafer from the material box is an urgent problem to be solved. Summary of the invention

[0003] The embodiments of the present disclosure provide a material taking control method, device, equipment and storage medium to improve the safety of material taking.

[0004] One aspect of an embodiment of the present disclosure provides a material taking control method, comprising:

[0005] Acquire an optical fiber signal obtained by scanning a material box with a scanning optical fiber, wherein at least one layer of wafers is placed in the material box, and the scanning optical fiber and the manipulator are installed on the same motion motor, and the motion motor is used to drive the scanning optical fiber and the manipulator to move;

[0006] Based on the optical fiber signal, determining a first motor position when the scanning optical fiber scans a lower surface of a wafer in a target material layer, and determining a second motor position when the scanning optical fiber scans an upper surface of a wafer in a layer below the target material layer;

[0007] Based on the first motor position and the second motor position, determining a safe position range of the motion motor when the robot safely takes out the wafer from the target material layer or a layer below the target material layer;

[0008] Based on the safe position range, the robot is controlled to absorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and move out of the material box.

[0009] Another aspect of the embodiments of the present disclosure provides a material taking control device, comprising:

[0010] A signal acquisition module, used to acquire an optical fiber signal obtained by scanning a material box with a scanning optical fiber, wherein at least one layer of wafers is placed in the material box, and the scanning optical fiber and the manipulator are installed on the same motion motor, and the motion motor is used to drive the scanning optical fiber and the manipulator to move;

[0011] a position determination module, for determining, based on the optical fiber signal, a first motor position when the scanning optical fiber scans a lower surface of a wafer in a target material layer, and a second motor position when the scanning optical fiber scans an upper surface of a wafer in a layer below the target material layer;

[0012] a range determination module, for determining, based on the first motor position and the second motor position, a safe position range of the motion motor when the robot safely takes out a wafer from the target material layer or a layer below the target material layer;

[0013] The material fetching control module is used to control the robot to absorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer based on the safe position range, and move out of the material box.

[0014] Another aspect of the embodiments of the present disclosure provides a material taking control device, the device comprising: a host computer, a scanning optical fiber, a manipulator and a motion motor, the manipulator and the scanning optical fiber are installed on the motion motor;

[0015] The motion motor is used to drive the scanning optical fiber to move and scan a material box, in which at least one layer of wafers is placed; and to drive the robot to move;

[0016] The host computer is used to obtain the optical fiber signal obtained by scanning the material box with the scanning optical fiber; based on the optical fiber signal, determine the first motor position when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and determine the second motor position when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer; based on the first motor position and the second motor position, determine the safe position range of the motion motor when the robot safely removes the wafer from the target material layer or the next layer of the target material layer; based on the safe position range, control the robot to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and move out of the material box.

[0017] Another aspect of the embodiments of the present disclosure provides an electronic device, comprising: a memory for storing a computer program; a processor for executing the computer program stored in the memory, and when the computer program is executed, the material taking control method described in any of the above embodiments is implemented.

[0018] Another aspect of the embodiments of the present disclosure provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the material taking control method described in any of the above embodiments is implemented.

[0019] Another aspect of the embodiments of the present disclosure provides a computer program product, including a computer program, which, when executed by a processor, implements the material taking control method described in any of the above embodiments.

[0020] In the embodiment of the present disclosure, based on the optical fiber signal obtained by scanning the material box with the scanning optical fiber, the first motor position corresponding to the moving motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and the second motor position corresponding to the moving motor when the scanning optical fiber scans the upper surface of the wafer in the layer below the target material layer can be determined. The relative position between the lower surface of the wafer in the target material layer and the upper surface of the wafer in the layer below the target material layer can be converted into the relative position of the moving motor, so that based on the relative position of the moving motor, the safe position range of the moving motor can be determined when the manipulator reaches in from between the target material layer and the next layer to pick up materials. Based on the safe position range, the manipulator is controlled to pick up materials from the target material layer or the next layer of the target material layer, which can reduce the risk of the manipulator touching the target material layer wafer and the next layer of the target material layer wafer causing wafer fragments when reaching into the material box, thereby improving the safety of material picking.

[0021] The technical solution of the present disclosure is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0023] The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0024] Figure 1 is a structural schematic diagram of a material taking control device provided by an exemplary embodiment of the present disclosure;

[0025] Figure 2 is a flow chart of a material taking control method provided by an exemplary embodiment of the present disclosure;

[0026] Figure 3 is a flowchart of a process for determining a safe location range provided by an exemplary embodiment of the present disclosure;

[0027] Figure 4 is a schematic diagram of the movement changes of the scanning optical fiber and the manipulator provided by an exemplary embodiment of the present disclosure;

[0028] Figure 5 is a flowchart of a process for determining a safe location range provided by another exemplary embodiment of the present disclosure;

[0029] Figure 6 is a schematic diagram of the movement change of a manipulator provided by an exemplary embodiment of the present disclosure;

[0030] Figure 7 is a schematic diagram of an upper safety margin and a lower safety margin provided by an exemplary embodiment of the present disclosure;

[0031] Figure 8 is a flow chart of a material taking control method provided by another exemplary embodiment of the present disclosure;

[0032] Fig. 9 is a structural schematic diagram of a material taking control device provided by an exemplary embodiment of the present disclosure;

[0033] Fig.10 It is a schematic diagram of the structure of an electronic device provided by an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure unless otherwise specifically stated.

[0035] Those skilled in the art can understand that the terms "first" and "second" in the embodiments of the present disclosure are only used to distinguish different steps, devices or modules, etc., and neither represent any specific technical meaning nor indicate the necessary logical order between them.

[0036] It should also be understood that in the embodiments of the present disclosure, “plurality” may refer to two or more than two, and “at least one” may refer to one, two, or more than two.

[0037] It should also be understood that any component, data or structure mentioned in the embodiments of the present disclosure can generally be understood as one or more, unless explicitly limited or otherwise indicated in the context.

[0038] In addition, the term "and / or" in the present disclosure is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present disclosure generally indicates that the associated objects before and after are in an "or" relationship.

[0039] It should also be understood that the description of the various embodiments in the present disclosure focuses on the differences between the various embodiments, and the same or similar aspects thereof can be referenced to each other, and for the sake of brevity, they will not be described one by one.

[0040] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0041] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0042] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0043] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0044] The disclosed embodiments can be applied to electronic devices such as terminal devices, computer systems, servers, etc., which can operate with many other general or special computing system environments or configurations. Examples of well-known terminal devices, computing systems, environments and / or configurations suitable for use with electronic devices such as terminal devices, computer systems, servers, etc. include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, network personal computers, small computer systems, large computer systems, and distributed cloud computing technology environments including any of the above systems, etc.

[0045] Electronic devices such as terminal devices, computer systems, servers, etc. can be described in the general context of computer system executable instructions (such as program modules) executed by computer systems. Generally, program modules can include routines, programs, object programs, components, logic, data structures, etc., which perform specific tasks or implement specific abstract data types. Computer systems / servers can be implemented in a distributed cloud computing environment, where tasks are performed by remote processing devices linked through a communication network. In a distributed cloud computing environment, program modules can be located on local or remote computing system storage media including storage devices.

[0046] like Figure 1 As shown, it shows a structural schematic diagram of a material taking control device provided by an exemplary embodiment of the present disclosure.

[0047] The material fetching control device includes a host computer 11 and a material fetching device 12, wherein the material fetching device 12 includes a scanning optical fiber 121, a manipulator 122 and a motion motor 123, the scanning optical fiber 121 and the manipulator 122 are installed on the motion motor 123, the motion motor 123 can be used to drive the scanning optical fiber 121 and the manipulator 122 to move, the scanning optical fiber 121 is used to scan the material box, specifically, to scan the wafer placement layer, i.e., the material layer, in the material box, and the manipulator 122 is used to take and place the wafer from the material box. The scanning optical fiber 121 and the manipulator 122 can move synchronously, the motion motor 123 can drive the scanning optical fiber 121 to move and scan the material box, and can drive the manipulator 122 to move, so that the manipulator 122 moves to the wafer placement layer position that can be inserted into the material box to take and place the wafer from the material box.

[0048] In a possible implementation, the scanning optical fiber 121 and the manipulator 122 are mounted on the motion motor 123, and the scanning optical fiber 121 and the manipulator 122 move in space according to the motion motor 123. For example, the scanning optical fiber 121 and the manipulator 122 can follow the motion motor 123 to move in space, wherein the up and down direction in space can be regarded as the V axis, and the left and right direction can be regarded as the U axis. In the process of scanning the material box, the motion motor 123 drives the scanning optical fiber 121 to keep moving parallel to the placement direction of the wafers in the material box, and the placement direction of the wafers in the material box can be the up and down direction. The motion motor 123 can drive the scanning optical fiber 121 to move in the up and down direction (V axis), so that the scanning optical fiber 121 scans the material box. In the process of transporting the wafer, the motion motor 123 drives the manipulator 122 to move in the up and down direction (V axis). When it moves to the material-retrieving position, the motion motor 123 drives the manipulator 122 to move in the left and right direction (U axis), so that the manipulator 122 extends into the material box to retrieve the material.

[0049] The host computer 11 can be used to control the material picking device 12 to perform the material picking process. The material picking device 12 controls the manipulator to pick up and place the wafer from the material box according to the control signal of the host computer. In a possible implementation, when controlling the manipulator to take out the wafer from the material box, the host computer 11 can obtain the optical fiber signal obtained by the scanning optical fiber scanning the material box, and based on the optical fiber signal, determine the first motor position when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and determine the second motor position when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer; based on the first motor position and the second motor position, determine the safe position range of the moving motor when the manipulator safely takes out the wafer from the target material layer or the next layer of the target material layer; based on the safe position range, control the manipulator to adsorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and move out of the material box.

[0050] In a possible implementation, the manipulator can remove the wafer by adsorbing the lower surface of the wafer, or it can also remove the wafer by adsorbing the upper surface of the wafer. Specifically: if a ceramic manipulator is used, the ceramic manipulator relies on negative pressure to adsorb and remove the wafer from the lower surface of the wafer. If a Bernoulli manipulator is used, the Bernoulli manipulator relies on positive pressure to adsorb and remove the wafer from the upper surface of the wafer. Therefore, after determining the first motor position when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and determining the second motor position when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer, different wafers are adsorbed by manipulators with different adsorption principles, which can be the target material layer wafer or the next layer of wafer in the target material layer.

[0051] It can be understood as follows: based on the first motor position and the second motor position, after determining the safe position range, the Bernoulli manipulator is controlled to take materials from the next layer of the target material layer by positive pressure adsorption, or the ceramic manipulator is controlled to take materials from the target material layer by negative pressure adsorption. For example, there are 8 layers of material in the material box, all of which store wafers. From the top and bottom directions (V axis), the top wafer is the 8th layer of wafer, arranged in sequence. If the target material layer is the 3rd layer, the next layer of the target material layer is the 2nd layer. After determining the safe position range, the manipulator can extend between the 3rd layer and the 2nd layer. If the manipulator is a ceramic manipulator, it adsorbs the lower surface of the 3rd layer wafer and moves it out of the material box. If the manipulator is a Bernoulli manipulator, it adsorbs the upper surface of the 2nd layer wafer and moves it out of the material box.

[0052] like Figure 2 As shown, it shows a flow chart of a material taking control method provided by an exemplary embodiment of the present disclosure. In an exemplary embodiment, the method can be used in the host computer 11 in the above-mentioned material taking control device, and the method includes steps 210-240:

[0053] Step 210, obtaining the optical fiber signal obtained by scanning the material box with the scanning optical fiber.

[0054] At least one layer of wafers is placed in the material box, and the scanning optical fiber and the manipulator are installed on the same motion motor, which is used to drive the scanning optical fiber and the manipulator to move. Before controlling the material picking device to pick up materials, the material picking device can be installed and debugged first, and the manipulator and the scanning optical fiber are installed on the V-axis of the motion motor, and the V-axis motion path direction of the motion motor is adjusted to be parallel to the placement direction of the wafers in the material box. The manipulator is debugged to be in the same direction as the scanning optical fiber, and perpendicular to the motion direction axis of the motion motor, pointing to the center direction of the material box, so that the scanning optical fiber can scan the material box and the manipulator can reach into the material box to pick up materials.

[0055] After debugging, the motion motor is controlled to move so that the scanning optical fiber scans the material box. When the scanning optical fiber scans the material box, a counter-fiber will be emitted. During the movement of the scanning optical fiber, the emitted counter-fiber will be blocked by the wafer and produce a signal change. That is, the optical fiber signal obtained by the scanning optical fiber scanning the material box changes due to the wafer blocking. The upper computer can obtain the optical fiber signal obtained by the scanning optical fiber scanning the material box, and determine whether the scanning optical fiber scans the wafer surface based on the optical fiber signal.

[0056] Step 220, based on the optical fiber signal, determine the first motor position when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and determine the second motor position when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer.

[0057] The target material layer is the reference material layer. The lower surface of the wafer in the target material layer is scanned to determine the safe range of the motion motor that can take out the wafer. In a possible implementation, when the robot takes out the wafer in the target material layer, it needs to extend from the middle of the target material layer and the next layer of the target material layer. In order to avoid the risk of the robot touching the target material layer wafer or the next layer of wafer in the target material layer when extending, causing wafer fragments, it is necessary to control the extension position of the robot according to the position of the lower surface of the wafer in the target material layer (referred to as the lower surface of the wafer) and the position of the upper surface of the wafer in the next layer of the target material layer (referred to as the upper surface of the wafer). Of course, the principle of the robot taking out the next layer of wafer in the target material layer is the same, which will not be repeated here.

[0058] In a possible implementation, the surface position of the wafer is converted into the motor position of the motion motor in the material handling device, so as to determine whether the wafer can be safely picked up and placed according to the position of the motion motor. The motor position of the motion motor refers to the position of the motion motor on the direction axis corresponding to the placement direction of the wafer in the material box (i.e., the above-mentioned V-axis position). For example, when the motion motor drives the scanning optical fiber to move up and down to scan the material box, the motor position of the motion motor is the position of the motion motor on the direction axis corresponding to the up and down direction (also referred to as the motor height).

[0059] Based on the acquired optical fiber signal, the first motor position corresponding to the moving motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer can be determined, and the second motor position of the moving motor when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer can be determined. In a possible implementation, the host computer can record the change process of the optical fiber signal during the scanning optical fiber scanning the material box and the corresponding scanning time, and record the motor position of the moving motor at the corresponding scanning time. When determining the first motor position, the motor position of the moving motor corresponding to the scanning optical fiber scanning the lower surface of the wafer in the target material layer can be determined according to the change of the optical fiber signal, which is the first motor position. When determining the second motor position, the motor position of the moving motor corresponding to the scanning optical fiber scanning the upper surface of the wafer in the next layer of the target material layer can be determined according to the change of the optical fiber signal, which is the second motor position.

[0060] Step 230 , based on the first motor position and the second motor position, determine a safe position range of the motion motor when the robot arm safely removes the wafer from the target material layer or the layer below the target material layer.

[0061] In one possible embodiment, the spacing distance between the manipulator and the scanning optical fiber is a fixed distance. After obtaining the first motor position of the moving motor when the scanning optical fiber scans the lower surface of the wafer, and obtaining the second motor position of the moving motor when the scanning optical fiber scans the upper surface of the next layer of the wafer, combined with the spacing distance between the manipulator and the scanning optical fiber, the safe position range of the moving motor can be determined when the manipulator safely removes the wafer from the target material layer or the next layer of the target material layer.

[0062] Specifically: If a ceramic manipulator is used, the ceramic manipulator relies on negative pressure to absorb the wafer from the lower surface of the wafer in the target material layer and move it out of the material box. If a Bernoulli manipulator is used, the Bernoulli manipulator relies on positive pressure to absorb the wafer from the upper surface of the wafer in the next layer of the target material layer and move it out of the material box.

[0063] Regardless of whether the lower surface of the wafer in the target material layer is adsorbed, or the upper surface of the wafer in the next layer of the target material layer is adsorbed, the safe position range of the motion motor that the robot can use to safely remove the corresponding wafer is consistent.

[0064] Step 240 , based on the safe position range, control the robot arm to absorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and move out of the material box.

[0065] In one possible implementation, after determining the safe position range, the current motor position of the motion motor can be obtained. If the current motor position is within the safe position range, the robot arm can be controlled to extend into the middle of the material layer, that is, between the target material layer and the next layer of the target material layer, to take material from the target material layer or the next layer of the target material layer, that is, control the robot arm to absorb the wafer in the target material layer or the next layer of the target material layer, move out the material box, and complete the wafer removal process.

[0066] In the embodiment of the present disclosure, based on the optical fiber signal obtained by scanning the material box by the scanning optical fiber, the first motor position corresponding to the moving motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and the second motor position corresponding to the moving motor when the scanning optical fiber scans the upper surface of the wafer in the layer below the target material layer can be determined. The relative position between the lower surface of the wafer in the target material layer and the upper surface of the wafer in the layer below the target material layer can be converted into the relative position of the moving motor. Therefore, based on the relative position of the moving motor, the safe position range of the moving motor can be determined when the manipulator reaches in from between the target material layer and the layer below the target material layer to retrieve materials. Based on the safe position range, the manipulator is controlled to retrieve materials from the target material layer or the layer below the target material layer, which can reduce the risk of the manipulator touching the wafer and causing wafer fragments during the reaching-in process, thereby improving the safety of material retrieval.

[0067] In a possible implementation, the safe position range is determined by combining the first motor position, the second motor position, and the spacing distance between the manipulator and the scanning optical fiber, such as Figure 3 As shown, the process may include steps 310-330:

[0068] Step 310, obtaining the distance between the manipulator and the scanning optical fiber.

[0069] In a possible implementation, after the manipulator and the scanning optical fiber are mounted on the motion motor, the spacing distance between the manipulator and the scanning optical fiber on the motion direction axis can be measured and stored in the host computer, and the spacing distance is the vertical spacing distance between the manipulator and the scanning optical fiber on the motion direction axis. In combination with the above example, when the motion direction axis is a direction axis corresponding to the up and down direction, the spacing distance can be the vertical distance between the manipulator and the scanning optical fiber in the up and down direction.

[0070] The host computer can obtain the stored interval distance during the process of determining the safe position range.

[0071] Step 320: Determine an upper limit of a safety range based on the difference between the first motor position and the interval distance, where the upper limit of the safety range is the maximum value of the safety position range.

[0072] In a possible implementation, the installation position of the manipulator is higher than the installation position of the scanning optical fiber. The first motor position is the motor position of the moving motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer. The motor position of the moving motor when the manipulator is flush with the lower surface of the wafer in the target material layer is subtracted from the interval between the manipulator and the scanning optical fiber. The motor position of the moving motor when the manipulator is flush with the lower surface of the wafer in the target material layer is obtained. The upper limit of the safety range corresponding to the motor position of the moving motor is determined based on the motor position when the manipulator is flush with the lower surface of the wafer in the target material layer, wherein the upper limit of the safety range is not greater than the motor position when the manipulator is flush with the lower surface of the wafer in the target material layer.

[0073] Indicatively, Figure 4 As shown, the interval distance between the manipulator 122 and the scanning optical fiber 121 is H, and the difference between the motor position of the moving motor when the scanning optical fiber scans the lower surface of the wafer in the target material layer and the motor position of the moving motor when the manipulator is flush with the lower surface of the wafer in the target material layer is the interval distance H between the manipulator 122 and the scanning optical fiber 121. As shown in the following formula (1):

[0074] ArmWaferPosV_up[i]=LightWaferPosV_down[i]-H (1)

[0075] Among them, LightWaferPosV_down[i] is the motor position when the scanning optical fiber scans the lower surface of the i-th layer of wafer (that is, the first motor position), H is the spacing distance between the robot 122 and the scanning optical fiber 121, and ArmWaferPosV_up[i] is the motor position when the robot is flush with the lower surface of the i-th layer of wafer.

[0076] Step 330 : determining a lower limit of a safety range based on a difference between the second motor position and the interval distance, where the lower limit of the safety range is a minimum value of the safety position range.

[0077] The second motor position is the motor position of the moving motor when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer, and then the interval between the manipulator and the scanning optical fiber is subtracted to obtain the motor position of the moving motor when the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer. The lower limit of the safety range corresponding to the motor position of the moving motor is determined based on the motor position when the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer, wherein the lower limit of the safety range is not less than the motor position when the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer. As shown in the following formula (2):

[0078] ArmWaferPosV_down[i]=LightWaferPosV_up[i-1]-H (2)

[0079] Among them, LightWaferPosV_up[i-1] is the motor position when the scanning fiber scans the upper surface of the i-1th layer wafer (that is, the second motor position), and ArmWaferPosV_down[i] is the motor position when the robot is flush with the upper surface of the i-1th layer wafer.

[0080] In this embodiment, according to the first motor position and the second motor position, and the spacing distance between the manipulator and the scanning optical fiber, the motor position when the manipulator is flush with the lower surface of the wafer in the target material layer and the motor position when the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer can be determined respectively. The upper limit of the safety range is determined according to the motor position when the manipulator is flush with the lower surface of the wafer in the target material layer, and the lower limit of the safety range is determined according to the motor position when the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer. This can improve the accuracy of determining the safety position range, thereby helping to improve the safety of material retrieval.

[0081] The manipulator has a certain thickness. In another possible implementation, the manipulator thickness may also be considered in determining the safe position range to improve the accuracy of determining the safe position range. Figure 5 As shown, the process may include steps 410-430:

[0082] Step 410, obtaining a first spacing distance between the scanning optical fiber and the upper surface of the robot, and obtaining a second spacing distance between the scanning optical fiber and the lower surface of the robot.

[0083] To avoid contact between the robot and the wafer, it is necessary to avoid contact between the upper surface of the robot and the lower surface of the wafer in the target material layer, and to avoid contact between the lower surface of the robot and the upper surface of the wafer in the next layer of the target material layer. The first spacing distance between the scanning optical fiber and the upper surface of the robot and the second spacing distance between the scanning optical fiber and the lower surface of the robot can be obtained respectively, wherein the first spacing distance and the second spacing distance can be measured and calculated in advance.

[0084] Step 420 : determining an upper limit of a safety range based on a difference between the first motor position and the first spacing distance.

[0085] The first motor position is subtracted from the first spacing distance between the upper surface of the robot and the scanning optical fiber to obtain the motor position of the moving motor when the upper surface of the robot is flush with the lower surface of the wafer. For example, as shown in the following formula (3):

[0086] ArmWaferPosV_up[i]=LightWaferPosV_down[i]-H_up (3)

[0087] Wherein, H_up is the first interval distance.

[0088] The upper limit of the safety range is determined based on the motor position of the moving motor when the upper surface of the manipulator is flush with the lower surface of the wafer in the target material layer, which can prevent the upper surface of the manipulator from touching the target material layer wafer, wherein the upper limit of the safety range is not greater than the motor position when the upper surface of the manipulator is flush with the lower surface of the wafer in the target material layer.

[0089] Step 430 : determining a lower limit of a safety range based on a difference between the second motor position and the second spacing distance.

[0090] The second motor position is subtracted from the second spacing distance between the lower surface of the robot and the scanning optical fiber to obtain the motor position of the moving motor when the lower surface of the robot is flush with the upper surface of the wafer in the next layer of the target material layer. For example, as shown in the following formula (4):

[0091] ArmWaferPosV_down[i]=LightWaferPosV_up[i-1]-H_down (4)

[0092] Wherein, H_down is the second spacing distance.

[0093] The lower limit of the safety range is determined based on the motor position of the moving motor when the lower surface of the robot is flush with the upper surface of the wafer in the next layer of the target material layer, which can prevent the lower surface of the robot from touching the wafer in the next layer of the target material layer, wherein the lower limit of the safety range is not less than the motor position when the lower surface of the robot is flush with the upper surface of the wafer in the next layer of the target material layer.

[0094] In this embodiment, in the process of determining the safe position range, the thickness of the manipulator is taken into consideration, and the upper limit of the safety range is determined based on the motor position of the moving motor when the upper surface of the manipulator is flush with the lower surface of the wafer in the target material layer, and the lower limit of the safety range is determined based on the motor position of the moving motor when the lower surface of the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer. This can prevent the upper surface of the manipulator from touching the wafer in the target material layer, and prevent the lower surface of the manipulator from touching the wafer in the next layer of the target material layer, thereby improving the safety of material retrieval.

[0095] In a possible implementation, the process of calculating and acquiring the first spacing distance between the scanning optical fiber and the upper surface of the manipulator may include steps 510-530:

[0096] Step 510, obtaining m third motor positions when the scanning optical fiber scans the lower surface of m wafer layers, and respectively obtaining m fourth motor positions when the upper surface of the robot is in contact with the lower surface of each wafer layer in the m wafer layers, where m is an integer greater than or equal to 1.

[0097] In a possible implementation, m third motor positions can be obtained when the scanning optical fiber scans the lower surface of m layers of wafers, and the m third motor positions are respectively the motor positions of the moving motor when the scanning optical fiber scans the lower surface of each layer of wafers in the m layers of wafers. In order to improve the accuracy of obtaining the third motor position, when obtaining the third motor position corresponding to scanning the lower surface of a layer of wafers, multiple sets of position data corresponding to multiple scans of the lower surface of the layer of wafers can be obtained, and the average of the multiple sets of position data is determined as the third motor position corresponding to the lower surface of the layer of wafers.

[0098] Schematically, the method of calculating the position of the third motor when the scanning optical fiber scans the lower surface of the first layer of wafer is shown in the following formula (5):

[0099]

[0100] Wherein, Vg1 is the third motor position corresponding to a scan of the lower surface of the first layer of wafer, n is the number of scans of the first layer of wafer by the scanning optical fiber, n is an integer greater than or equal to 1, the sum of n groups of Vg1 is the sum of the third motor positions corresponding to n scans of the lower surface of the first layer of wafer, and Vgp1 is the third motor position corresponding to the scan of the lower surface of the first layer of wafer obtained by the final determination. Schematically, n can be 10.

[0101] In a possible implementation, the position of the motion motor may be adjusted so that the upper surface of the robot arm just contacts the lower surface of each layer of the m-layer wafers, and m fourth motor positions at the time of contact are obtained respectively.

[0102] Schematically, when the m-layer wafer includes the 1st layer wafer, the 13th layer wafer, and the 25th layer wafer, the position of the motion motor can be adjusted so that the upper surface of the manipulator just contacts the lower surfaces of the 1st layer wafer, the 13th layer wafer, and the 25th layer wafer, respectively, thereby obtaining the fourth motor position when contacting the lower surface of the 1st layer wafer, the fourth motor position when contacting the lower surface of the 13th layer wafer, and the fourth motor position when contacting the lower surface of the 25th layer wafer, respectively.

[0103] Step 520 , respectively determine the differences between the m third motor positions and the m fourth motor positions to obtain m differences.

[0104] After obtaining m third motor positions and m fourth motor positions, the differences between the m third motor positions and their corresponding fourth motor positions can be calculated respectively to obtain m differences. One difference is the difference between the third motor position when the scanning optical fiber scans the lower surface of a layer of wafer and the fourth motor position when it contacts the upper surface of the robot and the lower surface of the wafer.

[0105] Indicatively, in combination with the above example, when the m-layer wafer includes the 1st layer wafer, the 13th layer wafer, and the 25th layer wafer, three difference values ​​can be calculated, as shown in the following equations (6), (7), and (8):

[0106] G1=Vgp1-V1 (6)

[0107] G13=Vgp13-V13 (7)

[0108] G25=Vgp25-V25 (8)

[0109] Among them, Vgp1 is the third motor position corresponding to scanning the lower surface of the first layer of wafer; Vgp13 is the third motor position corresponding to scanning the lower surface of the 13th layer of wafer; Vgp25 is the third motor position corresponding to scanning the lower surface of the 25th layer of wafer; V1 is the fourth motor position when the upper surface of the manipulator just touches the lower surface of the first layer of wafer; V13 is the fourth motor position when the upper surface of the manipulator just touches the lower surface of the 13th layer of wafer; V25 is the fourth motor position when the upper surface of the manipulator just touches the lower surface of the 25th layer of wafer; G1 is the spacing distance between the scanning optical fiber and the upper surface of the manipulator when scanning the lower surface of the first wafer, G13 is the spacing distance between the scanning optical fiber and the upper surface of the manipulator when scanning the lower surface of the 13th layer of wafer, and G25 is the spacing distance between the upper surface of the scanning optical fiber and the upper surface of the manipulator when scanning the lower surface of the 25th layer of wafer.

[0110] Step 530: determine the average of the m differences as the first interval distance.

[0111] The average of the m differences is calculated, and the average of the m differences is determined as the first spacing distance between the scanning optical fiber and the upper surface of the manipulator.

[0112] In combination with the above example, the first interval distance calculation method is shown in the following formula (9):

[0113]

[0114] That is, the first spacing distance H_up between the scanning optical fiber and the upper surface of the manipulator is the average of the spacing distance between the scanning optical fiber and the upper surface of the manipulator when scanning the lower surface of the first wafer, the spacing distance between the scanning optical fiber and the upper surface of the manipulator when scanning the lower surface of the 13th wafer, and the spacing distance between the scanning optical fiber and the upper surface of the manipulator when scanning the lower surface of the 25th wafer.

[0115] In one possible implementation, the second spacing distance may be calculated by calculating the first spacing distance. In another possible implementation, the second spacing distance may be calculated based on the first spacing distance and the thickness of the manipulator, wherein the process of calculating and obtaining the second spacing distance between the scanning optical fiber and the lower surface of the manipulator may include steps 540-560:

[0116] Step 540, obtaining the fifth motor position when the lower surface of the robot contacts the upper surface of the target wafer, and obtaining the sixth motor position when the upper surface of the robot contacts the lower surface of the target wafer, the target wafer having a preset thickness.

[0117] In a possible implementation, a target wafer with a preset thickness can be placed in the material box in advance, and the fifth motor position when the lower surface of the robot just contacts the upper surface of the target wafer and the sixth motor position when the upper surface of the robot just contacts the lower surface of the target wafer can be recorded respectively.

[0118] Step 550 , determining a manipulator thickness of the manipulator based on the preset thickness and the difference between the fifth motor position and the sixth motor position.

[0119] Indicatively, Figure 6 As shown, the difference D between the fifth motor position and the sixth motor position is the wafer thickness H of the target wafer. 晶 With manipulator thickness H 手 The sum of the fifth motor position and the sixth motor position is calculated, and then the difference between the difference and the preset thickness is calculated to obtain the thickness of the manipulator.

[0120] Step 560: Determine a second spacing distance based on the difference between the first spacing distance and the thickness of the robot.

[0121] The second distance is obtained by subtracting the thickness of the robot from the first distance.

[0122] In this embodiment, the first spacing distance between the upper surface of the manipulator and the scanning optical fiber is calculated based on multiple sets of data, which can improve the accuracy of determining the calculated first spacing distance. In addition, after the manipulator is installed on the motion motor, deformation and tilting may occur, and the thickness after installation may be different from the original thickness of the manipulator. The thickness of the manipulator is calculated based on the motor position when the upper and lower surfaces of the manipulator are in contact with the lower and upper surfaces of the target wafer respectively and the wafer thickness of the target wafer. The actual thickness of the manipulator after being installed on the motion motor can be obtained, ensuring that the accurate thickness of the manipulator is obtained. Based on the accurate manipulator thickness and the first spacing distance, a more accurate second spacing distance is calculated to improve the accuracy of determining the second spacing distance.

[0123] In one possible implementation, an upper safety limit margin and a lower safety limit margin may be pre-set, wherein the upper safety limit margin is used to control the lower surface distance between the robot and the lower surface of the wafer in the target material layer, and the lower safety limit margin is used to control the upper surface distance between the robot and the upper surface of the wafer in the next layer of the target material layer.

[0124] Indicatively, Figure 7As shown, the safety upper limit margin Safe_up and the safety lower limit margin Safe_down can be preset.

[0125] When determining the safe position range, the preset upper safety limit margin and lower safety limit margin can be obtained.

[0126] Optionally, the upper limit of the safety range can be determined based on the difference between the first motor position and the spacing distance and the safety upper limit margin. The difference between the first motor position and the spacing distance is the motor position when the manipulator is flush with the lower surface of the wafer in the target material layer. In one possible implementation, the upper limit of the safety range is the difference between the motor position when the manipulator is flush with the lower surface of the wafer in the target material layer and the safety upper limit margin. In another possible implementation, the upper limit of the safety range can also be determined based on the difference between the first motor position and the first spacing distance and the safety upper limit margin. The difference between the first motor position and the first spacing distance is the motor position when the upper surface of the manipulator is flush with the lower surface of the wafer in the target material layer. The upper limit of the safety range can be the difference between the motor position when the upper surface of the manipulator is flush with the lower surface of the wafer in the target material layer and the safety upper limit margin.

[0127] Combined with the above example, the upper limit of the safety range is ArmWaferPosV_up-Safe_up.

[0128] Optionally, the lower limit of the safety range can be determined based on the difference between the second motor position and the spacing distance, and the safety lower limit margin. The difference between the second motor position and the spacing distance is the motor position when the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer. In one possible implementation, the lower limit of the safety range is the sum of the motor position when the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer and the safety lower limit margin. In another possible implementation, the lower limit of the safety range can also be determined based on the difference between the second motor position and the second spacing distance, and the safety lower limit margin. The difference between the second motor position and the second spacing distance is the motor position when the lower surface of the manipulator is flush with the upper surface of the wafer in the next layer of the target material layer. The lower limit of the safety range can be the sum of the motor position when the lower surface of the manipulator is flush with the upper surface of the wafer and the safety lower limit margin.

[0129] Combined with the above example, the lower limit of the safety range is ArmWaferPosV_down+Safe_down, and the safe position range is (ArmWaferPosV_down+Safe_down, ArmWaferPosV_up-Safe_up).

[0130] In this embodiment, the safe position range is determined in combination with the set upper and lower limits of the safety range. When the motor position of the motion motor is in the safe position range, the robot arm can maintain a certain distance from the lower surface of the wafer in the target material layer and the upper surface of the wafer in the next layer of the target material layer, thereby avoiding touching and damaging the wafer, thereby improving the safety of material retrieval.

[0131] After the safe position range is determined, the robot arm may be controlled to pick up materials from the target material layer or the next layer of the target material layer based on the safe position range. The above step 240 may include the following steps 2401-2402:

[0132] Step 2401, obtaining the current motor position of the motion motor.

[0133] In a possible implementation, the motor position (which may be referred to as the initial motor position) of the motion motor when taking the first layer of wafers and the motion step length of the motion motor may be preset, and the motion step length may be determined according to the spacing between each layer of wafers in the material box. During the material taking process, the motion motor moves according to the set motion step length to drive the robot to move.

[0134] The current motor position of the motion motor is the target position to which the motion motor moves before the robot takes material from the target material layer or the layer next to the target material layer. The current motor position of the motion motor can be calculated based on the layer number corresponding to the target material layer or the layer next to the target material layer and the preset motion step of the motion motor.

[0135] Step 2402, in response to the current motor position being within the safe position range, controlling the robot arm to extend between the target material layer and the layer below the target material layer, and taking material from the target material layer or the layer below the target material layer.

[0136] After calculating the current motor position, if the current motor position is within the safe position range, the robot arm can be controlled to reach into the middle of the material layer to take the wafer.

[0137] In response to the current motor position not being within the safe position range, a material picking alarm message is generated. The material picking alarm message is used to prompt the robot position that there is a risk of picking and placing, so that the user can be informed of the risk information in time to debug the equipment. In a possible implementation, the material picking alarm message can be generated and the material picking device can be controlled to stop, that is, the robot is controlled to suspend the material picking process to avoid the risk of wafer fragmentation.

[0138] In one possible implementation, in response to the current motor position not being within the safe position range, the motor position of the motion motor can be automatically adjusted so that the motion motor is within the safe position range. When the motion motor moves to the safe position range, the robot arm can be controlled to pick up material from the target material layer or the next layer of the target material layer.

[0139] In a possible implementation, before taking a wafer from the target material layer or the next layer of the target material layer, the wafer thickness can also be detected to detect whether there is an abnormality. When the actual thickness of the wafer is normal, the safe position range of the motion motor is determined, so as to control the robot to take the material based on the safe position range. The process includes steps 610-630:

[0140] Step 610, in response to taking material from the target material layer, based on the optical fiber signal, determine the seventh motor position when the scanning optical fiber scans the upper surface of the wafer in the target material layer; based on the difference between the seventh motor position and the first motor position, determine the actual wafer thickness of the wafer to be taken from the target material layer.

[0141] If the robot arm takes material from the target material layer, the wafer in the target material layer is the wafer to be taken, and the wafer thickness of the wafer to be taken in the target material layer is detected. During this process, the host computer determines the position of the seventh motor when the scanning optical fiber scans the upper surface of the wafer in the target material layer based on the acquired optical fiber signal.

[0142] In a possible implementation manner, the difference between the seventh motor position and the first motor position is determined as the actual wafer thickness of the wafer to be taken out in the target material layer.

[0143] Step 620, in response to taking material from the next layer of the target material layer, determine the eighth motor position when the scanning optical fiber scans the lower surface of the wafer in the next layer of the target material layer based on the optical fiber signal; based on the difference between the second motor position and the eighth motor position, determine the actual thickness of the wafer to be taken from the next layer of the target material layer.

[0144] If the robot arm takes material from the next layer of the target material layer, the wafer in the next layer of the target material layer is the wafer to be taken, and the wafer thickness of the wafer to be taken in the next layer of the target material layer is detected. During this process, the upper computer determines the position of the eighth motor when the scanning optical fiber scans the lower surface of the wafer in the next layer of the target material layer based on the acquired optical fiber signal.

[0145] Based on the difference between the second motor position and the eighth motor position, the actual wafer thickness of the wafer to be taken in the next layer of the target material layer is determined.

[0146] Schematically, the method for calculating the actual thickness of the wafer is shown in the following formula (10):

[0147] WaferThick[i]=LightWaferPosV_up[i]-LightWaferPosV_down[i] (10)

[0148] WaferThick[i] is the actual wafer thickness of the i-th wafer layer, LightWaferPosV_up[i] is the motor position of the moving motor when the scanning optical fiber is flush with the upper surface of the i-th wafer layer (when the i-th layer is the target material layer, it is the seventh motor position, when the i-th layer is the layer below the target material layer, it is the second motor position); LightWaferPosV_down[i] is the motor position of the moving motor when the scanning optical fiber is flush with the lower surface of the i-th wafer layer (when the i-th layer is the target material layer, it is the first motor position, when the i-th layer is the layer below the target material layer, it is the eighth motor position).

[0149] Step 630, in response to the actual thickness of the wafer being within a preset thickness range, based on the first motor position and the second motor position, determine a safe position range of the motion motor when the robot arm safely removes the wafer from the target material layer or the layer below the target material layer.

[0150] In a possible implementation, the maximum wafer thickness ThickMax and the minimum wafer thickness ThickMin can be pre-set. If the actual wafer thickness is between the preset thickness range (ThickMin, ThickMax), it can be determined that the actual wafer thickness belongs to the preset thickness range. Based on the first motor position and the second motor position, the safe position range can be determined, and the above step 230 can be executed.

[0151] In another possible implementation, the thickness range can be set based on the preset wafer thickness, such as the minimum wafer thickness is 1 / 2 of the preset wafer thickness, and the maximum wafer thickness is 2 times of the preset wafer thickness. If the actual wafer thickness is between the preset thickness range (1 / 2 of the preset wafer thickness, 2 times of the preset wafer thickness), it is determined that the actual wafer thickness falls within the preset thickness range.

[0152] In one possible case, in response to the actual thickness of the wafer not falling within a preset thickness range, a wafer abnormality type may be determined based on the actual thickness of the wafer, and corresponding abnormality alarm information may be generated based on the wafer abnormality type.

[0153] Optionally, in response to the actual thickness of the wafer being less than the minimum thickness value of the preset thickness range, the wafer abnormality type is determined to be wafer thickness abnormality. If the actual thickness of the wafer is less than the set minimum thickness value (i.e., the above-mentioned minimum wafer thickness value), the wafer thickness is determined to be abnormal, and a thickness abnormality alarm message may be output. Indicatively, if the actual thickness of the wafer is less than 1 / 2 of the preset wafer thickness, a thickness abnormality alarm message is output.

[0154] Optionally, in response to the actual thickness of the wafer belonging to the first preset range, the wafer abnormality type is determined to be wafer stacking placement, and the minimum value of the first preset range is not less than the maximum value of the preset thickness range. If the actual thickness of the wafer is within the first preset range, the wafer stacking placement is determined (that is, multiple wafers are placed in the material layer where the wafer to be taken is placed), and the wafer stacking alarm information can be output. Schematically, the first preset range can be (2 times the preset wafer thickness, 3 times the preset wafer thickness), if the actual thickness of the wafer is within the first preset range, the wafer stacking alarm information can be output.

[0155] Optionally, in response to the actual thickness of the wafer belonging to the second preset range, the wafer abnormality type is determined to be a wafer staggered mode, and the minimum value of the second preset range is not less than the maximum value of the first preset range. If the actual thickness of the wafer is within the second preset range, the wafer staggered placement is determined (such as the two ends of the wafer are stuck in different material layer grooves), and a wafer staggered alarm message can be output. Schematically, the second preset range can be greater than 3 times the preset wafer thickness and above. If the actual thickness of the wafer is within the second preset range, a wafer staggered alarm message can be output.

[0156] In this embodiment, before determining the safe position range, the actual thickness of the wafer to be taken in the material taking layer (the target material layer or the layer below the target material layer) is detected. When the actual thickness of the wafer is normal, the safe position range is determined again, and the robot is controlled to take the material. It can timely detect whether the wafer itself and the placement position in the material taking layer are normal, thereby improving the safety of material taking.

[0157] In the case that the actual thickness of the wafer is abnormal, the wafer abnormality type can also be determined based on the actual thickness of the wafer, and the corresponding abnormal alarm information can be output, so that the user can obtain the abnormal information and the cause of the abnormality in time.

[0158] In an exemplary embodiment, Figure 8 As shown, taking the wafer in the target material layer as an example, the material taking control process includes the steps:

[0159] Step 810, obtaining the motor position when the scanning optical fiber scans the upper surface and the lower surface of the wafer in the target material layer, and calculating the actual thickness of the wafer.

[0160] Step 820 , determining whether the actual wafer thickness of the wafer in the target material layer is within the thickness range, if so, executing step 830 , if not, executing step 870 .

[0161] Step 830, determine whether the value of the motor position when scanning the lower surface of the wafer in the target material layer - the first spacing distance between the scanning optical fiber and the upper surface of the robot - the safety upper limit margin is greater than the height of the robot for picking up and placing the wafer. If so, execute step 840, if not, execute step 860.

[0162] The height of the robot for picking up and placing the wafer refers to the motor height of the moving motor when the robot picks up and places the wafer, which is the current motor position in the above embodiment. The motor position when scanning the lower surface of the wafer in the target material layer - the first spacing distance between the scanning optical fiber and the upper surface of the robot - the safety upper limit margin is the safety upper limit range. Determine whether the value of the motor position when scanning the lower surface of the wafer in the target material layer - the first spacing distance between the scanning optical fiber and the upper surface of the robot - the safety upper limit margin is greater than the height of the robot for picking up and placing the wafer, that is, determine whether the current motor position is less than the safety upper limit range.

[0163] Step 840, determine whether the value of the motor position when scanning the upper surface of the wafer in the next layer of the target material layer - the second spacing distance between the scanning optical fiber and the lower surface of the robot + the safety lower limit margin is less than the height of the robot to pick up and place the wafer. If so, execute step 850, if not, execute step 860.

[0164] The motor position when scanning the upper surface of the wafer in the next layer of the target material layer - the second spacing distance between the scanning optical fiber and the lower surface of the manipulator + the value of the safety lower limit margin is the safety lower limit range. Determine whether the motor position when scanning the upper surface of the wafer in the next layer of the target material layer - the second spacing distance between the scanning optical fiber and the lower surface of the manipulator + the safety lower limit margin is less than the height of the manipulator for picking up and placing the wafer, that is, determine whether the current motor position is greater than the safety lower limit range.

[0165] Step 850, controlling the robot to pick up and place the wafer.

[0166] Step 860, generating material extraction alarm information.

[0167] Step 870 , determine whether the actual wafer thickness is less than 0.5 times the preset wafer thickness, if so, execute step 880 , if not, execute step 890 .

[0168] Step 880, generating wafer thickness abnormality alarm information.

[0169] Step 890, determine whether the actual wafer thickness is greater than 2 times the preset wafer thickness and less than 3 times the preset wafer thickness, if so, execute step 8100, if not, execute step 8110.

[0170] Step 8100, generating wafer stacking alarm information.

[0171] Step 8110, determine whether the actual wafer thickness is greater than 3 times the preset wafer thickness, if so, execute step 8120.

[0172] Step 8120, generating wafer misalignment alarm information.

[0173] The specific implementation of steps 810-8120 may refer to the above embodiments and will not be described in detail here.

[0174] Fig. 9 : is a structural schematic diagram of a material taking control device provided by an exemplary embodiment of the present disclosure, the device can be used for the host computer described in the above embodiment, the device includes:

[0175] A signal acquisition module 910 is used to acquire an optical fiber signal obtained by scanning a material box with a scanning optical fiber, wherein at least one layer of wafers is placed in the material box, and the scanning optical fiber and the manipulator are installed on the same motion motor, and the motion motor is used to drive the scanning optical fiber and the manipulator to move;

[0176] A position determination module 920 is used to determine, based on the optical fiber signal, a first motor position when the scanning optical fiber scans a lower surface of a wafer in a target material layer, and to determine a second motor position when the scanning optical fiber scans an upper surface of a wafer in a layer below the target material layer;

[0177] A range determination module 930, for determining a safe position range of the motion motor when the robot safely takes out a wafer from the target material layer or a layer below the target material layer based on the first motor position and the second motor position;

[0178] The material picking control module 940 is used to control the robot to absorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer based on the safe position range, and move out of the material box.

[0179] In an exemplary embodiment, the installation position of the manipulator is higher than the installation position of the scanning optical fiber;

[0180] The range determination module 930 is further used for:

[0181] Obtaining the spacing distance between the manipulator and the scanning optical fiber;

[0182] Determine a safety range upper limit based on a difference between the first motor position and the interval distance, wherein the safety range upper limit is a maximum value of the safety position range;

[0183] Based on the difference between the second motor position and the spacing distance, a safety range lower limit is determined, where the safety range lower limit is a minimum value of the safety position range.

[0184] In an exemplary embodiment, the range determination module 930 is further configured to:

[0185] Acquire a first spacing distance between the scanning optical fiber and an upper surface of the manipulator, and acquire a second spacing distance between the scanning optical fiber and a lower surface of the manipulator;

[0186] determining the upper limit of the safety range based on a difference between the first motor position and the first spacing distance;

[0187] The safety range lower limit is determined based on a difference between the second motor position and the second spacing distance.

[0188] In an exemplary embodiment, the range determination module 930 is further configured to:

[0189] Obtaining a preset upper safety limit margin and a lower safety limit margin, wherein the upper safety limit margin is used to control the lower surface distance between the manipulator and the lower surface of the wafer in the target material layer, and the lower safety limit margin is used to control the upper surface distance between the manipulator and the upper surface of the wafer in the next layer of the target material layer;

[0190] Determining the upper limit of the safety range based on the difference between the first motor position and the interval distance and the upper limit margin of the safety range;

[0191] The lower limit of the safety range is determined based on the difference between the second motor position and the interval distance and the lower safety limit margin.

[0192] In an exemplary embodiment, the apparatus further comprises:

[0193] A position acquisition module, used to acquire the positions of m third motors when the scanning optical fiber scans the lower surface of m layers of wafers, and respectively acquire the positions of m fourth motors when the upper surface of the manipulator contacts the lower surface of each layer of wafers in the m layers of wafers, where m is an integer greater than or equal to 1;

[0194] A difference determination module, used to respectively determine the differences between the m third motor positions and the m fourth motor positions to obtain m differences;

[0195] A distance determination module is used to determine the average of the m differences as the first interval distance.

[0196] In an exemplary embodiment, the location acquisition module is further used to:

[0197] Acquiring a fifth motor position when the lower surface of the robot is in contact with the upper surface of a target wafer, and acquiring a sixth motor position when the upper surface of the robot is in contact with the lower surface of the target wafer, wherein the target wafer has a preset thickness;

[0198] The device also includes:

[0199] a first thickness determination module, configured to determine a manipulator thickness of the manipulator based on the preset thickness and a difference between the fifth motor position and the second motor position;

[0200] The distance determination module is further used to determine the second spacing distance based on the difference between the first spacing distance and the thickness of the robot arm.

[0201] In an exemplary embodiment, the location determination module 910 is further configured to:

[0202] In response to taking material from the target material layer, based on the optical fiber signal, determining the seventh motor position when the scanning optical fiber scans the upper surface of the wafer in the target material layer; in response to taking material from the next layer of the target material layer, based on the optical fiber signal, determining the eighth motor position when the scanning optical fiber scans the lower surface of the wafer to be taken in the next layer of the target material layer;

[0203] The device also includes:

[0204] a second thickness determination module, for determining, in response to taking material from the target material layer, an actual wafer thickness of the wafer in the target material layer based on a difference between the seventh motor position and the first motor position; and, in response to taking material from a next layer of the target material layer, determining, in response to taking material from the next layer of the target material layer, an actual wafer thickness of the wafer to be taken in the next layer of the target material layer based on a difference between the second motor position and the eighth motor position;

[0205] The range determination module 930 is also used to determine the safe position range of the motion motor when the robot safely removes the wafer from the target material layer or the next layer of the target material layer based on the first motor position and the second motor position in response to the actual thickness of the wafer falling within the preset thickness range.

[0206] In an exemplary embodiment, the apparatus further comprises:

[0207] a type determination module, configured to determine a wafer abnormality type based on the actual wafer thickness in response to the actual wafer thickness not belonging to the preset thickness range;

[0208] The information generation module is used to generate corresponding abnormal alarm information based on the wafer abnormality type.

[0209] In an exemplary embodiment, the type determination module is further configured to:

[0210] In response to the actual thickness of the wafer being less than a minimum thickness value of the preset thickness range, determining that the wafer abnormality type is a wafer thickness abnormality;

[0211] In response to the actual thickness of the wafer belonging to a first preset range, determining that the wafer abnormality type is wafer stacking placement, and the minimum value of the first preset range is not less than the maximum value of the preset thickness range;

[0212] In response to the actual thickness of the wafer belonging to a second preset range, the wafer abnormality type is determined to be a wafer staggered mode, and the minimum value of the second preset range is not less than the maximum value of the first preset range.

[0213] In an exemplary embodiment, the material fetching control module 940 is further used to:

[0214] Obtaining a current motor position of the motion motor;

[0215] In response to the current motor position belonging to the safe position range, controlling the extension into between the target material layer and a layer next to the target material layer to take material from the target material layer or a layer next to the target material layer;

[0216] The information generating module is further used to generate material picking alarm information in response to the current motor position not belonging to the safe position range.

[0217] The material taking control device in the embodiment of the present disclosure corresponds to the embodiment of the material taking control method of the present disclosure, and the relevant contents can be referenced to each other, which will not be repeated here. The beneficial technical effects corresponding to the material taking control device in the embodiment of the present disclosure can refer to the corresponding beneficial technical effects of the corresponding exemplary method part above, which will not be repeated here.

[0218] In addition, an embodiment of the present disclosure further provides an electronic device, including:

[0219] Memory for storing computer programs;

[0220] The processor is used to execute the computer program stored in the memory, and when the computer program is executed, the material taking control method described in any of the above embodiments of the present disclosure is implemented.

[0221] Fig.10 is a schematic diagram of the structure of an electronic device provided by an exemplary embodiment of the present disclosure, such as Fig.10 As shown, the electronic device includes one or more processors and memory.

[0222] The processor may be a central processing unit (CPU) or other forms of processing units having data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0223] The memory may store one or more computer program products, and the memory may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, a random access memory (RAM) and / or a cache memory (cache), etc. The non-volatile memory may include, for example, a read-only memory (ROM), a hard disk, a flash memory, etc. One or more computer program products may be stored on the computer-readable storage medium, and the processor may run the computer program product to implement the material taking control method and / or other desired functions of the various embodiments of the present disclosure described above.

[0224] In one example, the electronic device may further include: an input device and an output device, and these components are interconnected via a bus system and / or other forms of connection mechanisms (not shown).

[0225] In addition, the input device may also include, for example, a keyboard, a mouse, and the like.

[0226] The output device can output various information to the outside, including the determined distance information, direction information, etc. The output device can include, for example, a display, a speaker, a printer, a communication network and a remote output device connected thereto, and the like.

[0227] Of course, to simplify, Fig.10 Only some of the components related to the present disclosure in the electronic device are shown, and components such as a bus, an input / output interface, etc. are omitted. In addition, according to specific application situations, the electronic device may further include any other appropriate components.

[0228] In addition to the above-mentioned methods and devices, an embodiment of the present disclosure may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the material taking control method according to various embodiments of the present disclosure described in the above part of this specification.

[0229] The computer program product may be written in any combination of one or more programming languages ​​to write program code for performing the operations of the disclosed embodiments, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0230] In addition, an embodiment of the present disclosure may also be a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, enables the processor to execute the steps of the material taking control method according to various embodiments of the present disclosure described in the above part of this specification.

[0231] The computer readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can include, for example, but is not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0232] The basic principles of the present disclosure are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present disclosure. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, and are not limitations. The above details do not limit the present disclosure to the necessity of adopting the above specific details to be implemented.

[0233] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the system embodiment, since it basically corresponds to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0234] The block diagrams of the devices, apparatuses, equipment, and systems involved in this disclosure are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including," "comprising," "having," and the like are open words, referring to "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or," and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0235] The method and apparatus of the present disclosure may be implemented in many ways. For example, the method and apparatus of the present disclosure may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above order of steps for the method is for illustration only, and the steps of the method of the present disclosure are not limited to the order specifically described above, unless otherwise specifically stated. In addition, in some embodiments, the present disclosure may also be implemented as a program recorded in a recording medium, which includes machine-readable instructions for implementing the method according to the present disclosure. Therefore, the present disclosure also covers a recording medium storing a program for executing the method according to the present disclosure.

[0236] It should also be noted that in the apparatus, device and method of the present disclosure, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present disclosure.

[0237] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0238] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A material taking control method, characterized in that: The method comprises: Acquire an optical fiber signal obtained by scanning a material box with a scanning optical fiber, wherein at least one layer of wafers is placed in the material box, and the scanning optical fiber and the manipulator are installed on the same motion motor, and the motion motor is used to drive the scanning optical fiber and the manipulator to move; Based on the optical fiber signal, determining a first motor position when the scanning optical fiber scans a lower surface of a wafer in a target material layer, and determining a second motor position when the scanning optical fiber scans an upper surface of a wafer in a layer below the target material layer; Based on the first motor position and the second motor position, determining a safe position range of the motion motor when the robot safely takes out the wafer from the target material layer or a layer below the target material layer; Based on the safe position range, the robot is controlled to absorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and move out of the material box.

2. The method according to claim 1, characterized in that: The installation position of the manipulator is higher than the installation position of the scanning optical fiber; The determining, based on the first motor position and the second motor position, a safe position range of the motion motor when the robot safely takes out the wafer from the target material layer or a layer next to the target material layer comprises: Obtaining the spacing distance between the manipulator and the scanning optical fiber; Determine a safety range upper limit based on a difference between the first motor position and the interval distance, wherein the safety range upper limit is a maximum value of the safety position range; Based on the difference between the second motor position and the spacing distance, a safety range lower limit is determined, where the safety range lower limit is a minimum value of the safety position range.

3. The method according to claim 2, characterized in that The obtaining of the interval distance between the manipulator and the scanning optical fiber comprises: Acquire a first spacing distance between the scanning optical fiber and an upper surface of the manipulator, and acquire a second spacing distance between the scanning optical fiber and a lower surface of the manipulator; The step of determining an upper limit of a safety range based on a difference between the first motor position and the interval distance comprises: determining the upper limit of the safety range based on a difference between the first motor position and the first spacing distance; The step of determining the lower limit of the safety range based on the difference between the second motor position and the interval distance comprises: The safety range lower limit is determined based on a difference between the second motor position and the second spacing distance.

4. The method according to any one of claims 2 to 3, characterized in that: The method further comprises: Obtaining a preset upper safety limit margin and a lower safety limit margin, wherein the upper safety limit margin is used to control the lower surface distance between the manipulator and the lower surface of the wafer in the target material layer, and the lower safety limit margin is used to control the upper surface distance between the manipulator and the upper surface of the wafer in the next layer of the target material layer; The step of determining an upper limit of a safety range based on a difference between the first motor position and the interval distance comprises: Determining the upper limit of the safety range based on the difference between the first motor position and the interval distance and the upper limit margin of the safety range; The step of determining the lower limit of the safety range based on the difference between the second motor position and the interval distance comprises: The lower limit of the safety range is determined based on the difference between the second motor position and the interval distance and the lower safety limit margin.

5. The method according to claim 3, characterized in that: The method further comprises: Obtaining m third motor positions when the scanning optical fiber scans the lower surface of m layers of wafers, and respectively obtaining m fourth motor positions when the upper surface of the manipulator contacts the lower surface of each layer of the m layers of wafers, where m is an integer greater than or equal to 1; respectively determining the differences between the m third motor positions and the m fourth motor positions to obtain m differences; An average of the m differences is determined as the first interval distance.

6. The method according to claim 3, characterized in that The method further comprises: Acquiring a fifth motor position when the lower surface of the robot is in contact with the upper surface of a target wafer, and acquiring a sixth motor position when the upper surface of the robot is in contact with the lower surface of the target wafer, wherein the target wafer has a preset thickness; determining a manipulator thickness of the manipulator based on the preset thickness and a difference between the fifth motor position and the second motor position; The second spacing distance is determined based on a difference between the first spacing distance and the thickness of the robot.

7. The method according to any one of claims 1 to 3, characterized in that: After acquiring the optical fiber signal obtained by scanning the material box with the scanning optical fiber, the method further comprises: In response to taking material from the target material layer, based on the optical fiber signal, determine the seventh motor position when the scanning optical fiber scans the upper surface of the wafer in the target material layer; based on the difference between the seventh motor position and the first motor position, determine the actual wafer thickness of the wafer to be taken from the target material layer; or, in response to taking material from the next layer of the target material layer, based on the optical fiber signal, determine the eighth motor position when the scanning optical fiber scans the lower surface of the wafer to be taken from the next layer of the target material layer; based on the difference between the second motor position and the eighth motor position, determine the actual wafer thickness of the wafer to be taken from the next layer of the target material layer; In response to the actual thickness of the wafer being within a preset thickness range, based on the first motor position and the second motor position, determining a safe position range of the motion motor when the robot arm safely removes the wafer from the target material layer or a layer below the target material layer; In response to the actual thickness of the wafer not belonging to the preset thickness range, a wafer abnormality type is determined based on the actual thickness of the wafer; and corresponding abnormality alarm information is generated based on the wafer abnormality type.

8. The method according to claim 7, characterized in that The determining of the wafer abnormality type based on the wafer thickness includes: In response to the actual thickness of the wafer being less than a minimum thickness value of the preset thickness range, determining that the wafer abnormality type is a wafer thickness abnormality; In response to the actual thickness of the wafer belonging to a first preset range, determining that the wafer abnormality type is wafer stacking placement, and the minimum value of the first preset range is not less than the maximum value of the preset thickness range; In response to the actual thickness of the wafer belonging to a second preset range, the wafer abnormality type is determined to be a wafer staggered mode, and the minimum value of the second preset range is not less than the maximum value of the first preset range.

9. The method according to any one of claims 1 to 3, characterized in that: The method of controlling the robot to absorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer based on the safe position range and moving out of the material box includes: Obtaining a current motor position of the motion motor; In response to the current motor position belonging to the safe position range, controlling the manipulator to extend between the target material layer and a layer next to the target material layer, and taking material from the target material layer or a layer next to the target material layer; The method further comprises: In response to the current motor position not belonging to the safe position range, a material picking alarm message is generated.

10. A material taking control device, characterized in that: The device comprises: A signal acquisition module, used to acquire an optical fiber signal obtained by scanning a material box with a scanning optical fiber, wherein at least one layer of wafers is placed in the material box, and the scanning optical fiber and the manipulator are installed on the same motion motor, and the motion motor is used to drive the scanning optical fiber and the manipulator to move; a position determination module, for determining, based on the optical fiber signal, a first motor position when the scanning optical fiber scans a lower surface of a wafer in a target material layer, and a second motor position when the scanning optical fiber scans an upper surface of a wafer in a layer below the target material layer; a range determination module, for determining, based on the first motor position and the second motor position, a safe position range of the motion motor when the manipulator safely takes out a wafer from the target material layer or a layer below the target material layer; The material fetching control module is used to control the robot to absorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer based on the safe position range, and move out of the material box.

11. A material taking control device, characterized in that: The device comprises a host computer, a scanning optical fiber, a manipulator and a motion motor, wherein the manipulator and the scanning optical fiber are mounted on the motion motor; The motion motor is used to drive the scanning optical fiber to move and scan a material box, in which at least one layer of wafers is placed; and for driving the manipulator to move; The host computer is used to obtain the optical fiber signal obtained by scanning the material box by the scanning optical fiber; based on the optical fiber signal, determine the first motor position when the scanning optical fiber scans the lower surface of the wafer in the target material layer, and determine the second motor position when the scanning optical fiber scans the upper surface of the wafer in the next layer of the target material layer; Based on the first motor position and the second motor position, determining a safe position range of the motion motor when the robot safely takes out the wafer from the target material layer or a layer below the target material layer; Based on the safe position range, the robot is controlled to absorb the upper surface of the wafer in the next layer of the target material layer or the lower surface of the wafer in the target material layer, and move out of the material box.

12. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the material taking control method described in any one of claims 1 to 9 is implemented.

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