Intelligent silver wire bonding method and system for intelligently regulating and controlling power of power supply

Abstract

The invention relates to the technical field of power supply power management, and discloses an intelligent silver wire bonding method for intelligently regulating and controlling power supply power, and the method comprises the steps: querying the bonding technology of an intelligent bonding silver wire, setting the power supply power of the intelligent bonding silver wire, and collecting the bonding data of the intelligent bonding silver wire; classifying data items of the bonding data are identified, and key bonding parameters of the bonding data are extracted; identifying an action relationship between the power supply power and the bonding quality, and setting a power tracking system of the power supply power; analyzing a parameter change rule of the power supply power, and identifying a constraint condition of the power supply power; setting a power distribution mode and an abnormity warning threshold value of the power supply power, and setting a self-adaptive adjustment mechanism of the power supply power based on the abnormity warning threshold value and the power distribution mode; and in combination with a power tracking system, a self-adaptive adjustment mechanism and a power distribution mode, performing intelligent regulation and control on the power of the power supply to obtain an intelligent regulation and control result. According to the invention, the power of the bonding silver wire can be intelligently regulated and controlled, and the bonding quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of power management, and in particular to an intelligent silver wire bonding method and system for intelligently regulating power of a power source. Background Art

[0002] Smart silver bonding wire with intelligent power control refers to a bonding silver wire that can dynamically adjust its conductive properties according to the load requirements and operating status of the power system to adapt to different load requirements and improve energy utilization efficiency and the overall performance of the system. With the rapid development of microelectronics technology and the growing demand for intelligent manufacturing, the requirements for bonding silver wire and its process are gradually increasing. In order to improve the production efficiency and quality control of bonding silver wire, power management has become a key factor.

[0003] In the prior art, the power supply control for the silver bonding wire mainly adopts fixed parameter settings, which cannot be dynamically adjusted according to the actual load demand, affecting the control accuracy of the silver bonding wire power supply and resulting in poor quality of the silver bonding wire. Summary of the invention

[0004] In order to solve the above problems, the present invention provides an intelligent silver wire bonding method and system with intelligent power control of power supply, which can realize intelligent control of the power supply of the bonding silver wire and improve the bonding quality.

[0005] In a first aspect, the present invention provides an intelligent silver wire bonding method with intelligent power control, comprising: Acquire a smart silver bonding wire to be regulated, query the bonding process of the smart silver bonding wire, set the power of the smart silver bonding wire according to the bonding process, and collect bonding data of the smart silver bonding wire; Identifying classification data items of the bonding data, analyzing the mutual dependence between the power supply power and the classification data items, and extracting key bonding parameters of the bonding data according to the mutual dependence; Based on the key bonding parameters, the bonding quality of the smart silver bonding wire is analyzed, the functional relationship between the power supply and the bonding quality is identified, and according to the functional relationship, a power tracking system of the power supply is set; According to the power tracking system, real-time parameters of the power supply are collected, based on the real-time parameters, parameter variation rules of the power supply are analyzed, and according to the parameter variation rules, constraint conditions of the power supply are identified; Based on the constraint condition, a power allocation mode of the power supply is set, according to the power allocation mode, an abnormal warning threshold of the power supply is set, and based on the abnormal warning threshold and the power allocation mode, an adaptive adjustment mechanism of the power supply is set; In combination with the power tracking system, the adaptive adjustment mechanism and the power allocation mode, the power supply power is intelligently regulated to obtain an intelligent regulation result.

[0006] In a possible implementation manner of the first aspect, setting the power supply power of the smart bonding silver wire according to the bonding process includes: identifying a process type of the bonding process; Based on the process type, identifying a bonding object corresponding to the smart bonding silver wire; analyzing a first material property and a second material property of the smart silver bonding wire and the bonding object; Analyzing energy requirements corresponding to the process type according to the first material characteristic and the second material characteristic; Based on the energy requirement, identifying a bonding environment condition between the smart bonding silver wire and the bonding object; The power supply power of the smart bonding silver wire is set in combination with the energy demand, the material properties and the bonding environment conditions.

[0007] In a possible implementation manner of the first aspect, analyzing the bonding quality of the smart bonding silver wire based on the key bonding parameter includes: Based on the key bonding parameters, identifying the bonding interface of the smart silver bonding wire; analyzing material properties and surface conditions of the bonding interface; Identifying bonding influencing factors of the smart silver bonding wire according to the material properties and the surface state; Based on the smart silver bonding wire, extracting bonding points of the bonding interface; Analyzing the stability of the bonding point according to the bonding influencing factors; The bonding quality of the smart bonding silver wire is analyzed in combination with the material properties, the surface state and the stability.

[0008] In a possible implementation manner of the first aspect, setting a power tracking system of the power supply power according to the action relationship includes: According to the action relationship, identifying the bonding quality corresponding to the power supply power; Setting a quality standard for the bonding quality, and setting a power floating threshold of the power supply power according to the quality standard; Configuring a power monitoring device for the power supply, and collecting real-time power parameters of the power supply based on the power monitoring device; According to the power floating threshold, setting a tracking trigger condition of the real-time power parameter; In combination with the power floating threshold, the power monitoring device and the tracking trigger condition, a power tracking system of the power supply power is set.

[0009] In a possible implementation manner of the first aspect, analyzing a parameter change rule of the power supply based on the real-time parameter includes: Extracting historical data of the power supply power, and extracting power change data of the historical data; identifying time series data of the power variation data; Analyzing the historical change trend of the power supply based on the time series data; Analyzing the power change condition of the power supply according to the power change data; Extracting characteristic performance of the power supply under the historical change trend; Based on the change condition and the characteristic performance, construct a trend change model of the power supply power; According to the trend change model, the parameter change law of the power supply power is analyzed.

[0010] In a possible implementation manner of the first aspect, identifying the power constraint of the power supply according to the parameter variation rule includes: Identify the influencing factors of the parameter variation pattern; Analyze the factor types of the influencing factors; The proportion of the effect of the factor type on the power supply power is calculated using the following formula: ; in, Indicates the proportion of the effect of factor type on power supply power, Indicates the total number of evaluations corresponding to the factor type, The frequency index indicating the number of evaluations, represents the effect score of the i-th factor type on power supply power, Indicates The weight coefficient of each factor type, represents the total number of factor types, The index number indicating the factor type, Indicates The adjustment coefficient of each factor type on the power supply power; According to the role proportion, extract the key factor type of the influencing factor; Identify the bonding area corresponding to the power supply, and analyze the bonding material properties of the bonding area; identifying an output threshold of the power supply according to the property of the bonding material; Extracting bonding operation devices in the bonding area, and extracting a maximum power output range of the bonding operation devices; The power constraint of the power supply is identified based on the key factor type, the output threshold, and the maximum power output range.

[0011] In a possible implementation manner of the first aspect, setting the power allocation mode of the power supply based on the constraint condition includes: identifying a power transmission path of the power supply; Determining the bonding material and bonding area corresponding to the power supply power according to the power transmission path; identifying a bonding stage of the bonding material, and analyzing a stage power requirement of the bonding material based on the bonding stage; Extracting material bonding points of the bonding area and identifying bonding point positions of the material bonding points; identifying material properties of the bonding material, and analyzing regional power requirements of the bonding material based on the material properties and the bonding point locations; Based on the constraint conditions, analyzing the bonding effect of the bonding material; A power distribution mode of the power supply is set according to the bonding effect, the stage power requirement and the regional power requirement.

[0012] In a possible implementation manner of the first aspect, setting the abnormal warning threshold of the power supply power according to the power allocation mode includes: According to the power allocation mode, identifying the bonding stage and bonding object corresponding to the power of the power supply; analyzing the stage power requirements of the bonding stage and analyzing the material properties of the bonding objects; Based on the stage power requirement and the material properties, setting the segmented power standard of the power supply power; According to the segmented power standard, defining the stage abnormal conditions of the power supply power; Based on the segmented power standard and the stage abnormal condition, an abnormal warning threshold of the power supply power is set.

[0013] In a possible implementation manner of the first aspect, setting the adaptive adjustment mechanism of the power supply power based on the abnormal warning threshold and the power allocation mode includes: Based on the abnormal warning threshold, setting an abnormal feedback mechanism of the power supply power; According to the abnormal feedback mechanism, locating the abnormal area of ​​the power supply; Based on the power allocation mode, analyzing the power demand of the abnormal area; The following formula is used to identify the reasonableness of the operation of the required power in the abnormal area: ; Among them, M represents the reasonableness of the operation of the required power in the abnormal area, Indicates the adjustment coefficient of the required power in the abnormal area, It represents the difference between the required power and the actual power in the abnormal area at a specific time t. It represents the correction value of the required power in the abnormal area at a specific time t. It represents the error tolerance of the demand power in the abnormal area at a specific time t; According to the rationality of the operation, setting a mode switching condition of the power allocation mode; Based on the mode switching condition and the required power, an adaptive adjustment mechanism of the power supply power is set.

[0014] In a second aspect, the present invention provides an intelligent silver wire bonding system with intelligent power control, characterized in that the system comprises: A data acquisition module, used to obtain the smart bonding silver wire to be regulated, query the bonding process of the smart bonding silver wire, set the power supply of the smart bonding silver wire according to the bonding process, and collect bonding data of the smart bonding silver wire; A key parameter extraction module, used to identify the classification data items of the bonding data, analyze the mutual dependence degree between the power supply power and the classification data items, and extract the key bonding parameters of the bonding data according to the mutual dependence degree; A power tracking module, used for analyzing the bonding quality of the smart silver bonding wire based on the key bonding parameters, identifying the functional relationship between the power supply and the bonding quality, and setting a power tracking system of the power supply according to the functional relationship; A rule analysis module, used for collecting the real-time parameters of the power supply according to the power tracking system, analyzing the parameter change rule of the power supply based on the real-time parameters, and identifying the constraint conditions of the power supply according to the parameter change rule; A power allocation module, configured to set a power allocation mode of the power supply based on the constraint conditions, set an abnormal warning threshold of the power supply according to the power allocation mode, and set an adaptive adjustment mechanism of the power supply based on the abnormal warning threshold and the power allocation mode; The intelligent control module is used to combine the power tracking system, the adaptive adjustment mechanism and the power allocation mode to intelligently control the power of the power supply and obtain an intelligent control result.

[0015] Compared with the prior art, the technical principle and beneficial effects of the above solution are: The embodiment of the present invention can determine the key parameters affecting the power demand in the bonding process and the relationship between the power and the bonding data by querying the bonding process of the smart bonding silver wire, setting the power of the smart bonding silver wire according to the bonding process, and collecting the bonding data of the smart bonding silver wire, so as to realize the intelligent control of the bonding silver wire equipment; further, the embodiment of the present invention can better monitor and control the bonding process and ensure the quality of the bonding product by analyzing the mutual dependence degree between the power and the classification data items and extracting the key bonding parameters of the bonding data according to the mutual dependence degree; secondly, the embodiment of the present invention can determine the optimal power setting and optimize the bonding process by identifying the functional relationship between the power and the bonding quality and setting the power tracking system of the power according to the functional relationship, and reduce the fluctuation in the bonding process and improve the consistency of the bonding process by accurately controlling the power; thirdly, the embodiment of the present invention can continuously learn and optimize the power by analyzing the parameter variation law of the power and identifying the constraint conditions of the power according to the parameter variation law. The control strategy is adopted to make more scientific and data-driven decisions, improve the intelligence level of the bonding process, and automatically adjust the power supply according to the constraint conditions to ensure that the power supply is maintained within the range that can produce high-quality bonding; in addition, the embodiment of the present invention sets the power distribution mode of the power supply based on the constraint conditions to ensure that the bonding area obtains sufficient energy, avoids thermal damage to the material during the bonding process, and improves production efficiency. Based on the abnormal warning threshold and the power distribution mode, an adaptive adjustment mechanism of the power supply is set, which can flexibly adjust the power supply according to different production conditions and material properties to achieve intelligent control of the power supply; finally, the embodiment of the present invention combines the power tracking system, the adaptive adjustment mechanism and the power distribution mode to intelligently control the power supply to obtain an intelligent control result, which helps to maintain the stability of the bonding process, reduce fluctuations and defects, and thus improve the bonding quality. At the same time, through precise power distribution, unnecessary energy waste can be avoided, energy-saving production can be achieved, and the intelligent control system can quickly adapt to different production needs, thereby enhancing the flexibility and adaptability of the bonding process. Therefore, the intelligent silver wire bonding method with intelligent power control proposed in the present invention can realize intelligent power control of the silver wire bonding power and improve the bonding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 A schematic diagram of a process flow of an intelligent silver wire bonding method with intelligent power control provided by an embodiment of the present invention; Figure 2 A schematic diagram of a module of an intelligent silver bonding wire system with intelligent power control provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0019] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0020] The embodiment of the present invention provides a smart silver wire bonding method with intelligent power control, and the execution subject of the smart silver wire bonding method with intelligent power control includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided by the embodiment of the present invention. In other words, the smart silver wire bonding method with intelligent power control can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc. The server can be an independent server, or it can be a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms.

[0021] See also Figure 1 FIG. 1 is a flow chart of an intelligent silver wire bonding method with intelligent power control provided by an embodiment of the present invention. Figure 1 The smart silver wire bonding method for intelligent power control described in the invention includes: S1. Obtain a smart bonding silver wire to be regulated, and query the bonding process of the smart bonding silver wire, set the power supply of the smart bonding silver wire according to the bonding process, and collect bonding data of the smart bonding silver wire.

[0022] The embodiment of the present invention can determine the key parameters affecting the power demand in the bonding process by acquiring the smart bonding silver wire to be regulated and querying the bonding process of the smart bonding silver wire, thereby providing data support for the subsequent intelligent control of the power demand of the smart bonding silver wire. The smart bonding silver wire refers to the silver wire monitored and regulated by the intelligent control system during the bonding process, and the bonding process refers to the technical process of using silver wire as a connecting material to connect the electrode of the chip to the lead frame or substrate.

[0023] Optionally, the bonding process query of the smart bonding silver wire can be obtained through process testing.

[0024] Furthermore, the embodiment of the present invention sets the power supply power of the smart bonding silver wire according to the bonding process and collects the bonding data of the smart bonding silver wire, so as to determine the relationship between the power supply power and the bonding data, so as to realize intelligent control of the bonding silver wire equipment. The power supply power refers to the electric energy power supplied to the bonding equipment during the silver wire bonding process, and the bonding data refers to various parameters and performance indicator data collected during the bonding process, such as bonding strength, resistance of the bonding point, tension of the bonding wire, etc.

[0025] Optionally, the bonding data collection of the smart silver bonding wire may be acquired through a sensor built into the silver bonding wire device.

[0026] As an embodiment of the present invention, setting the power supply power of the smart bonding silver wire according to the bonding process includes: identifying the process type of the bonding process; based on the process type, identifying the bonding object corresponding to the smart bonding silver wire; analyzing the first material properties and the second material properties of the smart bonding silver wire and the bonding object; based on the first material properties and the second material properties, analyzing the energy demand corresponding to the process type; based on the energy demand, identifying the bonding environment conditions of the smart bonding silver wire and the bonding object; and setting the power supply power of the smart bonding silver wire in combination with the energy demand, the material properties and the bonding environment conditions.

[0027] Among them, the energy requirement refers to the total amount of energy required to complete the bonding process, such as ultrasonic energy, thermal energy, etc.; the bonding object refers to the two components that the bonding silver wire needs to connect, such as chip and substrate, chip and lead frame, etc.; the first material property refers to the physical and chemical properties of the bonding silver wire itself, such as melting point, conductivity, hardness, ductility, etc.; the second material property refers to the material properties of the bonding object, including thermal expansion coefficient, thermal conductivity, conductivity, surface state, etc.; the bonding environment conditions refer to the environmental conditions during the bonding process, such as temperature, humidity, cleanliness, pressure, etc.

[0028] Optionally, the analysis of the first material property and the second material property of the smart silver bonding wire and the bonding object can be determined through laboratory experiments, and the identification of the bonding environment conditions of the smart silver bonding wire and the bonding object based on the energy requirement can be achieved using environmental monitoring equipment, such as a thermometer.

[0029] S2. Identify the classification data items of the bonding data, analyze the mutual dependence between the power supply power and the classification data items, and extract key bonding parameters of the bonding data according to the mutual dependence.

[0030] The embodiment of the present invention can clarify the constituent parameter types of the bonding data by identifying the classification data items of the bonding data to obtain key characteristic parameters. The classification data items refer to the specific data types that classify the data collected in the bonding process according to their attributes and functions, such as material property data, environmental condition data, equipment status data, etc.

[0031] Optionally, the classification data item identification of the bond data can be implemented using a support vector machine.

[0032] Furthermore, the embodiment of the present invention can determine the optimal bonding parameters and achieve more precise power control by analyzing the degree of mutual dependence between the power supply power and the classification data items, wherein the degree of mutual dependence refers to the relationship density between the power supply power and the classification data items.

[0033] Optionally, the mutual dependence analysis between the power supply power and the classification data item may be implemented using a mutual information formula.

[0034] The embodiment of the present invention can better monitor and control the bonding process and ensure the quality of the bonding product by extracting the key bonding parameters of the bonding data according to the degree of interdependence. The key bonding parameters refer to variables or attributes in the bonding data that have a significant impact on the bonding results, such as power supply power, material properties, bonding speed, etc.

[0035] Optionally, the extraction of key bonding parameters of the bonding data according to the degree of mutual dependence may be implemented using a machine learning algorithm, such as a decision tree algorithm.

[0036] S3. Based on the key bonding parameters, the bonding quality of the smart bonding silver wire is analyzed, the relationship between the power supply power and the bonding quality is identified, and according to the relationship, a power tracking system of the power supply power is set.

[0037] The embodiment of the present invention can determine the optimal power setting by analyzing the bonding quality of the smart bonding silver wire based on the key bonding parameters to achieve high-quality bonding. The bonding quality refers to the quality of the connection formed between two or more materials or components during the bonding process.

[0038] As an embodiment of the present invention, the bonding quality of the smart bonding silver wire is analyzed based on the key bonding parameters, including: identifying the bonding interface of the smart bonding silver wire based on the key bonding parameters; analyzing the material properties and surface state of the bonding interface; identifying the bonding influencing factors of the smart bonding silver wire according to the material properties and the surface state; extracting the bonding points of the bonding interface based on the smart bonding silver wire; analyzing the stability of the bonding points according to the bonding influencing factors; analyzing the bonding quality of the smart bonding silver wire in combination with the material properties, the surface state and the stability.

[0039] Among them, the bonding interface refers to the contact area between the silver wire and the bonded material (such as a semiconductor chip or a substrate), the material properties refer to the general term for the inherent properties of the silver wire and the related properties of the bonded material, the surface state refers to the cleanliness, roughness, oxide layer condition, etc. of the bonding interface, the bonding influencing factors refer to the variables or conditions that affect the bonding process and the final bonding quality, such as the contact area between the bonding materials, environmental pollutants, the shape of the bonding point, etc., the bonding point refers to the physical connection point formed between the silver wire and the bonded material, and the stability refers to the ability of the bonding point to maintain its integrity and performance under various environments and working conditions.

[0040] Optionally, the surface state analysis of the bonding interface can be achieved using a surface profiler, the bonding point extraction of the bonding interface can be obtained through a microscope, and the stability analysis of the bonding points based on the bonding influencing factors can be achieved using thermal cycle testing, mechanical stress testing and chemical stability testing.

[0041] Furthermore, the embodiments of the present invention can optimize the bonding process and realize intelligent control of power supply by identifying the interaction relationship between the power supply power and the bonding quality, wherein the interaction relationship refers to the mutual influence and causal relationship between the power supply power and the bonding quality.

[0042] Optionally, the relationship analysis between the power supply power and the bonding quality can be determined by a regression analysis method.

[0043] The embodiment of the present invention can accurately control the power supply power, reduce fluctuations in the bonding process, and improve the consistency of the bonding process by setting up the power tracking system of the power supply power according to the action relationship. The power tracking system refers to a system for monitoring and tracking the power supply power in the bonding process.

[0044] As an embodiment of the present invention, the power tracking system of the power supply power is set according to the action relationship, including: identifying the bonding quality corresponding to the power supply power according to the action relationship; setting the quality standard of the bonding quality, and setting the power floating threshold of the power supply power according to the quality standard; configuring the power monitoring device of the power supply power, and based on the power monitoring device, collecting the real-time power parameters of the power supply power; setting the tracking trigger condition of the real-time power parameter according to the power floating threshold; and setting the power tracking system of the power supply power in combination with the power floating threshold, the power monitoring device and the tracking trigger condition.

[0045] Among them, the quality standard refers to the predefined performance indicators that the bonding quality should achieve, such as mechanical strength, electrical performance, thermal stability, etc., the power floating threshold refers to the allowable fluctuation range of the power supply during the bonding process, the power monitoring device refers to the equipment or system used to measure and record the power supply in real time, the real-time power parameter refers to the power supply data collected in real time during the bonding process, and the tracking trigger condition refers to the specific condition under which the system automatically takes action when the real-time parameter of the power supply reaches or exceeds the preset power floating threshold.

[0046] Optionally, the quality standard setting of the bonding quality can be determined according to the quality requirements of the bonding silver wire, and the power monitoring device configuration of the power supply power can be implemented using a power sensor, such as a thermocouple.

[0047] S4. According to the power tracking system, real-time parameters of the power supply are collected, and based on the real-time parameters, parameter variation patterns of the power supply are analyzed, and according to the parameter variation patterns, constraint conditions of the power supply are identified.

[0048] The embodiment of the present invention collects the real-time parameters of the power supply according to the power tracking system, and can make instant adjustments to the power supply during the bonding process to cope with any changes in the process. The real-time parameters refer to the power supply parameters collected in real time during the bonding process.

[0049] Optionally, according to the power tracking system, the real-time parameter collection of the power supply power can be achieved by using a power meter.

[0050] Furthermore, the embodiments of the present invention can continuously learn and optimize the power supply control strategy according to real-time data and historical data by analyzing the parameter change law of the power supply based on the real-time parameters, make more scientific and data-driven decisions, and improve the intelligence level of the bonding process. The parameter change law refers to the pattern and trend of the power supply changing with time or other factors during the bonding process.

[0051] As an embodiment of the present invention, the analysis of the parameter change law of the power supply power based on the real-time parameters includes: extracting the historical data of the power supply power, and extracting the power change data of the historical data; identifying the time series data of the power change data; analyzing the historical change trend of the power supply power based on the time series data; analyzing the change conditions of the power supply power according to the power change data; extracting the characteristic performance of the power supply power under the historical change trend; constructing the trend change model of the power supply power based on the trend change model; analyzing the parameter change law of the power supply power according to the trend change model.

[0052] Among them, the historical data refers to the power data collected during the past bonding process, the power change data refers to the numerical value extracted from the historical data, which represents the change of the power during the bonding process, the time series data refers to the power change data arranged in chronological order, the historical change trend refers to the overall trend of the power change over time, such as increase, decrease or periodic fluctuation, the change condition refers to the specific conditions or factors that affect the change of power, such as material properties, environmental conditions, equipment status, etc., the characteristic expression refers to the specific characteristics of the power, such as power peak, valley, stable range, etc., and the trend change model refers to a mathematical model that describes and predicts the change trend of the power.

[0053] Optionally, the time series data identification of the power change data can be obtained through time series analysis, and the analysis of the change conditions of the power supply power based on the power change data can be implemented using experimental design software, such as DOE software, and the construction of the trend change model of the power supply power based on the change conditions and the characteristic performance can be obtained through a deep learning model.

[0054] The embodiment of the present invention can automatically adjust the power supply power according to the constraint conditions by identifying the power supply power constraints based on the parameter change rules to ensure that the power supply power is maintained within the range that can produce high-quality bonding. The constraint conditions refer to factors that limit or control the change of power supply power, such as material properties, ambient temperature, equipment specifications, etc.

[0055] As an embodiment of the present invention, identifying the constraints of the power supply according to the parameter variation law includes: identifying the influencing factors of the parameter variation law; analyzing the factor types of the influencing factors; calculating the proportion of the effect of the factor types on the power supply; extracting the key factor types of the influencing factors according to the effect proportion; identifying the bonding area corresponding to the power supply, and analyzing the bonding material properties of the bonding area; identifying the output threshold of the power supply according to the bonding material properties; extracting the bonding operation equipment of the bonding area, and extracting the maximum power output range of the bonding process operation equipment; identifying the constraints of the power supply in combination with the key factor type, the output threshold and the maximum power output range.

[0056] Among them, the influencing factors refer to various reasons that cause changes in power supply, the factor type refers to the classification of influencing factors, such as physical, environmental or equipment factors, the role ratio refers to the contribution ratio of each factor to the change in power supply, the key factor type refers to the factor type that has a significant impact on power supply, the bonding area refers to the area where the silver wire contacts the substrate and forms a bond, the bonding material property refers to the material properties that affect the bonding process and power supply requirements, the output threshold refers to the minimum and maximum values ​​of power supply, the bonding operation equipment refers to equipment that performs bonding operations, such as a bonding machine, and the maximum power output range refers to the maximum power supply range that the bonding operation equipment can provide.

[0057] Optionally, the bonding material property analysis of the bonding area may be implemented using a material data sheet, and the identification of the bonding area corresponding to the power source power may be determined by a thermal imager, such as a thermal imaging camera.

[0058] In an optional embodiment of the present invention, the following formula is used to calculate the proportion of the effect of the factor type on the power supply power: ; in, Indicates the proportion of the effect of factor type on power supply power, Indicates the total number of evaluations corresponding to the factor type, The frequency index indicating the number of evaluations, represents the effect score of the i-th factor type on power supply power, Indicates The weight coefficient of each factor type, represents the total number of factor types, The index number indicating the factor type, Indicates The adjustment coefficient of each factor type on the power supply power.

[0059] S5. Based on the constraint conditions, set a power allocation mode of the power supply power, set an abnormal warning threshold of the power supply power according to the power allocation mode, and set an adaptive adjustment mechanism of the power supply power based on the abnormal warning threshold and the power allocation mode.

[0060] The embodiment of the present invention sets the power distribution mode of the power supply based on the constraint conditions, thereby ensuring that the bonding area obtains sufficient energy, avoiding thermal damage to the material during the bonding process, and improving production efficiency. The power distribution mode refers to a strategy for reasonably distributing the power supply to different stages or different areas in the bonding process according to the specific requirements of the bonding task and the capabilities of the bonding equipment during the silver wire bonding process.

[0061] As an embodiment of the present invention, the power distribution mode of the power supply power is set based on the constraint conditions, including: identifying the power transmission path of the power supply power; determining the bonding material and bonding area corresponding to the power supply power according to the power transmission path; identifying the bonding stage of the bonding material, and analyzing the stage power requirement of the bonding material based on the bonding stage; extracting the material bonding points of the bonding area and identifying the bonding point positions of the material bonding points; identifying the material properties of the bonding material, and analyzing the regional power requirement of the bonding material according to the material properties and the bonding point positions; analyzing the bonding effect of the bonding material based on the constraint conditions; and setting the power distribution mode of the power supply power according to the bonding effect, the stage power requirement and the regional power requirement.

[0062] Among them, the power transmission path refers to the path through which power is transmitted from the power supply system to the bonding tool or heating element through wires, switches, control units, etc.; the bonding stage refers to the different stages in the bonding process, such as the preheating stage, the melting stage, the cooling stage, etc.; the stage power requirement refers to the power level required for the specific stage of the bonding silver wire; the material bonding point refers to the point where the silver wire contacts the substrate and begins to bond; the bonding point position refers to the specific position of the bonding material in the bonding area; the regional power requirement refers to the power required for the bonding points at different positions in the bonding area; and the bonding effect refers to the quality and performance after bonding, such as mechanical strength, electrical properties and thermal stability.

[0063] Optionally, the power transmission path identification of the power supply can be determined by the technical specifications of the bonding equipment, the bonding point position identification of the material bonding point can be achieved using a microscope, and the regional power demand analysis of the bonding material based on the material properties and the bonding point positions can be achieved using simulation experiments. Based on the constraints, the bonding effect analysis of the bonding material can be obtained through physical and electrical tests after bonding.

[0064] Furthermore, the embodiment of the present invention can prevent the power supply power from exceeding the safe operating range of the equipment and ensure that the power supply power is maintained within the range that can produce high-quality bonding by setting the abnormal warning threshold of the power supply power according to the power allocation mode. The abnormal warning threshold refers to the upper or lower limit of the power supply power that is pre-set in order to ensure the safety of the bonding process and product quality.

[0065] As an embodiment of the present invention, setting the abnormal warning threshold of the power supply according to the power allocation mode includes: identifying the bonding stage and bonding object corresponding to the power supply according to the power allocation mode; analyzing the stage power requirement of the bonding stage, and analyzing the material properties of the bonding object; setting the segmented power standard of the power supply based on the stage power requirement and the material properties; defining the stage abnormal condition of the power supply according to the segmented power standard; and setting the abnormal warning threshold of the power supply based on the segmented power standard and the stage abnormal condition.

[0066] Among them, the bonding stage refers to the different stages in the bonding process, such as the preheating stage, the bonding object refers to the element or material that needs to be bonded, such as silver wire and substrate, the material properties refer to the material properties of the bonding object, including physical and thermodynamic properties, etc., the segmented power standard refers to the recommended power level of different stages set according to the bonding stage and material properties, and the stage abnormal condition refers to the condition where the power of the power supply deviates from the normal level.

[0067] Optionally, the segmented power standard setting of the power supply power based on the stage power demand and the material properties can be implemented by statistical analysis, and the stage abnormal condition definition of the power supply power according to the segmented power standard can be determined by a fault analysis model.

[0068] The embodiment of the present invention sets an adaptive adjustment mechanism of the power supply based on the abnormal warning threshold and the power allocation mode, and can flexibly adjust the power supply according to different production conditions and material properties to achieve intelligent regulation of the power supply. The adaptive adjustment mechanism refers to a system or method that can automatically adjust the power output of the power supply according to real-time feedback and preset conditions.

[0069] As an embodiment of the present invention, the adaptive adjustment mechanism of the power supply power is set based on the abnormal warning threshold and the power allocation mode, including: setting the abnormal feedback mechanism of the power supply power based on the abnormal warning threshold; locating the abnormal area of ​​the power supply power according to the abnormal feedback mechanism; analyzing the required power in the abnormal area based on the power allocation mode; identifying the rationality of operation of the required power in the abnormal area; setting the mode switching condition of the power allocation mode according to the rationality of operation; and setting the adaptive adjustment mechanism of the power supply power based on the mode switching condition and the required power.

[0070] Among them, the abnormal feedback mechanism refers to a mechanism for responding to and handling abnormal power supply conditions, the abnormal area refers to a bonding area where the power supply does not conform to the normal mode or expected behavior, the required power refers to the target power required to maintain the normal operation of the bonding process, the reasonable operation level refers to the degree to which the power supply can meet the expected standards or requirements after adjustment, and the mode switching condition refers to the specific condition that triggers switching from one working mode to another.

[0071] Optionally, the abnormal feedback mechanism setting of the power supply based on the abnormal warning threshold can be implemented by using a defect tracking tool.

[0072] In an optional embodiment of the present invention, the following formula is used to identify the reasonableness of the operation of the required power in the abnormal area: ; Among them, M represents the reasonableness of the operation of the required power in the abnormal area, Indicates the adjustment coefficient of the required power in the abnormal area, It represents the difference between the required power and the actual power in the abnormal area at a specific time t. It represents the correction value of the required power in the abnormal area at a specific time t. It represents the error tolerance of the demand power in the abnormal area at a specific time t.

[0073] S6. Combining the power tracking system, the adaptive adjustment mechanism and the power allocation mode, the power supply power is intelligently regulated to obtain an intelligent regulation result.

[0074] The embodiment of the present invention combines the power tracking system, the adaptive adjustment mechanism and the power allocation mode to intelligently control the power of the power supply to obtain an intelligent control result, which helps to maintain the stability of the bonding process, reduce fluctuations and defects, and thus improve the bonding quality. At the same time, through precise power allocation, unnecessary energy waste can be avoided and energy-saving production can be achieved. In addition, the intelligent control system can quickly adapt to different production needs and enhance the flexibility and adaptability of the silver wire bonding process. The intelligent control result refers to the result achieved after real-time monitoring and automatic adjustment of the power supply power in the silver wire bonding process using the power tracking system, the adaptive adjustment mechanism and the power allocation mode.

[0075] It can be seen that the embodiment of the present invention can determine the key parameters affecting the power demand in the bonding process and the relationship between the power and the bonding data by querying the bonding process of the smart bonding silver wire, setting the power of the smart bonding silver wire according to the bonding process, and collecting the bonding data of the smart bonding silver wire, so as to realize the intelligent control of the bonding silver wire equipment; further, the embodiment of the present invention can better monitor and control the bonding process and ensure the quality of the bonding product by analyzing the mutual dependence degree between the power and the classification data items and extracting the key bonding parameters of the bonding data according to the mutual dependence degree; secondly, the embodiment of the present invention can determine the optimal power setting and optimize the bonding process by identifying the functional relationship between the power and the bonding quality and setting the power tracking system of the power according to the functional relationship, and reduce the fluctuation in the bonding process and improve the consistency of the bonding process by accurately controlling the power; thirdly, the embodiment of the present invention can continuously learn and optimize the power by analyzing the parameter change law of the power and identifying the constraint conditions of the power according to the parameter change law. The power source power regulation strategy is adopted to make more scientific and data-driven decisions, improve the intelligence level of the bonding process, and automatically adjust the power source power according to the constraint conditions to ensure that the power source power is maintained within the range that can produce high-quality bonding; in addition, the embodiment of the present invention sets the power distribution mode of the power source power based on the constraint conditions to ensure that the bonding area obtains sufficient energy, avoids thermal damage to the material during the bonding process, and improves production efficiency. Based on the abnormal warning threshold and the power distribution mode, an adaptive adjustment mechanism of the power source power is set, which can flexibly adjust the power source power according to different production conditions and material properties to achieve intelligent regulation of the power source power; finally, the embodiment of the present invention combines the power tracking system, the adaptive adjustment mechanism and the power distribution mode to intelligently regulate the power source power, obtain an intelligent regulation result, which helps to maintain the stability of the bonding process, reduce fluctuations and defects, and thus improve the bonding quality. At the same time, through precise power distribution, unnecessary energy waste can be avoided, energy-saving production can be achieved, and the intelligent regulation system can quickly adapt to different production needs, thereby enhancing the flexibility and adaptability of the bonding process. Therefore, the intelligent silver wire bonding method with intelligent power control proposed in the present invention can realize intelligent power control of the silver wire bonding power and improve the bonding quality.

[0076] like Figure 2 As shown, it is a system functional module diagram of the intelligent silver bonding wire with intelligent power control of the present invention.

[0077] The intelligent silver bonding wire system 200 for intelligent power control of the power supply of the present invention can be installed in an electronic device. According to the functions to be implemented, the intelligent silver bonding wire system for intelligent power control of the power supply can include a data acquisition module 201, a key parameter extraction module 202, a power tracking module 203, a regularity analysis module 204, a power distribution module 205, and an intelligent control module 206. The module of the present invention can also be referred to as a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0078] In the embodiment of the present invention, the functions of each module / unit are as follows: The data acquisition module 201 is used to obtain the smart bonding silver wire to be regulated, query the bonding process of the smart bonding silver wire, set the power of the smart bonding silver wire according to the bonding process, and collect bonding data of the smart bonding silver wire; A key parameter extraction module 202, for identifying the classification data items of the bonding data, analyzing the mutual dependence between the power supply power and the classification data items, and extracting the key bonding parameters of the bonding data according to the mutual dependence; A power tracking module 203, used to analyze the bonding quality of the smart silver bonding wire based on the key bonding parameters, identify the functional relationship between the power supply and the bonding quality, and set a power tracking system of the power supply according to the functional relationship; A rule analysis module 204 is used to collect the real-time parameters of the power supply according to the power tracking system, analyze the parameter change rule of the power supply based on the real-time parameters, and identify the constraint conditions of the power supply according to the parameter change rule; A power allocation module 205, configured to set a power allocation mode of the power supply based on the constraint conditions, set an abnormal warning threshold of the power supply according to the power allocation mode, and set an adaptive adjustment mechanism of the power supply based on the abnormal warning threshold and the power allocation mode; The intelligent control module 206 is used to combine the power tracking system, the adaptive adjustment mechanism and the power allocation mode to intelligently control the power of the power supply and obtain an intelligent control result.

[0079] In detail, each module in the intelligent silver bonding wire system 200 with intelligent power control in the embodiment of the present invention is used in the same manner as described above. Figure 1 The intelligent silver wire bonding method for intelligent power control of the power supply described in the invention has the same technical means and can produce the same technical effects, so it will not be repeated here.

[0080] In addition, each functional module in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0081] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0082] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0083] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0084] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. A smart silver wire bonding method with intelligent power control, characterized in that: The method comprises: Acquire a smart silver bonding wire to be regulated, query the bonding process of the smart silver bonding wire, set the power of the smart silver bonding wire according to the bonding process, and collect bonding data of the smart silver bonding wire; Identifying classification data items of the bonding data, analyzing the mutual dependence between the power supply power and the classification data items, and extracting key bonding parameters of the bonding data according to the mutual dependence; Based on the key bonding parameters, the bonding quality of the smart silver bonding wire is analyzed, the functional relationship between the power supply and the bonding quality is identified, and according to the functional relationship, a power tracking system of the power supply is set; According to the power tracking system, real-time parameters of the power supply are collected, based on the real-time parameters, parameter variation rules of the power supply are analyzed, and according to the parameter variation rules, constraint conditions of the power supply are identified; Based on the constraint condition, a power allocation mode of the power supply is set, according to the power allocation mode, an abnormal warning threshold of the power supply is set, and based on the abnormal warning threshold and the power allocation mode, an adaptive adjustment mechanism of the power supply is set; In combination with the power tracking system, the adaptive adjustment mechanism and the power allocation mode, the power supply power is intelligently regulated to obtain an intelligent regulation result.

2. The method according to claim 1, characterized in that The step of setting the power supply of the smart silver bonding wire according to the bonding process includes: identifying a process type of the bonding process; Based on the process type, identifying a bonding object corresponding to the smart bonding silver wire; analyzing a first material property and a second material property of the smart silver bonding wire and the bonding object; Analyzing energy requirements corresponding to the process type according to the first material characteristics and the second material characteristics; Based on the energy requirement, identifying a bonding environment condition between the smart bonding silver wire and the bonding object; The power supply power of the smart bonding silver wire is set in combination with the energy demand, the material properties and the bonding environment conditions.

3. The method according to claim 1, characterized in that The step of analyzing the bonding quality of the smart silver bonding wire based on the key bonding parameters includes: Based on the key bonding parameters, identifying the bonding interface of the smart silver bonding wire; analyzing material properties and surface conditions of the bonding interface; Identifying bonding influencing factors of the smart silver bonding wire according to the material properties and the surface state; Based on the smart silver bonding wire, extracting bonding points of the bonding interface; Analyzing the stability of the bonding point according to the bonding influencing factors; The bonding quality of the smart bonding silver wire is analyzed in combination with the material properties, the surface state and the stability.

4. The method according to claim 1, characterized in that The power tracking system of the power supply power is set according to the action relationship, including: According to the action relationship, identifying the bonding quality corresponding to the power supply power; Setting a quality standard for the bonding quality, and setting a power floating threshold of the power supply power according to the quality standard; Configuring a power monitoring device for the power supply, and collecting real-time power parameters of the power supply based on the power monitoring device; According to the power floating threshold, setting a tracking trigger condition of the real-time power parameter; In combination with the power floating threshold, the power monitoring device and the tracking trigger condition, a power tracking system of the power supply power is set.

5. The method according to claim 1, characterized in that: The analyzing the parameter variation rule of the power supply power based on the real-time parameter includes: Extracting historical data of the power supply power, and extracting power change data of the historical data; identifying time series data of the power variation data; Analyzing the historical change trend of the power supply based on the time series data; Analyzing the power change condition of the power supply according to the power change data; Extracting characteristic performance of the power supply under the historical change trend; Based on the change condition and the characteristic performance, construct a trend change model of the power supply power; According to the trend change model, the parameter change law of the power supply power is analyzed.

6. The method according to claim 1, characterized in that The identifying the power constraint condition of the power supply according to the parameter variation rule includes: Identify the factors affecting the variation of the parameters; Analyze the factor types of the influencing factors; The proportion of the effect of the factor type on the power supply power is calculated using the following formula: ； in, Indicates the proportion of the effect of factor type on power supply power, Indicates the total number of evaluations corresponding to the factor type, The frequency index indicating the number of evaluations, represents the effect score of the i-th factor type on power supply power, Indicates The weight coefficient of each factor type, represents the total number of factor types, The index number indicating the factor type, Indicates The adjustment coefficient of each factor type on the power supply power; According to the role proportion, extract the key factor type of the influencing factor; Identify the bonding area corresponding to the power supply, and analyze the bonding material properties of the bonding area; identifying an output threshold of the power supply according to the property of the bonding material; Extracting bonding operation devices in the bonding area, and extracting a maximum power output range of the bonding operation devices; The power constraint of the power supply is identified based on the key factor type, the output threshold, and the maximum power output range.

7. The method according to claim 1, characterized in that The step of setting the power distribution mode of the power supply based on the constraint condition includes: identifying a power transmission path of the power supply; Determining the bonding material and bonding area corresponding to the power supply power according to the power transmission path; identifying a bonding stage of the bonding material, and analyzing a stage power requirement of the bonding material based on the bonding stage; Extracting material bonding points of the bonding area and identifying bonding point positions of the material bonding points; identifying material properties of the bonding material, and analyzing regional power requirements of the bonding material based on the material properties and the bonding point locations; Based on the constraint conditions, analyzing the bonding effect of the bonding material; A power distribution mode of the power supply is set according to the bonding effect, the stage power requirement and the regional power requirement.

8. The method according to claim 1, characterized in that The step of setting the abnormal warning threshold of the power supply power according to the power allocation mode includes: According to the power allocation mode, identifying the bonding stage and bonding object corresponding to the power of the power supply; analyzing the stage power requirements of the bonding stage and analyzing the material properties of the bonding objects; Based on the stage power requirement and the material properties, setting the segmented power standard of the power supply power; According to the segmented power standard, defining the stage abnormal conditions of the power supply power; Based on the segmented power standard and the stage abnormal condition, an abnormal warning threshold of the power supply power is set.

9. The method according to claim 1, characterized in that: The step of setting the adaptive adjustment mechanism of the power supply power based on the abnormal warning threshold and the power allocation mode includes: Based on the abnormal warning threshold, setting an abnormal feedback mechanism of the power supply power; According to the abnormal feedback mechanism, locating the abnormal area of ​​the power supply; Based on the power allocation mode, analyzing the power demand of the abnormal area; The following formula is used to identify the reasonableness of the operation of the required power in the abnormal area: ； Among them, M represents the reasonableness of the operation of the required power in the abnormal area, Indicates the adjustment coefficient of the required power in the abnormal area, It represents the difference between the required power and the actual power in the abnormal area at a specific time t. It represents the correction value of the required power in the abnormal area at a specific time t. It represents the error tolerance of the demand power in the abnormal area at a specific time t; According to the rationality of the operation, setting a mode switching condition of the power allocation mode; Based on the mode switching condition and the required power, an adaptive adjustment mechanism of the power supply power is set.

10. Intelligent silver wire bonding system with intelligent power control, characterized in that: The system comprises: A data acquisition module, used to obtain the smart bonding silver wire to be regulated, query the bonding process of the smart bonding silver wire, set the power supply of the smart bonding silver wire according to the bonding process, and collect bonding data of the smart bonding silver wire; A key parameter extraction module, used to identify the classification data items of the bonding data, analyze the mutual dependence degree between the power supply power and the classification data items, and extract the key bonding parameters of the bonding data according to the mutual dependence degree; A power tracking module, used for analyzing the bonding quality of the smart silver bonding wire based on the key bonding parameters, identifying the functional relationship between the power supply and the bonding quality, and setting a power tracking system of the power supply according to the functional relationship; A rule analysis module, used for collecting the real-time parameters of the power supply according to the power tracking system, analyzing the parameter change rule of the power supply based on the real-time parameters, and identifying the constraint conditions of the power supply according to the parameter change rule; A power allocation module, configured to set a power allocation mode of the power supply based on the constraint conditions, set an abnormal warning threshold of the power supply according to the power allocation mode, and set an adaptive adjustment mechanism of the power supply based on the abnormal warning threshold and the power allocation mode; The intelligent control module is used to combine the power tracking system, the adaptive adjustment mechanism and the power allocation mode to intelligently control the power of the power supply and obtain an intelligent control result.

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