Method and system for preparing micro-lens spherical array

Abstract

The invention provides a method and a system for preparing a micro-lens spherical array. The method comprises the following steps: spin-coating a first photoresist on the front surface of a silicon wafer; exposing and developing the first photoresist to obtain a plurality of local glue column arrays, wherein each local glue column array comprises a plurality of local glue columns; according to the plurality of local glue column arrays, the front surface is etched to obtain a plurality of local silicon column arrays, and each local silicon column array comprises a plurality of local silicon columns; coating a second photoresist on the front surface; second photoresist covers the faces, close to the front face, of the multiple local silicon column arrays through the photoetching technology and the overlay technology to obtain a micro-lens glue column array, the micro-lens glue column array comprises a plurality of micro-lens glue columns, and each micro-lens glue column covers the multiple local silicon columns of the corresponding local silicon column array; and heating the micro-lens rubber column array so as to soften and mold the plurality of micro-lens rubber columns to obtain the micro-lens spherical array. By controlling the formed local silicon column array, the size of the contact angle of the micro-lens spherical array can be controlled.

Description

Technical Field

[0001] The present application relates to the technical field of optical elements, and in particular to a method and system for preparing a microlens spherical array. Background Art

[0002] Microlens spherical array is a micro-optical focusing element, which is widely used in the fields of optical communication, integrated imaging, fiber coupling, light field display technology, etc. There are many preparation methods for microlens spherical array, such as microjet printing method, femtosecond laser direct writing method, etc., especially the photoresist hot melt method based on photolithography technology is the most commonly used. The method of traditional photolithography technology is to directly apply a layer of photoresist on the surface of the silicon wafer, then photolithograph the photoresist columnar array and hot melt it to make a microlens spherical array. In order to improve the contact angle of the microlens spherical surface, it is usually adopted to change the hydrophobic properties of the silicon wafer surface, including the selection of coating other materials or overall surface structuring to improve the hydrophobic ability of the surface. However, the overall modification of the silicon wafer surface is affected by factors such as material uniformity and processing conditions, and it is difficult to control the size of the contact angle. Summary of the invention

[0003] The present application provides a method and system for preparing a microlens spherical array, which increases the contact angle of the microlens spherical surface by forming a microlens glue column array on a local silicon column array, and can also control the size of the contact angle.

[0004] In a first aspect, an embodiment of the present application provides a method for preparing a microlens spherical array, the method for preparing a microlens spherical array comprising: spin coating a first photoresist on the front side of a silicon wafer; exposing and developing the first photoresist to obtain a plurality of local glue column arrays, each of which includes a plurality of local glue columns; etching the front side according to the plurality of local glue column arrays to obtain a plurality of local silicon column arrays, each of which includes a plurality of local silicon columns, each of which corresponds to a local glue column array, and the plurality of local silicon columns correspond one to one to the plurality of local glue columns of the corresponding local glue column array; The front side is coated with a second photoresist; a photolithography process and an overlay process are used to cover the second photoresist on a side of the plurality of local silicon pillar arrays close to the front side to obtain a microlens glue pillar array, wherein the microlens glue pillar array includes a plurality of microlens glue pillars, each of which covers a plurality of local silicon pillars of a corresponding local silicon pillar array; the microlens glue pillar array is heated to soften and shape the plurality of microlens glue pillars to obtain a microlens spherical surface array, wherein the microlens spherical surface includes a plurality of microlens spherical surfaces, each of which corresponds to a local silicon pillar array and is supported by a plurality of local silicon pillars of a corresponding local silicon pillar array.

[0005] In a second aspect, an embodiment of the present application provides a system for preparing a microlens spherical array, wherein the system for preparing a microlens spherical array includes a photoresist coating device, an exposure and development device, a first photoresist processing device, a second photoresist processing device, and a heating device, wherein the photoresist coating device is used to spin-coat a first photoresist on the front side of a silicon wafer; the exposure and development device is used to expose and develop the first photoresist to obtain a plurality of local glue column arrays, each of which includes a plurality of local glue columns; the first photoresist processing device is used to etch the front side according to the plurality of local glue column arrays to obtain a plurality of local silicon column arrays, each of which includes a plurality of local silicon columns, each of which corresponds to a local glue column array, and the plurality of local silicon columns are connected to the corresponding local glue column arrays. The plurality of local glue pillars of the partial glue pillar array correspond to each other one by one; the photoresist coating device is also used to coat the second photoresist on the front side; the second photoresist processing device is used to cover the second photoresist on the side of the plurality of local silicon pillar arrays close to the front side by using the photolithography process and the overlay process to obtain a microlens glue pillar array, the microlens glue pillar array includes a plurality of microlens glue pillars, each of which covers a plurality of local silicon pillars of the corresponding local silicon pillar array; the heating device is used to heat the microlens glue pillar array to soften and shape the plurality of microlens glue pillars to obtain a microlens spherical array, the microlens spherical array includes a plurality of microlens spherical surfaces, each of which corresponds to a local silicon pillar array and is supported by a plurality of local silicon pillars of the corresponding local silicon pillar array.

[0006] The method and system for preparing a microlens spherical array obtains a plurality of first photoresists corresponding to preset arrays in advance by exposing and developing a first photoresist spin-coated on the front side of a silicon wafer, and obtains a corresponding local silicon pillar array by etching on the front side according to the plurality of preset arrays through an ICP etching process, so that when a second photoresist is coated, the second photoresist can be supported by the local silicon pillar array to obtain a microlens glue pillar array, and then a microlens spherical array is formed when the microlens glue pillar array is heated; at the same time, the formed local silicon pillar array can be controlled by controlling the photolithography process and the overlay process, thereby controlling the size of the contact angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0008] Figure 1 This is a first flow chart of a method for preparing a spherical microlens array provided in an embodiment of the present application.

[0009] Figure 2 A flowchart of the sub-steps of step S102 provided in an embodiment of the present application.

[0010] Figure 3 This is a second flow chart of the method for preparing a spherical microlens array provided in an embodiment of the present application.

[0011] Figure 4 A flowchart of the sub-steps of step S106 provided in an embodiment of the present application.

[0012] Figure 5 A schematic diagram of the structure of a system for preparing a spherical microlens array provided in an embodiment of the present application.

[0013] Figure 6 This is a first schematic diagram of an application scenario of the method for preparing a spherical microlens array provided in an embodiment of the present application.

[0014] Figure 7 This is a second schematic diagram of an application scenario of the method for preparing a spherical microlens array provided in an embodiment of the present application.

[0015] Figure 8 A third schematic diagram of an application scenario of the method for preparing a spherical microlens array provided in an embodiment of the present application.

[0016] Fig. 9 This is a fourth schematic diagram of an application scenario of the method for preparing a spherical microlens array provided in an embodiment of the present application.

[0017] Fig.10 A schematic diagram of the technical effect of the method for preparing a spherical microlens array provided in an embodiment of the present application.

[0018] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0020] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar planning objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate. In other words, the described embodiments are implemented according to an order other than that illustrated or described herein. In addition, the terms "including" and "having" and any of their variations may also include other content. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to only those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0021] It should be noted that the descriptions involving "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0022] Please see Figure 1 , which is a first flow chart of a method for preparing a microlens spherical array provided in an embodiment of the present application. The present application provides a method for preparing a microlens spherical array. The method for preparing a microlens spherical array includes steps S101-S106.

[0023] Step S101, spin coating a first photoresist on the front side of the silicon wafer.

[0024] In step S101, the silicon wafer 1 can be used to carry a microlens spherical array. The first photoresist 2 can be a positive photoresist. The present application applies the first photoresist 2 on the front side of the silicon wafer 1 by spin coating, so that the first photoresist 2 is evenly coated on the silicon wafer 1, and the thickness of the first photoresist 2 can be controllably set by controlling the spin coating process. For example, the first photoresist 2 is AZ1515 photoresist. The thickness of the first photoresist 2 can be 0.2-5 microns.

[0025] Step S102, exposing and developing the first photoresist to obtain a plurality of local photoresist column arrays.

[0026] In step S102, each local glue column array 21 includes a plurality of local glue columns 211. The plurality of local glue column arrays 21 may be the same or different local glue column arrays. Since the first photoresist 2 is a positive photoresist, it is sensitive to light and easily reacts to light. Therefore, when the first photoresist 2 is subjected to light treatment in different ways, the first photoresist 2 may be characterized by different patterns through the plurality of local glue column arrays 21.

[0027] Please refer to Figure 2 , which is a flowchart of the sub-steps of step S102 provided in an embodiment of the present application. Exposing and developing the first photoresist to obtain a plurality of local photoresist column arrays includes steps S1021-S1023.

[0028] Step S1021 , determining exposure areas and non-exposure areas of the first photoresist respectively according to a plurality of preset arrays.

[0029] In step S1021, a plurality of preset arrays are used to characterize a plurality of expected patterns of the first photoresist 2, thereby affecting the shape of the subsequent microlens spherical surface 5. The exposure area and the non-exposure area are determined based on the size and shape of the microlens spherical surface 5. The distribution of the exposure area and the non-exposure area in the area where the first photoresist 2 is located is also affected by the angle formed between the first photoresist 2 and the equipment used for exposure and development. Different preset arrays have different exposure areas. Each preset array corresponds to a local glue column array 21. In the present application, the non-exposure area is determined based on a plurality of expected patterns corresponding to the plurality of preset arrays.

[0030] Step S1022, performing light treatment on the first photoresist according to the exposure area and the non-exposure area.

[0031] In step S1022, the first photoresist 2 in the exposure area undergoes a photoreaction. At this time, the solubility of the first photoresist 2 in the exposure area changes, and a difference in solubility occurs between the first photoresist 2 in the exposure area and the first photoresist 2 in the exposure area. Further, the required first photoresist 2 can be selectively retained according to the solubility of the exposure area and the non-exposure area. In order to ensure uniformity when the first photoresist 2 is subjected to light treatment, the first photoresist 2 is dried before the first photoresist 2 is subjected to light treatment.

[0032] Step S1023 , developing the first photoresist after the light treatment to project the plurality of preset arrays onto the first photoresist accordingly, so that the plurality of local glue pillars of each local glue pillar array are arranged on the front surface according to the corresponding preset array to obtain a plurality of local glue pillar arrays.

[0033] In step S1023, since the first photoresist 2 is a positive photoresist, the development process can be to remove the first photoresist 2 in the exposure area and retain the first photoresist 2 in the non-exposure area. Since the non-exposure area is determined according to the multiple expected patterns corresponding to the multiple preset arrays, the multiple expected patterns will be projected on the first photoresist 2 after the development process, that is, the multiple preset arrays are correspondingly projected on the first photoresist 2.

[0034] Step S103, etching the front surface according to the multiple local glue column arrays to obtain multiple local silicon column arrays.

[0035] In step S103, a plurality of local silicon pillar arrays 3 are arranged at intervals on the front side of the silicon wafer 1. Each local silicon pillar array 3 includes a plurality of local silicon pillars 31 arranged at intervals. The plurality of local silicon pillars 31 cooperate with each other to support the microlens spherical surface 5. A groove is formed between each local silicon pillar 31 and the adjacent local silicon pillars 31, and the groove is formed by being recessed from the front side of the silicon wafer 1 to the direction away from the front side. Each local silicon pillar array 3 corresponds to a local glue pillar array 21, and the plurality of local silicon pillars 31 correspond one to one with the plurality of local glue pillars 211 of the corresponding local glue pillar array 21.

[0036] Step S104, coating a second photoresist on the front surface.

[0037] In step S104, the second photoresist 4 is used to form the microlens spherical surface 5. The first photoresist 2 and the second photoresist 4 are different positive photoresists. For example, the second photoresist 4 can be AZ4620 photoresist or other series of positive photoresists.

[0038] Step S105 , using a photolithography process and an overlay process to cover a second photoresist on a surface of a plurality of local silicon pillar arrays close to the front surface to obtain a microlens silicon pillar array.

[0039] In step S105, the microlens glue column array includes a plurality of microlens glue columns. Each microlens glue column covers a plurality of local silicon columns 31 of the corresponding local silicon column array 3. Among them, the height of the local silicon column 31 is 10-600 microns. In the present application, the height of the microlens glue column is greater than the height of the local silicon column 31, so that the microlens glue column can completely cover the corresponding local silicon column array 3 when it is softened by hot melt, so that the multiple local silicon columns 31 can support the microlens spherical surface 5 formed subsequently. The photolithography process refers to the process of transferring patterns on photosensitive materials (such as photoresists) using optical technology. The overlay process refers to the process of aligning patterns between different levels in multiple photolithography steps, including but not limited to thick glue overlay, local overlay, thin glue overlay, etc. The photolithography process and overlay process enable the multiple microlens glue columns to map the expected patterns corresponding to the corresponding local silicon column array 3 when covering the corresponding local silicon column array 3.

[0040] Step S106, heating the microlens glue column array to soften and shape the multiple microlens glue columns to obtain a microlens spherical array.

[0041] In step S106, the microlens spherical surface array includes a plurality of microlens spherical surfaces 5. Each microlens spherical surface 5 corresponds to a local silicon pillar array 3 and is supported by a plurality of local silicon pillars 31 of the corresponding local silicon pillar array 3. When the microlens glue pillar array is heated, the second photoresist 4 will soften and form surface tension on the surface of the microlens glue pillar. The microlens glue pillar can be deformed by means of surface tension to change the contact condition with the local silicon pillar 31, thereby forming microlens spherical surfaces 5 with different expected contact angles.

[0042] Please refer to Figure 4 , which is a flowchart of the sub-steps of step S106 provided in the embodiment of the present application. Heating the microlens glue column array to soften and shape the multiple microlens glue columns to obtain a microlens spherical array includes steps S1061-S1062.

[0043] Step S1061, heating the microlens glue column array at a preset temperature.

[0044] In step S1061, the preset temperature is a temperature at which the second photoresist 4 can be vitrified. In this embodiment, when the second photoresist 4 is AZ4620 photoresist, the preset temperature is set to 100-280°C, and the second photoresist 4 is switched between vitrification and normal state by adjusting the preset temperature.

[0045] Step S1062, when the preset temperature is greater than the glass transition temperature of the second photoresist, the plurality of microlens glue pillars are heated to soften and respectively cover a plurality of local silicon pillars of the corresponding local silicon pillar array close to the front surface to obtain a plurality of microlens spherical surfaces to form a microlens spherical surface array.

[0046] Please see Figure 3 , which is a second flow chart of the method for preparing a microlens spherical array provided in an embodiment of the present application. After etching the front surface to obtain a plurality of local silicon pillar arrays, the method for preparing a microlens spherical array further includes step S201.

[0047] Step S201 , removing first photoresists corresponding to a plurality of preset arrays.

[0048] In step S201, the first photoresist 2 corresponding to the various preset arrays is the first photoresist 2 in the non-exposure area. After etching the front surface to form the expected pattern of the corresponding preset array, the first photoresist 2 needs to be removed to prevent mixing with the second photoresist 4 and affecting the subsequent formation of the microlens spherical array.

[0049] In the above embodiment, the method steps of preparing a microlens spherical array are described. The following will further describe how to increase the contact angle of the microlens spherical surface 5 in the method steps of preparing a microlens spherical array in conjunction with the accompanying drawings.

[0050] Please see Figure 6-Figure 9 , Figure 6-Figure 9 The cross-sectional views at different steps of the method for preparing a spherical microlens array are shown.

[0051] like Figure 6 As shown, first, the first photoresist 2 is evenly spin-coated on the front side of the silicon wafer 1 with a thickness of 0.2-5 microns. After the first photoresist 2 is dried, the first photoresist 2 is exposed and developed. In the exposure process, the exposure area and the non-exposure area are determined according to a plurality of preset arrays. In the development process of the present application, the first photoresist 2 in the exposure area is dissolved and removed, so that the expected pattern corresponding to the shape of the microlens spherical surface 5 is projected onto the first photoresist 2 according to the first photoresist 2 in the non-exposure area to form a plurality of local glue column arrays 21. Among them, the spacing between the plurality of local glue column arrays 21 and the spacing between the local glue columns 211 in each local glue column array 21 can be adjusted according to the exposure area and the non-exposure area. For example, along the setting direction of the silicon wafer 1, the length of each local glue column array 21 in the plurality of local glue column arrays 21 can be 0.2-20 microns, and the spacing between each local glue column array 21 and the adjacent local glue column array 21 can be 1-30 microns. In this embodiment, the spacing between each local glue column array 21 and the adjacent local glue column array 21 is configured to be 30 microns, and the spacing between the local glue columns 211 in each local glue column array 21 is 2 microns.

[0052] like Figure 7 As shown, multiple local silicon pillar arrays 3 are obtained by etching on the front side according to multiple preset arrays using an ICP etching process. The height of the local silicon pillar array 3 can be 0.8-20 microns. The spacing between each local silicon pillar array 3 and the adjacent local silicon pillar array 3 can be 1-30 microns. After obtaining multiple local silicon pillar arrays 3, the first photoresist 2 corresponding to the multiple local silicon pillar arrays 3 is removed. The height of the local silicon pillar array 3 can be adjusted accordingly according to the process of the ICP etching process.

[0053] like Figure 8As shown, the second photoresist 4 is coated on the front side of the silicon wafer, and the thickness can be 10-600 microns. In this embodiment, the thickness of the second photoresist 4 is 500 microns, and the second photoresist 4 is coated on the corresponding positions of the plurality of local silicon pillar arrays 3 on the front side, so that the second photoresist 4 and the corresponding local silicon pillar arrays 3 are aligned by the overlay process, and then the second photoresist 4 is covered on the corresponding local silicon pillar arrays 3 to form a microlens glue column covering the corresponding local silicon pillar arrays 3, which is helpful to form a microlens spherical surface 5 with a larger radius of curvature on the front side of the silicon wafer to improve the focusing ability and light coupling efficiency of the microlens, thereby improving its optical performance. At the same time, since the second photoresist 4 can be supported by the plurality of local silicon pillar arrays 3, and the height of the local silicon pillar arrays 3 can be adjusted accordingly according to the process of the ICP etching process, therefore, when the height of the local silicon pillar arrays 3 is different, the contact angle of the microlens spherical surface 5 formed by the second photoresist 4 is also different. Furthermore, the microlens spherical surface 5 with different contact angles can be prepared according to the corresponding relationship between the height of the local silicon pillar array 3 and the contact angle, and the contact angle of the microlens spherical surface 5 can be increased according to the above corresponding relationship.

[0054] like Fig. 9 As shown, the microlens glue column array is heated at a preset temperature. The corresponding glass transition temperature is determined according to the material of the second photoresist 4, and then the preset temperature is determined. In this embodiment, the second photoresist 4 is AZ4620 photoresist, and the preset temperature is set to 100-280°C. For a microlens glue column, when the second photoresist 4 is vitrified, since the height of the microlens glue column is greater than the height of the local silicon column 31, the second photoresist 4 is driven by surface tension to make the microlens glue column sufficient to cover the corresponding local silicon column array 3, and supported by multiple local silicon columns 31 to form a microlens spherical surface 5.

[0055] like Fig.10 As shown, for a microlens spherical surface 5. The microlens spherical surface 5 is supported by a corresponding plurality of local silicon pillars 31, and the desired patterns corresponding to the plurality of local silicon pillars 31 are aligned to the microlens spherical surface 5 through photolithography and overlay processes, and the size of the contact angle formed by the microlens spherical surface 5 will be affected by the size and shape of the local silicon pillars 31. The present application can adjust a variety of different contact angles by controlling the etching process of the local silicon pillars 31, and increase the contact angle of the microlens spherical surface 5 by the contact between the plurality of local silicon pillars 31 and the microlens glue pillars.

[0056] Please see Figure 5 , which is a schematic diagram of the structure of a system for preparing a microlens spherical array provided in an embodiment of the present application. The present application also provides a system 11 for preparing a microlens spherical array. The system 11 for preparing a microlens spherical array includes a photoresist coating device 110, an exposure and development device 111, a first photoresist processing device 112, a second photoresist processing device 113 and a heating device 114.

[0057] The photoresist coating device 110 is used to spin-coat a first photoresist 2 on the front side of the silicon wafer 1 .

[0058] The exposure and development device 111 is used to expose and develop the first photoresist 2 to obtain a plurality of local glue column arrays 21. Each local glue column array 21 includes a plurality of local glue columns 211.

[0059] The first photoresist processing device 112 is used to etch the front surface according to the multiple local glue column arrays 21 to obtain multiple local silicon column arrays 3. Each local silicon column array 3 includes multiple local silicon columns 31. Each local silicon column array 3 corresponds to a local glue column array 21, and the multiple local silicon columns 31 correspond to the multiple local glue columns 211 of the corresponding local glue column array 21.

[0060] The photoresist coating device 110 is also used to coat the second photoresist 4 on the front side.

[0061] The second photoresist processing device 113 is used to cover the second photoresist 4 on the side close to the front of the plurality of local silicon pillar arrays 3 by photolithography and overlay to obtain a microlens glue pillar array. The microlens glue pillar array includes a plurality of microlens glue pillars. Each microlens glue pillar covers a plurality of local silicon pillars 31 of the corresponding local silicon pillar array 3.

[0062] The heating device 114 is used to heat the microlens glue column array to soften and shape the multiple microlens glue columns to obtain a microlens spherical array. The microlens spherical array includes multiple microlens spheres 5, each microlens sphere 5 corresponds to a local silicon column array 3, and is supported by multiple local silicon columns 31 of the corresponding local silicon column array 3.

[0063] In the above embodiment, the first photoresist corresponding to a plurality of preset arrays is obtained in advance by exposing and developing the first photoresist spin-coated on the front side of the silicon wafer, and the corresponding local silicon pillar array is etched on the front side according to the plurality of preset arrays by the ICP etching process, so that when the second photoresist is coated, the second photoresist can be supported by the local silicon pillar array to obtain a microlens glue pillar array, and then a microlens spherical array is formed when the microlens glue pillar array is heated; at the same time, the formed local silicon pillar array can be controlled by controlling the photolithography process and the overlay process, thereby controlling the size of the contact angle.

[0064] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

[0065] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

[0066] The above examples are only preferred embodiments of the present application, and certainly cannot be used to limit the scope of rights of the present application. Therefore, equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A method for preparing a spherical microlens array, characterized in that: The method for preparing a spherical microlens array comprises: Spin coating a first photoresist on the front side of the silicon wafer; Expose and develop the first photoresist to obtain a plurality of local glue column arrays, each of which includes a plurality of local glue columns; According to the plurality of local glue column arrays, etching the front surface to obtain a plurality of local silicon column arrays, each local silicon column array includes a plurality of local silicon columns, each local silicon column array corresponds to a local glue column array, and the plurality of local silicon columns correspond one to one to the plurality of local glue columns of the corresponding local glue column array; Applying a second photoresist on the front surface; Using photolithography and overlay processes to cover the second photoresist on one side of the plurality of local silicon pillar arrays close to the front surface to obtain a microlens glue pillar array, wherein the microlens glue pillar array includes a plurality of microlens glue pillars, each of which covers a plurality of local silicon pillars of a corresponding local silicon pillar array; The microlens glue column array is heated to soften the multiple microlens glue columns to form a microlens spherical array, wherein the microlens spherical array includes multiple microlens spheres, each microlens sphere corresponds to a local silicon column array and is supported by multiple local silicon columns of the corresponding local silicon column array.

2. The method for preparing a spherical microlens array according to claim 1, characterized in that: The first photoresist is exposed and developed to obtain a plurality of local photoresist column arrays, including: According to a plurality of preset arrays, respectively determining the exposure area and the non-exposure area of ​​the first photoresist, wherein different preset arrays have different exposure areas, and each preset array corresponds to a local glue column array; Performing light treatment on the first photoresist according to the exposure area and the non-exposure area; The first photoresist after the light treatment is developed to project the plurality of preset arrays onto the first photoresist accordingly, so that the plurality of local glue pillars of each local glue pillar array are arranged on the front surface according to the corresponding preset array to obtain the plurality of local glue pillar arrays.

3. The method for preparing a spherical microlens array according to claim 2, characterized in that: The plurality of local silicon pillar arrays are obtained by etching on the front surface according to the plurality of preset arrays using an ICP etching process.

4. The method for preparing a spherical microlens array according to claim 2, characterized in that: After etching the front surface to obtain a plurality of local silicon pillar arrays, the method further comprises: The first photoresists corresponding to the plurality of preset arrays are removed.

5. The method for preparing a spherical microlens array according to claim 1, characterized in that: The microlens glue column array is heated to soften the plurality of microlens glue columns to form a microlens spherical array, comprising: Heating the microlens glue column array at a preset temperature; When the preset temperature is greater than the glass transition temperature of the second photoresist, the plurality of microlens glue columns are heated to soften and respectively cover a plurality of local silicon columns of the corresponding local silicon column array close to the front surface to obtain the plurality of microlens spherical surfaces to form the microlens spherical surface array.

6. The method for preparing a spherical microlens array according to claim 1, characterized in that: The first photoresist and the second photoresist are different positive photoresists.

7. The method for preparing a spherical microlens array according to claim 1, characterized in that: The height of the microlens glue column is greater than the height of the local silicon column.

8. A system for preparing a microlens spherical array, characterized in that: The system for preparing a microlens spherical array comprises: A photoresist coating device, used for spin coating a first photoresist on the front side of the silicon wafer; An exposure and development device, used for exposing and developing the first photoresist to obtain a plurality of local glue column arrays, each of which includes a plurality of local glue columns; A first photoresist processing device is used to etch the front surface according to the plurality of local glue column arrays to obtain a plurality of local silicon column arrays, each local silicon column array includes a plurality of local silicon columns, each local silicon column array corresponds to a local glue column array, and the plurality of local silicon columns correspond to the plurality of local glue columns of the corresponding local glue column array one by one; the photoresist coating device is also used to coat a second photoresist on the front surface; A second photoresist processing device, used for covering the second photoresist on a side of the plurality of local silicon pillar arrays close to the front surface by using a photolithography process and an overlay process to obtain a microlens glue pillar array, wherein the microlens glue pillar array includes a plurality of microlens glue pillars, each of which covers a plurality of local silicon pillars of a corresponding local silicon pillar array; A heating device is used to heat the microlens glue column array to soften and shape the multiple microlens glue columns to obtain a microlens spherical array, wherein the microlens spherical array includes multiple microlens spherical surfaces, each microlens spherical surface corresponds to a local silicon column array, and is supported by multiple local silicon columns of the corresponding local silicon column array.

9. The system for preparing a microlens spherical array according to claim 8, characterized in that: The first photoresist and the second photoresist are different positive photoresists.

10. The system for preparing a microlens spherical array according to claim 8, characterized in that: The height of the microlens glue column is greater than the height of the local silicon column.

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