Electronic case component function damage detection method, system, equipment and medium

Abstract

The invention discloses a method, a system and equipment for detecting functional damage of an electronic case component and a medium, and relates to the field of spacecraft space safety, and the method comprises the steps: carrying out the impact damage simulation of a printed circuit board in an electronic case, establishing a vulnerability model used for describing a mapping relation between component damage at different positions and a local damage index of the printed circuit board; establishing a damage effect model used for describing a mapping relation between the impact parameters of different space debris and physical damage effect data of the printed circuit board; based on the damage effect model and the vulnerability model, establishing a function damage model used for describing a mapping relationship between the impact parameters of different space debris and the overall function damage index of the printed circuit board; and according to the impact parameters of the target electronic case, determining an overall function damage index of the printed circuit board in the target electronic case by adopting a function damage model so as to perform damage analysis on the target electronic case. According to the invention, the damage detection precision of the electronic case is improved.

Description

Technical Field

[0001] The present application relates to the field of spacecraft space safety, and in particular to a method, system, equipment and medium for detecting functional damage of electronic chassis components under the impact of space debris. Background Art

[0002] With the increase in human space exploration activities, the number of spacecraft for various purposes has exploded, and space debris is increasing. The risk of normally operating spacecraft being hit by space debris and micrometeoroids has greatly increased, which has put forward higher and more accurate assessment requirements for the field of spacecraft vulnerability analysis and assessment technology.

[0003] At present, the research in the field of vulnerability analysis and assessment of spacecraft impact with space debris mostly takes the spacecraft as a whole as the research target and conducts system-level vulnerability assessment. For the important link "analysis of functional damage effects of components", the relevant assessment methods only mention the need to use damage data of key components, such as the degree of functional damage or failure probability of components, but do not explore the calculation method in depth, or ignore the damage uncertainty and use structural damage of components instead of functional damage to roughly judge the degree of functional damage of components. This situation will lead to large errors in subsequent evaluations.

[0004] In the actual application of spacecraft vulnerability assessment, the functional damage results of its key components are the basic damage data source for spacecraft vulnerability analysis. However, there is a lack of relevant research on functional damage analysis of components, because it requires a large number of damage tests to solve the difficult problem of mapping the structural damage and functional damage of key components of spacecraft. The workload is large and the cost-effectiveness is low. This situation leads to a lack of reliable basic damage data for spacecraft vulnerability analysis and assessment. Summary of the invention

[0005] The purpose of the present application is to provide a method, system, device and medium for detecting functional damage of electronic chassis components, which can improve the accuracy of electronic chassis damage detection.

[0006] To achieve the above objectives, this application provides the following solutions:

[0007] In a first aspect, the present application provides a method for detecting functional damage of an electronic chassis component, comprising:

[0008] Performing impact damage simulation on a printed circuit board in an electronic chassis, and establishing a vulnerability model of the printed circuit board according to the simulation results; the vulnerability model is used to describe the mapping relationship between component damage at different positions and the local damage index of the printed circuit board;

[0009] Establishing a damage effect model of space debris impacting an electronic chassis; the damage effect model is used to describe the mapping relationship between the impact parameters of different space debris and the physical damage effect data of the printed circuit board in the electronic chassis;

[0010] Based on the damage effect model and the vulnerability model, a functional damage model is established; the functional damage model is used to describe the mapping relationship between the impact parameters of different space debris and the overall functional damage index of the printed circuit board in the electronic chassis;

[0011] According to the impact parameters of the target electronic chassis, the functional damage model is used to determine the overall functional damage index of the printed circuit board in the target electronic chassis, so as to perform damage analysis on the target electronic chassis.

[0012] In a second aspect, the present application provides a system for detecting functional damage of an electronic chassis component, comprising:

[0013] A vulnerability model building module is used to simulate the impact damage of the printed circuit board in the electronic chassis and establish a vulnerability model of the printed circuit board according to the simulation results; the vulnerability model is used to describe the mapping relationship between the damage of components at different positions and the local damage index of the printed circuit board;

[0014] A damage effect model building module is used to establish a damage effect model of space debris impacting an electronic chassis; the damage effect model is used to describe the mapping relationship between the impact parameters of different space debris and the physical damage effect data of the printed circuit board in the electronic chassis;

[0015] A functional damage model building module, used to establish a functional damage model based on the damage effect model and the vulnerability model; the functional damage model is used to describe the mapping relationship between the impact parameters of different space debris and the overall functional damage index of the printed circuit board in the electronic chassis;

[0016] The damage analysis module is used to determine the overall functional damage index of the printed circuit board in the target electronic chassis according to the impact parameters of the target electronic chassis and adopt the functional damage model to perform damage analysis on the target electronic chassis.

[0017] In a third aspect, the present application provides a computer device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the above-mentioned method for detecting functional damage of electronic chassis components.

[0018] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the above-mentioned method for detecting functional damage to components of an electronic chassis.

[0019] According to the specific embodiments provided in this application, this application discloses the following technical effects:

[0020] The present application provides a method, system, device and medium for detecting functional damage of electronic chassis components. By simulating impact damage to a printed circuit board in an electronic chassis, a vulnerability model is established to describe the mapping relationship between damage to components at different positions and the local damage index of the printed circuit board, as well as a damage effect model to describe the mapping relationship between different space debris impact parameters and the physical damage effect data of the printed circuit board. Further, based on the above-mentioned damage effect model and vulnerability model, a functional damage model is established to describe the mapping relationship between different space debris impact parameters and the overall functional damage index of the printed circuit board. In terms of functional damage analysis of electronic chassis components caused by space debris impact, the mapping and conversion of structural damage to key components of electronic equipment to functional damage is achieved, and the quantitative results of the degree of functional damage of the components are obtained. Based on the functional damage model, various space debris impact conditions can be fully simulated to obtain the functional damage index of key components required for vulnerability analysis, thereby improving the accuracy of electronic chassis damage detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is an application environment diagram of a method for detecting functional damage of an electronic chassis component in an embodiment of the present application;

[0023] Figure 2 A schematic diagram of a flow chart of a method for detecting functional damage of an electronic chassis component provided in one embodiment of the present application;

[0024] Figure 3 A schematic diagram of a process for constructing a functional damage model of an electronic chassis component provided in an embodiment of the present application;

[0025] Figure 4 It is a structural schematic diagram of the electronic chassis;

[0026] Figure 5 A schematic diagram of the appearance of a printed circuit board;

[0027] Figure 6 A simplified circuit diagram of a printed circuit board;

[0028] Figure 7 The diagram is a schematic diagram of the vulnerability distribution of the printed circuit board;

[0029] Figure 8 This is a schematic diagram of the overall functional damage index after space debris hits the electronic chassis;

[0030] Fig. 9 A schematic diagram of functional modules of a system for detecting functional damage of an electronic chassis component provided by an embodiment of the present application;

[0031] Fig.10 Schematic diagram of the modeling process for building modules for the vulnerability model;

[0032] Fig.11 Schematic diagram of the refined functional modules for building modules for the vulnerability model. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] In the field of spacecraft vulnerability analysis and assessment technology, the invention patent publication number CN117932790A, named "A method and system for calculating the probability of failure of spacecraft in a space debris environment", takes into account the uncertainty of the future debris environment, takes the spacecraft as the subject of attention, reversely deduces the limit density of the space debris environment that it can withstand, and uses the failure probability as a representation to illustrate the degree of danger of the corresponding space debris environment. The invention patent publication number CN112182757A, named "A method for assessing the vulnerability of spacecraft in a space debris and micrometeoroid environment", determines the failure probability of each component of the spacecraft in a space debris and micrometeoroid environment, and calculates the system-level failure probability and survival probability of the manned spacecraft. The invention patent publication number is CN114021248A, and its name is “A method for determining the impact risk of space debris for aerospace vehicles”. It mainly analyzes the annual cumulative flux density (annual cumulative flux per unit area) of space debris of different sizes encountered by aerospace vehicles during their on-orbit missions through a space debris environment engineering model combined with the vehicle orbit profile, and calculates the cumulative flux density during the mission based on the vehicle mission cycle. It analyzes the number of impacts on different parts of the vehicle in combination with the vehicle geometric model and surface unit division, and calculates the impact probability of space debris of different sizes based on the statistical distribution of the number of impacts. It formulates the failure criteria for the outer surface materials in combination with the space debris impact data of the outer surface materials of the vehicle, and then analyzes the failure probability of the outer surface thermal protection materials, and compares it with the overall design indicators to judge the impact risk of space debris and analyze the acceptability of the risk.

[0035] However, the above studies mainly focus on the spacecraft as a whole, which leads to large evaluation errors. For example, the integrated electronic chassis, one of the key components of the spacecraft, has the main function of placing and protecting the printed circuit boards (PCBA) of the navigation, attitude control and other subsystems, so that they can work normally and avoid the harsh environment of space. When space debris collides with the integrated electronic chassis and forms an impact penetration, the PCBA inside the integrated electronic chassis may be damaged and cause its function to malfunction. However, ground damage tests show that due to the differences in impact parameters such as the initial velocity, incident angle, and attitude angle of the space debris collision, the functional damage results of the PCBA in the integrated electronic chassis have great uncertainty, including but not limited to whether the space debris can penetrate the electronic chassis and whether it can cause damage to its circuit board after penetration.

[0036] Therefore, this application combines experimental model verification, high-speed space debris simulation test and data mining technology to establish a component-level functional damage model for a typical electronic chassis of a spacecraft and its internal PCBA, which can be used for functional damage analysis of key components of the same type of spacecraft under the impact of space debris, obtain its functional damage data and failure probability, solve the problem of functional damage analysis of key components of this type of spacecraft, and provide effective basic data for spacecraft vulnerability analysis and assessment.

[0037] The electronic chassis components include the metal shell of the electronic chassis and the internal PCBA. Among them, the degree of functional degradation of the PCBA is characterized by a dimensionless functional damage index, referred to as the local damage index. The degree of functional degradation of the electronic chassis components is defined as the overall functional damage index, which represents the degree of overall functional degradation of the electronic chassis caused by the impact of the debris cloud on the PCBA after the space debris penetrates the electronic chassis. The vulnerability model of PCBA refers to the relationship model between the damage of local components of the PCBA and its comprehensive functional degradation, that is, the mapping relationship model between the damage of components at different positions and the local damage index of the PCBA. The graphical expression of this model gives the vulnerable parts of the PCBA, which is called the vulnerability distribution.

[0038] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0039] The electronic chassis component functional damage detection method provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown, the terminal 102 communicates with the server 104 through a network. The data storage system can store data that the server 104 needs to process. The data storage system can be set up separately, integrated on the server 104, or placed on the cloud or other servers.

[0040] The terminal 102 may be, but is not limited to, various desktop computers, laptop computers, smart phones, tablet computers, IoT devices, and portable wearable devices. The IoT devices may be smart speakers, smart TVs, smart air conditioners, smart vehicle-mounted devices, etc. The portable wearable devices may be smart watches, smart bracelets, head-mounted devices, etc. The server 104 may be implemented as an independent server or a server cluster consisting of multiple servers, or may be a cloud server.

[0041] In an exemplary embodiment, Figure 2 and Figure 3 As shown, a method for detecting functional damage of an electronic chassis component is provided. The method is executed by a computer device, and can be executed by a computer device such as a terminal or a server alone, or can be executed by a terminal and a server together. In the embodiment of the present application, the method is applied to Figure 1 The server 104 in the example is used as an example to illustrate the method, which includes the following steps 201 to 204. Among them:

[0042] Step 201, perform impact damage simulation on the printed circuit board in the electronic chassis, and establish a vulnerability model of the printed circuit board according to the simulation results. The vulnerability model is used to describe the mapping relationship between component damage at different positions and the local damage index of the printed circuit board.

[0043] Specifically, based on the layout information of the printed circuit board, LTspice software is used to carry out circuit function simulation, and component damage is injected into the printed circuit board to determine the degree of loss of printed circuit board function caused by component damage at different positions of the printed circuit board. In this way, the mapping relationship between component damage at different positions and the local damage index of the printed circuit board is determined, and a fragile model of the printed circuit board is established.

[0044] In a specific example, based on the layout, function and electrical connection relationship of PCBA components, LTspice software was used to carry out circuit function simulation and PCBA component damage injection analysis to obtain the degree of PCBA function loss caused by component damage at different positions of PCBA, i.e., local damage index, and establish a component damage-PCBA local damage index mapping relationship model, which is called PCBA vulnerability model. The vulnerable model can realize the calculation of local damage index of PCBA under the action of debris cloud.

[0045] The overall functional loss degree caused by impact damage at a certain position p of the PCBA is defined as the local damage index of the spatial position, that is, the vulnerability model is:

[0046]

[0047] Wherein, I(p) is the local damage index caused by the impact damage at position p of the printed circuit board, m is the total number of functions of the printed circuit board, and F(i) is the function judgment function. If the i-th function is normal, F(i)=0, and if the i-th function fails, F(i)=1.

[0048] The PCBA is divided into several 1mm×1mm uniform units. After a unit at a specific position is damaged by impact, the LTspice circuit simulation software is used to calculate the degree of PCBA function degradation caused by damage to each position point of the PCBA, which is the local damage index.

[0049] Step 202: Establish a damage effect model of space debris impacting an electronic chassis. The damage effect model is used to describe the mapping relationship between the impact parameters of different space debris and the physical damage effect data of the printed circuit board in the electronic chassis. The impact parameters include collision speed and incident angle.

[0050] In a specific example, a damage effect model of space debris impacting an electronic chassis was established by combining damage tests and simulation experiments. The model gives the relationship between the impact parameters of the space debris and the momentum distribution of the debris cloud formed after penetrating the outer shell of the electronic chassis. By extracting the impact parameters of the space debris and importing them into the model, the momentum distribution data of the debris cloud can be obtained, that is, the physical damage effect data of the printed circuit board in the electronic chassis.

[0051] Step 203: Establish a functional damage model based on the damage effect model and the vulnerability model. The functional damage model is used to describe the mapping relationship between the impact parameters of different space debris and the overall functional damage index of the printed circuit board in the electronic chassis.

[0052] Specifically, based on the damage effect model, the physical damage effect data of the printed circuit board in the electronic chassis under different impact parameters of space debris are extracted. The physical damage effect data of the printed circuit board in the electronic chassis under different impact parameters of space debris are used as the damage injection parameters of the printed circuit board, and combined with the vulnerability model, the overall functional damage index of the printed circuit board in the electronic chassis is determined to establish a functional damage model.

[0053] In a specific example, based on data mining technology, by statistically analyzing the overall functional damage index of printed circuit boards in electronic chassis under different groups of space debris impact parameters, a mapping relationship between space debris impact parameters and the overall functional damage index of printed circuit boards in electronic chassis is established, and a functional damage model of such components under the impact of space debris is constructed.

[0054] When space debris collides with the electronic chassis, the impact attitude angle is a random value, which causes random damage effects when the space debris with a specific collision speed and incident angle collides with the PCBA, resulting in different functional damages. The damage effects caused by different attitude angles fluctuate within a limited range. In order to facilitate the analysis of PCBA functional damage, this application statistically averages the damage effects of space debris and the corresponding functional damage index to highlight the impact of the collision speed v and the incident angle. The influence of the damage effect and its corresponding functional impact parameters is considered, while the influence of random attitude angle is ignored.

[0055] To characterize the impact of space debris under a certain set of impact parameters (collision velocity v, incident angle ) under the condition of space debris, the damage effect of PCBA in electronic chassis is defined as follows: the overall functional damage index of printed circuit boards in electronic chassis is: when the electronic chassis is hit by specific impact parameters (collision speed v, incident angle The expected degree of overall functional loss after being hit by space debris of ) is expressed as:

[0056]

[0057] Where v is the collision velocity, is the incident angle, It means that when the electronic chassis is hit by a speed of v and an incident angle of The overall functional damage index of the printed circuit board after being hit by space debris, E is the expectation operator, m is the total number of functions of the printed circuit board, F(i) is the function judgment function, if the i-th function is normal, then F(i) = 0, if the i-th function fails, then F(i) = 1.

[0058] In order to obtain the functional damage of the debris cloud generated by space debris with different impact parameters to the overall PCBA, this application is based on the damage effect model of space debris hitting the electronic chassis, determines the damage effect of the space debris cloud on the PCBA under the impact parameters, and calculates the damage index of the overall function of the PCBA under a single collision of space debris in combination with the PCBA vulnerability distribution. The specific method is as follows:

[0059] (1) Given the space debris impact parameters to be evaluated, determine the initial velocity space V = {v|v∈(1,2)}, the incident angle space And the attitude angle space Λ={(λ,ω,θ)|λ,ω∈(0,90°)θ∈(0,180°)}, where λ is the heading angle, ω is the pitch angle, and θ is the roll angle.

[0060] The collision parameter combination space is constructed by uniformly extracting the projectile collision parameter combination from the initial velocity space V, the incident angle space Φ, and the attitude angle space Λ. It is required that each parameter is evenly distributed in its respective value space.

[0061] (2) Extract the impact parameter combination γ in sequence from the impact parameter combination space Γ c ∈Γ,c∈(1,n); where n is the total number of impact parameter groups, and the extracted impact parameter combination is brought into the damage effect model of space debris hitting electronic chassis PCBA, and the impact parameter combination γ is calculated. c The momentum distribution of the corresponding space debris cloud impacting the PCBA (i.e., damage effect data). Substitute the above distribution into the PCBA vulnerability distribution to calculate the overall functional damage index e of the PCBA at this time. PCBA (γ c ). Repeat the above steps until all n groups of impact parameter combinations are calculated, and construct the damage index space E of the overall function of the electronic chassis based on the calculation results. PCBA ={e PCBA (γ c )|c∈(1,n)}.

[0062] (3) For collision velocity v and incident angle Conduct statistics and construct a functional damage model of space debris to the overall function of PCBA under specific parameters:

[0063]

[0064] in, is the overall functional damage index of PCBA under the impact parameters of group c, v c is the initial velocity of space debris under the cth group of impact parameters, is the incident angle of space debris under the cth group of impact parameters, γ c Damage parameter combination, b fragment ellipse parameter semi-minor axis, This is a fitting model for the overall functional damage index of PCBA after space debris hits the electronic chassis.

[0065] Step 204: According to the impact parameters of the target electronic chassis, the functional damage model is used to determine the overall functional damage index of the printed circuit board in the target electronic chassis to perform damage analysis on the target electronic chassis.

[0066] In another exemplary embodiment, in order to quantify the degree of damage to the electronic chassis caused by space debris, the overall functional damage index of the printed circuit board in the electronic chassis is divided into damage levels. The electronic chassis component functional damage detection method further includes the following step 205.

[0067] Step 205: Determine the damage level of the target electronic chassis according to the overall functional damage index of the printed circuit board in the target electronic chassis, and then perform a functional damage assessment on the target electronic chassis. The damage levels include mild damage, moderate damage, and severe damage.

[0068] When the functional impairment index is less than the first set threshold, the impairment level is mild impairment.

[0069] When the functional impairment index is greater than or equal to the first set threshold and less than or equal to the second set threshold, the impairment level is moderate impairment.

[0070] When the functional impairment index is greater than the second set threshold, the injury level is severe injury.

[0071] The first set threshold is less than the second set threshold. In a specific example, the first set threshold is 0.3 and the second set threshold is 0.6. That is, mild damage is a state where the overall function of the electronic chassis is lost by less than 30%, moderate damage is a state where the overall function of the electronic chassis is lost by between 30% and 60%, and severe damage is a state where the overall function of the electronic chassis is lost by 60%.

[0072] In the present application, the functional damage calculation of the electronic chassis under different impact parameters can be carried out based on the functional damage model of the electronic chassis. By statistically analyzing the functional damage index corresponding to each impact parameter combination and combining it with the damage level standard, the functional damage assessment of the electronic chassis under the impact of space debris can be completed. The failure probability of the components of the electronic chassis can be further obtained based on the functional damage assessment data statistics of all-round strikes.

[0073] This application also provides an application example. Taking the electronic chassis of a spacecraft as an example, this application is used to construct a functional damage model of the PCBA of this type of electronic chassis. The functional damage assessment process is as follows.

[0074] (1) Electronic chassis structure analysis and circuit equivalent simplification.

[0075] like Figure 4 As shown in FIG. 4 , the electronic chassis includes a front panel 401, a rear panel, an electrical connector, and a printed circuit board 402. The PCBA is the core component of the electronic chassis, and the functions of the electronic chassis are completely realized by the PCBA. Figure 5 As shown, the simplified PCBA circuit used in this example is as follows Figure 6 shown.

[0076] (2) PCBA vulnerability distribution.

[0077] Combine the damage effect model and circuit board simulation model (based on PCBA PCB layout information, circuit netlist information model) to carry out PCBA impact damage simulation, and build a simulation model by analyzing the simulation results. Figure 7 The PCBA vulnerability distribution is shown in Figure 7. The more yellowish the color is in Figure 7, the greater the local damage index of the PCBA area, and the more blue the color is, the smaller the local damage index of the PCBA area. The local damage index of the blue area is 0, which means that even if the area is hit by debris and causes impact damage, it will not have any impact on the overall function of the PCBA; the spatial importance of the yellow area is 1, which means that once the part is hit by debris, the overall function of the PCBA is lost; the spatial importance of the remaining areas is between 0 and 1, which means that after this area is hit by debris and causes impact damage, the overall function of the PCBA is partially damaged.

[0078] (3) Construction of a comprehensive functional damage model for electronic chassis.

[0079] According to the above method, the overall functional damage analysis of the electronic chassis impacted by space debris with typical parameters was completed. The results are as follows: Figure 8 As shown, Figure 8 The horizontal axes A1 to A5 represent different collision speeds. According to the simulation results, the overall functional damage model of the electronic chassis is constructed, as shown in Table 1.

[0080] Table 1 Functional impairment model

[0081]

[0082]

[0083] Among them, a1 to a 13 is the constant term of the fitting formula, v1 is the minimum value of the collision velocity, v2 is the maximum value of the collision velocity, is the minimum value of the incident angle, is the maximum value of the incident angle.

[0084] In terms of functional damage analysis of electronic chassis components caused by space debris impact, the present application realizes the mapping and transformation of structural damage to key components of electronic equipment into functional damage, obtains quantitative results of the degree of functional damage to the components, obtains a large amount of test data required for damage model fitting through test model verification and simulation experiments, improves the modeling cost-effectiveness of the functional damage model, and based on the functional damage model, various types of space debris impact conditions can be fully simulated to obtain the failure probability of key components required for vulnerability analysis.

[0085] Based on the same inventive concept, the embodiment of the present application also provides an electronic chassis component functional damage detection system for implementing the electronic chassis component functional damage detection method involved above. The implementation scheme for solving the problem provided by the system is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more electronic chassis component functional damage detection system embodiments provided below can refer to the limitations of the electronic chassis component functional damage detection method above, and will not be repeated here.

[0086] In an exemplary embodiment, Fig. 9 As shown, a system for detecting functional damage of electronic chassis components is provided, including: a vulnerability model construction module 901 , a damage effect model construction module 902 , a functional damage model construction module 903 and a damage analysis module 904 .

[0087] The vulnerability model building module 901 is used to simulate the impact damage of the printed circuit board in the electronic chassis and establish the vulnerability model of the printed circuit board according to the simulation results. The vulnerability model is used to describe the mapping relationship between the damage of components at different positions and the local damage index of the printed circuit board.

[0088] Specifically, Fig.10 and Fig.11 As shown in the figure, firstly, the printed circuit board layout file is read through the spatial position mapping submodule, the PCBA layout structure is parsed, and the mapping relationship from the spatial position to the components and their circuit nodes is constructed; then the damage injection submodule is used to read and analyze the netlist file of the original circuit (storing component parameters and component connection topology) and the damage effect data description file (storing the impact position and impact hole shape), and the corresponding damage effect data is injected into the original circuit netlist through the mapping relationship constructed by the spatial position mapping submodule to generate a new netlist with injected damage information; finally, the circuit function evaluation submodule is called to perform circuit function simulation, and the simulation results are analyzed to calculate the PCBA local damage index, and a mapping relationship model between component damage at different positions and PCBA local damage index, namely, a fragility model, is established.

[0089] The damage effect model building module 902 is used to build a damage effect model of space debris impacting an electronic chassis. The damage effect model is used to describe the mapping relationship between the impact parameters of different space debris and the physical damage effect data of the printed circuit board in the electronic chassis.

[0090] The functional damage model building module 903 is used to build a functional damage model based on the damage effect model and the vulnerability model. The functional damage model is used to describe the mapping relationship between the impact parameters of different space debris and the overall functional damage index of the printed circuit board in the electronic chassis.

[0091] The damage analysis module 904 is used to determine the overall functional damage index of the printed circuit board in the target electronic chassis according to the impact parameters of the target electronic chassis and adopt the functional damage model to perform damage analysis on the target electronic chassis.

[0092] In an exemplary embodiment, a computer device is provided, which may be a server or a terminal, and includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method for detecting functional damage of electronic chassis components in the above-mentioned embodiment.

[0093] In an exemplary embodiment, a computer-readable storage medium is provided, storing a computer program, which, when executed by a processor, implements the method for detecting functional damage of an electronic chassis component in the above-mentioned embodiment.

[0094] In an exemplary embodiment, a computer program product is provided, including a computer program, which, when executed by a processor, implements the method for detecting functional damage of an electronic chassis component in the above-mentioned embodiment.

[0095] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0096] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM may be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0097] The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. The non-relational database may include a distributed database based on blockchain, etc., but is not limited thereto. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but is not limited thereto.

[0098] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0099] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. At the same time, for those skilled in the art, according to the ideas of this application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. A method for detecting functional damage of electronic chassis components, characterized in that: The electronic chassis component functional damage detection method comprises: Performing impact damage simulation on a printed circuit board in an electronic chassis, and establishing a vulnerability model of the printed circuit board according to the simulation results; the vulnerability model is used to describe the mapping relationship between component damage at different positions and the local damage index of the printed circuit board; Establishing a damage effect model of space debris impacting an electronic chassis; the damage effect model is used to describe the mapping relationship between the impact parameters of different space debris and the physical damage effect data of the printed circuit board in the electronic chassis; Based on the damage effect model and the vulnerability model, a functional damage model is established; the functional damage model is used to describe the mapping relationship between the impact parameters of different space debris and the overall functional damage index of the printed circuit board in the electronic chassis; According to the impact parameters of the target electronic chassis, the functional damage model is used to determine the overall functional damage index of the printed circuit board in the target electronic chassis, so as to perform damage analysis on the target electronic chassis.

2. The method for detecting functional damage of electronic chassis components according to claim 1, characterized in that: The impact damage simulation of the printed circuit board in the electronic chassis is carried out, and the vulnerability model of the printed circuit board is established based on the simulation results, including: Based on the layout information of the printed circuit board, LTspice software is used to carry out circuit function simulation, and component damage is injected into the printed circuit board to determine the degree of loss of printed circuit board function caused by component damage at different positions of the printed circuit board. In this way, the mapping relationship between component damage at different positions and the local damage index of the printed circuit board is determined, and a vulnerable model of the printed circuit board is established.

3. The method for detecting functional damage of electronic chassis components according to claim 1, characterized in that: The vulnerability model is: Wherein, I(p) is the local damage index caused by the impact damage at position p of the printed circuit board, m is the total number of functions of the printed circuit board, and F(i) is the function judgment function. If the i-th function is normal, F(i)=0, and if the i-th function fails, F(i)=1.

4. The method for detecting functional damage of electronic chassis components according to claim 1, characterized in that: Based on the damage effect model and the vulnerability model, a functional damage model is established, which specifically includes: Based on the damage effect model, physical damage effect data of printed circuit boards in electronic chassis under different impact parameters of space debris are extracted; The physical damage effect data of the printed circuit board in the electronic chassis under different impact parameters of space debris are used as the damage injection parameters of the printed circuit board. Combined with the vulnerability model, the overall functional damage index of the printed circuit board in the electronic chassis is determined to establish a functional damage model.

5. The method for detecting functional damage of electronic chassis components according to claim 1, characterized in that: The impact parameters include collision speed and incident angle.

6. The method for detecting functional damage of electronic chassis components according to claim 5, characterized in that: The functional impairment model is: Where v is the collision velocity, is the incident angle, It means that when the electronic chassis is hit by a speed of v and an incident angle of The overall functional damage index of the printed circuit board after being hit by space debris, E is the expectation operator, m is the total number of functions of the printed circuit board, F(i) is the function judgment function, if the i-th function is normal, then F(i) = 0, if the i-th function fails, then F(i) = 1.

7. The method for detecting functional damage of electronic chassis components according to claim 1, characterized in that: The electronic chassis component function damage detection method also includes: The damage level of the target electronic chassis is determined according to the overall functional damage index of the printed circuit board in the target electronic chassis; the damage level includes mild damage, moderate damage and severe damage; when the functional damage index is less than a first set threshold, the damage level is mild damage; when the functional damage index is greater than or equal to the first set threshold and less than or equal to the second set threshold, the damage level is moderate damage; when the functional damage index is greater than or equal to the second set threshold, the damage level is severe damage; the first set threshold is less than the second set threshold.

8. An electronic chassis component functional damage detection system, characterized in that: The electronic chassis component function damage detection method according to any one of claims 1 to 7, wherein the electronic chassis component function damage detection system comprises: A vulnerability model building module is used to simulate the impact damage of the printed circuit board in the electronic chassis, and establish a vulnerability model of the printed circuit board according to the simulation results; the vulnerability model is used to describe the mapping relationship between the damage of components at different positions and the local damage index of the printed circuit board; A damage effect model building module is used to establish a damage effect model of space debris impacting an electronic chassis; the damage effect model is used to describe the mapping relationship between the impact parameters of different space debris and the physical damage effect data of the printed circuit board in the electronic chassis; A functional damage model building module, used to establish a functional damage model based on the damage effect model and the vulnerability model; the functional damage model is used to describe the mapping relationship between the impact parameters of different space debris and the overall functional damage index of the printed circuit board in the electronic chassis; The damage analysis module is used to determine the overall functional damage index of the printed circuit board in the target electronic chassis according to the impact parameters of the target electronic chassis and adopt the functional damage model to perform damage analysis on the target electronic chassis.

9. A computer device comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method for detecting functional damage to components of an electronic chassis as described in any one of claims 1-7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for detecting functional damage of an electronic chassis component according to any one of claims 1 to 7 is implemented.

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