Pressure sensor with flange

Abstract

The embodiment of the invention relates to a pressure sensor with a flange. A sensor module includes a substrate, a MEMS pressure sensor mounted to the organic substrate, and a unitary cover mounted on the substrate. The integrated cover includes a central elevated portion housing the MEMS pressure sensor, a bore in the central elevated portion, and a flat flange extending from the central elevated portion to an edge of the organic substrate.

Description

Technical Field

[0001] The present disclosure relates to a MEMS device installed in an electronic device, and more particularly to a MEMS pressure sensor module installed in an electronic device. Background Art

[0002] Microelectromechanical systems (MEMS) are used in a wide variety of applications. MEMS devices often implement sensors. For example, MEMS sensors can include accelerometers, gyroscopes, microphones, pressure sensors, and other types of sensors.

[0003] In the example of a MEMS pressure sensor, it is desirable in many cases that the MEMS pressure sensor be waterproof. More specifically, the MEMS pressure sensor can be implemented in a waterproof sensor module assembly. Thus, an electronic device implemented with the sensor module can be submerged in water without damaging the MEMS pressure sensor or circuitry associated with the MEMS pressure sensor.

[0004] The waterproof pressure sensor may have a lid. In one possible solution, the housing is shaped so that an O-ring may be placed on the lid. The O-ring helps ensure that the pressure sensor is waterproof. However, the application of the O-ring may be performed by hand. In addition, the thickness of certain components of the sensor module may be considerable, thereby accommodating space for the O-ring location. This introduces additional costs and a source of potential failure in the manufacturing process.

[0005] All topics discussed in the background section are not necessarily prior art, and should not be considered prior art simply because they are discussed in the background section. Along these lines, any recognition of problems in the prior art discussed in the background section or problems associated with such topics should not be considered prior art unless expressly stated to be prior art. Instead, the discussion of any topic in the background section should be considered part of the inventor's approach to solving a particular problem, which may itself be inventive. Summary of the invention

[0006] Embodiments of the present disclosure provide a MEMS pressure sensor module that is waterproof without implementing an O-ring. The MEMS pressure sensor can be coupled to an ASIC on an organic substrate. A cover is placed on the substrate, above the MEMS pressure sensor. The cover is an integral piece with a relatively wide flange. The wide flange is glued to the substrate in a manner that effectively seals the MEMS pressure sensor without the use of an O-ring and makes the MEMS pressure sensor waterproof.

[0007] In one embodiment, the unitary cover includes a raised center portion coupled to the flange. When the unitary cover is adhered to the substrate, the MEMS pressure sensor is positioned within the raised center portion. The raised upper portion has a relatively low profile because the space for the O-ring is not utilized. As a result, the MEMS pressure sensor module can effectively provide waterproofing for the MEMS sensor without the need for expensive O-ring assemblies.

[0008] In one embodiment, a sensor module includes a substrate, a MEMS pressure sensor mounted to the substrate, and an integral cover mounted on the substrate. The integral cover includes a central elevated portion, an aperture in the central elevated portion, and a flat flange, the central elevated portion accommodating the MEMS pressure sensor, the flat flange extending from the central elevated portion to an edge of the substrate.

[0009] In one embodiment, a method includes mounting a MEMS pressure sensor on a substrate and mounting an integral cover on the substrate. The integral cover includes a central raised portion, a hole in the central raised portion, and a flat flange, the central raised portion accommodating the MEMS pressure sensor, the flat flange extending from the central raised portion to an edge of the substrate. The method includes partially filling the central raised portion with a sealing gel, performing a first curing process of the sealing gel, filling a remaining portion of the central raised portion with the sealing gel after performing the first curing process, and performing a second curing process of the sealing gel.

[0010] In one embodiment, a method includes generating an analog pressure signal using a MEMS pressure sensor coupled to a substrate, receiving a digital pressure signal based on the analog pressure signal using an ASIC electrically coupled to the MEMS pressure sensor, and transmitting the digital pressure signal to control circuitry of an electronic device. The MEMS pressure sensor and the ASIC are positioned within a central raised portion of an integral cover that is mounted on the substrate and includes a hole in the central raised portion and a flat flange that extends from the central raised portion to an edge of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a block diagram of an electronic device according to one embodiment.

[0012] Figure 2A is a perspective view of a sensor module including a MEMS pressure sensor according to one embodiment.

[0013] Figure 2B According to an embodiment Figure 2A A top view of the sensor module.

[0014] Figure 2C According to an embodiment Figure 2A Side view of the sensor module.

[0015] Figure 3A is a perspective view of a sensor module at an intermediate stage of fabrication and including an organic substrate according to one embodiment.

[0016] Figure 3B According to an embodiment Figure 3A A perspective view of the sensor module where the ASIC is mounted to an organic substrate.

[0017] Figure 3C According to an embodiment Figure 3B A perspective view of the sensor module where glue is applied to the ASIC.

[0018] Figure 3D According to an embodiment Figure 3C A perspective view of the sensor module where the MEMS pressure sensor is mounted to the ASIC via glue.

[0019] Figure 3E According to an embodiment Figure 3D 00140] A perspective view of a sensor module in which wire bonds electrically couple the MEMS pressure sensor to the ASIC and the ASIC to the organic substrate.

[0020] Figure 3F According to an embodiment Figure 3E A perspective view of a sensor module in which the integral cover is mounted to an organic substrate.

[0021] Figure 3G is a side cross-sectional view of a sensor module after applying a first portion of sealing gel according to one embodiment.

[0022] Figure 3H According to an embodiment Figure 3G Side cross-sectional view of the sensor module after applying the second portion of sealing gel.

[0023] Fig. 3I is a side view of a sensor module within a housing coupled to an integral cover according to one embodiment.

[0024] Figure 4 is a block diagram of an electronic device including a sensor module according to one embodiment.

[0025] Figure 5 is an illustration of a smart watch including a sensor module according to one embodiment.

[0026] Figure 6is an illustration of a smart phone including a sensor module according to one embodiment.

[0027] Figure 7 is a flow chart of a method for assembling a sensor module according to one embodiment.

[0028] Figure 8 is a flow chart of a method for operating a sensor module according to one embodiment. DETAILED DESCRIPTION

[0029] In the following description, certain specific details are set forth to provide a thorough understanding of the various disclosed embodiments. However, one skilled in the relevant art will recognize that the embodiments may be implemented without one or more of these specific details, or with other methods, components, materials, etc. In other instances, well-known systems, components, and circuit devices associated with integrated circuits are not shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0030] Unless the context requires otherwise, throughout the specification and the appended claims, the word "comprise" and variations such as "include" and "comprising" are to be interpreted in an open, inclusive sense, i.e., to mean "including but not limited to." Additionally, "first," "second," and similar ordinal indicators are to be interpreted as interchangeable unless the context clearly dictates otherwise.

[0031] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment. Thus, the phrases "in one embodiment" or "in an embodiment" appearing in various places throughout this specification do not necessarily all refer to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0032] As used in this specification and the appended claims, the singular forms "a", "an", and "the" include plural referents unless the content clearly dictates otherwise. It should also be noted that the term "or" is generally used in the broadest sense, i.e., as "and / or", unless the content clearly dictates otherwise.

[0033] Figure 1 is a block diagram of an electronic device 100 according to one embodiment. The electronic device 100 includes a sensor module 102 coupled within a housing 104 of the electronic device 100. As will be explained in more detail below, the configuration of the sensor module provides an effective and efficient waterproof MEMS sensor.

[0034] The sensor module 102 includes a MEMS sensor 101 and an ASIC 103, which are coupled to a substrate 106. The MEMS sensor 101 is a MEMS pressure sensor. The MEMS pressure sensor 101 can generate a sensor signal indicating air pressure, water pressure, or other types of pressure.

[0035] The MEMS pressure sensor may be implemented in a semiconductor die. The semiconductor die may undergo various semiconductor processes to pattern and form components of the pressure sensor from the semiconductor die. The semiconductor process may also provide circuit components within the semiconductor die that facilitate the generation and transmission of a sensor signal indicative of the sensed pressure.

[0036] In one embodiment, the MEMS pressure sensor 101 includes a flexible layer that acts as a diaphragm. Fluid pressure in the environment of the MEMS sensor causes the diaphragm to deflect, bend, or otherwise move. The displacement of the diaphragm can be sensed. The displacement of the diaphragm can be related to the fluid pressure in the environment of the MEMS pressure sensor 101.

[0037] In one embodiment, the MEMS pressure sensor 101 is a capacitive sensor. In one example, electrodes are formed on a diaphragm and formed on a substrate or surface separated from the diaphragm by a cavity. The capacitance between the electrodes changes based on the distance between the electrodes. Therefore, the displacement of the diaphragm is sensed as a change in capacitance.

[0038] In one embodiment, the MEMS pressure sensor 101 is a piezoresistive pressure sensor. The piezoresistive element may be formed directly on the diaphragm or coupled to the diaphragm in a manner that causes the piezoresistive element to bend or move. Displacement of the diaphragm causes the piezoresistive element to bend or strain. The bending or strain of the piezoresistive element causes the resistance of the piezoresistive element to change. Therefore, the resistance of the piezoresistive element can be used to determine the fluid pressure in the environment of the MEMS pressure sensor 101. Other types of MEMS pressure sensors may be utilized without departing from the scope of the present disclosure.

[0039] ASIC 103 is an application specific integrated circuit. ASIC 103 may include analog-to-digital circuitry that receives an analog sensor signal from MEMS pressure sensor 101 and generates a digital sensor signal indicative of the pressure sensed by MEMS pressure sensor 101 .

[0040] The analog circuitry of ASIC 103 may include an analog-to-digital converter (ADC). The ADC may receive an analog pressure signal and may perform an analog-to-digital conversion to convert the analog pressure signal into a digital signal. The analog circuitry of the ASIC may include other types of circuitry that may condition or transform a signal received directly from MEMS sensor 101.

[0041] The digital circuitry of ASIC 103 may receive the digital sensor signal from the analog circuitry and may process or condition the digital sensor signal. The digital circuitry may include digital filters, demodulators, digital signal processing circuitry, control circuitry, or other types of circuitry for processing digital signals.

[0042] ASIC 103 may be implemented in an integrated circuit die that is separate from MEMS sensor 101. In this case, MEMS sensor 101 may be electrically coupled to ASIC 103 through coupling circuitry. The coupling circuitry may include one or more of wire bonds, solder bumps, contact pads, signal traces, or other types of coupling circuitry.

[0043] In one embodiment, ASIC 103 and MEMS sensor 101 are implemented in the same integrated circuit die. In this case, the sensor signal from MEMS sensor 101 is provided to ASIC 103 through metal interconnect lines and conductive vias embedded in the integrated circuit die. ASIC 103 and MEMS sensor 101 can be implemented in a system on a chip.

[0044] In one embodiment, substrate 106 is an organic substrate. The organic substrate may include signal traces or buried signal lines electrically coupled to ASIC 103. Electrical coupling may be achieved through solder bumps, wire bonding, or other types of electrical connections. Power may be provided to ASIC 103 via signal traces and signal lines. Digital sensor data may be output from ASIC to other components of electronic device 100 via signal lines and signal traces in substrate 106. Without departing from the scope of the present disclosure, substrate 106 may include a printed circuit board or other type of substrate. In one embodiment, substrate 106 is a ceramic substrate.

[0045] The sensor module 102 includes an integral cover 108 that is coupled to the substrate 106. The integral cover 108 is a single, unitary piece that is coupled to the substrate 106. The integral cover 108 may include stainless steel, aluminum, titanium, or other types of metals. Alternatively, the integral cover 108 may include plastic or other types of materials.

[0046] The integral cover 108 includes an elevated central housing 110. The elevated central housing 110 is positioned above the MEMS sensor 101 and the ASIC 103. The elevated central housing 110 includes a hole 114 through which pressure can be applied to the MEMS sensor 101.

[0047] The integral cover 108 includes a flat flange 112. The flat flange 112 is directly coupled to the substrate 106. The flat flange 112 is relatively wide. The flat flange 112 extends to the edge of the substrate 106, or nearly to the edge of the substrate 106. Because the flange 112 covers a relatively large surface area, the flange 112 can be glued to the substrate 106 in a manner that makes the MEMS sensor 101 and the ASIC 103 waterproof. As will be explained in more detail below, a sealing gel fills the raised center housing 110 to further make the MEMS sensor 101 and the ASIC 103 waterproof.

[0048] Because the wide flange 112 effectively seals the sensor module 112 in a waterproof manner, the height of the raised portion 110 can be relatively low. This is because the wide flange 112 makes it possible to achieve such waterproofing without placing an O-ring around the raised raised portion 110. If the O-ring is not utilized, the height of the raised center portion can be reduced. The result is a thinner sensor module 102. In addition, because no O-ring is utilized in waterproofing, a potentially expensive and trouble-prone aspect of manufacturing can be eliminated.

[0049] The sensor module 102 is coupled to the housing 104 of the electronic device 100. The housing may be glued to the top surface of the flange 112, or otherwise coupled to the sensor module 102.

[0050] The electronic device 100 may include a wearable electronic device such as a smart watch, smart glasses, a mobile phone, or other types of electronic devices. Alternatively, the electronic device 100 may include an industrial machine, a vehicle, or other types of electronic devices that may benefit from the implementation of the sensor module 102 within the electronic device 100.

[0051] Figure 2A is a perspective view of a sensor module 102 according to some embodiments. Figure 2A The sensor module 102 is Figure 1 An example of a sensor module 102. The sensor module 102 includes a substrate 106. In the example Figure 2A, the substrate 106 is rectangular and has a first lateral dimension D1 and a second lateral dimension D2. The lateral dimension D1 can be equal to the lateral dimension D2, so that the organic substrate 106 is substantially square in shape. Alternatively, depending on the device specifications, the lateral dimension D1 can be different from the lateral dimension D2. In one embodiment, the lateral dimensions D1 and D2 are between 3.5 mm and 8 mm, but other dimensions can be utilized without departing from the scope of the present disclosure. The substrate 106 includes a lateral edge 121.

[0052] The sensor module 102 includes an integral cover 108. The integral cover 108 includes a raised center housing 110 and a flange 112. The raised center housing 110 is positioned over the MEMS pressure sensor 101 and the ASIC 103 mounted on the substrate 106.

[0053] The raised center housing 110 has a hole 114. The hole 114 has a diameter dimension D3. The dimension D3 may be less than 1 mm, but other dimensions may be utilized without departing from the scope of the present disclosure. The raised center housing 110 also has a height dimension, which will be further described below.

[0054] The integral cover 108 includes a flat flange 112 extending from the raised central portion 110 to the edge of the substrate 106. The flat flange 112 has a lateral edge 123. When the cover is mounted to the substrate 106, the lateral edge 123 of the flange 112 is very close to the lateral edge 121. The width dimension of the flange 112 can be substantially the same as the width dimension of the substrate 106. Alternatively, the width dimension of the flange 112 can be slightly smaller than the width dimension of the substrate 106, so that when the cover 108 is mounted on the substrate 106, there is a lateral separation dimension D4 between the edge 123 of the flange 112 and the edge 121 of the substrate 106. The dimension D4 can be between 0.1 mm and 0.3 mm, but other dimensions can be utilized without departing from the scope of the present disclosure. The relatively large width of the flange 112 helps to ensure that the sensor module 102 is waterproof.

[0055] Figure 2B According to an embodiment Figure 2A A top view of the sensor module 102 is shown. Figure 2A The top view further illustrates the relative shape and position of the substrate 106 and the flange 112. In addition, Figure 2BThe top view of the embodiment of the present invention shows that the flange 112 has rounded corners. In addition, the raised center housing 110 also has rounded corners. Alternatively, one or both of the flange 112 and the raised center housing 110 can have sharp corners. Although a rectangular substrate 106 and cover 108 have been shown, in practice, other shapes can be utilized. For example, the substrate 106 and cover 108 can have a circular shape, an oval shape, or other shapes without departing from the scope of the present disclosure.

[0056] Figure 2C According to an embodiment Figure 2A 102 is a side view of the sensor module 102. Figure 2C The side view of 110 shows the curved nature of the raised center housing 110 and the flat nature of the flange 112. The flange 112 has a substantially flat bottom surface. In one embodiment, the overall height of the raised center housing above the substrate 106 is between 1 mm and 2 mm, but other heights may be utilized without departing from the scope of the present disclosure.

[0057] In one embodiment, the width of flange 112 from edge to edge is at least twice the height of raised center housing 110. In one embodiment, the width of flange 112 is more than three times the height of raised center housing 110. The relatively large width of the flange helps ensure waterproofing without the use of an O-ring. Other ratios of width to height may be used without departing from the scope of the present disclosure.

[0058] Figure 3A is a perspective view of a sensor module 102 and an intermediate assembly stage according to some embodiments. Figure 3A In the embodiment of the present invention, there is a substrate 106. A strip of glue 130 is positioned adjacent to the edge of the substrate 106. As will be explained in more detail below, the glue will be used to mount the cover 108 to the substrate 106. The substrate 106 includes an electrical connector 132.

[0059] exist Figure 3B 1 , ASIC 103 has been mounted to substrate 106 adjacent electrical connector 132. ASIC 103 may include leads, contact pads, or other types of connectors that may be used to electrically couple ASIC 103 to electrical connector 132.

[0060] exist Figure 3C , mounting glue 134 has been applied to the top surface of ASIC 103. This mounting will be used to adhere MEMS pressure sensor 101 to ASIC 103. Alternatively, mounting glue 134 may be placed on substrate 106 so that MEMS pressure sensor 101 may be mounted directly to substrate 106.

[0061] exist Figure 3D, the MEMS sensor 101 has been mounted to the ASIC 103. Specifically, the MEMS sensor 101 has been placed on the glue 134 to adhere the MEMS sensor 101 to the ASIC 103. The MEMS sensor 101 is mounted to the substrate 106 by mounting the MEMS sensor 101 to the ASIC 103 which is mounted to the substrate 106.

[0062] exist Figure 3E 1, a wire bonding process has been performed. The wire bonds extend between an electrical connector (e.g., contact pads) of the MEMS sensor 101 and an electrical connector of the ASIC 103. In this manner, the MEMS sensor 101 is electrically coupled to the ASIC 103 so that sensor signals can be transferred from the MEMS sensor 101 to the ASIC 103. The wire bonds extend from the electrical connector on the ASIC 103 to the electrical connector 132 of the substrate 106. Other types of electrical connectors may be utilized without departing from the scope of the present disclosure.

[0063] exist Figure 3F , the integrated cover 108 has been mounted to the substrate 106. Specifically, the bottom surface of the flange 112 has been mounted to the top surface of the substrate 106 via glue 130.

[0064] Figure 3G According to one embodiment Figure 3F A simplified cross-sectional view of the sensor module 102 after the stage of processing is shown. Figure 3G In the embodiment, the sealing gel 140 has been placed in the raised center shell 110. The sealing gel 140 only partially fills the raised center shell 110. An annealing or curing process is then performed to cure the sealing gel 140. This is part of the waterproofing process.

[0065] exist Figure 3H , a second dose of sealing gel 140 has been placed in the raised center housing 110. The second dose of sealing gel 140 fills the remaining portion of the raised center housing 110. An annealing or curing process is then performed. The waterproofing of the sensor module 102 is now complete. Applying the curing of the sealing gel in two separate application steps is very beneficial. Specifically, the process results in a complete or almost complete absence of bubbles within the raised center housing 110. The presence of bubbles in the raised center housing 110 can be problematic.

[0066] The MEMS pressure sensor 101 detects pressure via the sealing gel 140. Specifically, the fluid pressure causes the sealing gel 140 to flex, which further causes a diaphragm (or other mechanism) within the MEMS sensor 101 to deflect. Thus, the gel 140 makes the MEMS sensor 101 waterproof while still enabling the MEMS sensor 101 to sense pressure. Other configurations of the sensor module 102 may be utilized without departing from the scope of the present disclosure.

[0067] Fig. 3I is a side view of a sensor module 102 according to one embodiment. Fig. 3I 1, the housing 150 of the electronic device 100 has been mounted to the flange 112 of the cover 108. The flange 112 may include a groove or scoring 158 on the top surface of the flange 112. The housing 150 is then mounted to the cover by securing the leg portion 152 to the groove 158 via glue 156. The housing 150 includes a hole 154 that allows fluid communication with the MEMS sensor 101. Other configurations of the housing may be utilized without departing from the scope of the present disclosure.

[0068] Figure 4 is a block diagram of an electronic device 100 according to one embodiment. Figure 4 The diagram of FIG. 1 shows the generation and transfer of signals within electronic device 100 . Electronic device 100 includes control circuitry 164 , display 166 , and communication circuitry 168 .

[0069] The MEMS sensor 101 generates a sensor signal 160 and transmits the sensor signal 160 to the ASIC 103, as previously described. The ASIC 103 receives the sensor signal 160 and generates a digital sensor signal 162 by processing and conditioning the sensor signal 160, as previously described. The ASIC 103 transmits the sensor signal 162 to the control circuit 164. The control circuit 164 may correspond to one or more processors of the electronic device 100 that are not mounted on the substrate 106. The ASIC 103 may also include a controller processor. The control circuit 164 receives the digital sensor data 162, and may store or process the digital sensor data 162 and provide the data 170 to the display 166 or the communication circuit device 168. The display 166 may display data associated with the pressure signal to the user. The communication circuit device 168 may include a wired or wireless communication circuit device that enables the data 172 to be transmitted to an external device by wire or wireless.

[0070] Figure 5 is a diagram of a smart watch 170 according to one embodiment. The smart watch 170 is Figure 1 or Figure 4An example of an electronic device 100 of FIG. 100. The sensor module 102 shown in dashed lines is installed in the smart watch 170. The sensor module 102 can be positioned at a position where fluid communication can be achieved, so that the sensor module 102 can sense fluid pressure. The sensor module 102 can correspond to the sensor module shown in the previous figure.

[0071] Figure 6 is a diagram of a smart phone 180 according to one embodiment. Smart phone 180 is Figure 1 or Figure 4 An example of an electronic device 100 of FIG. 100. The sensor module 102 shown in dashed lines is installed in the smart phone 180. The sensor module 102 can be positioned at a position where fluid communication can be achieved, so that the sensor module 102 can sense fluid pressure. The sensor module 102 can correspond to the sensor module 102 shown in the previous figure.

[0072] Figure 7 700 is a flow chart of a method 700 for assembling a sensor module according to one embodiment. At 702, the method 700 includes mounting a MEMS pressure sensor on an organic substrate. At 704, the method 700 includes mounting an integral cover on the organic substrate. The integral cover includes a central raised portion, a hole in the central raised portion, and a flat flange, the central raised portion accommodating the MEMS pressure sensor, and the flat flange extending from the central raised portion to the edge of the organic substrate. At 706, the method 700 includes partially filling the central raised portion with a sealing gel. At 708, the method 700 includes performing a first curing process for the sealing gel. At 710, the method 700 includes filling the remaining portion of the central raised portion with the sealing gel after performing the first curing process. At 712, the method 700 includes performing a second curing process for the sealing gel.

[0073] Figure 8 is a flow chart of a method 800 for operating an electronic device according to one embodiment. At 802, the method 800 includes generating an analog pressure signal using a MEMS pressure sensor coupled to a substrate. At 804, the method 800 includes receiving a digital pressure signal based on the analog pressure signal using an ASIC electrically coupled to the MEMS pressure sensor. At 806, the method 800 includes transmitting the digital pressure signal to a control circuit of the electronic device, wherein the MEMS pressure sensor and the ASIC are positioned within a central raised portion of a unitary cover, the unitary cover being mounted on the substrate and including a hole in the central raised portion, and a flat flange extending from the central raised portion to an edge of the substrate.

[0074] In one embodiment, a sensor module includes a substrate, a MEMS pressure sensor mounted to the organic substrate, and an integral cover mounted on the substrate. The integral cover includes a central raised portion, a hole in the central raised portion, and a flat flange, the central raised portion accommodating the MEMS pressure sensor, the flat flange extending from the central raised portion toward an edge of the organic substrate.

[0075] In one embodiment, the sensor module includes an ASIC electrically coupled to the MEMS pressure sensor and mounted on the organic substrate below the central elevated portion.

[0076] In one embodiment, the sensor module includes a sealing gel within the central raised portion.

[0077] In one embodiment, the integral cover is stainless steel.

[0078] In one embodiment, the height of the central elevated portion above the organic substrate is less than 3 mm.

[0079] In one embodiment, the diameter of the central hole is less than 1 mm.

[0080] In one embodiment, the organic substrate has a rectangular surface with four lateral edges, wherein the integral flange extends to within 1 mm of each lateral edge.

[0081] In one embodiment, the flange has a groove in the top surface.

[0082] In one embodiment, the organic substrate has a circular top surface, wherein the flange has a circular edge.

[0083] In one embodiment, a method includes mounting a MEMS pressure sensor on an organic substrate and mounting an integral cover on the organic substrate. The integral cover includes a central raised portion, a hole in the central raised portion, and a flat flange, the central raised portion accommodating the MEMS pressure sensor, the flat flange extending from the central raised portion to an edge of the organic substrate. The method includes partially filling the central raised portion with a sealing gel, performing a first curing process of the sealing gel, filling a remaining portion of the central raised portion with the sealing gel after performing the first curing process, and performing a second curing process of the sealing gel.

[0084] In one embodiment, mounting the integrated cover to the organic substrate includes gluing the flange to the organic substrate.

[0085] In one embodiment, the method includes mounting the ASIC to the organic substrate before mounting the integral cover to the organic substrate.

[0086] In one embodiment, the method includes gluing a housing of the electronic device to a top surface of the flange.

[0087] In one embodiment, gluing the housing to the top surface of the flange includes gluing the housing to a grooved portion of the top surface.

[0088] In one embodiment, the integral cover is stainless steel.

[0089] In one embodiment, the organic substrate has a rectangular surface with four lateral edges, wherein the integral flange extends to within 1 mm of each lateral edge.

[0090] In one embodiment, a method includes: generating an analog pressure signal using a MEMS pressure sensor coupled to a substrate; receiving a digital pressure signal based on the analog pressure signal using an ASIC electrically coupled to the MEMS pressure sensor; and transmitting the digital pressure signal to a control circuit of an electronic device. The MEMS pressure sensor and the ASIC are positioned within a central raised portion of an integral cover, the integral cover being mounted on the substrate and including a hole in the central raised portion and a flat flange extending from the central raised portion to an edge of the substrate.

[0091] In one embodiment, the electronic device is a smart watch.

[0092] In one embodiment, the electronic device is a smart phone.

[0093] The various embodiments described above can be combined to provide additional embodiments. These and other changes can be made to the embodiments according to the above detailed description. In general, in the appended claims, the terms used should not be interpreted as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted as including all possible embodiments and the full range of equivalents enjoyed by these claims. Therefore, these claims are not limited by this disclosure.

Claims

1. A sensor module, comprising: substrate; a MEMS pressure sensor mounted to the substrate; an integral cover mounted on the substrate and comprising: a central raised portion, the central raised portion accommodating the MEMS pressure sensor; a hole in the central raised portion; and A flat flange extends from the central raised portion toward an edge of the organic substrate. 2 . The sensor module of claim 1 , comprising an ASIC electrically coupled to the MEMS pressure sensor and mounted on the substrate below the central elevated portion. The sensor module of claim 1 , comprising a sealing gel within the central raised portion. The sensor module of claim 1 , wherein a ratio of a width of the flat flange to a height of the central raised portion is at least 3. 5 . The sensor module of claim 1 , wherein a height of the central elevated portion above the substrate is less than 3 mm. The sensor module according to claim 1 , wherein the diameter of the central hole is less than 1 mm.

7. The sensor module of claim 1, wherein the substrate has a rectangular surface with four lateral edges, wherein the integral flange extends to within 0.2 mm of each lateral edge. The sensor module of claim 1 , wherein the flange has a groove in the top surface. 9 . The sensor module of claim 1 , wherein the organic substrate has a rounded top surface, wherein the flange has a rounded edge.

10. A method comprising: Mounting a MEMS pressure sensor on a substrate; An integral cover is mounted on the substrate, the integral cover comprising: a central raised portion, the central raised portion accommodating the MEMS pressure sensor; a hole in the central raised portion; and a flat flange extending from the central raised portion to an edge of the substrate; partially filling the central raised portion with a sealing gel; performing a first curing process of the sealing gel; After performing the first curing process, filling the remaining portion of the central raised portion with the sealing gel; and A second curing process of the sealing gel is performed.

11. The method of claim 10, wherein mounting the integral cover to the substrate comprises: The flange is glued to the substrate.

12. The method according to claim 10, comprising: An ASIC is mounted to the substrate prior to mounting the integral cover to the substrate.

13. The method according to claim 10, comprising: The housing of the electronic device is glued to the top surface of the flange.

14. The method of claim 13, wherein gluing the housing to the top surface of the flange comprises: The housing is glued to the grooved portion of the top surface.

15. The method of claim 10, wherein the integral cover is stainless steel.

16. The method of claim 10, wherein the height of the central elevated portion above the substrate is less than 3 mm.

17. The sensor module of claim 1, wherein the substrate has a rectangular surface with four lateral edges, wherein the integral flange extends to within 1 mm of each lateral edge.

18. A method comprising: generating an analog pressure signal using a MEMS pressure sensor, the MEMS pressure sensor being coupled to the substrate; receiving a digital pressure signal with an ASIC electrically coupled to the MEMS pressure sensor, the digital pressure signal being based on the analog pressure signal; The digital pressure signal is transmitted to the control circuit of the electronic device, wherein the MEMS pressure sensor and the ASIC are positioned in a central raised portion of an integral cover, the integral cover is mounted on the substrate and includes a hole and a flat flange, the hole is in the central raised portion, and the flat flange extends from the central raised portion to the edge of the substrate. The method of claim 18 , wherein the electronic device is a smart watch.

20. The method of claim 18, wherein the electronic device is a smart phone.

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