Electroplating device

Abstract

The electroplating device comprises an electrode tank, an electroplating cavity, a liquid inlet pipe and a liquid outlet pipe, the electrode tank and the electroplating cavity are communicated through the liquid inlet pipe and the liquid outlet pipe, the electroplating cavity comprises an outer cavity body and an inner cavity body arranged in the outer cavity body, the outer cavity body is provided with an outer cavity body liquid outlet, and the inner cavity body is provided with an inner cavity body liquid outlet. A liquid inlet communicated with the inner cavity is formed in the liquid inlet pipe, and in the horizontal direction, the path distance from the liquid inlet to the liquid outlet of the outer cavity through the liquid outlet of the inner cavity is larger than the linear distance between the liquid inlet and the liquid outlet of the outer cavity. According to the electroplating device, the flow of the electroplating liquid in the electroplating cavity can be increased, time is provided for rising and discharging of bubbles in the electroplating liquid, and therefore the electroplating quality is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to an electroplating device. Background Art

[0002] With the continuous development of integrated circuit (IC) and micro-electro-mechanical system (MEMS) technology, through-silicon via (TSV) technology has emerged. Through-silicon via technology is a method of forming a vertical through-silicon via that penetrates the silicon substrate and plating a conductive medium in the vertical through-silicon via to form electrical conduction. By interconnecting through holes in the vertical direction, the length of the connection can be shortened to the same as the thickness of the chip. In this way, on the one hand, the signal transmission path is shortened, and on the other hand, the area of ​​the interconnection structure on the chip is reduced, reducing the package size.

[0003] However, in the process of plating conductive media, bubbles may appear in the plating solution due to problems such as unclean substrate treatment and excessive pickling concentration, resulting in electroplating cavitation on the coating, causing poor coating adhesion or even falling off. Summary of the invention

[0004] The embodiments of the present application provide an electroplating chamber, which can reduce bubbles in the electroplating solution to a certain extent.

[0005] The present application provides an electroplating device, comprising: an electrode slot, an electroplating chamber, and a liquid inlet pipe and a liquid outlet pipe connecting the electrode slot and the electroplating chamber, the electroplating chamber comprising an outer cavity and an inner cavity arranged in the outer cavity, the outer cavity has an outer cavity liquid outlet, the inner cavity has an inner cavity liquid outlet, the liquid inlet pipe has a liquid inlet connected to the inner cavity, and in the horizontal direction, the path distance from the liquid inlet through the inner cavity liquid outlet to the outer cavity liquid outlet is greater than the straight-line distance between the liquid inlet and the outer cavity liquid outlet.

[0006] Specifically, the straight-line distance between the inner cavity liquid outlet and the outer cavity liquid outlet is greater than or equal to the straight-line distance between the liquid inlet and the outer cavity liquid outlet.

[0007] Specifically, the height of the liquid inlet is higher than the liquid outlet of the outer cavity.

[0008] Specifically, the liquid outlet of the outer cavity is opened at the bottom of the outer cavity.

[0009] Specifically, the liquid inlet is located in the inner cavity near the top of the inner cavity.

[0010] Specifically, the liquid inlet is arranged in the inner cavity, close to the inner wall of the inner cavity.

[0011] Specifically, a cooling pipe is arranged around the inner wall of the outer cavity.

[0012] Specifically, the inner cavity is arranged close to the inner wall of the outer cavity.

[0013] The electroplating device of the present application, due to the setting of the inner cavity, makes the plating liquid first flow from the liquid inlet to the inner cavity liquid outlet, and then flow from the inner cavity liquid outlet to the outer cavity liquid outlet. Compared with the electroplating liquid directly flowing from the liquid inlet to the outer cavity liquid outlet, the flow of the electroplating liquid in the electroplating chamber is lengthened, providing time for the bubbles to float up and discharge, thereby reducing the bubbles in the plating liquid in the plating chamber, thereby reducing the bubbles in the plating liquid in the plating tank, so as to reduce the cavitation of the coating.

[0014] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0015] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0017] Figure 1 A schematic top view of the electroplating chamber structure according to an embodiment of the present application is shown;

[0018] Figure 2 A schematic diagram of the electroplating chamber structure according to an embodiment of the present application is shown;

[0019] Figure 3 A schematic top view of the electroplating chamber structure according to an embodiment of the present application is shown;

[0020] Figure 4 A schematic top view of the electroplating chamber structure according to an embodiment of the present application is shown;

[0021] Figure 5 A schematic top view of an electroplating chamber structure according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0022] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0023] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the present application.

[0024] Please refer to Figures 1 to 5 This embodiment provides an electroplating device, which prolongs the flow distance of the electroplating solution in the electroplating chamber to provide more time for the bubbles to float up and be discharged, thereby reducing the bubbles in the electroplating solution to a certain extent.

[0025] The electroplating device includes an electrode tank containing electroplating solution and an electroplating chamber connected to the electrode tank. The substrate is immersed in the electrode tank. The electroplating solution in the electrode tank is energized to deposit on the substrate to form a coating. The substrate can also be replaced by a chip or other device that needs electroplating.

[0026] like Figure 1 As shown, the electroplating chamber includes an outer cavity 1 and an inner cavity 2 arranged in the outer cavity 1. An outer cavity liquid outlet 11 is provided on the outer cavity 1, and an outlet pipe 4 is externally connected to the outer cavity liquid outlet 11, and the outlet pipe 4 connects the electrode tank and the outer cavity 1. The inlet pipe 3 connects the electrode tank and the inner cavity 2, and an inner cavity liquid outlet 21 is provided on the inner cavity 2. The inlet pipe 3 guides the electroplating liquid into the inner cavity 2, and then flows from the inner cavity liquid outlet 21 to the outer cavity 1. The inlet pipe 3, the inner cavity liquid outlet 21 and the outlet pipe 4 allow the electroplating liquid to circulate continuously between the electrode tank, the outer cavity 1 and the inner cavity 2, so that the electroplating liquid is fully mixed with the additives placed in the outer cavity 1 and / or the inner cavity 2 in advance, thereby improving the quality of electroplating.

[0027] like Figure 2As shown, the end of the liquid inlet pipe 3 connected to the inner cavity 2 is provided with a liquid inlet 31, the liquid inlet pipe 3 extends into the inner cavity 2, and the liquid inlet 31 is arranged in the inner cavity 2. The path distance from the liquid inlet 31 to the outer cavity liquid outlet 11 through the inner cavity liquid outlet 21 is greater than the straight-line distance between the liquid inlet 31 and the outer cavity liquid outlet 11. The arrangement of the inner cavity 2 allows the electroplating liquid to first flow from the liquid inlet 31 to the inner cavity liquid outlet 21, and then flow from the inner cavity liquid outlet 21 to the outer cavity liquid outlet 11. Compared with the electroplating liquid flowing directly from the liquid inlet 31 to the outer cavity liquid outlet 11, this embodiment lengthens the process of the electroplating liquid in the electroplating chamber, provides time for the bubbles to float and discharge, and then reduces the bubbles in the electroplating liquid in the electroplating chamber, thereby reducing the bubbles in the electroplating liquid in the electroplating tank, so as to reduce the cavitation of the coating. When the plating solution enters the plating chamber, it first enters the inner cavity 2, and a circulation can be formed in the inner cavity 2, so that the plating solution is fully mixed with the additive placed in the inner cavity 2. The circulation of the plating solution in the inner cavity 2 can also increase the flow time of the plating solution, thereby reducing the bubbles in the plating solution. Furthermore, the inner cavity liquid outlet 21 is arranged away from the liquid inlet 31 and the outer cavity liquid outlet 11, which can further lengthen the flow of the plating solution in the plating chamber.

[0028] In one implementation of the present application, Figure 2 As shown, the liquid inlet 31 can be extended from the end of the liquid inlet pipe 3 to the side wall of the liquid inlet pipe 3 to further increase the size of the liquid inlet 31.

[0029] In other implementations of the embodiments of the present application, the top of the inner cavity 2 may be open, and the liquid inlet pipe 3 may be disposed at the top of the inner cavity 2 .

[0030] The straight-line distance between the inner cavity liquid outlet 21 and the outer cavity liquid outlet 11 is greater than or equal to the straight-line distance between the liquid inlet 31 and the outer cavity liquid outlet 11, that is, the inner cavity liquid outlet 21 is arranged on the side wall of the inner cavity 2 outside the circle with the straight-line distance between the liquid inlet 31 and the outer cavity liquid outlet 11 as the radius, thereby further increasing the flow of the electroplating solution.

[0031] In one implementation of the present application, continue to refer to Figure 1, the outer cavity liquid outlet 11 is arranged on one side of the outer cavity 1, and the liquid inlet 31 is arranged on the side of the inner cavity 2 close to the outer cavity liquid outlet 11, then the inner cavity liquid outlet 21 is arranged on the side wall outside the set range in the side wall of the inner cavity 2, wherein the set range is a circle with the outer cavity liquid outlet 11 as the center and the straight-line distance between the liquid inlet 31 and the outer cavity liquid outlet 11 as the radius. Preferably, the inner cavity liquid outlet 21 is arranged on the side away from the liquid inlet 31 outside the set range, so that the electroplating liquid can reach the outer cavity liquid outlet 11 only after circling the outer wall of the inner cavity 2 for half a circle in the process from the inner cavity liquid outlet 21 to the outer cavity liquid outlet 11, thereby lengthening the flow of the electroplating liquid in the electroplating chamber. The liquid inlet 31 arranged near the side wall of the inner cavity 2 can make the plating solution flow along the side wall, and the inner cavity liquid outlet 21 is arranged away from the liquid inlet 31, which can further reduce bubbles and make it easier for the plating solution to circulate in the inner cavity 2.

[0032] In one embodiment of the present application, the outer cavity liquid outlet 11 is arranged on one side of the outer cavity 1, and the liquid inlet 31 is arranged on the side of the inner cavity 2 away from the outer cavity liquid outlet 11, so that the electroplating solution can have a longer flow time in the electroplating chamber. The inner cavity liquid outlet 21 is arranged outside the set range in the side wall of the inner cavity 2, wherein the set range is a circle with the outer cavity liquid outlet 11 as the center and the straight-line distance between the liquid inlet 31 and the outer cavity liquid outlet 11 as the radius, which can lengthen the flow of the electroplating solution in the electroplating chamber.

[0033] In one implementation of the present application, Figure 3 As shown, the outer cavity 1 has multiple side walls, and the outer cavity liquid outlet 11 can be set near the corner surrounded by two adjacent side walls. The inner cavity 2 is a cube, for example, it can be a cuboid, and the inner cavity 2 includes multiple corners, the multiple corners include a first corner, a second corner, and other corners except the first corner and the second corner. The distance between the first corner (the upper left corner in the figure) and the outer cavity liquid outlet 11 is smaller than the second corner and other corners, and the distance between the second corner (the lower right corner in the figure) and the outer cavity liquid outlet 11 is greater than the first corner and other corners. Then the liquid inlet 31 can be set at the second corner or other corners, preferably at the second corner, which can increase the flow of the electroplating solution. Furthermore, the inner cavity liquid outlet 21 is set away from the side walls surrounding the outer cavity liquid outlet 11 and the liquid inlet 31, which can further lengthen the flow of the electroplating solution in the electroplating chamber.

[0034] In one implementation of the present application, Figure 4 And refer to Figure 2As shown, the liquid inlet 31 can be set at the first corner, and the inner cavity liquid outlet 21 can be set at the second corner or other corners, preferably at the second corner, so as to further lengthen the process of the electroplating solution. In other embodiments of the present application, when the outer cavity liquid outlet 11 is set close to a corner of the outer cavity 1, the liquid inlet 31 can be set only close to one side wall of the outer cavity 1, and the inner cavity liquid outlet 21 can also be set only close to one side wall of the inner cavity 2.

[0035] In one implementation of the present application, refer again to Figure 2 , the height of the liquid inlet 31 is higher than the outer cavity liquid outlet 11, so that the liquid inlet 31 is spaced apart from the outer cavity liquid outlet 11 in the height direction, thereby lengthening the flow of the electroplating solution in the height direction and further reducing bubbles. Furthermore, the outer cavity liquid outlet 11 is arranged at the bottom of the outer cavity 1, and may be arranged at the bottom of the side wall of the outer cavity 1 or located on one side of the bottom of the outer cavity 1, which is conducive to the electroplating solution flowing out of the outer cavity 1. An outer cavity opening and an outer cavity cover for opening or closing the outer cavity opening are provided at the top of the outer cavity 1, the top wall of the inner cavity 2 is open, and the liquid inlet pipe 3 enters the inner cavity 2 from the outer cavity opening and the inner cavity opening, and the liquid inlet 31 is arranged at a position of the inner cavity 2 close to the inner cavity opening, and the height of the liquid inlet 31 is higher than the inner cavity liquid outlet 21. For example, the inner cavity liquid outlet 21 can be set at the bottom of the inner cavity 2, and the height of the inner cavity liquid outlet 21 is higher than the outer cavity liquid outlet 11, which can further increase the plating liquid flow in the height direction and facilitate the plating liquid to flow from the inner cavity 2 to the outer cavity 1. Furthermore, the inner cavity 2 is set in the outer cavity 1 near the top of the outer cavity 1, which can further increase the plating liquid flow in the height direction.

[0036] Specifically, the bottom wall of the inner cavity 2 can be fixed to the bottom wall of the outer cavity 1 by a bracket 5, and the bracket 5 is arranged between the bottom wall of the inner cavity 2 and the bottom wall of the outer cavity 1, and the bracket 5 supports the bottom wall of the inner cavity 2 away from the bottom wall of the outer cavity 1, so that the bottom wall of the inner cavity 2 is higher than the bottom wall of the outer cavity 1. In other implementations of the embodiments of the present application, the side wall of the inner cavity 2 can be fixed at a position where the side wall of the outer cavity 1 is away from the bottom wall of the outer cavity 1.

[0037] In other embodiments of the present application, the electroplating device further provides a cooling pipe 6 around the inner wall of the outer cavity 1. There may be multiple cooling pipes 6, which can disturb the plating solution in the electroplating cavity to further increase the flow time and mixing uniformity of the plating solution.

[0038] like Figure 5As shown, the inner cavity 2 can be arranged close to the inner wall of the outer cavity 1, so that the electroplating liquid can more fully contact the cooling tube 6 in the process of the electroplating liquid flowing from the inner cavity outlet 21 around the outer wall of the inner cavity 2 to the outer cavity outlet 11. Further, the size of the inner cavity 2 can be close to the size of the outer cavity 1, and the volume of the inner cavity 2 becomes larger, which can increase the flow of the electroplating liquid in the process of the electroplating liquid flowing from the inner cavity outlet 21 through the outer wall of the inner cavity 2 to the outer cavity outlet 11, and can also make the cooling tube 6 better disturb the electroplating liquid, thereby further reducing bubbles and increasing the uniformity of cooling.

[0039] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application.

[0040] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An electroplating device, characterized in that: It includes an electrode groove, an electroplating cavity, and a liquid inlet pipe and a liquid outlet pipe which connect the electrode groove and the electroplating cavity. The electroplating cavity includes an outer cavity and an inner cavity arranged in the outer cavity. The outer cavity is provided with an outer cavity liquid outlet, the inner cavity is provided with an inner cavity liquid outlet, and the liquid inlet pipe is provided with a liquid inlet connected with the inner cavity. In the horizontal direction, the path distance from the liquid inlet through the inner cavity liquid outlet to the outer cavity liquid outlet is greater than the straight-line distance between the liquid inlet and the outer cavity liquid outlet.

2. The electroplating device according to claim 1, characterized in that: The straight-line distance between the inner cavity liquid outlet and the outer cavity liquid outlet is greater than or equal to the straight-line distance between the liquid inlet and the outer cavity liquid outlet.

3. The electroplating device according to claim 1, characterized in that: The height of the liquid inlet is higher than the liquid outlet of the outer cavity.

4. The electroplating device according to claim 3, characterized in that: The liquid outlet of the outer cavity is arranged at the bottom of the outer cavity.

5. The electroplating device according to claim 4, characterized in that: The liquid inlet is located in the inner cavity near the top of the inner cavity.

6. The electroplating device according to claim 1, characterized in that: The liquid inlet is arranged in the inner cavity, close to the inner wall of the inner cavity.

7. The electroplating device according to claim 1, characterized in that: A cooling pipe is arranged around the inner wall of the outer cavity.

8. The electroplating device according to claim 7, characterized in that: The inner cavity is arranged close to the inner wall of the outer cavity.

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