Semiconductor product production data collection method and collection device

Abstract

The invention provides a method and a device for collecting production data of semiconductor products. The method and the device are applied to a statistical process control system for semiconductor production. The method comprises the following steps: when a semiconductor product arrives at any processing site in a production line, obtaining process information of the semiconductor product; querying whether an effective control item exists in a measurement station corresponding to the processing station or not according to the processing information; if yes, the semiconductor product is controlled to enter the processing station for product processing; the processed semiconductor product is controlled to enter a measurement station corresponding to the processing station, and data collection is carried out according to the effective management and control item; after data collection is completed, the failure time of the effective management and control items is reset; and controlling the semiconductor product to go to a next processing station in the production line or complete processing. Therefore, by setting the management and control items, the time interval of data collection can be effectively managed and controlled, so that problems in semiconductor production can be found in time, and the production efficiency is ensured.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a method and device for collecting production data of semiconductor products. Background Art

[0002] In the industrial production of semiconductor manufacturing, in order to control the quality of semiconductor products, it is necessary to collect production data for analysis. However, the semiconductor production process is complex and involves a large number of rules. The existing technology lacks control over data collection, resulting in long intervals between production data collection, poor timeliness, and failure to promptly reflect production problems. Summary of the invention

[0003] In view of this, the purpose of this application is to provide a method and device for collecting semiconductor product production data. By setting control items, the time interval for data collection can be effectively controlled, so as to timely discover problems in semiconductor production and ensure production efficiency.

[0004] The present application provides a method for collecting semiconductor product production data, which is applied to a statistical process control system for semiconductor production. The method includes:

[0005] When a semiconductor product arrives at any processing station in the production line, process information of the semiconductor product is obtained;

[0006] According to the process information, query whether there is a valid control item in the measurement site corresponding to the processing site;

[0007] If so, controlling the semiconductor product to enter the processing site for product processing;

[0008] Controlling the semiconductor product after processing to enter the measurement site corresponding to the processing site, and collecting data according to the effective control items;

[0009] After data collection is completed, the expiration time of the effective control item is reset; and the semiconductor product is controlled to go to the next processing station in the production line or complete processing.

[0010] Furthermore, the statistical process control system provides a user graphical interface through a terminal device; the user graphical interface displays a control item configuration interface; the collection method also includes configuring the control items of the measurement site in the following manner:

[0011] In response to a configuration operation on the control item configuration interface, determining a control parameter;

[0012] Generate a control item to be released according to the control parameters;

[0013] In response to a publishing operation on the to-be-published control item, a control item that has been published by the measurement site is generated.

[0014] Further, the determining of the control parameters in response to the configuration operation on the control item configuration interface includes:

[0015] In response to a first configuration operation on the control item configuration interface, a control object is determined; wherein the control object includes at least one of the following items: a process machine, a process sub-machine, and a process recipe;

[0016] In response to a second configuration operation on the control item configuration interface, determining a control time limit;

[0017] In response to a third configuration operation on the control item configuration interface, a data collection item associated with the control item is determined.

[0018] Further, the process information includes the current process recipe and the current machine and the current sub-machine corresponding to the current process recipe; querying whether there is a valid control item in the measurement site corresponding to the processing site according to the process information includes:

[0019] According to the process information, query the control items published in the measurement site corresponding to the processing site to determine the candidate control items;

[0020] Determine whether the current time exceeds the expiration time of the candidate control item;

[0021] If the expiration time of the candidate control item has not been exceeded, the candidate control item is determined as the current valid control item.

[0022] Furthermore, after data collection is completed, the expiration time of the effective control item is reset, including:

[0023] The expiration time of the valid control item is re-determined based on the control time limit and the current time.

[0024] Furthermore, the collection method includes:

[0025] If the expiration time of the candidate control item has been exceeded, the semiconductor product is prohibited from entering the processing site for product processing, and relevant personnel are notified.

[0026] Furthermore, the collection method further comprises:

[0027] When used for quality control of product wafers on a production line, the quality of the product wafers is evaluated based on the production data of the collected semiconductor product wafers;

[0028] When used to monitor the status of a machine, the operating status of the machine is evaluated based on the collected production data of non-product semiconductor wafers;

[0029] When used for factory monitoring, the factory production environment is evaluated based on the collected production data of semiconductor products.

[0030] Furthermore, the collection method further comprises:

[0031] In response to a cancel operation on the published control item, adjusting the state of the published control item of the measurement site to a pending release state;

[0032] In response to a modification operation on the control item configuration interface, the control parameters of the control item in a to-be-released state are modified.

[0033] The embodiment of the present application further provides a device for collecting semiconductor product production data, the device for collecting data is applied to a statistical process control system for semiconductor production, and the device for collecting data includes:

[0034] An acquisition module, used to acquire process information of a semiconductor product when the semiconductor product arrives at any processing station in the production line;

[0035] A query module, used to query whether there is a valid control item currently in the measurement site corresponding to the processing site according to the process information;

[0036] A control module, for controlling the semiconductor product to enter the processing site for product processing, if any;

[0037] A collection module, used to control the semiconductor product after processing to enter a measurement site corresponding to the processing site, and collect data according to the effective control items;

[0038] A reset module, used to reset the expiration time of the effective control item after data collection is completed;

[0039] The control module is also used to control the semiconductor product to go to the next processing station in the production line or complete processing.

[0040] An embodiment of the present application also provides an electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate via the bus, and when the machine-readable instructions are executed by the processor, the steps of the method for collecting semiconductor product production data as described above are performed.

[0041] An embodiment of the present application further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the method for collecting semiconductor product production data as described above are executed.

[0042] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A flowchart showing a method for collecting semiconductor product production data provided by an embodiment of the present application is shown;

[0045] Figure 2 A schematic diagram showing the structure of a device for collecting semiconductor product production data provided by an embodiment of the present application is shown;

[0046] Figure 3 A schematic structural diagram of an electronic device provided in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0047] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, each other embodiment obtained by those skilled in the art without making creative work belongs to the scope of protection of the present application.

[0048] Research has found that in the industrial production of the semiconductor manufacturing industry, in order to control the quality of semiconductor products, it is necessary to collect production data for analysis. However, the semiconductor production process is complex and involves a large number of rules. The existing technology lacks control over data collection, resulting in long intervals between production data collection, poor timeliness, and failure to promptly reflect production problems.

[0049] Based on this, an embodiment of the present application provides a method for collecting semiconductor product production data, so as to effectively control the time interval for data collection through the set control items, so as to timely discover problems in semiconductor production and ensure production efficiency.

[0050] See also Figure 1 , Figure 1 This is a flow chart of a method for collecting semiconductor product production data provided in an embodiment of the present application. The collection method provided in an embodiment of the present application is applied to a statistical process control system (SPC) for semiconductor production. Figure 1 As shown in , the collection method includes:

[0051] S101. When a semiconductor product arrives at any processing station in a production line, process information of the semiconductor product is obtained.

[0052] For ease of understanding, the semiconductor production scenario in the embodiment of the present application is first introduced. In the semiconductor manufacturing process, the production line process usually includes multiple processing sites and measurement sites. The settings and monitoring processes between these sites are crucial to ensuring product quality and production efficiency. Among them, the processing site is used to perform specific processing operations, such as etching, deposition, lithography, etc.; the measurement site is used to measure key parameters of semiconductor production, such as size, thickness, etc. The processing site and the measurement site are set at intervals, and generally a corresponding measurement site is set after the processing site.

[0053] For example, a production line is: processing site 1-measurement site 1-processing site 2-measurement site 2-processing site 3-measurement site 3....... Semiconductor products flow on the production line, and the processing operations are performed in sequence to obtain the final product. At the same time, in order to ensure product quality, a monitoring process will be set up for the production line. Each monitoring process includes a section of processing sites and measurement sites. For example, monitoring process 1 is processing site 1-measurement site 1. Monitoring process 2 is processing site 2-measurement site 2.

[0054] In this step, when a batch of semiconductor products flows to any processing station in the production line, specifically when the semiconductor products are tracked in the processing station, the process information of this batch of semiconductor products can be obtained. For example, it can be read from the statistical process control system, MES system and other intelligent manufacturing systems according to the batch number.

[0055] The process information includes the current process recipe and the current equipment and sub-equipment corresponding to the current process recipe. A recipe refers to a process recipe in the semiconductor manufacturing process, which is a set of parameters and instructions used to guide the equipment to perform specific process steps; an equipment refers to a device used to perform specific process steps in the semiconductor manufacturing process; a sub-equipment refers to a subsystem or module inside the equipment, which is responsible for performing specific subtasks or functions, and is usually a part of the equipment.

[0056] S102, querying whether there is currently any valid control item in the measurement site corresponding to the processing site according to the process information.

[0057] In this step, the process information is used to query the statistical process control system to see whether there are valid control items in the measurement site corresponding to the current processing site. Valid control items are control items that have been released and have not exceeded the expiration time. Control items are used to control the process of collecting semiconductor product production data.

[0058] Therefore, in order to realize the production data collection, it is necessary to pre-create the Inhibit control item. The specific method of configuring the control item of the measurement site in the embodiment of the present application is described below.

[0059] In an embodiment of the present application, the statistical process control system provides a user graphical interface through a terminal device; the user graphical interface displays a control item configuration interface; then the collection method further includes configuring the control items of the measurement site in the following manner:

[0060] In response to a configuration operation on the control item configuration interface, control parameters are determined; control items to be released are generated according to the control parameters; and in response to a release operation on the control items to be released, control items released by the measurement site are generated.

[0061] Here, the control item configuration interface displays configurable parameter items and release options, which are in the form of controls; in the solution provided in the present application, configuration operations and release operations can be generated by triggering controls; specifically, controls can be triggered by fingers, mice, and\or preset combination keys, etc.; controls can also be triggered by keys such as the ctrl key, alt key, a key, etc. on the keyboard, and the preset keys can be manually set according to needs; or, controls can be triggered by voice control or preset trigger actions.

[0062] After configuring the control parameters, generate the control items in the pending release state; then, use the Approve release operation to release the control items to the corresponding measurement sites. Only control items in the released state can take effect.

[0063] The control parameters can be configured in the following ways:

[0064] In response to a first configuration operation on the control item configuration interface, a control object is determined; wherein the control object includes at least one of the following items: a process machine, a process sub-machine and a process recipe; in response to a second configuration operation on the control item configuration interface, a control period is determined; in response to a third configuration operation on the control item configuration interface, a data collection item associated with the control item is determined.

[0065] In the solution provided by this application, to create a control item, you first need to select the control object, which includes process machines, process sub-machines and process recipes; the three can be selected individually (individual control) or in combination (combined control); set the control time limit (in hours); select the data collection item (Spec) associated with the control item. After that, the expiration time of the control item can be calculated based on the current time and the set control time limit.

[0066] Accordingly, step S102 may include:

[0067] According to the process information, the control items published in the measurement site corresponding to the processing site are queried to determine the candidate control items; it is determined whether the current time exceeds the expiration time of the candidate control item; if it does not exceed the expiration time of the candidate control item, the candidate control item is determined as the current valid control item.

[0068] Here, when the production line is processing, it will first query whether there is a published control item in the measurement site corresponding to the processing site according to the machine name / sub-machine name / recipe name; if the corresponding published control item is found, it will be used as a candidate control item; and then it will be determined whether the current time exceeds the expiration time of the candidate control item. If it exceeds, the candidate control item will be determined as the current valid control item.

[0069] Furthermore, the collection method also includes:

[0070] In response to a cancel operation on the published control item, the state of the control item published by the measurement site is adjusted to a pending release state; in response to a modification operation on the control item configuration interface, the control parameters of the control item in the pending release state are modified.

[0071] Here, if you need to modify a control item that has been released, you must first UN-Approve the control item to cancel it, that is, make the control item no longer effective. Only then can you modify the parameters of the control item again through the control item configuration interface. After the modification is completed, Approve it again to make the control item effective.

[0072] S103. If yes, control the semiconductor product to enter the processing site for product processing.

[0073] In this step, if there are currently valid control items, the semiconductor products are controlled to enter the processing site and the machines and equipment are used to process the products.

[0074] S104, controlling the semiconductor product after processing to enter the measurement site corresponding to the processing site, and collecting data according to the effective control items.

[0075] In this step, after the processing is completed, the semiconductor product enters the measurement site after the processing site for data measurement. The measurement site will collect data according to each data collection item associated with the current effective control item, that is, collect the production data of the semiconductor product.

[0076] S105. After data collection is completed, the expiration time of the effective control item is reset; and the semiconductor product is controlled to go to the next processing station in the production line or complete processing.

[0077] In this step, after data collection is completed, the expiration time of the effective control item can be re-determined based on the control time limit and the current time to ensure that in the next time period, when the next batch of semiconductor products arrives at the processing site in the production line, the control item is still valid and data collection for the next time period is carried out.

[0078] At the same time, determine whether the processing site is the last processing site set in the process information of the current batch of semiconductor products; if so, complete the processing; if not, control the current batch of semiconductor products to go to the next processing site in the production line set in the process information, and return to execute S101.

[0079] Furthermore, the collection method also includes:

[0080] If the expiration time of the candidate control item has been exceeded, the semiconductor product is prohibited from entering the processing site for product processing, and relevant personnel are notified.

[0081] Here, the control item controls the monitoring time interval during the production process of the production line; if the expiration time of the candidate control item has been exceeded, it means that a measurement site has exceeded the set time but has not performed data monitoring and measurement. In this case, the semiconductor products to be produced cannot enter the processing site for processing, and relevant staff need to be contacted for processing to promptly confirm whether there are problems in semiconductor production.

[0082] Furthermore, the collection method also includes:

[0083] When used for quality control of product wafers on the production line, that is, when real-time data is collected on the production line InLine, the quality of the product wafers is evaluated based on the collected production data of the semiconductor product wafers. At this time, the data collection object is the wafer in the LOT of the production line, and the wafer is measured at the measurement station, and the quality of the wafer is judged by the collected wafer data.

[0084] When used to monitor the EQP status of equipment, EQP monitoring also measures wafers, but unlike INLINE, this process reflects the status of equipment through the collected wafer data, that is, the operating status of equipment is evaluated based on the collected production data of semiconductor non-product wafers. EQP monitoring and INLINE are performed simultaneously during the semiconductor manufacturing process.

[0085] When used for facility monitoring, the facility production environment, such as temperature and humidity in the factory, is evaluated based on the collected production data of semiconductor products, specifically the facility data during production.

[0086] Furthermore, the statistical process control system also provides a separate interface for querying all control items, and provides parameters such as machines, sub-machines, recipes, data collection items, etc. as screening conditions, which can easily view the control items set by users.

[0087] A method for collecting semiconductor product production data provided in an embodiment of the present application is applied to a statistical process control system for semiconductor production: when a semiconductor product arrives at any processing station in the production line, the process information of the semiconductor product is obtained; based on the process information, it is queried whether there is currently a valid control item in the measurement station corresponding to the processing station; if so, the semiconductor product is controlled to enter the processing station for product processing; the semiconductor product after processing is controlled to enter the measurement station corresponding to the processing station, and data is collected according to the valid control items; after data collection is completed, the expiration time of the valid control items is reset; and the semiconductor product is controlled to go to the next processing station in the production line or complete processing.

[0088] In this way, by setting control items, the time interval for data collection can be effectively controlled, problems in semiconductor production can be discovered in a timely manner, and production efficiency can be guaranteed. Specifically, product processing and data collection are allowed only when there are valid control items in the measurement site, and the expiration time of the valid control items is reset after the collection is completed, so as to avoid the time interval between two data collections being too long, resulting in the failure to respond to production problems in a timely manner.

[0089] See also Figure 2 , Figure 2The structure diagram of a device for collecting semiconductor product production data provided in an embodiment of the present application is shown in FIG. The device 200 is applied to a statistical process control system for semiconductor production, such as Figure 2 As shown in , the collecting device 200 comprises:

[0090] An acquisition module 210 is used to acquire process information of a semiconductor product when the semiconductor product arrives at any processing station in the production line;

[0091] A query module 220, for querying whether there is a valid control item in the measurement site corresponding to the processing site according to the process information;

[0092] A control module 230, for controlling the semiconductor product to enter the processing site for product processing, if any;

[0093] A collection module 240 is used to control the semiconductor product after processing to enter a measurement site corresponding to the processing site, and collect data according to the effective control items;

[0094] A reset module 250, configured to reset the expiration time of the effective control item after data collection is completed;

[0095] The control module 230 is also used to control the semiconductor product to go to the next processing station in the production line or complete processing.

[0096] Furthermore, the statistical process control system provides a user graphical interface through a terminal device; the user graphical interface displays a control item configuration interface; the collection device 200 also includes a configuration module, which is used to configure the control items of the measurement site in the following manner:

[0097] In response to a configuration operation on the control item configuration interface, determining a control parameter;

[0098] Generate a control item to be released according to the control parameters;

[0099] In response to a publishing operation on the to-be-published control item, a control item that has been published by the measurement site is generated.

[0100] Further, when the configuration module is used to determine the control parameters in response to the configuration operation on the control item configuration interface, the configuration module is used to:

[0101] In response to a first configuration operation on the control item configuration interface, a control object is determined; wherein the control object includes at least one of the following items: a process machine, a process sub-machine, and a process recipe;

[0102] In response to a second configuration operation on the control item configuration interface, determining a control time limit;

[0103] In response to a third configuration operation on the control item configuration interface, a data collection item associated with the control item is determined.

[0104] Further, the process information includes the current process recipe and the current machine and the current sub-machine corresponding to the current process recipe; when the query module 220 is used to query whether there is a valid control item in the measurement site corresponding to the processing site according to the process information, the query module 220 is used to:

[0105] According to the process information, query the control items published in the measurement site corresponding to the processing site to determine the candidate control items;

[0106] Determine whether the current time exceeds the expiration time of the candidate control item;

[0107] If the expiration time of the candidate control item has not been exceeded, the candidate control item is determined as the current valid control item.

[0108] Further, when the reset module 250 is used to reset the expiration time of the valid control item after data collection is completed, the reset module 250 is used to:

[0109] The expiration time of the valid control item is re-determined based on the control time limit and the current time.

[0110] Furthermore, the control module 230 is also used to: if the expiration time of the candidate control item has been exceeded, prohibit the semiconductor product from entering the processing site for product processing, and notify relevant personnel.

[0111] Furthermore, the collection device 200 further includes an evaluation module; the evaluation module is used to:

[0112] When used for quality control of product wafers on a production line, the quality of the product wafers is evaluated based on the production data of the collected semiconductor product wafers;

[0113] When used to monitor the status of a machine, the operating status of the machine is evaluated based on the collected production data of non-product semiconductor wafers;

[0114] When used for factory monitoring, the factory production environment is evaluated based on the collected production data of semiconductor products.

[0115] See also Figure 3 , Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 3As shown in , the electronic device 300 includes a processor 310 , a memory 320 and a bus 330 .

[0116] The memory 320 stores machine-readable instructions executable by the processor 310. When the electronic device 300 is running, the processor 310 communicates with the memory 320 via the bus 330. When the machine-readable instructions are executed by the processor 310, the above-mentioned Figure 1 The steps of the method for collecting semiconductor product production data in the method embodiment shown in the embodiment and the specific implementation thereof can be found in the method embodiment, which will not be described in detail here.

[0117] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the computer program can execute the above-mentioned Figure 1 The steps of the method for collecting semiconductor product production data in the method embodiment shown in the embodiment and the specific implementation thereof can be found in the method embodiment, which will not be described in detail here.

[0118] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0119] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0120] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0121] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0122] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application can essentially be embodied in the form of a software product, or in other words, the part that contributes to the prior art or the part of the technical solution. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0123] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-mentioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-mentioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for collecting semiconductor product production data, characterized in that: The collection method is applied to a statistical process control system for semiconductor production, and the collection method comprises: When a semiconductor product arrives at any processing station in the production line, process information of the semiconductor product is obtained; According to the process information, query whether there is a valid control item in the measurement site corresponding to the processing site; If so, controlling the semiconductor product to enter the processing site for product processing; Controlling the semiconductor product after processing to enter the measurement site corresponding to the processing site, and collecting data according to the effective control items; After data collection is completed, the expiration time of the effective control item is reset; and the semiconductor product is controlled to go to the next processing station in the production line or complete processing.

2. The collection method according to claim 1, characterized in that: The statistical process control system provides a user graphical interface through a terminal device; the user graphical interface displays a control item configuration interface; the collection method also includes configuring the control items of the measurement site in the following manner: In response to a configuration operation on the control item configuration interface, determining a control parameter; Generate a control item to be released according to the control parameters; In response to a publishing operation on the to-be-published control item, a control item that has been published by the measurement site is generated.

3. The collection method according to claim 2, characterized in that: The determining of the control parameters in response to the configuration operation on the control item configuration interface includes: In response to a first configuration operation on the control item configuration interface, a control object is determined; wherein the control object includes at least one of the following items: a process machine, a process sub-machine, and a process recipe; In response to a second configuration operation on the control item configuration interface, determining a control time limit; In response to a third configuration operation on the control item configuration interface, a data collection item associated with the control item is determined.

4. The collection method according to claim 3, characterized in that: The process information includes the current process recipe and the current machine and the current sub-machine corresponding to the current process recipe; According to the process information, query whether there is a valid control item in the measurement site corresponding to the processing site, including: According to the process information, query the control items published in the measurement site corresponding to the processing site to determine the candidate control items; Determine whether the current time exceeds the expiration time of the candidate control item; If the expiration time of the candidate control item has not been exceeded, the candidate control item is determined as the current valid control item.

5. The collection method according to claim 4, characterized in that: After data collection is completed, the expiration time of the effective control items is reset, including: The expiration time of the valid control item is re-determined based on the control time limit and the current time.

6. The collection method according to claim 4, characterized in that: The collection method includes: If the expiration time of the candidate control item has been exceeded, the semiconductor product is prohibited from entering the processing site for product processing, and relevant personnel are notified.

7. The collection method according to claim 1, characterized in that: The collection method further comprises: When used for quality control of product wafers on a production line, the quality of the product wafers is evaluated based on the production data of the collected semiconductor product wafers; When used to monitor the status of a machine, the operating status of the machine is evaluated based on the collected production data of non-product semiconductor wafers; When used for factory monitoring, the factory production environment is evaluated based on the collected production data of semiconductor products.

8. The collection method according to claim 2, characterized in that: The collection method further comprises: In response to a cancel operation on the published control item, adjusting the state of the published control item of the measurement site to a pending release state; In response to a modification operation on the control item configuration interface, the control parameters of the control item in a to-be-released state are modified.

9. A device for collecting semiconductor product production data, characterized in that: The collection device is applied to a statistical process control system for semiconductor production, and the collection device comprises: An acquisition module, used to acquire process information of a semiconductor product when the semiconductor product arrives at any processing station in the production line; A query module, used to query whether there is a valid control item in the measurement site corresponding to the processing site according to the process information; A control module, for controlling the semiconductor product to enter the processing site for product processing, if any; A collection module, used to control the semiconductor product after processing to enter a measurement site corresponding to the processing site, and collect data according to the effective control items; A reset module, used to reset the expiration time of the effective control item after data collection is completed; The control module is also used to control the semiconductor product to go to the next processing station in the production line or complete processing.

10. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and the machine-readable instructions are executed by the processor to execute the steps of the method for collecting semiconductor product production data as described in any one of claims 1 to 8.

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