Variable-temperature testing device for chip testing and chip processing system

Abstract

The invention provides a variable temperature testing device for chip testing and a chip processing system, and relates to the technical field of chip detection. Comprising an intermediate measurement Dewar assembly, a fixing assembly and a refrigeration assembly. The intermediate measurement Dewar assembly comprises a thin-wall cold finger, a transition ring, a Dewar base and a Dewar window seat; the fixing assembly comprises a bottom plate; the connecting piece is arranged on the bottom plate, and a first height is formed between the connecting piece and the bottom plate; the supporting piece is arranged on the bottom plate, and a second height is formed between the supporting piece and the bottom plate; one end of the supporting piece is connected with the bottom plate, and the other end is in supporting connection with the Dewar window seat; the refrigerating assembly comprises a refrigerating machine which is arranged on the bottom plate and is in communication connection with an external control device; one end of the expansion machine is connected with the refrigerating machine, and the other end of the expansion machine is detachably connected with the other end of the thin-wall cold finger through a connecting piece; the refrigerator determines a refrigeration temperature of the expander. The variable temperature testing device provided by the invention has the characteristics of high temperature adjustment response rate, large adjustable temperature range and high temperature control precision.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a variable temperature testing device and a chip process system for chip testing. Background Art

[0002] Infrared detectors have the characteristics of passive detection, high detection accuracy, and strong environmental adaptability, and are widely used in night vision, astronomical observation, aerospace, etc. Infrared detection chips are an important component of infrared detectors.

[0003] During the preparation of the infrared detection chip, before the formal component packaging, the infrared detection chip needs to be tested for performance to determine whether the electrical performance of the infrared detection chip meets the design requirements. This testing process is called chip mid-test.

[0004] At present, during the chip testing process, a low-temperature environment is generally provided for the infrared detection chip through a test dewar (such as setting a low-temperature liquid in the test dewar to provide a low-temperature environment) to complete the performance test of the infrared detection chip in a low-temperature environment.

[0005] However, the inventors found that such performance testing methods are limited by the temperature range of the cryogenic liquid. For example, when the cryogenic liquid is liquid nitrogen, the intermediate test dewar can only reduce the temperature of the infrared detection chip to the liquid nitrogen temperature range (such as 77K), but cannot achieve adjustment in other temperature ranges (such as 50-77K or 80-250K, etc.), resulting in limited adjustment of the temperature environment and failure to meet the test requirements.

[0006] The contents of the background technology section are merely the technologies known to the public and do not necessarily represent the existing technologies in the field. Summary of the invention

[0007] The present invention provides a variable temperature testing device and a chip manufacturing system for chip testing, aiming to solve the problem that the current chip performance testing method is limited by the temperature zone of the cryogenic liquid.

[0008] According to one aspect of the present invention, the present invention provides a variable temperature test device for chip testing, including a central test Dewar assembly, a fixed assembly and a refrigeration assembly. The central test Dewar assembly includes: a thin-walled cold finger; a transition ring connected to one end of the thin-walled cold finger; a Dewar base connected to the transition ring; a Dewar window seat, detachably connected to the Dewar base through a locking member; the fixed assembly includes: a bottom plate; a connecting member, arranged on the bottom plate, and having a first height with the bottom plate; a supporting member, arranged on the bottom plate, and having a second height with the bottom plate; one end of the supporting member is connected to the bottom plate, and the other end is supported and connected to the Dewar window seat; the refrigeration assembly includes: a refrigerator, arranged on the bottom plate, and connected to the external control device for communication; an expander, arranged on the bottom plate, one end of which is connected to the refrigerator, and the other end of which is detachably connected to the other end of the thin-walled cold finger through a connecting member; wherein the refrigerator determines the refrigeration temperature of the expander according to the control signal of the external control device.

[0009] According to some embodiments of the present invention, the Dewar base includes: a first Dewar shell connected to the transition ring; a lead shell arranged on one side of the first Dewar shell; a connector connected to the lead shell; and an insulator unit arranged on the first Dewar shell and electrically connected to the connector and the temperature sensor.

[0010] According to some embodiments of the present invention, the Dewar base further includes: an exhaust unit disposed on the first Dewar shell.

[0011] According to some embodiments of the present invention, the Dewar window seat includes: a cold platform, including an upper cold platform, a lower cold platform and a cold screen; a plurality of pins, which are arranged circumferentially on the cold platform; a lead square, which is arranged on a first Dewar shell; a lead ring, including an upper lead ring and a lower lead ring; at least two support columns, one end of the support column is connected to the first Dewar shell, and the other end is connected to the lead ring support.

[0012] According to some embodiments of the present invention, the insulator unit includes at least two redundantly arranged insulators.

[0013] According to some embodiments of the present invention, the refrigeration assembly further includes: a first heat dissipation unit, which is surrounded and arranged on the refrigerator; the first heat dissipation unit includes: a first heat dissipation end, which is arranged on the top of the refrigerator; and first heat dissipation teeth, which are arranged on both sides of the refrigerator.

[0014] According to some embodiments of the present invention, the refrigeration assembly further includes: a second heat dissipation unit, which is surrounded and arranged on the expander; the second heat dissipation unit includes: a second heat dissipation end, which is arranged on the top of the expander; and second heat dissipation teeth, which are arranged on both sides of the expander.

[0015] According to some embodiments of the present invention, a first annular sealing groove is provided around the thin-walled cold finger, and a first sealing ring is provided in the first annular sealing groove; and / or, a second annular sealing groove is provided on the first Dewar shell, and a second sealing ring is provided in the second annular sealing groove.

[0016] According to some embodiments of the present invention, the connecting member is provided with a third annular sealing groove, and a third sealing ring is provided in the third annular sealing groove.

[0017] According to another aspect of the present invention, the present invention further provides a chip manufacturing system, which includes the variable temperature testing device for chip testing as described above.

[0018] Beneficial Effects The variable temperature testing device provided by the present invention comprises a central testing dewar assembly, a fixed assembly and a refrigeration assembly, wherein the central testing dewar assembly is connected to the refrigeration assembly through the fixed assembly. The central testing dewar assembly can provide a testing environment for the chip central testing, the fixed assembly can provide fixed support for the central testing dewar assembly, and the refrigeration assembly can provide a cold source for the chip central testing.

[0019] The present invention replaces the prior art cold source method of setting low temperature liquid in the intermediate test dewar with the cold source method of the refrigerator, and can provide a wide range of adjustable temperature environment for chip intermediate test. The variable temperature test device provided by the present invention has the characteristics of fast temperature adjustment response rate, large adjustable temperature range and high temperature control accuracy.

[0020] In addition, the present invention can realize the detachable connection between the intermediate test dewar component and the refrigeration component through the setting of the fixing component, so as to realize the batch operation of the chip intermediate test. And the present invention can also realize the fixation of the intermediate test dewar component through the setting of the fixing component, and this fixing method does not need to configure other fixing tools additionally, and has the characteristics of simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic structural diagram of a variable temperature testing device according to an embodiment of the present invention is shown; Figure 2 Another structural schematic diagram of the variable temperature testing device according to an embodiment of the present invention is shown.

[0023] Description of reference numerals: Variable temperature test device 1; middle test Dewar assembly 10; fixed assembly 20; refrigeration assembly 30; Thin-walled cold finger 11; transition ring 12; Dewar base 13; Dewar window seat 14; locking piece 15; Bottom plate 21; connecting member 22; supporting member 23; first weight-reducing hole 211; second weight-reducing hole 212; Refrigerator 31; expansion machine 32; First Dewar housing 131; lead housing 132; connector 133; insulator unit 134; exhaust unit 135; Cold stage 141; pin 142; lead square 143; lead ring 144; upper lead ring 1441; support column 145; First heat dissipation unit 33; first heat dissipation end 331; first heat dissipation tooth 332; The second heat dissipation unit 34 has a second heat dissipation end 341 and a second heat dissipation tooth 342 . DETAILED DESCRIPTION

[0024] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar parts, and thus their repeated description will be omitted.

[0025] The described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of these specific details, or other modes, components, materials, devices, etc. may be adopted. In these cases, known structures, methods, devices, implementations, materials or operations will not be shown or described in detail.

[0026] In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0027] The terms "first", "second" and the like in the specification, claims and the above drawings of the present invention are used to distinguish different objects rather than to describe a specific order.

[0028] The following is a clear and complete description of the technical solution of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0029] According to one aspect of the present invention, the present invention provides a variable temperature testing device for chip testing.

[0030] Figure 1 A schematic structural diagram of a variable temperature testing device according to an embodiment of the present invention is shown; Figure 2 Another structural schematic diagram of the variable temperature testing device according to an embodiment of the present invention is shown.

[0031] According to an example embodiment, Figure 1 As shown, the variable temperature testing device 1 may include a central Dewar assembly 10 , a fixing assembly 20 and a refrigeration assembly 30 .

[0032] For example, Figure 1 As shown, the intermediate test Dewar assembly 10 is connected to the refrigeration assembly 30 via the fixing assembly 20. The variable temperature test device 1 can provide a test environment that can meet the refrigeration temperature requirement for the intermediate test of the chip to be tested.

[0033] Exemplarily, the chip to be tested may be an infrared detection chip, or of course, may be any other type of chip that needs to be tested, and the present invention is not limited thereto.

[0034] According to an example embodiment, Figure 1 or Figure 2 As shown, the center Dewar assembly 10 includes a thin-walled cold finger 11, a transition ring 12, a Dewar base 13 and a Dewar window seat 14.

[0035] For example, the material of the thin-walled cold finger 11 can be a metal material with low thermal conductivity, and the thin-walled cold finger 11 has a thin wall thickness. In this way, the heat load of the intermediate Dewar assembly 10 can be reduced through the low thermal conductivity and thin wall characteristics of the thin-walled cold finger 11.

[0036] like Figure 1 or Figure 2 As shown, the transition ring 12 is connected to one end of the thin-walled cold finger 11. The Dewar base 13 is detachably connected to the Dewar window seat 14 through a locking member 15.

[0037] For example, the locking member 15 may be a clamp.

[0038] The electrical lead-out structure required by the mid-test Dewar assembly 10 is provided on the Dewar base 13, which can realize electrical connection with the chip to be tested. The present invention can facilitate the replacement of the chip to be tested through the detachable connection between the Dewar window seat 14 and the Dewar base 13, so that the variable temperature test device 1 can be adapted to the mid-test of a variety of chips.

[0039] According to an example embodiment, Figure 1 As shown, the fixing assembly 20 may include a base plate 21 , a connecting member 22 and a supporting member 23 .

[0040] Exemplarily, the material of the fixing component 20 may be an aluminum alloy, and such a configuration may allow the fixing component 20 to have the characteristics of light material and higher heat dissipation properties.

[0041] According to an example embodiment, Figure 1 As shown, the bottom plate 21 is arranged at the bottom of the variable temperature testing device 1 .

[0042] Alternatively, if Figure 1 As shown, the bottom plate 21 is provided with a first weight-reducing hole 211 and a second weight-reducing hole 212. Such a configuration can make the structure of the variable temperature testing device 1 more lightweight.

[0043] According to an example embodiment, Figure 1 As shown, the connecting member 22 is disposed on the bottom plate 21 and has a first height with the bottom plate 21 .

[0044] For example, Figure 1 As shown, the connector 22 is used to connect the thin-walled cold finger 11 and the refrigeration assembly 30. And because the connector 22 has a first height (or a first angle), the center height (or angle) of the mid-test Dewar assembly 10 can be controlled by setting the first height (or first angle) of the connector 22. In this way, the center height (or angle) of the mid-test Dewar assembly 10 can be adapted to the center height (or angle) of the lens during the chip mid-test process, thereby meeting the test requirements of the chip mid-test.

[0045] Exemplarily, the connection member 22 may include an adapter flange.

[0046] According to an exemplary embodiment, the support member 23 is disposed on the bottom plate 21 and has a second height (or a second angle) with the bottom plate 21. One end of the support member 23 is connected to the bottom plate 21, and the other end is supported and connected to the Dewar window seat 14.

[0047] For example, Figure 1As shown, the support member 23 is used to provide support force for the variable temperature test device 1. And because the support member 23 has a second height (or a second angle), by setting the second height (or a second angle) of the support member 23, the center height (or angle) of the central Dewar assembly 10 can also be controlled.

[0048] According to an example embodiment, Figure 1 As shown, the refrigeration assembly 30 may include a refrigerator 31 and an expander 32 .

[0049] The refrigerator 31 is disposed on the bottom plate 21 and is connected to the external control device. The expander 32 is disposed on the bottom plate 21 , one end of which is connected to the refrigerator 31 , and the other end of which is detachably connected to the other end of the thin-walled cold finger 11 through the connector 22 .

[0050] The refrigerator 31 determines the refrigeration temperature of the expander 32 according to the control signal of the external control device.

[0051] For example, the refrigerator 31 may be a full-range linear Stirling refrigerator. A Stirling refrigerator is a refrigeration device based on the Stirling cycle principle, which can achieve refrigeration by compressing and expanding gas, and has the characteristics of simple operation, high efficiency, large cooling capacity and stable temperature control.

[0052] Exemplarily, the refrigerator 31 can communicate with an external control device (such as a refrigerator controller) through the host computer software, can quickly respond to the control signal, and control the cooling temperature within a preset temperature range (such as 50K-250K), thereby meeting the temperature environment required for the chip to be tested (such as an infrared detection chip) to be tested in the chip.

[0053] Through the above embodiments, the variable temperature testing device 1 provided by the present invention includes a central testing Dewar assembly 10, a fixing assembly 20 and a refrigeration assembly 30, and the central testing Dewar assembly 10 is connected to the refrigeration assembly 30 through the fixing assembly 20. The central testing Dewar assembly 10 can provide a testing environment for the chip central testing, the fixing assembly 20 can provide a fixed support for the central testing Dewar assembly 10, and the refrigeration assembly 30 can provide a cold source for the chip central testing.

[0054] The present invention replaces the prior art cold source method of setting a low-temperature liquid in the test dewar with a cold source method of a refrigerator, and can provide a wide range of adjustable temperature environment for chip testing. The variable temperature test device 1 provided by the present invention has the characteristics of fast temperature adjustment response rate, large adjustable temperature range and high temperature control accuracy.

[0055] In addition, the present invention can realize the detachable connection between the intermediate test dewar assembly 10 and the refrigeration assembly 30 by setting the fixing assembly 20, so as to realize the batch operation of the chip intermediate test. And the present invention can also realize the fixation of the intermediate test dewar assembly 10 by setting the fixing assembly 20, and this fixing method does not need to configure other fixing tools, and has the characteristics of simple structure.

[0056] Alternatively, if Figure 1 or Figure 2 As shown, the Dewar base 13 further includes a first Dewar housing 131 , a lead housing 132 , a connector 133 and an insulator unit 134 .

[0057] The first Dewar housing 131 is connected to the transition ring 12. The lead housing 132 is arranged on one side of the first Dewar housing 131, and is used to lead out the circuit structure in the Dewar base 13 and the Dewar window seat 14.

[0058] The connector 133 is connected to the lead housing 132 and is used to connect to the internal terminal of the middle-side Dewar through a wire that meets the heat leakage requirements.

[0059] For example, the connector 133 may be two 25-core electrical connectors.

[0060] like Figure 2 As shown, the insulator unit 134 is disposed on the first Dewar housing 131 and is electrically connected to the connector 133 and the temperature sensor.

[0061] Optionally, the insulator unit 134 includes at least two redundantly arranged insulators.

[0062] Alternatively, if Figure 1 As shown, the Dewar base 13 may further include an exhaust unit 135. The exhaust unit 135 is disposed on the first Dewar housing 131.

[0063] For example, the exhaust unit 135 may be an exhaust nozzle. The present invention can exhaust the interior of the central side Dewar assembly 10 by setting the exhaust nozzle, so that the interior of the central side Dewar assembly 10 can be in a vacuum environment.

[0064] Alternatively, if Figure 2 As shown, the Dewar window seat 14 includes a cold platform 141, a pin 142, a lead square 143, a lead ring 144 (including an upper lead ring 1441 and a lower lead ring, the lower lead ring is not shown in the figure) and at least two support columns 145.

[0065] The cold stage 141 includes an upper cold stage, a lower cold stage and a cold shield. For example, the upper cold stage and the lower cold stage can be installed and connected through the first installation hole 1411; the cold shield can be installed and connected with the cold stage through the second installation hole 1412.

[0066] like Figure 2 As shown, a plurality of pins 142 are circumferentially arranged on the cold stage 141. A lead 143 is arranged on the first Dewar housing 131.

[0067] One end of the support column 145 is connected to the first Dewar housing 131 , and the other end is supported and connected to the lead ring 144 .

[0068] Exemplarily, the Dewar window seat 14 may include four circumferentially arranged support columns 145 , and the angle difference between the four circumferentially arranged support columns 145 may be 90°.

[0069] Through the above embodiments, the present invention forms a wire bonding pad based on the structural arrangement of the pin 142, the lead square 143, the lead ring 144 and the connector 133. The present invention replaces the wire bonding method of welding the indium ball on the lead terminal in the prior art with the wire bonding pad, which can avoid the problems of the indium ball falling off or the welding wire falling off, making the structure of the variable temperature test device 1 more stable and reliable.

[0070] Alternatively, if Figure 1 As shown, the refrigeration assembly 30 may further include a first heat dissipation unit 33. The first heat dissipation unit 33 is disposed around the refrigerator 31.

[0071] For example, Figure 1 As shown, the refrigeration assembly 30 may include two first heat dissipation units 33 , and the two first heat dissipation units 33 are arranged at two ends of the refrigerator 31 .

[0072] The first heat dissipation unit 33 may further include a first heat dissipation end 331 and first heat dissipation teeth 332. The first heat dissipation end 331 is disposed on the top of the refrigerator 31. The first heat dissipation teeth 332 are disposed on both sides of the refrigerator 31.

[0073] The first heat dissipation end 331 and the first heat dissipation teeth 332 can dissipate heat generated during the operation of the refrigerator 31 .

[0074] Alternatively, if Figure 1 As shown, the refrigeration assembly 30 may further include a second heat dissipation unit 34. The second heat dissipation unit 34 is disposed around the expander 32.

[0075] For example, Figure 1 As shown, the refrigeration assembly 30 may include a second heat dissipation unit 34 .

[0076] The second heat dissipation unit 34 may further include a second heat dissipation end 341 and a second heat dissipation tooth 342. The second heat dissipation end 341 is disposed on the top of the expander 32. The second heat dissipation tooth 342 is disposed on both sides of the expander 32.

[0077] The second heat dissipation end 341 and the second heat dissipation tooth 342 can dissipate heat generated during the operation of the expander 32 .

[0078] Optionally, a first annular sealing groove is arranged around the thin-walled cold finger 11 , and a first sealing ring is arranged in the first annular sealing groove.

[0079] Such an arrangement can ensure that the thin-walled cold finger 11 has good sealing performance.

[0080] Optionally, the first Dewar housing 131 is provided with a second annular sealing groove, and a second sealing ring is provided in the second annular sealing groove.

[0081] Such an arrangement can ensure that the first Dewar housing 131 has good sealing performance.

[0082] Optionally, the connecting member 22 is provided with a third annular sealing groove, and a third sealing ring is provided in the third annular sealing groove.

[0083] Such an arrangement can ensure that the connecting member 22 has good sealing performance.

[0084] According to another aspect of the present invention, the present invention further provides a chip manufacturing system, which includes the variable temperature testing device for chip testing as described above.

[0085] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions of the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A variable temperature testing device for chip testing, characterized in that: Including the mid-test Dewar assembly, fixed assembly and refrigeration assembly; The mid-test Dewar assembly comprises: Thin wall cold finger; A transition ring connected to one end of the thin-walled cold finger; A Dewar base connected to the transition ring; A Dewar window seat, detachably connected to the Dewar base via a locking member; The fixing assembly comprises: Base plate; A connecting member, disposed on the bottom plate and having a first height relative to the bottom plate; A support member is arranged on the bottom plate and has a second height with the bottom plate; one end of the support member is connected to the bottom plate, and the other end is connected to the Dewar window seat support; The refrigeration assembly comprises: A refrigerator, disposed on the base plate and communicatively connected to an external control device; An expander, arranged on the bottom plate, one end of which is connected to the refrigerator, and the other end of which is detachably connected to the other end of the thin-walled cold finger through the connector; Wherein, the refrigerator determines the refrigeration temperature of the expander according to the control signal of the external control device.

2. The variable temperature testing device according to claim 1, characterized in that: The Dewar base comprises: A first Dewar housing connected to the transition ring; A lead housing is arranged on one side of the first Dewar housing; A connector connected to the lead housing; The insulator unit is arranged on the first Dewar shell and is electrically connected to the connector and the temperature sensor.

3. The variable temperature testing device according to claim 2, characterized in that: The Dewar base also includes: The exhaust unit is arranged on the first Dewar shell.

4. The variable temperature testing device according to claim 2, characterized in that: The Dewar window seat comprises: Cold stage, including upper cold stage, lower cold stage and cold screen; A plurality of pins are arranged around the cold table; A lead wire is arranged on the first Dewar housing; A lead ring, comprising an upper lead ring and a lower lead ring; At least two support columns, one end of each support column is connected to the first Dewar shell, and the other end of each support column is connected to the lead ring support.

5. The variable temperature testing device according to claim 2, characterized in that: The insulator unit comprises at least two redundantly arranged insulators.

6. The variable temperature testing device according to claim 1, characterized in that: The refrigeration assembly also includes: A first heat dissipation unit is disposed around the refrigerator; The first heat dissipation unit comprises: A first heat dissipation end is arranged on the top of the refrigerator; The first heat dissipation teeth are arranged on both sides of the refrigerator.

7. The variable temperature testing device according to claim 1, characterized in that: The refrigeration assembly also includes: A second heat dissipation unit is disposed around the expander; The second heat dissipation unit comprises: A second heat dissipation end is arranged on the top of the expander; The second heat dissipation teeth are arranged on both sides of the expander.

8. The variable temperature testing device according to claim 2, characterized in that: A first annular sealing groove is arranged around the thin-walled cold finger, and a first sealing ring is arranged in the first annular sealing groove; and / or The first Dewar shell is provided with a second annular sealing groove, and a second sealing ring is provided in the second annular sealing groove.

9. The variable temperature testing device according to claim 1, characterized in that: The connecting piece is provided with a third annular sealing groove, and a third sealing ring is provided in the third annular sealing groove.

10. A chip manufacturing system, characterized in that: It comprises a variable temperature testing device as described in any one of claims 1-9.

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