Memory with data processing function

Abstract

The invention relates to the technical field of memories, and discloses a memory with a data processing function, which comprises a PCB (printed circuit board), a packaging shell is mounted at the top of the PCB, a device body is arranged in the packaging shell, pins are fixedly arranged on the left side and the right side of the device body, a heat conduction column is in threaded connection with the center of the bottom of the packaging shell, and the heat conduction column is in threaded connection with the PCB. And a heat-conducting silica gel layer is arranged at the top end of the heat-conducting column. According to the memory with the data processing function, the cooling fins, the rotary buttons, the semicircular clamping blocks and the top plate are arranged, the cooling fins are installed below the PCB, and heat conduction columns on the cooling fins extend upwards to make contact with the bottom of the device body, so that heat generated by operation of the device body can be conducted, and heat generated by the device body can be transmitted by twisting the four rotary buttons on the top plate; and the four semicircular clamping blocks are moved out of the four semicircular clamping grooves in the inner side wall of the packaging shell respectively, so that the top plate can be detached, and heat dissipation and maintenance operation of the memory are facilitated.

Description

Technical Field

[0001] The present invention relates to the field of memory technology, and in particular to a memory with a data processing function. Background Art

[0002] The memory unit is actually a kind of sequential logic circuit. According to the usage type of memory, it can be divided into read-only memory (ROM) and random access memory (RAM). The functions of the two are quite different, so the descriptions are also different. At present, the heat dissipation of the memory is to install a heat sink on the memory. This method will increase the volume of the memory on the PCB board, and when the memory is repaired, the heat sink needs to be removed first, and then the memory shell is disassembled. The operation is not convenient, which affects the maintenance and heat dissipation of the memory. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] In view of the deficiencies in the prior art, the present invention provides a memory with a data processing function, which has the advantages of good thermal conductivity and heat dissipation effect and is easy to disassemble and overhaul. It solves the problem that the heat dissipation of the current memory is to add a heat sink to the memory. This method will increase the volume of the memory on the PCB board, and when the memory is overhauled, the heat sink needs to be removed first, and then the outer shell of the memory is disassembled, which is inconvenient to operate and affects the overhaul and heat dissipation of the memory.

[0005] (II) Technical solution

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a memory with data processing function, comprising a PCB board, a packaging shell is installed on the top of the PCB board, a device body is arranged inside the packaging shell, pins are fixedly arranged on the left and right sides of the device body, a heat-conducting column is threadedly connected to the center of the bottom of the packaging shell, a heat-conducting silicone layer is arranged on the top of the heat-conducting column, the top of the heat-conducting column is abutted against the bottom of the device body, a heat sink is fixedly connected to the bottom of the heat sink, the top of the heat sink is movably connected to the bottom of the PCB board, a top plate is arranged on the top of the packaging shell, four corners of the top of the top plate are rotatably connected to knobs, a semicircular card block is fixedly connected to the lower surface of the knob, and the side of the semicircular card block away from the knob is movably plugged into the inner side wall of the packaging shell.

[0007] Preferably, welding pads are fixedly provided on the left and right sides of the top of the PCB board, and the other ends of the two pins are respectively welded to the surfaces of the two welding pads, and the device body is welded to the two welding pads on the PCB board through the pins on both sides, so that the device body is connected to the PCB board circuit.

[0008] Preferably, a through hole is opened on the top of the PCB board, and the side surface of the thermally conductive column is rotatably connected to the inside of the through hole. The thermally conductive column rotates forward or reversely in the through hole, which facilitates the installation and removal of the heat sink under the PCB board.

[0009] Preferably, a threaded groove is provided at the bottom of the packaging shell, and the threaded groove is connected to the inner bottom wall of the packaging shell. A thread is provided on the upper surface of the thermally conductive column, and the upper surface of the thermally conductive column is connected to the internal thread of the threaded groove. After the upper surface of the thermally conductive column is connected to the inner thread of the threaded groove at the bottom of the packaging shell, the top of the thermally conductive column is coated with thermal conductive silicone grease, which can transfer the heat generated by the operation of the device to the thermally conductive column and finally to the heat sink under the PCB board, thereby facilitating the heat dissipation of the memory.

[0010] Preferably, a semicircular card slot is provided on the inner side wall of the packaging shell, and one side of the semicircular card block is matched with the inside of the semicircular card slot. The top plate on the packaging shell is installed and fixed by the semicircular card block cooperating with the card slot on the inner wall of the packaging shell. By twisting the four knobs on the top plate, the four semicircular card blocks are respectively rotated out of the four card slots, and the top plate on the packaging shell can be removed, thereby facilitating the maintenance operation of the device body inside the shell.

[0011] Compared with the prior art, the present invention provides a memory with data processing function, which has the following beneficial effects:

[0012] 1. The memory with data processing function is provided with a heat sink, a knob, a semicircular card block and a top plate. The heat sink is installed below the PCB board. The heat-conducting columns on the heat sink extend upward to contact the bottom of the device body, so that the heat generated by the operation of the device body can be conducted. By twisting the four knobs on the top plate, the four semicircular card blocks are respectively moved out of the four semicircular card slots on the inner side wall of the packaging shell, and the top plate can be disassembled, thereby facilitating the heat dissipation and maintenance operations of the memory.

[0013] 2. The memory with data processing function is provided with a heat-conducting column, and the upper surface of the heat-conducting column is provided with a thread. The upper surface of the heat-conducting column cooperates with the inner thread of the thread groove at the bottom of the packaging shell, so that the heat sink is fixedly installed under the PCB board. When the thermal grease on the heat-conducting column is consumed, the heat sink under the PCB board can be rotated to unscrew the heat-conducting column from under the packaging shell, which is convenient for adding a heat-conducting silicone layer on the top of the heat-conducting column, thereby facilitating the heat conduction and heat dissipation operation of the memory. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a cross-sectional view of the structure of the present invention;

[0015] Figure 2 For the present invention Figure 1 A magnified view of the structure at center;

[0016] Figure 3 This is a top view of the semicircular block structure of the present invention;

[0017] Figure 4 It is a top view of the structure of the present invention.

[0018] Among them: 1. PCB board; 2. packaging shell; 3. device body; 4. pins; 5. thermal conductive column; 6. thermal conductive silicone layer; 7. heat sink; 8. knob; 9. semicircular block; 10. welding plate; 11. through hole; 12. semicircular slot; 13. top plate. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1-4A memory with data processing function includes a PCB board 1, a packaging shell 2 is installed on the top of the PCB board 1, a device body 3 is arranged inside the packaging shell 2, the device body 3 has the characteristic of controllable liquid flow, and the splashing phenomenon of the liquid can be reduced by reducing the liquid flow speed, pins 4 are fixedly arranged on the left and right sides of the device body 3, welding pads 10 are fixedly arranged on the left and right sides of the top of the PCB board 1, and the other ends of the two pins 4 are respectively welded to the surfaces of the two welding pads 10, a heat-conducting column 5 is threadedly connected at the center of the bottom of the packaging shell 2, and a threaded groove is opened at the bottom of the packaging shell 2, The thread groove is communicated with the inner bottom wall of the packaging shell 2, and a thread is provided on the upper surface of the heat-conducting column 5. The upper surface of the heat-conducting column 5 is connected with the internal thread of the thread groove. A heat-conducting silicone layer 6 is provided on the top of the heat-conducting column 5. The top of the heat-conducting column 5 is abutted against the bottom of the device body 3. The heat-conducting column 5 is arranged, and a thread is provided on the upper surface of the heat-conducting column 5. The heat sink 7 is fixedly installed under the PCB board 1 through the cooperation between the upper surface of the heat-conducting column 5 and the inner thread of the thread groove at the bottom of the packaging shell 2. When the thermal grease on the heat-conducting column 5 is consumed, the heat-conducting column 5 can be screwed out from under the packaging shell 2 by rotating the heat sink 7 under the PCB board 1. , which is convenient for adding the thermal conductive silicone layer 6 at the top of the thermal conductive column 5, thereby facilitating the thermal conduction and heat dissipation operation of the memory. A through hole 11 is provided on the top of the PCB board 1. The side surface of the thermal conductive column 5 is rotatably connected to the inside of the through hole 11. The bottom end of the thermal conductive column 5 is fixedly connected with a heat sink 7. The top of the heat sink 7 is movably connected to the bottom of the PCB board 1. A top plate 13 is provided on the top of the packaging shell 2. The four corners of the top of the top plate 13 are rotatably connected with knobs 8. The lower surface of the knob 8 is fixedly connected with a semicircular card block 9. The side of the semicircular card block 9 away from the knob 8 is movably plugged into the inner side wall of the packaging shell 2. The packaging shell 2 A semicircular card slot 12 is provided on the inner side wall, one side of the semicircular card block 9 is matched with the inside of the semicircular card slot 12, and a heat sink 7, a knob 8, a semicircular card block 9 and a top plate 13 are provided. The heat sink 7 is installed below the PCB board 1, and the heat-conducting column 5 on the heat sink 7 extends upward to contact the bottom of the device body 3, so that the heat generated by the operation of the device body 3 can be conducted, and by twisting the four knobs 8 on the top plate 13, the four semicircular card blocks 9 are respectively moved out of the four semicircular card slots 12 on the inner side wall of the packaging shell 2, and the top plate 13 can be disassembled, thereby facilitating the heat dissipation and maintenance operations of the memory.

[0021] When in use, the heat sink 7 is installed below the PCB board 1, and the heat-conducting column 5 on the heat sink 7 extends upward to contact the bottom of the device body 3, so that the heat generated by the operation of the device body 3 can be conducted. When the thermal grease on the heat-conducting column 5 is consumed, the heat sink 7 under the PCB board 1 can be rotated to unscrew the heat-conducting column 5 from the bottom of the package shell 2, which is convenient for adding the heat-conducting silicone layer 6 on the top of the heat-conducting column 5; by twisting the four knobs 8 on the top plate 13, the four semicircular card blocks 9 are respectively moved out of the four semicircular card grooves 12 on the inner wall of the package shell 2, and the top plate 13 can be disassembled, which is convenient for disassembly and maintenance of the memory. In the memory with data processing function, the heat sink 7 is installed below the PCB board 1, replacing the method of installing the heat sink 7 above the memory, reducing the volume of the memory on the PCB board 1, and the disassembly operation of the memory is simple, thereby facilitating the maintenance and heat dissipation of the memory.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A memory with data processing function, comprising a PCB board (1), characterized in that: A packaging shell (2) is installed on the top of the PCB board (1), a device body (3) is arranged inside the packaging shell (2), pins (4) are fixedly arranged on the left and right sides of the device body (3), a heat-conducting column (5) is threadedly connected at the center of the bottom of the packaging shell (2), a heat-conducting silica gel layer (6) is arranged on the top of the heat-conducting column (5), the top of the heat-conducting column (5) is abutted against the bottom of the device body (3), the bottom of the heat-conducting column (5) is fixedly connected to a heat sink (7), and the top of the heat sink (7) is in contact with the PCB board ( 1), the top of the packaging shell (2) is provided with a top plate (13), the four corners of the top of the top plate (13) are rotatably connected to knobs (8), the lower surface of the knob (8) is fixedly connected to a semicircular clamping block (9), the side of the semicircular clamping block (9) away from the knob (8) is movably plugged into the inner side wall of the packaging shell (2), the left and right sides of the top of the PCB board (1) are fixedly provided with welding pads (10), and the other ends of the two pins (4) are respectively welded to the surfaces of the two welding pads (10).

2. A memory with data processing function according to claim 1, characterized in that: A through hole (11) is provided on the top of the PCB board (1), and the side surface of the heat-conducting column (5) is rotatably connected to the inside of the through hole (11).

3. The memory with data processing function according to claim 1, characterized in that: The bottom of the packaging shell (2) is provided with a thread groove, which is communicated with the inner bottom wall of the packaging shell (2); the upper surface of the heat-conducting column (5) is provided with a thread, and the upper surface of the heat-conducting column (5) is connected with the internal thread of the thread groove.

4. The memory with data processing function according to claim 1, characterized in that: The inner side wall of the packaging shell (2) is provided with a semicircular card slot (12), and one side of the semicircular card block (9) is adapted to the interior of the semicircular card slot (12).

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