Water temperature estimation method and device, electronic equipment, storage medium and vehicle

Abstract

The invention discloses a water temperature estimation method and device, electronic equipment, a storage medium and a vehicle. The method comprises the steps of obtaining heating electric power of an electronic device and a circuit board temperature; calculating a cold start heat coefficient according to the difference between a first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in the steady-state stage and a second heat dissipation temperature transferred to the heat dissipation element by the electronic device at the current moment; when the electronic device is in the cold start stage, the heat dissipating capacity of the electronic device under the heating electric power is corrected according to the cold start heat coefficient to obtain cold start corrected heat dissipating capacity; and estimating the waterway end water temperature of the heat dissipation element according to the cold start correction heat dissipation capacity. According to the invention, the heat dissipating capacity is corrected through the cold start heat coefficient, so that the corrected heat dissipating capacity accords with the temperature distribution in the cold start stage, and the accurate water temperature of the end part of the waterway of the heat dissipating element when the electronic device is in the cold start stage can be estimated through the temperature of the temperature measuring point on the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field related to vehicles, and in particular to a water temperature estimation method, device, electronic equipment, storage medium and vehicle. Background Art

[0002] When cooling electronic devices, such as chips, a temperature sensor is usually set to measure the temperature in order to monitor the temperature of the electronic device. In addition, the electronic device will be connected to a heat dissipation element, and heat conduction is performed through water in the heat dissipation element to achieve heat dissipation.

[0003] In order to monitor the end water temperature in the water circuit of the heat dissipation element, for example, to monitor the water temperature at the water circuit outlet and the water circuit inlet, it is necessary to monitor the water temperature in the water circuit.

[0004] In order to reduce costs, the water temperature at the end of the water path of the heat dissipation element connected to the electronic device can be determined by the thermal resistance model of the electronic device, thereby reducing the use of water temperature sensors.

[0005] However, when an electronic device is started, it will go through a cold start stage and a steady-state stage. The existing thermal resistance model is based on steady-state heat flow. It has a higher accuracy after the temperature distribution stabilizes, but has a larger error during the cold start stage of the electronic device. Therefore, the existing technology is inaccurate in estimating the water temperature at the end of the water path during the cold start stage of the electronic device. Summary of the invention

[0006] Based on this, it is necessary to provide a water temperature estimation method, device, electronic device, storage medium and vehicle to address the technical problem of inaccurate water temperature estimation at the end of the water channel during the cold start phase of electronic devices in the prior art.

[0007] The present invention provides a water temperature estimation method, comprising:

[0008] Acquiring the heating power of the electronic device and the temperature of the circuit board; the electronic device is fixed on the circuit board, and the electronic device is connected to a heat dissipation element in contact with the water channel;

[0009] Calculating a cold start heat coefficient according to a difference between a first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in a steady state stage and a second heat dissipation temperature transferred to the heat dissipation element by the electronic device at a current moment, wherein the cold start heat coefficient represents the ability of the electronic device to conduct heat in a cold start stage;

[0010] When the electronic device is in a cold start stage, the heat dissipation of the electronic device under the heating electric power is corrected according to the cold start heat coefficient to obtain a cold start corrected heat dissipation, wherein the cold start corrected heat dissipation is the heat dissipation of the electronic device under the heating electric power during the cold start stage;

[0011] The water temperature at the end of the water path of the heat dissipation element is estimated according to the cold start corrected heat dissipation and the circuit board temperature.

[0012] Furthermore, the method further comprises:

[0013] The first heat dissipation temperature and the second heat dissipation temperature are calculated based on the circuit board temperature, the estimated water temperature estimated in the steady-state stage, and the estimated temperature of the electronic device estimated in the steady-state stage. The estimated water temperature is an estimated value of the water temperature in the heat dissipation element connected to the electronic device calculated based on the circuit board temperature in the steady-state stage. The estimated electronic device temperature is an estimated value of the electronic device temperature calculated based on the circuit board temperature in the steady-state stage.

[0014] Further, the calculating the first heat dissipation temperature includes:

[0015] Calculating a first heat conduction error function operator when the electronic device ends cold start according to the distance between the electronic device and the water channel and the cold start time of the electronic device;

[0016] The first heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the first heat conduction error function operator.

[0017] Further:

[0018] The calculating of the first heat conduction error function operator at the end of the cold start of the electronic device according to the distance between the electronic device and the water channel and the cold start time of the electronic device comprises: calculating the first heat conduction error function operator as in, is the first heat conduction error function operator, L x is the distance between the electronic device and the waterway, t e is the cold start time of the electronic device, a is the temperature diffusion coefficient;

[0019] The calculating the first heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the first heat conduction error function operator includes: calculating the first heat dissipation temperature as:

[0020] Among them, T x,stable is the first heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0021] Further, the calculating the second heat dissipation temperature includes:

[0022] Calculating a second heat conduction error function operator at a current moment during a cold start process of the electronic device according to the distance between the electronic device and the water channel;

[0023] The second heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the second heat conduction error function operator.

[0024] Further:

[0025] The calculating of the second heat conduction error function operator at the current moment during the cold start process of the electronic device according to the distance between the electronic device and the water channel comprises: calculating the second heat conduction error function operator as in, is the second heat conduction error function operator, L x is the distance between the electronic device and the waterway, t is the time elapsed from the cold start of the electronic device to the current time, and a is the temperature diffusion coefficient;

[0026] The calculating the second heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator includes: calculating the second heat dissipation temperature Among them, T x,t is the second heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0027] Furthermore, the cold start heat coefficient is calculated according to the difference between the first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state stage and the second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment, including:

[0028] Calculate the cold start heat coefficient as: Among them, k transient is the cold start heat coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, T w ' is the estimated water temperature under steady state stage.

[0029] Furthermore, the method further comprises:

[0030] When the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state judgment value, then the current stage of the electronic device is judged to be a cold start stage, otherwise, the current stage of the electronic device is judged to be a steady state stage;

[0031] When the electronic device is powered off, the current stage of the electronic device is cleared.

[0032] Furthermore, the step of correcting the heat dissipation of the electronic device under the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation includes:

[0033] Calculate the cold start corrected heat dissipation as: Q transient =k transient Q, where Q transient is the cold start corrected heat dissipation, Q is the heat generated per unit time of the electronic device calculated based on the heat generation power, k transient is the cold start heat coefficient.

[0034] Further:

[0035] The step of correcting the heat dissipation of the electronic device at the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation comprises:

[0036] Calculating a first heat dissipation amount of heat dissipated by the electronic device to the heat dissipation element and a second heat dissipation amount of heat dissipated by the electronic device to the circuit board according to the cold start corrected heat dissipation amount;

[0037] The estimating the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation and the circuit board temperature includes:

[0038] Calculate the temperature of the electronic device at the location of the electronic device according to the second heat dissipation and the circuit board temperature and based on the second thermal resistance between the temperature measurement point and the electronic device;

[0039] Calculate the average heat exchange water temperature in the heat dissipation element according to the temperature of the electronic device and the first heat dissipation amount, based on the first thermal resistance between the electronic device and the water path, wherein the average heat exchange water temperature is the average value of the heat exchange temperature between the heat dissipation element and the electronic device;

[0040] The water temperature at the end of the water path of the heat dissipating element is estimated according to the average water exchange water temperature.

[0041] Further:

[0042] The first heat dissipation amount of the electronic device to the heat dissipation element and the second heat dissipation amount of the electronic device to the circuit board are calculated according to the cold start corrected heat dissipation amount, including: calculating the first heat dissipation amount as: Q1 = (1-k) Q transient , the second heat dissipation is: Q2 = kQ transient , where Q1 is the first heat dissipation, Q2 is the second heat dissipation, Q transient Correcting heat dissipation for said cold start;

[0043] The calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device includes: calculating the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance;

[0044] The calculating, based on the temperature of the electronic device and the first heat dissipation amount and the first thermal resistance between the electronic device and the water path, the average water exchange temperature in the heat dissipation element comprises: calculating the average water exchange temperature as: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0045] Furthermore, the water temperature at the end of the water channel of the heat dissipating element includes the water temperature at the water channel inlet, and the estimating the water temperature at the end of the water channel of the heat dissipating element according to the average water exchange water temperature includes:

[0046] According to the structural thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer and the area of ​​each layer, the thermal conduction resistance from the electronic device to the heat dissipation element is calculated as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers;

[0047] The wall temperature of the heat dissipation element in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction thermal resistance;

[0048] The estimated water temperature at the waterway inlet is: Among them, T in is the water temperature at the water channel inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, Tw is the average water exchange temperature, T wall is the wall temperature.

[0049] Furthermore, the water temperature at the end of the water channel of the heat dissipating element also includes the water temperature at the water channel outlet, and the estimating the water temperature at the end of the water channel of the heat dissipating element according to the average water exchange water temperature specifically includes:

[0050] The estimated water temperature at the waterway outlet is: Among them, T out is the water temperature at the water channel outlet, R is the heat exchange area per unit length, and L is the water channel length.

[0051] The present invention provides a water temperature estimation device, comprising:

[0052] An acquisition module is used to acquire the heating power of the electronic device and the temperature of the circuit board; the electronic device is fixed on the circuit board, and the electronic device is connected to a heat dissipation element in contact with the water channel;

[0053] a cold start correction coefficient calculation module, used to calculate a cold start heat coefficient according to a difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state stage and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at a current moment, wherein the cold start heat coefficient represents the ability of the electronic device to conduct heat in a cold start stage;

[0054] A cold start correction module, used for correcting the heat dissipation of the electronic device under the heating electric power according to the cold start heat coefficient when the electronic device is in the cold start stage to obtain a cold start corrected heat dissipation, wherein the cold start corrected heat dissipation is the heat dissipation of the electronic device under the heating electric power during the cold start stage;

[0055] The water temperature calculation module at the end of the water path is used to estimate the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation and the circuit board temperature.

[0056] The present invention provides an electronic device, comprising:

[0057] at least one processor; and,

[0058] a memory communicatively connected to at least one of the processors; wherein,

[0059] The memory stores instructions that can be executed by at least one of the processors. The instructions are executed by at least one of the processors to enable the at least one of the processors to perform the water temperature estimation method as described above.

[0060] The present invention provides a storage medium, wherein the storage medium stores computer instructions. When a computer executes the computer instructions, the storage medium is used to execute all steps of the water temperature estimation method as described above.

[0061] The present invention provides a vehicle, comprising the water temperature estimation device as described above, or the electronic device as described above.

[0062] The present invention calculates the first heat dissipation temperature and the second heat dissipation temperature respectively according to the estimated water temperature estimated in the steady-state stage and the estimated temperature of the electronic device estimated in the steady-state stage, calculates the cold start heat coefficient according to the difference between the first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in the steady-state stage and the second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment, and then corrects the heat dissipation of the electronic device under the heating electric power based on the cold start heat coefficient to obtain the cold start corrected heat dissipation, and estimates the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation. Since the cold start heat coefficient characterizes the ability of the electronic device to conduct heat in the cold start stage, the present invention corrects the heat dissipation by the cold start heat coefficient so that the corrected heat dissipation conforms to the temperature distribution in the cold start stage, so that the accurate water temperature at the end of the water path of the heat dissipation element of the electronic device in the cold start stage can be estimated through the temperature of the temperature measurement point on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 This is a working flow chart of a water temperature estimation method according to an embodiment of the present invention;

[0064] Figure 2 This is a working flow chart of a water temperature estimation method according to another embodiment of the present invention;

[0065] Figure 3 A schematic diagram of a heat conduction model according to an embodiment of the present invention;

[0066] Figure 4 A flowchart for determining the current stage of an electronic device in accordance with the best embodiment of the present invention;

[0067] Figure 5 This is a schematic diagram of building a waterway flow model according to an example of the present invention;

[0068] Figure 6 A schematic diagram of the calculation effect of an example of the present invention;

[0069] Figure 7 A schematic diagram of a water temperature estimation device according to an embodiment of the present invention;

[0070] Figure 8 The figure is a schematic diagram of the hardware structure of an electronic device of the present invention. DETAILED DESCRIPTION

[0071] The specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. The same components are represented by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the accompanying drawings, and the words "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0072] like Figure 1 The figure shows a working flow chart of a water temperature estimation method according to an embodiment of the present invention, comprising:

[0073] Step S101, obtaining the heating power of the electronic device and the temperature of the circuit board; the electronic device is fixed on the circuit board, and the electronic device is connected to a heat dissipation element in contact with the water channel;

[0074] Step S102, calculating a cold start heat coefficient according to a difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state stage and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at a current moment, wherein the cold start heat coefficient represents the ability of the electronic device to conduct heat in a cold start stage;

[0075] Step S103, when the electronic device is in a cold start stage, the heat dissipation of the electronic device under the heating electric power is corrected according to the cold start heat coefficient to obtain a cold start corrected heat dissipation, wherein the cold start corrected heat dissipation is the heat dissipation of the electronic device under the heating electric power during the cold start stage;

[0076] Step S104 , estimating the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation and the circuit board temperature.

[0077] Specifically, the present invention can be applied to electronic devices with processing capabilities, such as an electronic control unit (ECU) or an extended domain control unit (XCU) of a vehicle.

[0078] Specifically, first, the electronic device executes step S101 to obtain the heating power of the electronic device and the temperature of the circuit board.

[0079] In some embodiments, the electronic device is a chip.

[0080] like Figure 3The figure shows a schematic diagram of a heat conduction model of an embodiment of the present invention, including an electronic device 1, a circuit board 2 and a heat dissipation element 3. The heat source is the heat generation power of the electronic device 1, which is completely converted into heat because it does not need to do work externally. The circuit board 2 (Printed Circuit Board, PCB) connected to the electronic device 1 has poor thermal conductivity, so the heat dissipation Q to the environment is 环 It can be ignored. The heat generated by the electronic device 1 is transferred through the circuit board 2 and the connected heat dissipation element 3 respectively. The heat dissipation element 3 is preferably a heat dissipation plate, such as a heat dissipation aluminum plate. The heat dissipation element contacts the cooling water in the water channel and transfers the heat to the cooling water. The water channel refers to a passage formed by the heat dissipation element for the circulation of cooling water. The heat dissipated through the heat dissipation element 3 accounts for more than 90% of the total amount. The electronic device 1 is connected to the heat dissipation element 3 through the heat conductive structure 4. The heat dissipated by the electronic device 1 to the water through the heat dissipation element 3 is Q 水 .

[0081] A sensor is provided at the temperature measurement point 21 of the circuit board 2 to obtain the temperature of the circuit board through the sensor, wherein the distance from the temperature measurement point 21 to the center position of the electronic device 1 is the sensor measurement distance L2.

[0082] Then, step S102 is executed to calculate the cold start thermal coefficient according to the difference between the first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in a steady state stage and the second heat dissipation temperature transferred to the heat dissipation element by the electronic device at the current moment. The cold start thermal coefficient represents the ability of the electronic device to conduct heat in the cold start stage.

[0083] Among them, the state of the electronic device is in the steady state stage during normal use, and after powering off, when powering on again, the electronic device transitions from the cold start stage to the steady state stage. The temperature changes greatly in the cold start stage, while the temperature changes less in the steady state stage. Therefore, by judging whether the electronic device is in the cold start stage, and in the cold start stage, according to the difference between the first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in the steady state stage and the second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment, the cold start heat coefficient is calculated. The cold start heat coefficient characterizes the ability of the electronic device to conduct heat in the cold start stage, and is used to describe the difference between the temperature distribution in the cold start stage and the temperature distribution in the steady state stage.

[0084] In some embodiments, calculating the cold start heat coefficient according to the difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment includes:

[0085] According to the cold start heat transfer model, the cold start heat coefficient at the current moment is determined according to the difference between the first heat dissipation temperature and the estimated water temperature estimated in the steady state stage, and the difference between the second heat dissipation temperature and the estimated water temperature.

[0086] Then, when the current stage of the electronic device is a cold start stage, step S103 is executed to correct the heat dissipation of the electronic device under the heating power according to the cold start heat coefficient to obtain a cold start corrected heat dissipation.

[0087] Specifically, the heat generation power of the electronic device can be used as the heat dissipation per unit time of the electronic device. The heat dissipation is corrected by the cold start heat coefficient correction to obtain the cold start corrected heat dissipation.

[0088] Finally, step S104 is executed to estimate the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation and the circuit board temperature.

[0089] Specifically, the average water exchange temperature is calculated based on the cold start corrected heat dissipation calculated in step S103, and the water temperature at the end of the water channel of the heat dissipation element is estimated based on the average water exchange temperature. The average water exchange temperature is the average value of the heat exchange temperature between the heat dissipation element and the electronic device. Since the water in the heat dissipation element flows in from the water channel inlet, exchanges heat between the heat dissipation element and the electronic device, and then flows out from the water channel outlet, the water temperature at the end of the water channel in the heat dissipation element is different from the average water exchange temperature. In order to obtain the water temperature at the end of the water channel, the wall temperature of the heat dissipation element in contact with the water can be calculated based on the average water exchange temperature. Steady-state heat exchange means that the temperature distribution in the entire heat exchange system, including the electronic components as heat sources and the heat transfer elements for heat dissipation, does not change, wherein the temperature distribution does not change means that the temperature of each point does not change or changes very slightly. Under uniform wall temperature conditions, based on the wall temperature, the relationship between the average water exchange temperature and the water temperature at the end of the water channel in the heat dissipation element can be obtained. Thus, the water temperature at the end of the water channel in the heat dissipation element is estimated based on the average water exchange temperature.

[0090] In some embodiments, the water temperature at the end of the water channel is the water temperature at the water channel inlet or the water temperature at the water channel outlet.

[0091] The present invention calculates the first heat dissipation temperature and the second heat dissipation temperature respectively according to the estimated water temperature estimated in the steady-state stage and the estimated temperature of the electronic device estimated in the steady-state stage, calculates the cold start heat coefficient according to the difference between the first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in the steady-state stage and the second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment, and then corrects the heat dissipation of the electronic device under the heating electric power based on the cold start heat coefficient to obtain the cold start corrected heat dissipation, and estimates the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation. Since the cold start heat coefficient characterizes the ability of the electronic device to conduct heat in the cold start stage, the present invention corrects the heat dissipation by the cold start heat coefficient so that the corrected heat dissipation conforms to the temperature distribution in the cold start stage, so that the accurate water temperature at the end of the water path of the heat dissipation element of the electronic device in the cold start stage can be estimated through the temperature of the temperature measurement point on the circuit board.

[0092] like Figure 2 The flowchart of a water temperature estimation method in another embodiment of the present invention is shown, comprising:

[0093] Step S201, obtaining the heating power of the electronic device and the temperature of the circuit board; the electronic device is fixed on the circuit board, and the electronic device is connected to a heat dissipation element in contact with the water channel.

[0094] Step S202, calculating the first heat dissipation temperature and the second heat dissipation temperature according to the circuit board temperature, the estimated water temperature estimated in the steady state stage and the estimated temperature of the electronic device estimated in the steady state stage, wherein the estimated water temperature is an estimated value of the water temperature in the heat dissipation element connected to the electronic device calculated according to the circuit board temperature in the steady state stage, and the estimated temperature of the electronic device is an estimated value of the temperature of the electronic device calculated according to the circuit board temperature in the steady state stage.

[0095] In one embodiment, the calculating the first heat dissipation temperature includes:

[0096] Calculating a first heat conduction error function operator when the electronic device ends cold start according to the distance between the electronic device and the water channel and the cold start time of the electronic device;

[0097] The first heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the first heat conduction error function operator.

[0098] In one embodiment:

[0099] The calculating of the first heat conduction error function operator at the end of the cold start of the electronic device according to the distance between the electronic device and the water channel and the cold start time of the electronic device comprises: calculating the first heat conduction error function operator as in, is the first heat conduction error function operator, L x is the distance between the electronic device and the waterway, t e is the cold start time of the electronic device, a is the temperature diffusion coefficient;

[0100] The calculating the first heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the first heat conduction error function operator includes: calculating the first heat dissipation temperature as Among them, T x,stable is the first heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0101] In one embodiment, the calculating the second heat dissipation temperature includes:

[0102] Calculating a second heat conduction error function operator at a current moment during a cold start process of the electronic device according to the distance between the electronic device and the water channel;

[0103] The second heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the second heat conduction error function operator.

[0104] In one embodiment:

[0105] The calculating of the second heat conduction error function operator at the current moment during the cold start process of the electronic device according to the distance between the electronic device and the water channel comprises: calculating the second heat conduction error function operator as in, is the second heat conduction error function operator, L x is the distance between the electronic device and the waterway, t is the time from the cold start of the electronic device to the current time, and a is the temperature diffusion coefficient;

[0106] The calculating the second heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator includes: calculating the second heat dissipation temperature Among them, T x,t is the second heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0107] Step S203 , calculating a cold start heat coefficient according to a difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at a current moment.

[0108] In one embodiment, calculating the cold start heat coefficient according to the difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment includes:

[0109] Calculate the cold start heat coefficient as: Among them, k transient is the cold start heat coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, T w ' is the estimated water temperature under steady state stage.

[0110] Step S204, when the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state judgment value, then the current stage of the electronic device is judged to be a cold start stage, otherwise the current stage of the electronic device is judged to be a steady state stage; when the electronic device is powered off, the current stage of the electronic device is cleared.

[0111] Step S205 , when the current stage of the electronic device is a cold start stage, the heat dissipation of the electronic device under the heating electric power is corrected according to the cold start heat coefficient to obtain a cold start corrected heat dissipation.

[0112] In one embodiment, the step of correcting the heat dissipation of the electronic device at the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation includes:

[0113] Calculate the cold start corrected heat dissipation as: Q transient =k transient Q, where Q transient is the cold start corrected heat dissipation, Q is the heat generated per unit time of the electronic device calculated based on the heat generation power, k transient is the cold start heat coefficient.

[0114] Step S206, calculating a first heat dissipation amount of heat dissipated by the electronic device to the heat dissipation element and a second heat dissipation amount of heat dissipated by the electronic device to the circuit board according to the cold start corrected heat dissipation amount;

[0115] Step S207, calculating the temperature of the electronic device at the location of the electronic device according to the second heat dissipation and the circuit board temperature and based on a second thermal resistance between the temperature measurement point and the electronic device;

[0116] Step S208, calculating an average heat exchange water temperature in the heat dissipation element according to the temperature of the electronic device, the first heat dissipation, and a first thermal resistance between the electronic device and the water path, wherein the average heat exchange water temperature is an average value of the heat exchange temperatures between the heat dissipation element and the electronic device.

[0117] In one embodiment:

[0118] The first heat dissipation amount of the electronic device to the heat dissipation element and the second heat dissipation amount of the electronic device to the circuit board are calculated according to the cold start corrected heat dissipation amount, including: calculating the first heat dissipation amount as: Q1 = (1-k) Q transient , the second heat dissipation is: Q2 = kQ transient , where Q1 is the first heat dissipation, Q2 is the second heat dissipation, Q transient Correcting heat dissipation for said cold start;

[0119] The calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device includes: calculating the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance;

[0120] The calculating, based on the temperature of the electronic device and the first heat dissipation amount and the first thermal resistance between the electronic device and the water path, the average water exchange temperature in the heat dissipation element comprises: calculating the average water exchange temperature as: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0121] Step S209, estimating the water temperature at the end of the water path of the heat dissipation element according to the average water exchange water temperature.

[0122] In one embodiment, the water temperature at the end of the water channel of the heat dissipating element includes the water temperature at the water channel inlet, and estimating the water temperature at the end of the water channel of the heat dissipating element according to the average water exchange water temperature includes:

[0123] According to the structural thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer and the area of ​​each layer, the thermal conduction resistance from the electronic device to the heat dissipation element is calculated as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers;

[0124] The wall temperature of the heat dissipation element in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction thermal resistance;

[0125] The estimated water temperature at the waterway inlet is: Among them, T in is the water temperature at the water channel inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0126] In one embodiment, the water temperature at the end of the water path of the heat dissipating element also includes the water temperature at the water path outlet, and the estimating the water temperature at the end of the water path of the heat dissipating element according to the average water exchange water temperature specifically includes:

[0127] The estimated water temperature at the waterway outlet is: Among them, T out is the water temperature at the water channel outlet, R is the heat exchange area per unit length, and L is the water channel length.

[0128] Specifically, step S201 is first performed to obtain the heating power of the electronic device and the temperature of the circuit board.

[0129] Then, step S202 is performed to calculate the first heat dissipation temperature and the second heat dissipation temperature according to the circuit board temperature, the estimated water temperature estimated in the steady state stage, and the estimated temperature of the electronic device estimated in the steady state stage.

[0130] The estimated water temperature is an estimated value of the water temperature in the heat dissipation element connected to the electronic device calculated according to the circuit board temperature in the steady state stage, and the estimated temperature of the electronic device is an estimated value of the temperature of the electronic device calculated according to the circuit board temperature in the steady state stage. In the steady state process, the thermal resistance between the chip and the water changes depending on the physical properties. Therefore, the chip operating temperature can be estimated based on the water temperature. Therefore, the estimated water temperature and the estimated temperature of the electronic device can be calculated in the steady state stage.

[0131] In some embodiments, the method further comprises:

[0132] The temperature of the electronic device in the steady state stage and the predicted value of the water temperature in the heat dissipation element in the steady state stage are calculated according to the thermal resistance steady-state model, and the temperature of the electronic device in the steady state stage is used as the estimated temperature of the electronic device, and the predicted value of the water temperature in the heat dissipation element in the steady state stage is used as the estimated water temperature.

[0133] Among them, the thermal resistance steady-state model includes:

[0134] The first steady-state heat dissipation relationship: Q1' = (1-k) Q;

[0135] The second steady-state heat dissipation relationship: Q2' = kQ;

[0136] The temperature relationship of electronic devices in the steady state stage is: T e ' = T2 + Q2' · R2;

[0137] The water temperature relationship for calculating the predicted water temperature in the heat dissipation element in the steady state stage is: T w '=T e '-R1·Q1';

[0138] Among them, Q1' is the first steady-state heat dissipation, Q2' is the second steady-state heat dissipation, Q is the heat generated per unit time of the electronic device calculated based on the heating power, k is the steady-state heat transfer ratio, T e ' is the temperature of the electronic device in the steady state stage, T2 is the sensor temperature, R2 is the second thermal resistance, T w ' is the predicted value of the water temperature in the heat dissipation element in the steady state stage, and R1 is the first thermal resistance.

[0139] After the temperature of the electronic device in the steady state phase is used as the estimated temperature of the electronic device and the average water exchange temperature in the heat dissipation element in the steady state phase is used as the estimated water temperature, the first heat dissipation temperature and the second heat dissipation temperature are calculated respectively.

[0140] In one embodiment, the calculating the first heat dissipation temperature includes:

[0141] Calculating a first heat conduction error function operator when the electronic device ends cold start according to the distance between the electronic device and the water channel and the cold start time of the electronic device;

[0142] The first heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the first heat conduction error function operator.

[0143] Specifically, the heat conduction error function operator is:

[0144]

[0145] in, is the heat conduction error function operator, L x is the distance between the electronic device and the water channel, t is the time, and a is the temperature diffusion coefficient.

[0146] The a in formula (1) is the temperature diffusion coefficient, which represents the temperature diffusion capacity, and the calculation method is:

[0147]

[0148] Where ρ is the equivalent density of the heat transfer material between the electronic device and the water, λ is the equivalent thermal conductivity of the heat transfer material between the electronic device and the water, C P is the equivalent specific heat at constant pressure of the heat transfer material between the electronic device and the water. Specifically, the equivalent density may be the average density of each layer of heat transfer material between the electronic device and the water, the equivalent thermal conductivity may be the average thermal conductivity of each layer of heat transfer material between the electronic device and the water, and the equivalent specific heat at constant pressure may be the average specific heat at constant pressure of each layer of heat transfer material between the electronic device and the water.

[0149] In one embodiment:

[0150] The calculating of the first heat conduction error function operator at the end of the cold start of the electronic device according to the distance between the electronic device and the water channel and the cold start time of the electronic device comprises: calculating the first heat conduction error function operator as in, is the first heat conduction error function operator, L x is the distance between the electronic device and the waterway, t e is the cold start time of the electronic device, a is the temperature diffusion coefficient;

[0151] The calculating the first heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the first heat conduction error function operator includes: calculating the first heat dissipation temperature as Among them, T x,stable is the first heat dissipation temperature, T e 'Estimate the temperature of the electronic device, Tw ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0152] Specifically, the heat transfer from the electronic device to the test temperature point of the circuit board and the water channel heat exchange wall is equal area conductor heat transfer, so the distance L from the water channel to the electronic device is estimated. x At the same time, through experimental testing, the total time from the start of the electronic device to the steady state stage is recorded as the cold start time t e .

[0153] Then, the distance L from the waterway to the electronic device x And the cold start time t e Substituting into formula (1), we get the first heat conduction error function operator: in, is the first heat conduction error function operator, L x is the distance between the electronic device and the waterway, t e is the cold start time of the electronic device, and a is the temperature diffusion coefficient.

[0154] Then, the first heat dissipation temperature of the heat dissipation element, i.e., the distance L from the electronic device x The temperature of the electronic device after the cold start time. Therefore, the first heat conduction error function operator is integrated from 0 to determine the first heat dissipation temperature of the heat dissipation element at the end of the cold start of the electronic device:

[0155]

[0156] Among them, T x,stable is the first heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0157] In this embodiment, the first heat dissipation temperature of the heat dissipation element is determined by a heat conduction error function operator.

[0158] At the same time, at each sampling moment, the second heat dissipation temperature is calculated.

[0159] In one embodiment, the calculating the second heat dissipation temperature includes:

[0160] Calculating a second heat conduction error function operator at a current moment during a cold start process of the electronic device according to the distance between the electronic device and the water channel;

[0161] The second heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the second heat conduction error function operator.

[0162] Specifically, at each sampling moment, the second heat conduction error function operator is calculated by formula (1), and then the second heat dissipation temperature is calculated by the second heat conduction error function operator.

[0163] In one embodiment:

[0164] The calculating of the second heat conduction error function operator at the current moment during the cold start process of the electronic device according to the distance between the electronic device and the water channel comprises: calculating the second heat conduction error function operator as in, is the second heat conduction error function operator, L x is the distance between the electronic device and the waterway, t is the time from the cold start of the electronic device to the current time, and a is the temperature diffusion coefficient;

[0165] The calculating the second heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator includes: calculating the second heat dissipation temperature Among them, T x,t is the second heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0166] Specifically, the distance L from the waterway to the electronic device x Substitute the current time t into formula (1) to obtain the second heat conduction error function operator in, is the second heat conduction error function operator, L x is the distance between the electronic device and the water channel, t is the time from the cold start of the electronic device to the current time, and a is the temperature diffusion coefficient.

[0167] Then, the second heat dissipation temperature is the distance L from the electronic device. x The temperature of the electronic device at the current moment. Therefore, the second heat dissipation temperature is determined by integrating from 0 to the second heat conduction error function operator:

[0168]

[0169] Among them, T x,t is the second heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0170] This embodiment determines the second heat dissipation temperature of the heat dissipation element through a heat conduction error function operator.

[0171] Then, step S203 is performed to calculate the cold start heat coefficient according to the difference between the first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state and the second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment.

[0172] The temperature difference between the heat transfer end and the water temperature determines the magnitude of heat conduction. Therefore, this embodiment calculates the cold start heat coefficient at the current moment according to the first heat dissipation temperature and the second heat dissipation temperature to calculate the heat exchange amount during the cold start stage.

[0173] In one embodiment, calculating the cold start heat coefficient according to the difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment includes:

[0174] Calculate the cold start heat coefficient as: Among them, k transient is the cold start heat coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, T w ' is the estimated water temperature.

[0175] Specifically, the cold start heat coefficient is calculated as:

[0176]

[0177] Among them, k transient is the cold start heat coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, T w ' is the estimated water temperature.

[0178] In this embodiment, an accurate cold start heat coefficient is determined according to the second heat dissipation temperature and the first heat dissipation temperature.

[0179] Then, step S204 is executed to determine whether the current stage of the electronic device is a cold start stage. When the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state determination value, it is determined that the current stage of the electronic device is a cold start stage; otherwise, it is determined that the current stage of the electronic device is a steady state stage. When the electronic device is powered off, the current stage of the electronic device is cleared.

[0180] After the electronic device is powered on, the electronic device first goes through a cold start stage, during which the temperature rises rapidly. After that, the temperature reaches a stable state, and the temperature difference dT between the circuit board temperatures at two consecutive sampling moments is 0, entering the steady state stage and remaining in it. In the steady state stage, the temperature may have slight fluctuations. Among them, when dT = 0, it is the steady state, and when 0 < |dT| < T 阈值 it is the quasi-steady state, and T 阈值 is a very small temperature threshold. Both the steady state and the quasi-steady state are in the steady state stage.

[0181] Specifically, as Figure 4 shown in the flowchart of the method for determining the current stage of the electronic device in the best embodiment of the present invention. The electronic device is a chip, and the method includes:

[0182] Step S401, if the chip is powered off, then step S402 is executed; otherwise, the current stage of the chip remains the steady state stage;

[0183] Step S402, the chip goes into sleep;

[0184] Step S403, the chip is powered on;

[0185] Step S404, if |T2 - T x,t | < Limit, it is determined to be the steady state stage; otherwise, it is determined to be the cold start stage.

[0186] Among them, Limit is the preset state determination value, T2 is the circuit board temperature, and T x,t is the second heat dissipation temperature calculated according to formula (4). When the absolute value of the difference between the two is less than the state determination value, the current stage of the chip is determined to be the steady state. After entering the steady state, when the chip is powered off, the state is cleared and the state is re-judged after power-on. When the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to the state determination value, the current stage of the chip is determined to be the cold start state. During the entire cold start process, the second heat dissipation temperature is calculated and compared with the circuit board temperature at each sampling moment to determine whether the current stage still remains the cold start stage.

[0187] Then, when the current stage of the electronic device is the cold start stage, execute steps S205 to S208, and calculate the average heat exchange water temperature in the heat dissipation element connected to the electronic device according to the cold start heat coefficient, the heat generation electric power, and the circuit board temperature. The average heat exchange water temperature is the average value of the heat exchange temperatures between the heat dissipation element and the electronic device.

[0188] Specifically, the cold start heat coefficient, the heating electric power, and the circuit board temperature are input into the thermal resistance cold start model, and the average water exchange water temperature output by the thermal resistance cold start model is obtained as the average water exchange water temperature. The thermal resistance cold start model uses the cold start heat coefficient, the heating electric power, and the circuit board temperature as input variables, and outputs the average water exchange water temperature based on thermal resistance.

[0189] Specifically, the cold start heat coefficient calculated by formula (5) at the current moment, as well as the collected heat generation power and circuit board temperature, are input into the thermal resistance cold start model to obtain the average water exchange temperature output by the thermal resistance cold start model.

[0190] The thermal resistance cold start model at least includes: a heat dissipation distribution equation, a device temperature equation and a water temperature equation, that is, includes steps S205 to S208.

[0191] Step S205 is executed to correct the heat dissipation of the electronic device under the heating power according to the cold start heat coefficient to obtain a cold start corrected heat dissipation when the current stage of the electronic device is a cold start stage.

[0192] In one embodiment, the step of correcting the heat dissipation of the electronic device at the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation includes:

[0193] The step of correcting the heat dissipation of the electronic device at the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation comprises:

[0194] Calculate the cold start corrected heat dissipation as: Q transient =k transient Q, where Q transient is the cold start corrected heat dissipation, Q is the heat generated per unit time of the electronic device calculated based on the heat generation power, k transient is the cold start heat coefficient.

[0195] Specifically, the cold start corrected heat dissipation is calculated based on the cold start heat transfer coefficient:

[0196] Q transient =k transient Q (6)

[0197] Among them, Q transient is the cold start corrected heat dissipation, Q is the heat generated per unit time of the electronic device calculated based on the heat generation power, k transient is the cold start heat coefficient.

[0198] Then, step S206 is performed to calculate a first heat dissipation amount of heat dissipated from the electronic device to the heat dissipation element and a second heat dissipation amount of heat dissipated from the electronic device to the circuit board according to the cold start corrected heat dissipation amount.

[0199] In one embodiment, the first heat dissipation of the electronic device to the heat dissipation element and the second heat dissipation of the electronic device to the circuit board are calculated according to the cold start corrected heat dissipation, including: calculating the first heat dissipation as: Q1 = (1-k) Q transient , the second heat dissipation is: Q2 = kQ transient , where Q1 is the first heat dissipation, Q2 is the second heat dissipation, Q transient Corrected heat dissipation for the cold start

[0200] According to the current stage of the electronic device determined in step S204, it is determined whether to use Q or Q transient Calculate the following process, if it is a cold start phase, use Q transient If Q is used in the steady-state stage, the following calculation is based on the dynamic situation.

[0201] Based on the heating power, the heat dissipation per unit time Q of the electronic device can be calculated as the product of the heating power and the unit time. Then the heat dissipation per unit time of the electronic device can be decomposed into the first heat dissipation Q1 through the heat dissipation element and the second heat dissipation Q2 through the circuit board. The heat dissipation element is preferably an aluminum plate.

[0202] The heat dissipation distribution relationship is:

[0203] Q1=(1-k)Q transient (7)

[0204] Q2=kQ transient (8)

[0205] Wherein, Q1 is the first heat dissipation, and Q2 is the second heat dissipation.

[0206] If it is a steady-state stage, then Q1 = (1-k)Q, Q2 = kQ.

[0207] This embodiment combines the cold start correction heat dissipation to determine the first heat dissipation through the heat dissipation element and the second heat dissipation through the circuit board.

[0208] Then, step S207 is executed to calculate the temperature of the electronic device at the location of the electronic device according to the second heat dissipation and the circuit board temperature and based on the second thermal resistance between the temperature measurement point and the electronic device.

[0209] In one embodiment, the calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and based on the second thermal resistance between the temperature measurement point and the electronic device includes: calculating the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

[0210] Specifically, assuming that the temperature distribution from the center of the electronic device to the circuit board conforms to the circular distribution in a steady state, the heat dissipation per unit time in the radial direction is:

[0211]

[0212] Where Q is the radial heat dissipation per unit time of the electronic device, that is, the heat generation power of the electronic device. R is the radial distance of the chip, δ is the thickness of the circuit board, λ is the thermal conductivity, A is the heat exchange area, λ PCB is the thermal conductivity of the circuit board. The second thermal resistance from the temperature measurement point to the electronic device can be obtained by integrating formula (4) from L1 to L2, that is:

[0213]

[0214] Wherein, R2 is the second thermal resistance, L2 is the sensor measurement distance from the temperature measurement point to the center of the electronic device, L1 is the radius of the electronic device, δ is the thickness of the circuit board, λ PCB is the thermal conductivity of the circuit board.

[0215] Then, during the cold start phase, the temperature of the electronic device can be calculated using the device temperature relationship, formula (11):

[0216] T e =T2+Q2·R2 (11)

[0217] Among them, T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance.

[0218] This embodiment determines the accurate temperature of the electronic device through the second thermal resistance.

[0219] Then, step S208 is executed to calculate the average heat exchange water temperature in the heat dissipation element according to the temperature of the electronic device, the first heat dissipation, and the first thermal resistance between the electronic device and the water path. The average heat exchange water temperature is the average value of the heat exchange temperature between the heat dissipation element and the electronic device.

[0220] In one embodiment, the calculating the average water exchange temperature in the heat dissipation element based on the temperature of the electronic device, the first heat dissipation, and the first thermal resistance between the electronic device and the water path includes: calculating the average water exchange temperature as: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0221] Specifically, the first thermal resistance is calculated. Figure 3 As shown, the first thermal resistance is the thermal conduction resistance R from the electronic device 1 to the heat dissipation element 3 1,cond The convection heat transfer resistance R between the heat dissipation element 3 and water 1,conv sum.

[0222] In some embodiments, calculating the first thermal resistance includes:

[0223] Calculate the heat conduction thermal resistance from the electronic device to the heat dissipation element according to the structural thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer and the area of ​​each layer, wherein the electronic device is connected to the heat dissipation element through one or more heat-conducting structures, and the layers include multiple structural layers in the electronic device, one or more heat-conducting structures and the heat dissipation element;

[0224] Calculating the convection heat transfer thermal resistance between the heat dissipation element and water;

[0225] The first thermal resistance between the electronic device and the water in the heat dissipation element is calculated as the sum of the thermal conduction resistance and the convection resistance, that is, R1 = R 1,cond +R 1,conv , where R1 is the first thermal resistance, R 1,cond is the thermal conduction resistance, R 1,conv is the convective heat transfer thermal resistance.

[0226] Specifically, electronic devices generally include multiple structural layers. Taking a chip as an example, the structural layers of a chip generally include: substrate layer, solder layer, substrate layer, heat source layer, active layer, etc. Each structural layer has a structural thickness and area of ​​each layer, and each structural layer has a thermal conductivity coefficient of each layer according to the material of the different layers.

[0227] Therefore, the thermal resistance of heat conduction from the electronic device to the heat dissipation element is calculated according to the structural thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer and the area of ​​each layer. In addition, the layer between the electronic device and the heat dissipation element also includes a heat-conducting structure and a heat dissipation element. The heat-conducting structure includes various existing thermally conductive adhesives and thermally conductive parts. Each thermally conductive adhesive or thermally conductive part is regarded as a layer. At the same time, since the heat dissipation element is generally a flat plate, the heat dissipation element is regarded as a whole layer. The thermal resistance of heat conduction from the electronic device to the heat dissipation element is obtained by calculating the relevant parameters of each layer between the electronic device and the heat dissipation element.

[0228] In some embodiments, the heat conduction thermal resistance from the electronic device to the heat dissipation element is calculated according to the structural thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer, and the area of ​​each layer, including:

[0229] Calculate the thermal resistance of heat conduction as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers.

[0230] Specifically, the thermal conduction resistance is calculated using formula (12):

[0231]

[0232] Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers.

[0233] This embodiment provides a method for calculating the thermal conductivity.

[0234] Then the convective heat transfer thermal resistance between the heat dissipation element and the water is calculated. The convective heat transfer thermal resistance can be calculated based on the water heat exchange area.

[0235] In some embodiments, the convective heat transfer resistance between the heat dissipation element and water is calculated as: Among them, R 1,conv is the convection heat transfer thermal resistance, A w is the water heat transfer area, and α is the water heat transfer coefficient.

[0236] Finally, the water temperature in the heat dissipation element can be calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation. The water temperature in the heat dissipation element calculated according to the temperature of the electronic device, the first thermal resistance, and the first heat dissipation is the average water exchange temperature.

[0237] This embodiment calculates the average water exchange temperature in the heat dissipation element based on the thermal resistance.

[0238] The water temperature relationship is:

[0239] T w =T e -R1·Q1 (13)

[0240] Where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0241] Then, step S209 is executed to estimate the water temperature at the end of the water path of the heat dissipating element according to the average water exchange water temperature based on steady-state heat exchange.

[0242] Specifically, the average water temperature output by the thermal resistance steady-state model or the thermal resistance cold start model is used as the average water temperature. Since the water channel sensor is usually arranged upstream or downstream, the inlet and outlet water temperatures need to be calculated by the average water temperature. The first step in calculating the water temperature is to calculate the wall temperature in contact with the water.

[0243] In some embodiments, the wall temperature of the heat dissipation element wall is calculated according to the first heat dissipation and the heat conduction thermal resistance.

[0244] In some embodiments, calculating the wall temperature of the heat dissipation element wall according to the first heat dissipation amount and the heat conduction thermal resistance includes:

[0245] The wall temperature of the heat dissipation element in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0246] The first step in calculating the water temperature is to calculate the temperature of the wall in contact with the water:

[0247] T wall =T e -Q1·R 1,cond (14)

[0248] Where T wallis the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction resistance.

[0249] Then, the water temperature at the end of the water channel of the heat dissipation element is estimated according to the average water exchange water temperature and the wall temperature.

[0250] In some embodiments, the water temperature at the end of the water channel of the heat dissipation element is the water temperature at the water channel inlet, and estimating the water temperature at the end of the water channel of the heat dissipation element according to the average water exchange water temperature and the wall temperature includes:

[0251] The estimated water temperature at the waterway inlet is: Among them, T in is the water temperature at the water channel inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0252] Specifically, under the condition of uniform wall temperature, the heat transfer in the control volume can be expressed as follows:

[0253]

[0254] Where α is the water heat transfer coefficient, is the water mass flow rate, R is the heat transfer area per unit length, Cp w is the specific heat of water at constant pressure, T0 is the water temperature at position 0, usually the inlet is taken as position 0, T L is the water temperature at position L, dT water is the water temperature difference of the length differential, dx is the length differential, and L is the length of the waterway. The position from the inlet to the length x is referred to as position x, and the integral from the inlet to position x gives:

[0255]

[0256] Among them, T x is the temperature at position x, T in is the water temperature at the waterway inlet, that is, the water temperature T0 at position 0.

[0257] Then the temperature at position x is:

[0258]

[0259] The average water exchange temperature can be calculated as:

[0260]

[0261] From formula (18), the water temperature at the waterway inlet can be obtained:

[0262]

[0263] Among them, T in is the water temperature at the water channel inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0264] After obtaining the water temperature at the water channel inlet, the water channel outlet water temperature can be calculated according to formula (17). The water channel outlet water temperature T out In fact, it is the temperature T from the inlet to the position with a length of L L , therefore, the water temperature at the waterway outlet is:

[0265]

[0266] Among them, T out It is the water temperature at the waterway outlet.

[0267] In some embodiments, a waterway flow model is constructed through a neural network model to obtain water mass flow.

[0268] The neural network model is established by obtaining physical model data according to experimental data, and then expanded from the physical model data.

[0269] Specifically, the water mass flow rate of the heating element in different states is constant. The heating element is an electronic device that serves as a heat source. Therefore, the existing water flow model building method can be used to build a water flow model, and when the state of the heating element is determined, the corresponding water mass flow rate is obtained. Figure 5 As shown, firstly, the experimental data 501 is acquired, then modeling correction is performed, and the GT Power (engine working process simulation calculation software) model 502 is input, and the mapping database 503 is obtained through DoE, and the ANN flow static model 504 is obtained through feature screening, training, and verification, and the flow dynamic model 505 is obtained through the time constant.

[0270] As an example, the waterway flow model is built as follows:

[0271] 1. Obtain key flow data in the experiment, correct parameters such as pump pressure rise, component pressure drop, and along-the-way loss, build a physical model, and make corrections based on key experimental data.

[0272] 2. Build a physical model based on the experimental data and expand the experimental data. This step can calculate the branch flow that is not measured in the experiment but is relevant to the simulation. Specifically, the physical model is built through GT Power software. Then the database is mapped through the Design of Experiment (DOE). The mapping database can be regarded as a large amount of mapping data corresponding to input and output, and a neural network model can be established.

[0273] 3. Based on the data obtained in step 2, the control quantity in the system is used as the modeling feature, and the feature is expanded according to the physical meaning, as shown in Table 1. The expansion basis can be the order relationship between the pump speed and head, temperature and radiation heat transfer, and the instantaneous energy and cumulative energy entering the system.

[0274] Control volume Extended Features Pump speed Speed ​​2, Speed ​​3, temperature Water temperature 2, water temperature 3, water temperature 4 Valve opening Opening, opening 3 Engine speed, torque Engine speed*torque, ∫ speed*torque

[0275] Feature screening is performed based on the extended features, and the screening method is based on the pan-neural network GRNN with joint probability distribution.

[0276] The screening process is as follows:

[0277] 4.1 Put all the features to be selected into the set to be selected, and the selected set is an empty set at this time;

[0278] 4.2 Use the features in the candidate set to approximate the output value through GRNN, traverse the features in the candidate set, and select the feature with the minimum mean squared error (MSE) to enter the selected set;

[0279] 4.3 Then enter the iterative process, at this time the fitting target is changed to the remaining information after the output value of the feature fitting in the selected set, and the feature with the smallest MSE is selected to enter the selected set;

[0280] 4.4 Iterate in sequence until all the features in the set to be selected are traversed.

[0281] GRNN is based on probability and can better reflect the one-to-one correspondence between the control quantity as the model input and the state quantity as the model output.

[0282] 5. According to the feature order given by the screening results, the first four features that reduce the GRNN fitting MSE to 0 are selected, which can ensure accuracy and avoid feature redundancy.

[0283] 6. Randomly divide the data obtained in step 2 into training sets and test sets, establish a neural network model based on the screening features, use the K test to obtain the accuracy comparison of the model, and select the best traffic model based on the comprehensive training accuracy and test accuracy, that is, Figure 5 Static model of traffic.

[0284] 7. Build a steady-state heat exchange model of the heat exchange components in the system, for example, using the steady-state heat exchange model of this application, or various steady-state heat exchange models in the prior art, and the heat absorbed under steady-state conditions causes its temperature to change

[0285]

[0286] The heat source is the heat exchange between the heating element and the water flow, so there are:

[0287] Q 吸 =α·dA·(T B -T w )=α·L c ·dx·(T B -T w )(twenty two)

[0288] Where Q 吸 is the absorbed heat, C p is the specific heat of cooling water at constant pressure, is the cooling water flow rate, T w is the water temperature, T B is the temperature of the heating element, L C is the characteristic length of the heat exchange component, indicating the heat transfer area per unit length, α is the heat transfer coefficient, dA is the differential of the heat transfer area, and dx is the differential of the heat transfer length. Formula (21) and formula (22) are combined and integrated over the length from the inlet to the outlet of the heat exchange component to obtain

[0289]

[0290] Among them, T w,out is the outlet water temperature, T w,in is the inlet water temperature, and A is the heat exchange area.

[0291] Since the thermal mass of the heat exchange component is relatively large relative to the heat transfer amount within a unit step, it can be considered that the temperature of the heat exchange component remains unchanged within a unit step.

[0292] 8. Fit the heat transfer coefficient according to the mass flow rate to ensure that the heat transfer coefficient in the water channel is within a reasonable range and the trend is correct.

[0293] 9. Calculate the heat transfer heat Q per unit time step 吸 ,The temperature change of the heat exchange component within the step is calculated by formula (21), and the temperature of the heat exchange element is updated when calculating the next step.

[0294] 10. Identify the characteristic length of the heat exchange element through experimental data, compensate for the lack of flow accuracy, calibrate the flow model, and obtain the following Figure 5The flow dynamic model shown is a model obtained by adding filtering to the static model of the neural network. According to the flow dynamic model, the water mass flow of cooling water of the heating element, that is, the electronic device, under different conditions can be determined.

[0295] After determining the water mass flow rate, the water heat transfer coefficient can be fitted according to the water mass flow rate or the Reynolds number can be calculated according to the dimensionless method, and then the water heat transfer coefficient can be determined according to the relationship between the Prandtl number and the Nusselt number.

[0296] According to the water mass flow rate, the water heat transfer coefficient can be fitted by a quadratic polynomial, and the formula is as follows:

[0297]

[0298] Where α is the water heat transfer coefficient, is the water mass flow rate, C1, C2, C3 are fitting coefficients, which need to be fitted according to experimental values.

[0299] The dimensionless method involves two flow regimes, laminar and turbulent, which are distinguished by the Reynolds number, which is calculated as:

[0300]

[0301] Nusselt number calculation formula:

[0302]

[0303] In the formula, V is the water flow rate, L is the heat transfer length, v is the dynamic viscosity of water, and λ is the thermal conductivity of water. The water heat transfer coefficient can then be calculated as:

[0304]

[0305] In the formula, Pr is the Prandtl number of water, and f(Re,Pr) is the empirical function used to calculate the Nusselt number. Due to the different internal structures of the water channel, the calculation of Nu in laminar flow, transition state and turbulent flow must be identified based on experimental temperature data.

[0306] In some embodiments, the method further comprises:

[0307] Acquire a plurality of experimental data, wherein the experimental data include measured values ​​of water channel inlet temperatures;

[0308] Estimate the initial value of the Nusselt number according to the empirical function, obtain the initial value of the water heat transfer coefficient according to the initial value of the Nusselt number, and estimate the water temperature at the water channel inlet of the heat dissipation element according to the average water exchange water temperature and the wall temperature. Specifically, calculate the water temperature at the water channel inlet according to formula (14);

[0309] Adjust the Nusselt number and thus the water heat transfer coefficient until the estimated water temperature at the water channel inlet is consistent with the experimental water temperature at the water channel inlet.

[0310] like Figure 6 The figure shows a calculation effect diagram of an example of the present invention, including a main circuit test water temperature curve 61, a water temperature curve 62 calculated in a pure steady state, and a water temperature curve 63 predicted by the method of this embodiment. The horizontal axis is time, unit: s, and the vertical axis is temperature, unit: °C. Figure 6 It can be seen that at the beginning of the trip, the electronic device, in this case the chip, uploads the temperature of the previous trip during the initialization process, which leads to some fluctuations in the initial stage. After the fluctuation period, it can be seen from the effect that the dynamically corrected model can better predict the water temperature changes during the cold start of the chip.

[0311] This embodiment dynamically corrects the water temperature prediction of the heat dissipation element of the electronic device during the cold start phase to solve the delay problem of the existing prediction method. This embodiment simplifies the heat transfer model of the electronic device, infers the water temperature through the device temperature change, improves the accuracy through correction, reduces the sensor requirements, and thus reduces costs.

[0312] Based on the same inventive concept, Figure 7 FIG. 1 is a schematic diagram of a water temperature estimation device according to an embodiment of the present invention, comprising:

[0313] The acquisition module 701 is used to acquire the heating power of the electronic device and the temperature of the circuit board; the electronic device is fixed on the circuit board, and the electronic device is connected to a heat dissipation element in contact with the water channel;

[0314] A cold start correction coefficient calculation module 702 is used to calculate a cold start heat coefficient according to a difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state stage and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at a current moment, wherein the cold start heat coefficient represents the ability of the electronic device to conduct heat in a cold start stage;

[0315] A cold start correction module 703 is used to correct the heat dissipation of the electronic device under the heating electric power according to the cold start heat coefficient when the electronic device is in the cold start stage to obtain a cold start corrected heat dissipation, wherein the cold start corrected heat dissipation is the heat dissipation of the electronic device under the heating electric power during the cold start stage;

[0316] The water temperature calculation module 704 at the end of the water path is used to estimate the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation and the circuit board temperature.

[0317] The present invention calculates the first heat dissipation temperature and the second heat dissipation temperature respectively according to the estimated water temperature estimated in the steady-state stage and the estimated temperature of the electronic device estimated in the steady-state stage, calculates the cold start heat coefficient according to the difference between the first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in the steady-state stage and the second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment, and then corrects the heat dissipation of the electronic device under the heating electric power based on the cold start heat coefficient to obtain the cold start corrected heat dissipation, and estimates the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation. Since the cold start heat coefficient characterizes the ability of the electronic device to conduct heat in the cold start stage, the present invention corrects the heat dissipation by the cold start heat coefficient so that the corrected heat dissipation conforms to the temperature distribution in the cold start stage, so that the accurate water temperature at the end of the water path of the heat dissipation element of the electronic device in the cold start stage can be estimated through the temperature of the temperature measurement point on the circuit board.

[0318] In one embodiment, the device further comprises: a heat dissipation temperature calculation module, which is used to:

[0319] The first heat dissipation temperature and the second heat dissipation temperature are calculated based on the circuit board temperature, the estimated water temperature estimated in the steady-state stage, and the estimated temperature of the electronic device estimated in the steady-state stage. The estimated water temperature is an estimated value of the water temperature in the heat dissipation element connected to the electronic device calculated based on the circuit board temperature in the steady-state stage. The estimated electronic device temperature is an estimated value of the electronic device temperature calculated based on the circuit board temperature in the steady-state stage.

[0320] In one embodiment, the calculating the first heat dissipation temperature includes:

[0321] Calculating a first heat conduction error function operator when the electronic device ends cold start according to the distance between the electronic device and the water channel and the cold start time of the electronic device;

[0322] The first heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the first heat conduction error function operator.

[0323] In one embodiment:

[0324] The calculating of the first heat conduction error function operator at the end of the cold start of the electronic device according to the distance between the electronic device and the water channel and the cold start time of the electronic device comprises: calculating the first heat conduction error function operator as in, is the first heat conduction error function operator, L x is the distance between the electronic device and the waterway, t eis the cold start time of the electronic device, a is the temperature diffusion coefficient;

[0325] The calculating the first heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the first heat conduction error function operator includes: calculating the first heat dissipation temperature as Among them, T x,stable is the first heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0326] In one embodiment, the calculating the second heat dissipation temperature includes:

[0327] Calculating a second heat conduction error function operator at a current moment during a cold start process of the electronic device according to the distance between the electronic device and the water channel;

[0328] The second heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the second heat conduction error function operator.

[0329] In one embodiment:

[0330] The calculating of the second heat conduction error function operator at the current moment during the cold start process of the electronic device according to the distance between the electronic device and the water channel comprises: calculating the second heat conduction error function operator as in, is the second heat conduction error function operator, L x is the distance between the electronic device and the waterway, t is the time elapsed from the cold start of the electronic device to the current time, and a is the temperature diffusion coefficient;

[0331] The calculating the second heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator includes: calculating the second heat dissipation temperature Among them, T x,t is the second heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

[0332] In one embodiment, calculating the cold start heat coefficient according to the difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment includes:

[0333] Calculate the cold start heat coefficient as: Among them, k transient is the cold start heat coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, T w ' is the estimated water temperature under steady state stage.

[0334] In one embodiment, the device further includes a determination module, configured to:

[0335] When the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state judgment value, then the current stage of the electronic device is judged to be a cold start stage, otherwise, the current stage of the electronic device is judged to be a steady state stage;

[0336] When the electronic device is powered off, the current stage of the electronic device is cleared.

[0337] In one embodiment, the step of correcting the heat dissipation of the electronic device at the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation includes:

[0338] Calculate the cold start corrected heat dissipation as: Q transient =k transient Q, where Q transient is the cold start corrected heat dissipation, Q is the heat generated per unit time of the electronic device calculated based on the heat generation power, k transient is the cold start heat coefficient.

[0339] In one embodiment:

[0340] The step of correcting the heat dissipation of the electronic device at the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation comprises:

[0341] Calculating a first heat dissipation amount of heat dissipated by the electronic device to the heat dissipation element and a second heat dissipation amount of heat dissipated by the electronic device to the circuit board according to the cold start corrected heat dissipation amount;

[0342] The estimating the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation and the circuit board temperature includes:

[0343] Calculate the temperature of the electronic device at the location of the electronic device according to the second heat dissipation and the circuit board temperature and based on the second thermal resistance between the temperature measurement point and the electronic device;

[0344] Calculate the average heat exchange water temperature in the heat dissipation element according to the temperature of the electronic device and the first heat dissipation amount, based on the first thermal resistance between the electronic device and the water path, wherein the average heat exchange water temperature is the average value of the heat exchange temperature between the heat dissipation element and the electronic device;

[0345] The water temperature at the end of the water path of the heat dissipating element is estimated according to the average water exchange water temperature.

[0346] In one embodiment:

[0347] The first heat dissipation amount of the electronic device to the heat dissipation element and the second heat dissipation amount of the electronic device to the circuit board are calculated according to the cold start corrected heat dissipation amount, including: calculating the first heat dissipation amount as: Q1 = (1-k) Q transient , the second heat dissipation is: Q2 = kQ transient , where Q1 is the first heat dissipation, Q2 is the second heat dissipation, Q transient Correcting heat dissipation for said cold start;

[0348] The calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device includes: calculating the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance;

[0349] The calculating, based on the temperature of the electronic device and the first heat dissipation amount and the first thermal resistance between the electronic device and the water path, the average water exchange temperature in the heat dissipation element comprises: calculating the average water exchange temperature as: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

[0350] In one embodiment, the water temperature at the end of the water channel of the heat dissipating element includes the water temperature at the water channel inlet, and estimating the water temperature at the end of the water channel of the heat dissipating element according to the average water exchange water temperature includes:

[0351] According to the structural thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer and the area of ​​each layer, the thermal conduction resistance from the electronic device to the heat dissipation element is calculated as: Among them, R 1,cond is the thermal conduction resistance, δ iis the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers;

[0352] The wall temperature of the heat dissipation element in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction thermal resistance;

[0353] The estimated water temperature at the waterway inlet is: Among them, T in is the water temperature at the water channel inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

[0354] In one embodiment, the water temperature at the end of the water path of the heat dissipating element also includes the water temperature at the water path outlet, and the estimating the water temperature at the end of the water path of the heat dissipating element according to the average water exchange water temperature specifically includes:

[0355] The estimated water temperature at the waterway outlet is: Among them, T out is the water temperature at the water channel outlet, R is the heat exchange area per unit length, and L is the water channel length.

[0356] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0357] like Figure 8 The figure shows a hardware structure diagram of an electronic device of the present invention, including:

[0358] at least one processor 801; and,

[0359] A memory 802 is communicatively connected to at least one of the processors 801; wherein,

[0360] The memory 802 stores instructions that can be executed by at least one of the processors. The instructions are executed by at least one of the processors so that the at least one of the processors can execute the water temperature estimation method as described above.

[0361] Figure 8A processor 801 is taken as an example.

[0362] The electronic device may further include: an input device 803 and a display device 804 .

[0363] The processor 801, the memory 802, the input device 803 and the display device 804 may be connected via a bus or other means, and the figure takes the connection via a bus as an example.

[0364] The memory 802 is a non-volatile computer-readable storage medium that can be used to store non-volatile software programs, non-volatile computer executable programs and modules, such as program instructions / modules corresponding to the water temperature estimation method in the embodiment of the present application, for example, Figure 1 , Figure 2 The processor 801 executes various functional applications and data processing by running the non-volatile software programs, instructions and modules stored in the memory 802, that is, the water temperature estimation method in the above embodiment is implemented.

[0365] The memory 802 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required by at least one function; the data storage area may store data created according to the use of the water temperature estimation method, etc. In addition, the memory 802 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 802 may optionally include a memory remotely arranged relative to the processor 801, and these remote memories may be connected to the device for executing the water temperature estimation method via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0366] The input device 803 can receive user clicks and generate signal inputs related to user settings and function controls of the water temperature estimation method. The display device 804 can include display devices such as a display screen.

[0367] The one or more modules are stored in the memory 802 , and when executed by the one or more processors 801 , the water temperature estimation method in any of the above method embodiments is executed.

[0368] The present invention calculates the first heat dissipation temperature and the second heat dissipation temperature respectively according to the estimated water temperature estimated in the steady-state stage and the estimated temperature of the electronic device estimated in the steady-state stage, calculates the cold start heat coefficient according to the difference between the first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in the steady-state stage and the second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment, and then corrects the heat dissipation of the electronic device under the heating electric power based on the cold start heat coefficient to obtain the cold start corrected heat dissipation, and estimates the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation. Since the cold start heat coefficient characterizes the ability of the electronic device to conduct heat in the cold start stage, the present invention corrects the heat dissipation by the cold start heat coefficient so that the corrected heat dissipation conforms to the temperature distribution in the cold start stage, so that the accurate water temperature at the end of the water path of the heat dissipation element of the electronic device in the cold start stage can be estimated through the temperature of the temperature measurement point on the circuit board.

[0369] An embodiment of the present invention provides a storage medium, wherein the storage medium stores computer instructions. When a computer executes the computer instructions, the storage medium is used to execute all steps of the water temperature estimation method as described above.

[0370] In the context of the present disclosure, a storage medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or apparatus. The storage medium may be a machine-readable signal medium or a machine-readable storage medium. Alternatively, the storage medium may be a non-temporary computer-readable storage medium, for example, a non-temporary computer-readable storage medium may be a ROM, a random access memory (Random Access Memory, RAM), a compact disc read-only memory (Compact Disc ROM, CD-ROM), a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0371] An embodiment of the present invention provides a vehicle, including the water temperature estimation device as described above, or the electronic device as described above. It is understandable that the vehicle may also include: a processor, a memory, and a computer program. The computer program is stored in the memory and is configured to be executed by the processor to implement the water temperature estimation method provided in the embodiment of the present disclosure. The processor and the memory are already in Figure 7 The parts described in the illustrated embodiment are not repeated here.

[0372] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A water temperature estimation method, characterized in that: include: Acquiring the heating power of the electronic device and the temperature of the circuit board; the electronic device is fixed on the circuit board, and the electronic device is connected to a heat dissipation element in contact with the water channel; Calculating a cold start heat coefficient according to a difference between a first heat dissipation temperature transferred to the heat dissipation element when the electronic device is in a steady state stage and a second heat dissipation temperature transferred to the heat dissipation element by the electronic device at a current moment, wherein the cold start heat coefficient represents the ability of the electronic device to conduct heat in a cold start stage; When the electronic device is in a cold start stage, the heat dissipation of the electronic device under the heating electric power is corrected according to the cold start heat coefficient to obtain a cold start corrected heat dissipation, wherein the cold start corrected heat dissipation is the heat dissipation of the electronic device under the heating electric power during the cold start stage; The water temperature at the end of the water path of the heat dissipation element is estimated according to the cold start corrected heat dissipation and the circuit board temperature.

2. The water temperature estimation method according to claim 1, characterized in that: The method further comprises: The first heat dissipation temperature and the second heat dissipation temperature are calculated based on the circuit board temperature, the estimated water temperature estimated in the steady-state stage, and the estimated temperature of the electronic device estimated in the steady-state stage. The estimated water temperature is an estimated value of the water temperature in the heat dissipation element connected to the electronic device calculated based on the circuit board temperature in the steady-state stage. The estimated electronic device temperature is an estimated value of the electronic device temperature calculated based on the circuit board temperature in the steady-state stage.

3. The water temperature estimation method according to claim 2, characterized in that: The calculating the first heat dissipation temperature includes: Calculating a first heat conduction error function operator when the electronic device ends cold start according to the distance between the electronic device and the water channel and the cold start time of the electronic device; The first heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the first heat conduction error function operator.

4. The water temperature estimation method according to claim 3, characterized in that: The calculating of the first heat conduction error function operator at the end of the cold start of the electronic device according to the distance between the electronic device and the water channel and the cold start time of the electronic device comprises: calculating the first heat conduction error function operator as in, is the first heat conduction error function operator, L x is the distance between the electronic device and the waterway, t e is the cold start time of the electronic device, a is the temperature diffusion coefficient; The calculating the first heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the first heat conduction error function operator includes: calculating the first heat dissipation temperature as: Among them, T x,stable is the first heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

5. The water temperature estimation method according to claim 2, characterized in that: The calculating the second heat dissipation temperature includes: Calculating a second heat conduction error function operator at a current moment during a cold start process of the electronic device according to the distance between the electronic device and the water channel; The second heat dissipation temperature is calculated according to the estimated water temperature, the estimated temperature of the electronic component and the second heat conduction error function operator.

6. The water temperature estimation method according to claim 5, characterized in that: The calculating of the second heat conduction error function operator at the current moment during the cold start process of the electronic device according to the distance between the electronic device and the water channel comprises: calculating the second heat conduction error function operator as in, is the second heat conduction error function operator, L x is the distance between the electronic device and the waterway, t is the time elapsed from the cold start of the electronic device to the current time, and a is the temperature diffusion coefficient; The calculating the second heat dissipation temperature according to the estimated water temperature, the estimated temperature of the electronic device and the second heat conduction error function operator includes: calculating the second heat dissipation temperature Among them, T x,t is the second heat dissipation temperature, T e 'Estimate the temperature of the electronic device, T w ' is the estimated water temperature, is the heat conduction error function operator, and e is a natural constant.

7. The water temperature estimation method according to claim 1, characterized in that: The calculating the cold start heat coefficient according to the difference between the first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state stage and the second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at the current moment includes: Calculate the cold start heat coefficient as: Among them, k transient is the cold start heat coefficient, T x,stable is the first heat dissipation temperature, T x,t is the second heat dissipation temperature, T w ' is the estimated water temperature under steady state stage.

8. The water temperature estimation method according to claim 1, characterized in that: The method further comprises: When the electronic device is powered on, if the absolute value of the temperature difference between the circuit board temperature and the second heat dissipation temperature is greater than or equal to a preset state judgment value, then the current stage of the electronic device is judged to be a cold start stage, otherwise, the current stage of the electronic device is judged to be a steady state stage; When the electronic device is powered off, the current stage of the electronic device is cleared.

9. The water temperature estimation method according to claim 1, characterized in that: The step of correcting the heat dissipation of the electronic device at the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation comprises: Calculate the cold start corrected heat dissipation as: Q transient =k transient Q, where Q transient is the cold start corrected heat dissipation, Q is the heat generated per unit time of the electronic device calculated based on the heat generation power, k transient is the cold start heat coefficient.

10. The water temperature estimation method according to claim 1, characterized in that: The step of correcting the heat dissipation of the electronic device at the heating power according to the cold start heat coefficient to obtain the cold start corrected heat dissipation comprises: Calculating a first heat dissipation amount of heat dissipated by the electronic device to the heat dissipation element and a second heat dissipation amount of heat dissipated by the electronic device to the circuit board according to the cold start corrected heat dissipation amount; The estimating the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation and the circuit board temperature includes: Calculate the temperature of the electronic device at the location of the electronic device according to the second heat dissipation and the circuit board temperature and based on the second thermal resistance between the temperature measurement point and the electronic device; Calculate the average heat exchange water temperature in the heat dissipation element according to the temperature of the electronic device and the first heat dissipation amount, based on the first thermal resistance between the electronic device and the water path, wherein the average heat exchange water temperature is the average value of the heat exchange temperature between the heat dissipation element and the electronic device; The water temperature at the end of the water path of the heat dissipating element is estimated according to the average water exchange water temperature.

11. The water temperature estimation method according to claim 10, characterized in that: The first heat dissipation amount of the electronic device to the heat dissipation element and the second heat dissipation amount of the electronic device to the circuit board are calculated according to the cold start corrected heat dissipation amount, including: calculating the first heat dissipation amount as: Q1 = (1-k) Q transient , the second heat dissipation is: Q2 = kQ transient , where Q1 is the first heat dissipation, Q2 is the second heat dissipation, Q transient Correcting heat dissipation for said cold start; The calculating the temperature of the electronic device at the location of the electronic device based on the second heat dissipation and the circuit board temperature and the second thermal resistance between the temperature measurement point and the electronic device includes: calculating the temperature of the electronic device as: T e =T2+Q2·R2, where T e is the temperature of the electronic device, T2 is the temperature of the circuit board, Q2 is the second heat dissipation, and R2 is the second thermal resistance; The calculating, based on the temperature of the electronic device and the first heat dissipation amount and the first thermal resistance between the electronic device and the water path, the average water exchange temperature in the heat dissipation element comprises: calculating the average water exchange temperature as: T w =T e -R1·Q1, where T w is the average water exchange temperature, T e is the temperature of the electronic device, R1 is the first thermal resistance, and Q1 is the first heat dissipation.

12. The water temperature estimation method according to claim 10, characterized in that: The water temperature at the end of the water channel of the heat dissipating element includes the water temperature at the water channel inlet, and the estimating the water temperature at the end of the water channel of the heat dissipating element according to the average water exchange water temperature includes: According to the structural thickness of each layer between the electronic device and the heat dissipation element, the thermal conductivity coefficient of each layer and the area of ​​each layer, the thermal conduction resistance from the electronic device to the heat dissipation element is calculated as: Among them, R 1,cond is the thermal conduction resistance, δ i is the structural thickness of the i-th layer, λ i is the thermal conductivity of the i-th layer, A i is the area of ​​the i-th layer, and n is the number of layers; The wall temperature of the heat dissipation element in contact with water is calculated as: T wall =T e -Q1·R 1,cond , where T wall is the wall temperature, T e is the temperature of the electronic device, Q1 is the first heat dissipation, R 1,cond is the thermal conduction thermal resistance; The estimated water temperature at the waterway inlet is: Among them, T in is the water temperature at the water channel inlet, α is the water heat transfer coefficient, is the water mass flow rate, Cp w is the specific heat of water at constant pressure, A w is the water heat transfer area, T w is the average water exchange temperature, T wall is the wall temperature.

13. The water temperature estimation method according to claim 12, characterized in that: The water temperature at the end of the water path of the heat dissipating element also includes the water temperature at the water path outlet. The estimating the water temperature at the end of the water path of the heat dissipating element according to the average water exchange water temperature specifically includes: The estimated water temperature at the waterway outlet is: Among them, T out is the water temperature at the water channel outlet, R is the heat exchange area per unit length, and L is the water channel length.

14. A water temperature estimation device, characterized in that: include: An acquisition module is used to acquire the heating power of the electronic device and the temperature of the circuit board; the electronic device is fixed on the circuit board, and the electronic device is connected to a heat dissipation element in contact with the water channel; a cold start correction coefficient calculation module, used to calculate a cold start heat coefficient according to a difference between a first heat dissipation temperature transmitted to the heat dissipation element when the electronic device is in a steady state stage and a second heat dissipation temperature transmitted to the heat dissipation element by the electronic device at a current moment, wherein the cold start heat coefficient represents the ability of the electronic device to conduct heat in a cold start stage; A cold start correction module, used for correcting the heat dissipation of the electronic device under the heating electric power according to the cold start heat coefficient when the electronic device is in the cold start stage to obtain a cold start corrected heat dissipation, wherein the cold start corrected heat dissipation is the heat dissipation of the electronic device under the heating electric power during the cold start stage; The water temperature calculation module at the end of the water path is used to estimate the water temperature at the end of the water path of the heat dissipation element according to the cold start corrected heat dissipation and the circuit board temperature.

15. An electronic device, characterized in that: include: at least one processor; as well as, a memory communicatively connected to at least one of the processors; wherein, The memory stores instructions that can be executed by at least one of the processors, and the instructions are executed by at least one of the processors to enable at least one of the processors to execute the water temperature estimation method according to any one of claims 1 to 13.

16. A storage medium, characterized in that: The storage medium stores computer instructions, and when a computer executes the computer instructions, it is used to execute all steps of the water temperature estimation method according to any one of claims 1 to 13.

17. A vehicle, characterized in that: It includes the water temperature estimation device as claimed in claim 14, or the electronic device as claimed in claim 15.

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