A circuit board chemical metal deposition device

Abstract

The present invention relates to the technical field of copper deposition of circuit boards, and in particular to a chemical metal deposition device for circuit boards. It comprises: a first box body, a second box body and a third box body, both sides of the top of which are provided with gaps for the circuit boards to pass through; a controller, installed on the side of the first box body; a support frame, connected to the top of the first box body; a support plate, symmetrically connected to the bottom of the first box body; a sliding frame, respectively slidably connected to the support frame and the support plate and moving up and down, and the two sliding frames are symmetrically arranged up and down; a rubber strip, connected to the side of the two sliding frames close to each other. The present invention can effectively remove pollutants in various holes on the circuit board by designing a unique sliding frame and rubber strip, combined with a negative pressure system formed by a first pumping pump and a feeding pipe, especially for holes with smaller diameters or larger depths, the cleaning solution can be flushed in sequence through the square holes on the conveyor belt to ensure that each hole can be fully cleaned.

Description

Technical Field

[0001] The invention relates to the technical field of copper deposition of circuit boards, and in particular to a chemical metal deposition device for circuit boards. Background Art

[0002] In the modern electronic manufacturing industry, printed circuit boards (PCBs) are the core components of electronic products, and the accuracy and reliability of their manufacturing processes are directly related to the performance of the final products. Chemical metal deposition technology is a key step in the manufacturing process of printed circuit boards, especially in the production of multi-layer boards and high-density interconnect (HDI) boards. The copper deposition process is used to form conductive paths on non-conductive substrates, or to fill through-holes to achieve electrical connections between different layers.

[0003] The existing copper plating process for circuit boards first requires that the circuit boards be soaked in an alkaline cleaning solution for cleaning. This process is intended to remove various contaminants that may exist on the surface of the circuit board and in its holes, such as oil, fingerprints, oxides, and dust. However, the traditional immersion cleaning method has certain limitations. For holes with a smaller diameter or a larger depth, it is difficult for the cleaning solution to completely penetrate the hole wall, resulting in poor cleaning effect. In addition, the strong adhesion between some stubborn contaminants and the surface of the substrate makes it impossible to effectively remove these impurities by simple immersion. Even by extending the immersion time or increasing the concentration of the cleaning solution, it may not significantly improve the cleaning effect, but may lead to increased costs and waste of resources. The contaminants remaining on the inner wall of the hole will interfere with the uniform deposition of copper ions at the predetermined position, resulting in uneven coating thickness, increased porosity, and decreased bonding strength. These problems directly affect the reliability and durability of the circuit board, such as reducing the conductivity of the circuit, increasing the risk of short circuits, and shortening the product life. Summary of the invention

[0004] In view of this, the present invention provides a circuit board chemical metal deposition device, which can overcome the shortcomings of the existing copper deposition process that when the circuit board is cleaned, pollutants are easily left on the inner walls of the holes on the circuit board, resulting in poor copper deposition effect in the holes, which will directly affect the reliability and durability of the circuit board.

[0005] A circuit board chemical metal deposition device, comprising: a first box, a second box and a third box connected in sequence, each of which has a notch on both sides of the top for the circuit board to pass through; the first box, the second box and the third box are each provided with a conveying assembly for conveying the circuit board; the first box is used to place a solution for pre-treating the circuit board, the second box is used to place a copper plating solution for copper plating the circuit board, and the third box is used to place water for cleaning the circuit board; the first box is characterized in that the first box also includes: a controller installed on the side of the first box; a support frame connected to the top of the first box; a support plate symmetrically connected to the bottom of the first box; a sliding frame, respectively slidably connected to the support frame and the support plate and moving up and down, and the two sliding frames are symmetrically arranged up and down; a rubber strip connected to the two sliding frames close to each other one side; an electric push rod, respectively installed on the support frame and the support plate, and the telescopic rod of the electric push rod is connected to the sliding frame to drive the sliding frame to move until the rubber strip is in contact with the surface of the circuit board; a first pumping pump, symmetrically installed at the bottom of the first box body; connecting plates are respectively connected to the side of the support frame and the bottom of the first box body; a feed pipe, connected to the connecting plate, and the two ends of the feed pipe are respectively connected to the first pumping pump and the sliding frame, the first pumping pump transports the pretreatment solution in the first box body to the sliding frame on the upper side through the feed pipe, and at the same time generates a downward suction force in the sliding frame on the lower side, so that the pretreatment solution can smoothly pass through the holes of the circuit board covered by the two sliding frames; the second box body also includes: a copper plating mechanism, which is arranged on the second box body and is used to perform copper plating on the circuit board.

[0006] Furthermore, the conveying assembly includes: a rotating shaft, which is symmetrically connected to the inside of the first box body, the second box body and the third box body at upper and lower intervals; a first roller, which is evenly connected to the rotating shaft, and a gap is left between the first rollers on the upper and lower sides to allow the circuit board to pass through, and the first roller can convey the circuit board by rotation; a connecting gear, which is connected to the end of the rotating shaft, and the connecting gears on the upper and lower sides are meshed with each other; a first drive motor is respectively installed on the side of the first box body, the second box body and the third box body; a rotating rod, which is rotatably connected to the side of the first box body, the second box body and the third box body, and the end of the rotating rod is connected to the output shaft of the first drive motor; a worm, which is connected to the outer side of the rotating rod at intervals; a worm wheel, which is connected to the end of the rotating shaft on the lower side, and the worm wheel is meshed with the worm.

[0007] Furthermore, the copper plating mechanism includes: a first frame, which is symmetrically connected to the inside of the second box body at upper and lower intervals, and a gap is left between the first frames on the upper and lower sides to allow the circuit board to pass through; a second pumping pump, which is installed at intervals on the side of the second box body; a pumping pipe, which is connected to the side of the second box body at intervals and remains connected, and the end of the pumping pipe is connected to the feed port of the second pumping pump; a first shunt pipe, which is connected to the discharge port of the second pumping pump, and the end of the first shunt pipe is connected to the side of the first frame and remains connected, so that the second pumping pump can transport the copper plating solution to the first frame through the first shunt pipe; a cleaning component, which is arranged on the third box body and is used to clean the circuit board after the copper plating treatment.

[0008] Furthermore, the cleaning component includes: a second frame, which is provided with two groups, and the two groups of the second frames are connected to the inner wall of the third box body at intervals, and the two groups of the second frames are arranged alternately in the horizontal direction; a water pump, which is installed at intervals on the side of the third box body; a suction pipe, which is connected to the side of the third box body at intervals and remains connected, and the end of the suction pipe is connected to the water inlet of the water pump; a second diversion pipe, which is connected to the water outlet of the water pump, and the end of the second diversion pipe is connected to the second frame and remains connected, so that the water pump can transport clean water to the second frame through the second diversion pipe.

[0009] Furthermore, it also includes: a rotating wheel, which is symmetrically rotatably connected to the inside of the sliding frame on the upper side; a conveyor belt, which is wound around the two rotating wheels, and the conveyor belt has two square holes; a second drive motor, which is installed on the side of the sliding frame on the upper side, and the output shaft of the second drive motor is connected to the rotating shaft of one of the rotating wheels, and is used to drive the rotating wheel and the conveyor belt to rotate; a stopper, which is symmetrically connected to the inner wall of the sliding frame on the upper side, and the stopper is located on the inner side of the rotating wheel; an auxiliary wheel, which is rotatably connected to the stopper, and the conveyor belt bypasses the auxiliary wheel, so that the conveyor belt can be opened into a rectangular shape and fit the top of the circuit board.

[0010] Furthermore, it also includes: a hollow plate, connected to the side of the sliding frame; a third material pump, installed on the side of the hollow plate, and the discharge port of the third material pump is connected to the inside of the hollow plate; a connecting pipe, both ends of which are respectively connected to the feed pipe on the rear side and the feed port of the third material pump and remain connected; two fixed plates are provided, and are respectively connected to the sides of the upper and lower hollow plates that are close to each other, and a liquid supply channel connected to the inside of the hollow plate is opened inside the fixed plate; two rubber wipers are provided, and are respectively connected to the sides of the two fixed plates that are close to each other, and the sides of the rubber wipers are also provided with protrusions for cleaning dust on the surface of the circuit board, and the sides of the two rubber wipers that are close to each other are separated by dirt collecting grooves.

[0011] Furthermore, it also includes: wind knives, which are symmetrically installed in the first box body, the second box body and the third box body respectively.

[0012] Furthermore, it also includes: a base connected to the side of the third box body; a linear motor installed on the top of the base; a support seat connected to the mover of the linear motor; a material storage frame placed on the top of the support seat; a support rod connected to the inside of the material storage frame at intervals; and a second roller connected to the support rod for rotation at intervals.

[0013] The beneficial effects of the present invention are as follows: 1. The present invention can effectively remove pollutants in various holes on the circuit board by designing a unique sliding frame and rubber strip, combined with a negative pressure system formed by a first extraction pump and a feed pipe. In particular, for holes with smaller diameters or larger depths, the cleaning solution can be flushed in sequence through the square holes on the conveyor belt to ensure that each hole can be fully cleaned. This design can avoid the problem of poor copper deposition effect due to residual pollutants on the inner wall of the hole, thereby significantly improving the uniformity and bonding strength of the copper deposition layer, reducing the porosity, and improving the electrical performance and reliability of the circuit board.

[0014] 2. The present invention can achieve precise control of the flow of cleaning liquid by providing a third pump, a hollow plate and a liquid supply channel. When the circuit board passes through the rubber strips on the upper and lower sides, the third pump can accurately spray the cleaning liquid onto the surface of the circuit board through the liquid supply channel, and efficiently flush it through the gap between the rubber strip and the circuit board. This design can not only ensure that the cleaning liquid can evenly cover the surface of the circuit board, but also temporarily collect dust through the sump to prevent secondary pollution. In addition, the recycling of the cleaning liquid can also reduce the waste of water resources and further optimize the cleaning efficiency and environmental performance.

[0015] 3. The present invention can realize automatic adjustment of the height of the storage frame through the design of the linear motor and the support seat. When the circuit board completes all processing procedures, the circuit board automatically slides into the storage frame for storage under the action of gravity. Every time a circuit board is stored, the linear motor will drive the storage frame to drop a specified distance to ensure that the next circuit board can be smoothly received. This automated storage mechanism can not only simplify the management of the production line, but also improve the continuity and stability of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0017] Figure 2 It is a schematic diagram of the specific structure of the support frame, support plate and sliding frame of the present invention.

[0018] Figure 3 It is a schematic diagram of the specific structure of the conveying component of the present invention.

[0019] Figure 4 It is a schematic diagram of the installation of the copper deposition mechanism of the present invention.

[0020] Figure 5 It is a schematic diagram of the specific structure of the copper deposition mechanism of the present invention.

[0021] Figure 6 The figure is a schematic diagram of the installation of the rotating wheel, the conveyor belt, the second driving motor, the stopper and the auxiliary wheel of the present invention.

[0022] Figure 7 It is a schematic diagram of the installation of the hollow plate, the third material pumping pump and the connecting pipe of the present invention.

[0023] Figure 8 It is a cross-sectional view of the hollow plate, the fixed plate and the rubber strip of the present invention.

[0024] Fig. 9 It is a schematic diagram of the specific structure of the rubber wiper strip of the present invention.

[0025] Fig.10 It is a schematic diagram of the installation of the air knife of the present invention.

[0026] Fig.11 It is a schematic diagram of the installation of the base, linear motor, support seat and material storage frame of the present invention.

[0027] Fig.12 It is a schematic diagram of the installation of the support rod and the second roller of the present invention.

[0028] In the above drawings: 1-first box, 101-controller, 2-second box, 3-third box, 301-notch, 4-support frame, 5-support plate, 6-sliding frame, 601-rubber strip, 7-electric push rod, 8-first material pump, 9-connecting plate, 10-feeding pipe, 11-rotating shaft, 12-first roller, 13-connecting gear, 14-first driving motor, 15-rotating rod, 16-worm, 17-worm wheel, 18-first square frame, 19-second material pump, 20-feeding pipe, 21-first shunt pipe, 22- The second square frame, 23-water pump, 24-water suction pipe, 25-second diversion pipe, 26-rotating wheel, 27-conveyor belt, 2701-square hole, 28-second drive motor, 29-stopper, 30-auxiliary wheel, 31-hollow plate, 32-third material pumping pump, 33-connecting pipe, 34-fixed plate, 3401-liquid supply channel, 35-rubber wiper strip, 3501-protrusion, 3502-dirt collecting trough, 36-wind knife, 37-base, 38-linear motor, 39-support seat, 40-material storage frame, 41-support rod, 42-second roller. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Embodiment: A circuit board chemical metal deposition device, such as Figure 1-Figure 5 As shown, it includes a first box body 1, a second box body 2 and a third box body 3, and multiple first boxes 1 are arranged horizontally and connected to each other. The right side of the first box body 1 on the far right is connected to the second box body 2, and the right side of the second box body 2 is also connected to the third box body 3, and the left and right sides of the tops of the first box body 1, the second box body 2 and the third box body 3 are provided with notches 301 for the circuit board to pass through, and the controller 101 is installed at the lower left part of the front side of the leftmost first box body 1, and the left side of the top of each first box body 1 is connected to a support frame 4, and the front and rear sides of the bottom of each first box body 1 are connected to a support plate 5, and a sliding frame 6 is slidably connected to the support frame 4. , a sliding frame 6 is also slidably connected between the two support plates 5, the two sliding frames 6 are symmetrically arranged up and down, and the sliding frames 6 are hollow, and the sides of the two sliding frames 6 close to each other are both open-type designs, and the sides of the two sliding frames 6 close to each other are also connected with rubber strips 601, and the shape of the rubber strips 601 is rectangular, and electric push rods 7 are installed on the support frame 4 and the support plate 5, and the telescopic rod of the electric push rod 7 is connected to the sliding frame 6, which is used to drive the sliding frame 6 to move up and down, so that the rubber strips 601 on the sliding frame 6 can fit with the surface of the circuit board, and the first box body 1 is symmetrically connected to the left side of the bottom of the first box body 1. The material pump 8 is connected to the left side of the support frame 4 and the left side of the bottom of the first box body 1 with a connecting plate 9, and the two connecting plates 9 are connected with a feeding pipe 10, and the two ends of the front feeding pipe 10 are respectively connected to the left middle part of the lower sliding frame 6 and the feeding port of the first material pump 8 on the front side, and the two ends of the rear feeding pipe 10 are respectively connected to the left middle part of the upper sliding frame 6 and the discharge port of the first material pump 8 on the rear side, so that the first material pump 8 on the rear side can deliver the pretreatment solution to the inside of the upper sliding frame 6 through the feeding pipe 10, and the pretreatment solution in the upper sliding frame 6 can be flushed downward from the top of the circuit board, and the first material pump 8 on the front side can deliver the pretreatment solution to the inside of the upper sliding frame 6 through the feeding pipe 10. The material pipe 10 can extract the air inside the lower sliding frame 6, thereby generating a suction force under the circuit board, so that the pretreatment solution above the circuit board can pass through the holes on the circuit board more easily and quickly, thereby improving the cleaning effect of the holes on the circuit board. Since each first box body 1 is provided with the above-mentioned processing structure, and various solutions for pretreatment of the circuit board can be placed inside each first box body 1, the circuit board can be automatically subjected to alkaline degreasing, rinsing, micro-etching, pre-preg, activation and degumming treatment processes in sequence. The second box body 2 is also provided with a copper deposition mechanism for copper deposition treatment of the circuit board.

[0031] like Figure 3 As shown, the conveying assembly includes a rotating shaft 11, a first roller 12, a connecting gear 13, a first driving motor 14, a rotating rod 15, a worm 16 and a worm wheel 17. The inner upper parts of the first box body 1, the second box body 2 and the third box body 3 are all rotatably connected with two groups of rotating shafts 11, and the two groups of rotating shafts 11 are symmetrically arranged from top to bottom and are spaced from left to right. Each rotating shaft 11 is spaced from front to back and connected with a plurality of first rollers 12. A gap is left between the first rollers 12 on the upper and lower sides for the circuit board to pass through, and the first rollers 12 can convey the circuit board thereon by rotating. The front end of each rotating shaft 11 is connected with a connecting gear 13, and the connecting gears 13 on the upper and lower sides are meshed with each other. The first box body 1, the second box body 2 and the third box body 3 are rotatably connected with two groups of rotating shafts 11, and the two groups of rotating shafts 11 are symmetrically arranged from top to bottom and are spaced from left to right. A plurality of first rollers 12 are spaced from front to back and connected with each other. A gap is left between the first rollers 12 on the upper and lower sides for the circuit board to pass through, and the first rollers 12 can convey the circuit board thereon by rotating. The front end of each rotating shaft 11 is connected with a connecting gear 13, and the connecting gears 13 on the upper and lower sides are meshed with each other. A first driving motor 14 is installed on the upper left front side of the body 2 and the third box body 3, and the upper front sides of the first box body 1, the second box body 2 and the third box body 3 are rotatably connected with a rotating rod 15, and the left end of the rotating rod 15 is connected to the output shaft of the first driving motor 14, and a plurality of worms 16 are sleeved at intervals on the outer side of the rotating rod 15, and the worm 16 is fixedly connected to the rotating rod 15, and a worm wheel 17 is connected to the front end of the rotating shaft 11 on the lower side, and the worm wheel 17 is located on the front side of the connecting gear 13, and the worm wheel 17 is meshed with the worm 16, so that when the first driving motor 14 drives the rotating rod 15 to rotate, the meshing of the worm wheel 17 and the worm 16 can drive the rotating shaft 11 to rotate, thereby driving the first roller 12 to rotate to transport the circuit board.

[0032] like Figure 4 and Figure 5As shown, the copper deposition mechanism includes a first frame 18, a second extraction pump 19, an extraction pipe 20, a first shunt pipe 21 and a cleaning component. The first frame 18 is symmetrically connected to the upper and lower inner side of the second box body 2. The top and bottom of the upper first frame 18 are both open designs, and the top of the lower first frame 18 is open and the bottom is closed. The number of the first frames 18 is eight, and there is also a gap between the first frames 18 on the upper and lower sides for the circuit board to pass through. Four second extraction pumps 19 are installed at intervals from left to right on the lower rear side of the second box body 2, and four extraction pipes 20 are also connected to the lower rear side of the second box body 2 from left to right. The front end of the extraction pipe 20 is connected to the inside of the second box body 2, and the rear end of the extraction pipe 20 is connected to the feed port of the second extraction pump 19. Each The discharge port of the second extraction pump 19 is connected to a first shunt pipe 21, and the upper end of the first shunt pipe 21 is connected to the rear side of the two first frames 18 and maintained in communication, so that the second extraction pump 19 can transport the copper plating solution to the first frame 18 through the first shunt pipe 21. The third box body 3 is provided with a cleaning component for cleaning the circuit board after the copper plating treatment; the cleaning component includes a second frame 22, a water pump 23, a water pump 24 and a second shunt pipe 25. Two groups of second frames 22 are connected to the upper inner side of the third box body 3, and the number of the two groups of second frames 22 is four and they are spaced from left to right. The top of the upper second frame 22 is a closed design and the bottom is an open design. The bottom of the lower second frame 22 is a closed design and the top is an open design. Figure 4 As shown, the two groups of second boxes 22 are arranged alternately in the horizontal direction, and four water pumps 23 are installed at intervals from left to right on the lower rear side of the third box body 3. Four water pumping pipes 24 are also connected at intervals from left to right on the lower rear side of the third box body 3. The two ends of the water pumping pipes 24 are respectively connected to the water inlet of the third box body 3 and the water pump 23. The water outlet of each water pump 23 is connected to a second diverter pipe 25 and maintained in communication. The upper end of the second diverter pipe 25 is connected to the rear sides of the two second boxes 22 and maintained in communication, so that the water pump 23 can transport clean water to the second box 22 through the second diverter pipe 25.

[0033] In the initial state, the first box body 1 is pre-filled with an appropriate amount of cleaning solution, the second box body 2 and the first square frame 18 on the lower side are filled with copper plating solution, and the third box body 3 and the second square frame 22 on the lower side are filled with clean water. The liquid level in each box body is lower than the gap 301 to prevent mixing of different liquids. First, the circuit board is placed between the first rollers 12 on the upper and lower sides, and then the controller 101 controls the first drive motor 14 to drive the rotating rod 15 to rotate intermittently. The rotating rod 15 can drive the worm 16 and the worm wheel 17 to rotate intermittently. The worm wheel 17 can drive the rotating shaft 11 on the lower side and the first roller 12 to rotate intermittently. Through the meshing action of the connecting gear 13, the rotating shaft 11 on the upper side and the first roller 12 can be driven to rotate synchronously and intermittently. The roller 12 can intermittently transport the circuit board to the right; then the controller 101 can control the electric push rod 7 to drive the sliding frame 6 and the rubber strip 601 on the upper and lower sides to move a specified distance to the side close to each other, so that the spacing between the upper and lower rubber strips 601 is adapted to the thickness of the circuit board. As the circuit board moves intermittently to the right, the circuit board will pass between the upper and lower rubber strips 601, and the upper and lower rubber strips 601 can fit the top and bottom of the circuit board respectively. Since there is no squeezing force between the rubber strip 601 and the circuit board, the rubber strip 601 will not affect the movement of the circuit board to the right; at the same time, the controller 101 will control the two first extraction pumps 8 to start working, and the rear first extraction pump 8 can extract the cleaning solution in the first box 1 and convey it through The pipe 10 conveys the cleaning solution to the interior of the upper sliding frame 6, and the cleaning solution inside the sliding frame 6 will contact the top of the circuit board. At the same time, the first extraction pump 8 on the front side can extract the air inside the lower sliding frame 6 through the delivery pipe 10, so that a negative pressure is formed inside the lower sliding frame 6, thereby generating a downward airflow in each hole on the circuit board, so that the cleaning solution inside the upper sliding frame 6 can quickly flow downward to the interior of the lower sliding frame 6 through each hole on the circuit board, and then the cleaning solution can return to the first box body 1 through the front delivery pipe 10 and the first extraction pump 8 on the front side, so that a circulation system of the cleaning solution can be formed, and each hole on the circuit board can be automatically cleaned, and a better cleaning effect can be guaranteed; then the first The roller 12 will transport the cleaned circuit board to the right, and perform rinsing, micro-etching, pre-preg, activation and degumming processes in sequence. Finally, the first roller 12 will transport the circuit board to between the first boxes 18 on the upper and lower sides, and the controller 101 will control the second pumping pump 19 to work continuously. The second pumping pump 19 can extract the copper deposition solution inside the second box 2 through the pumping pipe 20, and can transport the copper deposition solution to the first boxes 18 on the upper and lower sides through the first shunt pipe 21. The copper deposition solution in the upper first box 18 will contact the top of the circuit board and flow downward along the holes on the circuit board. The copper deposition solution in the lower first box 18 will continue to emerge upward so that the copper deposition solution can contact the bottom of the circuit board, so that the circuit board can be fully copper deposited.Since the flow rate of the copper plating solution transported by the first shunt pipe 21 to the upper first frame 18 is greater than the flow rate of the copper plating solution in the first frame 18 flowing downward along the holes on the circuit board, the copper plating solution in the upper first frame 18 will gradually increase. When the upper first frame 18 is filled with the copper plating solution, the copper plating solution can overflow from the top of the upper first frame 18 and fall down into the second box body 2, thereby not causing waste of the copper plating solution; the first roller 12 continues to transport the circuit board to the right, and the circuit board will pass between the second frames 22 on the upper and lower sides, and the controller 101 will control the water pump 23 to continue working, and the water The pump 23 can extract the water in the third box 3 through the pumping pipe 24, and can transport the water to the second boxes 22 on the upper and lower sides through the second shunt pipe 25. The water in the upper second box 22 will fall down to the top of the circuit board, and can flow down along the holes on the circuit board, and finally flow back into the third box 3. The water in the lower second box 22 will rise up and contact the bottom of the circuit board. Under the action of pressure, it can also flow up along the holes on the circuit board, and finally fall down back into the third box 3. In this way, the copper plating solution remaining on the circuit board can be washed away to ensure the cleanliness of the circuit board. Finally, the circuit board can be taken away manually. ;

[0034] Since the diameters of the holes on the circuit board are not consistent, when the cleaning solution in the upper sliding frame 6 flows downward, most of the cleaning solution may flow downward from the holes with larger apertures, while only a small portion of the cleaning solution may flow downward from the holes with smaller apertures, or even none of the cleaning solution, resulting in the situation that some holes are not cleaned thoroughly. Therefore, a control component is designed; Figure 6 As shown, the control assembly includes a rotating wheel 26, a conveyor belt 27, a second driving motor 28, a stopper 29 and an auxiliary wheel 30. The upper sliding frame 6 is connected to the rotating wheel 26 for symmetrical rotation in the front and rear directions. The two rotating wheels 26 are wound with conveyor belts 27. The width of the conveyor belts 27 is adapted to the internal width of the sliding frame 6. The bottom of the conveyor belt 27 blocks the bottom of the upper sliding frame 6. Two square holes 2701 are opened on the conveyor belt 27. The height of the bottom of the conveyor belt 27 is consistent with the height of the bottom of the rubber strip 601 on the upper side. The front right side of the upper sliding frame 6 is equipped with A second drive motor 28 is provided, and the output shaft of the second drive motor 28 is connected to the rotating shaft of the front rotating wheel 26, so as to drive the rotating wheel 26 and the conveyor belt 27 to rotate. The inner wall of the upper sliding frame 6 is symmetrically connected with blocks 29 front and back, and the blocks 29 block the side where the two rotating wheels 26 are close to each other. The lower parts of the two blocks 29 are rotatably connected with auxiliary wheels 30, and the conveyor belt 27 passes around the two auxiliary wheels 30. The auxiliary wheels 30 cooperate with the rotating wheel 26 to expand the conveyor belt 27 into a rectangular shape, so that the bottom of the conveyor belt 27 can be completely fitted with the top of the circuit board.

[0035] When the device is running, the controller 101 will control the second drive motor 28 to drive the rotating wheel 26 and the conveyor belt 27 to rotate continuously, and the auxiliary wheel 30 will rotate synchronously with the rotation of the rotating wheel 26 to ensure that the conveyor belt 27 always remains in a tensioned state. When the circuit board passes between the sliding frames 6 on the upper and lower sides, the bottom of the conveyor belt 27 will contact the top of the circuit board, and the bottom of the conveyor belt 27 will block the bottom of the upper sliding frame 6, thereby separating the cleaning solution in the upper sliding frame 6 from the circuit board, so that the cleaning solution in the upper sliding frame 6 can only flow downward through the square hole 2701, and the square hole 2701 can move at a uniform speed from front to back on the top of the circuit board as the conveyor belt 27 rotates, so that the square hole 2701 can pass through the top of each hole on the circuit board in turn, ensuring that the cleaning solution can rinse each hole on the circuit board in turn and ensure a good cleaning effect.

[0036] like Figure 7-Figure 9 As shown, it also includes a hollow plate 31, a third material pump 32, a connecting pipe 33, a fixed plate 34 and a rubber strip 35. The left sides of the two sliding frames 6 are connected to the hollow plates 31, and the third material pump 32 is installed on the left sides of the two hollow plates 31, and the discharge port of the third material pump 32 is connected to the inside of the hollow plate 31. The two ends of the connecting pipe 33 are respectively connected to the rear feed pipe 10 and the feed port of the third material pump 32 and keep in communication. The fixed plate 34 is connected to the side of the two hollow plates 31 close to each other. Figure 8 As shown, a liquid supply channel 3401 is opened inside the fixed plate 34, and the liquid supply channel 3401 is inclined. The upper end of the liquid supply channel 3401 is connected to the inside of the hollow plate 31. The left part of the side where the two fixed plates 34 are close to each other is connected to a rubber strip 35. The rubber strip 35 is located on the left side of the lower end of the liquid supply channel 3401. Fig. 9 As shown, a protrusion 3501 is provided on the left side of the lower part of the rubber wiping strip 35, and the protrusion 3501 is similar to a shovel plate, so that the dust on the surface of the circuit board can be cleaned, and three dirt collecting grooves 3502 are separated on the sides of the two rubber wiping strips 35 on the upper and lower sides where they are close to each other, so that the sides of the two rubber wiping strips 35 where they are close to each other are serrated, which can effectively scrape off the dust on the surface of the circuit board during the wiping process.

[0037] When the first roller 12 transports the circuit board to the right, the circuit board will first pass between the hollow plates 31 on the upper and lower sides, and the rubber wiping strips 35 on the upper and lower sides will contact the top and bottom of the circuit board respectively, and the protrusions 3501 on the rubber wiping strips 35 can scrape off the dust adhering to the top and bottom of the circuit board, so as to perform a preliminary cleaning on the surface of the circuit board. Even if the dust is firmly adhered, the bottom of the rubber wiping strips 35 can continue to wipe the dust adhering to the top and bottom of the circuit board, so that the dust is temporarily stored in the dirt collecting tank 3502, thereby ensuring the cleanliness of the surface of the circuit board; at the same time, the third material pump 32 can be controlled to work intermittently by the controller 101. When the third material pump 32 is working, the third material pump 32 32 can extract part of the cleaning solution in the rear feed pipe 10 through the connecting pipe 33, and transport the cleaning solution to the hollow plate 31, and then the cleaning solution can flow to the top of the circuit board through the liquid supply channel 3401 and flush to the left. Under the action of water pressure, the rubber strip 35 will bend and deform slightly to the left, so that the cleaning solution can pass through the gap between the rubber strip 35 and the circuit board. At this time, the cleaning solution can flush the dust temporarily stored in the sump 3502 to the left, and finally the cleaning solution will fall back into the first box body 1. When the third extraction pump 32 is not working, the cleaning solution in the rear feed pipe 10 will not enter the connecting pipe 33, and the rubber strip 35 will return to its original state due to its own elasticity and re-fit the surface of the circuit board.

[0038] like Fig.10 As shown, it also includes a wind knife 36. Two wind knives 36 are symmetrically installed on the upper right side of the first box body 1, the second box body 2 and the third box body 3, and a gap is left between the two wind knives 36 for the circuit board to pass through; every time the circuit board passes through a processing step, the first roller 12 will transport the circuit board to the right through a group of wind knives 36, and at the same time, the controller 101 will control the wind knife 36 to start for a period of time, so that the wind knife 36 can spray a high-speed airflow to the left to form an air curtain, so as to blow away and dry the liquid adhering to the surface of the circuit board, thereby preventing the liquid adhering to the surface of the circuit board from affecting the next process of the circuit board.

[0039] like Figure 1 , Fig.11 and Fig.12 As shown, it also includes a base 37, a linear motor 38, a support seat 39, a material storage frame 40, a support rod 41 and a second roller 42. The lower right part of the third box body 3 is connected to the base 37, the top right side of the base 37 is installed with a linear motor 38, and the mover of the linear motor 38 is connected to the support seat 39, as shown in FIG. Figure 1As shown, the top of the support seat 39 is a slope that is higher on the left and lower on the right. A material storage frame 40 is placed on the top of the support seat 39 so that the material storage frame 40 is also placed at an angle. The left side of the material storage frame 40 is an open design, and the right side of the material storage frame 40 is a closed design. Handles are symmetrically connected to the top of the material storage frame 40 for easy picking. A plurality of groups of support rods 41 are connected at intervals from top to bottom inside the material storage frame 40, and each group of support rods 41 is distributed at intervals from left to right, and each support rod 41 is rotatably connected to a second roller 42 from front to back.

[0040] Initially, in the bottom group of second rollers 42, the top height of the leftmost second roller 42 is flush with the top height of the first roller 12; when the circuit board has completed all the processing procedures, the first roller 12 will transport the circuit board to the right to the top of the bottom group of second rollers 42. Since the storage frame 40 is tilted, the circuit board on the top of the bottom group of second rollers 42 will move to the right into the storage frame 40 for storage under the action of gravity. Then the controller 101 will control the linear motor 38 to drive the support seat 39 and the storage frame 40 to move downward a specified distance, so that the top height of the second group of second rollers 42 from the bottom to the top is flush with the top height of the first roller 12, so that the next circuit board can be automatically picked up. When the storage frame 40 is full of circuit boards, the storage frame 40 can be replaced.

[0041] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the spirit of the present invention.

Claims

1. A circuit board chemical metal deposition device, comprising: A first box (1), a second box (2) and a third box (3) are connected in sequence, and both sides of the top of the three boxes are provided with notches (301) for the circuit board to pass through; the first box (1), the second box (2) and the third box (3) are all provided with a conveying component for conveying the circuit board; the first box (1) is used to place a solution for pre-treating the circuit board, the second box (2) is used to place a copper plating solution for copper plating the circuit board, and the third box (3) is used to place water for cleaning the circuit board; the first box (1) also includes: a controller (101) installed on the side of the first box (1); a support frame (4) connected to the The top of the first box body (1); the support plate (5) is symmetrically connected to the bottom of the first box body (1); the sliding frame (6) is slidably connected to the support frame (4) and the support plate (5) and moves up and down, and the two sliding frames (6) are symmetrically arranged up and down; the rubber strip (601) is connected to the side of the two sliding frames (6) close to each other; the electric push rod (7) is respectively installed on the support frame (4) and the support plate (5), and the telescopic rod of the electric push rod (7) is connected to the sliding frame (6) to drive the sliding frame (6) to move until the rubber strip (601) is in contact with the surface of the circuit board; the first material pump (8) is symmetrically installed on the first box body ( 1) inner bottom; a connecting plate (9) respectively connected to the side of the support frame (4) and the inner bottom of the first box body (1); a feeding pipe (10) connected to the connecting plate (9), and the two ends of the feeding pipe (10) are respectively connected to the first pumping pump (8) and the sliding frame (6), the first pumping pump (8) transports the pretreatment solution in the first box body (1) to the upper sliding frame (6) through the feeding pipe (10), and at the same time generates a downward suction force in the lower sliding frame (6), so that the pretreatment solution can smoothly pass through the inside of the circuit board holes covered by the two sliding frames (6); the second box body (2) also includes: a copper deposition mechanism, which is arranged on the The second box body (2) is used for copper plating the circuit board; the rotating wheel (26) is symmetrically connected to the inside of the upper sliding frame (6); the conveyor belt (27) is wound around the two rotating wheels (26), and the conveyor belt (27) is provided with two square holes (2701); the second driving motor (28) is installed on the side of the upper sliding frame (6), and the output shaft of the second driving motor (28) is connected to the rotating shaft of one of the rotating wheels (26), and is used to drive the rotating wheel (26) and the conveyor belt (27) to rotate; the stopper (29) is symmetrically connected to the inner wall of the upper sliding frame (6), and the stopper (29) is located on the inner side of the rotating wheel (26);An auxiliary wheel (30) is rotatably connected to the stopper (29), and the conveyor belt (27) passes around the auxiliary wheel (30), so that the conveyor belt (27) can be opened into a rectangular shape and fit the top of the circuit board. ; 2. A circuit board chemical metal deposition device according to claim 1, characterized in that: The conveying assembly comprises: a rotating shaft (11) which is rotatably connected to the inside of the first box body (1), the second box body (2) and the third box body (3) at symmetrical intervals in the upper and lower parts; first rollers (12) which are evenly connected to the rotating shaft (11), a gap is left between the first rollers (12) on the upper and lower sides to allow the circuit board to pass through, and the first rollers (12) can convey the circuit board by rotating; a connecting gear (13) which is connected to the end of the rotating shaft (11), and the connecting gears (13) on the upper and lower sides are meshed with each other; a first driving motor (14), respectively installed on the side surfaces of the first housing (1), the second housing (2) and the third housing (3); a rotating rod (15), respectively rotatably connected to the side surfaces of the first housing (1), the second housing (2) and the third housing (3), and an end portion of the rotating rod (15) is connected to the output shaft of the first driving motor (14); a worm (16), connected at intervals to the outer side of the rotating rod (15); a worm wheel (17), connected to the lower end portion of the rotating shaft (11), and the worm wheel (17) is meshed with the worm (16).

3. A circuit board chemical metal deposition device according to claim 2, characterized in that: The copper plating mechanism comprises: a first frame (18) symmetrically connected to the inside of the second box (2) at intervals, and a gap is left between the first frames (18) on the upper and lower sides to allow the circuit board to pass through; a second pumping pump (19) installed at intervals on the side of the second box (2); a pumping pipe (20) connected to the side of the second box (2) at intervals and maintained in communication, and the end of the pumping pipe (20) is connected to the feed port of the second pumping pump (19); a first shunt pipe (21) connected to the discharge port of the second pumping pump (19), and the end of the first shunt pipe (21) is connected to the side of the first frame (18) and maintained in communication, so that the second pumping pump (19) can transport the copper plating solution to the first frame (18) through the first shunt pipe (21); a cleaning component is arranged on the third box (3) and is used to clean the circuit board after the copper plating treatment.

4. A circuit board chemical metal deposition device according to claim 3, characterized in that: The cleaning assembly comprises: a second square frame (22), which is provided with two groups, the two groups of the second square frames (22) are connected to the inner wall of the third box body (3) at intervals, and the two groups of the second square frames (22) are arranged in an up-and-down staggered manner in the horizontal direction; a water pump (23), which is installed at intervals on the side of the third box body (3); a water suction pipe (24), which is connected to the side of the third box body (3) at intervals and remains in communication, and the end of the water suction pipe (24) is in communication with the water inlet of the water pump (23); a second diverter pipe (25), which is connected to the water outlet of the water pump (23), and the end of the second diverter pipe (25) is connected to the second square frame (22) and remains in communication, so that the water pump (23) can transport clean water to the second square frame (22) through the second diverter pipe (25).

5. A circuit board chemical metal deposition device according to claim 4, characterized in that: Also includes: A hollow plate (31) is connected to the side of the sliding frame (6); a third material pump (32) is installed on the side of the hollow plate (31), and the discharge port of the third material pump (32) is connected to the inside of the hollow plate (31); a connecting pipe (33) has two ends respectively connected to the rear side of the material delivery pipe (10) and the feed port of the third material pump (32) and maintained in communication; two fixed plates (34) are provided and are respectively connected to the upper and lower hollow plates (31). 1) on the sides close to each other, and a liquid supply channel (3401) communicating with the inside of the hollow plate (31) is opened inside the fixed plate (34); two rubber wiping strips (35) are provided and are respectively connected to the sides close to each other of the two fixed plates (34), and the sides of the rubber wiping strips (35) are also provided with protrusions (3501) for cleaning dust on the surface of the circuit board, and the sides close to each other of the two rubber wiping strips (35) are separated by dirt collecting grooves (3502).

6. A circuit board chemical metal deposition device according to claim 5, characterized in that: Also includes: The wind knives (36) are symmetrically installed in the first box body (1), the second box body (2) and the third box body (3) respectively.

7. A circuit board chemical metal deposition device according to claim 6, characterized in that: Also includes: A base (37) is connected to the side of the third box body (3); a linear motor (38) is installed on the top of the base (37); a support seat (39) is connected to the mover of the linear motor (38); a material storage frame (40) is placed on the top of the support seat (39); a support rod (41) is connected to the inside of the material storage frame (40) at intervals; and a second roller (42) is rotatably connected to the support rod (41) at intervals.

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