Temperature control system and method and semiconductor cleaning equipment

Abstract

The invention provides a temperature control system and method and semiconductor cleaning equipment. According to the system, a first temperature sensor detects the first temperature of liquid medicine in a process tank body, and a second temperature sensor detects the second temperature of the heated liquid medicine; the control module is used for generating a second control signal when the second temperature is lower than a second target temperature, and at the moment, the control loop controls the heating module to heat the liquid medicine according to the full power according to the second control signal until the second temperature reaches the second target temperature; when the second temperature is not lower than the second target temperature, a first control signal is generated, and at the moment, the control loop controls the heating power of the heating module according to the first control signal until the first temperature reaches the first target temperature, so that the heating module is controlled to heat the liquid medicine in the process tank body in a segmented heating control mode; the liquid medicine heating time is shortened, and the process efficiency of the semiconductor cleaning equipment is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a temperature control system, method and semiconductor cleaning equipment. Background Art

[0002] In the wafer processing flow, cleaning technology is an important part, and the quality of wafer cleaning has an important impact on device performance. Among them, wafers are usually cleaned in batches using tank cleaning equipment. During the cleaning process, different chemical solutions are configured in the cleaning tank according to the different residual substances on the wafer surface that need to be removed to clean the surface without damage. In order to achieve the best cleaning effect, the temperature of the chemical solution in the cleaning tank needs to be controlled according to the process requirements; for example, for the current tank cleaning equipment, after each few wafer cleanings, the liquid in the cleaning tank needs to be replaced, the old liquid needs to be discharged, and new chemical liquid needs to be re-injected. After the new liquid is injected, the liquid needs to be reheated to the specified process temperature to ensure the cleaning effect of the wafer. Therefore, improving the heating efficiency of the chemical solution will have a direct impact on the production capacity of semiconductor equipment.

[0003] Existing tank cleaning equipment mainly uses circulating pumps and heaters to heat the liquid. During the heating process, the real-time temperature of the liquid in the tank is detected by a temperature sensor and input into the temperature controller. The temperature controller controls the heating of the liquid based on PID (Proportional Integral Derivative) and the real-time temperature. Based on the PID temperature control method, the liquid heating process will present a step-like temperature rise curve. It takes a long time for the temperature in the tank to reach the specified target temperature, which reduces the process efficiency of the tank cleaning equipment and thus reduces the production capacity of semiconductor equipment. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide a temperature control system, method and semiconductor cleaning equipment to alleviate the above-mentioned problems. By adopting a segmented heating control method to control the heating module to heat the chemical solution in the process tank, the heating time of the chemical solution is shortened, thereby improving the process efficiency of the semiconductor cleaning equipment, and further improving the production capacity of the semiconductor whole machine equipment.

[0005] In a first aspect, an embodiment of the present invention provides a temperature control system, which is applied to semiconductor cleaning equipment; the system includes: a control module, a control loop, a circulation module, a heating module, a first temperature sensor, and a second temperature sensor; the first temperature sensor is arranged in a process tank body of the semiconductor cleaning equipment, and is used to detect a first temperature of a liquid in the process tank body; the circulation module is connected to a liquid inlet and a liquid outlet of the process tank body, respectively, and is used to extract the liquid in the process tank body from the liquid outlet, and return the liquid to the process tank body through the liquid inlet; the heating module is arranged between the circulation module and the liquid inlet, and is used to heat the liquid flowing out of the liquid outlet; the second temperature sensor is arranged at the outlet of the heating module, and is used to detect a second temperature of the liquid after heating; the control module is used to obtain the first temperature and the second temperature, and if the second temperature is less than a preset second target temperature, a second control signal is generated, and the control loop controls the heating module to heat the liquid at full power according to the second control signal until the second temperature reaches the second target temperature; and when the second temperature is not less than the second target temperature, a first control signal is generated, and the control loop controls the heating power of the heating module according to the first control signal until the first temperature reaches the preset first target temperature; wherein the first target temperature is greater than the second target temperature.

[0006] Preferably, the control loop includes a first control loop and a second control loop; wherein the first control loop and the second control loop are arranged in parallel and are both connected to the heating module; the second control loop is used to control the heating module to heat the medicine solution at full power according to the second control signal; the first control loop is used to control the heating power of the heating module according to the first control signal.

[0007] Preferably, the first control loop includes: a first switching element, a temperature controller and a power control unit; wherein the power control unit is respectively connected to the first switching element, the temperature controller and the heating module; the first switching element is used to switch to a closed state according to a first control signal; the temperature controller is used to generate a power control signal according to the first temperature and the first target temperature; the power control unit is used to control the heating power of the heating module according to the power control signal.

[0008] Preferably, the thermostat is further used to obtain the first temperature detected by the first temperature sensor and send the first temperature to the control module; the control module is further used to write the first target temperature into the thermostat.

[0009] Preferably, the power control unit is a solid state relay.

[0010] Preferably, the second control loop comprises a second switch element, wherein the second switch element is connected to the heating module and is configured to be switched to a closed state according to a second control signal.

[0011] In a second aspect, an embodiment of the present invention further provides a temperature control method, which is applied to the temperature control system of the first aspect above, and the method includes: obtaining a first temperature and a second temperature; if the second temperature is lower than a preset second target temperature, generating a second control signal, and the control circuit controls the heating module to heat the medicine solution at full power according to the second control signal until the second temperature reaches the second target temperature; when the second temperature is not lower than the second target temperature, generating a first control signal, and the control circuit controls the heating power of the heating module according to the first control signal until the first temperature reaches the preset first target temperature; wherein the first target temperature is higher than the second target temperature.

[0012] Preferably, the control loop includes a first control loop and a second control loop; wherein the first control loop and the second control loop are arranged in parallel and are both connected to the heating module; the step in which the control loop controls the heating module to heat the medicinal liquid at full power according to the second control signal includes: the second control loop controls the heating module to heat the medicinal liquid at full power according to the second control signal.

[0013] Preferably, the step of the control loop controlling the heating power of the heating module according to the first control signal comprises: the first control loop controls the heating power of the heating module according to the first control signal.

[0014] In a third aspect, an embodiment of the present invention further provides a semiconductor cleaning device, which includes a process tank body and the temperature control system of the first aspect.

[0015] The embodiments of the present invention bring the following beneficial effects:

[0016] The embodiment of the present invention provides a temperature control system, method and semiconductor cleaning equipment. In the temperature control system, a first temperature sensor is used to detect a first temperature of a drug solution in a process tank body, and a second temperature sensor is used to detect a second temperature of the drug solution after heating; a control module is used to obtain the first temperature and the second temperature, and if the second temperature is less than a preset second target temperature, a second control signal is generated, and at this time, the control circuit controls the heating module to heat the drug solution at full power according to the second control signal until the second temperature reaches the second target temperature; and when the second temperature is not less than the second target temperature, a first control signal is generated, and at this time, the control circuit controls the heating power of the heating module according to the first control signal until the first temperature reaches the preset first target temperature; wherein the first target temperature is greater than the second target temperature, therefore, according to the second temperature of the heated drug solution being in different temperature ranges, the heating module is controlled to heat the drug solution at different heating powers, that is, the heating module is controlled to heat the drug solution in the process tank body by adopting a segmented heating control method, thereby shortening the drug solution heating time, thereby improving the process efficiency of the semiconductor cleaning equipment, and further improving the production capacity of the semiconductor whole machine equipment.

[0017] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A structural diagram of an existing tank-type cleaning device provided in an embodiment of the present invention;

[0021] Figure 2 A heating control principle diagram of an existing tank cleaning device provided by an embodiment of the present invention;

[0022] Figure 3 A schematic diagram of the structure of a semiconductor cleaning device provided by an embodiment of the present invention;

[0023] Figure 4 A control principle diagram of a temperature control system provided by an embodiment of the present invention;

[0024] Figure 5 A flow chart of a temperature control method provided by an embodiment of the present invention;

[0025] Figure 6 A schematic structural diagram of a semiconductor cleaning device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] For existing tank cleaning equipment, a circulation pump and a heater are mainly used to heat the liquid in the process tank (also called the cleaning tank). Figure 1 As shown, the tank cleaning equipment includes a process tank body 11, a circulation pump 12, a heater 13 and a temperature sensor 14 arranged in the process tank body 11. In addition, a first pipeline 15 is arranged between the process tank body 11 and the circulation pump 12, a second pipeline 16 is arranged between the circulation pump 12 and the heater 13, and a third pipeline 17 is arranged between the heater 13 and the process tank body 11.

[0028] Among them, the process tank body 11 is used to store the liquid, i.e., chemical liquid, used by the tank-type cleaning equipment to clean the wafer; the first pipeline 15, the second pipeline 16 and the third pipeline 17 are all used for the flow transmission of the liquid; the circulation pump 12 is used to control the circulation of the liquid; the heater 13 is used to heat the liquid; and the temperature sensor 14 is used to detect the temperature inside the process tank body 11.

[0029] Specifically, when the liquid in the process tank 11 needs to be heated, the heater 13 is turned on to heat the liquid therein, and the circulation pump 12 is turned on to circulate the liquid in the heating system, and the heated liquid is circulated into the process tank 11 through the circulation pump 12, so that the temperature in the process tank 11 is increased. Therefore, the heater 13 is continuously heated until the temperature in the process tank 11 reaches the specified target temperature, so as to achieve the purpose of increasing the temperature of the liquid in the process tank 11.

[0030] In addition, in order to control the temperature of the liquid in the process tank 11, a temperature sensor 14 is provided in the process tank 11 to detect the temperature in the process tank 11 in real time and feed the temperature back to the temperature control system. Figure 2 As shown, the temperature sensor feeds back the real-time temperature inside the process tank to the temperature controller (i.e., the temperature controller), a target temperature value is set inside the temperature controller, and a control signal is output based on the acquired real-time temperature and target temperature value as well as the internal PID control, so as to control the on and off of the solid-state relay according to the control signal. Since the solid-state relay is connected to the heater, the on and off control of the heater is realized, thereby achieving the purpose of heating temperature control.

[0031] And, if Figure 2 As shown, the tank cleaning equipment also includes a power supply (not shown), a circuit breaker and a contactor; wherein the power supply is connected to the heater via a power supply circuit. In actual applications, the circuit breaker is used to control the on and off of the heater power supply circuit, and the contactor is used to control the on and off of the heater.

[0032] However, based on the PID temperature control method, the liquid heating process will present a step-like temperature rising curve, and it will take a long time for the liquid temperature in the tank to reach the target temperature value, thereby reducing the process efficiency of the tank cleaning equipment and further reducing the production capacity of the semiconductor equipment.

[0033] Based on this, an embodiment of the present invention provides a temperature control system, method and semiconductor cleaning equipment. According to the second temperature of the heated solution being in different temperature ranges, the heating module is controlled to heat the solution according to different heating powers. That is, the heating module is controlled to heat the solution in the process tank by adopting a segmented heating control method, thereby shortening the solution heating time, thereby improving the process efficiency of the semiconductor cleaning equipment, and further improving the production capacity of the semiconductor whole machine equipment.

[0034] To facilitate understanding of this embodiment, the embodiment of the present invention is described in detail below.

[0035] Embodiment 1

[0036] An embodiment of the present invention provides a temperature control system applied to semiconductor cleaning equipment; the system includes: a control module, a control loop, a circulation module, a heating module, a first temperature sensor and a second temperature sensor.

[0037] Specifically, Figure 3 As shown, the first temperature sensor 311 is disposed in the process tank body 32 of the semiconductor cleaning equipment, and is used to detect the first temperature T1 of the liquid in the process tank body 32. In addition, the circulation module 313 is respectively connected to the liquid inlet 321 and the liquid outlet 322 of the process tank body 32, and is used to extract the liquid in the process tank body 32 from the liquid outlet 322, and return the liquid to the process tank body 32 through the liquid inlet 321; in the actual process, the circulation module 313 is preferably a circulation pump.

[0038] The heating module 314 is arranged between the circulation module 313 and the liquid inlet 321, and is used to heat the medicine flowing out of the liquid outlet 322; here the heating module 314 is preferably a heater. Therefore, for the medicine in the process tank body 32, when heating is required, the circulation module 313 and the heating module 314 are turned on, and the circulation module 313 draws the medicine in the process tank body 32 from the liquid outlet 322, and after being heated by the heating module 314, it returns to the process tank body 32 from the liquid inlet 321, thereby realizing the heating of the medicine in the process tank body 32, so that the medicine that meets the temperature requirements can be used to clean the wafer, thereby ensuring the production quality of the wafer.

[0039] In addition, the second temperature sensor 312 is arranged at the outlet of the heating module 314, and is used to detect the second temperature T2 of the heated medicinal liquid; it should be noted that the first temperature T1 and the second temperature T2 are only used to distinguish the temperature of the medicinal liquid at different positions at the same time. Preferably, the first temperature sensor 311 is controlled to collect the first temperature T1 in real time, and the second temperature sensor 312 is controlled to collect the second temperature T2 in real time; in some cases, the first temperature T1 and the second temperature T2 can be set to be periodically collected at preset intervals, which can be set specifically according to actual conditions.

[0040] During the temperature control process, the control module (not shown) is used to obtain the first temperature T1 and the second temperature T2. If the second temperature T2 is lower than the preset second target temperature T02, a second control signal is generated. At this time, the control circuit controls the heating module 314 to heat the medicine liquid at full power according to the second control signal until the second temperature T2 reaches the second target temperature T02; and, when the second temperature T2 is not lower than the second target temperature T02, a first control signal is generated. At this time, the control circuit controls the heating power of the heating module according to the first control signal until the first temperature T1 reaches the preset first target temperature T01.

[0041] Among them, the first target temperature T01 is greater than the second target temperature T02, that is, T01>T02, preferably, T02=0.9*T01. Specifically, when T2<T02, the control module generates a second control signal, and the control loop controls the heating module 314 to heat the liquid at full power according to the second control signal until T2=T02; when T2≥T02, the control module generates a first control signal, and the control loop controls the heating power of the heating module 314 according to the first control signal until the first temperature T1 in the process tank 32=T01. Therefore, by setting a plurality of temperature sensors and using different segmented control methods to control the heating module 314 to heat the liquid, compared with the existing single PID control method, the liquid heating time is shortened, thereby improving the process efficiency of the semiconductor cleaning equipment.

[0042] The temperature control system provided in the embodiment of the present invention controls the heating module to heat the liquid in the process tank body by adopting a segmented heating control method, thereby shortening the liquid heating time, thereby improving the process efficiency of the semiconductor cleaning equipment, and further improving the production capacity of the semiconductor whole machine equipment.

[0043] Furthermore, if Figure 3As shown, pipelines are also provided in the semiconductor cleaning equipment, and the pipelines include but are not limited to: a first pipeline 315 is provided between the process tank body 32 and the circulation module 313, a second pipeline 316 is provided between the circulation module 313 and the heating module 314, and a third pipeline 317 is provided between the heating module 314 and the process tank body 32; the above-mentioned first pipeline 315, second pipeline 316 and third pipeline 317 are all used for the flow transmission of the chemical solution.

[0044] In one embodiment, the above-mentioned control loop includes a first control loop and a second control loop; wherein the first control loop and the second control loop are arranged in parallel, and both are connected to the heating module 314; specifically, the second control loop is used to control the heating module 314 to heat the medicine solution at full power according to the second control signal; and the first control loop is used to control the heating power of the heating module 314 according to the first control signal.

[0045] Therefore, when T2<T02, the second control loop controls the heating module 314 according to the second control signal to heat the chemical solution at full power until T2=T02; when T2≥T02, the first control loop controls the heating power of the heating module 314 according to the first control signal, thereby controlling the heating module 314 in different segmented control modes through the first control loop and the second control loop, so that the temperature of the chemical solution quickly reaches the first target temperature T01, thereby shortening the heating time of the chemical solution and improving the process efficiency of the semiconductor cleaning equipment.

[0046] In one embodiment, the above-mentioned first control loop includes: a first switching element, a temperature controller and a power control unit; wherein the power control unit is respectively connected to the first switching element, the temperature controller and the heating module; the first switching element is used to switch to a closed state according to a first control signal; the temperature controller is used to generate a power control signal according to the first temperature T1 and the first target temperature T01, and at this time, the power control unit is used to control the heating power of the heating module 314 according to the power control signal.

[0047] Among them, the first switch element is preferably a contactor. For the sake of convenience, the first switch element is defined as contactor 1 here. When contactor 1 obtains the first control signal, it switches to a closed state according to the first control signal, so as to control the heating of the heating module 314 according to the first control loop. The temperature controller takes the first temperature T1 as input, and generates a power control signal according to the first temperature T1 and the first target temperature T01 to control the output ratio of the power control unit, thereby adjusting the heating power of the heating module 314. Here, the power control unit is preferably a solid-state relay.

[0048] In one implementation, the thermostat is further configured to obtain a first temperature detected by a first temperature sensor and send the first temperature to the control module; the control module is further configured to write the first target temperature into the thermostat.

[0049] Specifically, the above-mentioned thermostat is also connected to the control module via RS485 communication, and is used to send the first temperature detected by the first temperature sensor to the control module, so that the control module generates a corresponding control signal according to the first temperature and the second temperature. In addition, the control module is also used to write the first target temperature T01 into the thermostat, so that the thermostat generates a power control signal according to the first temperature T1 and the first target temperature T01, thereby realizing the adjustment of the heating power of the heating module 314.

[0050] In one embodiment, the second control loop includes a second switch element, wherein the second switch element is connected to the heating module 314 and is configured to be switched to a closed state according to a second control signal.

[0051] Similarly, the second switching element is preferably a contactor. For the sake of ease of explanation, the second switching element is defined here as contactor 2. When contactor 2 obtains the second control signal, it switches to a closed state according to the second control signal, so that the control module controls the heating module 314 according to the second control loop to heat the medicine solution at full power, so that the temperature of the medicine solution quickly reaches the second target temperature T02, thereby shortening the heating time of the medicine solution and improving the process efficiency of the semiconductor cleaning equipment.

[0052] In one embodiment, the system further includes a power supply circuit; wherein the power supply circuit is connected to the heating module 314 via a control loop, and is used to supply power to the heating module 314 .

[0053] Since the control loop includes a first control loop and a second control loop, when T2<T02, the second control loop is turned on according to the second control signal, at this time, the power supply circuit supplies power to the heating module 314 via the second control loop, so that the heating module 314 heats the liquid medicine at full power; until T2=T02; when T2≥T02, the first control loop is turned on according to the first control signal, at this time, the power supply circuit supplies power to the heating module 314 via the first control loop, and the temperature controller adjusts the heating power of the heating module 314 according to the first temperature T1 and the first target temperature T01, so that the temperature of the liquid medicine quickly reaches the first target temperature T01. Therefore, the heating module 314 is powered by the power supply circuit to ensure that the heating module 314 is controlled to heat the liquid medicine by using different segmented control methods, thereby shortening the liquid medicine heating time and improving the process efficiency of the semiconductor cleaning equipment.

[0054] In one embodiment, the system further includes a third switch element and a fourth switch element; wherein the power supply circuit is connected to the control circuit via the fourth switch element and the third switch element; the fourth switch element is used to control the conduction or disconnection of the power supply circuit; and the third switch element is used to control the conduction or disconnection of the heating module.

[0055] Specifically, the third switching element is preferably a contactor. For ease of explanation, the third switching element is defined here as contactor 3. When the control module controls the contactor 3 to switch to a closed state, the heating module 314 is turned on, thereby heating the medicinal liquid; conversely, when the control module controls the contactor 3 to switch to an open state, the heating module 314 is in a disconnected state, i.e., a non-working state, and cannot heat the medicinal liquid.

[0056] Similarly, the fourth switch element is preferably a circuit breaker. When the operator manually closes the circuit breaker, the power supply circuit is turned on and supplies power to the heating module 314. When an overcurrent or short circuit occurs in the circuit during the heating process, the operator manually disconnects the circuit breaker, and the power supply circuit is disconnected and stops supplying power to the heating module 314. Therefore, the switching state of the heating module 314 is further controlled by the third switch element and the fourth switch element, thereby improving the control accuracy of the liquid medicine temperature.

[0057] Embodiment 2

[0058] Based on the above embodiments, the working principle of the temperature control system is described in the embodiments of the present invention. Figure 4 As shown, the control module is preferably a PLC (Programmable Logic Controller), the heating module is a heater, the first switch element is a contactor 1, the second switch element is a contactor 2, the third switch element is a contactor 3, the fourth switch element is a circuit breaker, the power control unit is a solid-state relay, the first temperature sensor is a temperature sensor 1, which is installed in the process tank body and is used to detect the temperature of the liquid in the process tank body; the second temperature sensor is a temperature sensor 2, which is installed at the outlet of the heater and is used to detect the outlet temperature of the heater, that is, the temperature of the heated liquid.

[0059] Among them, the PLC is connected to the temperature controller through communication, and can not only obtain the second temperature T2 of the heated liquid detected by the temperature sensor 2, but also obtain the first temperature T1 of the liquid in the process tank 32 detected by the temperature sensor 1 through the temperature controller. At the same time, the second target temperature T02 is set, and the first target temperature T01 is written into the temperature controller. For example, after experimental measurement, when the second target temperature T02 is 90% of the first target temperature T01, the system takes the shortest time to reach the process target temperature T01, so here T02 = 0.9T01. In addition, the circuit breaker controls the on and off of the heater power supply circuit. When the circuit breaker is manually closed, the heater power supply circuit is turned on. When the heating circuit is overcurrent or short-circuited, the circuit breaker is disconnected and the heater stops supplying power. It should be noted that the above-mentioned second target temperature T02 can be adaptively adjusted according to actual conditions, and the embodiment of the present invention is not limited here.

[0060] Contactor 3 is used to control the conduction of the heater. Figure 3 When the liquid in the process tank needs to be heated, the PLC outputs a DO signal to control the coil of contactor 3 to be turned on, the normally open contact of contactor 3 to be closed, and part of contactor 3 in the power supply circuit is turned on. At this time, contactor 1 and contactor 2 are used to select the power supply circuit of the heater, which can also be called the selection of the control circuit; for example, when the PLC generates the second control signal D02, it controls the contact of contactor 2 to be closed. At this time, the power supply circuit supplies power to the heater through the circuit breaker, contactor 3, and contactor 2; when the PLC generates the first control signal D01, it controls the contact of contactor 1 to be closed. At this time, the power supply circuit supplies power to the heater through the circuit breaker, contactor 3, contactor 1, and the solid-state relay; at the same time, the temperature controller generates a power control signal according to the first temperature T1 and the first target temperature T01, and the solid-state relay adjusts the heating power of the heater according to the power control signal.

[0061] Specifically, the working principle of the above temperature control system is as follows:

[0062] (1) When T2<T02, the heater is heated at full power. At this time, the PLC outputs the second control signal DO2 to control the coil of contactor 2 to be energized, and its normally open contact is closed. The power supply circuit supplies power to the heater through the circuit breaker, contactor 3, and contactor 2. The heater works at full power, and the temperature in the system can be quickly increased. When the temperature T2 reaches T02 (90% T01), the process target temperature T01 of the liquid in the process tank has not yet been reached. The liquid needs to be continuously heated until the temperature of the liquid in the process tank reaches T01.

[0063] (2) When T2≥T02, the heater stops heating at full power; the PLC outputs DO1, controls the coil of contactor 1 to be energized, closes its normally open contact, and supplies power to the heater through the circuit breaker, contactor 3, contactor 1, and solid-state relay. Specifically, when the temperature T2 of the heated liquid reaches T02, since a third pipeline is provided between the heater and the process tank body, there is heat loss when the liquid returns to the process tank body through the third pipeline, and T02<process target temperature T01, resulting in the temperature T1 of the liquid in the process tank body<T01; at this time, the temperature controller performs PID control inside, and outputs a power control signal to the solid-state relay according to T1 and T01 to activate the semiconductor device inside the solid-state relay to turn it on, so that the current can flow into the heater through the solid-state relay to heat the heater. Among them, the power control signal is a PWM (Pulse Width Modulation) square wave, and the solid-state relay changes the duty cycle of the heater current according to the duty cycle of the PWM square wave, thereby controlling the heating power of the heater. For example, when the temperature controller outputs a PWM square wave control signal to the solid-state relay, and the PWM duty cycle is 50%, the duty cycle of the heater current is 50%, and the heater heats at 50% heating power. Therefore, in this stage, the heating power of the heater is controlled to heat the liquid in the system, and when the temperature T1 inside the process tank reaches the set process target temperature T01, the heater is controlled to stop heating.

[0064] In summary, the temperature control system provided in the embodiment of the present invention detects the temperature of the chemical solution at different positions in the system through multiple temperature sensors, and controls the heater using a segmented heating control method, so that the temperature in the process tank reaches the set process target temperature more quickly, shortening the chemical solution heating time, thereby improving the process efficiency of the semiconductor cleaning equipment, and further improving the production capacity of the semiconductor complete equipment.

[0065] Embodiment 3

[0066] Based on the above temperature control system, the embodiment of the present invention also provides a temperature control method, such as Figure 5 As shown, the method comprises the following steps:

[0067] Step S502, obtaining a first temperature and a second temperature;

[0068] Step S504: if the second temperature is lower than the preset second target temperature, a second control signal is generated, and the control circuit controls the heating module to heat the liquid medicine at full power according to the second control signal until the second temperature reaches the second target temperature;

[0069] Step S506, when the second temperature is not less than the second target temperature, a first control signal is generated, and the control loop controls the heating power of the heating module according to the first control signal until the first temperature reaches a preset first target temperature; wherein the first target temperature is greater than the second target temperature.

[0070] Preferably, the control loop includes a first control loop and a second control loop; wherein the first control loop and the second control loop are arranged in parallel and are both connected to the heating module; the step in which the control loop controls the heating module to heat the medicinal liquid at full power according to the second control signal includes: the second control loop controls the heating module to heat the medicinal liquid at full power according to the second control signal.

[0071] Preferably, the step of the control loop controlling the heating power of the heating module according to the first control signal comprises: the first control loop controls the heating power of the heating module according to the first control signal.

[0072] The specific process of the temperature control method can refer to the temperature control system, and the embodiment of the present invention will not be described in detail here. Therefore, the temperature control method controls the heating module to heat the liquid in the process tank by adopting a segmented heating control method, shortens the liquid heating time, thereby improving the process efficiency of the semiconductor cleaning equipment, and further improving the production capacity of the semiconductor equipment.

[0073] The temperature control method provided in the embodiment of the present invention has the same technical features as the temperature control system provided in the above embodiment, so it can also solve the same technical problems and achieve the same technical effects.

[0074] Furthermore, an embodiment of the present invention also provides a semiconductor cleaning device, which includes a process tank body and the above-mentioned temperature control system. In the actual cleaning process, the temperature control system heats the liquid in the process tank body by adopting a segmented heating control method so that the temperature of the liquid quickly reaches the set target temperature (i.e., the first target temperature), thereby shortening the liquid heating time, improving the process efficiency of the semiconductor cleaning device, and further improving the production capacity of the semiconductor complete device.

[0075] An embodiment of the present invention further provides a semiconductor cleaning device, including a processor and a memory, wherein the memory stores machine executable instructions that can be executed by the processor, and the processor executes the machine executable instructions to implement the above-mentioned temperature control method.

[0076] See also Figure 6 As shown, the semiconductor cleaning equipment includes a processor 100 and a memory 101. The memory 101 stores machine executable instructions that can be executed by the processor 100. The processor 100 executes the machine executable instructions to implement the above temperature control method.

[0077] Further, Figure 6 The semiconductor cleaning device shown further includes a bus 102 and a communication interface 103 , and the processor 100 , the communication interface 103 and the memory 101 are connected via the bus 102 .

[0078] Among them, the memory 101 may include a high-speed random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk storage. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 103 (which can be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. can be used. The bus 102 can be an ISA (Industrial Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus or an EISA (Enhanced Industry Standard Architecture) bus, etc. The above-mentioned bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 6 Only one bidirectional arrow is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0079] The processor 100 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit or software instructions in the processor 100. The above processor 100 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present invention can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in conjunction with the embodiments of the present invention can be directly embodied as a hardware decoding processor for execution, or a combination of hardware and software modules in the decoding processor for execution. The software module may be located in a storage medium mature in the art, such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 101, and the processor 100 reads the information in the memory 101 and completes the steps of the method of the above embodiment in combination with its hardware.

[0080] This embodiment also provides a machine-readable storage medium, which stores machine-executable instructions. When the machine-executable instructions are called and executed by a processor, the machine-executable instructions prompt the processor to implement the above-mentioned temperature control method.

[0081] The computer program product of the temperature control system, method and semiconductor cleaning equipment provided in the embodiments of the present invention includes a computer-readable storage medium storing program code. The instructions included in the program code can be used to execute the methods described in the previous method embodiments. The specific implementation can be found in the method embodiments and will not be repeated here.

[0082] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system and device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0083] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0084] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0085] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0086] Finally, it should be noted that the above-described embodiments are only specific implementations of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed by the present invention, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A temperature control system, applied to semiconductor cleaning equipment; characterized in that: The system comprises: a control module, a control loop, a circulation module, a heating module, a first temperature sensor and a second temperature sensor; The first temperature sensor is disposed in the process tank body of the semiconductor cleaning equipment, and is used to detect a first temperature of the chemical solution in the process tank body; The circulation module is respectively connected to the liquid inlet and the liquid outlet of the process tank body, and is used to extract the liquid medicine in the process tank body from the liquid outlet and return the liquid medicine to the process tank body through the liquid inlet; The heating module is disposed between the circulation module and the liquid inlet, and is used to heat the liquid medicine flowing out of the liquid outlet; The second temperature sensor is disposed at the outlet of the heating module and is used to detect the second temperature of the heated liquid medicine; The control module is used to obtain the first temperature and the second temperature, and if the second temperature is lower than a preset second target temperature, generate a second control signal, and the control circuit controls the heating module to heat the medicine liquid at full power according to the second control signal until the second temperature reaches the second target temperature; and when the second temperature is not lower than the second target temperature, generate a first control signal, and the control circuit controls the heating power of the heating module according to the first control signal until the first temperature reaches a preset first target temperature; wherein the first target temperature is higher than the second target temperature.

2. The system according to claim 1, characterized in that The control loop includes a first control loop and a second control loop; wherein the first control loop and the second control loop are arranged in parallel, and are both connected to the heating module; The second control circuit is used to control the heating module to heat the liquid medicine at full power according to the second control signal; The first control loop is used to control the heating power of the heating module according to the first control signal.

3. The system according to claim 2, characterized in that The first control loop includes: a first switch element, a temperature controller and a power control unit; wherein the power control unit is connected to the first switch element, the temperature controller and the heating module respectively; The first switch element is configured to switch to a closed state according to the first control signal; The thermostat is configured to generate a power control signal according to the first temperature and the first target temperature; The power control unit is used to control the heating power of the heating module according to the power control signal.

4. The system according to claim 3, characterized in that The thermostat is further used to obtain the first temperature detected by the first temperature sensor and send the first temperature to the control module; The control module is further used to write the first target temperature into the thermostat.

5. The system according to claim 3, characterized in that The power control unit is a solid state relay.

6. The system according to claim 2, characterized in that The second control loop includes a second switch element; wherein the second switch element is connected to the heating module and is configured to switch to a closed state according to the second control signal.

7. A temperature control method, characterized in that: Applied to the temperature control system according to any one of claims 1 to 6 above, the method comprises: acquiring the first temperature and the second temperature; If the second temperature is lower than a preset second target temperature, a second control signal is generated, and the control circuit controls the heating module to heat the liquid medicine at full power according to the second control signal until the second temperature reaches the second target temperature; When the second temperature is not less than the second target temperature, a first control signal is generated, and the control circuit controls the heating power of the heating module according to the first control signal until the first temperature reaches a preset first target temperature; Wherein, the first target temperature is greater than the second target temperature.

8. The method according to claim 7, characterized in that The control loop includes a first control loop and a second control loop; wherein the first control loop and the second control loop are arranged in parallel and are both connected to the heating module; the control loop controls the heating module to heat the liquid medicine at full power according to the second control signal, comprising: The second control loop controls the heating module to heat the liquid medicine at full power according to the second control signal.

9. The method according to claim 8, characterized in that The step of the control loop controlling the heating power of the heating module according to the first control signal comprises: The first control loop controls the heating power of the heating module according to the first control signal.

10. A semiconductor cleaning device, characterized in that: The semiconductor cleaning equipment comprises a process tank and a temperature control system as described in any one of claims 1 to 6.

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