Equipment power consumption detection method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention provides an equipment power consumption detection method and device, electronic equipment and a computer readable storage medium, and relates to the field of intelligent transportation. The method comprises the following steps: determining thermal radiation power and thermal convection power of the outer surface of to-be-detected equipment; and determining the power consumption of the to-be-detected equipment according to the thermal radiation power and the thermal convection power. The method is suitable for equipment adopting passive heat dissipation, the heat radiation power and the heat convection power of the outer surface of the to-be-detected equipment are determined, the two kinds of power are summed, the external heat dissipation power of the to-be-detected equipment in the balance state can be obtained, the heat dissipation power is equal to the power consumption of the to-be-detected equipment, and the heat dissipation efficiency of the to-be-detected equipment is improved. Product designers are effectively helped to assess system risks without detailed heat dissipation simulation means, and the effectiveness and risk control ability of product design are effectively improved.

Description

Technical Field

[0001] The present application relates to the field of smart transportation technology. Specifically, the present application relates to a method, device, electronic device, computer-readable storage medium and computer program product for detecting power consumption of a device. Background Art

[0002] The relevant technologies for determining heat dissipation power mainly include surface heat flux density estimation and volume power density estimation.

[0003] After determining the surface area of ​​the device to be tested, the surface heat flux density estimation method quickly calculates the heat dissipation power range of the device to be tested based on different heat dissipation methods. However, the disadvantage is that after selecting a heat dissipation method, the upper and lower limits of the heat flux density differ greatly, and the range of the calculated heat dissipation power is also large.

[0004] The volume power density method can obtain an exact value, but this solution ignores the thermal radiation capacity of large surfaces when targeting thin products, resulting in a large deviation between the estimated value and the actual situation. Summary of the invention

[0005] The embodiments of the present application provide a method, apparatus, electronic device, computer-readable storage medium and computer program product for detecting power consumption of a device, which can solve the above-mentioned problems of the prior art. The technical solution is as follows:

[0006] According to one aspect of an embodiment of the present application, a method for detecting power consumption of a device is provided, the method comprising:

[0007] Determine the thermal radiation power and thermal convection power of the outer surface of the device to be tested;

[0008] The power consumption of the device to be detected is determined according to the heat radiation power and the heat convection power.

[0009] According to another aspect of an embodiment of the present application, a device for detecting power consumption of a device is provided, the device comprising:

[0010] A power determination module, used to determine the thermal radiation power and thermal convection power of the outer surface of the device to be detected;

[0011] The power consumption determination module is used to determine the power consumption of the device to be detected according to the thermal radiation power and the thermal convection power.

[0012] As an optional implementation, when the device to be detected is not externally connected to a heat dissipation device, the outer surface of the device to be detected includes the outer surface of the body of the device to be detected;

[0013] When the device to be detected is externally connected to a heat dissipation device, the outer surface of the device to be detected includes the outer surface of the body of the device to be detected and the outer surface of the heat dissipation device.

[0014] As an optional implementation manner, the power determination module includes:

[0015] A regional radiation submodule, for determining the thermal radiation power of each region of the outer surface, each region having a different material;

[0016] The radiation summing module is used to take the sum of the thermal radiation powers of each area as the thermal radiation power of the outer surface of the device to be detected.

[0017] As an optional implementation manner, the power determination module includes:

[0018] A parameter determination submodule, for determining the heat transfer area, convection heat transfer coefficient, outer surface temperature and ambient temperature of the outer surface;

[0019] The thermal convection power determination submodule is used to determine the temperature difference between the outer surface temperature and the ambient temperature, and determine the thermal convection power of the outer surface of the device to be detected based on the heat transfer area, convection heat transfer coefficient and temperature difference of the outer surface.

[0020] As an optional implementation, the regional radiation submodule includes:

[0021] A radiation capacity determination unit, which determines the heat radiation capacity of the device to be detected and the external environment in the region, as well as the heat radiation area of ​​the region;

[0022] The radiation conversion unit is used to determine the difference in thermal radiation capability between the device to be detected and the external environment in the area, and obtain the thermal radiation power of the area according to the difference in capability and the thermal radiation area.

[0023] As an optional implementation manner, the radiation capability determination unit includes:

[0024] A parameter determination subunit, for determining the surface blackness, Boltzmann constant, external surface temperature and ambient temperature of the region;

[0025] A first capability determination subunit, configured to obtain the thermal radiation capability of the device to be detected in the area according to the surface blackness, the Boltzmann constant and the outer surface temperature of the area;

[0026] The second capability determination subunit is used to obtain the thermal radiation capability of the external environment in the area according to the surface blackness, the Boltzmann constant and the ambient temperature of the area.

[0027] As an optional embodiment, the convective heat transfer coefficient is related to one of the following parameters:

[0028] Thermal conductivity of air, viscosity, specific heat of fluid, density, volume expansion coefficient, temperature and flow state.

[0029] As an optional implementation manner, the device for detecting power consumption of the device further includes:

[0030] The adjustment module is used to adjust at least one of the components and the layout of the components of the device to be detected if it is determined that the power consumption of the device to be detected does not meet the preset conditions, until the adjusted power consumption of the device to be detected meets the preset conditions.

[0031] According to another aspect of an embodiment of the present application, an electronic device is provided. The electronic device includes a memory, a processor, and a computer program stored in the memory, and the processor executes the computer program to implement the steps of the above method.

[0032] According to another aspect of the embodiments of the present application, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0033] According to one aspect of an embodiment of the present application, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0034] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0035] It is suitable for devices that adopt passive heat dissipation. By determining the thermal radiation power and thermal convection power of the outer surface of the device to be tested and summing the two powers, the external heat dissipation power of the device to be tested in a balanced state can be obtained, and the heat dissipation power is equated with the power consumption of the device to be tested. It effectively helps product designers evaluate system risks without detailed heat dissipation simulation methods, and effectively improves the effectiveness of product design and risk control capabilities. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in describing the embodiments of the present application are briefly introduced below.

[0037] Figure 1 A schematic diagram of a system architecture for implementing heat dissipation power detection provided in an embodiment of the present application;

[0038] Figure 2a A heat dissipation estimation model for achieving a stable thermal equilibrium state between the surface of an object and the external environment provided in an embodiment of the present application;

[0039] Figure 2b A schematic diagram of a flow chart of a method for detecting power consumption of a device provided in an embodiment of the present application;

[0040] Figure 2c A heat dissipation estimation model for achieving a stable thermal equilibrium state between the surface of an object and the external environment provided in an embodiment of the present application;

[0041] Figure 3 A schematic diagram of the connection relationship between a main body of a device to be detected and an external heat dissipation device provided in an embodiment of the present application;

[0042] Figure 4 A schematic diagram of the structure of a device to be detected provided in an embodiment of the present application;

[0043] Figure 5 A schematic diagram of a flow chart of a method for detecting power consumption of a device provided in an embodiment of the present application;

[0044] Figure 6 A schematic diagram of a flow chart of a method for detecting power consumption of a device provided in another embodiment of the present application;

[0045] Figure 7 A schematic diagram of a scenario applied to a vehicle networking scenario provided in an embodiment of the present application;

[0046] Figure 8 A schematic diagram of the structure of a device power consumption detection apparatus provided in an embodiment of the present application;

[0047] Fig. 9 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0048] The embodiments of the present application are described below in conjunction with the drawings in the present application. It should be understood that the implementation methods described below in conjunction with the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions of the embodiments of the present application.

[0049] It will be understood by those skilled in the art that, unless specifically stated, the singular forms "one", "an" and "the" used herein may also include plural forms. It should be further understood that the terms "including" and "comprising" used in the embodiments of the present application refer to that the corresponding features can be implemented as the presented features, information, data, steps, operations, elements and / or components, but do not exclude the implementation as other features, information, data, steps, operations, elements, components and / or combinations thereof supported by the technical field. It should be understood that when we call an element "connected" or "coupled" to another element, the one element can be directly connected or coupled to the other element, or it can refer to that the one element and the other element establish a connection relationship through an intermediate element. In addition, the "connection" or "coupling" used here may include wireless connection or wireless coupling. The term "and / or" used here indicates at least one of the items defined by the term, for example, "A and / or B" can be implemented as "A", or as "B", or as "A and B".

[0050] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0051] First, several terms involved in this application are introduced and explained:

[0052] The transfer of heat is caused by the temperature difference inside or between objects. If there is no external work input, according to the second law of thermodynamics, heat will always automatically transfer from a high temperature to a low temperature. There are three basic ways to transfer heat energy: heat conduction, heat convection, and heat radiation. The following introduces these three ways of heat transfer:

[0053] Heat conduction, when there is no relative displacement between the parts of an object, the transfer of heat energy generated by the thermal motion of microscopic particles such as molecules, atoms and free electrons is called heat conduction.

[0054] The basic calculation formula for heat conduction is Fourier's law: the amount of heat transferred by heat conduction per unit time is proportional to the cross-sectional area perpendicular to the heat flow and to the temperature gradient. The negative sign indicates that the direction of heat conduction is opposite to the direction of the temperature gradient.

[0055] Thermal convection refers to the process of heat transfer caused by the relative displacement between the parts of the fluid due to the macroscopic movement of the fluid, and the mixing of cold and hot fluids. Thermal convection only occurs in the fluid, and since the molecules in the fluid also undergo irregular thermal motion, thermal convection is always accompanied by heat conduction.

[0056] The theoretical basis of convective heat transfer is Newton's law of cooling, referring to the following relationship Q = αA (T w -T air), α represents the convective heat transfer coefficient, α=f(g,l,ρ,μ,Δt,λ f ,c p ), A represents the heat transfer area, g represents the thermal conductivity of air, l represents the distance that air cools from high temperature to low temperature, ρ represents the density of air, μ represents the viscosity of air, Δt represents the temperature difference between air and object, λ f represents the air temperature, c p Indicates the flow state of air.

[0057] Thermal radiation is the way an object transfers energy through electromagnetic waves. Objects emit radiation for various reasons, and the radiation energy phenomenon emitted due to heat is called thermal radiation.

[0058] Radiation is different from the first two methods of heat transfer in that the first two require the presence of matter, while radiation can transfer energy in a vacuum and is even most efficient in a vacuum.

[0059] The thermal radiation capacity E can be calculated based on the empirical formula of Boltzmann's law. The thermal radiation capacity of an object is proportional to the fourth power of the temperature. The specific relationship is: E = ∈σT 4 , where ∈ represents the surface blackness of the object, σ represents the Boltzmann constant, and T represents the temperature.

[0060] To convert the thermal radiation capacity into radiation power, it is necessary to form a product relationship with the radiation area, and the relationship evolves into: Q = ∈ Aσ (T w 4 -T air 4 ), A represents the heat radiation area.

[0061] Intelligent Traffic System (ITS), also known as Intelligent Transportation System, effectively and comprehensively applies advanced science and technology (information technology, computer technology, data communication technology, sensor technology, electronic control technology, automatic control theory, operations research, artificial intelligence, etc.) to transportation, service control and vehicle manufacturing, strengthens the connection between vehicles, roads and users, and thus forms a comprehensive transportation system that ensures safety, improves efficiency, improves the environment and saves energy.

[0062] The device power consumption detection method, apparatus, electronic device, computer-readable storage medium and computer program product provided in the present application are intended to solve the above technical problems in the prior art.

[0063] The following describes several exemplary embodiments to illustrate the technical solutions of the embodiments of the present application and the technical effects produced by the technical solutions of the present application. It should be noted that the following embodiments can refer to, draw on or combine with each other, and the same terms, similar features and similar implementation steps in different embodiments will not be described repeatedly.

[0064] Figure 1 A schematic diagram of a system architecture for implementing heat dissipation power detection provided in an embodiment of the present application, wherein the system may include a terminal 100 and a server 200, the terminal 100 and the server 200 are connected via a network, an application client (hereinafter referred to as application) for detecting device power consumption is installed in the terminal, a detection device is integrated in the server, and the terminal 100 can access the server 200. In the embodiment of the present application, the server 200 is mainly used to obtain parameters such as the surface area, surface temperature, and ambient temperature of the device to be detected fed back by the terminal, and determine the thermal radiation power and thermal convection power of the outer surface of the device to be detected based on the above parameters, and determine the power consumption of the device to be detected according to the thermal radiation power and thermal convection power.

[0065] In the embodiment of the present invention, the server 200 may be an independent server, or a server network or server cluster composed of servers. For example, the server 200 described in the embodiment of the present invention includes but is not limited to a computer, a network host, a single network server, a plurality of network server sets or a cloud server composed of a plurality of servers. Among them, the cloud server is composed of a large number of computers or network servers based on cloud computing (Cloud Computing). In the embodiment of the present invention, communication between the server and the terminal can be achieved through any communication method, including but not limited to mobile communication based on the 3rd Generation Partnership Project (3GPP), Long Term Evolution (LTE), Worldwide Interoperability for Microwave Access (WiMAX), or computer network communication based on TCP / IP Protocol Suite (TCP / IP), User Datagram Protocol (UDP) protocol, etc.

[0066] It can be understood that the terminal 100 used in the embodiment of the present invention can be understood as a client device, and the terminal 100 includes both receiving and transmitting hardware, that is, a device with receiving and transmitting hardware capable of performing two-way communication on a two-way communication link. Such a terminal may include: a cellular or other communication device having a single-line display or a multi-line display or a cellular or other communication device without a multi-line display. The specific terminal 100 can be a desktop terminal or a mobile terminal. The terminal 100 can be one of a mobile phone, a tablet computer, a laptop computer, a vehicle-mounted terminal, etc., and at least one application that can access the network is pre-installed in the terminal 100.

[0067] Those skilled in the art will understand that Figure 1 The application environment shown in the figure is only one application scenario of the present application solution and does not constitute a limitation on the application scenario of the present application solution. Other application environments may also include Figure 1 More or fewer servers, or server network connections, as shown in Figure 1 Only one server and two terminals are shown. It can be understood that the data anomaly identification system may also include one or more other servers, and / or one or more terminals connected to the server network, which is not specifically limited here.

[0068] The embodiment of the present application provides a heat dissipation estimation model in which the surface of the object reaches a stable thermal equilibrium state with the external environment by considering the device to be detected as an object with uniform heat distribution. Figure 2a As shown, the device to be detected is an electronic device with a camera and a processor, so there are two main sources of heat: the processor and the camera. The heat generated by the processor is first thermally conducted to the radiator inside the device to be detected, and then thermally radiated to the air inside the device to be detected, and further thermally conducted to the outer shell of the device to be detected, and the heat is conducted to the outside air through thermal radiation and thermal convection. Similarly, the heat generated by the camera is first thermally conducted to the radiator inside the device to be detected, and then thermally radiated to the air inside the device to be detected, and further thermally conducted to the outer shell of the device to be detected, and the heat is conducted to the outside air through thermal radiation and thermal convection. Through the above model, when the embodiment of the present application performs thermal evaluation on the device to be detected, that is, when detecting the heat dissipation power, it only needs to consider how to calculate the thermal radiation power of the device to be detected to the external environment and the heat exchange power of thermal convection. The sum of the two is the external heat dissipation power of the device to be detected in a balanced state, which can also be approximately equivalent to the power consumption of the device to be detected.

[0069] The present application provides a method for detecting power consumption of a device, such as Figure 2b As shown, the method includes:

[0070] S101, determining the thermal radiation power and thermal convection power of the outer surface of the device to be tested;

[0071] S102: Determine the power consumption of the device to be detected according to the thermal radiation power and the thermal convection power.

[0072] The embodiments of the present application are applicable to devices that adopt passive heat dissipation. By determining the thermal radiation power and thermal convection power of the outer surface of the device to be tested and summing the two powers, the external heat dissipation power of the device to be tested in a balanced state can be obtained, and the heat dissipation power is equated with the power consumption of the device to be tested, which effectively helps product designers evaluate system risks without detailed heat dissipation simulation methods, and effectively improves the effectiveness of product design and risk control capabilities.

[0073] See also Figure 2c , which exemplarily shows a heat dissipation estimation model when the device to be detected is connected to an external heat dissipation device. As shown in the figure, the heat generated by the processor and the camera is thermally conducted to the external heat dissipation device, and the internal radiator also conducts the heat to the heat dissipation device, and the heat dissipation device further radiates the heat to the external air, and conducts the heat to the external air through heat convection and heat radiation.

[0074] Based on the above embodiments, as an optional embodiment, when the device to be detected is not externally connected to a heat dissipation device, the outer surface of the device to be detected includes the outer surface of the body of the device to be detected;

[0075] When the device to be detected is externally connected to a heat dissipation device, the outer surface of the device to be detected includes the outer surface of the body of the device to be detected and the outer surface of the heat dissipation device.

[0076] That is to say, when the device to be detected is externally cooled by a heat dissipation device, the power consumption of the device to be detected is taken as the sum of the thermal radiation power and thermal convection power of the outer surface of the device to be detected and the thermal radiation power and thermal convection power of the outer surface of the heat dissipation device.

[0077] In some embodiments, when there is an area on the outer surface of the body of the device to be detected that is blocked by an external heat sink, the blocked area does not need to count the thermal radiation power and thermal convection power. Figure 3, which exemplarily shows a schematic diagram of the connection relationship between the main body of the device to be detected and the external heat dissipation device in the embodiment of the present application. As shown in the figure, the heat dissipation device 302 is externally connected above the main body 301 of the device to be detected, and the heat dissipation device 302 blocks a part of the area b on the outer surface of the main body 301. Therefore, when calculating the thermal radiation power and thermal convection power of the main body, the thermal radiation power and thermal convection power of area b will not be calculated, but only the thermal radiation power and thermal convection power of area a and area c will be calculated. Similarly, for the external heat dissipation device 302, the thermal radiation power and thermal convection power of area b will not be calculated, and only the thermal radiation power and thermal convection power of the other five surfaces will be calculated.

[0078] Based on the above embodiments, as an optional embodiment, determining the thermal radiation power of the outer surface of the device to be detected includes:

[0079] Determining the thermal radiation power of various regions of the outer surface, the regions being made of different materials;

[0080] The sum of the thermal radiation powers of the various regions is taken as the thermal radiation power of the outer surface of the device to be detected.

[0081] Since the thermal radiation power is related to the material of the object, the embodiment of the present application can obtain the material information of the device to be detected, divide the outer surface of the device to be detected into multiple areas, and then determine the thermal radiation power of each area respectively, and then summarize the thermal radiation power of all areas to obtain the thermal radiation power of the outer surface of the device to be detected.

[0082] It should be understood that when the device to be detected has an external heat dissipation device, each region includes regions of different materials in the body of the device to be detected and regions of different materials in the heat dissipation device.

[0083] Based on the above embodiments, as an optional embodiment, the embodiment of the present application determines the thermal convection power of the outer surface of the device to be detected, including:

[0084] determining a heat transfer area, a convective heat transfer coefficient, an outer surface temperature, and an ambient temperature of the outer surface;

[0085] The temperature difference between the outer surface temperature and the ambient temperature is determined, and the thermal convection power of the outer surface of the device to be detected is determined according to the heat transfer area, the convection heat transfer coefficient and the temperature difference of the outer surface.

[0086] When determining the thermal convection power, since the thermal convection power is not directly related to the material itself, but is related to the convection heat transfer coefficient of the fluid (such as air), the embodiment of the present application directly determines the heat transfer area of ​​the outer surface, the convection heat transfer system, the outer surface temperature and the ambient temperature, and determines the temperature difference between the outer surface temperature and the ambient temperature, and uses the heat transfer area of ​​the outer surface, the convection heat transfer coefficient and the temperature difference to determine the thermal convection power of the outer surface.

[0087] In some embodiments, the thermal convection power Q of the outer surface of the device to be detected is r The calculation formula can be expressed as:

[0088] Q r =α*S*ΔT

[0089] Wherein, α represents the convection heat transfer coefficient, S represents the heat transfer area of ​​the outer surface of the device to be tested, and ΔT represents the temperature difference.

[0090] In some embodiments, the convective heat transfer coefficient during passive heat dissipation can be approximately calculated using the following formula:

[0091] α=(ΔT / l) B

[0092] Among them, C represents the state factor related to the size of the device to be tested, l represents the distance traveled by the air to complete the temperature cooling from high temperature to low temperature, and B represents the state factor related to the placement state of the device to be tested.

[0093] In some embodiments, the convective heat transfer coefficient can also be expressed as a constant of 3 to 5 W / m 2K .

[0094] Based on the above embodiments, as an optional embodiment, the heat radiation power of each area is determined by the following method:

[0095] Determine the heat radiation capacity of the device to be tested and the external environment in the area, as well as the heat radiation area of ​​the area;

[0096] The ability difference between the device to be detected and the external environment in the region of heat radiation is determined, and the heat radiation power of the region is obtained according to the ability difference and the heat radiation area.

[0097] It should be noted that according to the theoretical basis of thermal radiation power: the Stepan-Boltzmann law, it can be known that the thermal radiation capacity of an object is proportional to the fourth power of the temperature. To convert the thermal radiation capacity into radiation power, the thermal radiation capacity and the radiation area need to form a product relationship, and it is necessary to calculate the capacity difference between the equipment to be tested and the external environment in the thermal radiation content of the area. Based on the capacity difference and the thermal radiation area, the thermal radiation power of the area is obtained.

[0098] Based on the above embodiments, as an optional embodiment, determining the thermal radiation capacity of the device to be detected and the external environment in the area includes:

[0099] determining the surface blackness, the Boltzmann constant, the external surface temperature, and the ambient temperature of the region;

[0100] Obtaining the thermal radiation capability of the device to be tested in the area according to the surface blackness, Boltzmann constant and outer surface temperature of the area;

[0101] According to the surface blackness, Boltzmann constant and ambient temperature of the area, the thermal radiation capacity of the external environment in the area is obtained.

[0102] Specifically, in the embodiment of the present application, the heat radiation capacity E1 of the device to be detected in the area can be calculated by the following formula:

[0103]

[0104] Among them, ∈ represents the surface blackness of the area, σ represents the Boltzmann constant, T w Indicates the external surface temperature.

[0105] In the embodiment of the present application, the heat radiation capacity E2 of the external environment in the area can be calculated by the following formula:

[0106]

[0107] Among them, ∈ represents the surface blackness of the area, σ represents the Boltzmann constant, T air Indicates the ambient temperature.

[0108] Accordingly, the heat radiation power of each area in the embodiment of the present application can be expressed by the following formula:

[0109]

[0110] Where A represents the thermal radiation area of ​​the region.

[0111] See also Figure 4 , which exemplarily shows a schematic diagram of the structure of the device to be detected provided in an embodiment of the present application. As shown in the figure, the device to be detected is a scan code payment device. As shown in the figure, the device is a hexahedron, and the six faces are respectively represented as S1 to S6 in the figure. The material of the upper surface S1 of the device is glass, and the materials of the other five faces are plastic. Due to the difference in the materials of S1 and S2 to S6, the thermal radiation power of the upper surface S1 needs to be calculated separately. Specifically, the thermal radiation power Q of the outer surface of the device is C =Q c.1 +Q c.2 +Qc.3 +Q c.4 +Q c.5 +Q c.6 ; Among them, Q c.i The heat convection power Q of the outer surface of the device is r =α*(S1+S2+S3+S4+S5+S6)*ΔT,S i represents the heat transfer area of ​​the i-th surface.

[0112] See also Figure 5 , which exemplarily shows a flow chart of a method for detecting power consumption of a device according to an embodiment of the present application, as shown in the figure, including:

[0113] S201, determining each area of ​​the outer surface of the device to be tested and the heat radiation area of ​​each area, wherein the materials of the areas are different;

[0114] S202, for each area, determining the surface blackness, Boltzmann constant, external surface temperature and ambient temperature of the area;

[0115] S203, for each area, according to the surface blackness, Boltzmann constant and outer surface temperature of the area, obtaining the thermal radiation capacity of the device to be tested in the area;

[0116] S204, for each area, determining the difference in thermal radiation capability between the device to be detected and the external environment in the area, and obtaining the thermal radiation power of the area according to the difference in capability and the thermal radiation area;

[0117] S205, taking the sum of the thermal radiation powers of each area as the thermal radiation power of the outer surface of the device to be detected;

[0118] S206, determining the heat transfer area, convection heat transfer coefficient, outer surface temperature and ambient temperature of the outer surface;

[0119] S207, determining the temperature difference between the outer surface temperature and the ambient temperature, and determining the thermal convection power of the outer surface of the device to be detected according to the heat transfer area, convection heat transfer coefficient and temperature difference of the outer surface;

[0120] S208 . Taking the sum of the heat radiation power and the heat convection power of the outer surface of the device to be detected as the power consumption of the device to be detected.

[0121] It should be understood that the embodiment of the present application does not limit the execution order of step S203 and step S206.

[0122] Based on the above embodiments, as an optional embodiment, after determining the power consumption of the device to be detected, if it is determined that the power consumption of the device to be detected does not meet the preset conditions, at least one of the components of the device to be detected and the layout of the components is adjusted until the adjusted power consumption of the device to be detected meets the preset conditions.

[0123] See also Figure 6 , which exemplarily shows a flow chart of a method for detecting device power consumption provided by another embodiment of the present application, as shown in the figure, including:

[0124] S301, determining the device to be tested in the current design version;

[0125] S302, determining the thermal radiation power and thermal convection power of the outer surface of the device to be tested in the current design version;

[0126] S303, determining the power consumption of the device to be tested of the current design version according to the thermal radiation power and the thermal convection power;

[0127] S304, determining whether the power consumption of the device to be detected of the current design version meets the preset conditions, if not, executing S305, if yes, executing S306;

[0128] S305, updating at least one of the components and the layout of the components of the device to be tested of the current design version, obtaining the device to be tested of a new design version, and returning to execute S301;

[0129] S306: The device to be tested of the current design version is used as the final design.

[0130] When the embodiments of the present application are applied to product design, if it is determined that the power consumption of the product (i.e., the device to be tested) does not meet the preset conditions, at least one of the components and / or the layout of the components of the device to be tested is adjusted. For example, when the power consumption is too high, the processor can be replaced with a processor with lower power consumption, and the components that are relatively close to each other can be spaced farther apart. For example, if the processor and the camera are too close, the camera will obviously heat up after being started for a period of time. If the distance between the processor and the camera is close at this time, the heat of the processor will affect its own processing efficiency, that is, the power needs to be increased to achieve the processing efficiency before the heat. However, if the distance between the processor and the camera is set farther, the impact of the heat generated by the camera on the processor can be reduced, thereby reducing the power consumption of the processor.

[0131] The core of realizing intelligent transportation system lies in the intelligent vehicle auxiliary control, which is inseparable from various sensors, such as speed sensors, distance sensors, image sensors, meteorological sensors, etc. Since the power consumption of these sensors will affect the owner's vehicle maintenance cycle (such as charging cycle, battery replacement cycle, etc.), it is very important to limit the power consumption of these sensors.

[0132] See also Figure 7 , which exemplarily shows a schematic diagram of a design scenario of an embodiment of the present application applied to smart transportation. As shown in the figure, the scenario includes a confined space 110. A designer 160 places a prepared laser radar device 120 in the confined space 110, and sets a temperature sensor 130 in contact with the outer surface of the laser radar device 120 and a temperature sensor 140 not in contact with the outer surface of the laser radar device 120 in the confined space 110. After the laser radar device runs to a steady state, the temperature sensor 130 and the temperature sensor 140 send the collected temperature to the server 150. At the same time, the designer 160 The preliminary information such as the material / size / surface process of the laser radar device 120 is also sent to the server 150. The server 150 calculates the power consumption of the laser radar device 120 based on the received temperature and the preliminary information. If the power consumption meets the preset conditions, the designer determines that the laser radar device has met the power consumption requirements. If it does not meet the preset conditions, the designer adjusts at least one of the components and the layout of the components of the laser radar device 120 through the terminal 170, and prepares the adjusted laser radar device for power consumption detection again until the power consumption of the adjusted device to be detected meets the preset conditions.

[0133] The present application embodiment provides a device for detecting power consumption of a device, such as Figure 8 As shown, the device power consumption detection apparatus may include: a power determination module 101 and a power consumption determination module 102, wherein:

[0134] A power determination module 101, used to determine the thermal radiation power and thermal convection power of the outer surface of the device to be detected;

[0135] The power consumption determination module 102 is used to determine the power consumption of the device to be detected according to the heat radiation power and the heat convection power.

[0136] As an optional implementation, when the device to be detected is not externally connected to a heat dissipation device, the outer surface of the device to be detected includes the outer surface of the body of the device to be detected;

[0137] When the device to be detected is externally connected to a heat dissipation device, the outer surface of the device to be detected includes the outer surface of the body of the device to be detected and the outer surface of the heat dissipation device.

[0138] As an optional implementation manner, the power determination module includes:

[0139] A regional radiation submodule, for determining the thermal radiation power of each region of the outer surface, each region having a different material;

[0140] The radiation summing module is used to take the sum of the thermal radiation powers of each area as the thermal radiation power of the outer surface of the device to be detected.

[0141] As an optional implementation manner, the power determination module includes:

[0142] A parameter determination submodule, for determining the heat transfer area, convection heat transfer coefficient, outer surface temperature and ambient temperature of the outer surface;

[0143] The thermal convection power determination submodule is used to determine the temperature difference between the outer surface temperature and the ambient temperature, and determine the thermal convection power of the outer surface of the device to be detected based on the heat transfer area, convection heat transfer coefficient and temperature difference of the outer surface.

[0144] As an optional implementation, the regional radiation submodule includes:

[0145] A radiation capacity determination unit, which determines the heat radiation capacity of the device to be detected and the external environment in the region, as well as the heat radiation area of ​​the region;

[0146] The radiation conversion unit is used to determine the difference in thermal radiation capability between the device to be detected and the external environment in the area, and obtain the thermal radiation power of the area according to the difference in capability and the thermal radiation area.

[0147] As an optional implementation manner, the radiation capability determination unit includes:

[0148] A parameter determination subunit, for determining the surface blackness, Boltzmann constant, external surface temperature and ambient temperature of the region;

[0149] A first capability determination subunit, configured to obtain the thermal radiation capability of the device to be detected in the area according to the surface blackness, the Boltzmann constant and the outer surface temperature of the area;

[0150] The second capability determination subunit is used to obtain the thermal radiation capability of the external environment in the area according to the surface blackness, the Boltzmann constant and the ambient temperature of the area.

[0151] As an optional embodiment, the convective heat transfer coefficient is related to one of the following parameters:

[0152] Thermal conductivity of air, viscosity, specific heat of fluid, density, volume expansion coefficient, temperature and flow state.

[0153] As an optional implementation manner, the device for detecting power consumption of the device further includes:

[0154] The adjustment module is used to adjust at least one of the components and the layout of the components of the device to be detected if it is determined that the power consumption of the device to be detected does not meet the preset conditions, until the adjusted power consumption of the device to be detected meets the preset conditions.

[0155] The device of the embodiments of the present application can execute the method provided by the embodiments of the present application, and the implementation principles are similar. The actions performed by each module in the device of each embodiment of the present application correspond to the steps in the method of each embodiment of the present application. For the detailed functional description of each module of the device, please refer to the description in the corresponding method shown in the previous text, which will not be repeated here.

[0156] An electronic device is provided in an embodiment of the present application, including a memory, a processor and a computer program stored in the memory. The processor executes the above-mentioned computer program to implement the steps of a method for detecting device power consumption. Compared with the related art, it is suitable for devices that adopt passive heat dissipation. By determining the thermal radiation power and thermal convection power of the outer surface of the device to be detected, and by summing the two powers, the external heat dissipation power of the device to be detected in a balanced state can be obtained, and the heat dissipation power is equated with the power consumption of the device to be detected, which effectively helps product designers to evaluate system risks without detailed heat dissipation simulation methods, and effectively improves the effectiveness of product design and risk control capabilities.

[0157] In an alternative embodiment, an electronic device is provided, such as Fig. 9 As shown, Fig. 9 The electronic device 4000 shown includes: a processor 4001 and a memory 4003. The processor 4001 and the memory 4003 are connected, such as through a bus 4002. Optionally, the electronic device 4000 may also include a transceiver 4004, which may be used for data interaction between the electronic device and other electronic devices, such as data transmission and / or data reception. It should be noted that in actual applications, the transceiver 4004 is not limited to one, and the structure of the electronic device 4000 does not constitute a limitation on the embodiments of the present application.

[0158] Processor 4001 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array) or other programmable logic devices, transistor logic devices, hardware components or any combination thereof. It may implement or execute various exemplary logic blocks, modules and circuits described in conjunction with the disclosure of this application. Processor 4001 may also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.

[0159] The bus 4002 may include a path to transmit information between the above components. The bus 4002 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus. The bus 4002 may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Fig. 9 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0160] The memory 4003 may be a ROM (Read Only Memory) or other types of static storage devices that can store static information and instructions, a RAM (Random Access Memory) or other types of dynamic storage devices that can store information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory) or other optical disk storage, optical disk storage (including compressed optical disk, laser disk, optical disk, digital versatile disk, Blu-ray disk, etc.), magnetic disk storage media, other magnetic storage devices, or any other medium that can be used to carry or store computer programs and can be read by a computer, without limitation herein.

[0161] The memory 4003 is used to store the computer program for executing the embodiment of the present application, and the execution is controlled by the processor 4001. The processor 4001 is used to execute the computer program stored in the memory 4003 to implement the steps shown in the above method embodiment.

[0162] An embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps and corresponding contents of the aforementioned method embodiment can be implemented.

[0163] The embodiment of the present application also provides a computer program product, including a computer program, which can implement the steps and corresponding contents of the aforementioned method embodiment when executed by a processor.

[0164] The terms "first", "second", "third", "fourth", "1", "2", etc. (if any) in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that shown or described in the drawings.

[0165] It should be understood that, although each operation step is indicated by arrows in the flowchart of the embodiment of the present application, the implementation order of these steps is not limited to the order indicated by the arrows. Unless clearly stated herein, in some implementation scenarios of the embodiment of the present application, the implementation steps in each flowchart can be performed in other orders according to demand. In addition, some or all of the steps in each flowchart may include multiple sub-steps or multiple stages based on actual implementation scenarios. Some or all of these sub-steps or stages may be executed at the same time, and each sub-step or stage in these sub-steps or stages may also be executed at different times respectively. In different scenarios of execution time, the execution order of these sub-steps or stages may be flexibly configured according to demand, and the embodiment of the present application does not limit this.

[0166] The above is only an optional implementation method for some implementation scenarios of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the technical concept of the solution of the present application, other similar implementation methods based on the technical ideas of the present application are also within the protection scope of the embodiments of the present application.

Claims

1. A method for detecting power consumption of a device, characterized in that: include: Determine the thermal radiation power and thermal convection power of the outer surface of the device to be tested; The power consumption of the device to be detected is determined according to the heat radiation power and the heat convection power.

2. The method according to claim 1, characterized in that When the device to be detected is not externally connected to a heat dissipation device, the outer surface of the device to be detected includes the outer surface of the body of the device to be detected; When the device to be detected is externally connected to a heat dissipation device, the outer surface of the device to be detected includes the outer surface of the body of the device to be detected and the outer surface of the heat dissipation device.

3. The method for detecting device power consumption according to claim 1 or 2, characterized in that: Determine the thermal radiation power of the external surface of the device to be tested, including: Determining the thermal radiation power of various regions of the outer surface, the regions being made of different materials; The sum of the thermal radiation powers of the various regions is taken as the thermal radiation power of the outer surface of the device to be detected.

4. The method for detecting device power consumption according to claim 1 or 2, characterized in that: Determine the thermal convection power of the external surface of the device under test, including: determining a heat transfer area, a convective heat transfer coefficient, an outer surface temperature, and an ambient temperature of the outer surface; The temperature difference between the outer surface temperature and the ambient temperature is determined, and the thermal convection power of the outer surface of the device to be detected is determined according to the heat transfer area, the convection heat transfer coefficient and the temperature difference of the outer surface.

5. The method for detecting device power consumption according to claim 3, characterized in that: The heat radiation power of each area is determined as follows: Determine the heat radiation capacity of the device to be tested and the external environment in the area, as well as the heat radiation area of ​​the area; The ability difference between the device to be detected and the external environment in the region of heat radiation is determined, and the heat radiation power of the region is obtained according to the ability difference and the heat radiation area.

6. The method for detecting device power consumption according to claim 5, characterized in that: Determining the thermal radiation capabilities of the device to be detected and the external environment in the area includes: determining the surface blackness, the Boltzmann constant, the external surface temperature, and the ambient temperature of the region; Obtaining the thermal radiation capability of the device to be tested in the area according to the surface blackness, Boltzmann constant and outer surface temperature of the area; According to the surface blackness, Boltzmann constant and ambient temperature of the area, the thermal radiation capacity of the external environment in the area is obtained.

7. The method for detecting device power consumption according to claim 1, characterized in that: Also includes: If it is determined that the power consumption of the device to be detected does not meet the preset condition, at least one of the components of the device to be detected and the layout of the components is adjusted until the adjusted power consumption of the device to be detected meets the preset condition.

8. A device for detecting power consumption of a device, characterized in that: include: A power determination module, used to determine the thermal radiation power and thermal convection power of the outer surface of the device to be detected; The power consumption determination module is used to determine the power consumption of the device to be detected according to the thermal radiation power and the thermal convection power.

9. An electronic device comprising a memory, a processor and a computer program stored in the memory, characterized in that: The processor executes the computer program to implement the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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