Uniform coating method based on layout design parameters
By generating a film thickness distribution curve chart and calculating the film thickness uniformity value, and determining the layout design parameters, the problem of the uniformity of the deposition film thickness of the large movable substrate is solved, and the uniformity and repetition of the coating process are achieved.
Patent Information
- Application Number
- CN202311277871.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-28
- Publication Date
- 2025-03-28
AI Technical Summary
In the prior art, the uniformity of the deposition film thickness of large movable substrates often fails to meet the standards, and is usually optimized by evaporation source closed-cell or correction plate shading, but it is not possible to fundamentally achieve the optimal and reasonable uniform coating solution.
By obtaining the distance between the movable substrate and the evaporation source and the evaporation source nozzle spacing, a film thickness distribution curve is generated, and the film thickness uniform value is calculated to compare with the preset threshold value. The layout design parameters are determined based on the comparison results to optimize the coating process.
The uniformity verification and verification of a given movable substrate and evaporation source opening configuration is achieved, avoiding the problem of uneven coating and ensuring the repetition and quality of the coating process.
Smart Images
Figure CN119710609A_ABST