Water temperature estimation method, device, electronic device, storage medium and vehicle

Abstract

The application discloses a water temperature estimation method and device, electronic equipment, a storage medium and a vehicle. The method comprises the following steps: obtaining the heat generation electric power of an electronic device and the circuit board temperature of a temperature measurement point on a circuit board; calculating the first heat dissipation amount of the electronic device to a radiator connected with the electronic device and the second heat dissipation amount of the electronic device to the circuit board according to a preset heat dissipation amount distribution ratio and the heat generation electric power; calculating the temperature of the electronic device based on the second heat dissipation amount and the circuit board temperature; calculating the average heat exchange water temperature in the radiator based on the first thermal resistance between the electronic device and water in the radiator according to the electronic device temperature and the first heat dissipation amount; and estimating the pipe end water temperature of the radiator under the condition that the temperature distribution of a heat exchange system is stable according to the average heat exchange water temperature. The application can determine the pipe end water temperature of the radiator through the temperature of the temperature measurement point on the circuit board, so that the water temperature sensor is replaced by an algorithm, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicles, and particularly relates to a water temperature estimation method and device, electronic equipment, a storage medium and a vehicle. BACKGROUND

[0002] When heat dissipation is performed on an electronic device, such as a chip, in order to monitor the temperature of the electronic device, an electronic device temperature sensor for monitoring the temperature of the electronic device is usually arranged to measure the temperature of the electronic device. In addition, the electronic device is connected to a heat sink, and heat dissipation is achieved through heat conduction of water in the heat sink.

[0003] In order to perform temperature control, the end water temperature in the water circuit of the heat dissipation device also needs to be monitored, such as monitoring the outlet water temperature and the inlet water temperature of the pipeline. The prior art uses a water temperature sensor to monitor the water temperature in the water circuit.

[0004] Therefore, the prior art for monitoring the water circuit of the electronic device heat dissipation device needs both a water temperature sensor for monitoring the water temperature and an electronic device temperature sensor for monitoring the temperature of the electronic device, resulting in increased cost. SUMMARY

[0005] Therefore, it is necessary to provide a water temperature estimation method and device, electronic equipment, a storage medium and a vehicle to solve the technical problem that the prior art for monitoring the water circuit of the electronic device heat dissipation device needs both a water temperature sensor for monitoring the water temperature and an electronic device temperature sensor for monitoring the temperature of the electronic device, resulting in increased cost.

[0006] The present application provides a water temperature estimation method, comprising:

[0007] obtaining the heat generation electric power of an electronic device fixed on a circuit board and the circuit board temperature of a temperature measurement point on the circuit board;

[0008] calculating, according to a preset heat dissipation amount distribution ratio and the heat generation electric power, a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board;

[0009] calculating, based on the second heat dissipation amount and the circuit board temperature, an electronic device temperature of the electronic device;

[0010] calculating, according to the electronic device temperature and the first heat dissipation amount, an average heat exchange water temperature in the heat sink based on a first thermal resistance between the electronic device and water in the heat sink, the average heat exchange water temperature being an average of the heat exchange temperatures of the heat sink and the electronic device;

[0011] According to the average heat exchange water temperature, the water temperature at the pipe end of the radiator under the condition that the temperature distribution of the heat exchange system is stable is estimated.

[0012] Further, the electronic device temperature at the position of the electronic device is calculated based on the second heat dissipation amount and the circuit board temperature, and specifically includes:

[0013] The electronic device temperature at the position of the electronic device is calculated based on the second thermal resistance between the temperature measuring point and the electronic device with the second heat dissipation amount and the circuit board temperature.

[0014] Further, the electronic device temperature at the position of the electronic device is calculated based on the second thermal resistance between the temperature measuring point and the electronic device with the second heat dissipation amount and the circuit board temperature, and specifically includes:

[0015] The second thermal resistance between the temperature measuring point and the electronic device is calculated according to the ratio of the temperature measuring distance between the temperature measuring point and the electronic device to the radius of the electronic device.

[0016] The electronic device temperature at the position of the electronic device is calculated according to the circuit board temperature, the second heat dissipation amount and the second thermal resistance.

[0017] Further, the second thermal resistance between the temperature measuring point and the electronic device is calculated according to the ratio of the temperature measuring distance between the temperature measuring point and the electronic device to the radius of the electronic device, and specifically includes:

[0018] The second thermal resistance between the temperature measuring point and the electronic device is calculated as follows:

[0019] wherein R2 is the second thermal resistance, L2 is the temperature measuring distance between the temperature measuring point and the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, and λ PCB is the thermal conductivity coefficient of the circuit board.

[0020] Further, the electronic device temperature at the position of the electronic device is calculated according to the circuit board temperature, the second heat dissipation amount and the second thermal resistance, and specifically includes:

[0021] The electronic device temperature is calculated as follows: e T = T2 + Q2 · R2, wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance.

[0022] Further, the calculating the average heat exchange water temperature in the heat sink according to the electronic device temperature, the first heat dissipation amount, and the first thermal resistance between the electronic device and water in the heat sink specifically comprises:

[0023] calculating a thermal conduction thermal resistance between the electronic device and the heat sink according to a structure thickness of each layer between the electronic device and the heat sink, a thermal conductivity coefficient of each layer, and an area of each layer, the electronic device being connected to the heat sink through one or more heat conduction structures, the layers including a plurality of structure layers in the electronic device, the one or more heat conduction structures, and the heat sink;

[0024] calculating a convective heat exchange thermal resistance of the heat sink and water heat exchange;

[0025] calculating the first thermal resistance between the electronic device and water in the heat sink as a sum of the thermal conduction thermal resistance and the convective heat exchange thermal resistance;

[0026] calculating the average heat exchange water temperature in the heat sink according to the electronic device temperature, the first thermal resistance, and the first heat dissipation amount.

[0027] Further, the calculating the average heat exchange water temperature in the heat sink according to the electronic device temperature, the first thermal resistance, and the first heat dissipation amount specifically comprises:

[0028] calculating the average heat exchange water temperature in the heat sink as T w = T e - R1·Q1, wherein T w is the average heat exchange water temperature, T e is the electronic device temperature, R1 is the first thermal resistance, and Q1 is the first heat dissipation amount.

[0029] Further, the estimating the water temperature at a pipeline end of the heat sink under a condition that a temperature distribution of the heat exchange system is stable according to the average heat exchange water temperature specifically comprises:

[0030] calculating a thermal conduction thermal resistance between the electronic device and the heat sink according to a structure thickness of each layer between the electronic device and the heat sink, a thermal conductivity coefficient of each layer, and an area of each layer, the electronic device being connected to the heat sink through one or more heat conduction structures, the layers including a plurality of structure layers in the electronic device, the one or more heat conduction structures, and the heat sink;

[0031] calculating a wall temperature of a pipe wall of the heat sink according to the first heat dissipation amount and the thermal conduction thermal resistance;

[0032] estimating the water temperature at the pipeline end of the heat sink according to the average heat exchange water temperature and the wall temperature.

[0033] Furthermore, the calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance specifically includes:

[0034] The wall temperature of the radiator in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0035] Furthermore, the water temperature at the end of the pipe of the radiator is the water temperature at the pipe inlet, and estimating the water temperature at the end of the pipe of the radiator based on the average water exchange temperature and the wall temperature specifically includes:

[0036] The estimated water temperature at the pipeline inlet is: Among them, T in is the water temperature at the pipe inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water temperature, T wall is the wall temperature.

[0037] Furthermore, the heat conduction resistance from the electronic device to the heat sink is calculated based on the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer, specifically including:

[0038] Calculate the thermal resistance of heat conduction as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity coefficient of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers.

[0039] The present invention provides a water temperature estimation device, comprising:

[0040] A parameter acquisition module, used to acquire the heating power of the electronic device fixed on the circuit board and the circuit board temperature at the temperature measurement point on the circuit board;

[0041] an energy distribution calculation module, configured to calculate a first heat dissipation amount dissipated by the electronic device to a heat sink connected to the electronic device, and a second heat dissipation amount dissipated by the electronic device to the circuit board, based on a preset heat dissipation distribution ratio and the heating electric power;

[0042] an electronic device temperature calculation module configured to calculate an electronic device temperature of the electronic device based on the second heat dissipation amount and the circuit board temperature;

[0043] an average heat exchange water temperature calculation module configured to calculate an average heat exchange water temperature in the heat sink based on a first thermal resistance between the electronic device and water in the heat sink according to the electronic device temperature and the first heat dissipation amount, the average heat exchange water temperature being an average of heat exchange temperatures of the heat sink and the electronic device;

[0044] a water temperature calculation module configured to estimate a pipe end water temperature of the heat sink under a condition that a temperature distribution of a heat exchange system is stable according to the average heat exchange water temperature.

[0045] The present application provides an electronic device, comprising:

[0046] at least one processor; and,

[0047] a memory in communication connection with the at least one processor; wherein,

[0048] the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the water temperature estimation method as described above.

[0049] The present application provides a storage medium storing computer instructions, when the computer executes the computer instructions, all steps of the water temperature estimation method as described above are performed.

[0050] The present application provides a vehicle comprising the water temperature estimation device as described above, or the electronic device as described above.

[0051] The present application calculates the first heat dissipation amount of the electronic device to the heat sink connected with the electronic device and the second heat dissipation amount of the electronic device to the circuit board based on a preset heat dissipation amount distribution ratio through the heat generation electric power of the electronic device, and calculates the electronic device temperature from the second heat dissipation amount and the circuit board temperature, so as to calculate the average heat exchange water temperature in the heat sink based on the electronic device temperature and the first heat dissipation amount, and estimate the pipe end water temperature in the heat sink under the condition that the temperature distribution of the whole heat exchange system is stable during the process that the electronic device dissipates heat through the heat sink. The present application considers that the temperature distribution of the whole heat exchange system is stable during the process that the electronic device dissipates heat through the heat sink, so as to determine the pipe end water temperature of the heat sink through the temperature of the temperature measurement point on the circuit board, thereby replacing the water temperature sensor through the algorithm and reducing the cost. BRIEF DESCRIPTION OF DRAWINGS

[0052] Figure 1 a workflow diagram of a water temperature estimation method of an embodiment of the present application;

[0053] Figure 2 A water temperature estimation method according to an embodiment of the present application;

[0054] Figure 3 A schematic diagram of a heat conduction model according to an embodiment of the present application;

[0055] Figure 4 A schematic diagram of a water flow model according to an embodiment of the present application;

[0056] Figure 5 A schematic diagram of a calculation result according to an embodiment of the present application;

[0057] Figure 6 A schematic diagram of a water temperature estimation device according to an embodiment of the present application;

[0058] Figure 7 A schematic diagram of a hardware structure of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0059] The specific embodiments of the present application will be further described below with reference to the accompanying drawings. Identical parts are denoted by identical reference numerals in the drawings. It should be noted that the words “front”, “back”, “left”, “right”, “up” and “down” used in the following description refer to the directions in the drawings, and the words “inner” and “outer” refer to the directions towards or away from the geometric center of a specific part.

[0060] As shown in Figure 1 A schematic diagram of a water temperature estimation method according to an embodiment of the present application, comprising:

[0061] Step S101, obtaining the heat generating electric power of an electronic device fixed on a circuit board and the circuit board temperature of a temperature measurement point on the circuit board;

[0062] Step S102, calculating, according to a preset heat dissipation amount distribution ratio and the heat generating electric power, a first heat dissipation amount of the electronic device to a heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board;

[0063] Step S103, calculating, based on the second heat dissipation amount and the circuit board temperature, the electronic device temperature of the electronic device;

[0064] Step S104, calculating, according to the electronic device temperature and the first heat dissipation amount, based on a first thermal resistance between the electronic device and the water in the heat sink, the average heat exchange water temperature in the heat sink, the average heat exchange water temperature being the average value of the heat exchange temperature of the heat sink and the electronic device;

[0065] Step S105, according to the average heat exchange water temperature, estimate the heat exchanger temperature distribution under stable conditions, the radiator pipe end water temperature.

[0066] Specifically, the present application can be applied to electronic devices with processing capabilities, such as electronic controller units (ECU) or extended domain control units (XCU) of vehicles.

[0067] Specifically, first, the electronic device executes step S101, obtains the heat generating electric power of the electronic device and the circuit board temperature.

[0068] In some embodiments, the electronic device is a chip.

[0069] As Figure 3 The heat conduction model diagram of an embodiment of the present application is shown, including electronic device 1, circuit board 2 and heat sink 3. Among them, the heat source is the heat generating electric power of electronic device 1, because it does not need to do work outside, so it can be considered that the electric power of electronic device 1 is all converted into heat. Connected with electronic device 1 is circuit board 2 (PCB), because the circuit board has poor thermal conductivity, so the heat dissipation Q 环 Can be ignored. The heat generated by electronic device 1 is transmitted through circuit board 2 and through the heat sink 3 connected by contact, and the heat sink 3 is preferably a heat dissipation aluminum plate. Among them, the heat dissipation through the heat sink 3 accounts for more than 90% of the total amount, and the electronic device 1 is connected with the heat sink 3 through the heat dissipation structure 4, and the heat dissipation of the electronic device 1 through the heat sink 3 to the water is Q 水 .

[0070] A sensor can be provided at the temperature measurement point 21 of the circuit board 2, and the temperature obtained by the sensor is taken as the circuit board temperature. The distance from the sensor measurement point 21 to the center position of the electronic device 1 is the temperature measurement distance L2.

[0071] Then execute step S102, according to the preset heat dissipation distribution ratio and the heat generating electric power, calculate the first heat dissipation of the electronic device to the heat sink connected with the electronic device, and the second heat dissipation of the electronic device to the circuit board.

[0072] The heat dissipation distribution ratio refers to the proportion of heat dissipated by the electronic device to the circuit board and the heat sink. Specifically, since the electronic device is fixed on the circuit board, the heat generated by the electronic device will be dissipated through the circuit board in addition to the heat dissipated through the heat sink. However, since the circuit board is usually a PCB circuit board, its thermal conductivity is very poor, so the heat dissipation of the circuit board to the environment can be ignored. In some embodiments, the heat dissipation of the electronic device to the circuit board and the heat dissipation to the heat sink can be measured by pre-collecting multiple sets of sample experiments, and the heat dissipation ratio can be calculated.

[0073] Specifically, the preset heat dissipation distribution ratio can be set as k, and the unit time heat dissipation Q of the electronic device can be calculated based on the heat generating electric power as the product of the heat generating electric power and the unit time. Then, the unit time heat dissipation of the electronic device can be decomposed into the first heat dissipation Q1 through the heat sink and the second heat dissipation Q2 through the circuit board. The heat sink is preferably an aluminum plate.

[0074] Then, step S103 is performed to calculate the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature.

[0075] Specifically, the second heat dissipation is the heat dissipated by the electronic device to the circuit board, so the temperature of the electronic device is inversely calculated based on the circuit board temperature and the second heat dissipation as the electronic device temperature.

[0076] Then, step S104 is performed to calculate the average heat exchange water temperature in the heat sink based on the first thermal resistance between the electronic device and the water in the heat sink according to the electronic device temperature and the first heat dissipation.

[0077] Specifically, as shown in Figure 3 , the first thermal resistance is the sum of the thermal conduction thermal resistance R 1,cond of the electronic device 1 to the heat sink 3 and the convective heat transfer thermal resistance R 1,conv of the heat sink 3 and the water heat exchange.

[0078] Then, the average heat exchange water temperature in the heat sink 3 is calculated based on the first thermal resistance according to the first heat dissipation calculated in step S102 and the electronic device temperature calculated in step S103.

[0079] Finally, step S105 is performed to estimate the water temperature at the end of the pipeline of the heat sink under the condition that the temperature distribution of the heat exchange system is stable according to the average heat exchange water temperature.

[0080] Specifically, the water temperature calculated based on step S104 can be understood as an average heat exchange water temperature, which is an average of heat exchange temperatures of the heat sink and the electronic device. Since the water flow in the heat sink flows from the pipeline inlet, exchanges heat with the electronic device, and then flows from the pipeline outlet, the water temperature at the pipeline end in the heat sink is different from the average heat exchange water temperature. In order to obtain the water temperature at the pipeline end, the wall temperature of the pipe wall of the heat sink in contact with water can be calculated based on the average heat exchange water temperature. During the process of heat dissipation of the electronic device through the heat sink, the temperature distribution of the entire heat exchange system can be considered to be stable, that is, the process of heat dissipation of the electronic device through the heat sink is a steady-state heat exchange. The steady-state heat exchange refers to that, in the entire heat exchange system, including the electronic component as a heat source and each heat transfer element for heat dissipation, the temperature distribution does not change, wherein the temperature distribution not changing refers to that the temperature at each point does not change or changes very slightly. Under the condition of uniform wall temperature, based on the wall temperature, the relationship between the average heat exchange water temperature and the water temperature at the pipeline end in the heat sink can be obtained. Thus, the water temperature at the pipeline end in the heat sink is estimated based on the average heat exchange water temperature.

[0081] In some embodiments, the water temperature at the pipeline end is the water temperature at the pipeline inlet or the water temperature at the pipeline outlet.

[0082] The present application calculates, based on the preset heat dissipation amount distribution ratio and the heat generation electric power of the electronic device, a first heat dissipation amount of the electronic device to the heat sink connected with the electronic device and a second heat dissipation amount of the electronic device to the circuit board, and calculates the electronic device temperature based on the second heat dissipation amount and the circuit board temperature, so as to calculate the average heat exchange water temperature in the heat sink based on the electronic device temperature and the first heat dissipation amount, and estimate the water temperature at the pipeline end in the heat sink based on the average heat exchange water temperature under the condition that the temperature distribution of the entire heat exchange system is stable. The present application considers that the temperature distribution of the entire heat exchange system is stable during the process of heat dissipation of the electronic device through the heat sink, so as to determine the water temperature at the pipeline end of the heat sink through the temperature of the temperature measurement point on the circuit board, thereby replacing the water temperature sensor by the algorithm and reducing the cost.

[0083] As Figure 2 FIG. 5 shows a workflow diagram of a water temperature estimation method according to another embodiment of the present application, which comprises the following steps:

[0084] In step S201, the heat generation electric power of the electronic device fixed on the circuit board and the circuit board temperature of the temperature measurement point on the circuit board are obtained.

[0085] In step S202, based on the preset heat dissipation amount distribution ratio and the heat generation electric power, a first heat dissipation amount of the electronic device to the heat sink connected with the electronic device and a second heat dissipation amount of the electronic device to the circuit board are calculated.

[0086] Step S203, calculating the electronic device temperature at the location of the electronic device based on the second thermal resistance between the temperature measuring point and the electronic device with the second heat dissipation amount and the circuit board temperature.

[0087] In one embodiment, the calculating the electronic device temperature at the location of the electronic device based on the second thermal resistance between the temperature measuring point and the electronic device with the second heat dissipation amount and the circuit board temperature specifically comprises:

[0088] calculating the second thermal resistance between the temperature measuring point and the electronic device according to the ratio of the temperature measuring distance between the temperature measuring point and the electronic device to the radius of the electronic device;

[0089] calculating the electronic device temperature at the location of the electronic device according to the circuit board temperature, the second heat dissipation amount and the second thermal resistance.

[0090] In one embodiment, the calculating the second thermal resistance between the temperature measuring point and the electronic device according to the ratio of the temperature measuring distance between the temperature measuring point and the electronic device to the radius of the electronic device specifically comprises:

[0091] the second thermal resistance between the temperature measuring point and the electronic device is calculated as:

[0092] wherein R2 is the second thermal resistance, L2 is the temperature measuring distance between the temperature measuring point and the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

[0093] In one embodiment, the calculating the electronic device temperature at the location of the electronic device according to the circuit board temperature, the second heat dissipation amount and the second thermal resistance specifically comprises:

[0094] the electronic device temperature is calculated as: T e = T2 + Q2 · R2, wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance.

[0095] Step S204, calculating the average heat exchange water temperature in the heat sink based on the first thermal resistance between the electronic device and the water in the heat sink according to the electronic device temperature and the first heat dissipation amount, the average heat exchange water temperature being the average of the heat exchange temperatures between the heat sink and the electronic device.

[0096] In one embodiment, the calculating the average heat exchange water temperature in the heat sink according to the electronic device temperature, the first heat dissipation amount, and the first thermal resistance between the electronic device and water in the heat sink specifically comprises:

[0097] calculating a thermal conduction thermal resistance of the electronic device to the heat sink according to structural thicknesses of layers between the electronic device and the heat sink, thermal conductivities of the layers, and areas of the layers, the layers including structural layers in the electronic device, one or more heat conduction structures connecting the electronic device to the heat sink, and the heat sink;

[0098] calculating a convective heat exchange thermal resistance of the heat sink to water;

[0099] calculating the first thermal resistance between the electronic device and water in the heat sink as a sum of the thermal conduction thermal resistance and the convective heat exchange thermal resistance;

[0100] calculating the average heat exchange water temperature in the heat sink according to the electronic device temperature, the first thermal resistance, and the first heat dissipation amount.

[0101] In one embodiment, the calculating the average heat exchange water temperature in the heat sink according to the electronic device temperature, the first thermal resistance, and the first heat dissipation amount specifically comprises:

[0102] calculating the average heat exchange water temperature in the heat sink as T w = T e - R1·Q1, where T w is the average heat exchange water temperature, T e is the electronic device temperature, R1 is the first thermal resistance, and Q1 is the first heat dissipation amount.

[0103] calculating a thermal conduction thermal resistance of the electronic device to the heat sink according to structural thicknesses of layers between the electronic device and the heat sink, thermal conductivities of the layers, and areas of the layers, the layers including structural layers in the electronic device, one or more heat conduction structures connecting the electronic device to the heat sink, and the heat sink.

[0104] calculating a wall temperature of the heat sink pipe wall according to the first heat dissipation amount and the thermal conduction thermal resistance.

[0105] In one embodiment, the calculating a wall temperature of the heat sink pipe wall according to the first heat dissipation amount and the thermal conduction thermal resistance specifically comprises:

[0106] calculating the wall temperature of the heat sink pipe wall as T wall = Te Q1·R 1,cond wherein T wall is the wall temperature, T e is the electronic device temperature, Q1 is the first heat dissipation amount, R 1,cond is the heat conduction thermal resistance.

[0107] In step S207, the pipe end water temperature of the heat sink is estimated according to the average heat exchange water temperature and the wall temperature.

[0108] In one embodiment, the pipe end water temperature of the heat sink is the pipe inlet water temperature, and the estimation of the pipe end water temperature of the heat sink according to the average heat exchange water temperature and the wall temperature specifically includes:

[0109] The pipe inlet water temperature is estimated as: wherein T in is the pipe inlet water temperature, a is the water heat exchange coefficient, is the water mass flow rate, Cp w is the water specific heat at constant pressure, A w is the water heat exchange area, T w is the average heat exchange water temperature, and T wall is the wall temperature.

[0110] Specifically, step S201 is first performed to obtain the heat generation electric power of the electronic device and the circuit board temperature.

[0111] Then, step S202 is performed to calculate, according to a preset heat dissipation amount distribution ratio and the heat generation electric power, a first heat dissipation amount of the electronic device to the heat sink connected to the electronic device and a second heat dissipation amount of the electronic device to the circuit board.

[0112] Specifically, the preset heat dissipation amount distribution ratio is set as k, and the heat dissipation amount per unit time of the electronic device Q can be calculated based on the heat generation electric power as the product of the heat generation electric power and the unit time. The heat dissipation amount per unit time of the electronic device can be decomposed into the first heat dissipation amount Q1 through the heat sink and the second heat dissipation amount Q2 through the circuit board. The heat sink is preferably an aluminum plate.

[0113] The first heat dissipation amount Q1 and the second heat dissipation amount Q2 are respectively:

[0114] Q1=(1-k)Q (1)

[0115] Q2=kQ (2)

[0116] After the first heat dissipation amount and the second heat dissipation amount are determined, step S203 is performed to calculate the electronic device temperature at the location of the electronic device based on the second thermal resistance between the temperature measurement point and the electronic device and the second heat dissipation amount and the circuit board temperature.

[0117] The second thermal resistance is the thermal resistance from the temperature measurement point to the center of the electronic device. The temperature measurement point is where the sensor is placed. Since the sensor is generally not placed at the center of the electronic device, the temperature detected by the sensor at the temperature measurement point is not the temperature at the center of the electronic device, but the temperature after a certain heat dissipation. Therefore, the accurate electronic device temperature needs to be calculated based on the second thermal resistance.

[0118] Assuming that the temperature distribution from the center of the electronic device to the circuit board conforms to a circular ring distribution in a steady state, the second thermal resistance between the temperature measurement point and the electronic device can be calculated according to the ratio of the temperature measurement distance from the temperature measurement point to the center of the electronic device to the radius of the electronic device.

[0119] In one embodiment, the calculation of the electronic device temperature at the location of the electronic device based on the second thermal resistance between the temperature measurement point and the electronic device and the second heat dissipation amount and the circuit board temperature specifically includes:

[0120] The second thermal resistance between the temperature measurement point and the electronic device is calculated according to the ratio of the temperature measurement distance from the temperature measurement point to the center of the electronic device to the radius of the electronic device;

[0121] The electronic device temperature at the location of the electronic device is calculated according to the circuit board temperature, the second heat dissipation amount, and the second thermal resistance.

[0122] The embodiment quickly determines the second thermal resistance by the ratio of the temperature measurement distance to the radius of the electronic device, so that the accurate electronic device temperature can be obtained based on the second thermal resistance.

[0123] In one embodiment, the calculation of the second thermal resistance between the temperature measurement point and the electronic device according to the ratio of the temperature measurement distance from the temperature measurement point to the center of the electronic device to the radius of the electronic device specifically includes:

[0124] The second thermal resistance between the temperature measurement point and the electronic device is calculated as follows:

[0125] where R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the center of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, and λ PCB is the thermal conductivity of the circuit board.

[0126] Specifically, assuming that the temperature distribution from the electronic device center to the circuit board conforms to a circular ring distribution in a steady state, the radial unit time heat dissipation amount is:

[0127]

[0128] wherein Q is the radial unit time heat dissipation amount of the electronic device, i.e., the heat generation electric power of the electronic device. R is the chip radial distance, δ is the thickness of the circuit board, λ is the heat conduction coefficient, A is the heat exchange area, λ PCB is the heat conduction coefficient of the circuit board. The second thermal resistance from the equivalent radius L1 of the electronic device to the temperature measurement distance L2 can be obtained by integrating formula (3) from L1 to L2, i.e.,

[0129]

[0130] wherein R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the middle of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the heat conduction coefficient of the circuit board.

[0131] The embodiment provides a calculation formula of the second thermal resistance, and the second thermal resistance is quickly obtained.

[0132] In one embodiment, the electronic device temperature at the position of the electronic device is calculated according to the circuit board temperature, the second heat dissipation amount, and the second thermal resistance, specifically comprising:

[0133] The electronic device temperature is calculated as: T e = T2+ Q2· R2, wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance.

[0134] After the second thermal resistance is determined, the electronic device temperature can be obtained by formula 5 in a steady state:

[0135] T e = T2+ Q2· R2 (5)

[0136] wherein T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation amount, and R2 is the second thermal resistance.

[0137] After the electronic device temperature is determined, step S204 is performed, and the average heat exchange water temperature in the heat sink is calculated according to the electronic device temperature, the first heat dissipation amount, and the first thermal resistance between the electronic device and the water in the heat sink.

[0138] In one embodiment, calculating the average water temperature of the radiator based on the electronic device temperature, the first heat dissipation, and a first thermal resistance between the electronic device and water in the radiator specifically includes:

[0139] Calculating the heat conduction resistance from the electronic device to the heat sink based on the structural thickness, thermal conductivity, and area of ​​each layer between the electronic device and the heat sink, wherein the electronic device is connected to the heat sink via one or more heat-conducting structures, and the layers include multiple structural layers within the electronic device, the one or more heat-conducting structures, and the heat sink;

[0140] Calculating the convection heat transfer thermal resistance between the radiator and water;

[0141] Calculating a first thermal resistance between the electronic device and the water in the radiator as the sum of the heat conduction resistance and the convection resistance;

[0142] The average water temperature of the radiator is calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation.

[0143] Specifically, electronic devices typically consist of multiple structural layers. For example, a chip's structural layers typically include: substrate layer, solder layer, underlay layer, heat source layer, active layer, and so on. Each structural layer has a specific thickness and area, and each layer also has a specific thermal conductivity coefficient, depending on the material used.

[0144] Therefore, the thermal resistance of heat conduction from the electronic device to the heat sink is calculated based on the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer. In addition, the layer between the electronic device and the heat sink also includes a heat-conducting structure and a heat sink. The heat-conducting structure includes various existing thermally conductive adhesives and thermally conductive parts. Each thermally conductive adhesive or thermally conductive part is considered as a layer. At the same time, since the heat sink is generally a flat plate, the heat sink is considered as a whole layer. By calculating the relevant parameters of each layer between the electronic device and the heat sink, the thermal resistance of heat conduction from the electronic device to the heat sink is obtained.

[0145] In one embodiment, calculating the heat conduction resistance from the electronic device to the heat sink based on the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer specifically includes:

[0146] Calculate the thermal resistance of heat conduction as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λi is the thermal conductivity coefficient of the i-th layer, A i is the area of the i-th layer, and n is the number of layers.

[0147] Specifically, the heat conduction thermal resistance is calculated using formula (6):

[0148]

[0149] wherein R 1,cond is the heat conduction thermal resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity coefficient of the i-th layer, A i is the area of the i-th layer, and n is the number of layers.

[0150] The embodiment provides a method for calculating the thermal conductivity coefficient.

[0151] Then, the convective heat transfer thermal resistance of the heat sink and the water heat exchange is calculated, and the convective heat transfer thermal resistance can be calculated according to the water heat exchange area.

[0152] In some embodiments, the convective heat transfer thermal resistance of the heat sink and the water heat exchange is calculated as: wherein R 1,conv is the convective heat transfer thermal resistance, A w is the water heat exchange area, and a is the water heat exchange coefficient.

[0153] Finally, the water temperature in the heat sink can be calculated according to the electronic device temperature, the first thermal resistance, and the first heat dissipation amount. The water temperature in the heat sink is the average heat exchange water temperature.

[0154] The embodiment calculates the average heat exchange water temperature in the heat sink according to the thermal resistance.

[0155] In one embodiment, the average heat exchange water temperature in the heat sink is calculated according to the electronic device temperature, the first thermal resistance, and the first heat dissipation amount, and specifically includes:

[0156] The average heat exchange water temperature in the heat sink is calculated as: T w = T e - R1·Q1, wherein T w is the average heat exchange water temperature, T e is the electronic device temperature, R1 is the first thermal resistance, and Q1 is the first heat dissipation amount.

[0157] Specifically, the water temperature is calculated according to the first thermal resistance:

[0158] T w = T e - R1·Q1 (7)

[0159] Where T w is the average water temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0160] This embodiment provides a method for calculating the average water exchange temperature.

[0161] Then, step S205 is executed to calculate the heat conduction resistance from the electronic device to the heat sink according to the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer.

[0162] The method for calculating the thermal resistance of heat conduction is the same as above.

[0163] Then, step 206 is executed to calculate the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance.

[0164] In one embodiment, calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance specifically includes:

[0165] The wall temperature of the radiator in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0166] The first step in calculating the water temperature is to calculate the temperature of the wall in contact with the water:

[0167] T wall =T e -Q1·R 1,cond (8)

[0168] Where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0169] Step S207 : estimating the water temperature at the end of the pipe of the radiator according to the average water exchange temperature and the wall temperature.

[0170] In one embodiment, the water temperature at the end of the pipe of the radiator is the water temperature at the pipe inlet, and estimating the water temperature at the end of the pipe of the radiator based on the average water exchange water temperature and the wall temperature specifically includes:

[0171] The pipe inlet water temperature is estimated as: where T in is the pipe inlet water temperature, a is the water heat transfer coefficient, is the water mass flow rate, Cp w is the water constant pressure specific heat, A w is the water heat transfer area, T w is the average heat transfer water temperature, T wall is the wall temperature.

[0172] Specifically, under the condition of uniform wall temperature, the steady-state heat transfer in the control volume can be expressed as follows:

[0173]

[0174] where a is the water heat transfer coefficient, is the water mass flow rate, R is the heat transfer area per unit length, Cp w is the water constant pressure specific heat, T0 is the water temperature at position 0, generally taken as the inlet, T L is the water temperature at position L, dT water is the water temperature difference per unit length, dx is the length differential, and L is the pipe length. From the inlet to the position with length x is referred to as position x, and the integral from the inlet to position x is:

[0175]

[0176] where T x is the temperature at position x, T in is the pipe inlet water temperature, i.e., the water temperature at position 0 T0.

[0177] The temperature at position x is:

[0178]

[0179] The average heat transfer water temperature can be calculated as:

[0180]

[0181] The pipe inlet water temperature can be obtained from formula (12) as:

[0182]

[0183] where T in is the pipe inlet water temperature, a is the water heat transfer coefficient, is the water mass flow rate, Cp w is the water constant pressure specific heat, A w is the water heat transfer area, T w is the average heat transfer water temperature, T wall is the wall temperature.

[0184] After obtaining the pipe inlet water temperature, the pipe outlet water temperature can be calculated according to formula (11), and the pipe outlet water temperature T out The actual temperature T is the temperature from the inlet to the position with a length of L L Therefore, the pipe outlet water temperature is:

[0185]

[0186] where T out is the pipe outlet water temperature.

[0187] In some embodiments, a water flow model is built by a neural network model to obtain the water mass flow.

[0188] The neural network model is built according to experimental data to obtain physical model data, and then extended from the physical model data.

[0189] Specifically, the water mass flow of the heating element in different states is certain. The heating element is an electronic device as a heat source, so the existing water flow model building method can be used to build the water flow model, and the corresponding water mass flow is obtained when the state of the heating element is determined. As shown in Figure 4 First, the experimental data 401 is obtained, then the modeling correction is performed, and the GT Power (engine working process simulation calculation software) model 402 is input, the mapping database 403 is obtained through DoE, the ANN flow static model 404 is obtained through feature screening, training and verification, and the flow dynamic model 405 is obtained through the time constant.

[0190] As an example, the water flow model is built as follows:

[0191] 1. Obtain the key flow data in the experiment, correct the data pump pressure rise, component pressure drop and along-the-way loss and other parameters, build a physical model, and correct according to the key experimental data.

[0192] 2. Build a physical model according to the experimental data, and extend the experimental data. This step can calculate the branch flow that is not measured in the experiment but is related to the simulation. Specifically, a physical model is built through the GT Power software. Then a mapping database is obtained through Design of Experiment (DOE). The mapping database can be regarded as a large number of mapping data corresponding to the input-output, and a neural network model can be established.

[0193] 3. Based on the data obtained in step 2, the control variables in the system are taken as modeling features, and the features are extended according to physical meaning, as shown in Table 1. The extension basis can be the order relationship between the water pump speed and the lift, the temperature and the radiation heat exchange, and the instantaneous energy and the cumulative energy entering the system.

[0194]

[0195]

[0196] Based on the extended features, feature screening is performed, and the screening method is based on the generalized radial basis function (GRNN) neural network.

[0197] The screening process is as follows:

[0198] 4.1 Put all the selected features into the candidate set, and the selected set is empty at this time;

[0199] 4.2 Use the features in the candidate set to approximate the output value through the GRNN, traverse the features in the candidate set, and select the feature with the smallest mean squared error (MSE) to enter the selected set;

[0200] 4.3 Enter the iteration process, and the fitting target is changed to the remaining information after fitting the output value through the features in the selected set, and select the feature with the smallest MSE to enter the selected set;

[0201] 4.4 Iteration in turn until the features in the candidate set are traversed.

[0202] The GRNN is based on probability, which can better reflect the one-to-one correspondence between the control variables as the model input and the state variables as the model output.

[0203] 5. According to the feature order given by the screening result, the first four features are selected to reduce the GRNN fitting MSE to 0, which ensures the accuracy and avoids feature redundancy.

[0204] 6. The data obtained in step 2 is randomly divided into a training set and a test set, a neural network model is established according to the selected features, the accuracy of the model is obtained by K test, and the best flow model is selected by comprehensively considering the training accuracy and the test accuracy, i.e. Figure 4 The flow static model.

[0205] 7. A steady-state heat exchange model of the heat exchange component in the system is built, for example, the steady-state heat exchange model of the present application or various steady-state heat exchange models in the prior art, and the heat absorbed under the steady-state condition causes the temperature change

[0206]

[0207] The heat source is the heating element and the water flow heat exchange, so we have:

[0208] Q 吸 = α · dA · (T B - T w ) = α · L c · dx · (T B - T w ) (16)

[0209] where Q 吸 is the absorbed heat, C p is the specific heat of the cooling water at constant pressure, is the cooling water flow rate, T w is the water temperature, T B is the heating element temperature, L C is the characteristic length of the heat exchange component, represents the heat exchange area corresponding to each unit length, α is the heat exchange coefficient, dA is the differential of the heat exchange area, and dx is the differential of the heat exchange length. By combining equations (15) and (16) and integrating from the inlet to the outlet of the heat exchange component, we obtain

[0210]

[0211] where T w,out is the outlet water temperature, T w,in is the inlet water temperature, and A is the heat exchange area.

[0212] Because the thermal mass of the heat exchange component is relatively large compared to the heat exchange amount in a unit step, we can assume that the temperature of the heat exchange component remains constant within a unit step.

[0213] 8. The heat exchange coefficient is fitted according to the mass flow rate to ensure that the heat exchange coefficient in the pipeline is within a reasonable range, and the trend is correct.

[0214] 9. Calculate the heat exchange heat Q 吸 in a unit time step, calculate the temperature change of the heat exchange component in the step through equation (21), and update the temperature of the heat exchange element when calculating the next step.

[0215] 10. Identify the characteristic length of the heat exchange element through experimental data to compensate for the lack of flow accuracy, calibrate the flow model, and obtain the flow dynamic model as shown in Figure 4 . According to the flow dynamic model, we can determine the water mass flow rate of the cooling water of the heating element, i.e., the electronic device, in different states.

[0216] After determining the water mass flow rate, we can fit the water heat exchange coefficient according to the water mass flow rate or calculate the Reynolds number according to the dimensionless method, and then determine the water heat exchange coefficient according to the relationship between the Prandtl number and the Nusselt number.

[0217] The water heat transfer coefficient can be fitted by a second order polynomial according to the water mass flow rate, and the formula is as follows:

[0218]

[0219] wherein, a is the water heat transfer coefficient, is the water mass flow rate, C1, C2, C3 are fitting coefficients, which need to be fitted according to experimental values.

[0220] The dimensionless method involves two flow states, laminar flow state and turbulent flow state, and the two flow states are distinguished according to the Reynolds number, and the calculation formula of the Reynolds number is:

[0221]

[0222] The calculation formula of Nusselt number is:

[0223]

[0224] In the formula, V is the water flow rate, L is the heat transfer length, v is the dynamic viscosity of water, and λ is the thermal conductivity. Then the water heat transfer coefficient can be obtained as:

[0225]

[0226] In the formula, Pr is the Prandtl number of water, and f(Re, Pr) is an empirical function for calculating Nusselt number. Due to the difference in internal structure of the pipeline, the Nu calculation under laminar flow, transition state and turbulent flow needs to be identified according to the experimental temperature data.

[0227] In some embodiments, the method further comprises:

[0228] Obtaining a plurality of experimental data, the experimental data comprising measured values of water inlet temperature;

[0229] According to the empirical function, the initial value of Nusselt number is estimated, and the initial value of water heat transfer coefficient is obtained according to the initial value of Nusselt number, and the water inlet temperature of the radiator is estimated according to the average heat transfer water temperature and the wall temperature. Specifically, the water inlet temperature of the pipeline is calculated according to formula (13);

[0230] Adjusting the Nusselt number, and thus adjusting the water heat transfer coefficient, until the estimated water inlet temperature of the pipeline is consistent with the experimental water inlet temperature of the pipeline.

[0231] As Figure 5The calculation effect schematic diagram of one example of the present application is shown, including a main loop test water temperature curve 51 and a water temperature curve 52 predicted by using the method of the present example. The horizontal coordinate is time, unit: s, and the vertical coordinate is temperature, unit: ℃. As can be seen from the effect, the method of the present example can be stably predicted for a long time. After random screening of 50 vehicles for 300 trips, the average error of this modeling method under steady state is below 3℃, Figure 5 The tie error shown is 2.43℃.

[0232] The present example calculates the electronic device temperature at the position of the electronic device through the second thermal resistance between the temperature measurement point and the electronic device, thereby improving the accuracy of the electronic device temperature. At the same time, the water temperature in the radiator is converted into the average heat exchange water temperature based on the first thermal resistance between the electronic device and the water in the radiator according to the electronic device temperature and the first heat dissipation amount, and the pipe end water temperature of the pipeline is calculated based on the average heat exchange water temperature. The present example simplifies the heat transfer model of the electronic device, inversely calculates the pipe end water temperature through the change of the device temperature, reduces the demand for sensors, reduces the cost, and has high accuracy.

[0233] Based on the same inventive concept, as Figure 6 The schematic diagram of a water temperature estimation device of one example of the present application is shown, including:

[0234] The parameter acquisition module 601 is configured to acquire the heat generation electric power of the electronic device fixed on the circuit board and the circuit board temperature of the temperature measurement point on the circuit board.

[0235] The energy distribution calculation module 602 is configured to calculate the first heat dissipation amount of the electronic device to the radiator connected with the electronic device and the second heat dissipation amount of the electronic device to the circuit board according to the preset heat dissipation amount distribution ratio and the heat generation electric power.

[0236] The electronic device temperature calculation module 603 is configured to calculate the electronic device temperature of the electronic device based on the second heat dissipation amount and the circuit board temperature.

[0237] The average heat exchange water temperature calculation module 604 is configured to calculate the average heat exchange water temperature in the radiator based on the first thermal resistance between the electronic device and the water in the radiator according to the electronic device temperature and the first heat dissipation amount, the average heat exchange water temperature being the average value of the heat exchange temperatures of the radiator and the electronic device.

[0238] The water temperature calculation module 605 is configured to estimate the pipe end water temperature of the radiator under the condition that the temperature distribution of the heat exchange system is stable according to the average heat exchange water temperature.

[0239] The application calculates the first heat dissipation amount of the electronic device to the radiator connected with the electronic device and the second heat dissipation amount of the electronic device to the circuit board based on the preset heat dissipation amount distribution ratio according to the heat generating electric power of the electronic device, and calculates the electronic device temperature according to the second heat dissipation amount and the circuit board temperature, so as to calculate the average heat exchange water temperature in the radiator based on the electronic device temperature and the first heat dissipation amount, and estimate the water temperature at the end of the pipeline in the radiator under the condition that the temperature distribution of the heat exchange system is stable. The application can determine the water temperature at the end of the pipeline in the radiator according to the temperature of the temperature measuring point on the circuit board, so as to replace the water temperature sensor by the algorithm and reduce the cost.

[0240] In one embodiment, the electronic device temperature of the electronic device is calculated based on the second heat dissipation amount and the circuit board temperature, and specifically includes:

[0241] The electronic device temperature at the position of the electronic device is calculated based on the second thermal resistance between the temperature measuring point and the electronic device according to the second heat dissipation amount and the circuit board temperature.

[0242] In one embodiment, the electronic device temperature at the position of the electronic device is calculated based on the second thermal resistance between the temperature measuring point and the electronic device according to the second heat dissipation amount and the circuit board temperature, and specifically includes:

[0243] The second thermal resistance between the temperature measuring point and the electronic device is calculated according to the ratio of the temperature measuring distance between the temperature measuring point and the electronic device to the radius of the electronic device.

[0244] The electronic device temperature at the position of the electronic device is calculated according to the circuit board temperature, the second heat dissipation amount and the second thermal resistance.

[0245] In one embodiment, the second thermal resistance between the temperature measuring point and the electronic device is calculated according to the ratio of the temperature measuring distance between the temperature measuring point and the electronic device to the radius of the electronic device, and specifically includes:

[0246] The second thermal resistance between the temperature measuring point and the electronic device is calculated as follows:

[0247] Wherein R2 is the second thermal resistance, L2 is the temperature measuring distance between the temperature measuring point and the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

[0248] In one embodiment, the calculating the electronic device temperature at the location of the electronic device according to the circuit board temperature, the second heat dissipation and the second thermal resistance specifically comprises:

[0249] The electronic device temperature is calculated as T e = T2 + Q2·R2, where T e is the electronic device temperature, T2 is the circuit board temperature, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

[0250] In one embodiment, the calculating the average heat exchange water temperature in the heat sink according to the electronic device temperature, the first heat dissipation and the first thermal resistance between the electronic device and water in the heat sink specifically comprises:

[0251] The thermal conduction thermal resistance between the electronic device and the heat sink is calculated according to the structure thickness of each layer, the thermal conductivity of each layer and the area of each layer, the electronic device is connected to the heat sink through one or more heat conduction structures, and the layers include a plurality of structure layers in the electronic device, one or more heat conduction structures and the heat sink;

[0252] The convective heat exchange thermal resistance of the heat sink and water heat exchange is calculated;

[0253] The first thermal resistance between the electronic device and water in the heat sink is calculated as the sum of the thermal conduction thermal resistance and the convective heat exchange thermal resistance;

[0254] The average heat exchange water temperature in the heat sink is calculated according to the electronic device temperature, the first thermal resistance and the first heat dissipation.

[0255] In one embodiment, the calculating the average heat exchange water temperature in the heat sink according to the electronic device temperature, the first thermal resistance and the first heat dissipation specifically comprises:

[0256] The average heat exchange water temperature in the heat sink is calculated as T w = T e - R1·Q1, where T w is the average heat exchange water temperature, T e is the electronic device temperature, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0257] In one embodiment, the estimating the water temperature at the pipe end of the heat sink under the condition that the temperature distribution of the heat exchange system is stable according to the average heat exchange water temperature specifically comprises:

[0258] calculating a heat conduction thermal resistance from the electronic device to the heat sink according to structure thicknesses of layers between the electronic device and the heat sink, thermal conductivities of the layers, and areas of the layers, the layers including a plurality of structure layers within the electronic device, one or more heat conduction structures connecting the electronic device to the heat sink, and the heat sink;

[0259] calculating a wall temperature of the heat sink pipe wall according to the first heat dissipation amount and the heat conduction thermal resistance;

[0260] estimating a pipe end water temperature of the heat sink according to the average heat exchange water temperature and the wall temperature.

[0261] In one embodiment, the calculating a wall temperature of the heat sink pipe wall according to the first heat dissipation amount and the heat conduction thermal resistance specifically includes:

[0262] calculating the wall temperature of the heat sink in contact with water as T wall = T e - Q1·R 1,cond , where T wall is the wall temperature, T e is the electronic device temperature, Q1 is the first heat dissipation amount, R 1,cond is the heat conduction thermal resistance.

[0263] In one embodiment, the pipe end water temperature of the heat sink is a pipe inlet water temperature, and the estimating a pipe end water temperature of the heat sink according to the average heat exchange water temperature and the wall temperature specifically includes:

[0264] estimating the pipe inlet water temperature as: where T in is the pipe inlet water temperature, a is a water heat exchange coefficient, is a water mass flow, Cp w is a water specific heat at constant pressure, A w is a water heat exchange area, T w is the average heat exchange water temperature, and T wall is the wall temperature.

[0265] In one embodiment, the calculating a heat conduction thermal resistance from the electronic device to the heat sink according to structure thicknesses of layers between the electronic device and the heat sink, thermal conductivities of the layers, and areas of the layers specifically includes:

[0266] calculating the heat conduction thermal resistance as R 1,cond = ∑(δ i i-1)·λ i i-1)·A i i-1), where R 1,cond is the heat conduction thermal resistance, δ i is a structure thickness of an i-th layer, λ i is a thermal conductivity of the i-th layer, and A i is an area of the i-th layer.i is the area of ​​the i-th layer, and n is the number of layers.

[0267] Regarding the apparatus in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0268] like Figure 7 FIG. 1 is a schematic diagram of the hardware structure of an electronic device of the present invention, comprising:

[0269] at least one processor 701; and,

[0270] A memory 702 in communication with at least one of the processors 701; wherein,

[0271] The memory 702 stores instructions that can be executed by at least one of the processors. The instructions are executed by at least one of the processors to enable the at least one of the processors to perform the water temperature estimation method as described above.

[0272] Figure 7 A processor 701 is taken as an example.

[0273] The electronic device may further include an input device 703 and a display device 704 .

[0274] The processor 701, the memory 702, the input device 703 and the display device 704 may be connected via a bus or other means, with the bus connection being used as an example in the figure.

[0275] The memory 702 is a non-volatile computer-readable storage medium that can be used to store non-volatile software programs, non-volatile computer executable programs, and modules, such as the program instructions / modules corresponding to the water temperature estimation method in the embodiment of the present application, for example, Figure 1 、 Figure 2 The processor 701 executes the non-volatile software programs, instructions and modules stored in the memory 702 to perform various functional applications and data processing, that is, to implement the water temperature estimation method in the above embodiment.

[0276] The memory 702 can include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required by a function, and the data storage area can store data created according to use of the water temperature estimation method, etc. In addition, the memory 702 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state memory device. In some embodiments, the memory 702 can optionally include a memory disposed remotely with respect to the processor 701, which can be connected to the device executing the water temperature estimation method through a network. Examples of the above network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0277] The input device 703 can receive an input user click, and generate a signal input related to user settings and function control of the water temperature estimation method. The display device 704 can include a display screen or the like display device.

[0278] When the one or more modules are stored in the memory 702, and when executed by the one or more processors 701, the water temperature estimation method in any of the above method embodiments is executed.

[0279] The present application calculates, based on a preset heat dissipation amount distribution ratio, a first heat dissipation amount of an electronic device to a heat sink connected to the electronic device, and a second heat dissipation amount of the electronic device to a circuit board, by a heat generation electric power of the electronic device, and calculates an electronic device temperature from the second heat dissipation amount and a circuit board temperature, so as to calculate an average heat exchange water temperature in the heat sink based on the electronic device temperature and the first heat dissipation amount, and estimate a pipe end water temperature in the heat sink under a heat exchange system temperature distribution stable condition according to the average heat exchange water temperature. The present application can determine the pipe end water temperature of the heat sink by a temperature of a temperature measurement point on the circuit board, so as to replace a water temperature sensor by an algorithm, and reduce cost.

[0280] An embodiment of the present application provides a storage medium storing computer instructions, when a computer executes the computer instructions, all steps of the water temperature estimation method as described above are executed.

[0281] In the context of the present disclosure, the storage medium can be a tangible medium which can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. The storage medium can be a machine-readable signal medium or a machine-readable storage medium. Alternatively, the storage medium can be a non-transitory computer-readable storage medium, for example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a compact disc read-only memory (CD-ROM), a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0282] An embodiment of the present application provides a vehicle comprising the water temperature estimation apparatus as described above or the electronic device as described above. It can be understood that the vehicle can also comprise a processor, a memory and a computer program. The computer program is stored in the memory and configured to be executed by the processor to implement the water temperature estimation method provided by the embodiments of the present application. The processor and the memory have been described above. Figure 7 Part of the embodiments illustrated in the above description will not be described here.

[0283] The above-described embodiments only express several implementation manners of the present application, which are described in a more specific and detailed manner. However, it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A water temperature estimation method, characterized in that: include: Acquiring the heating power of the electronic device fixed on the circuit board and the circuit board temperature at the temperature measurement point on the circuit board; calculating, based on a preset heat dissipation distribution ratio and the heating electric power, a first heat dissipation from the electronic device to a heat sink connected to the electronic device, and a second heat dissipation from the electronic device to the circuit board; calculating an electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature; Calculating an average heat exchange water temperature in the radiator based on the electronic device temperature, the first heat dissipation amount, and a first thermal resistance between the electronic device and water in the radiator, the average heat exchange water temperature being an average of heat exchange temperatures between the radiator and the electronic device; The water temperature at the end of the pipe of the radiator is estimated based on the average water temperature during heat exchange under the condition of stable temperature distribution of the heat exchange system.

2. The water temperature estimation method according to claim 1, characterized in that: The calculating the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature specifically includes: The electronic component temperature at the location of the electronic component is calculated based on the second heat dissipation and the circuit board temperature and a second thermal resistance between the temperature measurement point and the electronic component.

3. The water temperature estimation method according to claim 2, characterized in that: The calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and a second thermal resistance between the temperature measurement point and the electronic device specifically includes: calculating a second thermal resistance between the temperature measurement point and the electronic device according to a ratio of a temperature measurement distance from the temperature measurement point to the middle of the electronic device to a radius of the electronic device; The temperature of the electronic component at the location where the electronic component is located is calculated according to the circuit board temperature, the second heat dissipation, and the second thermal resistance.

4. The water temperature estimation method according to claim 3, characterized in that: Calculating the second thermal resistance between the temperature measurement point and the electronic device based on the ratio of the temperature measurement distance from the temperature measurement point to the middle of the electronic device to the radius of the electronic device specifically includes: The second thermal resistance between the temperature measurement point and the electronic device is calculated as: Where R2 is the second thermal resistance, L2 is the temperature measurement distance from the temperature measurement point to the middle of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, and λ PCB is the thermal conductivity of the circuit board.

5. The water temperature estimation method according to claim 3, characterized in that: Calculating the temperature of the electronic device at the location of the electronic device based on the circuit board temperature, the second heat dissipation, and the second thermal resistance specifically includes: Calculate the temperature of electronic devices as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

6. The water temperature estimation method according to claim 1, characterized in that: Calculating the average water temperature of the radiator based on the electronic device temperature, the first heat dissipation, and a first thermal resistance between the electronic device and water in the radiator specifically includes: Calculating the heat conduction resistance from the electronic device to the heat sink based on the structural thickness, thermal conductivity, and area of ​​each layer between the electronic device and the heat sink, wherein the electronic device is connected to the heat sink via one or more heat-conducting structures, and the layers include multiple structural layers within the electronic device, the one or more heat-conducting structures, and the heat sink; Calculating the convection heat transfer thermal resistance between the radiator and water; Calculating a first thermal resistance between the electronic device and the water in the radiator as the sum of the heat conduction resistance and the convection resistance; The average water temperature of the radiator is calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation.

7. The water temperature estimation method according to claim 6, characterized in that: Calculating the average water temperature of the radiator according to the electronic device temperature, the first thermal resistance, and the first heat dissipation specifically includes: Calculate the average water temperature in the radiator as: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

8. The water temperature estimation method according to claim 1, characterized in that: The estimating, based on the average water temperature of the heat exchange water, the water temperature at the end of the pipe of the radiator under the condition that the temperature distribution of the heat exchange system is stable specifically includes: Calculating the heat conduction resistance from the electronic device to the heat sink based on the structural thickness, thermal conductivity, and area of ​​each layer between the electronic device and the heat sink, wherein the electronic device is connected to the heat sink via one or more heat-conducting structures, and the layers include multiple structural layers within the electronic device, the one or more heat-conducting structures, and the heat sink; Calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance; The water temperature at the end of the pipe of the radiator is estimated according to the average water exchange temperature and the wall temperature.

9. The water temperature estimation method according to claim 8, characterized in that: Calculating the wall temperature of the radiator tube wall according to the first heat dissipation and the heat conduction thermal resistance specifically includes: The wall temperature of the radiator in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

10. The water temperature estimation method according to claim 8, characterized in that: The water temperature at the end of the pipe of the radiator is the water temperature at the pipe inlet. The estimating the water temperature at the end of the pipe of the radiator based on the average water exchange temperature and the wall temperature specifically includes: The estimated water temperature at the pipeline inlet is: Among them, T in is the water temperature at the pipe inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

11. The water temperature estimation method according to claim 6 or 8, characterized in that: Calculating the heat conduction resistance from the electronic device to the heat sink based on the structural thickness of each layer between the electronic device and the heat sink, the thermal conductivity coefficient of each layer, and the area of ​​each layer specifically includes: Calculate the thermal resistance of heat conduction as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity coefficient of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers.

12. A water temperature estimation device, characterized in that: include: A parameter acquisition module, used to acquire the heating power of the electronic device fixed on the circuit board and the circuit board temperature at the temperature measurement point on the circuit board; an energy distribution calculation module, configured to calculate a first heat dissipation amount dissipated by the electronic device to a heat sink connected to the electronic device, and a second heat dissipation amount dissipated by the electronic device to the circuit board, based on a preset heat dissipation distribution ratio and the heating electric power; an electronic device temperature calculation module, configured to calculate the electronic device temperature of the electronic device based on the second heat dissipation and the circuit board temperature; an average heat exchange water temperature calculation module, configured to calculate an average heat exchange water temperature in the radiator based on the electronic device temperature, the first heat dissipation amount, and a first thermal resistance between the electronic device and the water in the radiator, the average heat exchange water temperature being an average of the heat exchange temperatures between the radiator and the electronic device; The water temperature calculation module is used to estimate the water temperature at the pipe end of the radiator under the condition that the temperature distribution of the heat exchange system is stable based on the average water exchange temperature.

13. An electronic device, characterized in that: include: at least one processor; as well as, a memory communicatively connected to at least one of the processors; wherein, The memory stores instructions that can be executed by at least one processor, and the instructions are executed by at least one processor to enable at least one processor to perform the water temperature estimation method according to any one of claims 1 to 11.

14. A storage medium, characterized in that The storage medium stores computer instructions, and when a computer executes the computer instructions, it is used to execute all steps of the water temperature estimation method according to any one of claims 1 to 11.

15. A vehicle, characterized in that: It includes the water temperature estimation device as claimed in claim 12, or the electronic device as claimed in claim 13.

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