Water temperature estimation method and device, electronic equipment, storage medium and vehicle

Abstract

The invention discloses a water temperature estimation method and device, electronic equipment, a storage medium and a vehicle. The method comprises the following steps: acquiring heating electric power of an electronic device and circuit board temperature of a temperature measuring point on a circuit board; according to a preset heat dissipating capacity distribution proportion and the heating electric power, calculating a first heat dissipating capacity of the electronic device for dissipating heat to a radiator connected with the electronic device and a second heat dissipating capacity of the electronic device for dissipating heat to a circuit board; calculating the temperature of the electronic device based on the second heat dissipating capacity and the temperature of the circuit board; according to the temperature of the electronic device and the first heat dissipating capacity, the average heat exchange water temperature in the radiator is calculated on the basis of first thermal resistance between the electronic device and water in the radiator; and according to the average heat exchange water temperature, the water temperature of the end of the pipeline of the radiator is estimated under the condition that the temperature distribution of the heat exchange system is stable. According to the invention, the water temperature of the end part of the pipeline of the radiator can be determined through the temperature of the temperature measuring point on the circuit board, so that the cost is reduced by replacing a water temperature sensor with an algorithm.

Description

Technical Field

[0001] The present invention relates to the technical field of vehicle-related technologies, and in particular to a water temperature estimation method, device, electronic equipment, storage medium and vehicle. Background Art

[0002] When cooling electronic devices, such as chips, in order to monitor the temperature of the electronic devices, electronic device temperature sensors that monitor the temperature of components of the electronic devices are usually set to measure the temperature of the electronic devices. In addition, the electronic devices will be connected to a radiator to conduct heat through water in the radiator to achieve heat dissipation.

[0003] In order to perform temperature control, it is also necessary to monitor the end water temperature in the radiator water circuit, such as monitoring the water temperature at the pipeline outlet and the water temperature at the pipeline inlet. The prior art uses a water temperature sensor to monitor the water temperature in the water circuit.

[0004] Therefore, the existing technology for monitoring the cooling water circuit of the electronic device requires not only a water temperature sensor for monitoring the water temperature, but also an electronic device temperature sensor for monitoring the temperature of the components of the electronic device, which increases the cost. Summary of the invention

[0005] Based on this, it is necessary to provide a water temperature estimation method, device, electronic device, storage medium and vehicle for monitoring the heat dissipation water circuit of electronic devices in response to the technical problem of increased costs caused by the existing technology, which requires both a water temperature sensor to monitor the water temperature and a wall temperature sensor to monitor the temperature of the components of the electronic devices.

[0006] The present invention provides a water temperature estimation method, comprising:

[0007] Acquire the heating power of the electronic device fixed on the circuit board and the circuit board temperature at the temperature measurement point on the circuit board;

[0008] Calculating a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power;

[0009] calculating an electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature;

[0010] According to the temperature of the electronic device and the first heat dissipation, based on the first thermal resistance between the electronic device and the water in the radiator, calculate the average heat exchange water temperature in the radiator, the average heat exchange water temperature being the average value of the heat exchange temperature between the radiator and the electronic device;

[0011] According to the average water temperature of the heat exchange water, the water temperature at the end of the pipe of the radiator under the condition of stable temperature distribution of the heat exchange system is estimated.

[0012] Further, the calculating the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature specifically includes:

[0013] The temperature of the electronic device at the location of the electronic device is calculated based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device.

[0014] Furthermore, the calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device specifically includes:

[0015] Calculating a second thermal resistance between the temperature measurement point and the electronic device according to a ratio of a temperature measurement distance from the temperature measurement point to the middle of the electronic device to a radius of the electronic device;

[0016] The temperature of the electronic component at the location where the electronic component is located is calculated according to the circuit board temperature, the second heat dissipation, and the second thermal resistance.

[0017] Further, the calculating the second thermal resistance between the temperature measurement point and the electronic device according to the ratio of the temperature measurement distance from the temperature measurement point to the middle of the electronic device to the radius of the electronic device specifically includes:

[0018] The second thermal resistance between the temperature measurement point and the electronic device is calculated as:

[0019] Where R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the middle of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

[0020] Further, calculating the temperature of the electronic device at the location of the electronic device according to the circuit board temperature, the second heat dissipation and the second thermal resistance specifically includes:

[0021] Calculate the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

[0022] Furthermore, the calculating, according to the temperature of the electronic device, the first heat dissipation, and the first thermal resistance between the electronic device and the water in the radiator, the average water exchange temperature in the radiator specifically includes:

[0023] Calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink;

[0024] Calculating the convection heat transfer thermal resistance between the radiator and water;

[0025] Calculate the first thermal resistance between the electronic device and the water in the heat sink as the sum of the thermal conduction resistance and the convection resistance;

[0026] The average water exchange temperature in the radiator is calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation.

[0027] Furthermore, the calculating the average water temperature of the heat exchanger in the radiator according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation specifically includes:

[0028] Calculate the average water temperature in the radiator: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0029] Furthermore, the estimating, based on the average water exchange water temperature, the water temperature at the end of the pipe of the radiator under the condition that the temperature distribution of the heat exchange system is stable, specifically includes:

[0030] Calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink;

[0031] Calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance;

[0032] The water temperature at the end of the pipe of the radiator is estimated according to the average water exchange water temperature and the wall temperature.

[0033] Further, the calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance specifically includes:

[0034] The wall temperature of the radiator in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0035] Furthermore, the water temperature at the end of the pipe of the radiator is the water temperature at the pipe inlet, and the estimating the water temperature at the end of the pipe of the radiator according to the average water exchange temperature and the wall temperature specifically includes:

[0036] The estimated water temperature at the pipeline inlet is: Among them, T in is the water temperature at the pipe inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0037] Furthermore, the heat conduction thermal resistance from the electronic device to the heat sink is calculated based on the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer, and specifically includes:

[0038] Calculate the thermal resistance of heat conduction as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers.

[0039] The present invention provides a water temperature estimation device, comprising:

[0040] A parameter acquisition module, used to acquire the heating power of the electronic device fixed on the circuit board and the circuit board temperature of the temperature measurement point on the circuit board;

[0041] an energy distribution calculation module, for calculating a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power;

[0042] an electronic device temperature calculation module, configured to calculate the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature;

[0043] an average heat exchange water temperature calculation module, configured to calculate an average heat exchange water temperature in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and the water in the radiator, wherein the average heat exchange water temperature is an average value of the heat exchange temperatures between the radiator and the electronic device;

[0044] The water temperature calculation module is used to estimate the water temperature at the end of the pipe of the radiator under the condition that the temperature distribution of the heat exchange system is stable according to the average water exchange water temperature.

[0045] The present invention provides an electronic device, comprising:

[0046] at least one processor; and,

[0047] a memory communicatively connected to at least one of the processors; wherein,

[0048] The memory stores instructions that can be executed by at least one of the processors. The instructions are executed by at least one of the processors to enable the at least one of the processors to perform the water temperature estimation method as described above.

[0049] The present invention provides a storage medium, wherein the storage medium stores computer instructions. When a computer executes the computer instructions, the storage medium is used to execute all steps of the water temperature estimation method as described above.

[0050] The present invention provides a vehicle, comprising the water temperature estimation device as described above, or the electronic device as described above.

[0051] The present invention calculates the first heat dissipation of the electronic device to the radiator connected to the electronic device and the second heat dissipation of the electronic device to the circuit board based on the preset heat dissipation distribution ratio through the heat generation electric power of the electronic device, and calculates the temperature of the electronic device based on the second heat dissipation and the circuit board temperature, thereby calculating the average water exchange temperature in the radiator based on the electronic device temperature and the first heat dissipation, and estimating the water temperature at the end of the pipe in the radiator based on the average water exchange temperature under the condition that the temperature distribution of the heat exchange system is stable. The present invention takes into account that the temperature distribution of the entire heat exchange system is stable during the process of the electronic device dissipating heat through the radiator, so that the water temperature at the end of the pipe of the radiator can be determined by the temperature of the temperature measurement point on the circuit board, thereby replacing the water temperature sensor with an algorithm to reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 This is a working flow chart of a water temperature estimation method according to an embodiment of the present invention;

[0053] Figure 2 This is a working flow chart of a water temperature estimation method according to another embodiment of the present invention;

[0054] Figure 3 A schematic diagram of a heat conduction model according to an embodiment of the present invention;

[0055] Figure 4 This is a schematic diagram of building a waterway flow model according to an example of the present invention;

[0056] Figure 5 A schematic diagram of the calculation effect of an example of the present invention;

[0057] Figure 6 A schematic diagram of a water temperature estimation device according to an embodiment of the present invention;

[0058] Figure 7 The figure is a schematic diagram of the hardware structure of an electronic device of the present invention. DETAILED DESCRIPTION

[0059] The specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. The same components are represented by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the accompanying drawings, and the words "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0060] like Figure 1 The figure shows a working flow chart of a water temperature estimation method according to an embodiment of the present invention, comprising:

[0061] Step S101, obtaining the heating power of the electronic device fixed on the circuit board and the circuit board temperature of the temperature measurement point on the circuit board;

[0062] Step S102, calculating a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power;

[0063] Step S103, calculating the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature;

[0064] Step S104, calculating an average heat exchange water temperature in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and water in the radiator, wherein the average heat exchange water temperature is an average value of heat exchange temperatures between the radiator and the electronic device;

[0065] Step S105, estimating the water temperature at the end of the pipe of the radiator under the condition of stable temperature distribution of the heat exchange system according to the average water exchange temperature.

[0066] Specifically, the present invention can be applied to electronic devices with processing capabilities, such as an electronic control unit (ECU) or an extended domain control unit (XCU) of a vehicle.

[0067] Specifically, first, the electronic device executes step S101 to obtain the heating power of the electronic device and the temperature of the circuit board.

[0068] In some embodiments, the electronic device is a chip.

[0069] like Figure 3 The figure shows a schematic diagram of a heat conduction model of an embodiment of the present invention, including an electronic device 1, a circuit board 2 and a heat sink 3. The heat source is the heat generation power of the electronic device 1. Since no work is required to be done externally, it can be considered that the power of the electronic device 1 is completely converted into heat. The circuit board 2 (Printed Circuit Board, PCB) is connected to the electronic device 1. Since the thermal conductivity of the circuit board is very poor, the heat dissipation Q to the environment is 环 The heat generated by the electronic device 1 is transferred through the circuit board 2 and the contacting heat sink 3, and the heat sink 3 is preferably a heat dissipation aluminum plate. Among them, the heat dissipated through the heat sink 3 accounts for more than 90% of the total amount. The electronic device 1 is connected to the heat sink 3 through the heat conduction structure 4. The heat dissipated by the electronic device 1 to the water through the heat sink 3 is Q 水 .

[0070] A sensor may be provided at the temperature measurement point 21 of the circuit board 2, and the temperature acquired by the sensor is used as the circuit board temperature. The distance from the sensor measurement point 21 to the center of the electronic device 1 is the temperature measurement distance L2.

[0071] Then, step S102 is performed to calculate a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power.

[0072] The heat dissipation distribution ratio refers to the ratio of the heat dissipated by the electronic device to the circuit board and the heat sink. Specifically, since the electronic device is fixed on the circuit board, in addition to being dissipated through the heat sink, part of the heat generated by the electronic device will be dissipated through the circuit board. Since the circuit board is usually a PCB circuit board, its thermal conductivity is very poor, so the heat dissipation of the circuit board to the environment can be ignored. In some embodiments, the heat dissipation of the electronic device to the circuit board and the heat dissipation to the heat sink can be measured by pre-collecting multiple groups of samples, so as to calculate the heat dissipation ratio.

[0073] Specifically, the preset heat dissipation distribution ratio can be set as k, and the heat dissipation per unit time Q of the electronic device can be calculated based on the heat generation power as the product of the heat generation power and the unit time. Then the heat dissipation per unit time of the electronic device can be decomposed into a first heat dissipation Q1 through the radiator and a second heat dissipation Q2 through the circuit board. The radiator is preferably an aluminum plate.

[0074] Then, step S103 is performed to calculate the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature.

[0075] Specifically, the second heat dissipation is the heat dissipated from the electronic device to the circuit board. Therefore, the temperature of the electronic device is inferred based on the circuit board temperature and the second heat dissipation as the temperature of the electronic device.

[0076] Afterwards, step S104 is executed to calculate the average water exchange temperature in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and the water in the radiator.

[0077] Specifically, Figure 3 As shown, the first thermal resistance is the thermal conduction resistance R from the electronic device 1 to the heat sink 3 1,cond Convective heat transfer resistance R between radiator 3 and water 1,conv sum.

[0078] Then, according to the first heat dissipation calculated in step S102 and the temperature of the electronic device calculated in step S103 , the average water exchange temperature in the radiator 3 is calculated based on the first thermal resistance.

[0079] Finally, step S105 is executed to estimate the water temperature at the end of the pipe of the radiator under the condition that the temperature distribution of the heat exchange system is stable according to the average water exchange water temperature.

[0080] Specifically, the water temperature calculated based on step S104 can be understood as the average heat exchange water temperature, which is the average value of the heat exchange temperature between the radiator and the electronic device. Since the water in the radiator flows in from the pipeline inlet, exchanges heat with the electronic device, and then flows out from the pipeline outlet, the water temperature at the end of the pipeline in the radiator is different from the average heat exchange water temperature. In order to obtain the water temperature at the end of the pipeline, the wall temperature of the radiator tube wall in contact with the water can be calculated based on the average heat exchange water temperature. In the process of electronic devices dissipating heat through the radiator, the temperature distribution of the heat exchange system can be considered to be stable in the entire heat exchange system, that is, the process of electronic devices dissipating heat through the radiator is steady-state heat exchange. Steady-state heat exchange means that the temperature distribution of the entire heat exchange system, including the electronic components as heat sources and the heat transfer elements for heat dissipation, does not change, wherein the temperature distribution does not change means that the temperature of each point does not change or changes very slightly. Under uniform wall temperature conditions, based on the wall temperature, the relationship between the average heat exchange water temperature and the water temperature at the end of the pipeline in the radiator can be obtained. Thus, the water temperature at the end of the pipeline in the radiator is estimated based on the average heat exchange water temperature.

[0081] In some embodiments, the water temperature at the end of the pipeline is the water temperature at the pipeline inlet or the water temperature at the pipeline outlet.

[0082] The present invention calculates the first heat dissipation of the electronic device to the radiator connected to the electronic device and the second heat dissipation of the electronic device to the circuit board based on the preset heat dissipation distribution ratio through the heat generation electric power of the electronic device, and calculates the temperature of the electronic device based on the second heat dissipation and the circuit board temperature, thereby calculating the average water exchange temperature in the radiator based on the electronic device temperature and the first heat dissipation, and estimating the water temperature at the end of the pipe in the radiator based on the average water exchange temperature under the condition that the temperature distribution of the heat exchange system is stable. The present invention takes into account that the temperature distribution of the entire heat exchange system is stable during the process of the electronic device dissipating heat through the radiator, so that the water temperature at the end of the pipe of the radiator can be determined by the temperature of the temperature measurement point on the circuit board, thereby replacing the water temperature sensor with an algorithm to reduce costs.

[0083] like Figure 2 The flowchart of a water temperature estimation method in another embodiment of the present invention is shown, comprising:

[0084] Step S201, obtaining the heat generation electric power of the electronic device fixed on the circuit board and the circuit board temperature of the temperature measurement point on the circuit board.

[0085] Step S202, calculating a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power.

[0086] Step S203 , calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device.

[0087] In one embodiment, the calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device specifically includes:

[0088] Calculating a second thermal resistance between the temperature measurement point and the electronic device according to a ratio of a temperature measurement distance from the temperature measurement point to the middle of the electronic device to a radius of the electronic device;

[0089] The temperature of the electronic component at the location where the electronic component is located is calculated according to the circuit board temperature, the second heat dissipation, and the second thermal resistance.

[0090] In one embodiment, calculating the second thermal resistance between the temperature measurement point and the electronic device according to the ratio of the temperature measurement distance from the temperature measurement point to the middle of the electronic device to the radius of the electronic device specifically includes:

[0091] The second thermal resistance between the temperature measurement point and the electronic device is calculated as:

[0092] Where R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the middle of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

[0093] In one embodiment, calculating the temperature of the electronic device at the location of the electronic device according to the circuit board temperature, the second heat dissipation and the second thermal resistance specifically includes:

[0094] Calculate the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

[0095] Step S204, calculating an average heat exchange water temperature in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and the water in the radiator, wherein the average heat exchange water temperature is an average value of the heat exchange temperatures between the radiator and the electronic device.

[0096] In one embodiment, the calculating the average water temperature of the heat exchanger in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and water in the radiator specifically includes:

[0097] Calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink;

[0098] Calculating the convection heat transfer thermal resistance between the radiator and water;

[0099] Calculate the first thermal resistance between the electronic device and the water in the heat sink as the sum of the thermal conduction resistance and the convection resistance;

[0100] The average water exchange temperature in the radiator is calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation.

[0101] In one embodiment, calculating the average water temperature of the heat exchanger in the radiator according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation specifically includes:

[0102] Calculate the average water temperature in the radiator: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0103] Step S205, calculating the thermal conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layer includes multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink.

[0104] Step S206: calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance.

[0105] In one embodiment, calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance specifically includes:

[0106] The wall temperature of the radiator in contact with water is calculated as: T wall =Te -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0107] Step S207, estimating the water temperature at the end of the pipe of the radiator according to the average water exchange temperature and the wall temperature.

[0108] In one embodiment, the water temperature at the end of the pipe of the radiator is the water temperature at the pipe inlet, and estimating the water temperature at the end of the pipe of the radiator according to the average water exchange water temperature and the wall temperature specifically includes:

[0109] The estimated water temperature at the pipeline inlet is: Among them, T in is the water temperature at the pipe inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0110] Specifically, step S201 is first performed to obtain the heating power of the electronic device and the temperature of the circuit board.

[0111] Then, step S202 is executed to calculate a first heat dissipation of the electronic device to a heat sink connected to the electronic device and a second heat dissipation of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power.

[0112] Specifically, the preset heat dissipation distribution ratio is set to k, and the heat dissipation per unit time Q of the electronic device can be calculated based on the heat generation power as the product of the heat generation power and the unit time. Then the heat dissipation per unit time of the electronic device can be decomposed into a first heat dissipation Q1 through the radiator and a second heat dissipation Q2 through the circuit board. The radiator is preferably an aluminum plate.

[0113] The first heat dissipation Q1 and the second heat dissipation Q2 are respectively:

[0114] Q1=(1-k)Q (1)

[0115] Q2=kQ (2)

[0116] After determining the first heat dissipation and the second heat dissipation, step S203 is performed to calculate the electronic device temperature at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device.

[0117] The second thermal resistance is the thermal resistance from the temperature measurement point to the center of the electronic device. The temperature measurement point is used to place the sensor. Since the sensor is generally not set at the center of the electronic device, the temperature detected by the sensor at the temperature measurement point is not the center temperature of the electronic device, but the temperature after a certain amount of heat dissipation. Therefore, it is necessary to calculate the accurate temperature of the electronic device based on the second thermal resistance.

[0118] Assuming that the temperature distribution from the center of the electronic device to the circuit board conforms to a circular distribution in a steady state, the second thermal resistance between the temperature measurement point and the electronic device can be calculated based on the ratio of the temperature measurement distance from the temperature measurement point to the middle of the electronic device to the radius of the electronic device.

[0119] In one embodiment, the calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device specifically includes:

[0120] Calculating a second thermal resistance between the temperature measurement point and the electronic device according to a ratio of a temperature measurement distance from the temperature measurement point to the middle of the electronic device to a radius of the electronic device;

[0121] The temperature of the electronic component at the location where the electronic component is located is calculated according to the circuit board temperature, the second heat dissipation, and the second thermal resistance.

[0122] This embodiment quickly determines the second thermal resistance by the ratio of the temperature measurement distance to the radius of the electronic device, so that the accurate temperature of the electronic device can be obtained based on the second thermal resistance.

[0123] In one embodiment, calculating the second thermal resistance between the temperature measurement point and the electronic device according to the ratio of the temperature measurement distance from the temperature measurement point to the middle of the electronic device to the radius of the electronic device specifically includes:

[0124] The second thermal resistance between the temperature measurement point and the electronic device is calculated as:

[0125] Where R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the middle of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

[0126] Specifically, assuming that the temperature distribution from the center of the electronic device to the circuit board conforms to the circular distribution in a steady state, the heat dissipation per unit time in the radial direction is:

[0127]

[0128] Where Q is the radial heat dissipation per unit time of the electronic device, that is, the heat generation power of the electronic device. R is the radial distance of the chip, δ is the thickness of the circuit board, λ is the thermal conductivity, A is the heat exchange area, λ PCB is the thermal conductivity of the circuit board. The second thermal resistance from the equivalent radius L1 of the electronic device to the temperature measurement distance L2 can be obtained by integrating formula (3) from L1 to L2, that is:

[0129]

[0130] Wherein, R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the middle of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

[0131] This embodiment provides a calculation formula for the second thermal resistance, and the second thermal resistance is quickly obtained.

[0132] In one embodiment, calculating the temperature of the electronic device at the location of the electronic device according to the circuit board temperature, the second heat dissipation and the second thermal resistance specifically includes:

[0133] Calculate the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

[0134] After determining the second thermal resistance, the temperature of the electronic device in steady state can be calculated by formula 5:

[0135] T e =T2+Q2·R2 (5)

[0136] Among them, T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

[0137] After the temperature of the electronic device is determined, step S204 is executed to calculate the average water exchange temperature in the radiator according to the temperature of the electronic device, the first heat dissipation, and the first thermal resistance between the electronic device and the water in the radiator.

[0138] In one embodiment, the calculating the average water temperature of the heat exchanger in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and water in the radiator specifically includes:

[0139] Calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink;

[0140] Calculating the convection heat transfer thermal resistance between the radiator and water;

[0141] Calculate the first thermal resistance between the electronic device and the water in the heat sink as the sum of the thermal conduction resistance and the convection resistance;

[0142] The average water exchange temperature in the radiator is calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation.

[0143] Specifically, electronic devices generally include multiple structural layers. Taking a chip as an example, the structural layers of a chip generally include: substrate layer, solder layer, substrate layer, heat source layer, active layer, etc. Each structural layer has a structural thickness and area of ​​each layer, and each structural layer has a thermal conductivity coefficient of each layer according to the material of the different layers.

[0144] Therefore, the thermal resistance of heat conduction from the electronic device to the radiator is calculated according to the structural thickness of each layer between the electronic device and the radiator, the thermal conductivity coefficient of each layer and the area of ​​each layer. In addition, the layer between the electronic device and the radiator also includes a heat-conducting structure and a radiator. The heat-conducting structure includes various existing thermally conductive adhesives and thermally conductive parts. Each thermally conductive adhesive or thermally conductive part is regarded as a layer. At the same time, since the radiator is generally a flat plate, the radiator is regarded as a whole layer. By calculating the relevant parameters of each layer between the electronic device and the radiator, the thermal resistance of heat conduction from the electronic device to the radiator is obtained.

[0145] In one embodiment, the heat conduction thermal resistance from the electronic device to the heat sink is calculated based on the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer, and specifically includes:

[0146] Calculate the thermal resistance of heat conduction as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λi is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers.

[0147] Specifically, the thermal conduction resistance is calculated using formula (6):

[0148]

[0149] Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers.

[0150] This embodiment provides a method for calculating the thermal conductivity.

[0151] Then calculate the convective heat transfer thermal resistance between the radiator and water. The convective heat transfer thermal resistance can be calculated based on the water heat exchange area.

[0152] In some embodiments, the convective heat transfer resistance between the radiator and water is calculated as: Among them, R 1,conv is the convection heat transfer thermal resistance, A w is the water heat transfer area, and α is the water heat transfer coefficient.

[0153] Finally, the water temperature in the radiator can be calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation. The water temperature in the radiator calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation is the average water exchange temperature.

[0154] This embodiment calculates the average water exchange temperature in the radiator based on the thermal resistance.

[0155] In one embodiment, calculating the average water temperature of the heat exchanger in the radiator according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation specifically includes:

[0156] Calculate the average water temperature in the radiator: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0157] Specifically, the water temperature is calculated based on the first thermal resistance:

[0158] T w =T e -R1·Q1 (7)

[0159] Where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0160] This embodiment provides a method for calculating the average water exchange temperature.

[0161] Then, step S205 is executed to calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer.

[0162] The method of calculating the thermal resistance of heat conduction is the same as above.

[0163] Then, step 206 is performed to calculate the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance.

[0164] In one embodiment, calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance specifically includes:

[0165] The wall temperature of the radiator in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0166] The first step in calculating the water temperature is to calculate the temperature of the wall in contact with the water:

[0167] T wall =T e -Q1·R 1,cond (8)

[0168] Where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0169] Step S207, estimating the water temperature at the end of the pipe of the radiator according to the average water exchange temperature and the wall temperature.

[0170] In one embodiment, the water temperature at the end of the pipe of the radiator is the water temperature at the pipe inlet, and estimating the water temperature at the end of the pipe of the radiator according to the average water exchange water temperature and the wall temperature specifically includes:

[0171] The estimated water temperature at the pipeline inlet is: Among them, T in is the water temperature at the pipe inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0172] Specifically, under the condition of uniform wall temperature, the steady-state heat transfer in the control volume can be expressed as follows:

[0173]

[0174] Where α is the water heat transfer coefficient, is the water mass flow rate, R is the heat transfer area per unit length, Cp w is the specific heat of water at constant pressure, T0 is the water temperature at position 0, usually the inlet is taken as position 0, T L is the water temperature at position L, dT water is the water temperature difference of the length differential, dx is the length differential, and L is the length of the pipeline. The position from the inlet to the length x is referred to as position x, and the integral from the inlet to position x gives:

[0175]

[0176] Among them, T x is the temperature at position x, T in is the water temperature at the pipeline inlet, that is, the water temperature T0 at position 0.

[0177] Then the temperature at position x is:

[0178]

[0179] The average water exchange temperature can be calculated as:

[0180]

[0181] From formula (12), the water temperature at the pipeline inlet can be obtained:

[0182]

[0183] Among them, T in is the water temperature at the pipe inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0184] After obtaining the pipe inlet water temperature, the pipe outlet water temperature can be calculated according to formula (11). The pipe outlet water temperature T out In fact, it is the temperature T from the inlet to the position with a length of L L , therefore, the water temperature at the pipeline outlet is:

[0185]

[0186] Among them, T out is the water temperature at the pipe outlet.

[0187] In some embodiments, a waterway flow model is constructed through a neural network model to obtain water mass flow.

[0188] The neural network model is established by obtaining physical model data according to experimental data, and then expanded from the physical model data.

[0189] Specifically, the water mass flow rate of the heating element in different states is constant. The heating element is an electronic device that serves as a heat source. Therefore, the existing water flow model building method can be used to build a water flow model, and when the state of the heating element is determined, the corresponding water mass flow rate is obtained. Figure 4 As shown, firstly, the experimental data 401 is acquired, then modeling correction is performed, and the GT Power (engine working process simulation calculation software) model 402 is input, and the mapping database 403 is obtained through DoE, and the ANN flow static model 404 is obtained through feature screening, training, and verification, and the flow dynamic model 405 is obtained through the time constant.

[0190] As an example, the waterway flow model is built as follows:

[0191] 1. Obtain key flow data in the experiment, correct parameters such as pump pressure rise, component pressure drop, and along-the-way loss, build a physical model, and make corrections based on key experimental data.

[0192] 2. Build a physical model based on the experimental data and expand the experimental data. This step can calculate the branch flow that is not measured in the experiment but is relevant to the simulation. Specifically, the physical model is built through GT Power software. Then the database is mapped through the Design of Experiment (DOE). The mapping database can be regarded as a large amount of mapping data corresponding to input and output, and a neural network model can be established.

[0193] 3. Based on the data obtained in step 2, the control quantity in the system is used as the modeling feature, and the feature is expanded according to the physical meaning, as shown in Table 1. The expansion basis can be the order relationship between the pump speed and head, temperature and radiation heat transfer, and the instantaneous energy and cumulative energy entering the system.

[0194]

[0195]

[0196] Feature screening is performed based on the extended features, and the screening method is based on the pan-neural network GRNN with joint probability distribution.

[0197] The screening process is as follows:

[0198] 4.1 Put all the features to be selected into the selected set, and the selected set is an empty set at this time;

[0199] 4.2 Use the features in the candidate set to approximate the output value through GRNN, traverse the features in the candidate set, and select the feature with the minimum mean squared error (MSE) to enter the selected set;

[0200] 4.3 Then enter the iterative process, at this time the fitting target is changed to the remaining information after the output value of the feature fitting in the selected set, and the feature with the smallest MSE is selected to enter the selected set;

[0201] 4.4 Iterate in sequence until all the features in the set to be selected are traversed.

[0202] GRNN is based on probability and can better reflect the one-to-one correspondence between the control quantity as the model input and the state quantity as the model output.

[0203] 5. According to the feature order given by the screening results, the first four features that reduce the GRNN fitting MSE to 0 are selected, which can ensure accuracy and avoid feature redundancy.

[0204] 6. Randomly divide the data obtained in step 2 into training sets and test sets, establish a neural network model based on the screening features, use the K test to obtain the accuracy comparison of the model, and select the best traffic model based on the comprehensive training accuracy and test accuracy, that is, Figure 4 Static model of traffic.

[0205] 7. Build a steady-state heat exchange model of the heat exchange components in the system, for example, using the steady-state heat exchange model of this application, or various steady-state heat exchange models in the prior art, and the heat absorbed under steady-state conditions causes its temperature to change

[0206]

[0207] The heat source is the heat exchange between the heating element and the water flow, so there are:

[0208] Q 吸 =α·dA·(T B -T w )=α·L c ·dx·(T B -T w ) (16)

[0209] Among them Q 吸 is the absorbed heat, C p is the specific heat of cooling water at constant pressure, is the cooling water flow rate, T w is the water temperature, T B is the temperature of the heating element, L C is the characteristic length of the heat exchange component, indicating the heat exchange area per unit length, α is the heat transfer coefficient, dA is the differential of the heat exchange area, and dx is the differential of the heat exchange length. Formula (15) and formula (16) are combined and integrated over the length from the inlet to the outlet of the heat exchange component to obtain

[0210]

[0211] Among them, T w,out is the outlet water temperature, T w,in is the inlet water temperature, and A is the heat exchange area.

[0212] Since the thermal mass of the heat exchange component is relatively large relative to the heat transfer amount within a unit step, it can be considered that the temperature of the heat exchange component remains unchanged within a unit step.

[0213] 8. Fit the heat transfer coefficient according to the mass flow rate to ensure that the heat transfer coefficient in the pipeline is within a reasonable range and the trend is correct.

[0214] 9. Calculate the heat transfer heat Q per unit time step 吸 ,The temperature change of the heat exchange component within the step is calculated by formula (21), and the temperature of the heat exchange element is updated when calculating the next step.

[0215] 10. Identify the characteristic length of the heat exchange element through experimental data, compensate for the lack of flow accuracy, calibrate the flow model, and obtain the following Figure 4 The flow dynamic model shown is a model obtained by adding filtering to the static model of the neural network. According to the flow dynamic model, the water mass flow of cooling water of the heating element, that is, the electronic device, under different conditions can be determined.

[0216] After determining the water mass flow rate, the water heat transfer coefficient can be fitted according to the water mass flow rate or the Reynolds number can be calculated according to the dimensionless method, and then the water heat transfer coefficient can be determined according to the relationship between the Prandtl number and the Nusselt number.

[0217] According to the water mass flow rate, the water heat transfer coefficient can be fitted by a quadratic polynomial, and the formula is as follows:

[0218]

[0219] Where α is the water heat transfer coefficient, is the water mass flow rate, C1, C2, C3 are fitting coefficients, which need to be fitted according to experimental values.

[0220] The dimensionless method involves two flow regimes, laminar and turbulent, which are distinguished by the Reynolds number, which is calculated as:

[0221]

[0222] Nusselt number calculation formula:

[0223]

[0224] In the formula, V is the water flow rate, L is the heat transfer length, v is the dynamic viscosity of water, and λ is the thermal conductivity coefficient. The water heat transfer coefficient can then be calculated as:

[0225]

[0226] In the formula, Pr is the Prandtl number of water, and f(Re,Pr) is the empirical function used to calculate the Nusselt number. Due to the different internal structures of the pipeline, the calculation of Nu in laminar flow, transition state and turbulent flow must be identified based on experimental temperature data.

[0227] In some embodiments, the method further comprises:

[0228] Acquire a plurality of experimental data, wherein the experimental data include measured values ​​of water channel inlet temperatures;

[0229] Estimate the initial value of the Nusselt number according to the empirical function, obtain the initial value of the water heat transfer coefficient according to the initial value of the Nusselt number, and estimate the pipe inlet water temperature of the radiator according to the average water exchange water temperature and the wall temperature. Specifically, calculate the pipe inlet water temperature according to formula (13);

[0230] The Nusselt number and thus the water heat transfer coefficient are adjusted until the estimated pipe inlet water temperature is consistent with the experimental pipe inlet water temperature.

[0231] like Figure 5The figure shows a schematic diagram of the calculation effect of an example of the present invention, including a main circuit test water temperature curve 51 and a water temperature curve 52 predicted by the method of this embodiment. The horizontal axis is time, unit: s, and the vertical axis is temperature, unit: °C. From the effect, it can be seen that the method of this embodiment can make stable predictions for a long time. After randomly selecting 50 vehicles and 300 trips for verification, this modeling method has an average error of less than 3 °C in steady state. Figure 5 The average error shown is 2.43°C.

[0232] This embodiment calculates the temperature of the electronic device at the location of the electronic device through the second thermal resistance between the temperature measurement point and the electronic device, thereby improving the accuracy of the temperature of the electronic device. At the same time, the water temperature calculated based on the first thermal resistance between the electronic device and the water in the radiator according to the temperature of the electronic device and the first heat dissipation is converted into an average water exchange temperature, and the water temperature at the end of the pipeline is calculated based on the average water exchange temperature. This embodiment simplifies the heat transfer model of the electronic device, infers the water temperature at the end of the pipeline through the change in device temperature, reduces the sensor requirements, reduces costs, and has high accuracy.

[0233] Based on the same inventive concept, Figure 6 FIG. 1 is a schematic diagram of a water temperature estimation device according to an embodiment of the present invention, comprising:

[0234] A parameter acquisition module 601 is used to acquire the heating power of the electronic device fixed on the circuit board and the circuit board temperature of the temperature measurement point on the circuit board;

[0235] An energy distribution calculation module 602 is used to calculate a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power;

[0236] An electronic device temperature calculation module 603, configured to calculate the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature;

[0237] an average heat exchange water temperature calculation module 604, configured to calculate an average heat exchange water temperature in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and the water in the radiator, wherein the average heat exchange water temperature is an average value of the heat exchange temperatures between the radiator and the electronic device;

[0238] The water temperature calculation module 605 is used to estimate the water temperature at the end of the pipe of the radiator under the condition that the temperature distribution of the heat exchange system is stable according to the average water temperature of the exchanged water.

[0239] The present invention calculates the first heat dissipation of the electronic device to the radiator connected to the electronic device and the second heat dissipation of the electronic device to the circuit board based on the preset heat dissipation distribution ratio through the heating electric power of the electronic device, and calculates the temperature of the electronic device based on the second heat dissipation and the circuit board temperature, thereby calculating the average water exchange temperature in the radiator based on the electronic device temperature and the first heat dissipation, and estimating the water temperature at the end of the pipe in the radiator based on the average water exchange temperature under the condition that the temperature distribution of the heat exchange system is stable. The present invention can determine the water temperature at the end of the pipe of the radiator through the temperature of the temperature measurement point on the circuit board, thereby replacing the water temperature sensor with an algorithm to reduce costs.

[0240] In one embodiment, calculating the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature specifically includes:

[0241] The temperature of the electronic device at the location of the electronic device is calculated based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device.

[0242] In one embodiment, the calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device specifically includes:

[0243] Calculating a second thermal resistance between the temperature measurement point and the electronic device according to a ratio of a temperature measurement distance from the temperature measurement point to the middle of the electronic device to a radius of the electronic device;

[0244] The temperature of the electronic component at the location where the electronic component is located is calculated according to the circuit board temperature, the second heat dissipation, and the second thermal resistance.

[0245] In one embodiment, calculating the second thermal resistance between the temperature measurement point and the electronic device according to the ratio of the temperature measurement distance from the temperature measurement point to the middle of the electronic device to the radius of the electronic device specifically includes:

[0246] The second thermal resistance between the temperature measurement point and the electronic device is calculated as:

[0247] Where R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the middle of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

[0248] In one embodiment, calculating the temperature of the electronic device at the location of the electronic device according to the circuit board temperature, the second heat dissipation and the second thermal resistance specifically includes:

[0249] Calculate the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

[0250] In one embodiment, the calculating the average water temperature of the heat exchanger in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and water in the radiator specifically includes:

[0251] Calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink;

[0252] Calculating the convection heat transfer thermal resistance between the radiator and water;

[0253] Calculate the first thermal resistance between the electronic device and the water in the heat sink as the sum of the thermal conduction resistance and the convection resistance;

[0254] The average water exchange temperature in the radiator is calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation.

[0255] In one embodiment, calculating the average water temperature of the heat exchanger in the radiator according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation specifically includes:

[0256] Calculate the average water temperature in the radiator: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0257] In one embodiment, estimating the water temperature at the end of the pipe of the radiator under the condition that the temperature distribution of the heat exchange system is stable according to the average water exchange water temperature specifically includes:

[0258] Calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink;

[0259] Calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance;

[0260] The water temperature at the end of the pipe of the radiator is estimated according to the average water exchange water temperature and the wall temperature.

[0261] In one embodiment, calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance specifically includes:

[0262] The wall temperature of the radiator in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0263] In one embodiment, the water temperature at the end of the pipe of the radiator is the water temperature at the pipe inlet, and estimating the water temperature at the end of the pipe of the radiator according to the average water exchange water temperature and the wall temperature specifically includes:

[0264] The estimated water temperature at the pipeline inlet is: Among them, T in is the water temperature at the pipe inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0265] In one embodiment, the heat conduction thermal resistance from the electronic device to the heat sink is calculated based on the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer, and specifically includes:

[0266] Calculate the thermal resistance of heat conduction as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, Ai is the area of ​​the i-th layer, and n is the number of layers.

[0267] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0268] like Figure 7 The figure shows a hardware structure diagram of an electronic device of the present invention, including:

[0269] at least one processor 701; and,

[0270] A memory 702 that is communicatively connected to at least one of the processors 701; wherein,

[0271] The memory 702 stores instructions that can be executed by at least one of the processors. The instructions are executed by at least one of the processors so that the at least one of the processors can execute the water temperature estimation method as described above.

[0272] Figure 7 A processor 701 is taken as an example.

[0273] The electronic device may further include: an input device 703 and a display device 704 .

[0274] The processor 701, the memory 702, the input device 703 and the display device 704 may be connected via a bus or other means, and the figure takes the connection via a bus as an example.

[0275] The memory 702 is a non-volatile computer-readable storage medium that can be used to store non-volatile software programs, non-volatile computer executable programs and modules, such as program instructions / modules corresponding to the water temperature estimation method in the embodiment of the present application, for example, Figure 1 , Figure 2 The processor 701 executes various functional applications and data processing by running the non-volatile software programs, instructions and modules stored in the memory 702, that is, the water temperature estimation method in the above embodiment is implemented.

[0276] The memory 702 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required by at least one function; the data storage area may store data created according to the use of the water temperature estimation method, etc. In addition, the memory 702 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 702 may optionally include a memory remotely arranged relative to the processor 701, and these remote memories may be connected to the device for executing the water temperature estimation method via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0277] The input device 703 can receive user clicks and generate signal inputs related to user settings and function controls of the water temperature estimation method. The display device 704 can include display devices such as a display screen.

[0278] The one or more modules are stored in the memory 702 , and when executed by the one or more processors 701 , the water temperature estimation method in any of the above method embodiments is executed.

[0279] The present invention calculates the first heat dissipation of the electronic device to the radiator connected to the electronic device and the second heat dissipation of the electronic device to the circuit board based on the preset heat dissipation distribution ratio through the heating electric power of the electronic device, and calculates the temperature of the electronic device based on the second heat dissipation and the circuit board temperature, thereby calculating the average water exchange temperature in the radiator based on the electronic device temperature and the first heat dissipation, and estimating the water temperature at the end of the pipe in the radiator based on the average water exchange temperature under the condition that the temperature distribution of the heat exchange system is stable. The present invention can determine the water temperature at the end of the pipe of the radiator through the temperature of the temperature measurement point on the circuit board, thereby replacing the water temperature sensor with an algorithm to reduce costs.

[0280] An embodiment of the present invention provides a storage medium, wherein the storage medium stores computer instructions. When a computer executes the computer instructions, the storage medium is used to execute all steps of the water temperature estimation method as described above.

[0281] In the context of the present disclosure, a storage medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or apparatus. The storage medium may be a machine-readable signal medium or a machine-readable storage medium. Alternatively, the storage medium may be a non-temporary computer-readable storage medium, for example, a non-temporary computer-readable storage medium may be a ROM, a random access memory (Random Access Memory, RAM), a compact disc read-only memory (Compact Disc ROM, CD-ROM), a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0282] An embodiment of the present invention provides a vehicle, including the water temperature estimation device as described above, or the electronic device as described above. It is understandable that the vehicle may also include: a processor, a memory, and a computer program. The computer program is stored in the memory and is configured to be executed by the processor to implement the water temperature estimation method provided in the embodiment of the present disclosure. The processor and the memory are already in Figure 7 The parts described in the illustrated embodiment are not repeated here.

[0283] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A water temperature estimation method, characterized in that: include: Acquire the heating power of the electronic device fixed on the circuit board and the circuit board temperature at the temperature measurement point on the circuit board; Calculating a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power; calculating an electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature; According to the temperature of the electronic device and the first heat dissipation, based on the first thermal resistance between the electronic device and the water in the radiator, calculate the average heat exchange water temperature in the radiator, the average heat exchange water temperature being the average value of the heat exchange temperature between the radiator and the electronic device; The water temperature at the end of the pipe of the radiator under the condition of stable temperature distribution of the heat exchange system is estimated according to the average water exchange water temperature.

2. The water temperature estimation method according to claim 1, characterized in that: The calculating the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature specifically includes: The temperature of the electronic device at the location of the electronic device is calculated based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device.

3. The water temperature estimation method according to claim 2, characterized in that: The calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device specifically includes: Calculating a second thermal resistance between the temperature measurement point and the electronic device according to a ratio of a temperature measurement distance from the temperature measurement point to the middle of the electronic device to a radius of the electronic device; The temperature of the electronic component at the location where the electronic component is located is calculated according to the circuit board temperature, the second heat dissipation, and the second thermal resistance.

4. The water temperature estimation method according to claim 3, characterized in that: Calculating the second thermal resistance between the temperature measurement point and the electronic device according to the ratio of the temperature measurement distance from the temperature measurement point to the middle of the electronic device to the radius of the electronic device specifically includes: The second thermal resistance between the temperature measurement point and the electronic device is calculated as: Where R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the middle of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

5. The water temperature estimation method according to claim 3, characterized in that: Calculating the temperature of the electronic device at the location of the electronic device according to the circuit board temperature, the second heat dissipation, and the second thermal resistance specifically includes: Calculate the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

6. The water temperature estimation method according to claim 1, characterized in that: The calculating, according to the temperature of the electronic device and the first heat dissipation amount, an average water exchange temperature in the radiator based on a first thermal resistance between the electronic device and water in the radiator, specifically includes: Calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink; Calculating the convection heat transfer thermal resistance between the radiator and water; Calculate the first thermal resistance between the electronic device and the water in the heat sink as the sum of the thermal conduction resistance and the convection resistance; The average water exchange temperature in the radiator is calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation.

7. The water temperature estimation method according to claim 6, characterized in that: The calculating the average water temperature of the heat exchanger in the radiator according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation specifically includes: Calculate the average water temperature in the radiator: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

8. The water temperature estimation method according to claim 1, characterized in that: The estimating, based on the average water exchange water temperature, the water temperature at the end of the pipe of the radiator under the condition that the temperature distribution of the heat exchange system is stable specifically includes: Calculate the heat conduction thermal resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat sink through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat sink; Calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance; The water temperature at the end of the pipe of the radiator is estimated according to the average water exchange water temperature and the wall temperature.

9. The water temperature estimation method according to claim 8, characterized in that: The calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance specifically includes: The wall temperature of the radiator in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

10. The water temperature estimation method according to claim 8, characterized in that: The water temperature at the end of the pipe of the radiator is the water temperature at the pipe inlet, and the estimating the water temperature at the end of the pipe of the radiator according to the average water exchange water temperature and the wall temperature specifically includes: The estimated water temperature at the pipeline inlet is: Among them, T in is the water temperature at the pipe inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

11. The water temperature estimation method according to claim 6 or 8, characterized in that: The heat conduction thermal resistance from the electronic device to the heat sink is calculated according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer, specifically including: Calculate the thermal resistance of heat conduction as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers.

12. A water temperature estimation device, characterized in that: include: A parameter acquisition module, used to acquire the heating power of the electronic device fixed on the circuit board and the circuit board temperature of the temperature measurement point on the circuit board; an energy distribution calculation module, for calculating a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation distribution ratio and the heating electric power; an electronic device temperature calculation module, configured to calculate the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature; an average heat exchange water temperature calculation module, configured to calculate an average heat exchange water temperature in the radiator according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and the water in the radiator, wherein the average heat exchange water temperature is an average value of the heat exchange temperatures between the radiator and the electronic device; The water temperature calculation module is used to estimate the water temperature at the end of the pipe of the radiator under the condition that the temperature distribution of the heat exchange system is stable according to the average water exchange water temperature.

13. An electronic device, characterized in that: include: at least one processor; as well as, a memory communicatively connected to at least one of the processors; wherein, The memory stores instructions that can be executed by at least one of the processors, and the instructions are executed by at least one of the processors to enable at least one of the processors to execute the water temperature estimation method according to any one of claims 1 to 11.

14. A storage medium, characterized in that: The storage medium stores computer instructions, and when a computer executes the computer instructions, it is used to execute all steps of the water temperature estimation method according to any one of claims 1 to 11.

15. A vehicle, characterized in that: It includes the water temperature estimation device as claimed in claim 12, or the electronic device as claimed in claim 13.

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