Method and device for analyzing wafer unit device, electronic equipment and medium

Abstract

The invention discloses a wafer unit device analysis method and device, electronic equipment and a medium, and relates to the field of semiconductor device detection. The analysis method comprises the following steps: acquiring information data of a to-be-analyzed wafer and a specific area thereof; based on the original test data file of the wafer to be analyzed and the boundary requirements of the specific area, determining the position coordinates of each boundary unit device in the specific area; on the basis of the position coordinates of the boundary unit device, screening unit device data located in a specific area from the original test data file, and saving the screened unit device data as a new data file; and analyzing the performance indexes of the unit devices in the specific area, and storing an analysis result in a new data file. According to the wafer unit device analysis method and device, the electronic equipment and the medium provided by the invention, a method for carrying out data analysis and sorting on a specific region on the wafer can be realized, the data processing efficiency is high, and the data analysis accuracy is high.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor device detection technology, and specifically relates to an analysis method, device, electronic equipment and medium for wafer unit devices. Background Art

[0002] Semiconductor device manufacturing is the core link of the modern electronics industry. The devices produced in this link are widely used in computers, communications, consumer electronics and other high-tech fields. The manufacture of semiconductor devices is usually carried out on wafers. The surface of the wafer undergoes a series of complex process steps to form micron or even nanometer-level unit devices. Thousands or even hundreds of thousands of unit devices can be manufactured on each wafer.

[0003] During the manufacturing process, in order to ensure the performance and reliability of each unit device, it is usually necessary to test and evaluate the electrical or optical performance of the unit device. Due to the large number of unit devices on each wafer, the corresponding data files will also generate a large number of data records, which can reach tens of thousands or even hundreds of thousands.

[0004] In the prior art, manual or semi-automatic software tools are usually used to process and analyze test data. Operators need to import test data files one by one or in batches, and use spreadsheet software or dedicated data analysis tools to perform data screening, statistics, and visualization. Although this method can meet basic needs when dealing with small amounts of data or analysis of a single area, it is inefficient and prone to errors when dealing with large-scale data and multi-area analysis.

[0005] In addition, during the semiconductor manufacturing process, different areas of the wafer are often designed with unit devices with different functions, or specific areas of the wafer need to be analyzed separately due to special requirements such as reliability and optoelectronic performance. The boundaries of these specific areas are usually not fixed. This dynamically changing boundary increases the complexity of data processing, and traditional data screening and analysis methods are difficult to respond flexibly.

[0006] Therefore, it is necessary to provide a new solution to the above technical problems. Summary of the invention

[0007] The purpose of the present application is to provide an analysis method, device, electronic equipment and medium for wafer unit devices, which can realize data analysis and sorting of specific areas on the wafer, and have high data processing efficiency and high data analysis accuracy.

[0008] To achieve the above objectives, the technical solutions provided by this application are as follows:

[0009] In a first aspect, the present application provides a method for analyzing a wafer unit device, which comprises:

[0010] Acquire information data of a wafer to be analyzed and its specific area, wherein the information data includes wafer size, unit device size and boundary requirements of the specific area; determine the position coordinates of each boundary unit device in the specific area based on an original test data file of the wafer to be analyzed and the boundary requirements of the specific area; filter out unit device data located in the specific area from the original test data file based on the position coordinates of the boundary unit device, and save the filtered unit device data as a new data file; analyze performance indicators of the unit devices in the specific area, and save the analysis results in the new data file.

[0011] In one or more embodiments, the boundary requirement of the specific area includes removing a predetermined edge area and / or a center area of ​​the wafer to be analyzed.

[0012] In one or more embodiments, the analysis method further includes: determining the columns where the X coordinate and the Y coordinate are located in the original test data file; and calculating the maximum and minimum values ​​of the X coordinate and the Y coordinate to determine the boundary of the wafer.

[0013] In one or more embodiments, the analysis method further includes: calculating the number of unit devices that need to be excluded based on the boundary requirements and unit device size of the specific area; and calculating the maximum and minimum values ​​of the X-coordinate and Y-coordinate of the boundary of the specific area based on the number of unit devices to be excluded to determine the boundary of the specific area.

[0014] In one or more embodiments, determining the position coordinates of each boundary unit device in the specific area includes: establishing a functional relationship between an X coordinate and a Y coordinate of a boundary shape of the specific area based on a boundary shape of the specific area; determining an X coordinate of each boundary unit device in the specific area based on a maximum value and a minimum value of an X coordinate of a boundary of the specific area; and calculating a Y coordinate of the boundary unit device based on the functional relationship and the X coordinate of the boundary unit device.

[0015] In one or more embodiments, filtering out the unit device data located in the specific area from the original test data file includes: filtering out the unit device data outside the boundary unit device based on the X coordinate and the Y coordinate of the boundary unit device; or filtering the unit device data inside the boundary unit device based on the X coordinate and the Y coordinate of the boundary unit device.

[0016] In one or more implementations, the method further includes: sorting unit devices on the wafer to be analyzed based on the new data file.

[0017] In the second aspect, the present application provides an analysis device for wafer unit devices, which includes: an acquisition module, a calculation module, a screening module and an analysis module; the acquisition module is used to acquire information data of the wafer to be analyzed and its specific area, and the information data includes wafer size, unit device size and boundary requirements of the specific area; the calculation module is used to determine the position coordinates of each boundary unit device in the specific area based on the original test data file of the wafer to be analyzed and the boundary requirements of the specific area; the screening module is used to filter out the unit device data located in the specific area from the original test data file based on the position coordinates of the boundary unit device, and save the filtered unit device data as a new data file; the analysis module is used to analyze the performance indicators of the unit devices in the specific area, and save the analysis results in the new data file.

[0018] In a third aspect, the present application provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method for analyzing wafer unit devices as described above is implemented.

[0019] In a fourth aspect, the present application provides a computer-readable medium, wherein the computer-readable medium carries computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement the analysis method of the wafer unit device as described above.

[0020] Compared with the prior art, the analysis method, device, electronic device and medium for wafer unit devices provided in the present application reduce human intervention by automatically calculating the boundaries of specific areas and screening data; dynamically calculate the boundary coordinates of specific areas, combine with geometric models to achieve accurate screening, and only retain the unit device data within the target area to ensure the pertinence and completeness of the analysis results; a method for data analysis and sorting of specific areas on a wafer can be implemented, with high data processing efficiency and high data analysis accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 This is a flow chart of a method for analyzing a wafer unit device in an embodiment of the present application;

[0023] Figure 2 This is an original test data diagram of an unprocessed wafer in an embodiment of the present application;

[0024] Figure 3 A test data graph of a specific area after screening in an embodiment of the present application;

[0025] Figure 4 It is a structural block diagram of an analysis device for wafer unit devices in one embodiment of the present application;

[0026] Figure 5 It is a structural block diagram of an electronic device in one embodiment of the present application. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of this application.

[0028] This application proposes an efficient, accurate and flexible analysis method to address the challenges faced by wafer unit device analysis during semiconductor device manufacturing. The existing technology has many shortcomings when dealing with large-scale wafer data, dynamically changing specific area boundaries and complex performance indicator analysis, such as low data processing efficiency, complex operations and prone to errors, and inaccurate analysis results. These problems not only restrict the improvement of quality control and yield rate in the semiconductor manufacturing process, but also affect the overall efficiency and economic benefits of the manufacturing process.

[0029] In order to solve the above problems, this application realizes the automated analysis of unit devices in a specific area of ​​the wafer through a systematic methodology design. The core idea is to use programming methods, combined with the basic size information of the wafer and unit devices, to dynamically determine the boundary coordinates of a specific area, automatically filter out the unit device data that meets the conditions, and analyze its performance indicators. Through this process, this application effectively improves the efficiency of data processing and the accuracy of analysis, and significantly reduces the risk of errors caused by human operation.

[0030] Specifically, this application first obtains the basic information of the wafer and its specific area, including the wafer size, unit device size, and boundary requirements of the specific area. Based on this information, the system can dynamically calculate and determine the boundary coordinates of the specific area, and then automatically filter out the unit device data located in the area from the massive amount of original test data. Subsequently, the system performs multi-dimensional performance indicator analysis on the filtered data, such as distribution pattern, average value, yield rate, standard deviation, and correlation coefficient, and saves the analysis results to a new data file for subsequent quality control and device sorting.

[0031] The implementation idea of ​​this application is based on the combination of automation and flexibility. It realizes efficient data processing and dynamic adaptation to different analysis needs through programming, overcoming the shortcomings of complex manual operations and low processing efficiency in the prior art. In addition, the method of this application has high scalability and adaptability, and can flexibly adjust analysis parameters according to different manufacturing needs and boundary requirements of specific areas to meet diverse application scenarios.

[0032] Please refer to Figure 1 As shown, a flow chart of a method for analyzing a wafer unit device in an embodiment of the present application is shown. The method for analyzing a wafer unit device specifically comprises the following steps:

[0033] S101: Acquire information data of a wafer to be analyzed and its specific area, wherein the information data includes wafer size, unit device size, and boundary requirements of the specific area.

[0034] The core of step S101 is to obtain information data of the wafer to be analyzed and its specific area, providing the necessary basic conditions for subsequent analysis. These information data include the overall size of the wafer, the size of the unit device, and the boundary requirements of the specific area. By collecting these data, the wafer to be analyzed and the specific area can be accurately defined, thus laying the foundation for subsequent data processing and performance analysis.

[0035] In a specific implementation, the implementation of this step can be carried out in a variety of ways. For example, the system can obtain basic wafer size information from user input or a predefined database, including parameters such as the wafer diameter (such as 2 inches to 12 inches) and thickness. At the same time, the size information of the unit device is also necessary, including the side length, geometric shape (such as square, round), etc. of the unit device, which is usually provided by the manufacturing process standards or design specifications (such as a square unit device with a side length of 15 mil). The boundary requirements of a specific area are an important basis for dynamic calculations in data processing, and its form can include removing the predetermined edge area and / or center area of ​​the wafer to be analyzed. For example, exclude a certain width of the wafer edge (such as 15 mm), remove a certain diameter range of the center (such as 20 mm), or only retain specific areas that meet certain shape conditions (such as rectangles, rings), etc.

[0036] Obtaining the wafer size and unit device size can help build the coordinate system for analysis and ensure the accuracy of subsequent coordinate calculations and screening logic. The boundary requirements of specific areas help to flexibly adjust the analysis scope according to needs, such as focusing on the yield rate of edge areas or performance differences in the center area. This ability to dynamically define boundaries improves the pertinence and effectiveness of data analysis.

[0037] During the implementation process, the method of obtaining information data can be achieved through a variety of ways. Users can manually enter the wafer size, unit device size, and boundary requirements of specific areas through a graphical user interface (GUI). This method is suitable for scenarios where parameters need to be adjusted flexibly, allowing operators to modify parameters in real time according to specific needs. In addition, information data can also be automatically obtained by reading configuration files or design files. For example, wafer design files usually contain the size of the wafer and the layout information of the unit devices. By parsing these files, the system can automatically extract the required size parameters and reduce the error rate of manual input.

[0038] S102: Determine the position coordinates of each boundary unit device in the specific area based on the original test data file of the wafer to be analyzed and the boundary requirements of the specific area.

[0039] The core task of step S102 is to dynamically calculate and determine the position coordinates of each boundary unit device in a specific area based on the original test data file and the boundary requirements of the specific area. This step converts the boundary requirements of the wafer from theoretical concepts into specific coordinates, which plays a connecting role in subsequent data screening and performance analysis.

[0040] During the testing and analysis of semiconductor wafers, the unit devices on the wafer are densely arranged, and the location of the unit devices is usually represented by their X-coordinates and Y-coordinates in the test data file. The boundary requirements of a specific area can be to remove a portion of the edge or center of the wafer, or to specify a certain geometric shape (such as a rectangle, circle or other irregular shape). Therefore, determining the coordinates of each unit device within the boundary of a specific area is essentially a matching process that combines the geometric boundary with the data coordinates.

[0041] In an exemplary embodiment, the analysis method further includes determining the columns where the X coordinate and the Y coordinate are located in the original test data file; and calculating the maximum and minimum values ​​of the X coordinate and the Y coordinate to determine the boundary of the wafer.

[0042] Determining the columns where the X and Y coordinates are located in the original test data file is the basis for ensuring the accuracy of subsequent data processing. In actual operation, the test data file is usually stored in the form of a spreadsheet, where each column represents different parameters, such as the ID, location coordinates, performance indicators, etc. of the unit device. Through programming means, such as using Excel VBA scripts, using the Find function or other search methods, the specific columns containing the X and Y coordinate data can be automatically identified. This process avoids the tediousness and possible errors of manual search and improves the efficiency and accuracy of data processing.

[0043] The maximum and minimum values ​​of the X and Y coordinates are determined to clearly identify the wafer boundary positions in the X and Y directions. For example, assuming that the X coordinate range of a wafer is 0 to 100 and the Y coordinate range is 0 to 100, this means that the diameter of the wafer is 100 mm and the center coordinates are (50,50). By calculating the maximum and minimum values, the boundaries of the wafer can be accurately drawn, ensuring that subsequent specific area positioning is based on actual data rather than theoretical estimates.

[0044] Specifically, the analysis method further includes: calculating the number of unit devices that need to be excluded based on the boundary requirements and unit device size of the specific area; and calculating the maximum and minimum values ​​of the X-coordinate and Y-coordinate of the boundary of the specific area based on the number of unit devices to be excluded to determine the boundary of the specific area.

[0045] The number of unit devices that need to be excluded can be calculated based on the boundary requirements of a specific area and the size of the unit device. To illustrate with a specific example, assume that the wafer diameter is 100mm, the side length of the unit device is 0.381mm, and a 15mm area on the edge of the wafer needs to be isolated. First, the number of unit devices that need to be excluded is calculated as 15mm divided by the side length of the unit device, that is, 15 / 0.381≈39.4. Since the number of unit devices must be an integer, a rounding function (such as Round, RoundUp, or RoundDown) can be used to round it. For example, use the RoundUp function to round 39.4 to 40.

[0046] Through this calculation, the boundary coordinates of a specific area can be determined. For example, the maximum value of the wafer X coordinate is 100, minus the width of 40 unit devices, the maximum value of the X coordinate of the boundary of the specific area can be calculated, that is, 100-(40×0.381)=100-15.24≈84.76. The same method can be used to calculate the minimum value of the X coordinate and the minimum and maximum values ​​of the Y coordinate of the boundary of a specific area, and the minimum and maximum boundary values ​​of the specific area can be determined. In the end, the boundary coordinates of the specific area will be from the minimum value of the X coordinate to the maximum value of 84.76, and the minimum value of the Y coordinate to the corresponding maximum boundary value.

[0047] The specific way to implement this step can be achieved through programming. Taking Excel VBA as an example, a script is written to automatically read the test data file, identify the columns where the X and Y coordinates are located, and use the Max and Min functions to calculate their maximum and minimum values. Subsequently, based on the input boundary requirements and unit device size, the number of unit devices that need to be excluded is automatically calculated, and the boundary coordinates of the specific area are adjusted. In this way, the entire process does not require manual intervention, which improves operational efficiency and accuracy.

[0048] Further, determining the position coordinates of each boundary unit device in the specific area includes: establishing a functional relationship between an X coordinate and a Y coordinate of the boundary shape based on a boundary shape of the specific area; determining an X coordinate of each boundary unit device in the specific area based on a maximum value and a minimum value of the X coordinate of the boundary of the specific area; and calculating a Y coordinate of the boundary unit device based on the functional relationship and the X coordinate of the boundary unit device.

[0049] The boundary shape of a specific area is converted into an accurate coordinate range through a mathematical function relationship in order to locate the X coordinate and Y coordinate of each boundary unit device. This step includes establishing a functional relationship based on the geometric shape of the specific area, determining the maximum and minimum values ​​of the X coordinate, and calculating the corresponding Y coordinate boundary value based on the functional relationship.

[0050] The boundary shape of a particular area can be a rectangle, a circle, or other geometric shape, which determines the functional relationship between the X coordinate and the Y coordinate. For example, for a circular area, the relationship between the X coordinate and the Y coordinate is defined by the equation of the circle as X 2 +Y 2 =R 2 , where R is the radius of the circle.

[0051] In the specific implementation, firstly, the maximum and minimum values ​​of the X coordinate are extracted according to the boundary shape and boundary requirements of the specific area. These values ​​limit the horizontal range of the specific area. For example, assuming that the diameter of a wafer is 100mm, and a circular area with a radius of 40mm and the center of the wafer as the origin needs to be analyzed, the range of the X coordinate of the boundary unit device is -40 to 40. Through this range, the coordinate range of the unit device to be analyzed in the X direction can be clearly defined.

[0052] After obtaining the X coordinate range, the Y coordinate corresponding to the X coordinate of each boundary unit device is calculated according to the functional relationship of the specific area. For example, for the above circular area, when X=30, the corresponding Y coordinate range is given by equation 30 2 +Y 2 =40 2 Solving, we get Y≈±26.46. The same method is applied to the X coordinate value of each boundary unit device, thereby constructing the coordinate set of the entire specific area boundary.

[0053] To achieve this process, we can use programming to automate the calculation. Taking Python as an example, the program first reads the boundary requirements and functional relationships of a specific area, traverses each discrete value in the X coordinate range, calculates the corresponding Y coordinate boundary value through the functional relationship, and stores the result as a coordinate set for subsequent use. Through this automated process, a large number of coordinate calculations can be completed quickly and efficiently, avoiding the inefficiency and errors of manual operations.

[0054] The significance of this step is to concretize the abstract geometric boundary into operational discrete coordinates through mathematical modeling, ensuring that the selected boundary unit devices accurately meet the definition of the specific area. Taking the circular area as an example, by accurately calculating the Y coordinate range corresponding to the X coordinate of each boundary unit device, it can be ensured that the unit devices on the circumference are fully included in the analysis range, without excluding or mistakenly including unit devices outside the boundary.

[0055] The purpose of this step is to provide a clear boundary basis for subsequent data screening, while ensuring the accuracy and completeness of the analysis area. This precise coordinate calculation can avoid the analysis deviation or inconsistent results caused by blurred boundaries in traditional methods. For example, if the boundary range is not accurately calculated, some edge unit devices may be omitted, thus affecting the accuracy of performance indicators.

[0056] S103: based on the position coordinates of the boundary unit devices, filter out the unit device data located in the specific area from the original test data file, and save the filtered unit device data as a new data file.

[0057] The goal of the filtering operation is to extract data within a specific area from the original test data file based on the coordinate range of the boundary unit devices. For example, if the specific area is a rectangle, the filtering condition is that the X coordinate and Y coordinate of the unit device both meet the boundary range of the area; if the specific area is a circle, it is necessary to determine whether the coordinates of the unit device meet the equation relationship of the circle (X 2 +Y 2 ≤R 2 ).

[0058] When implementing this step, you first need to combine the original test data file with the aforementioned boundary coordinates and automatically filter the data programmatically. For example, using Python to implement this operation, you can use the following logic: read the original data file, traverse the data one by one, and determine whether the X and Y coordinates of each record meet the boundary conditions of a specific area. For data that meets the conditions, extract it into a new data set and store it as a new file in the specified format. Taking the circular area as an example, the equation relationship of the circular area is X 2 +Y 2 ≤R 2 , then when traversing the data, for each record's X and Y values, determine whether the sum of their squares is less than or equal to R 2 , if the conditions are met, it will be included in the screening results.

[0059] In more complex application scenarios, this screening process can be combined with more advanced conditional logic. For example, when a specific area contains multiple sub-areas (such as multiple rectangles or circles), the data that meets the requirements of multiple areas can be screened out by combining conditions. In addition, the screening operation can also be combined with other attribute conditions, such as screening high-performance unit devices in a specific area based on the threshold of performance indicators.

[0060] After the screening is completed, the qualified unit device data is saved as a new data file. The purpose of this operation is to store the data of a specific area independently for subsequent analysis and operation. For example, the new data file can be saved in CSV or Excel format to be compatible with different data analysis tools. At the same time, the save operation can also add metadata descriptions, such as recording the screening conditions, specific area boundary coordinates and other information, to facilitate subsequent traceability and verification.

[0061] The significance of this process is that, through precise screening, the unit device data in a specific area is extracted, so that data processing is transferred from the overall level to the local area, reducing the data scale and improving the pertinence and efficiency of analysis. For example, in the test data of a certain wafer, if the total number of records is 100,000, and there are only 10,000 data in a specific area, the screening operation can extract these 10,000 data, which not only reduces the complexity of analysis, but also reduces the resource consumption of storage and processing.

[0062] In an exemplary embodiment, filtering out the unit device data located in the specific area from the original test data file includes: filtering out the unit device data outside the boundary unit device based on the X coordinate and Y coordinate of the boundary unit device; or filtering the unit device data inside the boundary unit device based on the X coordinate and Y coordinate of the boundary unit device.

[0063] The core task of this process is to distinguish the data inside and outside the boundary through mathematical conditions according to the X and Y coordinates of the boundary unit device, thereby filtering out irrelevant data outside the boundary or retaining only the target data inside the boundary. This step ensures the accuracy of data in a specific area and provides accurate input for subsequent performance analysis and yield calculation.

[0064] Specifically, the definition of a specific area usually depends on the coordinate range of the boundary unit device. The X-coordinate and Y-coordinate of the boundary unit device describe the geometric range of the specific area on the wafer. The screening logic includes two modes: one is to filter out the unit device data outside the boundary, and the other is to only filter the unit device data inside the boundary. These two operations correspond to different application requirements, such as excluding invalid area data or retaining only target area data.

[0065] The specific method of implementing this step can be automated by programming. For example, assuming that the specific area is a rectangle, its X coordinate range is [X min ,X max ], the Y coordinate range is [Y min ,Y max For each test data record, obtain its X coordinate and Y coordinate to determine whether it meets the conditions: min ≤X≤X max and Y min ≤Y≤Y max If both conditions are met, the unit device is considered to be located in a specific area and its data is retained; otherwise, it is filtered out. In this way, the data in the target area can be effectively retained, or irrelevant data that does not meet the conditions can be excluded.

[0066] S104: Analyze the performance indicators of the unit devices in the specific area, and save the analysis results into the new data file.

[0067] The performance analysis of unit devices is usually carried out based on one or more groups of indicators, such as electrical performance indicators such as current, voltage, response time, power consumption, noise, or optical performance such as reflectivity, transmittance, color value, etc. These performance indicators are usually obtained through automated measurement of test equipment and recorded in test data files. The purpose of the analysis is to extract meaningful features from these data, identify unit devices with abnormal performance, or identify areas with excellent performance by comparing the performance of each unit device in a specific area.

[0068] The performance analysis results need to be saved in a new data file for subsequent statistical analysis, report generation, or as a basis for production quality control. The saved results can include the performance indicators of each unit device, the results of the analysis and judgment (such as good or bad product identification), and the overall performance of the area (such as yield, performance distribution diagram, etc.). These analysis results can not only provide real-time feedback to production line personnel, but also provide data support for subsequent production optimization, helping engineers make data-driven decisions.

[0069] In an exemplary embodiment, the method further includes: sorting the unit devices on the wafer to be analyzed based on the new data file. The new data file contains the performance indicators and analysis results of the unit devices in the selected specific area. These results include information such as the specific performance value of each unit device, a mark of whether it meets the predetermined standard, and the classification of good or bad products. In the sorting process, these unit devices are divided into different categories according to the pre-set classification rules, and each type of unit device is subsequently processed.

[0070] The specific implementation of sorting can be achieved in combination with automated equipment or software programs. For example, in actual production, sorting equipment is usually combined with a visual inspection system or an electronic probe to accurately control the sorting action by reading the classification information in the new data file. The program reads the performance data and classification identification of each unit device in the new data file, and distributes the unit devices to different processing areas according to the classification rules. For example, good products can directly enter the packaging process, while defective products and waste products will be stored separately or further tested.

[0071] The present application will be further described below in conjunction with specific embodiments.

[0072] In one embodiment, a new EXCEL macro-enabled workbook is created, the Visual Basic (VB) editing page is opened from the development tool, a new module is created, and it is named "Test Data Processing", and a data processing function is established in the "Test Data Processing" module so that source code can be written therein to implement data processing and analysis. The function name begins with "Sub Data Analysis ()" and ends with "EndSub".

[0073] Define the required variables in the Sub function body. Single-precision data variables are defined as single, worksheet variables are defined as Worksheet, and other variables can be defined as variant variables Variant.

[0074] Write a program to obtain the relevant information data of the product corresponding to the document to be processed, as well as the basic information data required in the processing process, including wafer size, unit device size, and specific area data that needs to be removed or edited, such as removing 15mm from the edge and 20mm from the center.

[0075] Write the GetOpenFilename function code to get the file name of the document to be processed and save it to the defined array variable, where the array variable can be a variant variable defined by Variant. The file name contains the path where the file is located. It can be a single file or multiple files. When multiple files are selected, batch processing and analysis of multiple files can be performed continuously.

[0076] Edit the UBound function code to get the number of file names in the array, write a For loop code to traverse the file names in the variant array, and use the Open method to open the data files corresponding to the file names in the array in sequence. The lower boundary of the For loop traversal array can be 1, and the upper boundary is the number of array file names.

[0077] For each data file that has been opened, determine the columns where the X and Y coordinates in the test data document are located, and assign their column numbers to the single-precision variables defined above. The columns where the X and Y coordinates are located can be obtained by calling the Find function or writing other source code. Determine the maximum and minimum values ​​of the X and Y coordinates in the test data document respectively, where the maximum value can be determined and returned by the Max function, and the minimum value can be determined and returned by the Min function. The maximum value of the X coordinate corresponds to the maximum boundary of the test document data in the X direction, the minimum value of the X coordinate corresponds to the minimum boundary of the test document data in the X direction, the maximum value of the Y coordinate corresponds to the maximum boundary of the test document data in the Y direction, and the minimum value of the Y coordinate corresponds to the minimum boundary of the test document data in the Y direction. When using a mapping diagram to display the test document data, the maximum and minimum values ​​of the X coordinate correspond to the two end positions at the extreme edges in the X direction, and the maximum and minimum values ​​of the Y coordinate correspond to the two end positions at the extreme edges in the Y direction. Reference Figure 2 The two endpoint positions in the horizontal direction and the two endpoint positions in the vertical direction.

[0078] The obtained product information and processing information are used to calculate the coordinates corresponding to the boundaries of the specific area that needs to be removed or processed separately. The steps include: calculating the minimum coordinate position in the X direction and the maximum coordinate position in the X direction; writing the functional relationship between the X coordinate and the Y coordinate according to the graphics of the specific area; calculating the Y coordinate boundary value corresponding to each X coordinate, and calculating or filtering out the data outside the Y coordinate boundary value; the X coordinate value starts from the minimum value of the specific area and ends at the maximum value.

[0079] For example, in a 4-inch wafer, a square unit device with a side length of 15 mil is made. The diameter of the wafer is 100 mm, and the side length of the unit device is 0.381 mm. When the 15 mm range of the wafer edge needs to be isolated due to reliability or other reasons, the number of devices that need to be removed is calculated to be 39.4 (15 / 0.381). The maximum value of the X coordinate of a specific area is obtained by subtracting the number of devices that need to be removed from the maximum value of the X coordinate. Figure 3 The right endpoint position in the horizontal direction is obtained by the same method to obtain the minimum value of the X coordinate of the specific area. The number of removed unit devices can be rounded to an integer, and can be rounded up by the Round function, rounded up by Roundup, or rounded down by RoundDown. When Roundup is used to round up, the maximum coordinate value of the boundary position in the X direction of the specific area after isolation is the maximum value of the X coordinate minus 40 (39.4 rounded up).

[0080] Write a For loop code to traverse the X coordinate, with the starting value being the minimum value of the X coordinate of the specific area, the ending value being the maximum value of the X coordinate of the specific area, and the step being 1. Corresponding to the X coordinate in each loop, the X coordinate and Y coordinate values ​​of each unit device at the boundary of the specific area are calculated based on the relationship between the X coordinate and the Y coordinate of the specific area. The unit device boundary of the specific area is selected as needed, and the unit device data outside or within the boundary is filtered out or edited. The AutoFilter function can be called to filter out or edit each X coordinate and Y coordinate of the boundary point of the specific area. The editing range is based on the X and Y coordinate relationship that the required area satisfies. For example, when the specific area is a circle, the X coordinate and Y coordinate of the unit device at the boundary of the circular area satisfy the coordinate function relationship of the circle with the center of the wafer as the origin (usually the origin of the test data document), X 2 +Y 2 =R 2 , where R is the radius of the required specific area, and also the endpoint position coordinates of the specific area in the X or Y direction. After the loop ends, use False to turn off AutoFilter.

[0081] After the original test document is edited as expected, save the new document to the specified location for subsequent analysis and calculation of the specific area required, including but not limited to distribution law, average value, yield rate, standard deviation, correlation coefficient, etc. It also serves as the basic data for subsequent unit device sorting. Without the new document data, it will not be possible to sort separately according to the specified area, and there is a risk of selecting defective products into normal products. The new document can be saved to the specified location using the SaveAs function. Use the Close function to close the original file, and the SaveChanges parameter is defined as False to not save the changes to the original file. You can then compare and analyze the specific area and the entire wafer data.

[0082] Please refer to Figure 4 As shown, based on the same inventive concept as the aforementioned analysis method for wafer unit devices, the present application provides an analysis device 400 for wafer unit devices, which includes: an acquisition module 401 , a calculation module 402 , a screening module 403 and an analysis module 404 .

[0083] The acquisition module 401 is used to obtain information data of the wafer to be analyzed and its specific area, and the information data includes wafer size, unit device size and boundary requirements of the specific area. The calculation module 402 is used to determine the position coordinates of each boundary unit device in the specific area based on the original test data file of the wafer to be analyzed and the boundary requirements of the specific area. The screening module 403 is used to filter out the unit device data located in the specific area from the original test data file based on the position coordinates of the boundary unit device, and save the filtered unit device data as a new data file. The analysis module 404 is used to analyze the performance indicators of the unit devices in the specific area, and save the analysis results in the new data file.

[0084] Please refer to Figure 5 As shown, the embodiment of the present application further provides an electronic device 500, which includes at least one processor 501, a memory 502 (such as a non-volatile memory), a memory 503 and a communication interface 504, and the at least one processor 501, the memory 502, the memory 503 and the communication interface 504 are connected together via a bus 505. At least one processor 501 is used to call at least one program instruction stored or encoded in the memory 502, so that the at least one processor 501 performs various operations and functions of the analysis method of the wafer unit device described in various embodiments of this specification.

[0085] In the embodiments of the present specification, the electronic device 500 may include, but is not limited to, personal computers, server computers, workstations, desktop computers, laptop computers, notebook computers, mobile electronic devices, smart phones, tablet computers, cellular phones, personal digital assistants (PDAs), handheld devices, messaging devices, wearable electronic devices, consumer electronic devices, and the like.

[0086] An embodiment of the present application also provides a computer-readable medium, which carries computer execution instructions. When the computer execution instructions are executed by a processor, they can be used to implement various operations and functions of the wafer unit device analysis method described in the various embodiments of this specification.

[0087] The computer-readable medium in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, a system, device or component of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by or in combination with an instruction execution system, device or device.

[0088] In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, device, or device. The program code contained on the computer-readable medium may be transmitted using any suitable medium, including but not limited to: wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0089] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0090] The present application is described with reference to the flowcharts and / or block diagrams of the methods, apparatuses, systems, and computer program products of the embodiments of the present application. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0091] It is obvious to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0092] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A method for analyzing wafer unit devices, characterized in that: include: Acquire information data of a wafer to be analyzed and a specific area thereof, wherein the information data includes wafer size, unit device size, and boundary requirements of the specific area; Determine the position coordinates of each boundary unit device in the specific area based on the original test data file of the wafer to be analyzed and the boundary requirements of the specific area; Based on the position coordinates of the boundary unit devices, filter out the unit device data located in the specific area from the original test data file, and save the filtered unit device data as a new data file; The performance indicators of the unit devices in the specific area are analyzed, and the analysis results are saved in the new data file.

2. The method for analyzing wafer unit devices according to claim 1, characterized in that: The boundary requirement of the specific area includes removing a predetermined edge area and / or a center area of ​​the wafer to be analyzed.

3. The method for analyzing wafer unit devices according to claim 1, characterized in that: The analysis method further comprises: Determine the columns where the X coordinates and Y coordinates are located in the original test data file; The maximum and minimum values ​​of the X and Y coordinates are calculated to determine the boundaries of the wafer.

4. The method for analyzing wafer unit devices according to claim 3, characterized in that: The analysis method further comprises: Calculating the number of unit devices that need to be excluded based on the boundary requirements and unit device sizes of the specific area; Based on the number of unit devices to be excluded, the maximum and minimum values ​​of the X coordinate and the Y coordinate of the boundary of the specific area are calculated to determine the boundary of the specific area.

5. The method for analyzing wafer unit devices according to claim 4, characterized in that: Determining the position coordinates of each boundary unit device in the specific area includes: Based on the boundary shape of the specific area, establishing a functional relationship between the X coordinate and the Y coordinate of the boundary shape; Determine the X coordinate of each boundary unit device in the specific area based on the maximum value and the minimum value of the X coordinate of the boundary of the specific area; Based on the functional relationship and the X coordinate of the boundary cell device, the Y coordinate of the boundary cell device is calculated.

6. The method for analyzing wafer unit devices according to claim 5, characterized in that: Filtering out unit device data located in the specific area from the original test data file includes: Based on the X coordinate and the Y coordinate of the boundary unit device, filter out the unit device data outside the boundary unit device; or Based on the X-coordinate and the Y-coordinate of the boundary unit device, the unit device data inside the boundary unit device is filtered.

7. The method for analyzing wafer unit devices according to claim 1, characterized in that: The method further comprises: Based on the new data file, the unit devices on the wafer to be analyzed are sorted.

8. An analysis device for wafer unit devices, characterized in that: include: An acquisition module, used to acquire information data of the wafer to be analyzed and its specific area, wherein the information data includes wafer size, unit device size and boundary requirements of the specific area; A calculation module, used for determining the position coordinates of each boundary unit device in the specific area based on the original test data file of the wafer to be analyzed and the boundary requirements of the specific area; A screening module, configured to screen out unit device data located in the specific area from the original test data file based on the position coordinates of the boundary unit device, and save the screened unit device data as a new data file; The analysis module is used to analyze the performance indicators of the unit devices in the specific area and save the analysis results into the new data file.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the wafer unit device analysis method according to any one of claims 1 to 7 is implemented.

10. A computer-readable medium, characterized in that The computer-readable medium carries computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement the analysis method for wafer unit devices according to any one of claims 1 to 7.

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