Cleaning structure for wafer scribing

Abstract

The invention discloses a cleaning structure for wafer scribing, and relates to the technical field of wafer processing, the cleaning structure comprises a mounting box, the mounting box is internally provided with a cleaning cavity, the cleaning cavity is internally and vertically provided with a separator in a sliding manner, the separator divides the cleaning cavity into a cleaning area and a preparation area, one side of the mounting box is provided with a feed inlet, and the feed inlet is communicated with the cleaning area of the cleaning cavity; according to the invention, the cleaning liquid is in contact with organic matters and metal ions on the wafer so as to be separated from the wafer, and the started ultrasonic generator performs ultrasonic cleaning on the cleaning liquid in the cleaning cavity and the wafer, so that dust, metal ions and organic matter residues are loosened from the wafer and are separated from the wafer; the cleaning cylinder and a bristle layer arranged outside the cleaning cylinder are used for brushing the surface of the wafer, so that stubborn pollutants are brushed, and the cleaning effect of the wafer is improved again; after the wafer is cleaned, cleaning liquid and other waste in the cleaning area of the cleaning cavity are discharged together through the liquid discharging faucet, automatic cleaning is achieved, and simplicity and high efficiency are achieved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, in particular to a cleaning structure for wafer dicing. Background Art

[0002] Wafer, also known as silicon chip, is the core component of semiconductor integrated circuit manufacturing. It is made of high-purity silicon material through a series of complex processes and is round in shape, hence the name. Wafer is the basic material for manufacturing integrated circuits such as microelectronic devices, transistors, field effect transistors, and its application fields are very wide.

[0003] During the manufacturing process, the wafer goes through multiple steps such as silicon ingot growth, cutting, rough and fine grinding, cleaning, circuit making, coating and packaging, and finally becomes a high-quality material that can be used for integrated circuit manufacturing. The diameter of the wafer has various specifications, such as 4 inches, 6 inches, 8 inches, etc. In recent years, 12-inch and even larger wafers have been developed. The larger the wafer, the more integrated circuits can be produced on the same wafer, which helps to reduce costs, but also puts higher requirements on material technology and production technology. Wafers play a pivotal role in the semiconductor industry and are one of the key materials that promote the development of modern electronic technology. With the continuous development of science and technology, wafer manufacturing technology is also constantly improving to meet the growing demand for integrated circuits.

[0004] In the semiconductor manufacturing process, the cleanliness of the wafer surface is crucial to product quality and yield. However, during the wafer dicing process, various pollutants such as dust, metal ions, organic residues, etc. are often generated. These pollutants will seriously affect the subsequent processes and even cause the wafer to be scrapped. For this reason, we provide a cleaning structure for wafer dicing. Summary of the invention

[0005] The technical problem solved by the present invention is that in the semiconductor manufacturing process, the cleanliness of the wafer surface is crucial to product quality and yield. However, various pollutants, such as dust, metal ions, organic residues, etc., are often generated during the wafer dicing process. These pollutants will seriously affect the subsequent processes and even lead to the scrapping of the wafer.

[0006] The present invention can be implemented through the following technical scheme: a cleaning structure for wafer dicing, including an installation box, a cleaning chamber is provided in the installation box, an isolating member is vertically slidably installed in the cleaning chamber, the isolating member divides the cleaning chamber into a cleaning area and a preparation area, a feed port is opened on one side of the installation box, and the feed port is connected to the cleaning area of ​​the cleaning chamber, a feeding member is horizontally slidably installed in the feed port, an ultrasonic cleaning member is provided in the cleaning area of ​​the cleaning chamber, and the ultrasonic cleaning member is located at the bottom of the cleaning chamber, a brush cylinder cleaning member is provided on the installation box, and the brush cylinder cleaning member is located above the ultrasonic cleaning member and the feeding member.

[0007] A further technical improvement of the present invention is that the feeding part includes a feeding plate, the mounting box is provided with an electric slide rail, the electric slide rail is arranged along the direction of the feed port, the feeding plate is provided with a slider, and the slider is installed on the electric slide rail.

[0008] A further technical improvement of the present invention is that the ultrasonic cleaning element includes an ultrasonic generator, the ultrasonic generator is installed on the installation box, and the ultrasonic generator is located at the bottom and side of the cleaning area of ​​the cleaning chamber.

[0009] A further technical improvement of the present invention is that the brush cylinder cleaning member comprises a cleaning cylinder, the cleaning cylinder is rotatably mounted and connected in the cleaning cavity of the mounting box, and the cleaning cylinder is located above the ultrasonic generator, and a brush hair layer is arranged on the outside of the cleaning cylinder.

[0010] A further technical improvement of the present invention is that the isolation member includes an isolation plate, the isolation plate is vertically slidably mounted on the installation box, and the isolation plate is located in the cleaning chamber. The installation box is provided with a linear lifting member for driving the isolation plate to move up and down.

[0011] A further technical improvement of the present invention is that the linear lifting member includes a lifting screw, which is rotatably installed on an installation box and is vertically arranged. A lifting block is provided on one side of the isolation plate, and the lifting block is threadably connected to the lifting screw. A driving motor for driving the lifting screw to rotate is provided on the installation box.

[0012] A further technical improvement of the present invention is that: an electrical docking block is provided on the installation box, an electrical docking groove is provided on the electrical docking block, the electrical docking groove is electrically connected to the ultrasonic generator, a docking head is provided at the bottom of the lifting block, the docking head is electrically connected to an external power supply, and the docking head can be electrically connected to the electrical docking groove.

[0013] A further technical improvement of the present invention is that a plurality of drainage taps are provided on the side of the installation box, and the plurality of drainage taps are connected with the cleaning cavity along the length direction thereof.

[0014] A further technical improvement of the present invention is that a through liquid regulating port is provided on the installation box, and the liquid regulating port is communicated with the preparation area of ​​the cleaning chamber.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] (1) The device adds raw materials and mixes cleaning liquid into the preparation area of ​​the cleaning chamber through the liquid adjustment port, and the driving motor drives the lifting screw to rotate. The lifting screw is threadedly connected with the lifting block, so that the lifting block and the isolation plate move upward, so that the cleaning liquid in the preparation area flows into the cleaning area, and the uncleaned wafers are placed in batches on the feeding plate. The electric slide rail drives the slider and the feeding plate to move along the feed port to the cleaning area of ​​the cleaning chamber until the feeding plate drives the wafer to move between the cleaning cylinder and the ultrasonic generator. The cleaning liquid contacts the organic matter and metal ions on the wafer to separate them from the wafer, thereby performing preliminary cleaning on the wafer;

[0017] (2) The lifting screw is then driven by a driving motor to rotate, and the lifting screw is threadedly connected to the lifting block, so that the lifting block and the isolation plate move downward, separating the cleaning area and the preparation area of ​​the cleaning chamber, and the docking joint at the bottom of the lifting block is plugged into the electrical docking slot, so that the external power supply starts the ultrasonic generator through the docking joint and the electrical docking slot, and the started ultrasonic generator performs ultrasonic cleaning on the cleaning liquid and wafer in the cleaning chamber, so that dust, metal ions, and organic residues are loosened and separated from the wafer, and the cleaning barrel and the brush layer arranged on the outside thereof brush the surface of the wafer to brush stubborn pollutants, thereby further improving the cleaning effect of the wafer; when the wafer is cleaned, the cleaning liquid and other wastes in the cleaning area of ​​the cleaning chamber are discharged together through the drain faucet, and the cleaning is automated, simple and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 For the present invention Figure 1 A magnified schematic diagram of region A;

[0021] Figure 3 For the present invention Figure 1 A magnified schematic diagram of area B;

[0022] Figure 4 For the present invention Figure 1 Schematic diagram of the enlarged C area.

[0023] In the figure: 1. Installation box; 2. Cleaning chamber; 3. Feed port; 4. Feed plate; 5. Electric slide rail; 6. Sliding block; 7. Ultrasonic generator; 8. Cleaning cylinder; 9. Brush layer; 10. Isolation plate; 11. Lifting screw; 12. Lifting block; 13. Electrical docking block; 14. Electrical docking groove; 15. Docking head; 16. Drain faucet; 17. Liquid adjustment port. DETAILED DESCRIPTION

[0024] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0025] See also Figure 1-Figure 4 As shown, the present invention proposes a cleaning structure for wafer dicing, including an installation box 1, a cleaning chamber 2 is provided in the installation box 1, an isolating member is vertically slidably installed in the cleaning chamber 2, the isolating member divides the cleaning chamber 2 into a cleaning area and a preparation area, a feed port 3 is opened on one side of the installation box 1, and the feed port 3 is connected to the cleaning area of ​​the cleaning chamber 2, a feeding member is horizontally slidably installed in the feed port 3, an ultrasonic cleaning member is provided in the cleaning area of ​​the cleaning chamber 2, and the ultrasonic cleaning member is located at the bottom of the cleaning chamber 2, a brush cylinder cleaning member is provided on the installation box 1, and the brush cylinder cleaning member is located above the ultrasonic cleaning member and the feeding member ; The cleaning liquid is prepared in the preparation area of ​​the cleaning chamber 2, and then the isolation part slides upward to allow the cleaning liquid in the preparation area to flow into the cleaning area, and then the wafers are transferred to the cleaning area in batches through the feed port 3 by the feeding part. The cleaning liquid contacts the organic matter and metal ions on the wafer to separate them from the wafer, and the ultrasonic cleaning part ultrasonically cleans the cleaning liquid and wafer in the cleaning chamber 2 to loosen the dust, metal ions, and organic residues from the wafer and separate them from the wafer, and the brush barrel cleaning part brushes the surface of the wafer to brush the stubborn contaminants, thereby further improving the cleaning effect of the wafer.

[0026] The feeding part includes a feeding plate 4, an electric slide rail 5 is provided on the mounting box 1, the electric slide rail 5 is arranged along the direction of the feed port 3, a slider 6 is provided on the feeding plate 4, and the slider 6 is installed on the electric slide rail 5; uncleaned wafers are placed in batches on the feeding plate 4, and the electric slide rail 5 drives the slider 6 and the feeding plate 4 to move along the feed port 3 to the cleaning area of ​​the cleaning chamber 2.

[0027] The ultrasonic cleaning component includes an ultrasonic generator 7, which is installed on the installation box 1 and is located at the bottom and side of the cleaning area of ​​the cleaning chamber 2; the activated ultrasonic generator 7 performs ultrasonic cleaning on the cleaning liquid and the wafer in the cleaning chamber 2 so that dust, metal ions, organic residues and the wafer are loosened and separated from the wafer.

[0028] The brush barrel cleaning component includes a cleaning barrel 8, which is rotatably installed and connected in the cleaning chamber 2 of the installation box 1, and the cleaning barrel 8 is located above the ultrasonic generator 7. A brush bristle layer 9 is arranged on the outside of the cleaning barrel 8. The brush bristle layer 9 is made of a highly elastic synthetic material to avoid damaging the wafer. An external driving device drives the cleaning barrel 8 to rotate, and the cleaning barrel 8 drives the brush bristle layer 9 to rotate, thereby brushing the surface of the wafer to brush stubborn contaminants.

[0029] The isolation member comprises an isolation plate 10, which is vertically slidably mounted on the installation box 1 and is located in the cleaning chamber 2. The installation box 1 is provided with a linear lifting member for driving the isolation plate 10 to move up and down.

[0030] The linear lifting component includes a lifting screw 11, which is rotatably installed on the installation box 1, and the lifting screw 11 is vertically arranged. A lifting block 12 is provided on one side of the isolation plate 10, and the lifting block 12 is threadedly connected to the lifting screw 11. A driving motor for driving the lifting screw 11 to rotate is provided on the installation box 1; the driving motor drives the lifting screw 11 to rotate, and the lifting screw 11 is threadedly connected to the lifting block 12, so that the lifting block 12 and the isolation plate 10 move upward, so that the cleaning liquid in the preparation area flows into the cleaning area, and the driving motor drives the lifting screw 11 to rotate, and the lifting screw 11 is threadedly connected to the lifting block 12, so that the lifting block 12 and the isolation plate 10 move downward, and the cleaning area and the preparation area of ​​the cleaning chamber 2 can also be separated.

[0031] An electrical docking block 13 is provided on the installation box 1, and an electrical docking slot 14 is provided on the electrical docking block 13. The electrical docking slot 14 is electrically connected to the ultrasonic generator 7. A docking joint 15 is provided at the bottom of the lifting block 12, and the docking joint 15 is electrically connected to an external power supply. The docking joint 15 can be electrically connected to the electrical docking slot 14; the lifting block 12 and the isolation plate 10 move downward, and the docking joint 15 at the bottom of the lifting block 12 is inserted into the electrical docking slot 14, so that the external power supply starts the ultrasonic generator 7 through the docking joint 15 and the electrical docking slot 14.

[0032] A plurality of drain taps 16 are provided on the side of the installation box 1 , and the plurality of drain taps 16 are connected with the cleaning chamber 2 along the length direction thereof; the cleaning liquid and other wastes in the cleaning chamber 2 are discharged together through the drain taps 16 .

[0033] The installation box 1 is provided with a liquid adjustment port 17 which is connected to the preparation area of ​​the cleaning chamber 2 ; the liquid adjustment port 17 can facilitate operators to add raw materials to the preparation area of ​​the cleaning chamber 2 and mix cleaning liquid.

[0034] When the present invention is in use, raw materials are added to the preparation area of ​​the cleaning chamber 2 through the liquid adjustment port 17 and the cleaning liquid is prepared. The driving motor drives the lifting screw 11 to rotate, and the lifting screw 11 is threadedly connected with the lifting block 12, so that the lifting block 12 and the isolation plate 10 move upward, so that the cleaning liquid in the preparation area flows into the cleaning area, and the uncleaned wafers are placed in batches on the feeding plate 4. The electric slide rail 5 drives the slider 6 and the feeding plate 4 to move along the feed port 3 toward the cleaning area of ​​the cleaning chamber 2 until the feeding plate 4 drives the wafer to move between the cleaning cylinder 8 and the ultrasonic generator 7.

[0035] The lifting screw 11 is then driven to rotate by a driving motor, and the lifting screw 11 is threadedly connected to the lifting block 12, so that the lifting block 12 and the isolation plate 10 move downward to separate the cleaning area and the preparation area of ​​the cleaning chamber 2, and the docking joint 15 at the bottom of the lifting block 12 is plugged into the electrical docking groove 14, so that the external power supply starts the ultrasonic generator 7 through the docking joint 15 and the electrical docking groove 14, and the cleaning liquid contacts the organic matter and metal ions on the wafer to separate them from the wafer, and the started ultrasonic generator 7 ultrasonically cleans the cleaning liquid and the wafer in the cleaning chamber 2, so that the dust, metal ions, and organic residues are loosened and separated from the wafer, and the brush barrel cleaning part brushes the surface of the wafer to brush the stubborn pollutants, thereby further improving the cleaning effect of the wafer; when the wafer is cleaned, the cleaning liquid and other wastes in the cleaning area of ​​the cleaning chamber 2 are discharged together through the drain faucet 16.

[0036] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A cleaning structure for wafer dicing, characterized in that: The invention comprises an installation box (1), wherein a cleaning chamber (2) is provided in the installation box (1), an isolating member is vertically slidably installed in the cleaning chamber (2), and the isolating member divides the cleaning chamber (2) into a cleaning area and a preparation area, a feed port (3) is opened on one side of the installation box (1), and the feed port (3) is connected to the cleaning area of ​​the cleaning chamber (2), a feeding member is horizontally slidably installed in the feed port (3), an ultrasonic cleaning member is provided in the cleaning area of ​​the cleaning chamber (2), and the ultrasonic cleaning member is located at the bottom of the cleaning chamber (2), and a brush cylinder cleaning member is provided on the installation box (1), and the brush cylinder cleaning member is located above the ultrasonic cleaning member and the feeding member.

2. A wafer scribing cleaning structure according to claim 1, characterized in that: The feeding member comprises a feeding plate (4), an electric slide rail (5) is provided on the installation box (1), the electric slide rail (5) is arranged along the direction of the feed port (3), and a slider (6) is provided on the feeding plate (4), and the slider (6) is installed on the electric slide rail (5).

3. A wafer scribing cleaning structure according to claim 1, characterized in that: The ultrasonic cleaning element comprises an ultrasonic generator (7), which is installed on the installation box (1) and is located at the bottom and side of the cleaning area of ​​the cleaning chamber (2).

4. A wafer scribing cleaning structure according to claim 3, characterized in that: The brush cylinder cleaning member comprises a cleaning cylinder (8), the cleaning cylinder (8) is rotatably mounted and connected in a cleaning chamber (2) of an installation box (1), and the cleaning cylinder (8) is located above an ultrasonic generator (7), and a brush bristle layer (9) is arranged on the outside of the cleaning cylinder (8).

5. The wafer scribing cleaning structure according to claim 1, characterized in that: The isolation member comprises an isolation plate (10), the isolation plate (10) is vertically slidably mounted on the installation box (1), and the isolation plate (10) is located in the cleaning chamber (2). The installation box (1) is provided with a linear lifting member for driving the isolation plate (10) to move up and down.

6. A wafer scribing cleaning structure according to claim 5, characterized in that: The linear lifting component comprises a lifting screw (11), the lifting screw (11) is rotatably mounted on the installation box (1), and the lifting screw (11) is vertically arranged. A lifting block (12) is provided on one side of the isolation plate (10), and the lifting block (12) is threadedly connected to the lifting screw (11). The installation box (1) is provided with a driving motor for driving the lifting screw (11) to rotate.

7. A wafer scribing cleaning structure according to claim 6, characterized in that: The installation box (1) is provided with an electrical docking block (13), and the electrical docking block (13) is provided with an electrical docking groove (14), and the electrical docking groove (14) is electrically connected to the ultrasonic generator (7). The bottom of the lifting block (12) is provided with a docking head (15), and the docking head (15) is electrically connected to an external power supply. The docking head (15) can be electrically connected to the electrical docking groove (14).

8. The wafer scribing cleaning structure according to claim 1, characterized in that: A plurality of drainage taps (16) are provided on the side of the installation box (1), and the plurality of drainage taps (16) are connected to the cleaning chamber (2) along its length direction.

9. The wafer scribing cleaning structure according to claim 1, characterized in that: The installation box (1) is provided with a penetrating liquid adjustment port (17), and the liquid adjustment port (17) is communicated with the preparation area of ​​the cleaning chamber (2).

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